JP2011035055A - Work clamp and wire bonding device - Google Patents

Abstract

A work clamp capable of sufficiently suppressing oxidation of a bonding area without using a sliding window is provided.
A work clamp is provided under an internal hollow portion 14b, which is a space for performing a bonding operation, and under the internal hollow portion. A lower opening 14a for introducing one antioxidant gas, an upper opening 14c provided on the inner hollow portion to expose the bonding area, and an inner wall 14e covering the entire side of the inner hollow portion. And a first gas inlet for introducing a second antioxidant gas into the inner hollow portion, and an upper portion of the inner wall, the first gas inlet, And a second gas inlet for introducing a third antioxidant gas into the internal hollow portion.
[Selection] Figure 3

Description

  The present invention relates to a work clamp and a wire bonding apparatus using the work clamp, and more particularly to a work clamp and a wire bonding apparatus that can sufficiently suppress oxidation of a bonding area.

  FIG. 6 is a cross-sectional view for explaining a conventional wire bonding apparatus. This wire bonding apparatus performs wire bonding on a workpiece 9, and a lead frame 8 on which a bonding chip 7 is placed is a workpiece 9 to be bonded. A plurality of the workpieces 9 are conveyed by a rail (not shown) to perform wire bonding.

  The wire bonding apparatus has a heater plate 6 that heats the workpiece 9, and has a workpiece clamp 4 that clamps a plurality of workpieces 9 on the heater plate 6. The work clamp 4 is provided with a plurality of bonding area openings 4a. These bonding area openings 4a are openings that expose the bonding areas of the plurality of workpieces (that is, the bonding chip and the surrounding lead portions) when the plurality of workpieces 9 are clamped by the workpiece clamp 4.

  The work clamp 4 is provided with a space 4b located above the plurality of bonding area openings 4a, and a sliding window 5 located on the space 4b is disposed on the work clamp 4. The space 4b is a space for performing wire bonding work.

  The sliding window 5 is provided with a bonding work opening 5a and a teaching opening 5b. A bonding tool (capillary) 10 of a bonding head is disposed above the bonding work opening 5a. The bonding tool 10 performs wire bonding on the bonding area of the workpiece 9. An imaging means 11 is provided above the teaching opening 5b. The imaging means 11 recognizes the position of the workpiece 9 to be bonded through the teaching opening 5b. Note that each of the bonding work opening 5a and the teaching opening 5b is one work 9 or one line (a "row" is a direction perpendicular to the direction in which the work is conveyed by the rail). 9 is an opening having a size capable of bonding work or teaching.

  Further, since the heat generated by the heat of the heater plate 6 prevents the image pickup means 11 from recognizing the position of the workpiece 9, the wire bonding apparatus has an air blow mechanism (not shown) for removing heat.

  The bonding tool 10 of the bonding head, the imaging means 11, and the sliding window 5 are controlled so as to be integrally movable by a control unit (not shown). This control unit controls the position of the bonding head when wire bonding is performed on the workpiece 9.

  Further, the wire bonding apparatus has a mechanism for preventing oxidation of copper during wire bonding when the lead frame 8 is a bare copper lead frame or when the bonding wire is copper. This mechanism fills the space 4b of the work clamp 4 and the rail with an antioxidant gas such as an inert gas or a reducing gas (for example, nitrogen gas, mixed gas containing nitrogen, argon gas, etc.) This mechanism prevents the oxidation of the bare copper lead frame or the copper bonding wire by preventing the contamination.

A mechanism for preventing oxidation will be described in detail.
The heater plate 6 is provided with gas passages 6a and 6b. One end of the gas passage 6a is connected to the space 4b of the work clamp 4 through the opening of the lead frame 8, and one end of the gas passage 6b is connected to the rail. It is connected to the surroundings. The other ends of the gas paths 6a and 6b are connected to a gas supply source E that supplies an antioxidant gas. As a result, the antioxidant gas supplied from the gas supply source E passes through the gas path 6a, the opening of the lead frame 8, the space 4b, and the bonding operation opening 5a and the teaching opening 5b as indicated by arrows. While flowing outside, as shown by the arrow, it flows around the rail through the gas path 6 b and between the work clamp 4 and the heater plate 6.

  In the conventional wire bonding apparatus described above, the oxidation of the workpiece is prevented by flowing an antioxidant gas from the bottom to the top of the workpiece 9 (see, for example, Patent Document 1).

  By the way, in the conventional wire bonding apparatus, when performing wire bonding, as shown by the arrow, the antioxidant gas is blown out from the bonding work opening 5a, so that free air formed at the tip of the capillary 10 is formed. Ball eccentricity or variation in ball diameter may occur.

  The conventional wire bonding apparatus performs wire bonding work on the work 9 through the bonding work opening 5a of the slide window 5, and then moves the slide window 5 so that the bonding work is performed above the adjacent work 9. The opening portion 5a is positioned and the same wire bonding operation is repeated. For this reason, dust may be generated due to vibration when moving the sliding window 5 and rubbing of the movable part, and the dust may fall on the bonding area and adversely affect bonding.

  Moreover, in the said conventional wire bonding apparatus, since the air blow mechanism for removing a positive flame is used, air may be trapped in the space 4b of the work clamp 4 by air blow. As a result, the concentration of the antioxidant gas in the space 4b is lowered, and the antioxidant effect may be lowered.

Japanese Patent Laid-Open No. 2-112246 (lower left column on page 269 and FIG. 3)

  An object of one embodiment of the present invention is to provide a work clamp and a wire bonding apparatus that can sufficiently suppress oxidation of a bonding area without using a sliding window.

One aspect of the present invention is a work clamp used in a wire bonding apparatus,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A first gas inlet provided at an upper portion of the inner wall for introducing a second antioxidant gas into the inner hollow portion;
A second gas introduction port provided at an upper portion of the inner wall and provided at a position facing the first gas introduction port, for introducing a third antioxidant gas into the internal hollow portion; A first gas outlet for discharging the antioxidant gas from the inner hollow part;
It is a work clamp characterized by comprising.

  According to the work clamp, when wire bonding is performed, the first antioxidant gas is introduced from the lower side of the inner hollow portion toward the upper side, and the second gas is introduced from the first gas inlet port provided at the upper portion of the inner wall. By introducing the third antioxidant gas into the internal hollow portion from the second gas introduction port provided at a position opposite to the first gas introduction port. By filling the hollow portion with the antioxidant gas, the oxidation of the bonding area can be sufficiently suppressed.

  Further, according to the work clamp, when wire bonding is performed, the first antioxidant gas is introduced from the lower side of the inner hollow portion toward the upper side, and from the first gas inlet port provided at the upper portion of the inner wall. A second antioxidant gas is introduced into the inner hollow portion, and the second antioxidant gas is discharged from the inner hollow portion to a first gas discharge port provided at a position facing the first gas inlet. Thus, by filling the internal hollow portion with the antioxidant gas, the oxidation of the bonding area can be sufficiently suppressed.

In the work clamp according to one aspect of the present invention,
A first gas path having one end connected to the first gas inlet;
A third gas inlet connected to the other end of the first gas path and introducing the second antioxidant gas into the first gas path;
A second gas path having one end connected to the second gas inlet;
A fourth gas introduction port connected to the other end of the second gas path and introducing the third antioxidant gas into the second gas path, or the second antioxidant gas is connected to the second gas path. A second gas outlet for discharging from the gas path;
Comprising
The internal hollow portion may be located between the third gas introduction port and the fourth gas introduction port.

In the work clamp according to one aspect of the present invention,
The first gas introduction port is configured to introduce the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
The second gas introduction port introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces put in the lower opening, or The first gas discharge port sucks the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
The second direction is preferably opposite to the first direction.

One aspect of the present invention is a work clamp used in a wire bonding apparatus,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A first recess connected to the upper end of the inner wall and dug down to the upper surface of the work clamp;
A first gas cover provided on an upper surface of the work clamp and covering the first depression;
A first gas path having one end connected to the first depression;
A first gas inlet provided at the other end of the first gas path, for introducing a second antioxidant gas into the first gas path;
A second depression connected to the upper end of the inner wall, provided at a position facing the first depression, and dug down with respect to the upper surface of the work clamp;
A second gas cover provided on an upper surface of the work clamp and covering the second depression;
A second gas path having one end connected to the second depression;
A second gas introduction port provided at the other end of the second gas path for introducing a third antioxidant gas into the second gas path, or the second antioxidant gas as the second antioxidant gas. A gas outlet for exhausting from the gas path;
Comprising
The first space formed by the first recess and the first gas cover is for introducing the second antioxidant gas introduced into the first gas path into the internal hollow portion. Space,
The second space formed by the second depression and the second gas cover introduces the third antioxidant gas introduced into the second gas path into the internal hollow portion. Alternatively, the work clamp is a space for discharging the second antioxidant gas from the internal hollow portion.

In the work clamp according to one aspect of the present invention,
The first space introduces the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces placed in the lower opening,
The second space introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces put in the lower opening, or puts in the lower opening. The second antioxidant gas is sucked in a first direction crossing above the bonding areas of the plurality of workpieces, and the second direction is opposite to the first direction. preferable.

One aspect of the present invention is a work clamp used in a wire bonding apparatus,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A depression connected to the upper end of the inner wall, provided around the inner hollow portion, and dug down with respect to the upper surface of the work clamp;
A gas cover provided on an upper surface of the work clamp and covering the depression;
A first gas path having one end connected to the depression;
A first gas inlet provided at the other end of the first gas path, for introducing a second antioxidant gas into the first gas path;
A second gas path having one end connected to the recess and one end provided at a position facing one end of the first gas path;
A second gas introduction port provided at the other end of the second gas path for introducing a third antioxidant gas into the second gas path, or the second antioxidant gas as the second antioxidant gas. A gas outlet for exhausting from the gas path;
Comprising
The space formed by the recess and the gas cover introduces the second antioxidant gas introduced into the first gas path into the internal hollow portion and introduces it into the second gas path. The work clamp is a space for introducing the third antioxidant gas into the internal hollow portion or for discharging the second antioxidant gas from the internal hollow portion.

In the work clamp according to one aspect of the present invention,
One end of the first gas path introduces the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
One end of the second gas path introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces placed in the lower opening, or the lower opening The second antioxidant gas is sucked in a first direction crossing above the bonding area of the plurality of workpieces put in a part,
The second direction is preferably opposite to the first direction.

  In the work clamp according to one aspect of the present invention, it is preferable that the internal hollow portion is located between the first gas inlet and the second gas inlet or the gas outlet.

  In the workpiece clamp according to one aspect of the present invention, the plurality of workpieces placed in the lower opening may be workpieces arranged in two or more rows.

One aspect of the present invention is an apparatus that performs wire bonding to each of bonding areas of a plurality of workpieces,
A holding unit for holding the plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for bonding the plurality of workpieces while heating the plurality of workpieces by the heating mechanism;
Comprising
The work clamp is a wire bonding apparatus according to any one of the aspects described above.

  In the wire bonding apparatus according to one aspect of the present invention, the heating mechanism includes a heater plate, and the heater plate is supplied with the first antioxidant gas in the internal hollow portion through the lower opening. It is preferable that a gas supply path for supply is provided.

One aspect of the present invention is a holding unit that holds a plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
An internal hollow provided in the work clamp;
A gas introduction mechanism for introducing the first to third antioxidant gases into the internal hollow portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for performing a bonding operation in the internal hollow portion for each of the bonding areas of the plurality of workpieces;
Comprising
The work clamp is
A lower opening provided under the inner hollow portion, for entering bonding areas of the plurality of workpieces in the inner hollow portion;
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening,
The gas introduction mechanism is
When a bonding operation is performed by the bonding tool while heating the plurality of workpieces by the heating mechanism, a first antioxidant gas is introduced from the lower opening to the inner hollow portion through the lower opening, and Bonding of the plurality of workpieces introduced into the lower opening by introducing a second antioxidant gas in a first direction across the bonding area of the plurality of workpieces placed in the lower opening A wire bonding apparatus characterized in that a third antioxidant gas is introduced in a second direction crossing above the area, and the second direction is opposite to the first direction. is there.

One aspect of the present invention is a holding unit that holds a plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
An internal hollow provided in the work clamp;
A gas introduction mechanism for introducing the first and second antioxidant gases into the internal hollow portion;
A gas discharge mechanism for discharging the second antioxidant gas from the internal hollow portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for performing a bonding operation in the internal hollow portion for each of the bonding areas of the plurality of workpieces;
Comprising
The work clamp is
A lower opening provided under the inner hollow portion, for entering bonding areas of the plurality of workpieces in the inner hollow portion;
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening,
The gas introduction mechanism is
When performing a bonding operation by the bonding tool while heating the plurality of workpieces by the heating mechanism, the first antioxidant gas is introduced from the lower opening to the inner hollow portion through the lower opening, And a mechanism for introducing the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces placed in the lower opening,
The gas discharge mechanism is
In the wire bonding apparatus, the second antioxidant gas is discharged in a first direction crossing over the bonding areas of the plurality of workpieces placed in the lower opening.

  By applying one embodiment of the present invention, it is possible to provide a work clamp and a wire bonding apparatus that can sufficiently suppress oxidation of a bonding area without using a sliding window.

It is a top view for demonstrating the wire bonding apparatus by Embodiment 1. FIG. It is sectional drawing cut | disconnected along the 20-20 line shown in FIG. It is sectional drawing cut | disconnected along the 30-30 line shown in FIG. It is a top view for demonstrating the wire bonding apparatus by Embodiment 2. FIG. It is sectional drawing cut | disconnected along the 40-40 line shown in FIG. It is sectional drawing for demonstrating the conventional wire bonding apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a plan view for explaining the wire bonding apparatus according to the present embodiment. 2 is a cross-sectional view taken along line 20-20 shown in FIG. 3 is a cross-sectional view taken along the line 30-30 shown in FIG.

  The wire bonding apparatus according to the present embodiment performs wire bonding on a work 19, and a lead frame 18 on which a bonding chip 17 is placed is a work 19 to be bonded. A plurality of the workpieces 19 are conveyed by a rail (not shown) and wire bonding is performed. As shown in FIG. 1, two rows of bonding chips 17 are placed on the lead frame 18. Moreover, the wire bonding apparatus of this embodiment does not have a sliding window unlike the conventional wire bonding apparatus.

  As shown in FIGS. 2 and 3, the wire bonding apparatus includes a heater plate 3 that heats the workpiece 19, and a workpiece clamp 14 that clamps the plurality of workpieces 19 on the heater plate 3. The heater plate 3 is for heating the workpiece 19 to about 30 to 500 ° C. during wire bonding.

  The wire bonding apparatus has a mechanism for preventing copper oxidation during wire bonding when the lead frame 18 is a bare copper lead frame or when the bonding wire is copper. Details of this mechanism will be described later.

  The work clamp 14 has an internal hollow portion 14b as shown in FIGS. 2 and 3, and this internal hollow portion 14b is an inert gas or a reducing gas (for example, nitrogen gas, mixed gas containing nitrogen, argon gas, etc.). This is a space in which bonding work is performed on each of the bonding areas of the plurality of workpieces 19 in an atmosphere of an antioxidant gas such as Below the internal hollow portion 14b, a plurality of lower openings 14a are provided for inserting bonding areas of a plurality of workpieces 19 into the internal hollow portion 14b. As shown in FIG. 1, these lower openings 14 a serve as bonding areas (that is, bonding chips 17 and peripheral lead portions) of the plurality of workpieces 19 when the plurality of workpieces 19 are clamped by the workpiece clamp 14. It is an opening to be exposed. In other words, the lower opening 14 a is formed by the tip of a pressing part that presses the lead frame 18, and the tip of the pressing part presses while surrounding the bonding area of the lead frame 18.

  An upper opening 14c is provided on the inner hollow portion 14b, and the bonding areas of the plurality of workpieces 19 clamped by the upper opening 14c can be exposed through the inner hollow portion 14b. The planar shape of the upper opening 14c is a quadrangle as shown in FIG.

  The work clamp 14 has an inner wall 14e that covers the entire side of the inner hollow portion 14b located between the upper opening 14c and the lower opening 14a. The inner wall 14e has an inclined surface.

  A bonding tool (capillary) 10 of a bonding head is disposed above the upper opening 14 c, and this bonding tool 10 performs wire bonding on the bonding area of the work 19. An imaging unit 11 is provided above the upper opening 14c, and the imaging unit 11 recognizes the position of the workpiece 19 to be bonded through the upper opening 14c. The upper opening 14 c is an opening that can perform bonding work or teaching on the plurality of workpieces 19.

  The bonding tool 10 and the imaging means 11 of the bonding head are controlled to be movable by a control unit (not shown). This control unit controls the position of the bonding head when wire bonding is performed on the workpiece 19.

  As shown in FIGS. 2 and 3, the lower opening 14a has a first antioxidant gas that flows upward into the internal hollow portion from below as indicated by an arrow 21 even when a plurality of workpieces 19 are clamped by the workpiece clamp 14. An opening is formed for introduction toward. This opening is spatially connected to one end of a first gas path 16a provided in the heater plate 3, and the other end of the first gas path 16a is connected to a gas supply source A that supplies an antioxidant gas. It has been. Thus, during wire bonding, the first antioxidant gas supplied from the gas supply source A is, as indicated by arrows 22 and 21, the first gas path 16a, the opening of the lead frame 8, the lower opening 14a, It flows from the upper opening 14c to the outside of the work clamp 14 through the inner hollow portion 14b. That is, in the internal hollow portion 14b, the first antioxidant gas flows from the lower side to the upper side as indicated by the arrow 21 during wire bonding.

  The heater plate 3 is provided with a second gas path 16b as shown in FIG. One end of the second gas path 16b is connected to a space around the rail, and the other end of the second gas path 16b is connected to a gas supply source A that supplies an antioxidant gas. Thus, during wire bonding, the first antioxidant gas supplied from the gas supply source A passes between the second gas path 16b and the work clamp 14 and the heater plate 3 as indicated by an arrow 23. Flowed around the rail.

  As shown in FIGS. 2 and 3, the work clamp 14 is provided with a recess (concave portion or groove portion) 14 d that is dug down on the upper surface 14 f. The recess 14d is connected to the upper end of the inner wall 14e and is provided around the entire inner hollow portion 14b. That is, the depression 14d is formed so as to surround the upper opening 14c as shown in FIG.

  First and second gas covers 2a and 2b for covering the recess 14d are disposed on the upper surface of the work clamp. Specifically, as shown in FIG. 1, the first gas cover 2 a is positioned outside the bonding chip 17 in one row of the lead frame 18, and the second gas cover 2 b is connected to the lead frame 18. It is located outside the bonding chip 17 in the other row.

  As shown in FIG. 3, a space 14i is formed in the work clamp 14 by the recess 14d and the first gas cover 2a, and a space 14j is formed by the recess 14d and the second gas cover 2b. Yes.

  As shown in FIG. 3, the work clamp 14 is provided with a third gas path 16c having one end connected to a recess 14d, and the space 14i is a second gas path introduced into the third gas path 16c. This is a space for introducing an antioxidant gas into the internal hollow portion 14b. A first gas inlet 14g is provided at the other end of the third gas path 16c, and the first gas inlet 14g is introduced to introduce a second antioxidant gas into the third gas path 16c. The mouth. The first gas inlet 14g is connected to a gas supply source B that supplies the second antioxidant gas. Thereby, the second antioxidant gas supplied from the gas supply source B is formed by the third gas path 16c, the recess 14d and the first gas cover 2a as shown by an arrow 24 at the time of wire bonding. Is introduced into the inner hollow portion 14b through the space 14i. Specifically, when the second antioxidant gas is introduced from the third gas path 16c into the space 14i, the second antioxidant gas is caused to flow laterally or in the form of a curtain in the first gas cover 2a. , Introduced into the inner hollow portion 14b.

  As shown in FIG. 3, the work clamp 14 is provided with a fourth gas path 16d having one end connected to the recess 14d, and one end of the fourth gas path 16d is connected to the third gas path 16c. It is provided in the position facing one end of the. The space 14j is a space for introducing the third antioxidant gas introduced into the fourth gas path 16d into the internal hollow portion 14b. A second gas introduction port 14h is provided at the other end of the fourth gas path 16d, and the second gas introduction port 14h is used to introduce a third antioxidant gas into the fourth gas path 16d. This is the introduction port. The second gas inlet 14h is connected to a gas supply source B that supplies a third antioxidant gas. Thereby, at the time of wire bonding, the third antioxidant gas supplied from the gas supply source B is formed by the fourth gas path 16d, the recess 14d and the second gas cover 2b as indicated by an arrow 25. Is introduced into the internal hollow portion 14b through the space 14j. Specifically, when the third antioxidant gas is introduced from the fourth gas path 16d into the space 14j, the third antioxidant gas is caused to flow laterally or in a curtain shape in the second gas cover 2b. , Introduced into the inner hollow portion 14b.

  Further, as shown in FIG. 3, an internal hollow portion 14b is located between the first gas inlet 14g and the second gas inlet 14h.

  Further, at the time of wire bonding, the second antioxidant gas introduced from the third gas path 16c into the space 14i is introduced into the internal hollow portion 14b as indicated by an arrow 24 shown in FIG. At this time, as shown in FIG. 3, the second antioxidant gas is introduced in the first direction that crosses the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. The first direction is a direction substantially parallel to the surface of the lead frame 18 and is substantially perpendicular to the direction in which the first antioxidant gas flows.

  Further, at the time of wire bonding, the third antioxidant gas introduced into the space 14j from the fourth gas path 16d is introduced into the internal hollow portion 14b as indicated by an arrow 25 shown in FIG. As shown in FIG. 3, the third antioxidant gas introduction direction at this time is a second direction that crosses above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. The second direction is the direction opposite to the first direction, is substantially parallel to the surface of the lead frame 18, and is substantially perpendicular to the direction in which the first antioxidant gas flows.

Next, a method for suppressing the oxidation of the work clamp 14 will be described in detail.
When the workpiece 19 is heated by the heater plate 3 and bonding is performed, first to third antioxidant gases are introduced into the internal hollow portion 14b in order to suppress oxidation of the bonding wire, the bonding chip 17 and the lead frame 18. Use an antioxidant gas atmosphere. Specifically, the first antioxidant gas is introduced as indicated by the arrow 21 from the lower side toward the upper side through the lower opening 14a into the inner hollow part 14b, and bonding of the plurality of workpieces 19 placed in the lower opening 14a is performed. A second antioxidant gas is introduced as indicated by an arrow 24 in a first direction crossing over the area, and a second crossing over the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. A third antioxidant gas is introduced in the direction as indicated by arrow 25. The second direction is opposite to the first direction. And the 1st thru | or 3rd antioxidant gas introduced into the internal hollow part 14b is discharge | released outside from the upper opening part 14c.

  According to the above embodiment, the first to third antioxidant gases are introduced into the internal hollow portion 14b, and the internal hollow portion 14b is filled with the antioxidant gas, thereby sufficiently suppressing the oxidation of the bonding area. it can. More specifically, a second direction crossing the bonding area while introducing the second antioxidant gas in the form of a plane or a curtain in the first direction crossing the bonding area (opposite to the first direction). Direction), the third antioxidant gas is introduced in the form of a plane or curtain, so that the inside of the bonding area can be shielded from the outside air without using a conventional sliding window, and a copper bonding wire or bare copper Lead frame oxidation can be effectively suppressed.

  In addition, when the first antioxidant gas is introduced from the lower part to the upper part through the lower opening part 14a from the lower side to the upper part, there is no sliding window. Therefore, the first antioxidant gas is compared with the conventional wire bonding apparatus. It blows up to the upper opening which is a wide opening while reducing the flow velocity. For this reason, the influence on the free air ball formed at the tip of the capillary 10 can be reduced, and as a result, the occurrence of eccentricity of the free air ball or variation in the ball diameter can be suppressed.

  In the present embodiment, the second and third antioxidant gases introduced in a direction crossing the upper area of the bonding area can blow off the positive flame under the recognition lens that is the imaging means 11, and thus the antioxidant gas. Therefore, it is not necessary to use an air blow to remove the positive flame that has a negative effect on the antioxidant effect.

  Moreover, in this embodiment, since a sliding window is not required, the problem which arises with the dust which generate | occur | produces from the sliding window or the components which comprise it can be prevented.

  Further, in this embodiment, since oxidation of the bare copper lead frame can be prevented, it is not necessary to plate the lead surface, and the time and cost for the plating process can be reduced.

  It should be noted that the above embodiment can be implemented as the following modification.

(Modification 1)
In the above embodiment, the work clamp 14 is provided with the recess 14d dug down with respect to the upper surface 14f on the entire periphery of the inner hollow portion 14b as follows.

  The work clamp 14 is provided with first and second recesses dug down on the upper surface 14f thereof. Each of the first and second depressions is connected to the upper end of the inner wall 14e. The 1st hollow is provided in the position facing the 2nd hollow. A first gas cover 2a for covering the first recess is disposed on the upper surface of the work clamp 14, and a second gas cover 2b for covering the second recess is disposed on the upper surface of the work clamp 14. Has been. The first depression is not connected to the second depression.

  One end of the third gas path 16c is connected to the first recess, and one end of the fourth gas path 16d is connected to the second recess. The first space formed by the first recess and the first gas cover 2a is a space for introducing the second antioxidant gas introduced into the third gas path 16c into the internal hollow portion 14b. is there. The second space formed by the second recess and the second gas cover 2b is a space for introducing the third antioxidant gas introduced into the fourth gas path 16d into the internal hollow portion 14b. is there.

  In the first space, the second antioxidant gas is planarly or curtained in a first direction (in the direction of the arrow 24) crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. It is a space to introduce. The second space has a third direction in a second direction (a direction opposite to the first direction and in the direction of the arrow 25) crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. It is a space for introducing the antioxidant gas in the form of a plane or curtain.

  Also in the said modification 1, the effect similar to the said embodiment can be acquired.

(Modification 2)
In the embodiment described above, a recess 14d dug into the upper surface 14f of the work clamp 14, the first and second gas covers 2a, 2b for covering the recess 14d, and a first end connected to the recess 14d. 3 gas path 16c, a first gas introduction port 14g provided at the other end of the third gas path 16c, a fourth gas path 16d having one end connected to the recess 14d, and a fourth gas path The formation of the second gas inlet 14h provided at the other end of 16d is modified as follows without forming them.

  The work clamp 14 is provided with a third gas introduction port located at the upper part of the inner wall covering the entire side of the internal hollow portion 14b. The third gas introduction port is connected to the internal hollow portion 14b by the second gas introduction port. This is an inlet for introducing an antioxidant gas. In addition, the work clamp 14 is provided with a fourth gas introduction port located at the upper part of the inner wall that covers the entire side of the internal hollow portion 14b, and the fourth gas introduction port is provided with the third gas. It is an inlet for introducing a third antioxidant gas into the internal hollow portion 14b, provided at a position facing the inlet.

  The work clamp 14 is provided with a fifth gas path having one end connected to the third gas inlet, and the work clamp 14 has a fifth gas path connected to the other end of the fifth gas path. A gas inlet is provided. This fifth gas inlet is an inlet for introducing the second antioxidant gas into the fifth gas path. The work clamp 14 is provided with a sixth gas path having one end connected to the fourth gas inlet, and the work clamp 14 has a sixth gas path connected to the other end of the sixth gas path. Five gas inlets are provided. The sixth gas inlet is an inlet for introducing a third antioxidant gas into the sixth gas path. An internal hollow portion 14b is located between the fifth gas inlet and the sixth gas inlet.

  The third gas introduction port is configured to introduce the second antioxidant gas in a planar shape or a curtain shape in a first direction crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. This is the introduction port. The fourth gas introduction port faces the third antioxidant gas in a second direction (opposite to the first direction) crossing above the bonding area of the plurality of workpieces 19 put in the lower opening 14a. It is an introduction port for introducing into the shape or curtain.

  Also in the second modification, the same effect as in the above embodiment can be obtained.

(Modification 3)
In the above embodiment, the lead frame 18 on which two rows of bonding chips 17 are placed is used as a workpiece 19 to be bonded. The lead frame on which three or more rows of bonding chips are placed is referred to as a workpiece to be bonded. .

  In the third modification, the same effect as in the above embodiment can be obtained.

(Embodiment 2)
4 is a plan view for explaining the wire bonding apparatus according to the present embodiment, and FIG. 5 is a cross-sectional view taken along the line 40-40 shown in FIG. 4, which is the same as FIG. 1 to FIG. Parts are denoted by the same reference numerals, and only different parts will be described.

  As shown in FIG. 5, the space 14j formed by the recess 14d and the second gas cover 2b introduces the first or second antioxidant gas from the internal hollow portion 14b to the fourth gas path 16d. Space.

  Further, as shown in FIG. 5, a gas exhaust port 14k is provided at the other end of the fourth gas path 16d, and the gas exhaust port 14k is connected to the first or second oxidation from the fourth gas path 16d. It is an outlet for discharging the prevention gas. The gas discharge port 14k is connected to a discharge mechanism D such as a pump for discharging the antioxidant gas. Thereby, at the time of wire bonding, the first or second antioxidant gas in the inner hollow portion 14b passes through the space 14j and the fourth gas path 16d by the discharge mechanism D as shown by the arrow 25a, and the work clamp 14 Is discharged outside. An internal hollow portion 14b is located between the first gas inlet 14g and the gas outlet 14k.

  At the time of wire bonding, the second antioxidant gas introduced into the space 14i from the third gas path 16c is introduced into the internal hollow portion 14b in a planar shape or a curtain shape as indicated by an arrow 24 shown in FIG. The introduction direction of the second antioxidant gas at this time is a first direction crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a, as shown in FIG. The first direction is a direction substantially parallel to the surface of the lead frame 18 and is substantially perpendicular to the direction in which the first antioxidant gas flows.

  At the time of wire bonding, as shown in FIG. 4, the first or second antioxidant gas is sucked into the space 14j from the internal hollow portion 14b into a space or a curtain as indicated by an arrow 25a. The direction in which the second antioxidant gas is sucked is the first direction crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. Further, the first or second antioxidant gas sucked into the space 14j is discharged to the outside of the work clamp 14 from the gas discharge port 14k through the fourth gas path 16d as indicated by an arrow 25a shown in FIG. The

Next, a method for suppressing the oxidation of the work clamp 14 will be described in detail.
When the workpiece 19 is heated by the heater plate 3 for bonding, first and second antioxidant gases are introduced into the internal hollow portion 14b in order to suppress oxidation of the bonding wire, the bonding chip 17, and the lead frame 18. At the same time, the atmosphere of the antioxidant gas is obtained by discharging the first or second antioxidant gas from the internal hollow portion 14b. Specifically, the first antioxidant gas is introduced as indicated by the arrow 21 from the lower side toward the upper side through the lower opening 14a into the inner hollow part 14b, and bonding of the plurality of workpieces 19 placed in the lower opening 14a is performed. A second antioxidant gas is introduced in the form of a plane or a curtain as indicated by an arrow 24 in a first direction crossing the upper part of the area, and the first or second antioxidant gas is indicated by an arrow in the first direction. It is discharged in the form of a plane or curtain like 25a. At the same time, the first and second antioxidant gases introduced into the inner hollow portion 14b are also released to the outside from the upper opening 14c.

  In the second embodiment, the same effect as in the first embodiment can be obtained.

  In the present embodiment, the internal hollow portion 14b is oxidized by sucking the first or second antioxidant gas from the internal hollow portion 14b while introducing the first and second antioxidant gases into the internal hollow portion 14b. By being filled with the prevention gas, the oxidation of the bonding area can be sufficiently suppressed. Specifically, the first or second antioxidant gas is planarly introduced in the first direction while the second antioxidant gas is introduced planarly or in the form of a curtain in a first direction crossing over the bonding area. Alternatively, by sucking in a curtain shape, it is possible to create a gas flow in the first direction and prevent the outside air from being caught in the bonding area without using a sliding window of the prior art. The oxidation of the bear copper lead frame can be effectively suppressed.

  Further, in this embodiment, the oxidation of the bonding area can be sufficiently suppressed by a small amount of antioxidant gas as compared with the first embodiment. Therefore, the cost of the antioxidant gas can be reduced.

  In the present embodiment, the second antioxidant gas introduced in the direction crossing the upper part of the bonding area can blow off the positive flame under the recognition lens serving as the imaging means 11, so that the concentration of the antioxidant gas can be reduced. It is not necessary to use an air blow to remove the positive flame that lowers and adversely affects the antioxidant effect.

  It should be noted that the above embodiment can be implemented as the following modification.

(Modification 1)
In the above embodiment, the work clamp 14 is provided with the recess 14d dug down with respect to the upper surface 14f on the entire periphery of the inner hollow portion 14b as follows. In addition, the description of the same part as the modification 1 of Embodiment 1 is abbreviate | omitted.

  The second space formed by the second recess and the second gas cover 2b is a space for discharging the first or second antioxidant gas from the internal hollow portion 14b to the fourth gas path 16d. is there.

  In the second space, the first or second antioxidant gas is planarized in a first direction (in the direction of the arrow 25a) crossing above the bonding area of the plurality of workpieces 19 placed in the lower opening 14a. It is a space for inhaling in the form of a curtain.

  Also in the first modification, the same effect as in the second embodiment can be obtained.

(Modification 2)
In the embodiment described above, a recess 14d dug into the upper surface 14f of the work clamp 14, the first and second gas covers 2a, 2b for covering the recess 14d, and a first end connected to the recess 14d. 3 gas path 16c, a first gas introduction port 14g provided at the other end of the third gas path 16c, a fourth gas path 16d having one end connected to the recess 14d, and a fourth gas path The formation of the second gas inlet 14h provided at the other end of 16d is modified as follows without forming them. In this modification, the description of the same part as that of Modification 2 of Embodiment 1 is omitted.

  The work clamp 14 is provided with a third gas introduction port located at the upper part of the inner wall covering the entire side of the internal hollow portion 14b. The third gas introduction port is connected to the internal hollow portion 14b by the second gas introduction port. This is an inlet for introducing an antioxidant gas. In addition, the work clamp 14 is provided with a first gas discharge port located at the upper part of the inner wall that covers the entire side of the internal hollow portion 14b, and the first gas discharge port is the third gas discharge port. It is a discharge port that is provided at a position facing the introduction port and sucks the first or second antioxidant gas from the internal hollow portion 14b.

  The work clamp 14 is provided with a fifth gas path having one end connected to the third gas inlet, and the work clamp 14 has a fifth gas path connected to the other end of the fifth gas path. A gas inlet is provided. This fifth gas inlet is an inlet for introducing the second antioxidant gas into the fifth gas path. The work clamp 14 is provided with a sixth gas path having one end connected to the first gas discharge port. The work clamp 14 has a sixth gas path connected to the other end of the sixth gas path. Two gas outlets are provided. The second gas discharge port is a discharge port for discharging the first or second antioxidant gas from the sixth gas path. An internal hollow portion 14b is positioned between the fifth gas inlet and the second gas outlet.

  The third gas introduction port is configured to apply a second antioxidant gas in a planar shape or a curtain in a first direction (in the direction of an arrow 24) that crosses over the bonding area of the plurality of workpieces 19 put in the lower opening 14 a. It is an introduction port for introducing into the shape. The first gas discharge port faces the first or second antioxidant gas in a first direction (in the direction of arrow 25a) crossing above the bonding area of the plurality of workpieces 19 put in the lower opening 14a. It is a discharge port for discharging in the shape of a curtain or curtain.

  Also in the second modification, the same effect as in the second embodiment can be obtained.

(Modification 3)
In the above embodiment, the lead frame 18 on which two rows of bonding chips 17 are placed is used as a workpiece 19 to be bonded. The lead frame on which three or more rows of bonding chips are placed is referred to as a workpiece to be bonded. .

  Also in the third modification, the same effect as in the second embodiment can be obtained.

  Since the experiment for confirming the effects of the first and second embodiments was performed using the wire bonding apparatus shown in FIG. 1 to FIG. 3 or FIG. 4 and FIG. I will explain. The wire bonding apparatus includes a vertical movement mechanism (not shown) for bringing the heater plate 3 into contact with the lead frame 18.

(experimental method)
As shown in FIG. 1 to FIG. 3 or FIG. 4 and FIG. 5, the bare copper lead frame is clamped by the work clamp, and the first to third antioxidant gases are introduced into the inner hollow portion 14b, or While introducing the second antioxidant gas into the internal hollow portion 14b, the first or second antioxidant gas is discharged from the internal hollow portion 14b, and the lead frame 18 and the heater plate 3 are brought into contact with each other by the vertical movement mechanism, The heater plate 3 is heated at a temperature of 320 ° C. for 3 minutes, and then the heater plate 3 is lowered to release the contact between the heater plate 3 and the lead frame 18 to stop the heating by the heater plate 3 and left for 27 minutes. (During this time, the heater plate heating is operating, and the antioxidant gas from the heater plate 3 to the lower surface of the lead frame 18 is Supply was left went), then removed the lead frame to determine the state of oxidation, and the results are shown in Table 1. In Table 1, a lead frame determined not to be oxidized was described as “◯”, and a lead frame determined to be oxidized was described as “x”. Air blow was not performed during the wire bonding operation. Nitrogen gas was used as the first to third antioxidant gases. The flow rate of nitrogen gas was as shown in Table 1, and experiments under conditions 1 to 8 were performed with the gas flow rate varied.

  “PRE”, “MAIN”, “POST”, and “AROUND” shown in Table 1 mean that an antioxidant gas is allowed to flow from the bottom to the top of the bare copper lead frame. “MAIN” corresponds to the flow rate of the first antioxidant gas introduced into the internal hollow portion 14 b of the work clamp 14, and “PRE” conveys the bare copper lead frame below the work clamp 14 by the rail. This corresponds to the flow rate of the antioxidant gas introduced to the previous position. “POST” corresponds to the flow rate of the antioxidant gas introduced to the position immediately after the bare copper lead frame positioned below the work clamp 14 is conveyed by the rail, and “AROUND” is the inside of the work clamp 14. This corresponds to the flow rate of the antioxidant gas introduced around the heater plate 3 which is a hollow portion.

  The “COVER near side” shown in Table 1 corresponds to the flow rate of the second antioxidant gas introduced in the form of a curtain in the direction of the arrow 24 shown in FIG. 1, and the “COVER back side” is the arrow 25 shown in FIG. This corresponds to the flow rate of the third antioxidant gas introduced in a curtain shape in the direction of or the flow rate of the first or second antioxidant gas discharged in a curtain shape in the direction of the arrow 25a shown in FIG. The “determination” shown in Table 1 means that “O” means that no oxidation was observed in the bare copper lead frame, and “X” means that oxidation was observed in the bare copper lead frame.

  Regarding oxidation of the bear copper lead frame, no oxidation was observed under the conditions 1, 2, 3, 4 and 6. Therefore, when the flow rate of “PRE”, “MAIN”, and “POST” was 1 L / min or more, “AROUND ”Is 0.5 L / min or more,“ COVER near ”is 0.5 L / min or more, and“ COVER back ”is 0.5 L / min or more regardless of whether it is a jet or vacuum (suction). Then, it was confirmed that the effect of preventing the oxidation of the bare copper lead frame was obtained.

  Table 2 shows that the flow rates of “PRE”, “MAIN” and “POST” are 1.0 L / min, the flow rate of “AROUND” is 0.5 L / min, “COVER near side” and “COVER back side” respectively. The result of having measured the diameter of the initial ball (IB) formed by the bonding tool under the experimental condition where the flow rate is 1.0 L / min (spout) is shown. The number of measurements N is 20.

  Table 3 shows the result of measuring the diameter of the initial ball (IB) formed by the bonding tool in the experiment of Condition 4. The number of measurements N was 20, the flow rate on the “COVER near side” was 0.5 L / min, and the flow rate on the “COVER back side” was 0.5 L / min in vacuum.

  According to Table 2 and Table 3, Cpk was 1.33 or more, and it was confirmed that variation was suppressed. Therefore, it was confirmed that the occurrence of eccentricity of free air balls or variations in ball diameter can be suppressed. Cpk is a general numerical value for determining the production process capability index, and the concept is as follows.

Cpk> 1.67 High process capability 1.67>Cpk> 1.33 Process capability is 1.33>Cpk> 1.00 Process capability is not sufficient 1.00> Cpk Insufficient process capability

2a ... 1st gas cover 2b ... 2nd gas cover 3, 6 ... Heater plate 4, 14 ... Work clamp 4a ... Bonding area opening part 4b, 4b ... Space 5 ... Sliding window 5a ... Opening part 5b for bonding operation | work ... Teaching openings 6a, 6b ... gas path 7, 17 ... bonding tip 8, 18 ... lead frame 9, 19 ... work 10 ... bonding tool (capillary)
DESCRIPTION OF SYMBOLS 11 ... Imaging means 14a ... Lower opening part 14b ... Internal hollow part 14c ... Upper opening part 14d ... Indentation (concave part or groove part)
14e ... inner wall 14f ... upper surface 14g ... first gas inlet 14h ... second gas inlet 14i, 14j ... space 14k ... gas outlet 16a ... first gas path 16b ... second gas path 16c ... third Gas path 16d ... fourth gas path 21-25, 25a ... arrow

Claims (13)

In work clamps used in wire bonding equipment,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A first gas inlet provided at an upper portion of the inner wall for introducing a second antioxidant gas into the inner hollow portion;
A second gas introduction port provided at an upper portion of the inner wall and provided at a position facing the first gas introduction port, for introducing a third antioxidant gas into the internal hollow portion; A first gas outlet for discharging the antioxidant gas from the inner hollow part;
A work clamp characterized by comprising: In claim 1,
A first gas path having one end connected to the first gas inlet;
A third gas inlet connected to the other end of the first gas path and introducing the second antioxidant gas into the first gas path;
A second gas path having one end connected to the second gas inlet;
A fourth gas introduction port connected to the other end of the second gas path and introducing the third antioxidant gas into the second gas path, or the second antioxidant gas is connected to the second gas path. A second gas outlet for discharging from the gas path;
Comprising
The work clamp, wherein the internal hollow portion is located between the third gas introduction port and the fourth gas introduction port. In claim 1 or 2,
The first gas introduction port is configured to introduce the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
The second gas introduction port introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces put in the lower opening, or The first gas discharge port sucks the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
The work clamp, wherein the second direction is opposite to the first direction. In work clamps used in wire bonding equipment,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A first recess connected to the upper end of the inner wall and dug down to the upper surface of the work clamp;
A first gas cover provided on an upper surface of the work clamp and covering the first depression;
A first gas path having one end connected to the first depression;
A first gas inlet provided at the other end of the first gas path, for introducing a second antioxidant gas into the first gas path;
A second depression connected to the upper end of the inner wall, provided at a position facing the first depression, and dug down with respect to the upper surface of the work clamp;
A second gas cover provided on an upper surface of the work clamp and covering the second depression;
A second gas path having one end connected to the second depression;
A second gas introduction port provided at the other end of the second gas path for introducing a third antioxidant gas into the second gas path, or the second antioxidant gas as the second antioxidant gas. A gas outlet for exhausting from the gas path;
Comprising
The first space formed by the first recess and the first gas cover is for introducing the second antioxidant gas introduced into the first gas path into the internal hollow portion. Space,
The second space formed by the second depression and the second gas cover introduces the third antioxidant gas introduced into the second gas path into the internal hollow portion. Alternatively, the work clamp is a space for discharging the second antioxidant gas from the internal hollow portion. In claim 4,
The first space introduces the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces placed in the lower opening,
The second space introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces put in the lower opening, or puts in the lower opening. The second antioxidant gas is sucked in a first direction crossing above the bonding area of the plurality of workpieces, and the second direction is opposite to the first direction. Features a work clamp. In work clamps used in wire bonding equipment,
An internal hollow portion that is a space for performing bonding work on each of the bonding areas of a plurality of workpieces in an antioxidant gas atmosphere,
A lower opening provided under the inner hollow portion for entering a bonding area of the plurality of workpieces into the inner hollow portion, and a first antioxidant gas is introduced into the inner hollow portion from below to above. A lower opening for introduction,
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening;
A depression connected to the upper end of the inner wall, provided around the inner hollow portion, and dug down with respect to the upper surface of the work clamp;
A gas cover provided on an upper surface of the work clamp and covering the depression;
A first gas path having one end connected to the depression;
A first gas inlet provided at the other end of the first gas path, for introducing a second antioxidant gas into the first gas path;
A second gas path having one end connected to the recess and one end provided at a position facing one end of the first gas path;
A second gas introduction port provided at the other end of the second gas path for introducing a third antioxidant gas into the second gas path, or the second antioxidant gas as the second antioxidant gas. A gas outlet for exhausting from the gas path;
Comprising
The space formed by the recess and the gas cover introduces the second antioxidant gas introduced into the first gas path into the internal hollow portion and introduces it into the second gas path. A work clamp, wherein the work clamp is a space for introducing the third antioxidant gas into the internal hollow portion or discharging the second antioxidant gas from the internal hollow portion. In claim 6,
One end of the first gas path introduces the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces put in the lower opening,
One end of the second gas path introduces the third antioxidant gas in a second direction crossing above the bonding area of the plurality of workpieces placed in the lower opening, or the lower opening The second antioxidant gas is sucked in a first direction crossing above the bonding area of the plurality of workpieces put in a part,
The work clamp, wherein the second direction is opposite to the first direction.   The work clamp according to any one of claims 4 to 7, wherein the internal hollow portion is located between the first gas inlet and the second gas inlet or the gas outlet. .   9. The work clamp according to claim 1, wherein the plurality of works placed in the lower opening are works arranged in two or more rows. A device that performs wire bonding to each bonding area of a plurality of workpieces,
A holding unit for holding the plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for bonding the plurality of workpieces while heating the plurality of workpieces by the heating mechanism;
Comprising
10. The wire bonding apparatus according to claim 1, wherein the work clamp is the one described in any one of claims 1 to 9.   11. The heating mechanism according to claim 10, wherein the heating mechanism includes a heater plate, and the heater plate is provided with a gas supply path for supplying the first antioxidant gas to the internal hollow portion through the lower opening. The wire bonding apparatus characterized by the above-mentioned. A holding unit for holding a plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
An internal hollow provided in the work clamp;
A gas introduction mechanism for introducing the first to third antioxidant gases into the internal hollow portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for performing a bonding operation in the internal hollow portion for each of the bonding areas of the plurality of workpieces;
Comprising
The work clamp is
A lower opening provided under the inner hollow portion, for entering bonding areas of the plurality of workpieces in the inner hollow portion;
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening,
The gas introduction mechanism is
When a bonding operation is performed by the bonding tool while heating the plurality of workpieces by the heating mechanism, a first antioxidant gas is introduced from the lower opening to the inner hollow portion through the lower opening, and Bonding of the plurality of workpieces introduced into the lower opening by introducing a second antioxidant gas in a first direction across the bonding area of the plurality of workpieces placed in the lower opening The wire bonding apparatus is a mechanism for introducing a third antioxidant gas in a second direction crossing the upper area, wherein the second direction is opposite to the first direction. A holding unit for holding a plurality of workpieces;
A workpiece clamp for fixing the plurality of workpieces on the holding portion;
An internal hollow provided in the work clamp;
A gas introduction mechanism for introducing the first and second antioxidant gases into the internal hollow portion;
A gas discharge mechanism for discharging the second antioxidant gas from the internal hollow portion;
A heating mechanism for heating the plurality of workpieces;
A bonding tool for performing a bonding operation in the internal hollow portion for each of the bonding areas of the plurality of workpieces;
Comprising
The work clamp is
A lower opening provided under the inner hollow portion, for entering bonding areas of the plurality of workpieces in the inner hollow portion;
An upper opening provided on the inner hollow portion and exposing each of the bonding areas of the plurality of workpieces;
An inner wall covering the entire side of the internal hollow portion located between the upper opening and the lower opening,
The gas introduction mechanism is
When performing a bonding operation by the bonding tool while heating the plurality of workpieces by the heating mechanism, the first antioxidant gas is introduced from the lower opening to the inner hollow portion through the lower opening, And a mechanism for introducing the second antioxidant gas in a first direction crossing above the bonding area of the plurality of workpieces placed in the lower opening,
The gas discharge mechanism is
A wire bonding apparatus characterized by being a mechanism for discharging the second antioxidant gas in a first direction crossing above the bonding areas of the plurality of workpieces placed in the lower opening.

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