JP2011182376A - Antenna device and communication equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna device in which an electrode electromagnetic-field-coupled with an electrode of another antenna device disposed at a position opposite to the antenna device is easily mounted on a printed circuit board, without increasing manufacturing steps. <P>SOLUTION: The antenna device includes a printed circuit board 1, a coupling electrode 8 and an electrode pole 7. In the printed circuit board 1, a ground 2 is formed on one surface via a base 4 and wiring 3 of which at least one end portion is short-circuited to a ground layer is formed on the other surface. The coupling electrode 8 is comprised of an approximately planar conductor and can perform communication by being electromagnetic-field-coupled with an electrode of another antenna device disposed at a position opposite to the antenna device. The electrode pole 7 electrically connects the wiring 3 formed on the printed circuit board 1 and the coupling electrode 8 together while separating them for a predetermined distance in a thickness direction H of the printed circuit board 1. On the surface of the printed circuit board 1 where the ground 2 is formed, a land 9 is formed which is electrically insulated from the ground 7 and the electrode pole 7 is electrically connected with the land 9 through the surface of the printed circuit board 1, on which the wiring 3 is formed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an antenna device that performs information communication by electromagnetic field coupling between a pair of opposed electrodes, and a communication device in which the antenna device is incorporated.

  In recent years, a system has been developed in which data such as music and images is transmitted wirelessly between electronic devices such as computers and small portable terminals without using cables or media. Some of such wireless transmission systems are capable of high-speed transfer of up to about 560 Mbps at a short distance of several centimeters. Among such transmission systems capable of high-speed transfer, Transferjet (registered trademark) has the advantage that the transmission distance is short but the possibility of eavesdropping is low and the transmission speed is high.

  Transferjet (registered trademark) can be achieved by electromagnetic field coupling of corresponding high-frequency couplers at very short distances, and the signal quality depends on the performance of the high-frequency coupler.

  For example, a high-frequency coupler described in Patent Document 1 includes a printed circuit board in which a ground is formed on one surface, a stub having a microstrip structure formed on the other surface of the printed circuit board, a coupling electrode, and this coupling It consists of a metal wire that connects the electrode and the stub. Moreover, in the communication apparatus described in Patent Document 1, a transmission / reception circuit is also formed on a printed circuit board constituting the high frequency coupler.

JP 2008-31816 A

  In the high-frequency coupler described in Patent Document 1 described above, it is necessary to electrically connect the coupling electrode and the resonance line via a columnar metal wire. For example, if the coupling electrode and the metal wire are made in one piece, or connected to the resonance line in the state of being connected first, if the height of the metal wire is low, direct connection between objects using a soldering iron or the like It becomes difficult. For this reason, there is a method in which solder paste is pre-arranged in the connection part and the electrode assembly of the coupling electrode and the metal wire is joined by a reflow process or the like. In this case, the assembly is accurately arranged and fixed at the connection position. Otherwise, problems such as tilting of the electrode assembly or joining of the electrode assembly from a predetermined position of the resonance line may occur.

  The present invention has been proposed in view of such a situation, and an electrode that is electromagnetically coupled with an electrode of another antenna device disposed at an opposing position can be easily obtained without increasing the number of manufacturing steps. An object of the present invention is to provide an antenna device that can be mounted on a printed circuit board. Another object of the present invention is to provide a communication device in which this antenna device is incorporated.

  As a means for solving the above-described problems, an antenna device according to the present invention is an antenna device that performs information communication by electromagnetic field coupling between a pair of electrodes facing each other at a predetermined communication frequency, and is a dielectric. A printed circuit board on which a ground layer is formed on a conductive layer on one side, and a wiring in which at least one end is short-circuited on the ground layer is formed on the conductive layer on the other side; A coupling electrode that is electromagnetically coupled to an electrode of another antenna device that is disposed in an opposing position and that can communicate, and a wiring formed on the printed circuit board and a coupling electrode. The electrode columns are electrically connected to each other at a predetermined distance in the thickness direction, and on the surface of the printed circuit board on which the ground layer is formed, a land electrically insulated from the ground layer is formed, Pole penetrates the surface of the wiring of the printed circuit board is formed, characterized in that it is connected to land and electrically.

  In addition, the communication device according to the present invention is a communication device that performs information communication by electromagnetic coupling between electrodes of another communication device arranged at an opposing position, and a conductive layer on one surface via a dielectric. A ground layer is formed on the other side of the conductive layer on the other side, a printed circuit board on which at least one end portion is short-circuited to the ground layer, and a substantially planar conductor, and at a position facing each other. The coupling electrode that is electromagnetically coupled to the electrodes of the other antenna devices that are arranged to enable communication, and the wiring formed on the printed board and the coupling electrode are separated by a predetermined distance in the thickness direction of the printed board, Electrically connected electrode columns and a transmission / reception processing unit that is electrically connected to the wiring and performs signal transmission / reception processing. The surface of the printed circuit board on which the ground layer is formed is electrically insulated from the ground layer. Shaped land Are, the electrode posts, through a surface wiring of printed circuit board is formed, characterized in that it is connected to land and electrically.

  In the present invention, the electrode pillar that electrically connects the wiring formed on the printed circuit board and the coupling electrode is electrically connected to the land through the surface on which the wiring of the printed circuit board is formed. It is not necessary to connect the wiring and the electrode column using a soldering iron or the like on the surface of the printed circuit board on which the wiring is formed. Therefore, according to the present invention, an electrode that is electromagnetically coupled to an electrode of another antenna device disposed at an opposing position can be easily mounted on a printed circuit board without increasing the number of manufacturing steps.

It is a figure which shows the structure of the communication system with which the antenna device to which this invention was applied is integrated. It is a figure which shows the structure of the high frequency coupler which concerns on 1st Embodiment which is an antenna device to which this invention was applied. It is a figure for demonstrating the connection between an electrode pillar and wiring. It is a figure for demonstrating the other example of a connection between an electrode pillar and wiring. It is a figure for demonstrating the sample for evaluation corresponding to the high frequency coupler to which this invention was applied. It is a figure for demonstrating the sample for a comparison which concerns on the comparison object of the sample for an evaluation. It is a frequency characteristic figure which shows the analysis result of the joint strength which used the sample for evaluation and the sample for comparison, respectively. It is a figure which shows the structure of the modification of the high frequency coupler which concerns on 1st Embodiment which is an antenna device to which this invention was applied. It is a figure which shows the structure of the high frequency coupler which concerns on 2nd Embodiment which is an antenna apparatus with which this invention was applied. It is a figure for demonstrating the structure of the terminal for a connection of the high frequency coupler which concerns on 2nd Embodiment which is an antenna apparatus with which this invention was applied. It is a figure which shows the structure of the modification of the high frequency coupler which concerns on 2nd Embodiment which is an antenna apparatus with which this invention was applied. It is a figure for demonstrating the structure of the terminal for a connection of the modification of the high frequency coupler which concerns on 2nd Embodiment. It is a figure for demonstrating arrangement | positioning of the model which analyzes the coupling strength between high frequency couplers. It is a frequency characteristic figure which shows the analysis result of the coupling strength in the modification of the high frequency coupler concerning a 2nd embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention.

<Communication system>
An antenna device to which the present invention is applied is a device that performs information communication by electromagnetic coupling between a pair of opposed electrodes, and is a communication system that enables high-speed transfer of about 560 Mbps, for example, as shown in FIG. 100 is used by being incorporated.

  The communication system 100 includes communication devices 101 and 105 that perform two data communications. Here, the communication apparatus 101 includes a high-frequency coupler 102 having an electrode 103 and a transmission / reception circuit unit 104. The communication device 105 includes a high-frequency coupler 106 having an electrode 107 and a transmission / reception circuit unit 108.

  As shown in FIG. 1, when the high frequency couplers 102 and 106 provided in each of the communication devices 101 and 105 are arranged facing each other, the two electrodes 103 and 107 operate as one capacitor, and as a whole a band-pass filter. By operating, a high frequency signal in a 4 to 5 GHz band for realizing high-speed transfer of, for example, about 560 Mbps can be efficiently transmitted between the two high frequency couplers 102 and 106.

  Here, the transmitting and receiving electrodes 103 and 107 included in the high-frequency couplers 102 and 106 are arranged to face each other with a spacing of about 3 cm, for example, and can be coupled to each other.

  In the communication system 100, for example, the transmission / reception circuit unit 104 connected to the high-frequency coupler 102 generates a high-frequency transmission signal based on the transmission data when a transmission request is issued from a host application, and sends a signal from the electrode 103 to the electrode 107. Propagate. Then, the transmission / reception circuit unit 108 connected to the reception-side high-frequency coupler 106 demodulates and decodes the received high-frequency signal, and passes the reproduced data to the higher-level application.

  The antenna device to which the present invention is applied is not limited to the above-described one that transmits a high frequency signal in the 4 to 5 GHz band, and can be applied to signal transmission in other frequency bands. A high frequency signal in the 4 to 5 GHz band will be described as a transmission target.

<First Embodiment>
As an antenna device incorporated in such a communication system 100, a high-frequency coupler 110 according to the first embodiment as shown in FIG. 2 will be described.

  That is, the high-frequency coupler 110 includes the printed circuit board 1, the coupling electrode 8, and the electrode pillar 7 that electrically connects the wiring 3 formed on the printed circuit board 1 and the coupling electrode 8.

  The printed circuit board 1 is a double-sided printed circuit board in which copper foil is disposed on both surfaces of a base material 4 functioning as a dielectric. The conductive layer on one surface is used as a ground 2 and the land 9 connected to the electrode pillar 7 is connected to the ground. 2 are formed on the same surface at a certain distance. A wiring 3 is formed on the conductive layer on the other surface of the printed circuit board 1 by patterning.

  One end of the wiring 3 is short-circuited with the ground 2 by the end through-hole 6, and the other end is formed with an end 3 b for connection with the transmission / reception circuit board. For example, the wiring 3 is short-circuited by being bonded to the ground 2 through the base material 4 with a conductive plating film or conductive paste provided in the end through-hole 6. The connection with the ground 2 is for electrical short-circuiting, and the wiring 3 and the ground 2 may be connected by a conductive column such as a through bump.

  In the high-frequency coupler 110 shown in FIG. 2, from the viewpoint of increasing communication sensitivity, the distance from the end of the wiring 3 that is short-circuited by the end through-hole 6 to the connection point with the electrode column 7 is the communication. It functions as a resonance line 3a that is separated by an integral multiple of approximately one-quarter wavelength of the frequency.

  Thus, the resonance line 3a is used to increase the coupling efficiency of the coupling electrode provided in another high-frequency coupler and the coupling electrode 8 of the high-frequency coupler 110, and is connected to the ground 2 as described above. As a result, a short stub is formed, and the voltage is 0 in this portion. Therefore, when the electrode column 7 is connected on the line at a distance of about a quarter wavelength of the communication frequency from this portion, the voltage is reduced at the connection point. It becomes maximum and the coupling efficiency is good. The resonant line 3a plays a role in determining the coupling efficiency between the high-frequency couplers, and the line length has a required coupling strength and bandwidth based on an integral multiple of a quarter wavelength of the communication frequency. Decide by taking into account.

  In the high-frequency coupler 110 shown in FIG. 2, the end of the wiring 3 on the resonance line 3a side is a short stub via the electrode column through-hole 5, but the end subjected to such a short-circuit treatment and the connection In addition to the end 3b, a resonance line branched from a connection point with the electrode column 7 may be provided. The resonance line branched from the connection point with the electrode column 7 is short-circuited at a position separated by an integral multiple of about a quarter wavelength of the communication frequency with respect to the connection point with the electrode column 7, or An open stub with an open end may be used. However, even in the case of this open stub, it is necessary to adjust the line length so that the voltage is maximized at the junction of the electrode columns 7.

  Further, the line shape of the wiring 3 does not necessarily need to be a straight line, and can be a curved line with a curvature or a bent shape.

  As described above, the end 3b for connection with the transmission / reception circuit board is formed at the end of the other wiring 3 with respect to the end where the resonance line 3a is formed. The connection end 3b is connected to a connector terminal penetrating the printed circuit board 1 (not shown in the drawing), or the wiring 3 is extended to the end of the printed circuit board 1 to provide a connection terminal there. Use.

  Further, as shown in the cross-sectional view of FIG. 3A, the printed circuit board 1 is formed with lands 9 electrically insulated from the ground 2 on the surface of the conductive layer serving as the ground 2. An electrode column through hole 5 for inserting the electrode column 7 is formed from the surface of the conductive layer on which the wiring 3 is formed to the surface of the conductive layer serving as the ground 2. As shown in FIG. 3B, the inside of the electrode pillar through hole 5 is coated or filled with a conductor 5a by plating, conductive paste or the like, so that the wiring 3 and the land 9 are electrically connected. It has become.

  The base material 4 of the printed circuit board 1 is a substance having a dielectric property superior to that of the conductive layer, and is selected from, for example, glass epoxy, phenol, polyimide, liquid crystal polymer, Teflon, etc., but has a dielectric constant as low as possible and a dielectric loss. A material using a small material is preferable.

  The coupling electrode 8 is made of a substantially planar conductor, and functions as an antenna capable of communicating by being electromagnetically coupled to electrodes of other antenna devices arranged at opposing positions. Such a coupling electrode 8 is a substantially planar conductor as described above, and can have a circular, square, polygonal shape, etc., and the material is a good conductor having rigidity such as copper, brass, and stainless steel. It is preferable to use it.

  The electrode columns 7 are electrically separated from the wiring 3 formed on the printed board 1 and the coupling electrode 8 by being separated by a predetermined distance in the thickness direction H of the printed board 1.

  Specifically, the electrode column 7 is a good conductor having the same rigidity as the coupling electrode 8, and one end thereof is connected to the coupling electrode 8, but a part of the coupling electrode 8 is processed to form the coupling electrode 8. It may be produced as a single piece.

  The other end of the electrode column 7 is connected to the land 9 through the electrode column through hole 5 described above. Here, the electrode column 7 is electrically connected to the wiring 3 by the conductor 5 a formed inside the electrode column through hole 5. The electrode pillar 7 is attached to a predetermined position of the wiring 3. However, since the electrode pillar through-hole 5 is formed, the electrode pillar 7 is easily positioned and connected on the back surface of the printed circuit board 1. Connection processing can be done easily with a trowel. It is preferable that the inner diameter of the electrode column through hole 5 is designed to be the same as or slightly larger than the outer shape of the electrode column 7 so that it does not loosen when the electrode column 7 is inserted. Thus, in the high-frequency coupler 110, for example, when it is attached as an integrally molded product of the coupling electrode 8 and the electrode column 7, there is no need to fix them, and reflow treatment using cream solder, conductive paste, or the like. Thus, the electrode column 7 and the wiring 3 can be easily connected.

  In the high-frequency coupler 110 to which the present invention having the above-described configuration is applied, the electrode pillar 7 that electrically connects the wiring 3 formed on the printed board 1 and the coupling electrode 8 is provided on the printed board 1. 3 is penetrated through the surface on which the wiring 3 is formed and is electrically connected to the land 9. Therefore, the wiring 3 and the electrode pillar 7 are connected to each other on the surface on which the wiring 3 of the printed circuit board 1 is formed using a soldering iron or the like. There is no need to connect. Therefore, as shown as a specific example of the high-frequency coupler 110, the antenna device according to the present invention is electromagnetically coupled to the electrodes of other antenna devices arranged at opposing positions without complicating the manufacturing process. The electrode can be easily mounted on a printed circuit board.

  Further, the high-frequency coupler 110 described above is not limited to the case where the wiring 3 and the electrode column 7 are electrically connected via the single electrode column through-hole 5, and in particular, as shown in FIG. As described above, by using the one in which the through hole 5b and the through hole 5c arranged around the through hole 5b are formed from the surface on which the wiring 3 is formed to the surface on which the land 9 is formed, The wiring 3 and the electrode column 7 can be electrically connected. That is, in the through hole 5b, as shown in FIG. 4 (B), the conductor 5a is coated from the land 9 with a soldering iron or the like, so that the electrode column 7 and the land 9 are reliably electrically connected. Further, in the through hole 5c, the conductor 5a is filled from the land 9, so that the land 9 and the wiring 3 can be reliably electrically connected. In this way, in the high frequency coupler 110, the electrode pillar 7 and the land 9 are electrically connected via the through hole 5b, and the wiring 3 and the land 9 are electrically connected via the through hole 5c. It is particularly preferable to do from the following points.

  That is, if the gap from the side wall surface of the through hole 5b to the side wall surface of the electrode column 7 is narrow, it is difficult to fill the conductor 5a from the land 9 side, and the electrical connection between the electrode column 7 and the wiring 3 is ensured. This is because the connection cannot be achieved. Further, the distance from the side wall surface of the through hole 5b to the side wall surface of the electrode column 7 is because the electrical connection quality varies due to manufacturing errors of individual elements.

  In this way, the high frequency coupler 110 includes a through hole 5b in which the electrode pillar 7 penetrates the surface of the printed circuit board 1 on which the wiring 3 is formed and is electrically connected to the land 9, and around the through hole 5b. The through hole 5c that is located and electrically connects the land 9 and the wiring 3 is formed, so that the wiring 3 and the electrode column 7 can be more securely connected while allowing manufacturing errors of individual elements. Can be connected.

<Characteristic evaluation>
Next, an evaluation sample 110a was prepared in order to examine the performance of the high frequency coupler 110, and the characteristics were compared with the comparative sample 110b for examining the performance of the high frequency coupler according to the comparative example. FIG. 5 and FIG. 6 are prototype samples, which respectively show an evaluation sample 110a and a comparison sample 110b.

  In these samples, the coupling electrode 28 of the evaluation sample 110a and the coupling electrode 38 of the comparative sample 110b are each made of a circular stainless steel material, and a part thereof is grooved and bent by laser processing. The electrode columns 27 and 37 are produced as a single body. In these samples, the electrode columns 27 and 37 have a structure in which two electrode columns 27 and 37 are erected so as to maintain mechanical strength.

  In the comparative sample 110 b, the tip of the electrode column 37 is partially bent and soldered at a predetermined position of the wiring 33. On the other hand, in the sample 110a for evaluation, the electrode column 27 is press-fitted into a through hole 27a having substantially the same diameter as that of the electrode column 27 provided at a predetermined position of the printed circuit board 21 so that the land on the back surface of the printed circuit board 21 is At 29, soldering is performed. Since the through hole 27 a is plated on the inner wall with a conductive material, the coupling electrode 28, the electrode pillar 27, and the wiring 23 are electrically connected by solder bonding at the land 29.

  In these samples, one end of each of the wirings 23 and 33 is connected to the ground on the back side of the board through the through holes 21a and 31a of the printed boards 21 and 31, and the other end is connected to the SMA connectors 30 and 40. Terminals 30a and 40a are provided. The SMA connectors 30 and 40 are joined to the connection terminals 30a and 40a with solder, respectively. The SMA connectors 30 and 40 are connectors for inserting a coaxial cable for measurement.

  Since the coupling strength of a high-frequency coupler is usually evaluated in combination with a reference coupler, the coupling electrodes of these samples and the reference coupler are face-to-face so that the central axes of the coupling electrodes coincide with each other. The measurement was performed with the distance between the electrodes set at 15 mm. For measurement, N5230A manufactured by Agilent was used as a network analyzer, and the frequency characteristics were compared as shown in FIG. 7 with the transmission coefficient S21 as the coupling strength.

  As is clear from this frequency characteristic, it was confirmed that the coupling strength was the same between the evaluation sample 110a and the comparison sample 110b.

  Therefore, as is clear from the evaluation using such a sample, the high frequency coupler 110 is similar to the high frequency coupler in which the electrode pillar and the wiring are connected without using the land formed on the ground side. In addition, the manufacturing process can be simplified, the supporting force of the coupling electrode can be enhanced, and the connection stability can be improved.

<Modification>
Next, a configuration of a high-frequency coupler 120 as shown in FIG. 8 will be described as a modification of the antenna device according to the first embodiment to which the present invention is applied.

  Similarly to the high frequency coupler 110 described above, the high frequency coupler 120 is an electrode that electrically connects the printed circuit board 1, the coupling electrode 8, the wiring 3 formed on the printed circuit board 1, and the coupling electrode 8. And a pillar 7. In addition, the high-frequency coupler 120 includes an upper substrate 16 that holds the coupling electrode 8.

  Here, in the high-frequency coupler 110 described above, the coupling electrode 8 is held via the thin electrode column 7, so that care must be taken when moving the finished product. In the high-frequency coupler 120, the coupling electrode 8 is firmly held by the upper substrate 16, so that even if an external pressure is applied to the coupling electrode 8, the electrode column 7 integrated with the coupling electrode 8 is formed. It is possible to prevent a poor electrical connection with the wiring 3 that may be deformed or caused by deformation of the electrode column 7. Therefore, handling related to the movement of the high-frequency coupler 120 is facilitated.

  The high-frequency coupler 120 according to the modified example is the same as the configuration of the high-frequency coupler 110 according to the first embodiment described above except that the upper substrate 16 is provided, and thus the same reference numerals are given in FIG. The description of each element will be omitted.

  The upper substrate 16 is a dielectric material, and generally glass epoxy, phenol, polyimide, liquid crystal polymer, Teflon and the like are candidates, but from the viewpoint of improving the bonding strength between the bonding electrodes, it is a low dielectric material. It is preferable to use a porous material having a relative dielectric constant of one unit produced by foaming a certain fluororesin, polyethylene, polyimide or the like.

  Since the upper substrate 16 can support the coupling electrode 8 on the entire surface, the physical strength of the high-frequency coupler 120 itself and the stability of electrical connection can be increased. The upper substrate 16 can expand the options of the manufacturing process of the coupling electrode 8 and the electrode column 7.

  For example, in the high-frequency coupler 120, the coupling electrode 8 is formed by patterning on the upper surface 16 a of the upper substrate 16 by plating or the like, or a substrate on which the coupling electrode 8 is patterned, or a conductive metal plate processed into a coupling electrode shape. Paste. Subsequently, in the high-frequency coupler 120, through-hole processing is performed at the center of the coupling electrode 8 together with the upper substrate 16, and then the through-hole 7 a is formed at a predetermined position of the wiring 3 formed on the printed circuit board 1. 8, the other surface of the upper substrate 16, that is, the lower surface 16 b of FIG. 8 is bonded to the printed circuit board 1.

  The printed circuit board 1 is in a state in which the wiring 3 and the land 9 are electrically connected through the electrode column through holes 5 by plating or the like.

  Subsequently, the electrode column 7 is inserted so as to penetrate the through hole 7 a and the through hole 5, and the coupling electrode 8 and the electrode column 7 are joined with solder or the like, and the land 9 and the electrode column 7 on the back surface of the printed circuit board 1. Are connected by solder or the like, whereby the wiring 3, the electrode pillar 7, and the coupling electrode 8 are electrically connected.

  In the above example, the electrode column 7 is inserted and soldered, but it can also be produced by a process that omits these steps. Next, the process will be described.

  First, on the printed circuit board 1 on which the wiring 3, the land 9 and the ground 2 are formed, the upper substrate 16 on which the coupling electrode 8 is formed, or the substrate on which the upper substrate 16 and the coupling electrode 8 are formed, or A conductive metal plate processed into a coupling electrode shape is pasted. At this time, the bonding electrode 8 is attached so that the center portion thereof is aligned with a predetermined position of the wiring 3 formed on the printed circuit board 1.

  Next, through holes are formed through the upper substrate 16 and the printed circuit board 1 from the center of the coupling electrode 8 to form the through holes 7a and the through holes 5. After that, the inner wall of the through hole 7a and the through hole 5 is plated and a conductive paste is pressed to form a conductive layer. This conductive layer electrically connects the coupling electrode 8, the wiring 3, and the land 9. Therefore, the conductive layer serves as the electrode pillar 7, and the high-frequency coupler 120 is completed without being connected by solder or the like.

  As shown in FIG. 4 described above, the high frequency coupler 120 penetrates from the surface on which the wiring 3 is formed to the surface on which the land 9 is formed, and electrically connects the electrode column 7 and the land 9. By using a hole in which a hole 5b and a through hole 5c for electrically connecting the wiring 3 and the land 9 are formed, the wiring 3 and the electrode column 7 are reliably electrically connected through the land 9. be able to.

<Second Embodiment>
As an antenna device incorporated in the communication system 100, a high-frequency coupler 210 according to the second embodiment as shown in FIG. 9 will be described.

  Similarly to the high frequency coupler 110 described above, the high frequency coupler 210 is an electrode that electrically connects the printed circuit board 1, the coupling electrode 8, the wiring 3 formed on the printed circuit board 1, and the coupling electrode 8. And a pillar 7.

  The high-frequency coupler 210 according to the present embodiment is the same as the configuration of the high-frequency coupler 110 according to the first embodiment described above except for the specific configuration mounted on the printed circuit board 1, and therefore, in FIG. 9. In FIG. 8, the same reference numerals are given, and description of each element is omitted.

  The printed circuit board 1 is a double-sided printed circuit board in which copper foil is disposed on both surfaces of a base material 4 functioning as a dielectric, as with the high-frequency coupler 110 described above. A land 9 connected to the pillar 7 is formed on the same surface at a certain distance from the ground 2. A wiring 3 is formed by patterning on the conductive layer on the other surface of the printed circuit board, and this wiring 3 functions as two resonance lines 3 a and 3 a starting from the electrode column 7. The ends of the resonance lines 3a and 3a are joined to the ground 2 through the base material 4 by conductive plating films or conductive pastes provided in the end through holes 6 and 6, respectively. Although the end portions of the resonance lines 3a and 3a are short stubs connected to the ground 2 via the end through holes 6 and 6, one side may be an open stub having an open end.

  Further, the printed circuit board 1 is formed with an electrode column through hole 5 for inserting the electrode column 7, and in the same manner as the structure shown in the sectional view of FIG. The wiring 5 and the land 9 are electrically connected to each other by coating or filling with the conductor 5a.

  In the high-frequency coupler 210 having the above-described configuration, the electrode column 7 that electrically connects the wiring 3 formed on the printed circuit board 1 and the coupling electrode 8 is formed on the surface on which the wiring 3 of the printed circuit board 1 is formed. Is electrically connected to the land 9 through an electrode column through hole 5 penetrating through the land 9. Further, in the high frequency coupler 210, as shown in FIG. 10, the connection terminal portion 22 is formed on the surface of the printed circuit board 1 on which the ground 2 is formed.

  That is, the high-frequency coupler 210 is formed by forming a connection terminal portion 22 including a signal terminal 22a and ground terminals 22b and 22c on one surface of the printed circuit board 1 for surface mounting by solder paste or the like on a circuit board. is there. Specifically, the connection terminal portion 22 is coated with a resist 221 on the ground 2, but when the resist 221 is formed, the land 9 and a part of the ground 2 are omitted, so that each signal The terminal 22a and the ground terminals 22b and 22c are exposed as electrical connection surfaces. In addition, in such a terminal configuration, for example, an IHFEX MHF series micro coaxial receptacle connector can be mounted on the connection terminal portion 22 and connected to the circuit board via the micro coaxial cable. Is possible.

  In addition, as a modification of the antenna device according to the second embodiment, a configuration of a high-frequency coupler 220 as illustrated in FIG. 11 will be described.

  Similarly to the high frequency coupler 210 described above, the high frequency coupler 220 electrically connects the printed circuit board 1, the coupling electrode 8, the wiring 3 formed on the printed circuit board 1, and the coupling electrode 8. And a pillar 7. In addition, the high frequency coupler 220 includes an upper substrate 16 that holds the coupling electrode 8.

  Here, in the high-frequency coupler 210 described above, since the coupling electrode 8 is held via the thin electrode column 7, it is necessary to be careful when moving the finished product. In the high-frequency coupler 220, the coupling electrode 8 is firmly held by the upper substrate 16, so that the electrode column 7 integrated with the coupling electrode 8 is formed even when an external pressure is applied to the coupling electrode 8. It is possible to prevent a poor electrical connection with the wiring 3 that may be deformed or caused by deformation of the electrode column 7. Therefore, handling related to the movement of the high-frequency coupler 220 is facilitated.

  In the high frequency coupler 220, as shown in FIG. 12, the signal terminal 22a and the ground terminals 22b and 22c are exposed from the resist layer covering the ground 2 and the land 9, respectively, and are connected to the circuit board. 22 is formed.

  The high-frequency coupler 220 according to the modified example is the same as the configuration of the high-frequency coupler 210 described above except for the specific configuration mounted on the printed circuit board 1, and thus the same reference numerals are used in FIGS. 11 and 12. A description of each element will be omitted.

  In the high-frequency coupler 220 having such a configuration, the electrode column 7 penetrates the upper substrate 16 and the printed circuit board 1 and is connected to the wiring 3 through the land 9.

  The upper substrate 16 is a dielectric material, and generally glass epoxy, phenol, polyimide, liquid crystal polymer, Teflon and the like are candidates, but from the viewpoint of improving the bonding strength between the bonding electrodes, it is a low dielectric material. It is preferable to use a porous material having a relative dielectric constant of one unit produced by foaming a certain fluororesin, polyethylene, polyimide or the like.

  Since the upper substrate 16 can support the entire surface of the coupling electrode 8, the physical strength of the high frequency coupler 220 itself and the stability of electrical connection can be increased. The upper substrate 16 can expand the options of the manufacturing process of the coupling electrode 8 and the electrode column 7.

  For example, in the high frequency coupler 220, the coupling electrode 8 is formed by patterning on the upper surface 16a of the upper substrate 16 by plating or the like, or a substrate on which the coupling electrode 8 is patterned, or a conductive metal plate processed into a coupling electrode shape. Paste. Subsequently, in the high-frequency coupler 220, through-hole processing is performed in the center of the coupling electrode 8 together with the upper substrate 16, and then the through-hole 7 a is formed at a predetermined position of the wiring 3 formed on the printed circuit board 1. 11, the other surface of the upper substrate 16, that is, the lower surface 16 b of FIG. 11 is bonded to the printed circuit board 1.

  The printed circuit board 1 is in a state in which the wiring 3 and the land 9 are electrically connected through the electrode column through holes 5 by plating or the like.

  Subsequently, the electrode column 7 is inserted so as to penetrate the through hole 7 a and the through hole 5, and the coupling electrode 8 and the electrode column 7 are joined with solder or the like, and the land 9 and the electrode column 7 on the back surface of the printed circuit board 1. Are connected by solder or the like, whereby the wiring 3, the electrode pillar 7, and the coupling electrode 8 are electrically connected.

  In the above example, the electrode column 7 is inserted and soldered, but it can also be produced by a process that omits these steps. Next, the process will be described.

  First, on the printed circuit board 1 on which the wiring 3, the land 9 and the ground 2 are formed, the upper substrate 16 on which the coupling electrode 8 is formed, or the substrate on which the upper substrate 16 and the coupling electrode 8 are formed, or A conductive metal plate processed into a coupling electrode shape is pasted. At this time, the bonding electrode 8 is attached so that the center portion thereof is aligned with a predetermined position of the wiring 3 formed on the printed circuit board 1.

  Next, through holes are formed through the upper substrate 16 and the printed circuit board 1 from the center of the coupling electrode 8 to form the through holes 7a and the through holes 5. After that, the inner wall of the through hole 7a and the through hole 5 is plated and a conductive paste is pressed to form a conductive layer. Since this conductive layer electrically connects the coupling electrode 8, the wiring 3, and the land 9, the conductive layer serves as the electrode pillar 7, and the high-frequency coupler 220 is completed without being connected by solder or the like.

  The high-frequency coupler 220 is similar to the high-frequency coupler 210 described above, and the surface on which the electrode pillars 7 are formed on the wiring 3 of the printed circuit board 1 from the surface on which the wiring 3 is formed to the surface on which the lands 9 are formed. And a through hole that is electrically connected to the land 9 and a through hole that is disposed around the through hole and that electrically connects the land 9 and the wiring 3 is used. The wiring 3 and the electrode pillar 7 can be electrically connected reliably.

<Performance evaluation>
Next, in order to investigate the performance of the high-frequency coupler according to the second embodiment, an analysis using a three-dimensional electromagnetic field simulator HFSS manufactured by Ansoft Corporation was performed. Here, the analysis model is a configuration related to the high-frequency coupler 220 shown in FIG. 11 in the embodiment, the printed board 1 is a double-sided copper foil board using a liquid crystal polymer of 50 μm for the base material 4, and the coupling electrode 8 is a diameter The 8 mm thin copper plate and the electrode pillar 7 are assumed to be iron pillars having a height of 1.1 mm. The upper substrate 16 uses a liquid crystal polymer as in the printed circuit board. The signal is supplied to the signal terminal 22a and analyzed with respect to the ground terminals 22b and 22c.

  As a comparative example of such an analysis model, the high-frequency coupler 120 according to the first embodiment described above is used. In this comparative example, the dimensions of the coupling electrode, the upper substrate, the electrode column, the printed board, and the materials used are the same as in the example. In the high-frequency coupler 120 as a comparative example, the signal is analyzed by supplying power to the connection end 3b of the wiring 3 positioned so as to face the ground 2 via the base material 4 with the ground 2 as a reference. And

  The coupling strength was evaluated by the transmission characteristic S21 of the S parameter used for evaluating the high frequency transmission characteristic. FIG. 13 shows a model for analyzing the coupling strength between the high-frequency couplers. The pair of coupling electrodes 8a and 8b are opposed to each other in a parallel state with the central axes of the coupling electrodes coincided. The opposing distance, that is, the distance between the pair of coupling electrodes 8a and 8b is 15 mm.

  FIG. 14 shows frequency characteristics of the coupling strength analyzed based on such conditions. In the example, it can be seen that about 1 dB coupling strength can be improved in the 4.5 GHz band as compared with the comparative example.

  Such an improvement in the coupling strength is achieved by the high frequency coupler 220 according to the embodiment supplying power directly from the signal terminal 22a formed on the land 9 located at the base of the coupling electrode 8, so that the end of the wiring 3 can be improved. This is because the signal transmission path is shorter than that of the high-frequency coupler 120 according to the comparative example in which a signal is transmitted to the electrode pillar 7, so that the influence of transmission loss and impedance mismatch is small.

  As described above, the high-frequency couplers 210 and 220 according to the second embodiment use the land 9 electrically connected to the electrode column 7 as the signal terminal 22a, so that the connection end is formed on the surface on which the wiring is formed. Compared with the provided high frequency coupler, the signal transmission path can be shortened. As a result, the high-frequency couplers 210 and 220 can reduce the effects of transmission loss and impedance mismatch, so that the manufacturing process can be simplified, the supporting force of the coupling electrode can be enhanced, the connection stability can be improved, and the high-frequency coupling can be achieved. The coupling strength of the vessel can be improved.

  Further, since the high frequency couplers 210 and 220 have the connection terminal portion 22 formed on the surface of the printed circuit board 1 on which the ground 2 is formed, the connection end 3b is provided on the surface on which the wiring 3 is formed. If at least one resonance line is short-circuited using the space required for providing the connection end 3b, a number of short-circuited or opened resonance lines 3a are formed, and communication sensitivity is formed. Can be improved.

  1, 21 Printed circuit board, 2 Ground, 3, 23, 33 Wiring, 3a Resonance line, 3b Connection end, 4 Base material, 5 Electrode pillar through hole, 5a Conductor, 5b, 5c, 21a, 31a, 27a Through hole , 6 End through hole, 7, 27, 37 Electrode column, 8, 8a, 8b, 28, 38 Coupling electrode, 9, 29 Land, 16 Upper substrate, 16a Upper surface, 16b Lower surface, 22 Connection terminal portion, 22a Signal terminal, 22b, 22c Ground terminal, 221 resist, 30, 40 connector, 30a, 40a connection terminal, 100 communication system, 101, 105 communication device, 102, 106, 110, 120, 210, 220 high frequency coupler, 110a Sample for evaluation, 110b Sample for comparison, 103, 107 electrodes, 104, 108 Transmission / reception Circuit part

Claims (7)

In an antenna device that performs information communication by electromagnetic field coupling between a pair of opposed electrodes at a predetermined communication frequency,
A printed circuit board in which a ground layer is formed on a conductive layer on one side and a wiring in which at least one end is short-circuited on the ground layer is formed on the conductive layer on the other side via a dielectric,
A coupling electrode that is made of a substantially planar conductor and is electromagnetically coupled to an electrode of another antenna device disposed at an opposing position to enable communication.
The wiring formed on the printed circuit board and the coupling electrode are separated by a predetermined distance in the thickness direction of the printed circuit board, and provided with electrode columns that are electrically connected,
On the surface of the printed circuit board on which the ground layer is formed, a land electrically insulated from the ground layer is formed,
The antenna device, wherein the electrode column penetrates a surface of the printed board on which the wiring is formed and is electrically connected to the land.   The land has a first through hole that is electrically connected to the land through the surface of the printed circuit board on which the wiring is formed, and the land is located around the first through hole. The antenna device according to claim 1, wherein a second through hole that electrically connects the land and the wiring is formed.   2. The coupling electrode according to claim 1, wherein the coupling electrode is separated from the surface on which the wiring is formed on the printed board by a predetermined distance with a fixing member made of a dielectric in the thickness direction of the printed board. 2. The antenna device according to 2.   One end of the wiring is short-circuited to the ground layer, and can be electrically connected to a transmission / reception device that performs signal transmission / reception processing at the other end via a connection point with the electrode column. The antenna device according to any one of claims 1 to 3, wherein a connection terminal portion is formed.   The antenna device according to any one of claims 1 to 3, wherein the land is formed with a signal terminal electrically connectable to a transmission / reception device that performs signal transmission / reception processing.   The wiring has at least one end opened or short-circuited with the ground layer at a position separated by an integral multiple of a quarter wavelength of the communication frequency with reference to a connection point with the electrode column. The antenna device according to claim 1, wherein the antenna device is characterized in that In a communication device that performs information communication by electromagnetic field coupling between electrodes of other communication devices arranged at opposing positions,
A printed circuit board in which a ground layer is formed on a conductive layer on one side and a wiring in which at least one end is short-circuited on the ground layer is formed on the conductive layer on the other side via a dielectric,
A coupling electrode that is made of a substantially planar conductor and is electromagnetically coupled to an electrode of another antenna device disposed at an opposing position to enable communication.
An electrode column for electrically connecting the wiring formed on the printed board and the coupling electrode by a predetermined distance apart in the thickness direction of the printed board;
A transmission / reception processing unit that is electrically connected to the wiring and performs signal transmission / reception processing;
On the surface of the printed circuit board on which the ground layer is formed, a land electrically insulated from the ground layer is formed,
The communication device, wherein the electrode column penetrates a surface of the printed circuit board on which the wiring is formed and is electrically connected to the land.

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