JP2011151048A - Method of manufacturing electronic component, and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which has superior shock resistance and highly reliable electric connection of an inner via and secondary mounting in laminate structure including a ceramic substrate. <P>SOLUTION: A method of manufacturing the electronic component in which, from both sides of a laminate formed by laminating a ceramic substrate, an insulating resin sheet made of a conductive resin composition and having via conductors, and a multilayer circuit substrate or a metal foil, pressurizing force is impressed while heating the laminate through ceramic bases to cure the insulating resin sheet, thereby obtaining a precursor, and dividing the precursor to manufacture the electronic component, is used. The electronic component having insulating resins formed on both surfaces of the ceramic substrate is also used. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component having a component built-in structure in which different kinds of materials of a ceramic substrate and a resin material are laminated, and a method for manufacturing the same.

  Electronic component modules on which electronic components, mainly semiconductor chips, are mounted greatly contribute to miniaturization, thinning, and high performance of information communication devices, office electronic devices, household electronic devices, medical electronic devices, etc. is doing. In particular, in response to the demand for miniaturization and thinning in the field of information communication equipment, in order to further increase the mounting density of electronic components such as semiconductor chips, the wiring pitch of the wiring board for mounting the electronic component electrode pitch and electronic components. The miniaturization is progressing more and more.

  Recently, in addition to the conventional two-dimensional mounting in which electronic parts are mounted on the surface of the wiring board, the electronic parts are built in the wiring board, and the mounting area is greatly reduced, and the three-dimensional structure is aimed at reducing the size and increasing the density. Development of built-in component modules using various mounting methods is also actively underway.

In addition, when mounting electronic components such as semiconductor chips on a mother board of an electronic device such as a personal computer or a mobile phone, wiring between the electronic parts with fine wiring rules and the mother board with relatively coarse wiring rules for the electronic parts In order to adjust the rules, electronic components are mounted on a wiring board called an interposer board or module board, and then BGA (Ball Grid Array) mounting using solder balls or LGA (Land Guard Array) by electrode part solder printing. In many cases, stepwise mounting forms such as secondary mounting on a mother board are adopted. Resin substrates are usually used for this mother board, but wiring rules for electronic components and mother boards, required board area and thickness, and electronic component wiring are often used for interposer boards and module boards. A resin substrate or a ceramic substrate is selected and used from various viewpoints such as heat dissipation. Here, when a ceramic substrate is used as an interposer substrate or a module substrate, the thermal expansion coefficients of the ceramic substrate and the mother substrate are greatly different, so that a large stress is applied to the secondary mounting portion, for example, a crack is generated in a solder ball of BGA mounting. An electrical connection failure such as occurrence may occur. In response to the occurrence of defects due to the use of such dissimilar materials, by forming a resin layer on the mother substrate mounting surface of an interposer substrate or module substrate made of a ceramic material, stress can be relieved and defects can be prevented. A method (Patent Document 1) has been proposed.
JP 2003-124435 A

  However, in the method disclosed in Patent Document 1, there is no warp on the secondary mounting surface in the state of the heterogeneous stacked connection structure of the ceramic substrate and the resin substrate before the secondary mounting on the mother substrate. Desired. A ceramic substrate has high rigidity and generates little warpage in a heterogeneous laminated connection structure with a resin substrate, but often contains stress inherently because warpage hardly occurs. When this internal stress increases, it often causes various problems such as breakage such as chipping and cracking of the ceramic substrate all at once. Therefore, in a heterogeneous laminated connection structure of a ceramic substrate and a resin substrate, there is a method of relaxing stress by connecting resin surfaces by a structure in which a resin layer is formed on a ceramic substrate as disclosed in Patent Document 1. However, in the laminated structure in which the resin layer is directly formed on the ceramic substrate, since the entire surface is bonded instead of the minimum grid pattern connection as in BGA mounting and LGA mounting, a large warp occurs due to the difference in thermal expansion coefficient. Secondary mountability on the mother board will be significantly impaired. Depending on the relationship between the thickness of the ceramic substrate and the thickness of the resin layer, the internal stress and warpage caused by the heterogeneous multilayer structure are likely to change, so the reliability of the secondary mounting on the mother board in any heterogeneous multilayer structure It was very difficult to make the price high.

  Hereinafter, a conventional method for manufacturing an electronic component and an electronic component will be described with reference to FIGS. 13 (a) to 13 (e), 14 and 15. FIG.

  In FIG. 13A, a ceramic substrate 333 in which circuit components 311b and 311c are mounted on a wiring pattern 302a of the ceramic substrate 301, an insulating resin sheet 335 in which a via-hole conductor 334 made of a conductive resin composition is formed, Then, a transfer sheet 325 in which a wiring pattern 324 of the transfer forming material is formed on the carrier layer 323 of the transfer forming material is prepared. The via hole conductor 334 is aligned and laminated so that the wiring pattern 302a of the ceramic substrate and the wiring pattern 324 of the transfer forming material are electrically connected. As shown in FIG. 13B to FIG. 13E, the laminated body is integrated by thermosetting the insulating resin sheet by pressurizing and heating the above-described laminated body with a hot press apparatus. 356 is a metal plate, 352 is a cushioning material, and 353 is a heating plate of a hot press machine. Further, after mounting the circuit component 311a and the semiconductor element 312 such as a semiconductor chip or a semiconductor package on the wiring pattern 302b of the ceramic substrate, the carrier layer of the transfer sheet is peeled off and the electronic component precursor 343 (FIG. 14) is produced. The electronic component precursor 343 is cut along the cutting line 355 to be divided into individual pieces, thereby producing the electronic component. However, when heated under pressure, the via hole conductor 334 is distorted as shown in FIG. 15 due to the difference in thermal expansion coefficient due to the different laminated structure of the ceramic substrate and the insulating resin sheet, transfer sheet, or resin multilayer substrate. Due to the misalignment, a reliable connection could not be obtained. Further, the warpage is greatly generated due to the difference in thermal expansion coefficient between the different laminated structures, and the warpage of about 5 to 8 mm occurs in the size of 100 × 100 mm.

  The present invention has been made in view of the above points, and its main object is to suppress the generation of distortion and warpage of the via-hole conductor 334 due to the heterogeneous multilayer structure of the electronic component including the ceramic substrate, and to prevent the mother of the electronic component. An object of the present invention is to provide a technique for improving the electrical connection reliability of secondary mounting on a substrate.

  The method of manufacturing an electronic component according to the present invention includes a step of preparing a ceramic substrate on which circuit components are mounted on a wiring pattern on at least one main surface, and a via hole conductor formed by filling a via hole with a conductive resin composition. A step of preparing the uncured insulating resin sheets A and B having, a step of preparing a transfer forming material composed of at least two layers of a carrier layer and a wiring pattern, and a second transfer forming material or a wiring pattern. A step of preparing a resin multilayer substrate or a metal foil, and the transfer forming material, the uncured insulating resin sheet A, the ceramic substrate, the uncured insulating resin sheet B, and a second transfer forming material. Alternatively, a resin multilayer substrate having a wiring pattern or a metal foil is sequentially laminated, and the wiring pattern on one main surface of the ceramic substrate and the front are formed by the via-hole conductor. The wiring pattern of the transfer forming material and the wiring pattern of the other main surface of the ceramic substrate and the second transfer forming material, the resin multilayer substrate having the wiring pattern, or the metal foil are positioned so as to be electrically connected A step of laminating and laminating, a ceramic base is disposed on the upper and lower surfaces of the laminate laminated in the step, and the uncured insulating resin sheets A and B are cured by pressure and heating, and the transfer forming material The uncured insulating resin sheet A, the ceramic substrate, the uncured insulating resin sheet B and the second transfer forming material, a resin multilayer substrate having a wiring pattern, or a metal foil are integrated. Removing the carrier layer of the transfer forming material, forming a wiring pattern embedded in the insulating resin sheet to produce a precursor of the electronic component, and Dividing the precursor is intended to include a step of fabricating the electronic component.

  According to this configuration, when the insulating resin sheet is cured by pressurizing and heating the laminated body, the insulating base is simply disposed on the upper and lower surfaces of the laminated body without adding a special process. A highly reliable electronic component in which a via hole conductor formed in a resin sheet is not distorted and hardly warps can be easily produced. In addition, since the via-hole conductor is not distorted and is not easily warped, it can be formed in a large size, so that an electronic component can be manufactured without a significant increase in manufacturing time.

  The method for manufacturing an electronic component according to the present invention includes a step of preparing a ceramic substrate on which circuit components are mounted on a wiring pattern on at least one main surface, and a via hole formed by filling a via hole with a conductive resin composition. A step of preparing uncured insulating resin sheets A and B having a conductor, a step of preparing a resin multilayer substrate or a metal foil having a wiring pattern, the resin multilayer substrate, and the uncured insulating property The resin sheet A, the ceramic substrate, the uncured insulating resin sheet B and the second resin multilayer substrate, or a metal foil are sequentially laminated, and a wiring pattern on one main surface of the ceramic substrate is formed by the via-hole conductor. The wiring pattern of the resin multilayer substrate and the wiring pattern of the other main surface of the ceramic substrate are electrically connected to the second resin multilayer substrate or the metal foil. The ceramic bases are disposed on the upper and lower surfaces of the laminated body laminated by the above steps, and the uncured insulating resin sheets A and B are cured by pressurizing and heating. A resin multilayer substrate, the uncured insulating resin sheet A, the ceramic substrate, the uncured insulating resin sheet B and the second resin multilayer substrate, or a metal foil are integrated to produce a precursor of an electronic component And a step of dividing the precursor of the electronic component to produce an electronic component.

  Even in this configuration, the same effects as those of the electronic component manufacturing method of the present invention can be obtained. In addition, by using a multilayer flexible substrate instead of the wiring transfer pattern, the wiring capacity can be improved without warping, so that the degree of design freedom is not hindered.

  The method for manufacturing an electronic component according to the present invention includes a step of processing the metal foil as a precursor of the electronic component to form a wiring pattern, and a step of mounting a circuit component on the wiring pattern processed from the metal foil. And a step of producing an electronic component by dividing the precursor of the electronic component.

  According to this configuration, the circuit component is built in the insulating resin sheet bonded to both surfaces of the ceramic substrate, and the circuit component is further mounted on the wiring pattern formed on the insulating resin sheet. The electronic component is a three-dimensionally mounted component.

  The electronic component manufacturing method of the present invention includes a step of mounting a circuit component on the wiring pattern of the second resin multilayer substrate as a precursor of the electronic component. According to this configuration, the same effects as those of the electronic component manufacturing method of the invention can be obtained.

  Specifically, the resin multilayer substrate is preferably a flexible substrate using at least one film base material selected from polyimide, aramid, PET, PPS, PEN, and Teflon (registered trademark).

  According to this configuration, it is possible to minimize the influence of the resin multilayer substrate, which is an unbalance factor other than the warp mitigation structure by the insulating resin sheet laminated on both surfaces of the ceramic substrate, on the warp of the electronic component. Become.

  Specifically, the insulating resin sheet is made of a mixture containing 50% to 75% by volume inorganic filler and a thermosetting resin. According to this configuration, mixing the inorganic filler has an effect of reducing the thermal expansion coefficient of the insulating resin sheet, which is one of the causes of internal stress in the heterogeneous laminated structure. In addition, when the mixing ratio is 75% by volume or more, the amount of liquid is too small with respect to the amount of powder, making it difficult to form a sheet, and when it is 50% by volume or less, the thermal expansion is reduced by mixing the inorganic filler. And the effect of improving heat dissipation is reduced. When the circuit component such as a semiconductor chip is embedded in the insulating resin sheet by pressurization and heating, if the viscosity does not damage the circuit component, the compounding ratio of the inorganic filler is preferably large.

Specifically, the inorganic filler contains at least one inorganic filler selected from Al ₂ O ₃ , SiO ₂ , MgO, BN, and AlN. By using these inorganic fillers, there is an effect that the heat dissipation of the insulating resin sheet is increased and the thermal expansion coefficient is small.

  Specifically, the thermosetting resin contains at least one thermosetting resin selected from an epoxy resin, a phenol resin, and a cyanate resin. A wide variety of these resins are commercially available, and by using these resins, the resin becomes excellent in heat resistance and electrical insulation.

  Specifically, the conductive resin composition includes metal particles including at least one metal selected from gold, silver, copper, and nickel as a conductive component, and includes an epoxy resin as a resin component. The metal has a low electrical resistance, and the epoxy resin is excellent in heat resistance and electrical insulation. In particular, metal particles coated with silver on the surface using copper powder as a core material are suitable because they have both the characteristics of copper powder that has high mechanical strength and is inexpensive and silver powder that is resistant to oxidation and low resistance.

  An electronic component according to the present invention includes a ceramic substrate layer having a first wiring pattern, and an insulating resin sheet having a via-hole conductor made of a conductive resin composition bonded to the first main surface of the ceramic substrate layer. A second wiring pattern bonded to the insulating resin sheet layer and electrically connected to the first wiring pattern by the via-hole conductor, or a resin multilayer substrate layer having a second wiring pattern And an insulating resin sheet layer bonded to the second main surface of the ceramic substrate. According to this configuration, since the insulating resin sheet layer is formed on both sides of the ceramic substrate layer, the warpage due to the lamination of different materials is made into an electronic component with high stress that balances stress and has no warpage. be able to. Further, the stress balance caused by laminating the second wiring pattern or the resin multilayer substrate layer having the second wiring pattern that is bonded to the first main surface of the ceramic substrate layer via the insulating resin sheet layer. It is possible to easily match the stress balance by changing the thickness of the insulating resin sheet layer bonded to both surfaces of the ceramic substrate layer, and there is no warping even if it is not necessarily a completely symmetrical structure. It becomes an electronic component.

  The electronic component of the present invention is mounted on the first wiring pattern in a state of being incorporated in the insulating resin sheet layer on at least one of the first main surface and the second main surface of the ceramic substrate layer. It may further include a circuit component. In this configuration, a circuit component mounted on both sides of the ceramic substrate layer is preferable because it is close to a symmetric structure and can relieve stress. Even in this structure, the stress balance mismatch including the built-in circuit component configuration can be easily achieved by changing the thickness of the insulating resin sheet layer bonded to both sides of the ceramic substrate layer. In other words, the electronic component is not necessarily warped without necessarily having a completely symmetrical structure.

  Specifically, the circuit component includes a semiconductor chip. Based on this configuration, warping is less likely to occur. In particular, when a bare chip semiconductor or a semiconductor package in which external electrodes with fine pitches are formed is mounted, the electrical connection of the bare chip semiconductor or semiconductor package mounting due to warpage hardly occurs.

  The electronic component of the present invention is bonded to the second main surface of the ceramic substrate layer and bonded to the insulating resin sheet layer having a via-hole conductor made of a conductive resin composition and the insulating resin sheet layer. A third wiring pattern or a resin multilayer substrate layer having a third wiring pattern or a conductive film layer, and the first wiring pattern of the ceramic substrate layer and the third wiring by the via-hole conductor. The pattern or the conductive film layer may be electrically connected. In this configuration, the magnetic shield effect can be obtained by arranging the via-hole conductor around the built-in circuit component and connecting it to the ground. Further, by mounting circuit components on the third wiring pattern or the resin multilayer substrate having the third wiring pattern, electronic components are mounted with high density.

  According to the present invention, an uncured thermosetting resin sheet having a via-hole conductor filled with a conductive resin paste on both sides of a ceramic substrate on which circuit components are mounted, and a transfer sheet on which a wiring pattern is formed or When laminating a laminate with either a resin multilayer substrate or metal foil by pressurization and heating, disposing different types of electronic components by placing a ceramic base on the top and bottom surfaces of the laminate and heating with pressure It is possible to suppress the distortion of the via-hole conductor and the occurrence of warpage due to the above. This is because the distortion caused by the difference in coefficient of thermal expansion between the ceramic substrate and the resin / metal material that occurs during heating is placed between the ceramic substrate as a core and the ceramic base is placed on both sides to apply pressure. Therefore, the via hole conductor formed in the insulating resin sheet is not distorted and the positional deviation from the wiring pattern is not generated. By changing the thickness of the insulating resin sheet bonded to both surfaces of the ceramic substrate according to the configuration of the electronic component, it is possible to easily configure a stress symmetric structure, thereby controlling the occurrence of warpage. According to this manufacturing method, it is possible to simplify the process because heating and pressurization can be performed with circuit components mounted on both sides of the ceramic substrate. In addition, by reducing the distortion and warpage of via-hole conductors in electronic components, it is possible to improve the secondary mounting property of the motherboard, the electrical connection reliability after secondary mounting, and the drop impact resistance reliability. Become.

  Embodiments of the present invention will be described below with reference to FIGS.

(First embodiment)
A method for manufacturing an electronic component according to a first embodiment of the present invention will be described with reference to schematic process cross-sectional views of FIGS. 1 (a) to 1 (m).

  In FIG. 1, 101 is a 6-layer ceramic substrate having a thickness of 0.5 mm, non-shrinkable LTCC (low temperature co-fired ceramics), 102a and 102b are wiring patterns of the ceramic substrate 101, and a paste mainly composed of an Ag material. The thickness is 20 μm formed by printing / firing. Reference numerals 111a, 111b, and 111c denote circuit parts, which are chip parts such as resistors, capacitors, and inductors, 112 denotes a semiconductor element, and a semiconductor chip, a semiconductor package, and the like 124 has a thickness of 0.012 mm formed on the transfer forming material. A wiring pattern made of Cu foil, 123 is a transfer formation material carrier layer of 0.07 mm thick Cu foil or resin film, 131 is a 0.5 mm thick insulating resin sheet, and the thickness is adjusted according to the thickness of the component Is done. Reference numeral 132 denotes a protective film having a thickness of 0.02 mm, which is PPS (polyphenylene sulfide), but PET (polyethylene terephthalate), PEN (polyethylene naphthalate), or the like may be used. 133 is a via hole having a diameter of 0.16 mm, 134 is a via hole conductor made of a conductive resin composition, 141 is a metal foil, 151 is a ceramic base having a thickness of 2 mm, 152 is a cushioning material having a thickness of 2 mm, 154 is a heater, 153 is a hot press A heating plate of the apparatus, 143 is an electronic component precursor, 155 is a division processing line, and 147 is an electronic component of the present invention.

The insulating resin sheet 131 is made of a mixture containing 50% to 75% by volume of an inorganic filler and a thermosetting resin. Here, the inorganic filler includes at least one inorganic filler selected from Al ₂ O ₃ , SiO ₂ , MgO, BN and AlN, and the thermosetting resin is at least one selected from an epoxy resin, a phenol resin and a cyanate resin. It consists of what contains a thermosetting resin. Furthermore, the conductive resin composition constituting the via-hole conductor 134 includes metal particles including at least one metal selected from gold, silver, copper, and nickel as a conductive component, and includes an epoxy resin as a resin component. Consists of things. Such a configuration is the same in the second to sixth embodiments.

  1A and 1B, circuit components 111a, 111b, and 11c and a semiconductor element 112 are mounted on the wiring patterns 102a and 102b of the ceramic substrate 101. In FIG. 1C and FIG. 1D, a metal foil 122 of the transfer forming material 121 is processed to prepare a transfer forming material 125 in which a wiring pattern 124 of the transfer forming material is formed. 1E to 1H, the protective film 132 is bonded to both surfaces of the insulating resin sheet 131, the via hole 133 is opened, the conductive resin composition is filled to form the via hole conductor 134, and the protective film 132 is formed. Is removed to prepare an insulating resin sheet 135 on which a via-hole conductor 134 is formed. In FIG. 1 (i), the ceramic substrate 104 on which circuit components are mounted, the insulating resin sheet 135a provided with via-hole conductors, the transfer forming material 125 on which the wiring pattern is formed, and the metal foil 141 are connected to the ceramic substrate 101 by the via-hole conductors 134. The ceramic substrate wiring pattern 102b and the transfer forming material wiring pattern 124 formed on one main surface of the ceramic substrate 101, and the ceramic substrate wiring pattern 102a and metal foil 141 formed on the other main surface of the ceramic substrate 101 are electrically connected. Are aligned so that they are connected to each other. In FIG. 1 (j), the ceramic substrate 104 on which the circuit components are mounted, the insulating resin sheets 135a and 135b having via-hole conductors, the transfer forming material 125 on which the wiring pattern is formed, and the metal foil 141 are stacked. The ceramic base 151 and the cushioning material 152 are arranged on the lower surface, and the insulating resin sheet 131 is thermoset by pressurizing and heating with the heating plate 153 to integrate the laminate. FIG. 1 (k) shows a laminate integrated by pressurization and heating. In FIG. 1L, the carrier layer 123 of the transfer forming material is removed. As a practical manufacturing method, a large number of electronic parts manufactured by the processes of FIGS. 1A to 1L are generally taken in large numbers, and a carrier layer 123 of a transfer forming material is formed. At the stage of removal, the electronic component precursor 143 shown in FIG. 1 (m) is obtained. The electronic component of the present invention is manufactured as each electronic component 147 by dividing and dividing into pieces at the cutting line 155.

  In the first embodiment, the circuit components are mounted on both surfaces of the ceramic substrate and incorporated in the insulating resin sheet. However, the present invention is not limited to this, and mounting on one surface may be possible. A built-in component on a ceramic substrate may be used. In addition, the insulating resin sheet bonded to the other main surface of the ceramic substrate may contain only components without necessarily forming via-hole conductors.

  Distortion caused by the difference in thermal expansion coefficient between the ceramic substrate and the resin material generated during heating is applied by applying pressure by placing the ceramic base 151 on both sides with the ceramic substrate 101 as a core, so that the heat of the resin / metal material in between is applied. The expansion can be suppressed, and the via hole conductor 134 formed on the insulating resin sheet 131 is not distorted, so that the positional deviation between the via hole conductor and the wiring pattern does not occur. By changing the thickness of the insulating resin sheet 131 bonded to both surfaces of the ceramic substrate 101 according to the configuration of the electronic component, a stress symmetric structure can be easily configured, so that the occurrence of warpage can be controlled. In addition, since it is possible to heat and press the circuit component mounted on both sides of the ceramic substrate, the step of mounting the component after pressurizing and heating can be omitted, and the process can be simplified. In addition, by reducing the distortion and warpage of via-hole conductors in electronic components, it is possible to improve the secondary mounting property of the motherboard, the electrical connection reliability after secondary mounting, and the drop impact resistance reliability. Become.

(Second Embodiment)
A method for manufacturing an electronic component according to a second embodiment of the present invention will be described with reference to schematic process cross-sectional views in FIGS. 3 (a) to 3 (c).

  In FIG. 3, reference numeral 133 denotes a ceramic substrate on which circuit components are mounted, 135a and 135b are insulating resin sheets on which via-hole conductors are formed, and the respective components and manufacturing steps are the same as those in the first embodiment. 126 is a resin multilayer substrate, and 141 is a metal foil.

  In FIG. 3A, the ceramic substrate 133 on which circuit components are mounted, the insulating resin sheets 135a and 135b provided with via-hole conductors, the resin multilayer substrate 126, and the metal foil 141 are connected to one of the ceramic substrates 101 by the via-hole conductors 134. The wiring pattern 102a of the ceramic substrate formed on the main surface, the wiring pattern 128b of the resin multilayer substrate 126, and the wiring pattern 102b of the ceramic substrate formed on the other main surface of the ceramic substrate 101 and the metal foil 141 are electrically connected. Laminate them so that they are connected. In FIG. 3 (b), ceramic bases 133 on which circuit components are mounted, insulating resin sheets 135a and 135b having via-hole conductors, a resin multilayer substrate 126, and a metal base 141 are laminated on the upper and lower surfaces of the laminate. 151 and the cushioning material 152 are arranged, and the insulating resin sheet 131 is thermally cured by pressurizing and heating with the heating plate 153 of the hot press device, and the laminate is integrated. Here, 154 is a heater for heating. FIG. 3C shows a laminated body integrated by pressurization and heating. Although shown in the drawing as an individual piece, the electronic component precursor of the present invention is manufactured by dividing and dividing the precursor of a large-sized electronic component having a large number of pieces as in the first embodiment.

  In the second embodiment, the circuit components are mounted on both surfaces of the ceramic substrate and incorporated in the insulating resin sheet. However, the present invention is not limited to this, and single-sided mounting may be used, and a thick film or a thin film may be formed. A built-in component on a ceramic substrate may be used. In addition, the insulating resin sheet bonded to the other main surface of the ceramic substrate may contain only components without necessarily forming via-hole conductors.

  In the second embodiment, in addition to the effects of the first embodiment, since a resin multilayer substrate is used instead of the transfer pattern which is a single-layer wiring layer, the wiring capacity is high and the design freedom is hindered. It becomes an electronic component without. Also, a flexible substrate (thickness 0.015 mm to 0.1 mm) using a film base material having a thickness of 0.005 mm to 0.05 mm such as polyimide, aramid, PET, PPS, PEN or Teflon (registered trademark) as a resin multilayer substrate By using, warpage can be made smaller.

(Third embodiment)
A method for manufacturing an electronic component according to a third embodiment of the present invention will be described with reference to schematic process cross-sectional views in FIGS. 4 (a) and 4 (b).

  In FIG. 4, 142 is a wiring pattern obtained by processing a metal foil, 114a and 114b are circuit components, and 112 and 113 are semiconductor elements, which are semiconductor chips or semiconductor packages.

  In FIG. 4A and FIG. 4B, the wiring pattern 142 is formed by patterning the metal foil 141 of the precursor of the electronic component manufactured in the second embodiment. Next, a semiconductor element 113 such as a semiconductor chip or a semiconductor package and circuit components 114 a and 114 b are mounted on the wiring pattern 142. Furthermore, the electronic component precursor of the present invention is manufactured by dividing a large-sized large-sized electronic component precursor into individual pieces. The electronic component precursor described in the first embodiment may be used as the electronic component precursor. In addition, the wiring pattern was formed by patterning the metal foil, but when applying pressure and heating, the wiring pattern transfer using a transfer forming material or a resin multilayer substrate can be adhered and circuit components can be mounted on the wiring pattern. good.

  In the third embodiment, in addition to the effects of the second embodiment, circuit components are stacked and mounted in multiple stages, so that the electronic component has a high mounting density and is advantageous for miniaturization.

(Fourth embodiment)
An electronic component according to a fourth embodiment of the present invention will be described with reference to schematic cross-sectional views of FIGS.

  5 to 12, 101 is a ceramic substrate, 102a and 102b are wiring patterns of the ceramic substrate 101, 111a, 111b, and 111c are circuit components and chips such as resistors, capacitors, and inductors, and 112 is a semiconductor element. A semiconductor chip or a semiconductor package, etc. 124 is a wiring pattern of a transfer forming material, 127 is a resin multilayer board, 128a and 128b are wiring patterns of a resin multilayer board, 131a and 131b are insulating resin sheets, and 134 is a conductive resin composition. The via-hole conductor 141 is a metal foil. Such a configuration is the same in the fifth embodiment. Instead of the metal foil 141, a metal thin film formed by sputtering, vapor deposition, or the like, a metal thick film formed by plating, or a printing paste containing conductive particles may be used.

  The electronic component of the present invention in FIG. 5 is bonded to the first main surface of the ceramic substrate 101 and bonded to the insulating resin sheet 131a having a via-hole conductor 134 made of a conductive resin composition, and the insulating resin sheet 131a. The wiring pattern 124 of the second transfer forming material electrically connected to the first wiring pattern by the via hole conductor 134, the circuit component 111a and the semiconductor chip or the semiconductor package on the second main surface of the ceramic substrate 101, etc. The semiconductor element 112 is mounted, the insulating resin sheet 131b is bonded, and the circuit component 111a and the semiconductor element 112 such as a semiconductor chip or a semiconductor package are built in the insulating resin sheet.

  According to this configuration, since the insulating resin sheets are formed on both surfaces of the ceramic substrate, the warpage due to the lamination of different materials can be made into an electronic component with high stress balance and no secondary warpage. it can. In addition, it is possible to easily adjust the stress balance by changing the thickness of the insulating resin sheet that is bonded to both sides of the ceramic substrate, so that more complex stresses can easily be generated by mounting circuit components. In other words, the electronic component is not necessarily warped without necessarily having a completely symmetrical structure.

  The electronic component of the present invention in FIG. 6 is a component in which a circuit component is mounted on the first main surface of a ceramic substrate and is built in an insulating resin sheet. As a result, the insulating resin sheet bonded to the first main surface of the ceramic substrate not only serves as a stress relaxation function during secondary mounting on the mother substrate but also serves as a component built-in layer. It becomes an electronic component.

  7 and 8, in addition to the configuration described above, the electronic component of the present invention is further provided with a metal foil 141 on an insulating resin sheet 131b that is bonded to the second main surface of the ceramic substrate and has a built-in circuit component. A magnetic shield function is provided by bonding and forming a via-hole conductor 134 so as to surround the circuit component 111a and the semiconductor element 112 such as a semiconductor chip or a semiconductor package, and connecting it to the ground.

  The electronic component of the present invention in FIGS. 9 to 12 uses a resin multilayer substrate 126 in place of the wiring pattern 124 of the transfer forming material in the configuration of the electronic component described in FIGS. Reference numeral 127 denotes a core material of a resin multilayer substrate, preferably a flexible substrate using at least one film base material selected from polyimide, aramid, PET, PPS, PEN, and Teflon (registered trademark).

  Since a resin multilayer substrate is used in place of the transfer pattern which is a single-layer wiring layer, the electronic component has high wiring capacity and does not hinder the freedom of design. Further, by using a flexible substrate using a film base material such as polyimide, aramid, PET, PPS, PEN, and Teflon (registered trademark) as the resin multilayer substrate, warpage can be further reduced. Moreover, although the resin multilayer substrate is illustrated as a two-layer substrate, it is not limited to this.

(Fifth embodiment)
An electronic component according to a fifth embodiment of the present invention will be described with reference to a schematic cross-sectional view of FIG.

  In FIG. 4B, 148 is an example of the electronic component of the present invention shown in FIG. 3C manufactured in the fourth embodiment. In the present embodiment, the metal foil 141 is replaced with the wiring pattern 142. A semiconductor element 113 such as a semiconductor chip or a semiconductor package and circuit components 114 a and 114 b are mounted on the wiring pattern 142. The via-hole conductor 134 is not limited to the purpose of magnetic shielding but is also used as a signal line. The wiring pattern is obtained by patterning a metal foil. However, the wiring pattern is not limited to this, and a wiring pattern transfer or a resin multilayer substrate may be attached. Further, although a resin multilayer substrate is used on the secondary mounting surface side to the mother substrate, it may be formed by wiring pattern transfer. Furthermore, the circuit component mounting on the ceramic substrate may be a mounting form on one side.

  In the electronic component of the present invention, circuit components are stacked and mounted in multiple stages, so that the electronic component has a high mounting density and is advantageous for miniaturization.

  Hereinafter, the present invention will be described in more detail with reference to examples.

(Sixth embodiment)
The manufacturing method of the electronic component of the first embodiment described above includes the following steps (1) to (7) and schematic process cross-sectional views of FIGS. 1 (a) to 1 (m) and FIG. It explains using.

  The second to fifth embodiments were manufactured in the same manner. Although the structure of each layer differs in each embodiment, the same manufacturing method can be used in terms of process.

(1) Preparation of ceramic substrate on which circuit components are mounted A wiring pattern for evaluating the connectivity of via-hole conductors 134 formed on insulating resin sheet 131 and circuit components shown in FIG. 1A are mounted. A multilayer ceramic substrate 103 composed of four layers having a size of 100 × 100 mm and a thickness of 0.4 mm, on which wiring patterns 102a and 102b are formed, is prepared.

  Next, a semiconductor element 112 such as a semiconductor chip or a semiconductor package is flip-chip mounted on the ceramic substrate wiring pattern shown in FIG. 1B by means of ACF, NCF, SBB, or the like. Next, a cream solder paste is supplied by means of screen printing, dispensing, etc., the circuit components 111a, 111b, and 111c are mounted, and reflow is performed to prepare the ceramic substrate 104 on which the circuit components are mounted. These mounting parts are built in the insulating resin sheet. However, in order to prevent a short circuit due to remelting of the solder in the reflow process at the time of secondary mounting, it is possible to use SnSb solder having a higher melting point than Sn-Ag-Cu solder. It is preferable to use a high-temperature type cream solder, a melting point shift type solder, or a conductive adhesive. Further, the circuit component may be mounted only on one side of the ceramic substrate.

(2) Preparation of Transfer Forming Material Formed with Wiring Pattern FIG. 1 (c) shows a thickness of 0.07 mm as a release layer on a carrier layer 123 of transfer forming material having a thickness of 0.07 mm via nickel plating. A transfer forming material 121 (Furukawa Circuit Foil Co., Ltd. F-DP) on which a 012 mm copper foil 122 is laminated. A transfer forming material 125 in which a wiring pattern 124 of a transfer forming material in which a predetermined pattern is formed by processing the copper foil 122 is prepared by a photolithography technique. The transfer forming material may be produced by forming a resist pattern opposite to the wiring pattern on the carrier copper foil, forming the wiring pattern by plating, and then removing the resist.

(3) Preparation of Resin Sheet Filled with Conductive Paste As shown in FIGS. 1 (e) to 1 (h), first, an insulating resin sheet made of a mixture of an inorganic filler and a thermosetting resin was produced. . A mixture containing 10% by weight of an epoxy resin (Epicure YH-306 made of oil-shelled epoxy) and 90% by weight of an alumina filler (AS-40 made by Showa Denko) was stirred for 10 minutes. A 1 mm insulating resin sheet 131 was produced. Next, five insulating resin sheets and a PPS film 132 having a thickness of 0.02 mm are laminated on the upper and lower surfaces to form an insulating resin sheet of 100 × 100 × 0.54 mm, and then a puncher or laser is used. A through hole 133 having a diameter of 0.16 mm serving as an inner via was formed, and the through hole was filled with a conductive resin paste by screen printing, and then the PPS protective film was peeled off. The conductive resin paste used here is 85% by weight of spherical copper particles, 3% by weight of bisphenol A type epoxy resin (“Epicoat 828” manufactured by Yuka Shell Epoxy Co., Ltd.) as a resin component, and a glycidyl ester epoxy resin. (Toto Kasei Co., Ltd. “YD-171”) 9% by weight and an amine adduct curing agent (“MY-24” manufactured by Ajinomoto Co., Inc.) 3% by weight as a curing agent were kneaded and adjusted using three rolls. Note that a cavity for incorporating a circuit component in the insulating resin sheet may be processed according to the situation such as the size of the built-in circuit component.

(4) Preparation of Laminated Body As shown in FIG. 1 (i), the transfer forming material 125 prepared earlier, the insulating resin sheet 135a on which the via-hole conductor 134 is formed, the ceramic substrate 104 on which circuit components are mounted, and the via-hole conductor The wiring formed on one main surface of the ceramic substrate by the via-hole conductor 134 formed on the insulating resin sheet, with the insulating resin sheet 135b formed with a metal foil 141 made of copper foil having a thickness of 0.035 mm. A laminate is prepared in which the pattern 102a, the wiring pattern 124 of the transfer forming material, the wiring pattern 102b formed on the other main surface of the ceramic substrate, and the metal foil 141 made of copper foil are aligned so as to be electrically connected. .

(5) Curing the insulating resin sheet by hot pressing to integrate the laminated body As shown in FIGS. 1 (j) to 1 (i), a ceramic base having a thickness of 2 mm is formed on the upper and lower surfaces of the previously prepared laminated body. 151 and a cushioning material 152 having a thickness of 2 mm are placed and integrated by heating with a heating plate 153, and then the carrier layer 123 of the transfer forming material is peeled off to produce a precursor of the electronic component of the present invention. . Here, 154 is a heater for heating. Pressurization heating was performed using a hot press machine, the heating temperature was 200 ° C., the pressure was 3 MPa, and the pressure heating time was 2 hours. The epoxy resin contained in the insulating resin sheet and via hole conductor is also completely cured, and the wiring patterns 102a and 102b of the ceramic substrate, the wiring pattern 124 of the transfer forming material, and the metal foil 108 are passed through the via hole conductor formed in the insulating resin sheet. Was electrically connected. The above-described cushioning material 152 aims to equalize pressure by absorbing the parallelism and flatness of the heating plate of the hot press.

  When the laminate is directly sandwiched between a metal plate or a cushioning material and heated under pressure, the thermal expansion coefficient between the ceramic substrate 101, the metal plate, the cushioning material, the carrier layer of the transfer forming material, the copper foil, and the insulating resin sheet 131. The difference in thermal expansion between the ceramic contact surface of the insulating resin sheet and the opposite contact surface differs in the thickness portion, and as a result, as shown in FIGS. 15 (a) and 15 (b), the conductivity is increased. The via hole conductor formed in the resin sheet is distorted. FIG. 15A is a cross-sectional view of the via-hole conductor, and FIG. 15B is a top view thereof. The ceramic base 151 is disposed on the upper and lower surfaces of the laminate, and the ceramic substrate is used as a core. The upper and lower resin materials and metal materials are sandwiched between the ceramic bases and pressed. The via-hole conductor is not distorted as shown in FIGS. 2 (a) and 2 (b). 2A is a cross-sectional view, and FIG. 2B is a top view. Further, since the insulating resin layers are formed on both sides of the ceramic substrate, the structure is close to a symmetric structure, and the elongation of the insulating resin layer is suppressed when being heated under pressure. It is very small with ~ 0.7mm.

(6) Production of electronic component The electronic component precursor produced earlier is divided by dicing along the dividing line 155 to obtain the electronic component of the present invention having a size of 20 × 20 mm and a thickness of 1.6 mm (16 pieces / board). ) Made.

(7) Secondary mounting Next, an electronic component mounting apparatus in which the manufactured electronic component was secondarily mounted on a FR-4 wiring board having a thickness of 1 mm by LGA mounting using a solder paste was manufactured.

  Here, as an example for comparison, an electronic component mounting apparatus in which an electronic component having no insulating resin layer on the other main surface of the ceramic substrate shown in FIG. 16 was manufactured and secondarily mounted by LGA mounting was manufactured.

  The evaluation was performed by using an electronic component mounting apparatus in which the electronic component of the present invention was secondarily mounted and a comparative electronic component mounting apparatus, 50 pieces each, and a liquid bath thermal shock test (125 ° C. after being immersed in a thermostatic bath at −55 ° C. for 5 minutes. Was immersed in a constant temperature bath for 5 minutes) 1000 times, and the electrical connection resistance between the via-hole conductor and the secondary mounting portion was performed. As a result, in the electronic component mounting apparatus of the comparative example, 18 poorly connected electrical connections occurred in the via hole conductor and 42 in the secondary mounting, whereas in the electronic component mounting apparatus in which the electronic component of the present invention was secondary mounted, There was no electrical connection failure between the via-hole conductor and the secondary mounting.

  In the first embodiment, the wiring pattern on the secondary mounting surface is the transfer pattern, but a multilayer flexible substrate may be used. Further, the circuit component mounting surface may be one side.

  As described above, the electronic component according to the present invention is formed on the upper and lower surfaces of the laminate when the laminate of the base material in which the insulating resin sheet and the wiring pattern are formed on both surfaces of the ceramic substrate is pressed and heated. By disposing the ceramic base, there is an effect that the distortion of the via-hole conductor and the warpage of the substrate due to the heterogeneous laminated structure are alleviated and the electrical connection reliability of the secondary mounting is improved.

  INDUSTRIAL APPLICABILITY The present invention is useful in manufacturing an electronic component having excellent impact resistance, high inner via connection, secondary mounting electrical connection reliability, and the electronic component in a heterogeneous laminated structure including a ceramic substrate.

(A)-(m) Process sectional drawing which shows the manufacturing method of the electronic component in the 1st Embodiment of this invention (A) Sectional view showing via-hole conductor state in first to fifth embodiments of the present invention, (b) Plan view showing via-hole conductor state in first to fifth embodiments of the present invention (A)-(c) Process sectional drawing which shows the manufacturing method of the electronic component in the 2nd Embodiment of this invention. (A) And (b) Process sectional drawing which shows the manufacturing method of the electronic component in the 3rd Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention Sectional drawing of the electronic component in the 4th Embodiment of this invention (A)-(e) Process sectional drawing which shows the manufacturing method of the conventional electronic component Sectional view showing a precursor of a conventional electronic component (A) Sectional drawing which shows the state of the via-hole conductor of the conventional electronic component, (b) Top view which shows the state of the via-hole conductor of the conventional electronic component Sectional view of conventional electronic components

Explanation of symbols

101, 301 Ceramic substrate 102a, 102b, 302a, 302b Wiring pattern 111a-111c, 114a-114b, 311a-311c Circuit component 112, 113, 312 Semiconductor element 121 Transfer forming material 123, 323 Transfer forming material carrier layer 124, 324 Wiring pattern 131, 131a, 131b Insulating resin sheet 134, 334 Via hole conductor 141 Metal foil 151 Ceramic base 152, 352 Cushion material 143, 343 Precursor of electronic component 126 Resin multilayer substrate 153, 353 Heating plate 356 Metal plate

Claims (10)

Laminating a ceramic substrate, an uncured insulating resin sheet having a via hole conductor formed by filling a via hole with a conductive resin composition, a resin multilayer substrate, or a metal foil,
Including placing ceramic plates on the upper and lower surfaces, pressurizing and heating to cure the uncured insulating resin sheet, producing a precursor, and dividing the precursor to produce an electronic component; Manufacturing method for electronic parts. The method of manufacturing an electronic component according to claim 1, wherein an electronic component is mounted on the ceramic substrate. 3. The electron according to claim 1, wherein the resin multilayer substrate is a flexible substrate using at least one film base material selected from polyimide, aramid, PET, PPS, PEN, and Teflon (registered trademark). A manufacturing method for parts. 4. The method of manufacturing an electronic component according to claim 1, wherein the insulating resin sheet is made of a mixture containing 50% to 75% volume of an inorganic filler and a thermosetting resin. Wherein the inorganic filler _{is, Al 2 O 3, SiO 2} , MgO, method of manufacturing an electronic component according to claim 4, characterized in that it comprises at least one inorganic filler selected from BN and AlN. A ceramic substrate having a first wiring pattern;
An insulating resin sheet layer having a via-hole conductor made of a conductive resin composition, bonded to the first main surface of the ceramic substrate;
A second wiring pattern bonded to the insulating resin sheet and electrically connected to the first wiring pattern by the via-hole conductor, or a resin multilayer layer having a second wiring pattern;
An electronic component comprising: an insulating resin sheet layer bonded to the second main surface of the ceramic substrate. A circuit component mounted on the first wiring pattern in a state of being incorporated in the insulating resin sheet is further provided on at least one of the first main surface and the second main surface of the ceramic substrate. The electronic component according to claim 6. The electronic component according to claim 7, wherein the circuit component includes a semiconductor element. An insulating resin sheet layer having a via-hole conductor made of a conductive resin composition, bonded to the second main surface of the ceramic substrate;
A third wiring pattern bonded to the insulating resin sheet, a resin multilayer substrate layer having a third wiring pattern, or a conductive film layer, and the first wiring of the ceramic substrate layer by the via-hole conductor The electronic component according to claim 7 or 8, wherein the pattern and the third wiring pattern or the conductive film layer are electrically connected. The electronic component according to claim 9, wherein a circuit component is mounted on the third wiring pattern.