JP2011147965A - Lens apparatus for laser machining and laser machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lens apparatus for laser machining and a laser machining apparatus, enabling the use according to a plurality of machining applications by a single machining apparatus. <P>SOLUTION: The lens apparatus for laser machining 10 includes a lens holder 11 which is attachably/detachably mounted on a head part 2 of a laser beam marker 1 for machining a workpiece W by condensing the laser beam by an fθ lens 2e. An auxiliary lens 12 for changing the angle of the laser beam emitted from the fθ lens 2e with respect to the optical axis X is fitted to the lens holder 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laser processing lens apparatus and a laser processing apparatus that are suitably used in a laser processing apparatus that performs processing by locally heating an object to be processed with laser light at high speed.

  Conventionally, as a laser processing device that deflects laser light with a galvanometer mirror and condenses it with a lens, and locally heats and processes a workpiece at high speed, the galvanometer mirror and galvanometer scanner, and the laser reflected by the galvanometer mirror Some include an fθ lens that collects light (see, for example, Patent Document 1).

JP 2007-253203 A

Many laser processing apparatuses of this type are manufactured so that the fθ lens cannot be removed from the apparatus main body in order to ensure confidentiality. For this reason, it is necessary to separately prepare a laser processing apparatus provided with an optimal fθ lens according to the processing application. For example, when printing is performed by irradiating the surface of a workpiece with laser light, a non-telecentric fθ lens in which the laser light is angled with respect to the optical axis so that printing can be performed even if the printing surface is an uneven surface. Is required. In addition, when drilling a blind via hole or the like by irradiating an electronic circuit board with a laser beam, it is perpendicular to the substrate surface so that the conductive portion formed by plating the processed hole is not disconnected. Since it is necessary to form a hole, a laser processing apparatus including a telecentric fθ lens in which laser light is parallel to the optical axis is required. For this reason, it is necessary to prepare a plurality of laser processing apparatuses according to the processing application, and there is a problem that the processing cost increases.
Then, it aims at providing the lens apparatus for laser processing and laser processing apparatus which enable the use according to a some processing application with a single processing apparatus.

  The lens device for laser processing of the present invention is a lens device for laser processing that is additionally attached to a laser processing device that condenses laser light by an fθ lens held in a head portion and is used for processing a processing object. And an auxiliary lens that changes the angle of the laser beam emitted from the fθ lens with respect to the optical axis, and a lens holder that is mounted with the auxiliary lens and can be detachably attached to the head portion. It is characterized by that.

  According to the laser processing lens device of the present invention, the auxiliary lens that changes the angle of the laser beam emitted from the fθ lens with respect to the optical axis is detachably attached to the head portion of the laser processing device via the lens holder. Therefore, the angle of the laser beam can be changed by attaching and detaching the auxiliary lens according to the processing application. Therefore, the single laser processing apparatus can be used in accordance with a plurality of processing applications, and processing costs can be reduced.

  Moreover, it is preferable that the said laser processing apparatus is a laser marker. In this case, since the auxiliary lens can be attached to a laser marker that is particularly inexpensive among laser processing apparatuses, the processing cost can be effectively reduced.

  The fθ lens is preferably a non-telecentric fθ lens, and the auxiliary lens preferably has a characteristic of emitting as a telecentric laser beam. In this case, an auxiliary lens that emits telecentric laser light can be attached to a laser processing apparatus including an inexpensive non-telecentric fθ lens. Therefore, an expensive laser processing apparatus equipped with a telecentric fθ lens is not required, and the processing cost can be further effectively reduced.

  Moreover, it is preferable that the workpiece processed by the laser light emitted from the auxiliary lens is an electronic circuit board. In this case, since the electronic circuit board can be processed by attaching the auxiliary lens to an inexpensive laser processing apparatus provided with a non-telecentric fθ lens, the processing cost of the electronic circuit board can be reduced.

  The laser processing apparatus of the present invention includes an fθ lens that is held by a head unit and collects laser light, and the laser processing lens that is additionally attached to the head unit and used for processing a workpiece. And a device.

  According to the laser processing apparatus of the present invention, since the laser processing lens device described above is detachably attached to the head portion, the light of the fθ lens can be obtained by attaching or detaching the laser processing lens device according to the processing application. The angle of the laser beam with respect to the axis can be changed. Therefore, the single laser processing apparatus can be used in accordance with a plurality of processing applications, and processing costs can be reduced.

  According to the present invention, the angle of the laser beam with respect to the optical axis of the fθ lens can be changed by attaching / detaching the auxiliary lens to / from the laser processing apparatus according to the processing application. Use according to a plurality of processing applications is possible, and processing costs can be reduced.

It is the schematic which shows the laser marker to which the lens apparatus for laser processing concerning one Embodiment of this invention is attached. It is a principal part enlarged view of the head part of a laser marker. It is the schematic which shows the state which attached the lens apparatus for laser processing to the laser marker. (A) is sectional drawing which shows the electronic circuit board after drilling with the laser marker which attached the lens apparatus for laser processing, (b) is a hole by the laser marker which has not attached the lens apparatus for laser processing. It is sectional drawing which shows the electronic circuit board after performing an opening process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing a laser marker as a laser processing apparatus to which a laser processing lens apparatus of the present invention is attached. The laser marker 1 prints characters and the like by heating the surface of a workpiece W such as resin or metal with laser light and locally changing or deforming the surface. The laser marker 1 includes a head unit 2 and a controller unit 3 that controls the head unit 2. The head unit 2 and the controller unit 3 are connected by a cable 4.

  FIG. 2 is an enlarged view of a main part of the head part 2 of the laser marker 1. The head portion 2 includes a box-shaped head main body portion 2a, a laser oscillator 2b that generates laser light, a galvano mirror 2c that deflects the laser light, a galvano scanner 2d that swings and drives the galvano mirror 2c, And an fθ lens 2e that condenses the laser beam deflected by the galvanometer mirror 2c and irradiates the workpiece W. The laser oscillator 2b, the galvano mirror 2c, and the galvano scanner 2d are built in the head main body 2a.

  The laser beam generated by the laser oscillator 2b is, for example, a CO2 (carbon dioxide gas) laser beam. The galvanometer mirror 2c deflects the laser beam output from the laser oscillator 2b at a predetermined deflection angle and swings it in the X-axis direction and the Y-axis direction on the surface of the workpiece W. The galvano scanner 2d can change the laser light incident position on the fθ lens 2e by swinging the galvano mirror 2c.

  The fθ lens 2e is held on the lower surface 2a1 of the tip of the head body 2a so that it cannot be removed from the head body 2a. The fθ lens 2e is a non-telecentric fθ lens, and the laser beam emitted from the fθ lens 2e is inclined with respect to the optical axis X of the fθ lens 2e depending on the beam deflection angle by the galvanometer mirror 2c. It has become.

  Therefore, the emitted laser beam is substantially parallel to the optical axis X when the deflection angle is small and close to the optical axis X, but the laser beam is emitted obliquely from the fθ lens 2e as the deflection angle increases. The By using this fθ lens 2e, the laser light deflected in various directions by the galvanometer mirror 2b is incident on the surface of the workpiece W, and is focused on the surface of the workpiece W. Desired characters and symbols can be printed. At this time, since the laser beam is emitted obliquely from the fθ lens 2e, printing can be performed even if the surface of the workpiece W is an uneven surface.

  FIG. 3 is a schematic view showing a state in which the laser processing lens device 10 of the present invention is attached to the laser marker 1 described above. This lens device 10 for laser processing is additionally attached to the laser marker 1, a lens holder 11 that is detachably attached to the head portion 2 of the laser marker 1, and an auxiliary lens attached to the lens holder 11. 12.

  The lens holder 11 has an upper holder portion 11a that is detachably fixed to the lower portion of the head portion 2, and a lower holder portion 11b that is fixed to the lower portion of the upper holder portion 11a. The upper holder portion 11a is formed in a cylindrical shape, and the inner peripheral diameter thereof is set to be slightly larger than the outer peripheral diameter of the fθ lens 2e.

  The lower holder part 11b is formed in a cylindrical shape, and its outer diameter is set to be approximately the same as the outer diameter of the upper holder part 11a. Moreover, the inner peripheral diameter of the lower holder part 11b is formed larger than the inner peripheral diameter of the upper holder part 11a.

  The auxiliary lens 12 changes the angle of the laser beam emitted from the fθ lens 2e with respect to the optical axis X, and has a characteristic of emitting as a telecentric laser beam. The auxiliary lens 12 includes a first lens portion 12a disposed immediately below the fθ lens 2e, a second lens portion 12b disposed at a predetermined interval below the first lens portion 12a, and a second lens portion 12b. And a third lens portion 12c disposed at a predetermined interval below. The first lens portion 12a has an outer peripheral portion fixed to the inner peripheral portion 11a1 of the upper holder portion 11a with the convex surface 12a1 facing downward.

  The second lens portion 12b has an outer peripheral portion fixed to the inner peripheral portion 11a1 of the upper holder portion 11a with the convex surface 12b1 facing downward. The thickness of the second lens portion 12b is set to be thicker than the thickness of the first lens portion 12a. In addition, the outer diameter of the second lens portion 12b is set to be substantially the same as the outer diameter of the first lens portion 12a.

  The third lens portion 12c has an outer peripheral portion fixed to the inner peripheral portion 11b1 of the lower holder portion 11b with the convex surface 12c1 facing downward. The thickness of the third lens portion 12c is set to be substantially the same as the thickness of the second lens portion 12b. The outer diameter of the third lens portion 12c is set larger than the outer diameter of the second lens portion 12b. Furthermore, the interval between the second lens portion 12b and the third lens portion 12c is set longer than the interval between the first lens portion 12a and the second lens portion 12b.

  The laser light emitted from the third lens portion 12c is emitted as telecentric laser light that is substantially parallel to the optical axis X. Thereby, the telecentric laser beam can be emitted by attaching the auxiliary lens 12 to the laser marker 1 having the non-telecentric fθ lens 2e. Therefore, the laser marker 1 to which the auxiliary lens 12 is attached can irradiate the workpiece W made of, for example, an electronic circuit board with a laser beam to perform a drilling process such as a blind via hole.

  4A is a cross-sectional view showing the electronic circuit board after drilling with the laser marker 1 to which the auxiliary lens 12 is attached, and FIG. 4B is a laser marker 1 to which the auxiliary lens 12 is not attached. It is sectional drawing which shows the electronic circuit board after performing a punching process by. In FIG. 4B, when the auxiliary lens 12 is not attached, the laser light emitted from the fθ lens 2e is angled with respect to the optical axis X, and therefore the blind via hole Hb angled with respect to the substrate surface. Is formed. Therefore, there is a possibility that a conductive portion (not shown) formed by plating the blind via hole Hb is disconnected. On the other hand, as shown in FIG. 4A, when the auxiliary lens 12 is attached, the laser light emitted from the auxiliary lens 12 is substantially parallel to the optical axis X, so that the substrate surface The vertical via hole Ha can be formed. Therefore, it is possible to avoid disconnection of the conductive portion.

  As described above, according to the laser processing lens device according to the embodiment of the present invention, the auxiliary lens 12 that changes the angle of the laser light emitted from the fθ lens 2e with respect to the optical axis X is used as the head of the laser processing device (laser marker 1). Since the unit 2 is detachably attached to the part 2 via the lens holder 11, the angle of the laser beam can be changed by detaching the auxiliary lens 12 according to the processing application. Therefore, the single laser processing apparatus can be used in accordance with a plurality of processing applications, and processing costs can be reduced.

Further, since the auxiliary lens 12 can be attached to the laser marker 1 that is particularly inexpensive among laser processing apparatuses, the processing cost can be effectively reduced.
Moreover, since the auxiliary lens 12 having the characteristic of emitting as telecentric laser light can be attached to an inexpensive laser processing apparatus including the non-telecentric fθ lens 2e, an expensive laser processing apparatus including the telecentric fθ lens is provided. It becomes unnecessary, and the processing cost can be further effectively reduced.
Moreover, since the electronic circuit board can be processed as the workpiece W by attaching the auxiliary lens 12 to an inexpensive laser processing apparatus including the non-telecentric fθ lens 2e, the processing cost of the electronic circuit board can be reduced. Can do.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the meanings described above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, in the above embodiment, if the auxiliary lens 12 can change the angle of the laser light emitted from the fθ lens 12, the shape and the number of attached lenses can be changed as appropriate.

1 Laser marker (laser processing equipment)
2 Head part 2e fθ lens 10 Lens device 11 for laser processing 11 Lens holder 12 Auxiliary lens W Work object X Optical axis

Claims (5)

A laser processing lens device that is additionally attached to a laser processing device that condenses laser light by an fθ lens held in a head portion and is used for processing a processing object,
An auxiliary lens that changes the angle of the laser beam emitted from the fθ lens with respect to the optical axis;
A lens holder that is mounted with the auxiliary lens and is detachably attachable to the head portion;
A lens device for laser processing, comprising:   The laser processing lens device according to claim 1, wherein the laser processing device is a laser marker. The fθ lens is a non-telecentric fθ lens;
The lens device for laser processing according to claim 1, wherein the auxiliary lens has a characteristic of emitting as a telecentric laser beam.   The laser processing lens device according to claim 3, wherein the object to be processed by the laser light emitted from the auxiliary lens is an electronic circuit board. An fθ lens that is held by the head and collects the laser beam;
The lens device for laser processing according to any one of claims 1 to 4, wherein the lens device is additionally attached to the head portion and used for processing a workpiece.
A laser processing apparatus comprising:

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