JP2011170752A - Ic module loaded medium and ic card - Google Patents

Abstract

An object of the present invention is to improve the radiation efficiency of electromagnetic waves and reduce the discomfort on the appearance of an antenna coil and a capacitive coupling electrode in a non-contact type IC module mounting medium and IC card having a structure without through holes. Objective.
The present invention relates to an IC module mounting medium and an IC card provided with an antenna coil (20), wherein a pair of capacitive coupling electrodes is provided at opposite positions on the front and back of a base sheet on which the IC module and the antenna coil are mounted. Two sets (31a, 31b) (32a, 32b) are provided, and one set (32a, 32b) of the two sets of electrodes is provided at the corner of the base sheet, and the extension line of the outermost peripheral pattern of the electrodes is an antenna. The above problem is solved by arranging the coil (20) so as to be aligned with the outermost peripheral pattern.
[Selection] Figure 1

Description

  The present invention relates to a medium mounted with an IC module and an IC card using the medium, and more particularly to a medium mounted with an IC module including a function of performing information transmission with an external device in a non-contact manner and an IC card using the medium.

  A non-contact type IC card has a sheet-like medium (sometimes called an antenna sheet) in which an IC module and an antenna coil are mounted on at least one surface of a base material sheet made of a dielectric material (insulating material). It has a structure sandwiched between plastic sheets called core sheets.

  The IC module is an electronic circuit for various information processing (may include a CPU, memory, etc.), an electronic circuit for information transmission with an external device via an antenna coil, and energy from an external device in the case of battery-less. And a function of generating electric power to the electronic circuit.

  The IC module includes at least a pair of antenna terminals, and the antenna terminals are connected to both ends of the antenna coil. In the present invention, the antenna coil mounted on the medium is assumed to be spiral. Therefore, when the IC module is arranged at the center side of the spiral of the antenna coil, one end of the center side of the spiral of the antenna coil and one of the antenna terminals of the IC module are connected to the wiring pattern on the surface side of the base sheet (hereinafter referred to as the surface). It is connected via a wiring).

On the other hand, one end on the outer periphery side of the spiral of the antenna coil is led to the back surface side of the base material sheet through a through hole provided in the base material sheet and connected to the wiring pattern on the back surface of the base material sheet (hereinafter referred to as back surface wiring). Is done. The back surface wiring intersects with the antenna coil on the front surface side and is led to the center side, and is again led to the substrate sheet surface side through a through hole different from the through hole. In this way, one end on the outer peripheral side of the spiral of the antenna coil is lead to the surface of the base sheet, and is connected to the other antenna terminal of the IC module.
The non-contact IC card having the above structure is disclosed in Patent Document 1, for example.

  In the case where the front and back surfaces of the base sheet are electrically connected by the through holes and electrically connected, there is a disadvantage that the manufacturing process of the through holes is particularly complicated. In order to solve such drawbacks, there is a concept of forming capacitive coupling electrodes on the front and back sides of the base sheet instead of the through holes and electrically connecting them through a capacitor formed by the electrodes. A non-contact IC card based on such a concept is disclosed in Patent Document 2, for example.

JP 2000-242755 A JP-A-8-180160

  According to the non-contact IC card disclosed in Patent Document 2, the front and back of the base sheet can be electrically connected without providing a through hole. However, the base sheet for a non-contact IC card can be obtained due to the presence of capacitive coupling electrodes. The antenna coil is provided at a position avoiding a part of the outermost periphery of the antenna. Accordingly, a blank is generated in the vicinity of the outermost periphery of the base sheet, and a useless area is created.

  That is, according to the non-contact IC card using the capacitive coupling electrode as in Patent Document 2, the antenna coil pattern does not extend to the region near the outermost periphery of the base sheet due to the presence of the capacitive coupling electrode. There is a problem that the radiation resistance of the antenna is increased (the radiation efficiency of electromagnetic waves is deteriorated) as compared with a non-contact IC card using a through hole as in Patent Document 1.

  Further, since a blank is generated in the vicinity of the outermost periphery of the base sheet and a useless area is formed, there is a problem that an uncomfortable appearance is generated with respect to the pattern of the antenna coil and the capacitive coupling electrode.

  Therefore, the present invention aims to improve the radiation efficiency of electromagnetic waves and reduce the appearance of the antenna coil and capacitive coupling electrode in a non-contact type IC module mounting medium and IC card having a structure without through holes. To do.

  The present invention solves the above problems by the following aspects.

  According to a first aspect of the IC module mounting medium (1) of the present invention, an IC module (11) and an antenna coil (20) are provided on at least one surface of a rectangular base sheet (10) made of a dielectric material. In the IC module mounting medium, two sets of capacitive coupling electrodes ((31a, 31b), (32a, 32b)) are provided at opposite positions on the front and back of the base sheet, and the capacity on the back side of the base sheet The coupling electrodes (31b, 32b) are connected to each other by a back surface wiring (45), and one of the capacitive coupling electrodes on the surface side of the base sheet (31a) and one antenna terminal (T1) of the IC module (11), The other (32a) of the capacitive coupling electrode and one end of the antenna coil (20), the other end of the antenna coil (20), and the other antenna terminal (T2) of the IC module Are connected by the surface wirings (41, 42), and one of the two sets of capacitive coupling electrodes (32a, 32b) is provided at the corner of the base sheet, and the capacitive coupling electrode ( 32a and 32b) are arranged so that the extended line of the outermost peripheral pattern of the antenna coil (20) is aligned with the outermost peripheral pattern of the antenna coil (20).

According to the first aspect, the front and back surfaces of the base sheet are capacitively coupled by the coupling capacitors (C1, C2) formed by the capacitive coupling electrodes instead of the through holes.

Further, one of the capacitive coupling electrodes is provided at the corner of the base sheet, and further, the extension line of the outermost peripheral pattern of the capacitive coupling electrode is arranged so as to be aligned with the outermost peripheral pattern of the antenna coil. Since no blank space is generated in the vicinity of the outermost periphery, there is no useless area. Therefore, since the pattern of the antenna coil extends to a region near the outermost periphery of the base sheet, there is an effect that the radiation resistance of the antenna coil is reduced.

  Further, according to the first aspect of the present invention, the capacitive coupling electrode is visually assimilated as a part of the antenna coil, and there is an effect that an uncomfortable appearance is reduced due to the presence of the capacitive coupling electrode.

  According to a second aspect of the IC module mounting medium (1) of the present invention, in the first aspect, the capacitive coupling electrodes (32a, 32b) provided at the corners of the base material sheet are base material sheets ( 10) A long shape in the long side direction.

  According to a third aspect of the IC module mounting medium (1) of the present invention, in the first or second aspect, the capacitive coupling electrodes (31a, 31b, 32a, 32b) have the same shape. And

According to the second and third aspects, the capacitive coupling electrode is more easily assimilated as a part of the shape of the antenna coil by making the capacitive coupling electrode long in the longitudinal direction of the base sheet. There is an effect of becoming.

  According to a fourth aspect of the IC module mounting medium (1) of the present invention, in any one of the first to third aspects, a set of adjustment electrodes having a predetermined shape that serves as a resonance frequency adjustment capacitor (C3). (33a, 33b) are provided at opposite positions on the front and back of the base sheet, and the adjustment electrode (33a) on the base sheet surface side of the set of adjustment electrodes is connected to the surface wiring (43), The adjustment electrode (33b) on the back surface side of the base material sheet is connected to the back surface wiring (44).

  According to a fifth aspect of the IC module mounting medium (1) of the present invention, in the fourth aspect, the capacitive coupling electrode and the adjustment electrode are formed of an integrated electrode pattern. .

  According to the fourth and fifth aspects, the resonance frequency adjusting electrodes (33a, 33b) functioning as the resonance frequency adjusting capacitor (C3) and the capacitive coupling electrode (functioning as the capacitive coupling capacitor (C1)) ( 31a, 31b) can be realized with one electrode.

  According to a sixth aspect of the IC card (2) of the present invention, IC card core sheets (50a, 50b) are laminated on the front and back of the IC module mounting medium (1) of any one of the first to fifth aspects. It is characterized by that.

According to the IC module mounting medium and the IC card of the present invention, the antenna coil pattern extends to the region near the outermost periphery of the base sheet, so that the effective area of the antenna coil is increased and the radiation resistance as an antenna is reduced. is there.

  According to the IC module mounting medium and the IC card of the present invention, there is an effect that the discomfort on the appearance caused by the presence of the capacitive coupling electrode is reduced.

It is a conceptual diagram which shows 1st Embodiment of the IC module mounting medium concerning this invention. It is AA 'arrow sectional drawing of FIG. It is a conceptual diagram which shows 2nd Embodiment of the IC module mounting medium concerning this invention. It is a conceptual diagram which shows 3rd Embodiment of the IC module mounting medium concerning this invention. It is an equivalent circuit diagram of the IC module mounting medium according to the present invention. It is sectional drawing which shows an example of embodiment of the IC card concerning this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment according to IC module mounting medium)
FIG. 1 is a conceptual diagram showing a first embodiment of an IC module mounting medium according to the present invention.
2 is a cross-sectional view taken along the line AA ′ of FIG.
In each embodiment of the present invention, for convenience, the surface on which the IC module is provided is referred to as the front surface or the front surface side, and the opposite surface is referred to as the back surface or the back surface side.
The first embodiment includes an IC module 11 and an antenna coil 20 at predetermined positions on one surface of a rectangular base material sheet 10 made of a dielectric material and corresponding to a card shape as shown in FIG. Two sets of capacitive coupling electrodes are provided at opposite positions on the front and back of the base sheet.

One of the two sets is a set of a capacitive coupling electrode 31a and a capacitive coupling electrode 31b formed on the spiral side of the antenna coil 20 and constitutes a coupling capacitor C1.
The other of the two sets is a set of a capacitive coupling electrode 32a and a capacitive coupling electrode 32b formed outside the spiral of the antenna coil 20, and constitutes a coupling capacitor C2.
The capacitive coupling electrodes 31 b and 32 b on the back side of the base sheet are connected by a back side wiring 45. One of the capacitive coupling electrodes 31a on the surface side of the base sheet, one antenna terminal T1 of the IC module 11, the other 32a of the capacitive coupling electrode, one end of the antenna coil 20, and the other end of the antenna coil 20 and the The other antenna terminal T2 of the IC module is connected by surface wirings 41 and 42, respectively.
Further, of the two sets of capacitive coupling electrodes, one of the capacitive coupling electrodes 32a and 32b is provided at the corner of the base sheet, and is an extension of the outermost peripheral pattern of the capacitive coupling electrodes 32a and 32b. The wires are arranged so as to be aligned with the outermost peripheral pattern of the antenna coil 20.

  As described above, according to the IC module mounting medium of the first embodiment, there is no useless area because no blank is generated near the outermost periphery of the base sheet, and the pattern of the antenna coil extends to the area near the outermost periphery of the IC card. It becomes a spreading structure.

  Therefore, the outermost peripheral side on the base material sheet having a card shape can be used as effectively as an area for forming the antenna coil, and the effective area of the antenna is substantially increased. As a result, the radiation resistance of the antenna coil is reduced. .

(Second Embodiment of IC Module Mounting Medium)
FIG. 3 is a conceptual diagram showing a second embodiment of the IC module mounting medium according to the present invention.
In the second embodiment, the shape of the capacitive coupling electrodes 32a and 32b provided at the corners of the base sheet is made long in the long side direction of the base sheet 10 in the first embodiment. .

  The shape of the set of capacitive coupling electrodes 31a and 31b may be arbitrary as long as the required capacitor capacity is obtained, but the capacitive coupling electrodes 31a and 31b on the center side of the spiral of the antenna coil 20 as shown in FIG. By making the set long in the long side direction, the external appearance of the capacitive coupling electrode is further reduced.

  Further, in addition to the above-described embodiment, the shape of the capacitive coupling electrodes 31a and 31b may be the same as that of the capacitive coupling electrodes 32a and 32b as shown in FIG.

(Third embodiment of the IC module mounting medium)
4A and 4B are conceptual diagrams showing a third embodiment of the IC module mounting medium according to the present invention.

In FIG. 4A, a set of electrodes 33a and 33b having a predetermined shape for forming a resonance frequency adjusting capacitor C3 is provided at opposite positions on the front and back of the substrate sheet. The adjustment electrode 33 a on the front surface side of the material sheet 10 is connected to the capacitive coupling electrode 31 a on the front surface side via the surface wiring 43, and the adjustment electrode 33 b on the back surface side of the base sheet 10 is connected to the back surface via the back surface wiring 44. The form connected to the capacitive coupling electrode 32b on the side is shown. Other configurations are the same as those of the first embodiment.

A typical shape of the resonance frequency adjusting electrode may be a comb shape having a constricted portion for cutting.

  Furthermore, in FIG. 4 (a), the capacitive coupling electrode 31a and the adjustment electrode 33a on the front side of the base sheet and the capacitive coupling electrode 31b and the adjustment electrode 33b on the back side of the base sheet may be integrated. .

  FIG. 5A is an equivalent circuit diagram of an IC module mounting medium corresponding to the configuration of FIG. In the figure, C1 and C2 are coupling capacitors, C3 is a resonance frequency adjusting capacitor, and L is an antenna coil.

  In FIG. 4B, a set of adjustment electrodes 33a and 33b having a predetermined shape for the capacitor C3 for adjusting the resonance frequency is provided at opposite positions on the front and back of the base material sheet. The adjustment electrode 33a on the front surface side of the material sheet 10 is connected to the antenna terminal T2 of the IC module provided on the front surface side via the surface wirings 43 and 42, and the adjustment electrode 33b on the back surface side of the base sheet 10 is connected to the back surface. A form in which the back surface side capacitive coupling electrode 32b is connected via the wiring 44 is shown. Other configurations are the same as those of the first embodiment.

  FIG. 5B is an equivalent circuit diagram of the IC module mounting medium corresponding to the configuration of FIG. In the figure, C1 and C2 are coupling capacitors, C3 is a resonance frequency adjusting capacitor, and L is an antenna coil.

(Embodiment related to IC card)
6A and 6B are cross-sectional views showing an example of an embodiment of an IC card.
By stacking IC card core sheets 50a and 50b on the front and back of the IC module mounting medium 1 shown in each of the above embodiments, and applying heat plates (not shown) on the front and back, and heat-pressing from the direction of arrow P The IC card core sheets 50a and 50b are heat-sealed on the front and back of the IC module mounting medium 1 to obtain an IC card.

Example 1
In the IC module mounting medium 1 having the configuration shown in FIG. 1, a capacitive coupling electrode having the following configuration was formed.
Size of electrodes for capacitive coupling electrodes 31a and 31b: 20 mm × 10 mm
Capacity of capacitive coupling electrodes 32a and 32b: 40 mm × 5 mm
Base sheet material: PET (polyethylene-terephthalate)
Base sheet thickness: 35 μm
Core sheet material (same on both sides): PET
Core sheet thickness (same on both sides): 250 μm
As a result, the capacitances of the capacitors C1 and C2 were measured values of about 200 pF.
The theoretical value when the relative dielectric constant of PET is 3.2 (10 MHz) is about 162 pF.
As a result of operating at a carrier frequency of 13.56 MHz in the state of being an IC card, it operated well.

(Example 2)
In the IC module mounting medium 1 having the configuration shown in FIG. 2, capacitive coupling electrodes having the following configuration were formed. The material and thickness of the base sheet and the core sheet are the same as in Example 1.
Capacitance coupling electrodes 31a and 31b: 40 mm × 5 mm
Capacity of capacitive coupling electrodes 32a and 32b: 40 mm × 5 mm
The material and thickness of the base sheet and the core sheet are the same as in Example 1.
As a result, the capacitance of the capacitor C1 was about 200 pF in actual measurement.
As a result of operating at a carrier frequency of 13.56 MHz in the state of being an IC card, it operated well.

(Example 3)
The configuration of the IC module mounting medium 1 configured as shown in FIG. 4a is the same as that of the first embodiment except that resonance adjusting electrodes 33a and 33b (adjusting capacitors C3) are added.
As a result, as a result of the IC card being operated at a carrier frequency of 13.56 MHz, the adjustment capacitor C3 in FIG. 5A is cut by cutting the constricted portion of one of the adjustment electrodes 33a and 33b. It was confirmed that the capacitor capacity corresponding to can be adjusted, and it operated well.

Example 4
The configuration of the IC module mounting medium 1 having the configuration shown in FIG. 4B is the same as that of the first embodiment except that resonance adjusting electrodes 33a and 33b (adjusting capacitors C3) are added.
As a result, as a result of the IC card being operated at a carrier frequency of 13.56 MHz, the adjustment capacitor C3 in FIG. 5B is cut by cutting the constricted portion of one of the adjustment electrodes 33a and 33b. It was confirmed that the capacitor capacity corresponding to can be adjusted, and it operated well.

(Modification)
The present invention is not limited to the embodiments described above, and various modifications are possible, and these are also within the equivalent scope of the present invention. Examples include the following.

(1) As an example of the base material sheet, an example in which general PET is used for an IC card is shown. However, the material of the base material sheet is not limited to PET. For example, polyvinyl chloride, polycarbonate Etc. In particular, in order to increase the capacitance of the coupling capacitor, a base sheet made of a material having a large relative dielectric constant is preferable.
Although the example in the case where the thickness of the base sheet is also 35 μm, which is general for IC cards, has been shown, in order to increase the capacitance of the coupling capacitor, it is necessary to make it thin as long as the strength as the base sheet can be maintained. preferable.

(2) Although the example in which the IC module and the antenna coil are provided only on one surface of the base sheet is shown, the IC module and the antenna coil may be provided on the opposite surface.

(3) Although the example in which the IC module and the antenna coil are provided only on one surface of the base sheet is shown, the IC module and the antenna coil may be provided on both the front and back surfaces.

(4) Although an example of only the non-contact method has been described, an IC module having both functions of a non-contact method and a contact method may be mounted.

(5) Although an example in which an IC card is formed by sandwiching the front and back of an IC module mounting medium with a core sheet for an IC card has been shown, the IC module mounting medium is attached to, for example, a film or a paper medium, or a film or a paper medium is used. It is good also as what is called an IC tag by inserting | pinching.

The present invention is applicable to a dual type IC card having both a contact type and a non-contact type in addition to a non-contact IC card.
Furthermore, the present invention can also be used for IC tags.

DESCRIPTION OF SYMBOLS 1 ... IC module mounting medium 2 ... IC card 10 ... Base material sheet 11 ... IC module 20 ... .... Antenna coils 31a, 32a ... Capacitive coupling electrodes (for surface)
31b, 32b ... Capacitive coupling electrode (for back surface)
33a ············· Resonance frequency adjustment electrode (for surface)
33b ··········· Resonance frequency adjustment electrode (for back side)
41, 42, 43 ··· Surface wiring 44, 45 ··· Back wiring 50a, 50b ··· Core sheets T1, T2 ··· Antenna terminals C1, C2 · · · Capacitance coupling capacitor C3 ... Resonance frequency adjustment capacitors

Claims (6)

In an IC module mounting medium comprising an IC module and an antenna coil on at least one surface of a rectangular base material sheet made of a dielectric material,
Two sets of capacitive coupling electrodes are provided at opposite positions on the front and back of the base sheet,
The capacitive coupling electrodes on the back side of the base sheet are connected by back wiring,
One of the capacitive coupling electrodes on the surface side of the base sheet and one antenna terminal of the IC module, the other of the capacitive coupling electrodes and one end of the antenna coil, and the other end of the antenna coil and the other antenna of the IC module Terminals are connected to each other by surface wiring,
One of the two sets of capacitive coupling electrodes is provided at the corner of the base sheet, and is arranged so that the extension line of the outermost peripheral pattern of the capacitive coupling electrode is aligned with the outermost peripheral pattern of the antenna coil. IC module mounting medium characterized by the above.   The IC module mounting medium according to claim 1, wherein the capacitive coupling electrode provided at the corner of the base sheet has a shape that is long in the long side direction of the base sheet.   3. The IC module mounting medium according to claim 1, wherein the capacitive coupling electrodes have the same shape.   A set of adjustment electrodes having a predetermined shape that serves as a capacitor for adjusting the resonance frequency is provided at opposite positions on the front and back of the base sheet, and the adjustment electrode on the surface side of the base sheet is the surface of the set of adjustment electrodes. The IC module mounting medium according to any one of claims 1 to 3, wherein the adjustment electrode on the back side of the base material sheet is connected to the wiring, and is connected to the back surface wiring.   5. The IC module mounting medium according to claim 4, comprising an electrode pattern in which the capacitive coupling electrode and the adjustment electrode are integrated. 6. An IC card, wherein an IC card core sheet is laminated on the front and back of the IC module mounting medium according to claim 1.

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