JP2011029365A - Semiconductor memory device, sheet-shaped substrate, housing-type semiconductor memory device, and method of manufacturing semiconductor memory device - Google Patents

Abstract

To provide a semiconductor memory device in which a circuit pattern and components to be mounted can be shared between a housing type semiconductor memory device and a module type semiconductor memory device.
A semiconductor memory device of the present invention includes a circuit board on which a circuit pattern is formed and can be stored in a housing, a non-volatile semiconductor memory mounted on the circuit board, and one end of the circuit board. And a connector for connecting to the host device, wherein a screw hole for inserting a screw for fixing the housing to the host device is formed at a corner of the housing. When the circuit board is housed in the housing with the center axis of the circuit board along the connector insertion direction being shifted from the center axis of the housing, the screw hole on the side where the circuit board is displaced A circuit pattern is formed to avoid the interference portion 4a of the circuit board that interferes with the screw that is inserted and protrudes to the inside of the housing, and the interference portion is cut away.
[Selection] Figure 4

Description

  The present invention relates to a semiconductor memory device, a sheet-like substrate, a housing type semiconductor memory device, and a method for manufacturing the semiconductor memory device.

  2. Description of the Related Art Conventionally, a semiconductor memory device that is used with a nonvolatile semiconductor memory such as a NAND flash memory is configured by mounting a nonvolatile semiconductor memory on a circuit board on which a circuit pattern is formed. In such a semiconductor memory device, a circuit pattern formed on a circuit board and an arrangement of components to be mounted may be made common or used for a plurality of external interfaces. For example, Patent Document 1 and Patent Document 2 disclose techniques for reducing development costs and manufacturing costs by sharing parts and the like.

  In recent years, a semiconductor memory device having a non-volatile semiconductor memory is used by being housed in a 2.5-inch type housing same as a hard disk drive (HDD) housing (hereinafter referred to as a housing-type semiconductor memory device), There is a case where it is used without being housed in a housing or the like (hereinafter referred to as a module type semiconductor memory device) in accordance with the MO-297 standard established by JEDEC (Joint Electron Engineering Engineering Council).

  However, the techniques disclosed in Patent Document 1 and Patent Document 2 do not take into account the requirements for housing a 2.5-inch type housing or the requirements based on the MO-297 standard. There is a problem that it is difficult to share the semiconductor memory device and the module type semiconductor memory device.

JP 2004-234440 A JP 2003-132668 A

  The present invention relates to a semiconductor memory device, a sheet-like substrate, a case-type semiconductor memory device, and a semiconductor memory device capable of sharing circuit patterns and mounted components between the case-type semiconductor memory device and the module-type semiconductor memory device. It aims at providing the manufacturing method of.

  According to one aspect of the present invention, a circuit board on which a circuit pattern is formed and can be stored in a housing, a non-volatile semiconductor memory mounted on the circuit board, and a host disposed on one end of the circuit board A semiconductor memory device including a connector connected to the device, wherein a screw hole for inserting a screw for fixing the housing to the host device is formed at a corner portion of the housing, and a connector insertion direction When the circuit board is housed in the housing with the center axis of the circuit board along the direction shifted from the center axis of the housing, screw holes formed in the corners on the side where the circuit board is displaced There is provided a semiconductor memory device characterized in that a circuit pattern is formed avoiding an interference portion of a circuit board that interferes with a screw that is inserted and protrudes to the inside of a housing.

  Moreover, according to one aspect of the present invention, there is provided a sheet-like substrate including a circuit board in which a circuit pattern is formed and can be stored in a housing, and a peripheral portion connected to the periphery of the circuit board, A non-volatile semiconductor memory can be mounted on the circuit board, and a connector for connecting to the host device can be disposed at one end. Screws for fixing the housing to the host device are provided at corners of the housing. When the circuit board is housed in the housing in which the screw hole to be inserted is formed and the center axis of the circuit board along the insertion direction of the connector is shifted from the center axis of the housing A circuit pattern is formed by avoiding an interference portion of a circuit board that interferes with a screw that is inserted into a screw hole formed at a corner portion on the side of the shifted direction and protrudes inside the housing. A shaped substrate is provided.

  Further, according to one aspect of the present invention, a semiconductor memory device in which a nonvolatile semiconductor memory is mounted on a circuit board on which a circuit pattern is formed, and a connector connected to the host device is disposed at one end of the circuit board; A housing for housing the semiconductor memory device therein, and a screw hole into which a screw for fixing the housing to the host device is inserted is formed at a corner of the housing. The central axis of the circuit board along the insertion direction is shifted with respect to the central axis of the housing, and the circuit board is inserted into a screw hole formed at a corner on the side where the semiconductor memory device is shifted. There is provided a housing type semiconductor memory device characterized in that an interference portion with a screw projecting to the inside of the housing is cut off, and a circuit pattern is formed avoiding the interference portion.

  Further, according to one aspect of the present invention, a circuit board on which a circuit pattern is formed, a nonvolatile semiconductor memory mounted on the circuit board, a connector that is disposed at one end of the circuit board and is connected to the host device, The center axis of the circuit board along the insertion direction of the connector is shifted with respect to the center axis of the casing in a casing in which a screw hole for inserting a screw for fixing to the host device is formed at the corner. A method of manufacturing a semiconductor memory device that can be stored in a different arrangement, and when a circuit board is stored in a housing, the circuit board is inserted into a screw hole formed in a corner portion on the side in which the circuit board is shifted. A sheet-like board is prepared, which includes a circuit board on which a circuit pattern is formed avoiding an interference portion of the circuit board that interferes with a screw protruding inside the casing, and a peripheral portion connected to the periphery of the circuit board. The circuit board is stored inside the body. When the circuit board is moved, the interference part of the circuit board that interferes with the screw that is inserted into the screw hole formed in the corner portion on the side where the circuit board is shifted and protrudes to the inside of the housing is cut off, and the periphery of the sheet board is removed. A method of manufacturing a semiconductor memory device is provided, wherein the part is separated.

  According to the present invention, since the circuit pattern is formed while avoiding the interference portion, the circuit pattern and the mounted components can be shared between the housing type semiconductor memory device and the module type semiconductor memory device.

FIG. 1 is a plan view of a semiconductor memory device, (a) a diagram showing a semiconductor memory device used in a module type semiconductor memory device, and (b) a diagram showing a semiconductor memory device used in a housing type semiconductor memory device. is there. FIG. 2 is a plan view showing the internal structure of the housing type semiconductor memory device. FIGS. 3A and 3B are partially enlarged perspective views in which the interference portion of the housing type semiconductor memory device is enlarged, in which FIG. 3A is a diagram illustrating a state in which no screw is inserted into the screw hole, and FIG. It is a figure which shows the state by which was inserted. FIG. 4 is a partially enlarged plan view in which the periphery of the interference part is enlarged in the circuit pattern shown in FIG. 5 is a cross-sectional view taken along line AA shown in FIG. 4, and (a) a diagram showing a circuit board 4 used in a module type semiconductor memory device, and (b) a case type semiconductor memory device. It is a figure which shows the circuit board used. FIG. 6 is a plan view of the sheet-like substrate. FIG. 7 is a block diagram showing a schematic configuration of the PC board processing apparatus of the semiconductor memory device. FIG. 8 is a flowchart for explaining a PC board processing step of the semiconductor memory device.

  Hereinafter, a semiconductor memory device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by this embodiment.

(First embodiment)
FIG. 1 is a plan view of a semiconductor memory device, (a) a diagram showing a semiconductor memory device used in a module type semiconductor memory device, and (b) a diagram showing a semiconductor memory device used in a housing type semiconductor memory device. is there. FIG. 2 is a plan view showing the internal structure of the housing type semiconductor memory device 20. In FIG. 2, in order to clarify an internal structure, it has shown with the cover removed.

  The module type semiconductor memory device 15 is a device that uses the semiconductor memory device 10 without being housed in a housing or the like in accordance with the MO-297 standard established by JEDEC (Joint Electron Engineering Engineering Council). That is, in the module type semiconductor memory device 15, the semiconductor memory device 10 itself becomes the module type semiconductor memory device 15. The housing-type semiconductor memory device 20 is a device in which the semiconductor memory device 10 is housed and used in a 2.5-inch housing 22 that is the same as the housing of a hard disk drive (HDD).

  The semiconductor memory device 10 includes a circuit board 4, a nonvolatile semiconductor memory 12, a controller 14, and a connector 16. The nonvolatile semiconductor memory 12, the controller 14, and the connector 16 are mounted on the circuit board 4. The circuit board 4 has a multilayer structure formed by overlapping synthetic resins, and has an eight-layer structure in the first embodiment. On the circuit board 4, circuit patterns are formed in various shapes on the surface or inner layer of each layer made of synthetic resin. The nonvolatile semiconductor memory 12 mounted on the circuit board 4, the controller 14, and the connector 16 are electrically connected via a circuit pattern formed on the circuit board 4.

  The nonvolatile semiconductor memory 12 is, for example, a NAND flash memory. By configuring the semiconductor memory device 10 using the nonvolatile semiconductor memory 12 such as a NAND flash memory, it is possible to improve the data reading performance, the impact resistance performance, and the power consumption. In the first embodiment, four nonvolatile semiconductor memories are arranged on one surface of the circuit board 4. One controller 14 for controlling the nonvolatile semiconductor memory 12 is disposed on the other surface of the circuit board 4. The connector 16 is disposed at one end of the circuit board 4. The connector 16 is an interface for connecting the host device such as a computer and the semiconductor memory device 10. The shape of the connector 16 is determined so as to comply with, for example, the SATA standard which is a connection interface standard.

  The semiconductor memory device 10 for the module type semiconductor memory device 15 and the semiconductor memory device 10 for the housing type semiconductor memory device 20 are different in part of the shape of the circuit board 4 constituting the semiconductor memory device 10. Specifically, a part of the circuit board 4 of the semiconductor memory device 10 for the housing type semiconductor memory device 20 is cut away to form a notch 7.

  As shown in FIG. 2, when used in the housing type semiconductor memory device 20, the semiconductor memory device 10 is arranged such that the central axis AX is shifted from the central axis BX of the housing 22. This is because the position of the connector 16 with respect to the housing 22 is determined by a predetermined standard such as Serial ATA Revision 2.6, so that a deviation occurs between the central axis AX and the central axis BX. By shifting the central axis AX and the central axis BX, one side of the circuit board 4 approaches the wall surface of the housing 22.

  3 is a partially enlarged perspective view in which the interference portion of the housing type semiconductor memory device 20 is enlarged, (a) a view showing a state in which no screw is inserted into the screw hole, and (b) from the side to the screw hole. It is a figure which shows the state in which the screw was inserted. When the housing-type semiconductor memory device 20 is fixed to a host device such as a computer, a fixing screw (housing fixing means) 24 is inserted from the side or bottom side of the housing 22. In order to insert the screws 24, screw holes 22a are formed in the corners of the housing 22 on the side and bottom sides, respectively.

  The screw 24 inserted into the screw hole 22 a on the direction side where the central axis AX of the semiconductor memory device 10 is shifted protrudes to the inside of the housing 22 and a part of the circuit board 4 close to the wall surface of the housing 22 (interference) Part 4a).

  In the circuit board 4 used in the housing type semiconductor memory device 20, the interference portion 4a is cut away and the notch 7 is formed, so that the actual interference between the screw 24 and the circuit board 4 can be avoided. . Therefore, it is possible to prevent the circuit board 4 from being broken or bent due to the interference with the screw 24. Specifically, the notch 7 is formed on one side close to the wall surface of the housing 22 and in the vicinity of the connector 16 when the semiconductor memory device 10 is accommodated in the housing 22.

  On the other hand, the external dimensions of the module type semiconductor memory device 15 are defined by, for example, JEDEC MO-297 standard. Since the module type semiconductor memory device 15 is used without housing the semiconductor memory device 10 in a housing, the outer dimensions and the like of the semiconductor memory device 10 itself are defined. Thereby, the external dimensions and the like of the circuit board 4 constituting the semiconductor memory device 10 are also defined.

  The JEDEC MO-297 standard specifies that a hole 4 c is provided in a portion corresponding to the notch 7. Therefore, it is difficult to form the notch 7 in the circuit board 4 in the module type semiconductor memory device 15. However, in the module type semiconductor memory device 15, since the semiconductor memory device 10 is not housed in the housing 22, the interference with the screw 24 does not become a problem even when the notch 7 is not formed. The hole 4c is used when the module type semiconductor memory device 15 is fixed to a host device such as a computer by using a screw. In the housing type semiconductor memory device 20, the semiconductor memory device 10 is fixed to the housing 22 using a hole 4 d formed in the vicinity of the hole 4 c.

  Next, the configuration of the circuit pattern 17 formed on the circuit board 4 will be described. FIG. 5 is a partially enlarged plan view in which the periphery of the interference portion 4a is enlarged. 5 is a cross-sectional view taken along line AA shown in FIG. 4, and (a) a diagram showing a circuit board 4 used in the module type semiconductor memory device 15, and (b) a case type semiconductor memory device. 2 is a diagram showing a circuit board 4 used in FIG. The circuit pattern 17 is made of a conductive metal material such as copper. The circuit pattern 17 is formed over substantially the entire area of the circuit board 4 in plan view, but is formed so as to avoid the interference portion 4a as shown in FIG. Further, an interval (resin region in which no circuit pattern is formed) Y is provided between the cutting line (the forming line of the notch 7) and the circuit pattern 17 when the interference portion 4a is cut off, and the first embodiment In the form, Y = 0.5 mm. Here, in the semiconductor memory device 10, the screw is inserted into the hole 4 c and the circuit pattern 17 may be contacted to perform grounding. By suppressing the distance Y to a predetermined distance, the screw head and the circuit pattern 17 can be brought into contact with each other, and grounding can be performed.

  The circuit pattern 17 is also formed on another layer different from the layer shown in FIG. 4, and FIG. 4 only shows an example. Also, in all layers different from the layers shown in FIG. 4, the circuit pattern 17 is formed avoiding the interference portion 4a, and the interval Y is also provided. In addition, each device such as the nonvolatile semiconductor memory 12 is not arranged in the interference unit 4a.

  As shown in FIG. 5B, since a predetermined interval Y is provided between the cutting line when the interference portion 4a is cut off and the circuit pattern 17, the edge portion 4b when the interference portion 4a is cut off. The circuit pattern 17 is not exposed.

  FIG. 6 is a plan view of the sheet-like substrate. The sheet substrate 2 includes a circuit board 4 and a peripheral portion 6. The peripheral portion 6 is provided so as to surround the periphery of the circuit board 4, and is connected to the circuit board 4 through the connecting portion 8. The peripheral portion 6 surrounds the periphery of the circuit board 4 having an uneven outer shape, and the outer shape as the sheet-like substrate 2 is formed into a substantially square shape, whereby the circuit board 4 is handled when the nonvolatile semiconductor memory 12 is mounted. Improve sexiness.

  Further, a discrimination portion 9 is formed on the circuit board 4 (see also FIG. 1). The determination unit 9 is formed to determine whether the circuit board 4 is used for the module type semiconductor memory device 15 or the case type semiconductor memory device 20. The determination unit 9 can also manage information necessary for manufacturing such as a lot number of components mounted on the circuit board 4. The determination unit 9 is, for example, a two-dimensional code printed so as to be readable from the surface of the circuit board 4. The determination unit 9 is printed with a marker or the like before the nonvolatile semiconductor memory 12 or the like is mounted. The determination unit 9 is formed avoiding the position where the nonvolatile semiconductor memory 12 or the like is mounted, and can be read after the nonvolatile semiconductor memory 12 or the like is mounted. Note that the determination unit 9 only needs to be able to determine whether the semiconductor memory device 10 is used for the module type semiconductor memory device 15 or the case type semiconductor memory device 20, and is limited to a two-dimensional code. I can't. For example, a barcode or an IC chip may be used. Further, it may be a difference in shape such as unevenness formed on the circuit board 4. Further, the determination unit 9 may be formed at a place other than the illustrated position. For example, it may be printed on the surface of each device such as the nonvolatile semiconductor memory 12.

  The nonvolatile semiconductor memory 12 and the controller 14 are mounted on the circuit board 4 in the state of the sheet-like board 2 to which the peripheral part 6 is connected. The semiconductor memory device 10 can be obtained from the sheet-like substrate 2 by cutting the connecting portion 8 using a drill of a dividing machine to cut the peripheral portion 6. The notch 7 of the circuit board 4 is formed when the connecting portion 8 is cut. In the first embodiment, by separating the peripheral portion 6 from the sheet-like substrate 2 on which the nonvolatile semiconductor memory 12 and the controller 14 are mounted, four semiconductor memory devices 10 are formed from one sheet-like substrate 2. Obtainable. Note that the number of semiconductor memory devices 10 that can be obtained from one sheet-like substrate 2 is not limited to four, and a larger sheet-like substrate is used to make more semiconductor memory devices 10 one sheet-like substrate. You may comprise so that it can obtain from. Moreover, you may comprise so that the one semiconductor memory device 10 can be obtained from one sheet-like board | substrate.

  FIG. 7 is a block diagram showing a schematic configuration of a PC board processing apparatus (manufacturing apparatus) of the semiconductor memory device 10. The PC plate processing apparatus 30 includes a drill 31, a reading unit 33, and a control unit 34. The drill 31 functions as a cutting portion that cuts the connecting portion 8 of the sheet-like substrate 2 or cuts the interference portion 4a. The reading unit 33 reads the determination unit 9 to determine whether the circuit board 4 is used for the module type semiconductor memory device 15 or the case type semiconductor memory device 20. The control unit 34 automatically reads the processing data based on the determination result by the reading unit 33 and controls the drill 31 to cut the coupling unit 8 or cut the interference unit 4a.

  FIG. 8 is a flowchart for explaining a PC board processing step of the semiconductor memory device 10. First, the non-volatile semiconductor memory 12, the controller 14, and the connector 16 are mounted on the sheet-like substrate 2 (step S1). Next, the determination unit 9 is read, and machining data is automatically read based on the determination result (step S2). When it is determined that the circuit board 4 is used for the housing type semiconductor memory device 20 (step S3, Yes), the connecting portion 8 is cut, and the interference portion 4a is cut away by a drill. 7 is formed (step S4). Thereby, four semiconductor memory devices 10 in which the notches 7 are formed from one sheet-like substrate 2 are obtained.

  If it is determined in step S3 that the circuit board 4 is not used for the housing type semiconductor memory device 20 but is used for the module type semiconductor memory device 15 (step S3, No), the notch 7 is not formed, but the connecting portion 8 is cut (step S5). As a result, four semiconductor memory devices 10 in which notches 7 are not formed from one sheet-like substrate 2 are obtained. Note that the step of forming the notch 7 and the step of cutting the connecting portion 8 may be performed in separate steps, and either step may be performed first.

  As described above, the circuit pattern 17 is formed so as to avoid the interference portion 4a of the circuit board 4, and each device such as the nonvolatile semiconductor memory 12 is also arranged so as to avoid the interference portion 4a. Regardless of whether it is used or the case of the housing type semiconductor memory device 20, the circuit pattern 17 of the circuit board 4 and the arrangement of each device can be made common. That is, the circuit pattern 17 of the circuit board 4 and the arrangement of each device can be made common regardless of the presence or absence of the notch 7. Thereby, the design cost of arrangement of the circuit pattern 17 and each device can be suppressed. In addition, since mounting evaluation and performance evaluation can be made common, the evaluation cost can be suppressed. In addition, since each device to be mounted can be shared, the selection cost of each device can be reduced. Further, when the semiconductor memory device 10 is used for the module type semiconductor memory device 15, the notch 7 is not formed, so that the formation of the hole 4c required by the MO-297 standard can be satisfied. When used in the body-type semiconductor memory device 20, interference between the screw 24 and the circuit board 4 can be avoided by forming the notch 7.

  Further, since the circuit pattern 17 is formed so as to avoid the interference portion 4a, it is not necessary to cause the drill 31 to cut the circuit pattern 17 when the notch 7 is formed. Thereby, when forming the notch 7, since only the resin can be cut by the drill 31, the life of the drill 31 can be extended. Further, as shown in FIG. 5B, since the circuit pattern 17 is not exposed at the edge 4b when the interference part 4a is cut, metal burrs are hardly generated at the edge 4b. Thereby, it can suppress that the problem that a metal burr short-circuits between the circuit patterns 17 formed between each layer of the circuit board 4 generate | occur | produces. Further, it is possible to prevent the metal burr from being detached from the circuit board 4 and causing a problem such as a short circuit in another place.

  In the first embodiment, when the peripheral portion 6 is cut off from the sheet-like substrate 2, the interference portion 4a is cut away to form the cutout 7. However, the present invention is not limited to this. For example, when the peripheral portion 6 is cut off, the notched portion 7 is not formed and stocked as the module type semiconductor memory device 15 and later used in the housing type semiconductor memory device 20. The notch 7 may be formed by cutting off the.

  In the first embodiment, the PC board processing apparatus of the semiconductor memory device has been described as an example. However, the present invention is not limited to this. For example, the semiconductor memory device manufacturing process may be provided as a manufacturing program for causing a manufacturing apparatus such as a divider to perform the manufacturing process.

  AX, BX central axis, Y interval, 2 sheet-like substrate, 4 circuit board, 4a interference part, 4b edge part, 4c, 4d hole, 6 peripheral part, 7 notch, 8 connecting part, 9 discriminating part, 10 semiconductor memory Device, 12 nonvolatile semiconductor memory, 14 controller, 15 module type semiconductor memory device, 16 connector, 20 housing type semiconductor memory device, 22 housing, 22a screw hole, 24 screw (housing fixing means), 30 PC board processing device , 31 drill, 33 reading unit, 34 control unit

Claims (5)

A circuit board on which a circuit pattern is formed, a nonvolatile semiconductor memory mounted on the circuit board, and a connector that is disposed at one end of the circuit board and is connected to the host device, and is fixed to the host device In a case where a screw hole into which a screw is inserted is formed at a corner, the central axis of the circuit board along the insertion direction of the connector can be stored in an arrangement shifted from the central axis of the case. A semiconductor memory device,
When the circuit board is housed in the housing, the circuit interferes with a screw that is inserted into the screw hole formed at a corner portion on the side in which the circuit board is displaced and protrudes to the inside of the housing. A semiconductor memory device, wherein the circuit pattern is formed to avoid an interference portion of a substrate. A circuit board having a circuit pattern formed therein and capable of being stored in a housing, and a sheet-like board having a peripheral portion connected to the periphery of the circuit board,
The circuit board can be mounted with a non-volatile semiconductor memory and a connector connected to the host device can be disposed at one end.
A screw hole into which a screw for fixing the casing to the host device is inserted is formed at the corner of the casing,
When the circuit board is housed in the housing in an arrangement in which the center axis of the circuit board along the insertion direction of the connector is shifted from the center axis of the housing, the direction side in which the circuit board is displaced The circuit pattern is formed so as to avoid an interference portion of the circuit board that interferes with a screw that is inserted into the screw hole formed in a corner portion of the housing and protrudes to the inside of the housing. substrate. A non-volatile semiconductor memory is mounted on a circuit board on which a circuit pattern is formed, and a semiconductor memory device in which a connector for connecting to a host device is disposed at one end of the circuit board;
A housing for housing the semiconductor memory device therein,
A screw hole into which a screw for fixing the casing to the host device is inserted is formed at the corner of the casing,
The semiconductor memory device is disposed in the housing by shifting the central axis of the circuit board along the insertion direction of the connector with respect to the central axis of the housing,
The circuit board is inserted into the screw holes formed at the corners on the side where the semiconductor memory device is shifted, and an interference portion with the screw protruding to the inside of the housing is removed, and the interference portion is removed. A housing type semiconductor memory device characterized in that the circuit pattern is formed to avoid.   4. The housing type semiconductor memory device according to claim 3, wherein the circuit pattern is formed on the circuit board so as to avoid an edge portion of a notch portion where the interference portion is cut off. 5. A circuit board having a circuit pattern formed thereon, a non-volatile semiconductor memory mounted on the circuit board, and a connector disposed at one end of the circuit board and connected to the host device, and fixed to the host device. Can be housed in a housing in which a screw hole for inserting a screw is inserted in a corner portion, with the center axis of the circuit board being shifted from the center axis of the housing along the insertion direction of the connector A method of manufacturing a semiconductor memory device,
When the circuit board is housed in the housing, the circuit interferes with a screw that is inserted into the screw hole formed at a corner portion on the side in which the circuit board is displaced and protrudes to the inside of the housing. Creating a sheet-like substrate comprising the circuit board on which the circuit pattern is formed while avoiding an interference part of the substrate, and a peripheral part connected to the periphery of the circuit board;
When the circuit board is housed in the housing, the circuit interferes with a screw that is inserted into the screw hole formed at a corner portion on the side in which the circuit board is displaced and protrudes to the inside of the housing. Cut off the interference part of the substrate,
A method of manufacturing a semiconductor memory device, wherein the peripheral portion is separated from the sheet-like substrate.

Images