JP2011159859A - Method of manufacturing electronic component, and electronic component - Google Patents

Abstract

An electronic component manufacturing method for connecting a support and an adherend using a conductive connection material having a laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil. Provides a method for producing an electronic component in which voids are unlikely to occur in the cured product of the resin layer.
A first terminal of a support 10 and a second terminal of an adherend 20 are joined using solder or tin to electrically connect the support and the adherend. A method of manufacturing an electronic component, comprising a laminated structure comprising a curable resin composition and a metal foil selected from solder foil or tin foil between the first terminal and the second terminal to be joined A disposing step of disposing the conductive connecting material, a heating step of heating the conductive connecting material at a temperature that is equal to or higher than the melting point of the metal foil and does not complete the curing of the curable resin composition, and the pressurized fluid 7 A pressure curing step of curing the curable resin composition while applying pressure is sequentially performed.
[Selection] Figure 5

Description

  The present invention relates to an electronic component manufacturing method and an electronic component.

  In recent years, with the demand for higher functionality and miniaturization of electronic devices, the pitch between connection terminals in electronic materials is becoming increasingly narrow. Along with this, the connection between terminals in a fine wiring circuit has also been advanced. As a connection method between terminals, for example, flip chip connection in which a large number of terminals are connected together using an anisotropic conductive adhesive or an anisotropic conductive film when an IC chip is electrically connected to a circuit board. Technology is known. An anisotropic conductive adhesive or anisotropic conductive film is a film or paste in which conductive particles are dispersed in an adhesive mainly composed of a thermosetting resin (for example, JP-A-61-276873). Patent Document 1) and Japanese Patent Application Laid-Open No. 2004-260131 (Patent Document 2)). By arranging this between the electronic members to be connected and thermocompression bonding, a large number of opposing terminals can be connected together, and insulation between adjacent terminals is ensured by the resin in the adhesive. Make it possible.

  However, it is very difficult to control the aggregation of the conductive particles. (1) The conductive particles and the terminals, or the conductive particles are not sufficiently in contact with each other, and a part between the opposing terminals is not conductive. (2) In some cases, conductive particles remain in the resin (insulating region) other than between the opposing terminals (conducting region) to cause leakage current, and insulation between adjacent terminals cannot be sufficiently secured. It was. For this reason, it is difficult for conventional anisotropic conductive adhesives and anisotropic conductive films to cope with further narrow pitches between terminals.

JP-A 61-276873 JP 2004-260131 A

Under such circumstances, there is a need to provide a conductive connection material that makes it possible to obtain good electrical connection between connection terminals and high insulation reliability between adjacent terminals. Furthermore, after connecting the terminals that are opposite using an anisotropic conductive adhesive or anisotropic conductive film, when the resin is cured, voids (voids) are formed in the cured product of the cured curable resin composition. ) Occurred.
As a result of intensive studies to solve the problems in the prior art, the present inventors can easily agglomerate solder or tin between terminals by using solder foil or tin foil instead of conductive particles. Thus, it was found that solder or tin can be suppressed from remaining in the resin. Furthermore, by curing the curable resin composition while applying pressure with a pressurized fluid, it has been found that voids are hardly generated in the cured product, and the present invention has been completed.

Such an object is achieved by the present invention described in the following (1) to (11).
(1) An electronic component that joins the first terminal of the support and the second terminal of the adherend using solder or tin to electrically connect the support and the adherend. A laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil between the first terminal and the second terminal to be joined. An arrangement step of arranging the conductive connecting material, a heating step of heating the conductive connecting material at a temperature that is equal to or higher than the melting point of the metal foil and does not complete the curing of the curable resin composition, and applying a pressurized fluid. A pressure curing step of curing the curable resin composition while pressing, in order, a method for producing an electronic component,
(2) An electronic component that joins the first terminal of the support and the second terminal of the adherend using solder or tin to electrically connect the support and the adherend. A laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil between the first terminal and the second terminal to be joined. An arrangement step of arranging the conductive connection material having, a heating and pressure curing step of simultaneously heating the conductive connection material and curing the curable resin composition while being pressurized with a pressurized fluid are sequentially performed. A method of manufacturing an electronic component characterized by
(3) The method for manufacturing an electronic component according to (1) or (2), wherein the pressurized fluid is a gas,
(4) The method of manufacturing an electronic component according to any one of (1) to (3), wherein the pressurized fluid is air or nitrogen.
(5) The object to be treated is placed in a pressure vessel, and the object to be treated is heated while being pressurized with the pressurized fluid, whereby the pressure curing step or the heating and pressure curing is performed. The method for manufacturing an electronic component according to any one of (1) to (4), wherein a process is performed,
(6) In the pressure curing step or the heating and pressure curing step, the pressure of the pressurized fluid is 0.1 to 10 MPa, any one of (1) to (5) A method for manufacturing the electronic component according to claim 1,
(7) The method for producing an electronic component according to any one of (1) to (6), wherein the curable resin composition contains a compound having a flux function.
(8) The method for producing an electronic component according to (7), wherein the compound having the flux function has a phenolic hydroxyl group and / or a carboxyl group (9) The conductive connecting material is a curable resin composition layer / metal foil. The manufacturing method of the electronic component of any one of (1)-(8) including the laminated structure which consists of a layer / curable resin composition layer,
(10) The method for manufacturing an electronic component according to any one of (1) to (8), wherein the conductive connection material includes a laminated structure including a curable resin composition layer / a metal foil layer.
(11) An electronic component manufactured by the manufacturing method according to any one of (1) to (10).

  According to the present invention, by using a solder foil or a tin foil instead of the conductive particles as the conductive connection material, the solder or tin can be easily aggregated between the terminals, and the solder or tin is contained in the curable resin composition. Provided are an electronic component manufacturing method and an electronic component that can be suppressed from remaining, and are less likely to generate voids in the cured product by curing the curable resin composition while being pressurized with a pressurized fluid. be able to.

It is sectional drawing which shows an example of the electronic component manufactured by the manufacturing method of the electronic component of this invention. In the connection method between terminals of this invention, it is sectional drawing which shows roughly an example of the state of a support body, a to-be-adhered body, and a conductive connection material after arrange | positioning a conductive connection material between terminals. In the connection method between terminals of this invention, it is sectional drawing which shows roughly an example of the state of a support body, a to-be-adhered body, and a conductive connection material after arrange | positioning a conductive connection material between terminals. Sectional drawing which shows schematically an example of the state of a support body, a to-be-adhered body, an electroconductive area | region, and an insulating area | region after heating and hardening the electrically conductive connection material arrange | positioned between terminals in the connection method between the terminals of this invention. It is. It is typical sectional drawing which shows the form example of the manufacturing method of the electronic component of 1st Embodiment of this invention. It is typical sectional drawing which shows the form example of the manufacturing method of the electronic component of 2nd Embodiment of this invention. It is a plane schematic diagram which shows an example of the shape of a metal foil layer.

  The method for producing an electronic component of the present invention includes a step of curing a curable resin composition for filling a gap between a support and an adherend while being pressurized with a pressurized fluid. Depending on the time of pressure curing and electrical connection between the support and the adherend, there are the following embodiments.

  In the method for manufacturing an electronic component according to the first aspect of the present invention, the first terminal of the support and the second terminal of the adherend are joined using solder or tin, and the support and the A method of manufacturing an electronic component for electrically connecting an adherend, comprising a curable resin composition and a solder foil or a tin foil between the first terminal and the second terminal to be joined. An arrangement step of arranging a conductive connection material having a laminated structure composed of a selected metal foil, and the conductive connection material at a temperature not lower than the melting point of the metal foil and at which the curing of the curable resin composition is not completed. It is the manufacturing method of the electronic component which performs in order the heating process which heats, and the pressurization hardening process which hardens the said curable resin composition, pressurizing with a pressurized fluid.

  In the method for manufacturing an electronic component according to the second aspect of the present invention, the first terminal of the support and the second terminal of the adherend are joined using solder or tin, and the support and the A method of manufacturing an electronic component for electrically connecting an adherend, comprising a curable resin composition and a solder foil or a tin foil between the first terminal and the second terminal to be joined. An arrangement step of arranging a conductive connecting material having a laminated structure composed of a selected metal foil, and heating of the conductive connecting material and curing of the curable resin composition are performed simultaneously while being pressurized with a pressurized fluid. It is the manufacturing method of the electronic component which performs a heating and pressure curing process in order.

  Hereinafter, a method for manufacturing an electronic component and an electronic component according to the present invention will be described in detail based on embodiments shown in the accompanying drawings.

First, prior to describing the method for manufacturing an electronic component of the present invention, an electronic component manufactured by the method for manufacturing an electronic component of the present invention will be described.
FIG. 1 is a longitudinal sectional view showing an example of an electronic component manufactured by the method of manufacturing an electronic component of the present invention. In the following description, the upper side in FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.
An electronic component 1 shown in FIG. 1 includes an adherend (semiconductor chip) 20, a support (substrate) 10 that supports the adherend 20, and a plurality of conductive bumps (terminals) 70. Yes.
The support 10 is an insulating substrate and is made of various resin materials such as polyimide, epoxy, cyanate, bismaleimide triazine (BT resin). The shape of the support 10 in plan view is usually a square such as a square or a rectangle.
On the upper surface (one surface) of the support 10, for example, a terminal 11 made of a conductive metal material such as copper is provided in a predetermined shape.
Further, the support 10 has a plurality of vias (through holes: through holes) (not shown) penetrating in the thickness direction, and connection terminals are formed in these vias.
Each of the connection terminals formed in the via has one end (upper end) electrically connected to a part of the terminal 11 and the other end (lower end) protruding from the lower surface (the other surface) of the support 10. The bumps 70 are connected.
The bump 70 has a substantially spherical shape (Ball shape), and has a configuration in which a part (upper side) of the bump 70 is surrounded by the reinforcing layer 71 formed on the lower surface of the support 10.
A wiring pattern 40 is formed on the support 10. A terminal 21 included in the adherend 20 is electrically connected to the wiring pattern 40 via a connection portion 81.
Further, the gap between the adherend 20 and the support 10 is filled with a sealing material made of various resin materials, and a sealing layer 80 is formed by a cured product of this sealing material. Yes. The sealing layer 80 has a function of improving the bonding strength between the adherend 20 and the support 10 and a function of preventing entry of foreign matter, moisture, and the like into the gap.

The electronic component 1 as shown in FIG. 1 can be manufactured as follows, for example.

Hereinafter, the manufacturing method of the electronic component of this invention is demonstrated.
The method for producing an electronic component of the present invention includes a step of curing a curable resin composition for filling a gap between a support and an adherend while being pressurized with a pressurized fluid. The production method varies depending on the pressure curing and the timing of electrical connection between the support and the adherend.

A method of manufacturing an electronic component in which a first terminal of a support and a second terminal of an adherend are joined using solder or tin to electrically connect the support and the adherend A conductive connection having a laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil between the first terminal and the second terminal to be joined. While placing the material, a heating step of heating the conductive connecting material at a temperature not lower than the melting point of the metal foil and the curing of the curable resin composition, A method of manufacturing an electronic component that sequentially performs a pressure curing step of curing the curable resin composition is a first embodiment,
A method of manufacturing an electronic component in which a first terminal of a support and a second terminal of an adherend are joined using solder or tin to electrically connect the support and the adherend A conductive connection having a laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil between the first terminal and the second terminal to be joined. A second embodiment includes an arrangement step of arranging a material, and a heating and pressure curing step of simultaneously heating the conductive connecting material and curing the curable resin composition while being pressurized with a pressurized fluid, Each form will be described.

<< First Embodiment >>
In the method for manufacturing an electronic component according to the first embodiment of the present invention, a curable resin composition, a solder foil or a tin foil is interposed between a first terminal of a support to be bonded and a second terminal of an adherend. An arrangement step of arranging a conductive connection material having a laminated structure composed of a metal foil selected from the above, and the conductive connection at a temperature that is equal to or higher than the melting point of the metal foil and does not complete the curing of the curable resin composition A heating step of heating the material, and a pressure curing step of curing the curable resin composition while being pressurized with a pressurized fluid.

Hereinafter, each step will be described in detail.
(1-a) Arrangement Step First, as shown in FIG. 2, the support 10 provided with the terminal 11 and the adherend 20 provided with the terminal 21 are arranged so that the terminal 11 and the terminal 21 face each other. The conductive connection material 30 which consists of the metal foil 110 and the curable resin composition 120 provided on both surfaces of the metal foil 110 is disposed between these terminals. At this time, the conductive connection material 30 uses an apparatus such as a roll laminator or a press, and as shown in FIGS. (3-a) and (3-b), one side of the support 10 or the adherend 20 in advance, or As shown to a figure (3-c), you may be thermocompression bonded to both the support body 10 and the to-be-adhered body 20. FIG. Further, the surfaces of the terminals 11 and 21 may be subjected to treatments such as cleaning, polishing, plating, and surface activation as necessary in order to improve electrical connection.

(1-b) Heating step In the heating step, the conductive connection material arranged between the terminals in the arrangement step is heated at a temperature equal to or higher than the melting point of the metal foil. The heating temperature may be equal to or higher than the melting point of the metal foil. For example, by adjusting the heating time such as shortening the heating time, the range in which the solder or tin can move in the curable resin composition, that is, the “curable resin composition” The upper limit is not particularly limited as long as it does not complete the curing of the object. The heating temperature is preferably 5 ° C. or more higher than the melting point of the metal foil, more preferably 10 ° C. or more, more preferably 20 ° C. or more, and particularly preferably 30 ° C. or more.

  The heating temperature can be appropriately selected depending on the metal foil to be used and the composition of the curable resin composition, but is preferably 100 ° C. or higher, more preferably 130 ° C. or higher, particularly preferably 140 ° C. or higher, and 150 ° C. or higher. Most preferred. In order to prevent thermal degradation of the substrate or the like to be connected, the heating temperature is preferably 260 ° C. or lower, more preferably 250 ° C. or lower, and particularly preferably 240 ° C. or lower.

  When the conductive connecting material is heated at such a temperature, the metal foil 110 is melted, and the melted solder or tin can move in the curable resin composition 120. When the curable resin composition contains a compound having a flux function, the solder or tin surface oxide film is removed by the reducing action of the compound having the flux function contained in the curable resin composition. This is a state in which the wettability is enhanced, and metal bonding is promoted to easily aggregate between opposing terminals. On the other hand, since the surface oxide films of the terminals 11 and 21 are also removed by the reducing action of the compound having a flux function and the wettability is enhanced, metal bonding with solder or tin is facilitated. As a result, as shown in FIG. 4, a conductive region 130 is formed between the terminals, and the terminals 11 and 21 are electrically connected. On the other hand, the insulating region 140 is formed by filling the periphery of the conductive region with the curable resin composition. As a result, insulation between adjacent terminals is ensured, and a short circuit between adjacent terminals can be prevented.

In the connection method of the present invention, heating may be performed by applying pressure so as to reduce the distance between the opposing terminals. For example, the distance between the terminals facing each other is controlled to be constant by heating and pressurizing the support 10 and the adherend 20 in FIG. It is possible to improve the reliability of electrical connection between the terminals facing each other.
Furthermore, when heating or heating, an ultrasonic wave or an electric field may be applied, or special heating such as laser or electromagnetic induction may be applied.

(1-c) Pressure curing step In the connection method of the present invention, after forming the conductive region 130 and the insulating region 140 in the heating step, the curable resin composition is pressure-cured to insulate the insulating region. 140 is fixed. Thereby, electrical reliability and mechanical connection strength between the terminals can be sufficiently ensured. In particular, in the connection method of the present invention, since a curable resin composition having a high insulation resistance value is used, the insulation of the insulating region can be more sufficiently ensured.

  As shown in FIG. 5, the support body 10 and the adherend 20 that are electrically connected in the heating step (1-b) are installed in a pressurized oven 8, and from the inlet 9 for the pressurized fluid, The curable resin composition is cured by introducing the pressurized fluid 7 and heating the pressurized oven 8 while being pressurized with the pressurized fluid 7. As a result, the mechanical strength of the conductive region 130 or the insulating region 140 can be increased.

  The pressurized fluid according to the pressure curing step (1-c) means a fluid used for pressurization, and is not particularly limited. For example, a gas such as nitrogen gas, argon gas, and air is preferable and inexpensive. In this respect, air or nitrogen is preferable. Moreover, a liquid can also be used as a pressurized fluid which concerns on a pressure hardening process (1-c).

  In the pressure curing step (1-c), the pressure applied when the support 10 and the adherend 20 electrically connected in the heating step (1-b) are pressurized with a pressurized fluid is 0.1. -10 MPa, preferably 0.5-5 MPa. In the pressure curing step (1), the pressure applied when the support 10 and the adherend 20 electrically connected in the heating step (1-b) are pressurized with a pressurized fluid is in the above range. , Voids are less likely to occur in the cured product.

  In the present invention, pressurizing with a pressurized fluid means that the pressure of the atmosphere of the support 10 and the adherend 20 electrically connected in the heating step (1-b) is more than the atmospheric pressure. It refers to increasing only (pressure curing step (1) and heating and pressure curing step (2)).

  In the pressure curing step (1), the heating temperature of the support 10 and the adherend 20 that are electrically connected in the heating step (1-b) may be equal to or higher than the curing temperature of the curable resin composition. The temperature may be appropriately selected and is usually 100 to 250 ° C, preferably 150 to 200 ° C. In the pressure curing step (1), the heating time of the support 10 and the adherend 20 electrically connected in the heating step (1-b) is appropriately selected depending on the type of the curable resin composition. Is usually 0.5 to 3 hours, preferably 1 to 2 hours.

  In the pressure curing step (1-c), as a method of curing the curable resin composition while being pressurized with a pressurized fluid, for example, a processing object to be heated (pressure curing step (1) in a pressure vessel. ), The support 10 and the adherend 20) that are electrically connected in the heating step (1-b) are installed, and then the treatment is performed while introducing and pressurizing the pressurized fluid into the pressure vessel. Method of heating an object, more specifically, an object to be treated is placed in a pressure oven, and the object to be treated is heated in the pressure oven while introducing a gas for pressurization into the pressure oven. The method of doing is mentioned.

  As described above, the electronic component manufacturing method according to the first embodiment of the present invention uses solder or tin for the first terminal of the support and the second terminal of the adherend in the electronic component manufacturing method. As a step of electrically connecting the support and the adherend, the placement step (1-a), the heating step (1-b), and the pressure curing step (1-c) are performed. It is the manufacturing method of the electronic component performed in order.

  Examples of the support 10 and the adherend 20 according to the method for manufacturing an electronic component of the first embodiment of the present invention include combinations shown in Table 1.

<< Second Embodiment >>
In the method for manufacturing an electronic component according to the second embodiment of the present invention, a curable resin composition, a solder foil or a tin foil is provided between a first terminal of a support to be bonded and a second terminal of an adherend. An arrangement step of arranging a conductive connection material having a laminated structure composed of a metal foil selected from the above, and heating of the conductive connection material and curing of the curable resin composition are simultaneously performed while being pressurized with a pressurized fluid Heating and pressure curing step to be performed.
Hereinafter, each step will be described in detail.

(2-a) Arrangement Step Also in the second embodiment of the present invention, in the same manner as in the first embodiment, a conductive connection is made between the first terminal of the support and the second terminal of the adherend. Material can be placed.

(2-b) Heating and pressure curing step The heating and pressure curing step (2-b) according to the electronic component manufacturing method of the second embodiment of the present invention is performed by (2-b1) pressurizing with a pressurized fluid. While the substrate, the adherend, and the conductive connection material are heated at a temperature equal to or higher than the curing temperature of the curable resin composition to cure the curable resin composition, the curable resin is cured during the curing process. In a pressurized atmosphere for curing the resin composition, by heating at a temperature equal to or higher than the melting point of the metal foil, electrical connection between the first terminal and the second terminal, and pressure curing of the curable resin composition Or (2-b2) heating the support, the adherend, and the conductive connection material at a temperature equal to or higher than the melting point of the metal foil while pressurizing with a pressurized fluid. And then heating at a temperature equal to or higher than the curing temperature of the curable resin composition. This is a step of curing the curable resin composition. In the heating and pressure curing step (2-b), the heating temperature for electrical connection between the first terminal and the second terminal is the heating step (1-b) of the first embodiment. It is the same as that of description.

  The pressurized fluid according to the heating and pressure curing step (2-b) is the same as the pressurized fluid according to the pressure curing step (1-c).

  In the heating and pressure curing step (2-b), the applied pressure when pressurizing the support, the adherend and the conductive connecting material with a pressurized fluid is 0.1 to 10 MPa, preferably 0.5 to 5 MPa. is there. In the heating and pressure curing step (2-b), when the pressure applied to the support, the adherend and the conductive connection material with the pressurized fluid is in the above range, voids (voids) are formed in the cured product. Is less likely to occur.

  In the heating and pressure curing step (2-b), when the melting point of the metal foil is equal to or lower than the curing temperature of the curable resin composition, (2-b1) while pressing with a pressurized fluid, While the conductive connecting material is heated at a temperature equal to or higher than the curing temperature of the curable resin composition to cure the curable resin composition, during the curing process, the conductive connection material is added for curing the curable resin composition. By heating at a melting point or higher of the metal foil in a pressurized atmosphere, electrical connection between the first terminal and the second terminal and pressure curing of the curable resin composition are simultaneously performed. In this case, the curable resin composition is cured by heating the support, the adherend, and the curable conductive connecting material at a temperature equal to or higher than the curing temperature of the curable resin composition while being pressurized with a pressurized fluid. The heating temperature at that time may be equal to or higher than the curing temperature of the curable resin composition, and is usually 100 to 250 ° C, preferably 150 to 200 ° C, and the heating time depends on the type of the curable resin composition. Although appropriately selected, it is usually 0.5 to 3 hours, preferably 1 to 2 hours.

Further, when the melting point of the metal foil is higher than the curing temperature of the curable resin composition, (2-b2) the support, the adherend, and the conductive connection material are not less than the melting point of the metal foil while being pressurized with a pressurized fluid. By heating at a temperature, the metal foil is melted, and the molten metal foil is selectively aggregated between the first terminal and the second terminal facing each other, and the first terminal and the second terminal Electrical connection is possible. Next, the curable resin composition is cured by heating at a temperature equal to or higher than the curing temperature of the curable resin composition. In this case, the heating temperature at the time of heating the support, the adherend, and the conductive connection material to perform electrical connection between the first terminal and the second terminal while being pressurized with a pressurized fluid is as described above. This is the same as the description of the heating step (1-b) of the first embodiment. The heating temperature at the time of curing the curable resin composition by heating at a temperature equal to or higher than the curing temperature of the curable resin composition only needs to be equal to or higher than the curing temperature of the curable resin composition, and is usually 100 to 250. The heating time is appropriately selected according to the type of the curable resin composition, but is usually 0.5 to 3 hours, preferably 1 to 2 hours.

  In the heating and pressure curing step (2-b), as a method of curing the curable resin composition at the same time as the electrical connection between the opposing terminals while being pressurized with a pressurized fluid, for example, in FIG. In the course of heating the support 10, the adherend 20 and the conductive connecting material 30 in the heating oven 8 while introducing the pressurized fluid 7 and pressurizing the inside of the heating oven 8, the heating oven 8 A method of applying a load from the top of the adherend 20 with a press machine installed inside is mentioned. Specifically, a press machine is installed in the heating oven 8, and the support 10, the adherend 20 and the conductive connection material 30 are attached to the press machine. Next, the pressurized fluid 7 is introduced to pressurize the pressure oven 8. Then, while pressurizing with the pressurized fluid 7, the temperature in the pressurizing oven 8 is heated at a temperature equal to or higher than the curing temperature of the curable resin composition 120, for example, 180 ° C. A press installed in the heating oven 8 in a 180 ° C. pressurized atmosphere at any time during the curing of the article 120, for example, 10 minutes after the start of heating in the 180 ° C. pressurized atmosphere There is a method in which the temperature of the press surface is set to a temperature equal to or higher than the melting point of the metal foil, for example, 230 ° C., and a solder connection is performed by applying a load from above the adherend 20 for 15 seconds, for example. That is, in the heating and pressure curing step (2-b), the electrical connection between the opposing terminals is performed while being pressurized with a pressurized fluid, and at the same time, the curable resin composition is cured. Somewhere in the process of curing the composition, an electrical connection between opposing terminals can be performed in a heated and pressurized atmosphere.

  In the method for manufacturing an electronic component according to the first aspect of the present invention, the curable resin composition is used while being pressurized with a pressurized fluid in the pressure curing step (1-c) or the heating and pressure curing step (2-b). By curing the product, the voids in the curable resin composition are crushed and the resin is cured, so that voids are not easily generated in the cured product. Further, in the pressure curing step (1-c) or the heating and pressure curing step (2-b), pressure is applied evenly from all directions to the support, the adherend and the conductive connection material by the pressurized fluid. Therefore, the melt of the curable resin composition can be prevented from bleeding out from the gap between the support and the adherend.

Next, the conductive connection material according to the present invention will be described.
The conductive connection material according to the present invention includes a curable resin composition and a metal foil selected from solder foil or tin foil. The form is a laminate having a multilayer structure composed of a curable resin composition layer and a metal foil layer, and each of the curable resin composition layer and the metal foil layer may be a single layer or a plurality of layers. . The laminated structure of the conductive connecting material is not particularly limited, and may be a two-layer structure (curable resin composition layer / metal foil layer) of a curable resin composition layer and a metal foil layer, or a curable resin composition layer or A three-layer structure including a plurality of either or both of the metal foil layers or a multilayer structure having more than that may be used. In addition, when using two or more curable resin composition layers or metal foil layers, the composition of each layer may be the same or different.

  In one embodiment of the conductive connection material according to the present invention, from the viewpoint of reducing the surface oxide film of the metal foil with a compound having a flux function, the upper and lower layers of the metal foil layer are preferably curable resin composition layers. . For example, a three-layer structure (curable resin composition layer / metal foil layer / curable resin composition layer) is preferable. In this case, the thickness of the curable resin composition layer on both sides of the metal foil layer may be the same or different. The thickness of the curable resin composition layer may be appropriately adjusted according to the conductor thickness of the terminal to be connected.

  Hereinafter, each of the curable resin composition and the metal foil constituting the conductive connection material according to the present invention will be described.

(1) Curable resin composition The curable resin composition according to the present invention may be in a liquid or solid form at room temperature. Here, “liquid state at room temperature” means a state having no fixed form at room temperature (25 ° C.). Paste forms are also included in liquid form.

  A curable resin composition is used as the curable resin composition according to the present invention. Examples of the curable resin composition used in the present invention include those that are cured by heating or irradiation with actinic radiation.

  In addition to the curable resin, the curable resin composition used in the present invention includes a film-forming resin, a curing agent, a curing accelerator, a compound having a flux function, a silane coupling agent, and the like as necessary.

(I) Curable resin The curable resin used by this invention will not be specifically limited if normally used as an adhesive component for semiconductor device manufacture. For example, epoxy resin, phenoxy resin, silicone resin, oxetane resin, phenol resin, (meth) acrylate resin, polyester resin (unsaturated polyester resin), diallyl phthalate resin, maleimide resin, polyimide resin (polyimide precursor resin), bismaleimide -Triazine resin etc. are mentioned. In particular, the use of a thermosetting resin containing at least one selected from the group consisting of epoxy resins, (meth) acrylate resins, phenoxy resins, polyester resins, polyimide resins, silicone resins, maleimide resins, and bismaleimide-triazine resins. preferable. Especially, it is preferable to use an epoxy resin from a viewpoint that it is excellent in sclerosis | hardenability and preservability, the heat resistance of a hardened | cured material, moisture resistance, and chemical resistance. These curable resins may be used alone or in combination of two or more.

Content of curable resin can be suitably set according to the form of curable resin composition. For example, when the curable resin composition is liquid, the content of the curable resin is preferably 10% by weight or more, more preferably 15% by weight or more, and more preferably 20% by weight with respect to the total weight of the curable resin composition. The above is more preferable, 25% by weight or more is further more preferable, 30% by weight or more is still more preferable, and 35% by weight or more is particularly preferable. Further, it is preferably less than 100% by weight, more preferably 95% by weight or less, still more preferably 90% by weight or less, still more preferably 75% by weight or less, still more preferably 65% by weight or less, and particularly preferably 55% by weight or less.
When the curable resin composition is solid, the content of the curable resin is preferably 5% by weight or more, more preferably 10% by weight or more, and more preferably 15% by weight with respect to the total weight of the curable resin composition. The above is more preferable, and 20% by weight or more is particularly preferable. Moreover, 90 weight% or less is preferable, 85 weight% or less is more preferable, 80 weight% or less is further more preferable, 75 weight% or less is still more preferable, 65 weight% or less is still more preferable, 55 weight% or less is especially preferable.
When the content of the curable resin is within the above range, the electrical connection strength and the mechanical adhesive strength between the terminals can be sufficiently secured.

  In the present invention, any epoxy resin that is liquid at room temperature and solid at room temperature may be used. An epoxy resin that is liquid at room temperature and an epoxy resin that is solid at room temperature may be used in combination. When the curable resin composition is liquid, it is preferable to use a liquid epoxy resin at room temperature, and when the curable resin composition is solid, use either a liquid or solid epoxy resin. However, when a solid epoxy resin is used, it is preferable to use a film-forming resin in combination.

Preferred examples of the epoxy resin that is liquid at room temperature (25 ° C.) include bisphenol A type epoxy resins and bisphenol F type epoxy resins. A bisphenol A type epoxy resin and a bisphenol F type epoxy resin may be used in combination.
The epoxy equivalent of the epoxy resin that is liquid at room temperature is preferably 150 to 300 g / eq, more preferably 160 to 250 g / eq, and particularly preferably 170 to 220 g / eq. If the epoxy equivalent is less than the above lower limit, the shrinkage of the cured product tends to increase, and warping may occur. On the other hand, when the upper limit is exceeded, when a film-forming resin is used in combination, the reactivity with a film-forming resin, particularly a polyimide resin, tends to decrease.

Examples of solid epoxy resins at room temperature (25 ° C.) include bisphenol A type epoxy resins, bisphenol S type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, glycidyl amine type epoxy resins, and glycidyl ester type epoxies. Resin, trifunctional epoxy resin, tetrafunctional epoxy resin, etc. are mentioned. Among these, solid trifunctional epoxy resin, cresol novolac type epoxy resin and the like are preferable. These epoxy resins may be used alone or in combination of two or more.
The epoxy equivalent of the epoxy resin solid at room temperature is preferably 150 to 3000 g / eq, more preferably 160 to 2500 g / eq, and particularly preferably 170 to 2000 g / eq.
The softening point of the epoxy resin solid at room temperature is preferably 40 to 120 ° C, more preferably 50 to 110 ° C, and particularly preferably 60 to 100 ° C. When the softening point is within the above range, tackiness can be suppressed and handling can be easily performed.

(Ii) Film-forming resin When a solid curable resin composition is used, it is preferable to use the curable resin and the film-forming resin in combination. The film-forming resin used in the present invention is not particularly limited as long as it is soluble in an organic solvent and has film-forming properties alone. Either a thermoplastic resin or a thermosetting resin can be used, and these can be used in combination. Specifically, as the film-forming resin, (meth) acrylic resin, phenoxy resin, polyester resin (saturated polyester resin), polyurethane resin, polyimide resin, polyamideimide resin, siloxane-modified polyimide resin, polybutadiene resin, polypropylene resin, Styrene-butadiene-styrene copolymer, styrene-ethylene-butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene- Acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, polyvinyl acetate, nylon and the like can be mentioned. Among these, (meth) acrylic resins, phenoxy resins, polyester resins, and polyimide resins are preferable. A film-forming resin may be used alone or in combination of two or more.

  In this specification, “(meth) acrylic resin” refers to a polymer of (meth) acrylic acid and its derivatives, or a copolymer of (meth) acrylic acid and its derivatives and other monomers. Means. When expressed as “(meth) acrylic acid” or the like, it means “acrylic acid or methacrylic acid” or the like.

Examples of the (meth) acrylic resin used in the present invention include polyacrylic acid such as polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, and poly-2-ethylhexyl acrylate. Esters, polymethacrylates such as polymethyl methacrylate, polyethyl methacrylate, polybutyl methacrylate, polyacrylonitrile, polymethacrylonitrile, polyacrylamide, butyl acrylate-ethyl acrylate-acrylonitrile copolymer, acrylonitrile-butadiene Copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer, methacrylate Acid methyl-acrylonitrile copolymer, methyl methacrylate-α-methylstyrene copolymer, butyl acrylate-ethyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate-methacrylic acid copolymer, butyl acrylate-ethyl acrylate- Acrylonitrile-2-hydroxyethyl methacrylate-acrylic acid copolymer, butyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate copolymer, butyl acrylate-acrylonitrile-acrylic acid copolymer, butyl acrylate-ethyl acrylate-acrylonitrile Examples thereof include a copolymer and an ethyl acrylate-acrylonitrile-N, N-dimethylacrylamide copolymer. Of these, butyl acrylate-ethyl acrylate-acrylonitrile copolymer and ethyl acrylate-acrylonitrile-N, N-dimethylacrylamide are preferable. These (meth) acrylic resins may be used alone or in combination of two or more.

  Although the skeleton of the phenoxy resin used in the present invention is not particularly limited, bisphenol A type, bisphenol F type, biphenyl type, and the like are preferable.

  The polyimide resin used in the present invention is not particularly limited as long as the resin has an imide bond in the repeating unit. For example, what is obtained by making diamine and acid dianhydride react, heating the obtained polyamic acid, and carrying out dehydration ring closure is mentioned.

  Examples of the diamine include aromatic diamines such as 3,3′-dimethyl-4,4′diaminodiphenyl, 4,6-dimethyl-m-phenylenediamine, and 2,5-dimethyl-p-phenylenediamine, Examples thereof include siloxane diamines such as 3-bis (3-aminopropyl) -1,1,3,3-tetramethyldisiloxane. A diamine may be used individually by 1 type, or may use 2 or more types together.

  Examples of the acid dianhydride include 3,3,4,4'-biphenyltetracarboxylic acid, pyromellitic dianhydride, 4,4'-oxydiphthalic dianhydride, and the like. An acid dianhydride may be used individually by 1 type, or may use 2 or more types together.

  The polyimide resin may be soluble or insoluble in a solvent, but is preferably a solvent-soluble one because it can be easily varnished when mixed with other components and has excellent handleability. In particular, a siloxane-modified polyimide resin is preferably used because it can be dissolved in various organic solvents.

  The weight average molecular weight of the film-forming resin used in the present invention is preferably 8,000 to 1,000,000, more preferably 8,500 to 950,000, and still more preferably 9,000 to 900,000. When the weight average molecular weight of the film-forming resin is within the above range, the film-forming property can be improved, and the fluidity of the conductive connecting material before curing can be suppressed. The weight average molecular weight of the film-forming resin can be measured by GPC (gel permeation chromatography).

  In the present invention, commercially available products can be used as such film-forming resins. Furthermore, in a range that does not impair the effects of the present invention, a film-forming resin may be used in which various additives such as a plasticizer, a stabilizer, an inorganic filler, an antistatic agent and a pigment are blended.

In the conductive connection material used in the present invention, the content of the film-forming resin can be appropriately set according to the form of the curable resin composition to be used.
For example, in the case of a solid curable resin composition, the content of the film-forming resin is preferably 5% by weight or more with respect to the total weight of the curable resin composition, and is 10% by weight or more. It is more preferable that the content is 15% by weight or more. Further, it is preferably 50% by weight or less, more preferably 45% by weight or less, and particularly preferably 40% by weight or less. When the content of the film-forming resin is within the above range, the fluidity of the curable resin composition before melting can be suppressed, and the conductive connecting material can be easily handled.

(Iii) Curing Agent Preferred examples of the curing agent used in the present invention include phenols, acid anhydrides, and amine compounds. A hardening | curing agent can be suitably selected according to the kind etc. of curable resin. For example, when an epoxy resin is used as the curable resin, good reactivity with the epoxy resin, low dimensional change during curing, and appropriate physical properties after curing (for example, heat resistance, moisture resistance, etc.) are obtained. Phenols are preferably used as the curing agent, and bifunctional or higher functional phenols are more preferable in terms of excellent physical properties after curing of the curable resin. Moreover, such a hardening | curing agent may be used individually by 1 type, and may use 2 or more types together.

  Examples of the phenols include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, trisphenol, tetrakisphenol, phenol novolac resin, and cresol novolac resin. Of these, phenol novolac resins and cresol novolac resins are preferable because they have good reactivity with epoxy resins and excellent physical properties after curing.

When the content of the curing agent has a functional group that functions as a curing agent when the compound having a flux function described below and the type of the curable resin or the curing agent to be used have a functional group, the content should be selected as appropriate. Can do.
For example, when an epoxy resin is used as the curable resin, the content of the curing agent is preferably 0.1 to 50% by weight and more preferably 0.2 to 40% by weight with respect to the total weight of the curable resin composition. 0.5 to 30% by weight is preferable. When the content of the curing agent is within the above range, the electrical connection strength between the terminals and the mechanical adhesive strength can be sufficiently secured.

(Iv) Curing accelerator The curing accelerator used in the present invention is imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole. 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl- 4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate 2 , 4-Diamino-6- [2'-methylimidazolyl (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl (1') ] Isocyanuric acid adduct of 2-ethyl-s-triazine, isocyanuric acid adduct of 2-phenylimidazole, isocyanuric acid adduct of 2-methylimidazole, 2-phenyl-4,5-dihydroxydimethylimidazole, 2-phenyl-4 -Imidazole compounds such as methyl-5-hydroxymethylimidazole.

Content of a hardening accelerator can be suitably set according to the kind of hardening accelerator to be used.
For example, when an imidazole compound is used, the content of the imidazole compound is preferably 0.001% by weight or more, more preferably 0.003% by weight or more, based on the total weight of the curable resin composition. 0.005% by weight or more is particularly preferable. Moreover, 1.0 weight% or less is preferable, 0.7 weight% or less is more preferable, and 0.5 weight% or less is especially preferable. When the content of the imidazole compound is less than the lower limit, the effect as a curing accelerator is not sufficiently exhibited, and the curable resin composition may not be sufficiently cured. On the other hand, when the content of the imidazole compound exceeds the above upper limit, the solder or tin does not move sufficiently to the terminal surface before the curing of the curable resin composition is completed, and the solder or tin remains in the insulating region and is insulative. May not be sufficient. In addition, the storage stability of the conductive connection material may be reduced.

(V) Compound having flux function The curable resin composition according to the present invention preferably contains a compound having a flux function, and can reduce a metal oxide film such as a surface oxide film of a terminal and a metal foil, Aggregation of metal foil between terminals can be facilitated. For example, the compound having a flux function is preferably a compound having a phenolic hydroxyl group and / or a carboxyl group. Examples of the compound having a phenolic hydroxyl group include phenol, o-cresol, 2,6-xylenol, p-cresol, m-cresol, o-ethylphenol, 2,4-xylenol, 2,5-xylenol, m- Ethylphenol, 2,3-xylenol, meditol, 3,5-xylenol, p-tert-butylphenol, catechol, p-tert-amylphenol, resorcinol, p-octylphenol, p-phenylphenol, bisphenol F, bisphenol AF, biphenol Monomers containing phenolic hydroxyl groups such as diallyl bisphenol F, diallyl bisphenol A, trisphenol, tetrakisphenol, phenol novolac resins, o-cresol novolac resins, bisphenols Nord F novolak resins, resins containing a phenolic hydroxyl group such as bisphenol A novolac resin.

  Examples of the compound having a carboxyl group include an aliphatic acid anhydride, an alicyclic acid anhydride, an aromatic acid anhydride, an aliphatic carboxylic acid, and an aromatic carboxylic acid. Examples of the aliphatic acid anhydride include succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, and polysebacic acid anhydride. Examples of the alicyclic acid anhydride include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic acid. An anhydride etc. are mentioned. Examples of the aromatic acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitate, and glycerol tris trimellitate.

Examples of the aliphatic carboxylic acid include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, acrylic acid, methacrylic acid, crotonic acid, Examples include oleic acid, fumaric acid, maleic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, sebacic acid, dodecanedioic acid, and pimelic acid. Among them, the following formula (1):
_{HOOC- (CH 2) n -COOH (} 1)
(In Formula (1), n is an integer of 1-20.)
Are preferable, and adipic acid, sebacic acid, and dodecanedioic acid are more preferable.

［式中、Ｒ^１〜Ｒ^５は、それぞれ独立して、１価の有機基であり、Ｒ^１〜Ｒ^５の少なくとも一つは水酸基である。］

［式中、Ｒ^６〜Ｒ^２０は、それぞれ独立して、１価の有機基であり、Ｒ^６〜Ｒ^２０の少なくとも一つは水酸基又はカルボキシル基である。］ The structure of the aromatic carboxylic acid is not particularly limited, but a compound represented by the following formula (2) or (3) is preferable.

[Wherein, R ^{1 to} R ⁵ are each independently a monovalent organic group, and at least one of R ^{1 to} R ⁵ is a hydroxyl group. ]

[Wherein, R ^{6 to} R ²⁰ are each independently a monovalent organic group, and at least one of R ^{6 to} R ²⁰ is a hydroxyl group or a carboxyl group. ]

  Aromatic carboxylic acids include benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, hemimellitic acid, trimellitic acid, trimesic acid, merophanic acid, platnic acid, pyromellitic acid, meritic acid, xylylic acid, hemelitonic acid, mesitylene Acid, prenylic acid, toluic acid, cinnamic acid, salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid), 4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,5-2 Examples include naphthoic acid derivatives such as dihydroxy-2-naphthoic acid; phenolphthaline; diphenolic acid and the like.

Among these, in the present invention, a compound that not only has a flux function but also acts as a curing agent for the curable resin is preferable. That is, as the compound having a flux function used in the present invention, a compound having a functional group capable of reacting with a curable resin and exhibiting an action of reducing a metal surface oxide film such as a metal foil and a terminal is used. preferable. The functional group is appropriately selected depending on the type of curable resin. For example, when an epoxy resin is used as the curable resin, the functional group is preferably a functional group capable of reacting with an epoxy group such as a carboxyl group, a hydroxyl group, and an amino group. A compound having a flux function also acts as a curing agent, thereby reducing metal surface oxide films such as metal foils and terminals to increase the wettability of the metal surface, facilitating the formation of conductive regions, After forming the property region, it can be added to the curable resin to increase the elastic modulus or Tg of the resin. In addition, since the compound having a flux function acts as a curing agent, there is an advantage that flux cleaning is not required and the occurrence of ion migration due to the remaining flux component can be suppressed.

The compound having such a flux function preferably has at least one carboxyl group. For example, when an epoxy resin is used as the curable resin, examples of the compound include aliphatic dicarboxylic acids or compounds having a carboxyl group and a phenolic hydroxyl group.
Preferred examples of the aliphatic dicarboxylic acid include compounds in which two carboxyl groups are bonded to an aliphatic hydrocarbon group. The aliphatic hydrocarbon group may be saturated or unsaturated acyclic, or may be saturated or unsaturated cyclic. Further, when the aliphatic hydrocarbon group is acyclic, it may be linear or branched.

  As such aliphatic dicarboxylic acid, the compound whose n is an integer of 1-20 in the said Formula (1) is mentioned preferably. When n in the formula (1) is within the above range, the balance between the flux activity, the outgas at the time of bonding, the elastic modulus after the conductive connecting material is cured, and the glass transition temperature becomes good. In particular, n is preferably 3 or more because an increase in the elastic modulus after curing of the conductive connecting material can be suppressed and the adhesion to the adherend can be improved. In addition, n is preferably 10 or less because it is possible to suppress a decrease in elastic modulus and further improve connection reliability.

  Examples of the aliphatic dicarboxylic acid represented by the formula (1) include glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, and pentadecane. Examples include diacid, octadecanedioic acid, nonadecanedioic acid, and eicosanedioic acid. Among these, adipic acid, suberic acid, sebacic acid and dodencandioic acid are preferable, and sebacic acid is particularly preferable.

  Examples of the compound having a carboxyl group and a phenolic hydroxyl group include salicylic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), and 2,6-dihydroxybenzoic acid. Benzoic acid derivatives such as acid, 3,4-dihydroxybenzoic acid, gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2- Naphthoic acid derivatives such as naphthoic acid; phenolphthaline; diphenolic acid and the like. Of these, phenolphthaline, gentisic acid, 2,4-dihydroxybenzoic acid, and 2,6-dihydroxybenzoic acid are preferable, and phenolphthalin and gentisic acid are particularly preferable.

  A compound having a flux function may be used alone or in combination of two or more. Moreover, since any compound easily absorbs moisture and causes voids, it is preferable to dry the compound having a flux function in advance before use.

Content of the compound which has a flux function can be suitably set according to the form of the curable resin composition to be used.
For example, when the curable resin composition is liquid, the content of the compound having a flux function is preferably 1% by weight or more, more preferably 2% by weight or more, based on the total weight of the curable resin composition. A weight percent or more is particularly preferred. Moreover, 50 weight% or less is preferable, 40 weight% or less is more preferable, 30 weight% or less is further more preferable, and 25 weight% or less is especially preferable.
In the case of a solid curable resin composition, the content of the compound having a flux function is preferably 1% by weight or more, more preferably 2% by weight or more, based on the total weight of the curable resin composition. 3% by weight or more is particularly preferable. Moreover, 50 weight% or less is preferable, 40 weight% or less is more preferable, 30 weight% or less is further more preferable, and 25 weight% or less is especially preferable.
When the content of the compound having the flux function is within the above range, the metal foil and the surface oxide film of the terminal can be removed to such an extent that they can be electrically joined. Furthermore, the elastic modulus or Tg of the resin can be increased by efficiently adding to the resin at the time of curing. Moreover, generation | occurrence | production of the ion migration resulting from the compound which has an unreacted flux function can be suppressed.

(Vi) Silane coupling agent Examples of the silane coupling agent used in the present invention include an epoxy silane coupling agent and an aromatic-containing aminosilane coupling agent. By adding the silane coupling agent, the adhesion between the bonding member and the conductive connecting material can be enhanced. A silane coupling agent may be used individually by 1 type, and may use 2 or more types together.

  Content of a silane coupling agent can be suitably selected according to types, such as a joining member and curable resin. For example, the content of the silane coupling agent is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and particularly preferably 0.1% by weight or more with respect to the total weight of the curable resin composition. It is preferably 2% by weight or less, more preferably 1.5% by weight or less, and particularly preferably 1% by weight or less.

  In the curable resin composition used in the present invention, a plasticizer, a stabilizer, a tackifier, a lubricant, a filler, an antistatic agent, a pigment, and the like may be blended as long as the effects of the present invention are not impaired.

  In the present invention, the curable resin composition can be prepared by mixing and dispersing the above components. The mixing method and dispersion method of each component are not specifically limited, It can mix and disperse | distribute by a conventionally well-known method.

  Moreover, in this invention, you may mix the said each component in a solvent or under absence of solvent, and may prepare a liquid curable resin composition. The solvent used at this time is not particularly limited as long as it is inert to each component. For example, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diisobutyl ketone (DIBK), cyclohexanone, Ketones such as diacetone alcohol (DAA); aromatic hydrocarbons such as benzene, xylene and toluene; alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol and n-butyl alcohol; methyl cellosolve, ethyl cellosolve, butyl cellosolve; Cellosolves such as methyl cellosolve acetate and ethyl cellosolve acetate, N-methyl-2-pyrrolidone (NMP), tetrahydrofuran (THF), dimethylformamide (DMF), dibasic acid ester (DB ), Ethyl 3-ethoxypropionate (EEP), and dimethyl carbonate (DMC). Moreover, it is preferable that the usage-amount of a solvent is an quantity from which the solid content concentration of the component mixed with the solvent will be 10 to 60 weight%.

  The curable resin composition according to the present invention is 10 to 90% by weight of epoxy resin, 0.1 to 50% by weight of curing agent, and 5 to 50% by weight of film-forming resin with respect to the total weight of the curable resin composition. And the thing containing 1-50 weight% of compounds which have a flux function is more preferable. Moreover, the compound 2-40 which has 20-80 weight% of epoxy resins, 0.2-40 weight% of hardening | curing agents, 10-45 weight% of film-forming resin, and a flux function with respect to the total weight of a curable resin composition. More preferred are those containing% by weight. Moreover, the compound 3-25 which has epoxy resin 35 to 55 weight%, hardening | curing agent 0.5 to 30 weight%, film-forming resin 15 to 40 weight%, and a flux function with respect to the total weight of curable resin composition. Those containing wt% are particularly preferred.

In the conductive connection material according to the present invention, the thickness of each curable resin composition layer is not particularly limited, but is preferably 1 μm or more, more preferably 3 μm or more, and particularly preferably 5 μm or more. The thickness of the curable resin composition layer is preferably 200 μm or less, more preferably 150 μm or less, and particularly preferably 100 μm or less. When the thickness of the curable resin composition layer is within the above range, the gap between adjacent terminals can be sufficiently filled with the curable resin composition, and after the curable resin composition is cured, the machine is solidified. The adhesive strength and the electrical connection between the opposing terminals can be sufficiently secured, and the connection terminals can be manufactured.

  When the conductive connection material according to the present invention includes a plurality of curable resin composition layers, the composition of each curable resin composition layer may be the same, or may differ depending on the type of resin component used, the difference in the formulation, etc. Good. The physical properties such as melt viscosity and softening temperature of the curable resin composition layer may be the same or different. For example, a liquid curable resin composition layer and a solid curable resin composition layer may be used in combination.

(2) Metal foil In this invention, a metal foil layer is a layer comprised with the metal foil chosen from solder foil or tin foil. The metal foil layer should just be formed in at least one part of the curable resin composition layer by planar view, and may be formed in the whole surface of the curable resin composition layer.

  The shape of the metal foil layer is not particularly limited, and a certain shape may be repeatedly formed in a pattern shape, or the shape may be irregular. Regular shapes and irregular shapes may be mixed. FIG. 7 is a schematic plan view showing an example of the shape of the metal foil layer. A metal foil layer 150 having various shapes is formed on the curable resin composition layer 160. As the shape of the metal foil layer, for example, a dotted pattern (a), a striped pattern (b), a polka dot pattern (c), a rectangular pattern (d), a checkered pattern as shown in FIG. Examples include (e), a frame shape (f), a lattice pattern shape (g), and a multiple frame shape (h). These shapes are examples, and these shapes can be combined or deformed depending on the purpose and application.

  In one embodiment of the present invention, when connecting a full grid type adherend in which the electrode to be connected is disposed on the entire connection surface of the adherend, a sheet-like shape is formed on the entire surface of the curable resin composition. It is preferable to form a metal foil.

In addition, when connecting a peripheral type adherend in which the electrode to be connected is arranged in the periphery of the connection surface of the adherend, from the viewpoint of effectively using the metal foil, and between adjacent electrodes From the viewpoint of not leaving the metal foil, it is preferable to form a patterned metal foil repeatedly on at least a part of the curable resin composition. At this time, the shape of the metal foil can be appropriately selected depending on the pitch and form of the electrodes.

  The metal foil used in the present invention is not particularly limited, but tin (Sn), lead (Pb), silver (Ag), bismuth (Bi), indium (In), zinc (Zn), nickel (Ni), An alloy of at least two metals selected from the group consisting of antimony (Sb), iron (Fe), aluminum (Al), gold (Au), germanium (Ge), and copper (Cu), or a simple substance of tin It is preferable.

Among these, considering the melting temperature and mechanical properties, the metal foil is composed of Sn—Pb alloy, Sn—Bi alloy which is lead-free solder, Sn—Ag—Cu alloy, Sn—In alloy, Sn A solder foil made of an alloy containing Sn such as an alloy of -Ag is more preferable. In the case of using an Sn-Pb alloy, the content of tin is preferably 30% by weight or more and less than 100% by weight, more preferably 35% by weight or more and less than 100% by weight, and particularly preferably 40% by weight or more and less than 100% by weight. In the case of lead-free solder, the content of tin is preferably 15% by weight or more and less than 100% by weight, more preferably 20% by weight or more and less than 100% by weight, and particularly preferably 25% by weight or more and less than 100% by weight. For example, Sn-Pb alloy is Sn63-Pb (melting point 183 ° C.)
Lead-free solders include Sn-3.0Ag-0.5Cu (melting point 217 ° C.), Sn-3.5Ag (melting point 221 ° C.), Sn-58Bi (melting point 139 ° C.), Sn-9.0Zn (melting point 199) ° C), Sn-3.5Ag-0.5Bi-3.0In (melting point 193 ° C), Au-20Sn (melting point 280 ° C), and the like are preferable.

  The metal foil may be appropriately selected according to the heat resistance of the electronic member or semiconductor device to be connected. For example, in the connection between terminals in a semiconductor device, the melting point is 330 ° C. or lower (more preferably 300 ° C. or lower, particularly preferably 280 ° C. or lower, more preferably, in order to prevent the members of the semiconductor device from being damaged by thermal history. It is preferable to use a metal foil that is 260 ° C. or lower. In order to ensure the heat resistance of the semiconductor device after the connection between terminals, it is preferable to use a metal foil having a melting point of 100 ° C. or higher (more preferably 110 ° C. or higher, particularly preferably 120 ° C. or higher). In addition, melting | fusing point of metal foil can be measured with a differential scanning calorimeter (DSC).

  The thickness of the metal foil can be appropriately selected according to the gap between the opposing terminals, the separation distance between adjacent terminals, and the like. For example, in the case of connection between connection terminals such as a semiconductor chip, a substrate, and a semiconductor wafer in a semiconductor device, the thickness of the metal foil is preferably 0.5 μm or more, more preferably 3 μm or more, particularly preferably 5 μm or more, 100 micrometers or less are preferable, 50 micrometers or less are more preferable, and 20 micrometers or less are especially preferable. If the thickness of the metal foil is less than the lower limit, the number of unconnected terminals tends to increase due to insufficient solder or tin. On the other hand, if the thickness exceeds the upper limit, bridging occurs between adjacent terminals due to excessive solder or tin, and shorting easily occurs. There is a tendency.

  Examples of the method for producing the metal foil include a method of producing from a lump such as an ingot by rolling, and a method of forming the metal foil layer by direct vapor deposition, sputtering, plating, etc. on the curable resin composition layer. In addition, as a method for producing a metal foil having a repetitive pattern, for example, a method of punching a metal foil into a predetermined pattern, a method of forming a predetermined pattern by etching, etc., or using a shielding plate or a mask Examples thereof include a method of forming by vapor deposition, sputtering, plating, and the like.

  The content of the metal foil is preferably 5% by weight or more, more preferably 20% by weight or more, and particularly preferably 30% by weight or more with respect to the total weight of the conductive connecting material. Moreover, less than 100 weight% is preferable, 80 weight% or less is more preferable, and 70 weight% or less is especially preferable. If the content of the metal foil is less than the above lower limit, unconnected terminals may increase due to insufficient solder or tin. On the other hand, if the content of the metal foil exceeds the above upper limit, bridging is likely to occur between adjacent terminals due to excessive solder or tin.

  Or you may define content of metal foil with the volume ratio with respect to a conductive connection material. For example, the content of the metal foil is preferably 1% by volume or more, more preferably 5% by volume or more, and particularly preferably 10% by volume or more with respect to the conductive connection material. Moreover, 90 volume% or less is preferable, 80 volume% or less is more preferable, and 70 volume% or less is especially preferable. If the content of the metal foil is less than the above lower limit, unconnected terminals may increase due to insufficient solder or tin. On the other hand, if the content of the metal foil exceeds the above upper limit, bridging is likely to occur between adjacent terminals due to excessive solder or tin.

In the present invention, the form of the conductive connection material can be appropriately selected according to the form of the curable resin composition. For example, when the curable resin composition is in a liquid state, the curable resin composition is applied on a release substrate such as a polyester sheet coated with the curable resin composition on both sides of the metal foil, and half-finished at a predetermined temperature. After drying and forming a film for the purpose of curing (B-stage formation) or the like, a film formed by pasting metal foils together can be used as a conductive connection material. When the curable resin composition is in a solid state, the varnish of the curable resin composition dissolved in an organic solvent is applied onto a release substrate such as a polyester sheet, dried at a predetermined temperature, and then bonded to a metal foil. Or what was formed in the film form using methods, such as vapor deposition, can be provided as an electroconductive connection material.

  Moreover, the conductive connection material of this invention and the metal foil used for this can also use what gave the embossing in order to improve a contact with a terminal.

  The thickness of the conductive connecting material of the present invention is not particularly limited, but is preferably 1 μm or more, more preferably 3 μm or more, particularly preferably 5 μm or more, preferably 200 μm or less, more preferably 150 μm or less, and particularly preferably 100 μm or less. . When the thickness of the conductive connecting material is within the above range, the gap between adjacent terminals can be sufficiently filled with the curable resin composition. In addition, the mechanical adhesive strength after the resin component is cured or solidified and the electrical connection between the opposing terminals can be sufficiently ensured. In addition, it is possible to manufacture a connection terminal according to the purpose and application.

Next, a method for manufacturing the conductive connection material will be described.
When the curable resin composition used in the present invention is liquid at 25 ° C., for example, the metal foil is immersed in the liquid curable resin composition, and the liquid curable resin composition is attached to both surfaces of the metal foil, The conductive connection material of the present invention can be manufactured. When it is necessary to control the thickness of the curable resin composition, a method in which a metal foil immersed in a liquid curable resin composition is passed through a bar coater having a certain gap or a liquid curable resin composition is spray coated. It can produce by the method of spraying by etc.

  Moreover, when the curable resin composition used by this invention is a film form at 25 degreeC, a conductive connection material can be manufactured as follows, for example. First, a varnish of a curable resin composition dissolved in an organic solvent is applied onto a release substrate such as a polyester sheet, dried at a predetermined temperature to form a film, and a film-like curable resin composition is produced. Next, when two curable resin compositions formed on a release substrate were prepared and laminated with a hot roll with a metal foil sandwiched between them, when the curable resin composition was placed above and below the metal foil, A three-layer conductive connecting material comprising a curable resin composition / metal foil / curable resin composition can be produced. In addition, a two-layer conductive connection material composed of a curable resin composition / metal foil can be produced by arranging the curable resin composition on one side of the metal foil by the above-described laminating method.

  In addition, when using a wound metal foil, the metal foil is used as a base substrate, and the film-like curable resin composition is laminated on the upper and lower sides or one side of the metal foil with a hot roll, thereby winding the metal foil. The conductive connection material can also be obtained. Furthermore, when using a wound metal foil, a varnish-like curable resin composition is directly applied to the upper and lower sides or one side of the metal foil, and the solvent is evaporated to produce a wound conductive connection material. be able to.

When making conductive connection materials using patterned metal foil, place the metal foil on the peeling substrate, half-cut the metal foil with a mold from the metal foil side, and remove the excess metal foil Then, a patterned metal foil is produced by laminating the film-like curable resin composition with a hot roll. When providing a curable resin composition on both surfaces of a patterned metal foil, the film is peeled off from the surface of the patterned metal foil opposite to the surface on which the curable resin composition is formed. What is necessary is just to laminate further the curable resin composition of a shape.
In addition, the manufacturing method of a conductive connection material is not restrict | limited to the said method. The manufacturing method of the conductive connection material can be appropriately selected by those skilled in the art according to the purpose and application.

1 Electronic Component 7 Pressurized Fluid 8 Pressurized Oven 9 Pressurized Fluid Inlet 10 Support 11 First Terminal 20 Adhered Body 21 Second Terminal 30 Conductive Connection Material 70 Bump 71 Reinforcement Layer 80 Sealing Layer 81 Connection Part 110 Metal foil 120 Curable resin composition 130 Conductive region 140 Insulating region 150 Metal foil layer 160 Curable resin composition layer

Claims (11)

A method of manufacturing an electronic component in which a first terminal of a support and a second terminal of an adherend are joined using solder or tin to electrically connect the support and the adherend Because
A conductive connecting material having a laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil is disposed between the first terminal to be joined and the second terminal. The placement process;
A heating step of heating the conductive connecting material at a temperature that is equal to or higher than the melting point of the metal foil and does not complete the curing of the curable resin composition;
A pressure curing step of curing the curable resin composition while being pressurized with a pressurized fluid;
A method of manufacturing an electronic component, wherein the steps are performed in order. A method of manufacturing an electronic component in which a first terminal of a support and a second terminal of an adherend are joined using solder or tin to electrically connect the support and the adherend Because
A conductive connecting material having a laminated structure composed of a curable resin composition and a metal foil selected from solder foil or tin foil is disposed between the first terminal to be joined and the second terminal. The placement process;
A heating and pressure curing step for simultaneously heating the conductive connecting material and curing the curable resin composition while being pressurized with a pressurized fluid;
A method of manufacturing an electronic component, wherein the steps are performed in order.   The method for manufacturing an electronic component according to claim 1, wherein the pressurized fluid is a gas.   The method for manufacturing an electronic component according to claim 1, wherein the pressurized fluid is air or nitrogen.   The pressure curing step or the heating and pressure curing step is performed by placing the treatment target in a pressure vessel and heating the treatment target while pressurizing the pressure vessel with the pressurized fluid. The manufacturing method of the electronic component of any one of Claims 1-4 characterized by the above-mentioned.   6. The electronic component according to claim 1, wherein the pressure of the pressurized fluid is 0.1 to 10 MPa in the pressure curing step or the heating and pressure curing step. Manufacturing method.   The method for producing an electronic component according to claim 1, wherein the curable resin composition contains a compound having a flux function.   The method for producing an electronic component according to claim 7, wherein the compound having the flux function has a phenolic hydroxyl group and / or a carboxyl group.   The manufacturing method of the electronic component of any one of Claims 1-8 in which the said electrically conductive connection material contains the laminated structure which consists of a curable resin composition layer / metal foil layer / curable resin composition layer.   The manufacturing method of the electronic component of any one of Claims 1-8 in which the said conductive connection material contains the laminated structure which consists of a curable resin composition layer / metal foil layer.   The electronic component manufactured by the manufacturing method of any one of Claims 1-10.

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