JP2011181675A - Mounting device for circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount a plurality of chips having fluctuations in outer shape, in positions where those chips do not come into contact with each other, and to attain high density without any trouble, when mounting the chips. <P>SOLUTION: A camera 5 is moved to above a chip 1a to be mounted first to image the chip from above. The chip is recognized by pattern matching technique to acquire the position and outer shape size of the chip. The chip is mounted in a predetermined mounting position and when a chip 1b to be mounted second is moved to the predetermined mounting position, it is computed in an operation region 20b whether the chips come into contact with each other including mounting precision and outer shape sizes. When they do not come into contact with each other, the second chip 1b is mounted in the predetermined mounting position, but when they come into contact, an amount of contact between the chips is offset-corrected to move and mount the second chip 1b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit component mounting apparatus, and in particular, mounting of a circuit component for mounting, for example, a semiconductor integrated circuit called a chip without bringing the chips into contact with each other at a plurality of mounting locations set on a substrate. Relates to the device.

As a conventional circuit component mounting apparatus, for example, there is one shown in Patent Document 1, and since the present invention is the invention closest to the present invention, the technique disclosed in Patent Document 1 will be described below.
First, page 2 and paragraph numbers 0003 to 0004 of the same document disclose the following problems.

(Problems described in Patent Document 1)
When sequentially mounting a plurality of chips on a plurality of mounting locations set on a substrate, particularly when the chip is a surface-mounted LED, each LED after mounting is required to be aligned with each other. It is done. However, if the positioning of the next chip is performed sequentially with reference to the electrodes formed at the mounting position of the substrate, the relative position of each chip may vary due to the generally low positional accuracy of the pattern-formed electrodes. is there. To provide a mounting apparatus and a mounting method that eliminate variations in relative positions between chips when sequentially mounting chips on a plurality of mounting locations set on a substrate.
Next, the following configuration is disclosed in page 3, paragraph number 0010 to page 3, paragraph number 0013 of the same document.

(Configuration described in Patent Document 1)
The substrate and the chip are placed on a table. The table is mounted on a moving table in which an X table and a Y table are stacked, and moves horizontally by driving the moving table. The substrate is placed on the table with the surface on which a plurality of electrodes (substrate-side electrodes) are formed facing upward, and the chip faces downward on the surface on which the plurality of electrodes (chip-side electrodes) are formed. In this state, a plurality of chips are arranged on the chip holder. A plurality of mounting locations for mounting the chip are formed on the substrate. A mounting head is disposed above the table. The mounting head is attached to the lifting mechanism, and is brought into contact with and separated from the table by driving the lifting mechanism. Further, the mounting head is provided with a suction mechanism and a heating mechanism, and has a function of mounting the chip adsorbed on a thermocompression tool mounted on the lower part of the mounting head by heating and pressing the chip onto the substrate. The mounting head functions as a chip mounting means for mounting a chip side electrode formed on one surface of the chip on a substrate side electrode formed at each of a plurality of mounting locations. Recognition means such as a camera for recognizing the position of the object is disposed between the table and the mounting head. The camera can simultaneously image in the vertical direction, and is attached to a moving mechanism for moving above or below the object to be imaged at the time of imaging. The driving units such as the moving table, the mounting head, the lifting mechanism, the camera, and the moving mechanism are communicatively connected to the control unit, and their operations are controlled based on a control signal transmitted from the control unit. The control unit includes a calculation area, a storage area, and an image processing area. The calculation area includes the drive amount and drive time of each drive unit of the mounting apparatus based on a control program and various data stored in advance in the storage area. And so on. The image processing area performs position recognition by processing an image of an imaging target imaged by a camera. Based on this position recognition result, the amount of movement of the table is calculated in the calculation area, and the chip and the substrate are positioned.
Next, the following operations are disclosed in page 4, paragraph number 0015 to page 5, paragraph number 0023 of the same document.

(Operation described in Patent Document 1)
The camera is moved above the chip mounted first among the plurality of chips placed on the table, and the chip is imaged from above. The captured image of the chip is transmitted to the image processing area, and the position of the chip is recognized by a pattern matching method for the outer shape of the chip. Based on the chip position recognition result, the movement amount of the table for aligning the mounting head (thermocompression bonding tool) and the chip is calculated in the calculation area. After moving the table to position the chip vertically below the thermocompression bonding tool, the thermocompression bonding tool is lowered to suck the chip. The table is moved to position a mounting location to be mounted first among a plurality of mounting locations set on the substrate vertically below the chip adsorbed by the thermocompression bonding tool. The camera is moved between the chip and the mounting location, and the chip is imaged from below and the mounting location is imaged from above. In the image processing region, the positional deviation between the chip and the mounting portion is recognized by a pattern matching method of the outer shape of the electrode formed on the chip electrode and the mounting portion. Based on this misalignment recognition result, the amount of movement of the table for aligning the chip and the mounting location is calculated in the calculation area. After the table is moved and the chip and the mounting location are aligned, the thermocompression bonding tool is lowered and the chip electrode is mounted on the electrode formed at the mounting location and heated and pressed. As a result, the chip is mounted and mounted at the mounting location formed on the substrate (chip mounting process). When the mounting of the chip is completed, the chip is then mounted at a mounting location adjacent to the mounting location. The chip is mounted with reference to the mounting position of the previously mounted chip. This is because if the chip is mounted with reference to the position of the electrode formed on the substrate as in the case of mounting the chip, the influence of the positional accuracy of the electrode becomes manifest as an error in the relative position between the chip and the chip. This is to prevent variations in relative positions between chips mounted on the substrate. As in the case of the above-described chip, after the chip is adsorbed to the thermocompression bonding tool, the camera is moved above the previously mounted chip, and the chip is imaged from above. Since the chip base is composed of a plate-like translucent base, the camera can image the electrodes from the upper surface side to the lower surface side of the chip substrate by light transmitted through the chip base material. The captured image of the electrode is transmitted to the image processing area, and the position of the chip is recognized by a pattern matching method of the outer shape of the electrode (recognition step). The camera is moved below the chip adsorbed by the thermocompression bonding tool, and the chip is imaged from below. In the image processing area, the chip position is recognized by the pattern matching method of the outer shape of the electrode of the chip. In the storage area, pitch data between the mounting positions formed on the substrate is stored in advance, and the chip position recognition result and the position recognition result of the chip electrode mounted on the mounting position, between the mounting position and the mounting position. Based on the pitch data, the amount of movement of the table for aligning the chip and the mounting location is calculated by the calculation area. The table is moved to align the chip with the mounting location (positioning step), and then the thermocompression bonding tool is lowered to mount the chip electrode on the electrode formed at the mounting location and heat and press. As a result, the chip is mounted and mounted at a mounting location formed on the substrate. In this way, when mounting a chip made of a plate-shaped translucent base material sequentially on a plurality of mounting locations set on the substrate, it is later mounted based on the position of the chip-side electrode of the previously mounted chip Since the mounting position of the chip to be performed is positioned, it is possible to eliminate the variation in the relative position between the chips. In particular, when the chip is a surface-mounted LED, it can be mounted in an aligned state by eliminating variations in position and orientation between the LEDs.

  As another known example in this field, for example, Patent Document 2 discloses a semiconductor chip outer shape recognition method for accurately recognizing the outer shape of a semiconductor chip, and a semiconductor chip position correction using the outer shape recognition method. The semiconductor chip 101 is placed on a stage having an xy orthogonal coordinate system plane, parallel to the x axis and in the y coordinate in the xy orthogonal coordinate system plane. The plurality of virtual lines 401 are scanned so as to increase the value, and the outer shape of the semiconductor chip 101 is recognized by using the plurality of intersections 420, 421, 422 between the plurality of virtual lines 401 and the outer periphery of the semiconductor chip 101. . As a result, the angle and position of the semiconductor chip 101 can be collectively corrected, the correction accuracy is extremely high, the number of processes is less than that of the conventional correction method, and the angle and position of the semiconductor chip 101 can be easily corrected. In addition, since the mounting position of the semiconductor chip 101 can be accurately corrected, a technique that can reduce the defective product rate during bonding is disclosed.

  Further, Patent Document 3 intends to position all chips accurately and quickly by an optimal amount of pitch movement even if the distance between chips is partially different, and is mounted on a movable table at a predetermined pitch. A large number of chips arranged in a grid are picked up by a camera, and the chip is moved to a predetermined position while moving the movable table based on recognition data obtained by image processing of the video signal from the camera by an image processing unit. , The inter-chip distances Pn, Pn-1, Pn-2 and the array direction are calculated from the recognition data of a plurality of chips Tn-1, Tn-2, Tn-3 located immediately before, and the calculation result is Based on this, a technique is disclosed in which the inter-chip distance Pn + 1 and the arrangement direction to the next chip Tn + 1 to be recognized are predicted and the movable table is pitch-moved based on the prediction data.

  Furthermore, Patent Document 4 intends to provide an optical module manufacturing technique for mounting a plurality of chip-shaped optical device patterns on a substrate while aligning the patterns of a plurality of chip-shaped optical devices in a predetermined positional relationship extremely precisely. Align the pattern and the marker attached to the alignment jig corresponding to the pattern, and temporarily fix the chip to the predetermined position of the jig with the temporary fixing adhesive, and repeat this process for multiple chips. Is temporarily fixed to each predetermined position on the jig, the marker on the substrate and the marker attached to the jig are aligned, and the chip temporarily fixed to the jig is connected via molten solder or adhesive A technique is disclosed in which a jig is pressed onto a substrate, a chip is bonded to a predetermined position on the substrate, the jig is removed at a predetermined temperature, and chip-shaped optical devices are collectively transferred and mounted on the substrate. .

JP 2007-266425 A JP 2008-124336 A JP-A-9-17841 Japanese Patent Laid-Open No. 11-145487

However, in the conventional circuit component mounting apparatus described in the background art above, when mounting a plurality of chips, it is mounted at a position away from each other so that the chips do not come into contact with each other in consideration of variations in the chip outer shape. However, for this reason, there has been a problem that high density of a plurality of chips is hindered.
The circuit component mounting apparatus according to the present invention includes the following main components.
(1) In high-density mounting means on a substrate on which a plurality of chips are mounted, a camera for photographing a target chip is provided, and adjacent to means for measuring the distance from the center of the chip to the edge in an image photographed by the camera. Means for comparing the predetermined distance between the centers of the chips of the matching chips and the total distance from the center to the end of each of the measured adjacent chips, and the total distance measured as a result of the comparison Is larger than a predetermined distance between the centers, a means for mounting the adjacent chips apart from the predetermined distance is provided to avoid contact between the chips.
(2) In the constituent requirements of (1), the distance from the center of the chip to the end is grasped from the external pattern (or mark) of the chip.

On the other hand, the techniques disclosed in Patent Documents 1 to 4 described above lack any of the above-described constituent requirements (1) to (2). In particular, in order to solve the problem of “mounting chips so that they do not contact each other in consideration of variations in chip external shapes when mounting multiple chips,” the distance between the centers of adjacent chips is predetermined. If the distance is equal to or greater than this distance, a means of “separating the distance more than a predetermined distance” is indispensable, but such means is not disclosed in Patent Documents 1 to 4 described above.
Further, in the case of the technique disclosed in Patent Document 1 described above, since it is a mounting device that sequentially mounts chips made of a light-transmitting substrate, it cannot be applied to a non-light-transmitting chip. .

  The present invention has been made in view of the above-described conventional problems. For example, when the mounting component is a semiconductor integrated circuit referred to as a chip, the adjacent components are considered in consideration of variations in a plurality of chip external sizes. When the chips are in contact with each other, it is possible to provide a circuit component mounting apparatus that can be mounted without contacting the chips by making it possible to separate the distance between the two chips.

  In order to solve the above-described problem, a circuit component mounting apparatus according to the present invention, for each of two circuit components, measuring means for measuring the distance between the center and the end farthest from the center, Arranging means for arranging the two circuit components placed on the mounting table at the planned mounting locations, respectively, and mounting any one of the two circuit components at the planned mounting location of the circuit components. 1 between the end portions of the two circuit components, based on the measurement result of the one mounting means, the measurement result by the measuring means, and the distance between the predetermined centers of the two circuit components respectively arranged at the planned mounting locations. A calculation means for calculating a distance; a contact determination means for determining whether or not the two circuit parts are in contact with each other based on a calculation result of the calculation means; and the two circuit components based on a determination result of the contact determination means If contact A correction unit that moves the circuit component on the mounting side to position it at a position that does not contact the mounted circuit component, and a second unit that mounts the circuit component positioned by the correction unit at the positioned position. And mounting means.

  As described above, according to the present invention, for example, when the mounting component is a semiconductor integrated circuit called a chip, when mounting a plurality of such chips, variation in the outer size of each chip is considered. At the same time, when the distance between the centers of adjacent chips is equal to or greater than a predetermined distance, the distance between the centers is set to be equal to or greater than the predetermined distance.

It is a block diagram which shows the structure of the mounting apparatus of the circuit component which concerns on embodiment of this invention. It is a block diagram which shows the other structure of the circuit component mounting apparatus which concerns on embodiment of this invention. It is explanatory drawing which shows arrangement | positioning of the board | substrate 2 after mounting a circuit component using the circuit component mounting apparatus which concerns on embodiment of this invention, and chip | tip 1a, 1b. It is a flowchart figure which shows operation | movement of the control part 20 of the mounting apparatus of the circuit components shown in FIG. It is explanatory drawing which shows an example of the chip | tip with a mark. It is explanatory drawing which shows the example of determination of the contact between chips in the case of mounting by performing angle correction. It is explanatory drawing which shows the example of determination of the contact between chips in the case of mounting, without performing angle correction.

A circuit component mounting apparatus according to the present invention includes a positioning unit for positioning a chip mounting position, a chip mounting unit, a calculation unit for calculating a chip mounting position, a storage unit for storing calculation results, and an image processing unit. And an arithmetic means for executing a pattern matching method.
The circuit component mounting method according to the present invention recognizes the outer size of the chip mounted after the first, and if the chip is mounted at a predetermined mounting position of the first and subsequent chips, the chips including the mounting accuracy and the outer size are aligned. If contact is calculated in the calculation area, the second chip is mounted while maintaining it at a predetermined mounting position. If contact is made, the contact amount between the chips is offset and moved and mounted. It is characterized by that.
This feature produces an effect of mounting so that a plurality of chips do not come into contact with each other based on variations in chip outer size.

Embodiments of a circuit component mounting apparatus and a circuit component mounting method according to the present invention will be described below in detail with reference to the drawings.
FIG. 1 is a configuration diagram showing a configuration of a circuit component mounting apparatus according to an embodiment of the present invention.
However, the drawing also shows a method of using the mounting apparatus for mounting circuit components.
The circuit component mounting apparatus according to the present embodiment shown in the figure includes a substrate 2 on which a chip is mounted on a top surface, a chip table 3 on which a chip before mounting is placed, and a moving table 4 that can move horizontally in the XY directions. The camera 5 for recognizing the position of the object, the head 6 attached to the lifting mechanism, the stage 7 for fixing the substrate 2, the thermocompression bonding tool 8 attached to the lower part of the head 6, and the control unit 20 And comprising.
The control unit 20 includes a calculation area 20a, a storage area 20b, and an image processing area 20c.
In FIG. 1, reference numeral 1a is a chip to be mounted first, and reference numeral 1b is a chip to be mounted second.

The function of the circuit component mounting apparatus according to the embodiment of the present invention shown in FIG. 1 will be described below.
The first mounted chip 1a and the second mounted chip 1b are placed on the chip table 3 with the surface on which a plurality of electrodes (chip side electrodes) are formed facing upward. That is, a plurality of the chips are arranged on the chip table 3.
The substrate 2 is arranged on the stage 7 with the surface on which a plurality of electrodes (substrate-side electrodes) are formed facing upward. Each chip is arranged and mounted on the upper surface of the substrate 2.
The chip table 3 is fixed on the moving table 4 in a state where each chip is placed.
The moving table 4 is mounted on a moving mechanism (not shown) and can move horizontally in the XY directions. A chip table 3 and a stage 7 are fixed on the moving table 4.
The camera 5 is an imaging device that performs imaging for recognizing the position of an object (here, each chip described above), and is fixed to the head 6.

The head 6 is mounted on an elevating mechanism (not shown), is movable in the vertical direction, and is brought into contact with and separated from the stage 7 by driving the elevating mechanism. Further, the head 6 is provided with a suction mechanism and a heating mechanism (both not shown), and each chip adsorbed by a thermocompression bonding tool 8 mounted on the lower part of the head 6 is heated and pressed against the substrate 2. And has a function to be implemented.
The stage 7 is a pedestal for adsorbing and fixing the substrate 2.
Each drive unit such as a moving mechanism of the moving table 4, a lifting mechanism of the head 6, a camera 5, a suction mechanism of the head 6, and a heating mechanism of the head 6 is communicably connected to the control unit 20. The operation is controlled based on a control signal transmitted from the control unit 20.

The calculation area 20a of the control unit 20 calculates the driving amount (movement distance) of each driving unit of the mounting apparatus, the driving time, and the like based on a control program and various data stored in advance in the storage area 20b. Further, the amount of movement of the moving table 4 is calculated based on the position recognition result in the image processing area 20c, and the respective chips and the substrate 5 are positioned by controlling the respective driving units.
The image processing area 20c of the control unit 20 processes the image of the object to be imaged (here, each chip described above) imaged by the camera 5 and recognizes the position of the object to be imaged. The calculation area 20a calculates the movement amount of the movement table 4 based on the position recognition result. The object to be imaged is recognized in the image processing area 20c by analyzing the image taken by the camera 5 by pattern recognition, and the position recognition result is stored in the storage area 20b.

FIG. 2 is a configuration diagram showing another configuration of the circuit component mounting apparatus according to the embodiment of the present invention.
However, the drawing also shows a method of using the mounting apparatus for mounting circuit components.
The circuit component mounting apparatus according to the present embodiment shown in the figure includes a substrate 32 on which a chip is mounted, a chip table 33 on which a chip before mounting is placed, and a moving table 34 that can move horizontally in the XY directions. A camera 35 and a camera 39 for recognizing the position of the object, a head 36 attached to the lifting mechanism, a stage 37 for fixing the substrate 32, a thermocompression bonding tool 38 attached to the lower part of the head 36, And a control unit 40.
The control unit 40 includes a calculation area 40a, a storage area 40b, and an image processing area 40c.
In FIG. 2, reference numeral 31a is the first mounted chip, and reference numeral 31b is the second mounted chip.

The function of the circuit component mounting apparatus according to the embodiment of the present invention shown in FIG. 2 will be described below.
The first mounted chip 31a and the second mounted chip 31b are placed on the chip table 33 with the surface on which a plurality of electrodes (chip side electrodes) are formed facing upward. That is, a plurality of the chips are arranged on the chip table 33.
The substrate 32 is arranged on the stage 37 with the surface on which a plurality of electrodes (substrate-side electrodes) are formed facing upward. Each chip is arranged and mounted on the upper surface of the substrate 32.
The chip table 33 is fixed on the moving table 34 in a state where each chip is placed.
The moving table 34 is mounted on a moving mechanism (not shown) and can move horizontally in the XY directions, and a chip table 33 and a stage 37 are fixed thereon.
The camera 35 is an imaging device that performs imaging for recognizing the position of an object (here, each chip described above), and is fixed to a stage 37.
The camera 39 is an imaging device that performs imaging for recognizing the position of an object (here, each chip described above), and is fixed to the head 36.

The head 36 is mounted on an elevating mechanism (not shown), is movable in the vertical direction, and is brought into contact with and separated from the stage 37 by driving the elevating mechanism. In addition, the head 36 is provided with a suction mechanism and a heating mechanism (both not shown), and the respective chips adsorbed by the thermocompression bonding tool 38 attached to the lower part of the head 36 are heated and pressed against the substrate 32. And has a function to be implemented.
The stage 37 is a pedestal for adsorbing and fixing the substrate 32.
Each drive unit such as a moving mechanism of the moving table 4, an elevating mechanism of the head 36, a camera 35 and a camera 39, a suction mechanism of the head 6, and a heating mechanism of the head 6 is connected to the control unit 40 so as to be communicable. The operation is controlled based on a control signal transmitted from the control unit 40.
The drive units such as the moving table 34, the head 36, the lifting mechanism, the camera 35, the camera 39, the suction mechanism, and the heating mechanism are connected to the control unit 40 so as to communicate with each other. The operation is controlled based on the transmitted control signal.

The calculation area 40a of the control unit 40 calculates the driving amount (movement distance), driving time, and the like of each driving unit of the mounting apparatus based on a control program and various data stored in advance in the storage area 40b. Further, the amount of movement of the moving table 4 is calculated based on the position recognition result in the image processing area 40c, and the respective chips and the substrate 35 are positioned by controlling the respective driving units.
The image processing area 40c of the control unit 40 processes the image of the shooting target (here, each chip described above) picked up by the camera 35 and recognizes the position of the shooting target. The calculation area 40a calculates the movement amount of the movement table 34 based on the position recognition result. The object to be imaged is recognized in the image processing area 40c by analyzing the image taken by the camera 35 by pattern recognition, and the position recognition result is stored in the storage area 40b.

FIG. 3 is an explanatory view showing the arrangement of the substrate 2 and the chips 1a and 1b after the circuit components are mounted using the circuit component mounting apparatus according to the embodiment of the present invention.
As shown in the figure, the chips 1a and 1b are mounted on the substrate 2 so as not to contact each other.

(Description of operation)
FIG. 4 is a flowchart showing the operation of the control unit 20 of the circuit component mounting apparatus shown in FIGS.
In the following description of the operation, the distance (x1-x2) is the distance between the centers of the two chips respectively arranged at the initial mounting planned location (the distance determined in advance at the design stage, that is, the predetermined distance). And a distance α (hereinafter simply referred to as “α”) between the center of the first mounted chip and the end portion farthest from the center (hereinafter simply referred to as “end portion”). And the distance β (hereinafter simply referred to as “β”) is the distance between the center of the second mounted chip and its end.
When x1-x2> α + β, the chips do not contact each other, and when x1-x2 ≦ α + β, the chips contact each other.
The operation of the control unit 20 of the circuit component mounting apparatus shown in FIG. 1 will be described below with reference to FIG. 1 and the flowchart shown in FIG.

(Step S1)
First, in step S <b> 1, the control unit 20 moves the moving table 4 via the moving mechanism of the moving table 4, and the position of the camera 5 is the first of the plurality of chips placed on the chip table 3. The upper part of the chip 1a mounted on the board is positioned so as to be photographed.
(Step S2)
Next, in step S <b> 2, the control unit 20 controls the lifting mechanism of the head 6 and images the chip 1 a from above the chip 1 a via the camera 5. The captured image of the chip 1 a is sent to the image processing area 20 c of the control unit 20.

(Step S3)
Next, in step S3, the calculation area 20a of the control unit 20 recognizes the chip 1a by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 20b, and the position and outer size of the chip 1a. To get. In addition, the calculation area 20a calculates the distance α between the center and the end of the chip 1a to be mounted first using this result. Further, the calculation area 20a calculates the amount of movement of the moving table 4 for aligning the head 6 and the chip 1a based on the position and outer size of the chip 1a.
(Step S4)
Next, in step S <b> 4, the control unit 20 moves the moving table 4 through the moving mechanism of the moving table 4, and lowers the thermocompression bonding tool 8 through the lifting mechanism of the head 6 to suck the head 6. The chip 1a is adsorbed using a mechanism.

(Step S5)
Next, in step S <b> 5, the control unit 20 moves the moving table 4 again via the moving mechanism of the moving table 4 and sets it on the substrate 2 vertically below the chip 1 a adsorbed by the thermocompression bonding tool 8. Position the mounted location. The thermocompression bonding tool 8 is lowered to mount the chip 1 a on the substrate 2, heated using the heating mechanism of the head 6 and pressed via the lifting mechanism of the head 6. Thereby, the chip 1 a is mounted on the substrate 2. The mounted chip 1a is imaged by the camera 5. Thereafter, the mounted chip 1a is recognized and the mounting position of the chip 1a is obtained by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 20b via the calculation area 20a. The position information is stored in the storage area 20b.

  Although illustration is omitted, thereafter, the control unit 20 applies the same steps as the above steps S1 to S5 to the second mounted chip 1b, and the image of the chip 1b on the chip table 3 is applied. Is captured using the camera 5, the chip 1a is recognized by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 20b, the position and outer size of the chip 1b are acquired, and the mounting position is determined. Positioning is performed, and the mounting position information is stored in the storage area 20b. However, at this stage, in step S5, the chip 1b is positioned at the mounting position set on the substrate 2, and the thermocompression tool 8 is lowered to mount the chip 1b on the substrate 2. The chip 1b is not yet mounted.

(Step S6)
Next, in step S6, the calculation area 20a of the control unit 20 determines the edge positions of the mounted chip 1a and the second mounted chip 1b (that is, the center and end portions) based on the mounting location information. The position α is obtained, and the distance α between the center and the end of the first mounted chip 1a and the distance β between the center and the end of the second mounted chip 1b are calculated.
(Step S7)
Next, in step S7, the calculation area 20a of the control unit 20 verifies whether or not the already mounted chip 1a and the second mounted chip 1b contact each other, and the already mounted chip 1a. If the second mounted chip 1b is in contact with each other, the process proceeds to step S8. If the already mounted chip 1a and the second mounted chip 1b are not in contact with each other, the process proceeds to step S10.

Hereinafter, the verification method will be described.
The above verification is performed based on each mounting location information, and the calculation area 20a of the control unit 20 calculates whether or not the chips are in contact with each other including the mounting accuracy and the outer size. The distance between the chip centers (= x1-x2) is the sum of the distance α between the center and end of the first mounted chip 1a and the distance β between the center and end of the second mounted chip 1b. If it is larger, it is determined that the chips do not contact each other. On the other hand, the distance between the centers of the chips (= x1-x2) is the distance α between the center and the end of the first mounted chip 1a, and 2 When it is not larger than the sum of the distances β between the center and the end of the chip 1b to be mounted second, it is determined that the chips are in contact with each other.

(Step S8)
In step S8, the control unit 20 calculates a distance equal to or greater than the contact amount between the chips (= (x1-x2) − (α + β)) via the calculation area 20a, and then via the moving mechanism of the moving table 4. The moving table 4 is moved with offset correction.
(Step S9)
In step S <b> 9, the control unit 20 positions a mounting location set on the substrate 2 below the chip 1 b attracted by the thermocompression bonding tool 8. The thermocompression bonding tool 8 is lowered to mount the chip 1 b on the substrate 2, heated using the heating mechanism of the head 6, and pressed through the lifting mechanism of the head 6. As a result, the chip 1b is mounted on the substrate 2 at the position where the offset correction has been performed. Thereafter, the mounted chip 1b is imaged by the camera 5, and the chip 1b is recognized by pattern matching with a predetermined circuit component pattern stored in advance, and the position and outer size of the chip 1b are acquired (these information) Is referred to when mounting other chips). As a result, the process is ended or the process returns to step S1 to mount another chip.

(Step S10)
In step S <b> 10, the control unit 20 lowers the thermocompression bonding tool 8 to mount the chip 1 b on the substrate 2, heats it using the heating mechanism of the head 6, and presses it via the lifting mechanism of the head 6. As a result, the chip 1b is mounted on the substrate 2 while keeping the predetermined position as planned. Thereafter, the mounted chip 1b is imaged by the camera 5, and the chip 1b is recognized by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 20b, and the position and outer size of the chip 1b are acquired. (These information is referred to when another chip is mounted). As a result, the process is ended or the process returns to step S1 to mount another chip.
In the processing of step S7 and step S8, if there is another chip already mounted in addition to the chip 1a, it is considered that the chip 1b does not come into contact with this other chip.

The operation of the control unit 40 of the circuit component mounting apparatus shown in FIG. 2 will be described below with reference to FIG. 2 and the flowchart shown in FIG.
(Step S1)
First, in step S <b> 1, the control unit 40 moves the moving table 34 via the moving mechanism of the moving table 34, and the position of the camera 35 is the first of the plurality of chips placed on the chip table 33. The upper part of the chip 31a mounted on the board is positioned so as to be photographed.
(Step S2)
Next, in step S <b> 2, the control unit 40 controls the lifting mechanism of the head 36 and images the chip 31 a from above the chip 31 a via the camera 39. The captured image of the chip 31 a is sent to the image processing area 40 c of the control unit 40.

(Step S3)
Next, in step S3, the calculation area 40a of the control unit 40 recognizes the chip 31a by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 40b, and the position and outer size of the chip 31a. To get. The calculation area 40a calculates the distance α between the center and the end of the chip 31a to be mounted first using the recognition result. Furthermore, the calculation area 40a calculates the amount of movement of the moving table 34 for aligning the head 36 and the chip 31a based on the position and outer size of the chip 31a.
(Step S4)
Next, in step S <b> 4, the control unit 40 moves the moving table 34 via the moving mechanism of the moving table 34, and lowers the thermocompression bonding tool 38 via the lifting mechanism of the head 36, thereby sucking the head 36. The chip 31a is adsorbed using a mechanism.

(Step S5)
Next, in step S <b> 5, the control unit 40 moves the moving table 34 again through the moving mechanism of the moving table 34 and sets it on the substrate 32 vertically below the chip 31 a adsorbed by the thermocompression bonding tool 38. Position the mounted location. The chip 31 a is mounted on the substrate 32 by lowering the thermocompression bonding tool 38, heated using the heating mechanism of the head 36, and pressed through the lifting mechanism of the head 36. Thereby, the chip 31 a is mounted on the substrate 32. The mounted chip 31a is imaged by the camera 39. Thereafter, the mounted chip 31a is recognized and the mounting position of the chip 31a is obtained by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 40b via the calculation area 40a. The position information is stored in the storage area 40b.

  Although illustration is omitted, after that, the control unit 40 applies the same steps as the above steps S1 to S5 to the chip 31b to be mounted second, and the chip 31b adsorbed by the thermocompression bonding tool 38 is applied. Is captured from below using the camera 35, the chip 31b is recognized by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 40b, and the position and outer size of the chip 31b are acquired. Then, the mounting position information is positioned, and the mounting position information is stored in the storage area 40b. However, at this stage, in step S5, the chip 31b is positioned at the mounting position set on the substrate 32, and the operation until the chip 31b is mounted on the substrate 32 by lowering the thermocompression bonding tool 38 is performed. The chip 31b is not yet mounted.

(Step S6)
Next, in step S6, the calculation area 40a of the control unit 40 determines the edge positions (that is, the center and end portions of the mounted chip 31a and the second mounted chip 31b based on the mounting location information. The position α is obtained, and the distance α between the center and the end of the chip 31a to be mounted first and the distance β between the center and the end of the chip 31b to be mounted second are calculated.
(Step S7)
Next, in step S7, the calculation area 40a of the control unit 40 verifies whether the already mounted chip 31a and the second mounted chip 31b contact each other, and the already mounted chip 31a. If the second mounted chip 31b is in contact with each other, the process proceeds to step S8. If the already mounted chip 31a and the second mounted chip 31b are not in contact with each other, the process proceeds to step S10.
The verification method is the same as the verification method described in the operation of the control unit 20 of the circuit component mounting apparatus shown in FIG.

(Step S8)
In step S8, the control unit 40 calculates a distance equal to or greater than the contact amount between the chips (= (x1-x2) − (α + β)) via the calculation area 40a, and then via the moving mechanism of the moving table 34. The movement table 34 is moved with offset correction.
(Step S9)
In step S <b> 9, the control unit 40 positions a mounting location set on the substrate 32 below the chip 31 b attracted by the thermocompression bonding tool 38. The chip 31b is mounted on the substrate 32 by lowering the thermocompression bonding tool 38, heated using the heating mechanism of the head 36, and pressed through the lifting mechanism of the head 36. Thereby, the chip 31b is mounted on the substrate 32 at the position where the offset correction is performed. Thereafter, the mounted chip 31b is imaged by the camera 35, and the chip 31b is recognized by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 40b, and the position and outer size of the chip 31b are acquired. (These information is referred to when another chip is mounted). As a result, the process is ended or the process returns to step S1 to mount another chip.

(Step S10)
In step S <b> 10, the control unit 40 lowers the thermocompression bonding tool 38 to mount the chip 31 b on the substrate 32, heats it using the heating mechanism of the head 36, and presses it via the lifting mechanism of the head 36. As a result, the chip 31b is mounted on the substrate 32 while keeping the predetermined position as planned. Thereafter, the mounted chip 31b is imaged by the camera 35, and the chip 31b is recognized by pattern matching with a predetermined circuit component pattern stored in advance in the storage area 40b, and the position and outer size of the chip 31b are acquired. (These information is referred to when another chip is mounted). As a result, the process is ended or the process returns to step S1 to mount another chip.

In the processing of step S7 and step S8, when there is another chip already mounted in addition to the chip 31a, it is considered that the chip 31b does not come into contact with this other chip.
Also, the operation of the control unit 40 of the circuit component mounting apparatus shown in FIG. 2 does not necessarily follow the procedure of the flowchart shown in FIG. 4. For example, the processing for the chip 31 a and the processing for the chip 31 b are interchanged. Is possible. Also, the execution order of the two processes can be interchanged.

FIG. 5 is an explanatory view showing an example of a chip with a mark.
In the case of the chip shown in the figure, black brackets are marked at the upper left and lower right corners.
FIG. 6 is an explanatory diagram illustrating an example of determining contact between chips when mounting is performed with angle correction.
Since both chips shown in the figure are angle corrected and both chips have long sides aligned in the X-axis direction, α is the distance from the center of the chip (X1, Y1) to the right end of the chip, and β is the chip Since the distance is from the center (X2, Y2) to the left end of the chip, the distance between both centers is (X1-X2).
FIG. 7 is an explanatory diagram illustrating a determination example of contact between chips when mounting without performing angle correction.
In the example, α is the distance from the center of the chip (X1, Y1) to the upper right corner of the chip, because both chips shown in the figure are not angle-corrected and the long sides of both chips are not aligned in the X-axis direction. Β is the distance from the center (X2, Y2) of the chip to the upper left corner of the chip. In this case as well, the distance between the centers may be (X1−X2).

(Other embodiments)
The chip supply to the chip table may be manual or a chip supply unit.
The substrate may be supplied to the stage manually or by a substrate supply unit.
If the outer shape of the chip is recognized and it is determined that the chip is a predetermined size or larger, the mounting of the chip may be stopped. In this case, an alarm may be generated to notify the operator to that effect.
Further, not only the outer shape of the chip but also the chip mark may be pattern-matched. If the entire chip does not fit in the camera's field of view, the outer shape or mark may be imaged twice. In this case, the camera moves and images a diagonal outline or mark. The center of the chip is calculated from the two mark positions.

Further, when the mounting apparatus has no θ correction, for example, as shown in FIG. 7, the distance α ′ between the center and corner of the first mounted chip and the center and corner of the second mounted chip are The mounting position may be calculated by comparing the sum of the distances β ′ between and the distance between the chip centers (= x1-x2).
In this case, the distance between the chip centers (= x1-x2) is a distance α ′ between the center and corner of the first mounted chip and a distance β ′ between the center and corner of the second mounted chip. If the sum is greater than the sum of the two, that is, if the two chips do not contact, the second chip is kept in a predetermined mounting position.

On the other hand, in this case, the distance between the chip centers (= x1-x2) is the distance α ′ between the center and the end of the first mounted chip and the center and the end of the second mounted chip. If the distance is less than the sum of the distances β ′, that is, if both chips are in contact, offset correction is performed for a distance that is greater than the contact amount between the chips (= (x1−x2) − (α ′ + β ′)). To move and implement.
Further, an X-ray imaging device, an infrared microscope, or the like may be used for the above-described chip mark recognition. Furthermore, an upper and lower two-view camera having an upward camera and a downward camera may be used.
Further, although the chip table 3 and the stage 7 are fixed on the moving table 4 and operated in the XY direction, the head 6 may be fixed to the moving table and the head may operate in the XY direction.
Further, when the outer size of the second chip is recognized, the chip mounting position where the chips do not contact each other including the mounting accuracy and the outer size is calculated in the calculation area 20b of the control unit 20, and the offset is corrected and moved. May be implemented.

Moreover, you may mount in nitrogen atmosphere for the purpose of joining quality improvement.
Further, as a mounting method, not only heating and pressing but also ultrasonic vibration or laser heating may be used.
Further, the mounting position of the chip may be recognized by reading the encoder of the motor. A program for executing at least a part of the processing of each component of the circuit component mounting apparatus according to the present invention by computer control and causing the computer to execute the above processing according to the procedure shown in the flowchart of FIG. May be stored and distributed in a computer-readable recording medium such as a semiconductor memory, a CD-ROM, or a magnetic tape. A computer including at least a microcomputer, a personal computer, and a general-purpose computer may read and execute the program from the recording medium.

  The present invention is applicable to construction of a circuit component mounting apparatus, and in particular, a semiconductor integrated circuit called a chip, for example, is not brought into contact with a plurality of mounting locations set on a substrate. The present invention can be suitably applied to a circuit component mounting apparatus for mounting.

1a, 31a First mounted chip 1b, 31b Second mounted chip 2, 32 Substrate 3, 33 Chip table 4, 34 Moving table 5, 35, 39 Camera 6, 36 Head 7, 37 Stage 8, 38 Heat Crimping tool 20, 40 Control unit 20a, 40a Calculation area 20b, 40b Storage area 20c, 40c Image processing area

Claims (10)

Measuring means for measuring the distance between the center of each of the two circuit components and the end farthest from the center;
Arrangement means for arranging the two circuit components placed on the mounting table at respective mounting locations;
A first mounting means for mounting any one of the two circuit components to a mounting position of the circuit component;
Calculation means for calculating the distance between the end portions of the two circuit components based on the measurement result by the measurement means and the distance between the predetermined centers of the two circuit components respectively arranged at the mounting location. When,
Contact determination means for determining whether or not the two circuit components are in contact with each other based on a calculation result by the calculation means;
According to the determination result of the contact determination means, when the two circuit components are in contact with each other, the correction circuit that moves the unmounted circuit component and positions it at a position not in contact with the mounted circuit component;
Second mounting means for mounting the circuit component positioned by the correcting means at the positioned position;
A circuit component mounting apparatus comprising:   The measuring means recognizes each of the two circuit components by pattern matching with a predetermined circuit component pattern stored in advance based on an image obtained by photographing each of the two circuit components with a camera. 2. The circuit component mounting according to claim 1, wherein each of the two circuit components is recognized and a distance between the outermost end from the center is acquired based on the recognition result. apparatus.   3. The circuit component mounting apparatus according to claim 2, wherein the number of installed cameras is one or more.   When a plurality of cameras are installed, at least one camera photographs one of the two circuit components from above, and at least one other camera photographs the other circuit component from below. 4. The circuit component mounting apparatus according to claim 3, wherein the circuit component mounting apparatus is a device.   The arrangement means obtains the position of each of the two circuit components at the recognition point based on the recognition result, and calculates the amount of movement of each of the two circuit components to the planned mounting location based on the position. The circuit component mounting apparatus according to claim 2, wherein each circuit component is calculated.   The correction movement amount of the unmounted circuit component moved by the correction means is a distance between the end furthest from the center and a distance between the predetermined centers of the two circuit components. The circuit component mounting apparatus according to claim 2, wherein the circuit component mounting apparatus is determined based on the determination result.   3. The circuit component according to claim 2, wherein the pattern matching with the predetermined circuit component pattern stored in advance is executed by using an outline of the circuit component or a mark of the circuit component as a pattern matching target. Mounting equipment.   2. The circuit component mounting apparatus according to claim 1, wherein the mounting means includes means for mounting and heating the circuit component at the mounting location and pressing the circuit component.   The contact determination means also determines contact between the unmounted circuit component and the other mounted circuit component when there is another mounted circuit component other than the two circuit components. The correction means moves the unmounted circuit component when the contact determining means determines that the unmounted circuit component is in contact with the other mounted circuit component. 2. The circuit component mounting apparatus according to claim 1, wherein the unmounted circuit component is positioned at a position where it does not come into contact with the other mounted circuit components.   6. The circuit component mounting apparatus according to claim 1, wherein the circuit component is a chip including a semiconductor integrated circuit.

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