JP2011153334A - Plating method and electroplating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating method which can stably perform plating, and an electroplating apparatus. <P>SOLUTION: The electroplating apparatus 2 includes: a cathode 20 connected to a conductive layer 12; an anode 21 arranged at the lower part of a base material 1 so as to face the other side of the base material 1; and an electroplating liquid feeding part 23 flowing an electroplating liquid L between the other side of the base material 1 and the anode 21. The electroplating apparatus 2 flows the electroplating liquid l between the other side of an insulating layer 11 and the anode 21 by the electroplating liquid feeding part 23 and further exhausts the electroplating liquid L between the other side of the insulating layer 11 and the anode 21 to the part lower than the other side of the insulating layer 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a plating method and an electrolytic plating apparatus.

Conventionally, a circuit board mounted on an electronic device or the like is manufactured as follows (see Patent Documents 1 and 2).
First, a base material having an insulating layer and a first metal film formed on one surface of the insulating layer is prepared. And a hole is formed in the said insulating layer of a base material with a laser. Next, the first metal film is covered with a mask. Thereafter, the substrate is immersed in a plating solution, and electrolytic plating is performed. This forms a via in the hole of the insulating layer.
Next, a second metal film is formed on the other surface side of the insulating layer, and the first metal film and the second metal film are processed by etching or the like to form a circuit layer.

JP 2007-188985 A JP 2005-272874 A

  In such a manufacturing method, when the via is formed in the hole of the insulating layer by plating, if the side surface of the first metal film is exposed, plating is deposited on the side surface of the first metal film. In this case, since the area of the side surface of the first metal film is very large compared to the hole area where the plating should be deposited, the deposition of the plating proceeds preferentially, and the inside of the hole becomes difficult to be plated. Such a phenomenon is remarkable especially when the diameter of the hole is very small.

According to the present invention, a step of preparing a base material having an insulating layer in which a through hole is formed and a conductive layer that is provided on one surface of the insulating layer and closes one opening of the through hole;
Connecting the cathode to the conductive layer and disposing the substrate above the anode so that the other surface of the insulating layer faces the anode;
An electrolytic plating solution is allowed to flow between the other surface of the insulating layer and the anode to form a plating film in the through hole, and the electrolytic plating solution between the other surface of the insulating layer and the anode is used. And a step of discharging below the other surface of the insulating layer.

According to this invention, the electrolytic plating solution is allowed to flow between the other surface of the insulating layer (the surface opposite to the surface on which the conductive layer is provided) and the anode, thereby forming a plating film in the through hole. The electrolytic plating solution is discharged below the other surface of the insulating layer.
Thereby, it can suppress that electroplating liquid adheres to the side surface of the conductive layer provided on the one surface of the insulating layer, and plating will deposit on the side surface of the conductive layer. Thereby, plating can be stably performed inside the hole.

Furthermore, according to the present invention,
Electrolytic plating apparatus for performing electroplating in the through-hole of a base material having an insulating layer in which a through-hole is formed and a conductive layer provided on one surface of the insulating layer and blocking one opening of the through-hole Because
A cathode connected to the conductive layer;
The anode disposed below the substrate so as to face the other surface of the substrate;
An electroplating solution supply section for flowing an electroplating solution between the other surface of the substrate and the anode;
In the electrolytic plating apparatus, the electrolytic plating solution is supplied between the other surface of the insulating layer and the anode by the electrolytic plating solution supply unit, and the electrolytic plating is performed between the other surface of the insulating layer and the anode. An electroplating apparatus configured to discharge the liquid below the other surface of the insulating layer can also be provided.

  A plating method and an electrolytic plating apparatus capable of performing stable plating are provided.

It is a top view which shows the electroplating apparatus concerning one Embodiment of this invention. It is sectional drawing of the II-II direction of FIG. It is sectional drawing of the III-III direction of FIG. It is a figure which shows the supporting member of an electroplating apparatus. It is sectional drawing which shows a base material. It is a top view which shows the electroplating apparatus concerning the modification of this invention. It is a top view which shows the anode concerning the modification of this invention. It is a figure which shows the electroplating apparatus concerning the modification of this invention. It is a figure which shows the principal part of the electroplating apparatus concerning the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
With reference to FIGS. 1-3, the outline | summary of the electroplating apparatus 2 of this embodiment is demonstrated.
1 is a plan view of the electrolytic plating apparatus 2, FIG. 2 is a cross-sectional view in the II-II direction of FIG. 1, and FIG. 3 is a cross-sectional view in the III-III direction of FIG.
The electrolytic plating apparatus 2 of the present embodiment includes a base material 1 having an insulating layer 11 in which a through hole 111 is formed, and a conductive layer 12 provided on one surface of the insulating layer 11 and closing one opening of the through hole 111. It is an electroplating apparatus for performing electroplating in the through-hole 111 of this.
The electroplating apparatus 2 includes a cathode 20 connected to the conductive layer 12, an anode 21 disposed below the substrate 1 so as to face the other surface of the substrate 1, the other surface of the substrate 1, and an anode The base plate 1 is held above the anode 21 and the anode 21 and the other surface of the base plate 1 are opposed to each other. A holding unit (consisting of the conveyance roller 25 and the cathode 20) is provided.
In the electrolytic plating apparatus 2, the electrolytic plating solution supply unit 23 causes the electrolytic plating solution L to flow between the other surface of the insulating layer 11 and the anode 21, and electrolysis is performed between the other surface of the insulating layer 11 and the anode 21. The plating solution L is configured to be discharged below the other surface of the insulating layer 11.

Next, the electrolytic plating apparatus 2 of this embodiment will be described in detail.
First, the base material 1 to be plated by the electrolytic plating apparatus 2 will be described.
As shown in FIG. 5, the base material 1 includes an insulating layer 11 in which a through hole 111 is formed and a conductive layer 12.
The base material 1 becomes a flexible circuit board, for example.
The insulating layer 11 is, for example, a polyimide film and has a thickness of about 10 μm to 200 μm.
A plurality of through holes 111 penetrating the front and back surfaces are formed in the insulating layer 11. The through hole 111 is formed so that the diameter increases from the front surface (one surface) side to the back surface (other surface) side of the insulating layer 11 and has a tapered cross section.
On one surface side of the insulating layer 11, a conductive layer 12 that closes the openings of the plurality of through holes 111 is provided. The conductive layer 12 is a metal film, for example, a copper film.
The thickness of the conductive layer 12 is, for example, 5 to 50 μm.

  As shown in FIGS. 1 to 4, the electrolytic plating apparatus 2 of the present embodiment includes a cathode 20, an anode 21, an electrolytic plating solution supply unit 23, a plating tank 24 filled with an electrolytic plating solution L, and a transport roller. 25 and a support member 26.

The electroplating apparatus 2 of this embodiment is an apparatus for carrying and continuously plating the sheet-like substrate 1 while being held on the plating tank 24 by the carrying roller 25.
The plating tank 24 is filled with an electrolytic plating solution L, for example, an electrolytic plating solution such as copper sulfate.
The anode 21 is not immersed in the electroplating solution L in the plating tank 24, and is disposed above the liquid surface of the electroplating solution L in the plating tank 24.
Here, the anode 21 may be a soluble anode or an insoluble anode.
The anode 21 is composed of a plurality of metal plates 211 and is disposed in the transport direction of the base material 1 (x direction in FIGS. 1 to 3) and in the direction orthogonal to the transport direction (y direction in FIGS. 1 to 3). For example, the metal plates 211 are arranged in 10 rows × 2 columns when the transport direction of the base material 1 is “row” and the direction orthogonal to the transport direction is “column”.
Each metal plate 211 is supported by a support member 26 as shown in FIG. 4, and the metal plates 211 adjacent to each other along the transport direction (x direction) of the base material 1, the direction orthogonal to the transport direction of the base material 1 ( The metal plates 211 adjacent in the y direction are spaced apart.
4A is a plan view of the support member 26, and FIG. 4B is a cross-sectional view in the IV-IV direction of FIG. 4A.
The support member 26 is made of, for example, an insulating material, and has a recess 261 for fitting the metal plate 211. The support member 26 is formed with a through groove 262 extending in the center in the conveyance direction of the base material 1. The through groove 262 is located between the metal plates 211 adjacent to each other in the direction orthogonal to the conveyance direction of the substrate 1, and the electrolytic plating solution L is supplied to the substrate 1 side through the through groove 262.
As shown in FIG. 1 and FIG. 2, the width W1 of the anode 21 (in this embodiment, the gap between the two metal plates 211 aligned in the direction orthogonal to the transport direction of the base material 1 and the two metal plates 211 The total width) is smaller than the width W2 of the substrate 1 (the length in the direction orthogonal to the conveyance direction of the substrate 1).
Furthermore, in the present embodiment, the width W3 of the support member 26 (the length in the direction orthogonal to the substrate transport direction) is smaller than the width W2 of the substrate 1.
Further, in a plan view from the upper side of the plating tank 24, a gap between the metal plates 211 arranged in a direction orthogonal to the substrate transport direction, that is, the through groove 262 has a width in a direction orthogonal to the substrate 1 transport direction. Located at approximately the center of W2.
Here, as shown in FIG. 2, the conductive layer 12 of the base material 1 positioned immediately above the metal plate 211 in a state where the base material 1 is conveyed onto the anode 21 and the base material 1 and the anode 21 are opposed to each other. And the distance H between the metal plate 211 is preferably 0.1 mm or more.
By setting the thickness to 0.1 mm or more, physical contact between the substrate 1 and the anode 21 can be avoided, and the effect of preventing plating burn due to current concentration can be prevented.
The upper limit value of the distance H is not particularly limited, but is preferably 1000 mm or less, for example.

The cathode 20 is formed in a roll shape and is disposed above the anode 21. The cathode 20 is disposed so as to be in contact with the conductive layer 12 on the surface of the base material 1 and functions as a transport roller for transporting the base material 1.
For example, as shown in FIGS. 1 and 3, the cathodes 20 are respectively disposed on the base end side and the tip end side of the base material 1 in the transport direction.

  The transport roller 25 transports the base material 1 on the anode 21.

As shown in FIG. 2, the electrolytic plating solution supply unit 23 supplies the electrolytic plating solution L in the plating tank 24 toward the substrate 1 disposed on the upper part of the plating tank 24. The electrolytic plating solution supply unit 23 includes, for example, a pump P and a pipe M connected to the pump P.
The electrolytic plating solution L discharged from the electrolytic plating solution supply unit 23 is supplied toward the substrate 1 through the gaps between the metal plates 211 (that is, the through grooves 262).
As shown in FIG. 2, the electrolytic plating solution L flows between the insulating layer 11 of the substrate 1 and each metal plate 211, and the outer end portion of each metal plate 211 (the conveyance direction of the substrate 1). From the end in the direction orthogonal to the lower side), and falls downward due to its own weight.
Note that a plurality of pipes M of the electrolytic plating solution supply unit 23 may be provided so that the electrolytic plating solution L is supplied over the entire longitudinal direction of the through groove 262. Also, as shown in FIG. A plate material 28 having a plurality of through holes 281 disposed along the longitudinal direction of the through groove 262 is disposed below, and the entire longitudinal direction of the through groove 262 is disposed via the plurality of through holes 281 and the through grooves 262. Further, a structure in which the electrolytic plating solution L is supplied may be adopted.
9 is a cross-sectional view in which a plate material 28 is added to the cross-sectional view in the IX-IX direction of FIG. Further, the arrows in FIG. 9 indicate the flow of the electrolytic plating solution L.

Next, a plating method using the electrolytic plating apparatus 2 as described above will be described.
First, the outline | summary of the plating method of this embodiment is demonstrated.
The plating method of the present embodiment prepares a base material 1 having an insulating layer 11 in which a through hole 111 is formed and a conductive layer 12 provided on one surface of the insulating layer 11 and closing one opening of the through hole 111. Connecting the cathode 20 to the conductive layer 12, and disposing the base material 1 above the anode 21 so that the other surface of the insulating layer 11 faces the anode 21,
An electrolytic plating solution is allowed to flow between the other surface of the insulating layer 11 and the anode 21 to form a plating film in the through hole 111, and the electrolytic plating solution between the other surface of the insulating layer 11 and the anode 21 is insulated. And a step of discharging below the other surface of the layer 11.

Next, the plating method of this embodiment will be described in detail.
First, the base material 1 is prepared.
Although not shown, the substrate 1 is wound in a roll shape, and the substrate 1 is supplied onto the plating tank 24 via the transport roller 25 and the cathode 20. At this time, the substrate 1 is supplied so that the conductive layer 12 is in direct contact with the cathode 20.
In addition, degreasing is performed before the electroplating.

The substrate 1 is conveyed on the plating tank 24 by the conveying roller 25 and the cathode 20. At this time, the electrolytic plating solution L in the plating tank 24 is moved upward from the anode 21 side toward the substrate 1. Supply (see FIG. 2). The electrolytic plating solution L is applied to the insulating layer 11 of the substrate 1 through a gap (in this embodiment, the through groove 262) formed between the metal plates 211 arranged in a direction perpendicular to the substrate conveyance direction of the anode 21. Supplied between the other surface and the metal plate 211. The electrolytic plating solution L is also supplied into the through hole 111 of the insulating layer 11. As a result, as shown in FIG. 2, the gap between the metal plate 211 and the insulating layer 11 and the inside of the through hole 111 are filled with the electrolytic plating solution L. The electrolytic plating solution L includes the metal plate 211 and the through hole. In contact with the conductive layer 12 exposed from 111, plating is deposited inside the through hole 111.
In addition, while the base material 1 passes the upper part of the plating tank 24, the electrolytic plating solution L is continuously supplied from the through groove 262. Therefore, while the substrate 1 passes through the upper part of the plating tank 24, the state where the gap between the metal plate 211 and the insulating layer 11 and the inside of the through hole 111 are filled with the electrolytic plating solution L is maintained. Become.

As shown in FIG. 2, the electroplating solution L supplied between the other surface of the insulating layer 11 of the substrate 1 and the metal plate 211 is the outer end of the metal plate 211 (on the side opposite to the through groove 262 side). ) From the other side of the insulating layer 11 and falls due to its own weight.
Here, as described above, the width W <b> 1 of the anode 21 is smaller than the width W <b> 2 of the substrate 1, and the end portion of the substrate 1 is larger than the end portion of the anode 21 in plan view from above the plating tank 24. It protrudes in a direction (outward) orthogonal to the substrate conveyance direction. Furthermore, in the present embodiment, the width W3 of the support member 26 that supports the anode 21 is also smaller than the width W2 of the base material 1, and the end portion of the base material 1 projects outward from the support member 26.
Therefore, the electrolytic plating solution L supplied between the other surface of the insulating layer 11 of the substrate 1 and the metal plate 211 does not come into contact with the end portion or the side surface of the conductive layer 12 on the insulating layer 11 and is a plating tank. It falls to the 24 side and is collected in the plating tank 24. Thereby, it can suppress that plating deposits on the conductive layer 12.

The electrolytic plating solution L collected in the plating tank 24 is again flowed from the through groove 262 toward the substrate 1 by the electrolytic plating solution supply unit 23.
In the plating tank 24, although not shown, the electrolytic plating solution may be periodically analyzed by the adjusting means to adjust the concentration of each component in the electrolytic plating solution L.
In the present embodiment, the substrate 1 passes over the anode 21 without stopping. Plating is performed in the through hole 111 while the substrate 1 passes over the anode 21. However, the substrate 1 may pass over the plurality of anodes 21 while being temporarily stopped on the anodes 21.

The base material 1 plated in the through hole 111 is washed with water, and the base material 1 plated in the through hole 111 is completed.
Then, the base material 1 is cut | disconnected as needed and a metal film is affixed on the other surface side of the insulating layer 11 of the base material 1. FIG. Thereafter, the conductive layer 12 and the metal film are selectively removed to form a circuit layer to obtain a circuit board. This circuit board is a flexible circuit board.

Next, the effect of this embodiment is demonstrated.
In the present embodiment, since the electrolytic plating solution L between the other surface of the insulating layer 11 and the anode 21 flows below the other surface of the insulating layer 11, it is provided on one surface of the insulating layer 11. It can suppress that the electroplating liquid L adheres to the side surface of the conductive layer 12, and plating deposits on the side surface of the conductive layer 12. Thereby, it is possible to stably plate the inside of the through hole 111.
In particular, in this embodiment, when the base material 1 and the anode 21 are opposed to each other, the width W1 of the anode 21 is smaller than the width W2 of the base material 1, and the base material is viewed in plan view from above the plating tank 24. One end portion projects beyond the end portion of the anode 21 in a direction (outward) perpendicular to the substrate transport direction. Furthermore, in this embodiment, the width W3 of the support member 26 that supports the anode 21 is also smaller than the width W2 of the base material 1, and the end in the width direction of the base material 1 protrudes outward from the support member 26 as well. Yes.
Therefore, the electrolytic plating solution L between the anode 21 and the insulating layer 11 is discharged to the plating tank 24 side without coming into contact with the end of the insulating layer 11. It can suppress reliably that plating will precipitate.

Further, the conventional manufacturing method as described above has a problem that plating is deposited on the conductive layer. In order to solve this problem, for example, when the base material has a discontinuous shape, an insulating plate such as a resin is applied to the conductive layer side, and then the outer periphery of the circuit board is covered with an insulating adhesive tape or the like. Sealing the surface and side surfaces of the conductive layer from the plating solution by sealing, or if the substrate has a continuous shape, covering the conductive layer and all of its side surfaces with a continuous insulating adhesive tape, etc. Can be considered.
However, both of these methods have a problem in that productivity is not improved because a lot of work is required for attaching the adhesive tape before plating and further peeling off after plating.
On the other hand, in this embodiment, the electrolytic plating solution L is allowed to flow between the other surface of the insulating layer 11 of the substrate 1 (the surface opposite to the surface on which the conductive layer is provided) and the anode 21, A plating film is formed in 111. Then, the electrolytic plating solution L is discharged below the other surface of the insulating layer 11.
Thereby, since the electroplating liquid L does not contact the conductive layer 12 provided on one surface of the insulating layer 11, the conductive layer 12 does not need to be covered with an insulating tape or the like. Therefore, it is possible to save time and effort for the plating process in the through hole 111 of the insulating layer 11 and to perform plating efficiently.

Furthermore, in this embodiment, the electrolytic plating solution L is allowed to flow upward toward the base material 1 from the gaps (through grooves 262) between the metal plates 211 constituting the anode 21. By doing in this way, the electroplating liquid L can be stably poured between the insulating layer 11 and the anode 21 of the base material 1.
For example, as indicated by an arrow in FIG. 6, it is conceivable to flow an electrolytic plating solution from the base end side in the substrate transport direction into the gap between the substrate 1 and the anode 21. However, when the transport distance on the plating tank 24 is increased, the electrolytic plating solution L must flow very vigorously from the base end side in the transport direction of the substrate 1 toward the front end side in the transport direction. In addition, it becomes difficult to stably supply the electrolytic plating solution L between the substrate 1 and the anode 21.
On the other hand, in this embodiment, a gap is formed between a pair of metal plates 211 adjacent in a direction orthogonal to the substrate conveyance direction, and the electrolytic plating solution is supplied between the substrate 1 and the anode 21 from this gap. Therefore, even if the electrolytic plating solution L does not flow very vigorously, the electrolytic plating solution L can flow stably between the insulating layer 11 and the anode 21 of the substrate 1.

  Furthermore, in the present embodiment, the position of the gap between the metal plates 211 adjacent in the direction orthogonal to the substrate transport direction of the anode 21 (in this embodiment, the through groove 262) is substantially the width W2 direction of the substrate 1. Since it is in the center position, the electrolytic plating solution L can be made to flow substantially uniformly from the through groove 262 to the end side of the base material 1 (end side along the base material transport direction), and the plating can be performed stably. can do.

It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
For example, in the above embodiment, the anode 21 is composed of a plurality of metal plates 211, but the present invention is not limited to this. For example, as shown in FIG. 7, the anode 210 may be composed of a single metal plate 212. By doing in this way, the structure of a plating apparatus can be simplified. In this case, a through hole 212A may be formed in the metal plate 212, and the electrolytic plating solution L may be supplied from the through hole 212A to the substrate 1 side.
However, if the anode 21 is composed of a plurality of metal plates 211 as in the above embodiment, the current flowing between each metal plate 211 and the cathode 20 can be set to different values and controlled.
Since the through hole 111 has a tapered cross section, the plating area increases as the plating progresses. Therefore, for example, the value of the current flowing between the metal plate 211 on the base end side in the transport direction of the base material 1 and the cathode 20 is set between the metal plate 211 on the front end side in the transport direction of the base material 1 and the cathode 20. The current density on the surface to be plated can be made constant by making it smaller than the value of the current flowing through the surface. Specifically, as shown in FIG. 8, a control unit 27 (in this case, a resistor) can be provided to vary the amount of current flowing between each metal plate 211 and the cathode 20.

In the above embodiment, the through hole 111 has a tapered cross section. However, the shape is not limited to this, and a shape having a uniform diameter from one opening of the through hole 111 toward the other opening, for example, a circle. It may be columnar.
Furthermore, in the said embodiment, although the electroplating apparatus 2 performed plating continuously, conveying the base material 1 on the anode 21, not only this but the base material 1 on the anode 21 is mentioned. The plating may be performed in a state in which is stopped.
Further, in the above embodiment, the electroplating apparatus 2 includes a transport roller for transporting a continuous substrate, but is not limited thereto, and includes a transport roller as a device dedicated to a non-continuous substrate. It does not have to be. For example, a single-wafer type electroplating apparatus may be used.
Moreover, although the base material 1 was for flexible circuit boards, it is not limited to this, and may be for rigid boards.

DESCRIPTION OF SYMBOLS 1 Base material 2 Electrolytic plating apparatus 11 Insulating layer 12 Conductive layer 20 Cathode 21 Anode 23 Plating solution supply part 24 Plating tank 25 Conveyance roller 26 Support member 27 Control part 28 Plate material 111 Through-hole 210 Anode 211 Metal plate 212A Through-hole 212 Metal plate 261 Recess 262 Through groove 281 Through hole H Distance L Electroplating solution M Pipe P Pump W1 Width W2 Width W3 Width

Claims (10)

Providing a base material having an insulating layer in which a through hole is formed and a conductive layer provided on one surface of the insulating layer and closing one opening of the through hole;
Connecting the cathode to the conductive layer and disposing the substrate above the anode so that the other surface of the insulating layer faces the anode;
An electrolytic plating solution is allowed to flow between the other surface of the insulating layer and the anode to form a plating film in the through hole, and the electrolytic plating solution between the other surface of the insulating layer and the anode is used. And a step of discharging below the other surface of the insulating layer. The plating method according to claim 1,
When the anode and the base material are arranged to face each other, the end portion of the insulating layer protrudes outward from the end portion of the anode,
The plating method in which the electrolytic plating solution between the other surface of the insulating layer and the anode is discharged below the other surface of the insulating layer without contacting the end portion of the insulating layer. In the plating method according to claim 1 or 2,
The anode is formed with an opening for flowing the plating solution toward the insulating layer,
A plating method in which an electrolytic plating solution is allowed to flow from the anode side toward the other surface side of the insulating layer through the opening of the anode, and the electrolytic plating solution is allowed to flow between the other surface of the insulating layer and the anode. In the plating method according to claim 3,
The anode is composed of a plurality of metal plates, and a gap serving as the opening is formed between the plurality of metal plates,
A plating method in which an electrolytic plating solution is allowed to flow from the anode side toward the other surface side of the insulating layer through the gap. In the plating method according to any one of claims 1 to 4,
A plating method in which the electrolytic plating solution discharged below the other surface of the insulating layer is collected, and the electrolytic plating solution is again flowed between the other surface of the insulating layer and the anode. In the plating method according to any one of claims 1 to 5,
A plating method in which electrolytic plating is performed in the through hole of the insulating layer while transporting the base material on the anode. Electrolytic plating apparatus for performing electroplating in the through-hole of a base material having an insulating layer in which a through-hole is formed and a conductive layer provided on one surface of the insulating layer and blocking one opening of the through-hole Because
A cathode connected to the conductive layer;
The anode disposed below the substrate so as to face the other surface of the substrate;
An electroplating solution supply section for flowing electroplating between the other surface of the substrate and the anode;
In the electrolytic plating apparatus, the electrolytic plating solution is supplied between the other surface of the insulating layer and the anode by the electrolytic plating solution supply unit, and the electrolytic plating is performed between the other surface of the insulating layer and the anode. An electrolytic plating apparatus configured to discharge the liquid below the other surface of the insulating layer. In the electroplating apparatus according to claim 7,
The anode is formed with an opening for flowing the plating solution toward the insulating layer,
An electrolytic plating solution is allowed to flow from the anode side toward the other surface side of the insulating layer through the opening of the anode, and the electrolytic plating solution is allowed to flow between the other surface of the insulating layer and the anode. Electroplating equipment. The electroplating apparatus according to claim 8,
The anode is composed of a plurality of metal plates,
A gap to be the opening is formed between the plurality of metal plates,
An electrolytic plating apparatus configured to cause an electrolytic plating solution to flow between the other surface of the insulating layer and the anode by flowing an electrolytic plating solution upward from the gap. In the electroplating apparatus in any one of Claims 7 thru | or 9,
An electroplating apparatus comprising a transport unit for transporting the base material on the anode.

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