JP2011020212A - Device and method for processing substrate, and method for manufacturing processed substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for processing a substrate which can smooth a surface of the substrate after the processing and is simple in construction, a method for processing the substrate using the device for processing the substrate, and a method for manufacturing the processed substrate using the method for processing the substrate. <P>SOLUTION: The device for processing the substrate has an injection member 12 for abrasive grains 12a arranged in such a way that the angle between an injection direction of the abrasive grains 12a and a processing surface of the substrate 1 becomes equal to an angle at the brittle mode processing. An injection direction alteration member 18 is disposed between the injection member 12 in the injection direction of the abrasive grains 12a and the processing surface of the substrate 1, and can change an approaching angle of the abrasive grains 12a to the processing surface of the substrate 1 from the angle at the brittle mode processing to the angle at ductile mode processing. The injection direction alteration member 18 is movable. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus, a substrate processing method, and a processed substrate manufacturing method. More specifically, the substrate surface after processing can be made smooth (mirror surface) and is simple, a substrate processing device, a substrate processing method using the processing device, and a processed substrate using the processing method It is related with the manufacturing method.

  Conventionally, in order to form a concave portion on the surface of a substrate for the purpose of correcting a defect of the substrate or the like, it is common to perform processing of the substrate, for example, blasting.

  For example, regarding a glass substrate, one of the requirements for a glass substrate accompanying a recent increase in screen size is a reduction in defects in the glass substrate. Here, the defect of a glass substrate means internal defects, such as an internal bubble and an internal foreign material, and surface defects, such as a processus | protrusion and a damage | wound formed in the surface.

  When a flat display is formed using a glass substrate having defects, display defects such as bright spots and black spots occur in the vicinity of the defects. For example, when an internal bubble having a certain size (for example, a diameter of 100 μm or more) is present, the vicinity thereof is observed as a bright spot. The mechanism by which the bright bubbles are generated by the internal bubbles is not necessarily clear, but the presence of the internal bubbles may cause the lens effect due to the glass around the internal bubbles and the disorder of the polarization state due to the stress remaining on the glass around the internal bubbles. It is thought to be the cause. Further, even when a certain amount of internal foreign matter exists, black spots may be generated when the internal foreign matter is made of a light-shielding material. Further, surface defects such as protrusions and scratches may cause a fine refracting surface or reflecting surface to be formed in a direction different from the original surface of the glass substrate, resulting in bright spots due to these. Therefore, it is desirable that the glass substrate has as few defects as possible.

  Here, the cause of the defect of the glass substrate will be described.

  The internal bubbles are generated when bubbles are formed in the melted glass material due to entrainment of air, release of gas from the refractory material, or the like in the step of melting the glass material when manufacturing the glass substrate. Furthermore, depending on the glass raw material used, there is a glass raw material itself that generates gas. Such internal bubbles exist with a certain probability depending on the volume, and it is not easy to reduce the probability. In addition, when the position of the bubble which exists in a glass substrate is near the surface, a processus | protrusion (a rise and a wave | undulation are included) may be accompanied on the surface of a glass substrate.

  There are two types of internal foreign matters, one caused by raw materials and the other caused by external contamination. Examples of the internal foreign matters resulting from the raw materials include those that have been made foreign due to the glass raw material remaining undissolved, and hardly soluble foreign matters that have been mixed in the glass raw material. Moreover, as contamination from the outside, there is a material that has become a foreign substance when the refractory material used when melting the glass raw material is mixed into the glass. In addition, when the position of the foreign material which exists in a glass substrate is near the surface, a processus | protrusion (a swelling and a wave | undulation) may be accompanied on the surface of a glass substrate like an internal bubble.

  As described above, the protrusion formed on the surface of the glass substrate is a surface defect caused by internal bubbles or internal foreign matter.

  Moreover, the damage | wound formed in the surface of a glass substrate arises when glass substrates contact in the process of cutting out a glass substrate from a large sized glass plate called an original plate and performing a periphery process.

  By the way, although it is not a technique for coping with the defect of the glass substrate, in order to eliminate the bright spot defect caused by the defective pixel, a recess is formed in a region corresponding to the defective pixel in the glass substrate, and the recess There is known a technique for preventing light leakage by filling a light-blocking resin into the film (for example, see Patent Documents 1 and 2).

  Also known is a polishing apparatus that removes minute protrusions formed on a color filter of a liquid crystal display panel by grinding (for example, see Patent Document 3).

Japanese Patent Laid-Open No. 5-210074 (Release Date August 20, 1993) JP 2005-189360 A (publication date: July 14, 2005) JP-A-6-313871 (publication date November 8, 1994)

  However, the conventional substrate processing method has a problem that it is difficult to correct a defect of the substrate.

  Therefore, although it is ideal to use a substrate without defects, it is impossible to manufacture such a substrate. Even if the generation of defects can be reduced to a certain extent by reviewing the manufacturing process of the substrate, there is a limit.

  On the other hand, if all of the substrates including defects are defective, this leads to a problem of a decrease in yield and an increase in substrate cost. In particular, a large glass substrate corresponding to a large screen is prone to include defects stochastically, so the problem of yield reduction is serious.

  Therefore, there is a demand for a technique for improving the quality of a manufactured substrate by performing processing for correcting it even if the manufactured substrate contains a defect.

  Such a requirement is common to general substrates such as glass substrates constituting flat display panels such as liquid crystal display panels and plasma display panels. However, glass for liquid crystal display panels is particularly used for the following reasons. This is noticeable in the substrate.

  It is necessary to form a semiconductor element on the surface of a glass substrate for a liquid crystal display panel, and the semiconductor element is easily affected by alkali metals. Therefore, it is common to use an alkali-free glass that does not contain an alkali metal as an additive component (the alkali metal as an impurity is 1% or less) as a glass substrate for a liquid crystal display panel. However, since the alkali-free glass has a high melting point, the alkali-free glass is difficult to remove bubbles when the glass raw material is melted, and internal bubbles are likely to remain. Therefore, since the glass substrate for liquid crystal display panels tends to include defects as internal bubbles, there is a particularly high demand for a technique for improving the quality of the substrate by correcting the defects.

  Further, in order to solve the above-mentioned problem, at least one of powder or fluid is sprayed onto a portion where the defect to be corrected formed on the substrate is located, and an area including at least the defect to be corrected from the substrate In order to remove the material, there is a technique for performing brittle processing.

  However, the technique for performing the brittle processing has a problem that the processed substrate surface cannot be smoothed.

  Here, in order to smooth the substrate surface after processing, it is conceivable to perform ductile processing after brittle processing, that is, switch from brittle processing to ductile processing. However, the member for injecting powder or fluid is moved. Therefore, when the brittle processing is switched to the ductile processing, a new problem arises that the processing apparatus becomes complicated and increases in size.

  The present invention has been made in view of the above problems, and an object of the present invention is to use a substrate processing apparatus that can smooth a substrate surface after processing and is simple, and the processing apparatus. An object of the present invention is to provide a method for processing a substrate and a method for manufacturing a processed substrate using the processing method.

  In order to solve the above-described problems, the substrate processing apparatus according to the present invention includes the abrasive particle injection member disposed such that the angle between the abrasive particle injection direction and the substrate processing surface is an angle in brittle processing. A substrate processing apparatus, wherein the angle of entry of the abrasive grains into the processing surface of the substrate between the spray member and the processing surface of the substrate in the abrasive spray direction is determined from the angle in the brittle processing. An injection direction changing member for changing to an angle in ductility processing is disposed, and the injection direction changing member is movable.

  According to said structure, since the said injection direction change member is arrange | positioned between the said injection member in the injection direction of the said abrasive grain, and the processed surface of the said board | substrate, the said abrasive grain to the processed surface of this board | substrate The approach angle can be changed from an angle in brittle processing to an angle in ductile processing. Thereby, the processed substrate surface can be smoothed. Further, according to the above configuration, since the injection direction changing member is movable, the angle of entry of the abrasive grains into the processing surface of the substrate is changed again from the angle in ductile processing to the angle in brittle processing. Can do. That is, the injection direction changing member moves to a position where it does not come into contact with the abrasive grains, so that the angle of entry of the abrasive grains into the processing surface of the substrate is changed again from the angle in ductile processing to the angle in brittle processing. be able to.

  Moreover, according to said structure, the angle of approach of the said abrasive grain to the process surface of the said board | substrate can be changed from the angle in a brittle process to the angle in a ductile process using only one injection member, and also ductility. Since the angle in processing can be changed to the angle in brittle processing, the substrate processing apparatus can be simplified.

  Moreover, it is preferable that the substrate processing apparatus of the present invention further includes a rotating member for rotating the injection direction changing member around the injection direction of the abrasive grains.

  Thereby, the processing apparatus of the board | substrate of this invention can change the injection direction of the said abrasive grain after reflecting in the said injection direction change member.

  Moreover, it is preferable that the substrate processing apparatus of the present invention further includes an injection direction control member for changing the angle of the injection direction changing member with respect to the injection direction of the abrasive grains.

  Thereby, the processing apparatus of the board | substrate of this invention can control the injection angle of the said abrasive grain after reflecting in the said injection direction change member.

  In the substrate processing apparatus of the present invention, it is preferable that the jetting direction changing member contains at least one of silicon carbide and silicon nitride.

  As a result, the substrate processing apparatus of the present invention makes it difficult for the jetting direction changing member to deteriorate, and the substrate processing operation can be made more efficient.

  In the substrate processing apparatus of the present invention, the substrate is preferably a glass substrate, and the abrasive grains are preferably alumina.

  Thereby, alumina has a hardness (Mohs) of 9, and can be suitably used as abrasive grains for grinding.

  In the substrate processing apparatus of the present invention, it is preferable to alternately perform the ejection of abrasive grains and a medium for ejecting the abrasive grains and the ejection of only the medium.

  Abrasive grains that are sprayed and ground onto the processing part of the substrate remain in the grinding part. Therefore, the grinding efficiency of the next abrasive grain is obstructed, and the grinding efficiency decreases as the abrasive grain continues. To do. However, in the substrate processing apparatus, the ejection of abrasive grains and a medium for ejecting the abrasive grains and the ejection of only the medium are alternately performed. Thus, grinding of the processed portion of the substrate and removal of residues such as abrasive grains remaining in the ground portion are alternately performed, so that unnecessary abrasive grains can be eliminated. As a result, the substrate processing apparatus of the present invention can increase the grinding efficiency.

  Moreover, it is preferable that the processing apparatus of the board | substrate of this invention fills the processing site | part of the said board | substrate with a transparent material.

  As a result, the substrate processing apparatus of the present invention is filled with a transparent material (individual) in a portion (indentation, groove, etc.) from which the substrate has been removed by processing, and this portion is compared with an empty state. Thus, the refractive index change at this portion can be reduced. As a result, the substrate processing apparatus of the present invention can make the portion from which the substrate has been removed by the processing difficult to notice.

  In the substrate processing apparatus of the present invention, the substrate may constitute a liquid crystal display panel.

  Since a substrate (glass substrate) for constituting a liquid crystal display panel has a low alkali metal content and a high melting point, it tends to generate internal bubbles. Therefore, the substrate processing apparatus of the present invention is particularly effective for a substrate for constituting a liquid crystal display panel.

  In order to solve the above-described problems, the substrate processing method of the present invention is characterized in that processing is performed using the substrate processing apparatus, and ductility processing of the substrate is performed after brittle processing of the substrate.

  According to the above configuration, the substrate processing apparatus can perform ductile processing of the substrate after brittle processing of the substrate, so that the substrate surface after processing can be smoothed.

  Moreover, the manufacturing method of the processed substrate of this invention is characterized by including the process of using the said processing method of a board | substrate, in order to solve said subject.

  According to said structure, the surface of the manufactured process board | substrate can be smoothed.

  As described above, the substrate processing apparatus according to the present invention processes a substrate on which the abrasive grain injection member is arranged so that the angle between the abrasive grain injection direction and the processed surface of the substrate becomes an angle in brittle processing. An angle between duct member machining and an angle of entry of the abrasive grains into the machining surface of the substrate between the jetting member in the jetting direction of the abrasive grains and the machining surface of the substrate. The injection direction changing member for changing to is arranged, and the injection direction changing member is movable.

  Therefore, the substrate processing apparatus of the present invention has an effect that the processed substrate surface can be smoothed and has a simple structure.

(A)-(e) is sectional drawing which shows the progress of the grinding process in the 1st Embodiment of this invention. In the 1st Embodiment of this invention, it is sectional drawing which shows the principal part of the glass substrate used as the object of defect correction. (A) is sectional drawing which shows the structure of the defect correction apparatus used in the 1st Embodiment of this invention, (b) shows the principal part of the defect correction apparatus used in the 1st Embodiment of this invention. It is a top view and (c) is sectional drawing which shows the principal part of the defect correction apparatus used in the 1st Embodiment of this invention. It is sectional drawing which shows the correction head with which the defect correction apparatus shown in FIG. 3 was equipped. (A) And (b) is sectional drawing which shows the shape of the processing surface by the said grinding process. It is sectional drawing which shows the state which filled the hollow formed by the said grinding process with the transparent material. In 1st Embodiment of this invention, it is sectional drawing which shows the principal part of the other glass substrate used as the object of defect correction. In 2nd Embodiment of this invention, it is sectional drawing which shows the principal part of the glass substrate used as the object of defect correction. (A)-(e) is sectional drawing which shows the progress of the grinding process in the 2nd Embodiment of this invention. It is sectional drawing which shows the principal part of the glass substrate used as the object of defect correction in the 3rd Embodiment of this invention. (A)-(d) is sectional drawing which shows the progress of the grinding process in the 3rd Embodiment of this invention. (A) is a top view which shows the liquid crystal display panel in embodiment of this invention, (b) is sectional drawing which shows the said liquid crystal display panel. It is sectional drawing which shows the structure of the other defect correction apparatus used in the defect correction method of this invention. It is sectional drawing which shows the other correction head used in the defect correction method of this invention. (A) is a figure which shows the external appearance of the glass substrate surface before the grinding process in the defect correction method of this invention, (b) shows the external appearance of the glass substrate surface after the grinding process in the defect correction method of this invention. FIG. The appearance of the surface of the glass substrate before and after grinding was taken with 6 million pixels using a general digital camera.

[Embodiment 1]
The first embodiment of the present invention will be described as follows. Note that the present invention is not limited to this, and the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in this embodiment are not particularly limited unless otherwise specified. It is not intended to limit the scope to that, but merely an illustrative example. In this specification and the like, “A to B” indicating a range indicates “A or more and B or less”.

  In the present embodiment, a glass substrate defect correcting device and a defect correcting method will be described as examples in the substrate processing apparatus and processing method. However, the present invention is not limited to these, and can also be applied to a general substrate (material) processing apparatus and processing method.

  Here, the substrate (material) that is the object to be processed is not particularly limited as long as it is a brittle material, and examples thereof include glass and ceramic.

  The defect correction method of this embodiment is a glass substrate defect correction method for constituting a display panel, and the defect to be corrected is an internal defect formed on the glass substrate.

  Moreover, the defect correction method of this embodiment is applicable with respect to the glass substrate for comprising various display panels, such as a liquid crystal display panel and a plasma display panel (PDP).

  Furthermore, the defect correction method of this embodiment can be implemented at various stages in the production of glass substrates and display panels. For example, a stage in which a glass manufacturer cuts a glass substrate from the original plate and ships it; a stage in which the display substrate manufacturer accepts the glass substrate and then uses it for a display panel; Thereafter, the defect correction method of this embodiment can be performed in various stages such as a stage until the display device is assembled. In particular, when the glass manufacturer performs the defect correction method of the present embodiment in the stage from cutting out the glass substrate from the original plate to shipping, the defect correction method of the present embodiment forms the glass substrate manufacturing method. It will be.

  In the following, it is assumed that the glass substrate is for a liquid crystal display panel, and the stage from the inspection of the configured display panel to the assembly as a display device is assumed as an implementation stage of the defect correction method. Further, assuming internal bubbles as internal defects, a method for correcting internal bubbles will be described.

  In addition, since the glass substrate for constituting a liquid crystal display panel has a low alkali metal content and a high melting point, it easily generates internal bubbles. Therefore, the defect correcting method of the present embodiment is particularly effective for a glass substrate for constituting a liquid crystal display panel.

  FIG. 2 is a cross-sectional view of the glass substrate 1 on which the internal bubbles 1b as internal defects to be corrected are formed.

  The internal bubble 1b shown in FIG. 2 has a relatively large size and a position that is relatively close to the surface 1s of the glass substrate 1, and therefore has a projection 1p on the surface 1s of the glass substrate 1. The internal bubble 1b may not be accompanied by the protrusion 1p depending on its size and position.

  The internal bubbles 1b may have various sizes from those having a maximum diameter of 100 μm or less to those having the same size as the thickness of the glass substrate 1 (for example, 0.7 mm). For the small internal bubbles 1b having a maximum diameter of, for example, 100 μm or less, since the adverse effect on the display is small, it may be considered that no special measures are taken. In addition, for the internal bubbles 1b having a maximum diameter of, for example, 100 to 300 μm, it may be considered to take a measure such as blackening. However, for the internal bubbles 1b whose maximum diameter exceeds, for example, 300 μm, it is difficult to consider an effective measure for sufficiently reducing the adverse effect on the display, except for the defect correction method of the present embodiment described below.

  As described above, the defect correcting method according to the present embodiment can deal with a wide range of internal bubbles 1b from small to large, but is particularly effective for large internal bubbles 1b for which it is difficult to consider other effective measures.

  Due to the internal bubbles 1b formed on the glass substrate 1, bright spots are observed. Although the detailed mechanism is not necessarily clear as the reason, it can be considered as follows.

  When a liquid crystal display panel is configured using the glass substrate 1 on which the internal bubbles 1b are formed, due to the lens effect by the glass around the internal bubbles 1b, the disorder of the polarization state due to the stress remaining on the glass around the internal bubbles 1b, etc. The vicinity of the internal bubble 1b is observed as a bright spot.

  Therefore, in the defect correcting method according to the present embodiment, the abrasive grains are sprayed at a position where the internal bubble 1b, which is an internal defect formed in the glass substrate 1, is located, and at least the internal portion from the surface 1s of the glass substrate 1. In this method, the glass material is removed until the bubbles 1b are reached.

  Further, as shown in FIG. 2, the glass material 1d surrounding the internal bubble 1b (hereinafter referred to as a winding part) 1d may cause a lens effect or a disorder of the polarization state, and therefore, it is removed together with the internal bubble 1b. preferable.

  FIG. 1A to FIG. 1E are diagrams showing an internal defect removal process by the defect correction method of this embodiment.

  As shown to Fig.1 (a), the abrasive grain 12a is sprayed with respect to the processus | protrusion 1p of the surface 1s of the glass substrate 1 with a predetermined injection speed. At this time, alumina having a particle size of 800 (about 0.03 mm (30 μm)) is used as the abrasive grains 12 a, but is not limited to this, and is appropriately selected according to the type of the substrate to be processed. be able to. Examples of the abrasive grains 12a include alumina and cerium. In addition, when a workpiece is the glass substrate 1, it is preferable to use an alumina as the abrasive grain 12a. Moreover, as a particle size of the abrasive grain 12a, it is preferable that it is 0.1-100 micrometers. The particle size of the abrasive grains 12a may be changed between brittle processing and ductile processing. In this case, at the time of brittle processing, the particle size of the abrasive grains 12a is increased to increase the processing force, while at the time of ductile processing, the particle size of the abrasive grains 12a is decreased to decrease the processing force.

  The scanning speed (moving speed of the correction head 12) is set to 0.2 mm / s to 0.6 mm / s, but is not limited to this, and is appropriately determined according to the type of the substrate that is the processing target. Can be selected. The injection amount (injection pressure) of the abrasive grains 12a is injected with 0.8 MPa of air, but is not limited to this, and can be appropriately selected according to the type of the substrate to be processed. The spraying time of the abrasive grains 12a is not particularly limited, and can be appropriately selected according to the type of the substrate to be processed, the depth of the substrate to be processed, and the like.

  Then, the abrasive grains 12a are continuously sprayed at the above injection speed, and the glass material of the protrusions 1p is removed by the abrasive grains 12a until the abrasive grains 12a reach the internal bubbles 1b as shown in FIG. And the grinding area | region by the abrasive grain 12a reaches to the internal bubble 1b by continuing spraying the abrasive grain 12a. In this state, the abrasive grains 12a are further sprayed, and the internal bubbles 1b are removed until the corrected surface 1e is exposed, as shown in FIG. The glass material of the winding part 1d is removed. 1A to 1C are diagrams for explaining brittle processing. Furthermore, as shown in FIG. 1 (d), at an angle shallower than that shown in FIG. 1 (b) (from an oblique direction with respect to the injection direction (substantially perpendicular direction) in the case shown in FIG. 1 (b)), The abrasive grains 12a are continuously ejected at the above-described ejection speed. In this state, the abrasive grains 12a are further sprayed, and the glass material is removed until the correction surface 1f becomes smooth (mirror surface) as shown in FIG. In addition, FIG.1 (d) and FIG.1 (e) are figures explaining a ductile process.

  Since the above-mentioned grinding progresses by the accumulation of fine brittleness processing caused by the collision of the injected abrasive grains 12a, fine and high-quality processing can be performed. Furthermore, since the grinding proceeds by switching from brittle machining to ductile machining, the substrate surface after machining can be smoothed.

  Here, the angle of entry of the abrasive grains in the brittle processing is larger than 35 ° and within a range of 90 ° or less with respect to the surface 1 s of the substrate 1. For example, when the substrate is a glass substrate, it is preferably 90 °.

  On the other hand, the approach angle of the abrasive grains in the ductile processing is larger than 0 ° and within a range of 35 ° or less with respect to the surface 1 s of the substrate 1. For example, when the substrate is a glass substrate, it is preferably 30 °.

  An apparatus for realizing the defect correction method of this embodiment will be described below.

  FIG. 3A is a cross-sectional view of the defect correcting apparatus 10 for carrying out the defect correcting method of the present embodiment.

  The defect correcting device 10 is fixed to the substrate mounting table 13 and a substrate mounting table 13 for fixing the glass substrate 1 as a correction target in a direction perpendicular to the ground on the mounting surface 11 a of the mounting table 11. Head mounting base 14 on which correction head 12 for injecting abrasive grains 12a is applied to correction location 1b or reflection plate (injection direction changing member) 18 of glass substrate 1, and reflection plate 18 and reflection plate support member A reflecting plate mounting base 15 on which a rotating member 16 having a jetting direction changing member 19 provided with a fixing member 17 is mounted is provided.

  Here, it is preferable that the reflecting plate 18 contains ceramic, and it is more preferable that the reflecting plate 18 is made of only ceramic. Examples of the ceramic include silicon carbide (SiC) and silicon nitride (SiN). Moreover, the material of the reflecting plate support member 17 is not specifically limited, For example, a metal etc. are mentioned.

  The size of the reflector 18 is not particularly limited, but the area is preferably 1 cm square or more.

  The rotating member 16 is for rotating the reflecting plate 18 around the injection direction of the abrasive grains 12 a injected from the correction head 12.

  The correction head 12 is provided on the head mounting base 14 so as to be movable in a horizontal direction and a vertical direction with respect to the ground, and the spraying direction of the abrasive grains 12a is horizontal with respect to the ground (with respect to the glass substrate 1). Vertical direction).

  The correction head 12 includes an injection nozzle (described later) that injects abrasive grains 12 a for grinding the glass substrate 1. That is, the defect correction apparatus 10 moves the correction head 12 to a position facing the internal bubble 1b or the reflection plate 18 of the glass substrate 1, and the abrasive grains 12a are moved to the surface 1s of the glass substrate 1 or the surface of the reflection plate 18 at that position. It is designed to be sprayed into the grinding process. Here, when grinding is performed by spraying the abrasive grains 12 a onto the surface 1 s of the glass substrate 1 (in the case of brittle processing), the abrasive grains 12 a do not contact (collision) the reflecting plate 18 and the glass substrate 1. The surface is sprayed onto the surface 1s to perform grinding. On the other hand, when grinding is performed by spraying the abrasive grains 12a onto the surface of the reflecting plate 18 (in the case of ductility processing), the abrasive grains 12a contacting (collising) with the reflecting plate 18 are reflected in the direction of the glass substrate 1. Thus, grinding is performed by spraying onto the surface 1s of the glass substrate 1 at a shallow angle.

  The jetting direction changing member 19 is provided along with the rotating member 16 so as to be movable in the horizontal direction with respect to the circular surface (rotating surface) of the rotating member 16 in the reflector plate mount 15. The injection direction changing member 19 moves to a position where it does not come into contact with the abrasive grains 12a ejected from the correction head 12 during brittle machining, and moves to a position where it comes into contact with the abrasive grains 12a ejected from the correction head 12 during ductility machining. The direction of the abrasive grains 12a sprayed is changed.

  Further, the mounting table 11 is also movably provided, and the spray position of the abrasive grains 12 a may be adjusted by moving the glass substrate 1 on the mounting table 11.

  In addition, when implement | achieving ductile processing, instead of providing the injection direction change member 19 provided with the reflecting plate 18 and the reflecting plate support member 17 in the defect correction apparatus 10, the reflecting plate R (not shown) on the glass substrate 1 is provided. The abrasive grains 12a are sprayed toward the reflector R at a shallow angle, and the abrasive grains 12a that contact (impact) the reflector R reflect in the direction in which the reflector R is not provided on the glass substrate 1. Then, grinding may be performed by spraying the surface 1 s of the glass substrate 1 at a shallow angle. The inclination angle of the reflecting plate R is adjusted in consideration of the spray position of the abrasive grains 12a on the glass substrate 1. Thereby, it becomes possible to eliminate cloudiness (mirror surface unevenness) on the surface of the glass substrate 1 which occurs when the abrasive grains 12a are directly applied to the glass substrate 1. In this case, the material of the reflector R is the same as that of the reflector 18. Moreover, the area, height, etc. of this reflector R are not specifically limited.

  FIG. 3B is a plan view showing a main part of the defect correcting apparatus 10 for carrying out the defect correcting method of the present embodiment. Specifically, it is a plan view showing a configuration excluding the substrate mounting table 13, the glass substrate 1, and the mounting table 11 when the defect correction apparatus 10 is viewed from the substrate mounting table 13 side. As shown in FIG. 3B, the rotating member 16 is rotated by the rotating shaft 25 in the reflecting plate mounting base 15. As a result, the defect correcting device 10 can change the injection position (injection direction) of the abrasive grains 12a.

  FIG.3 (c) is sectional drawing which shows the principal part of the defect correction apparatus 10 for enforcing the defect correction method of this embodiment. Specifically, it is a cross-sectional view showing the configuration of the injection direction changing member 19. As shown in FIG.3 (c), the reflector 18 can change the angle of the abrasive grain 12a with respect to the injection direction of the abrasive grain 12a by the reflector control member 27 in the reflector support member 17. FIG. As a result, the defect correction apparatus 10 can change the spray position of the abrasive grains 12a (the spray position in the depth direction in the grinding region).

  In implementing the defect correction method of this embodiment, it can carry out in the following procedure, for example. First, a liquid crystal display panel is produced using the glass substrate 1 before defect correction. And when irradiating uniform light from the back surface of the created liquid crystal display panel, inspecting whether bright spots are observed due to the internal bubbles 1b formed on the glass substrate 1, and observed The position is specified in advance. Thereafter, the liquid crystal display panel is fixed to the substrate mounting table 13 of the defect correcting apparatus 10, and grinding processing described later is performed at the specified position. In addition, when a polarizing plate is affixed on the surface of the glass substrate 1, what is necessary is just to peel a polarizing plate once before performing a grinding process and to re-apply a polarizing plate after completion | finish of a grinding process.

  FIG. 4 is a schematic diagram of the correction head 12 provided in the defect correction apparatus 10.

  As shown in FIG. 4, the correction head 12 has a structure having an abrasive grain supply nozzle 121 for quantitatively supplying abrasive grains 12 a.

  The abrasive grain supply nozzle 121 is made of a cylinder, a cylindrical front end hole 121a serving as a discharge hole for the abrasive grains 12a, a cylindrical rear end hole 121b serving as an air supply hole, and the cylindrical front end hole 121a and the cylindrical rear end hole 121b. And an abrasive grain supply hole 121c serving as a supply hole for the abrasive grains 12a.

  The abrasive grain supply hole 121c of the abrasive grain supply nozzle 121 is connected to an abrasive tank 122 for storing abrasive grains, and the cylindrical rear end hole 121b is connected to a high-speed electromagnetic valve 123.

  The abrasive grain tank 122 is provided with an opening / closing lid (not shown) at a connection portion with the abrasive grain supply nozzle 121, and the opening / closing lid is opened only when the abrasive grains 12a are supplied. .

  The high-speed solenoid valve 123 includes a connection cylinder 123a connected to the cylindrical rear end hole 121b of the abrasive grain supply nozzle 121 and an air intake port for taking in supply air from an air supply unit (not shown). When the high-speed solenoid valve 123 is open, the supply air taken in from the air intake port 123b is supplied to the connecting cylinder 123a. When the high-speed solenoid valve 123 is closed, the air intake Supplying supply air taken in from the port 123b to the connecting cylinder 123a is stopped.

  Therefore, in the correction head 12 having the above-described configuration, when the high-speed solenoid valve 123 is open and the opening / closing lid of the abrasive tank 122 is open, the abrasive grains 12a are ejected from the abrasive supply nozzle 121 by the supply air. Is done. If the high-speed solenoid valve 123 is in the closed state, the abrasive grains 12 a are not injected from the abrasive grain supply nozzle 121 regardless of the open / closed state of the opening / closing lid of the abrasive tank 122. If the high-speed solenoid valve 123 is open and the opening / closing lid of the abrasive tank 122 is closed, only air that does not contain the abrasive grains 12a can be injected from the abrasive supply nozzle 121. it can.

  The correction head 12 having the above-described configuration is, for example, made of abrasive grains 12a made of alumina having a particle size of 800 with respect to the projection 1p on the surface 1s of the glass substrate 1 or the reflecting plate at a processing speed of 0.2 mm / s to 0.6 mm / By injecting at s (injection speed 150 to 200 m / s), the glass material is removed until the internal bubbles 1b that are internal defects are reached.

  Normally, when the abrasive grains 12 a are continuously sprayed from the correction head 12 onto the surface 1 a of the glass substrate 1 or the surface of the reflecting plate, the abrasive grains 12 a remain on the ground portion of the glass substrate 1. In such a case, the newly-injected abrasive grains 12a collide with the abrasive grains 12a remaining in the grinding site and cannot be directly ground on the actual grinding target surface, resulting in a problem of reduced grinding efficiency. .

  Thus, by alternately performing injection of the abrasive grains 12a and injection of only air that is a medium for injecting the abrasive grains 12a, the abrasive grains 12a remaining at the grinding site can be removed by injection of only air. Can do. Thereby, it becomes possible to improve the grinding efficiency. As a specific method in this case, as described above, if the high-speed solenoid valve 123 is opened and the lid of the abrasive tank 122 is opened and closed intermittently, the air containing the abrasive grains 12a and Air that does not include the abrasive grains 12a can be alternately injected.

  As the correction head 12 described above, for example, AJM (ABRASIVE Jet Machining) manufactured by Sendai Nikon Corporation can be used.

  In the defect correction method of the present embodiment, removal processing up to the state shown in FIG. The state shown in FIG. 1 (e) is not necessarily an ideal state as the shape of the glass substrate 1, but the result of actually confirming the influence on the display is compared with the state before performing the removal processing. Thus, it is difficult to observe the bright spots due to the internal bubbles 1b.

  Next, a desirable processing shape will be described. As shown in FIG. 5A, when a recess having a shape in which a part of the processing surface 1w is vertically formed with respect to the surface 1s is formed, the processing surface 1w is observed in the observation direction D perpendicular to the surface 1s. Since the vertical portion of the line coincides with the observation direction D, the influence on the display of the processed surface 1w is accumulated in the observation direction D. As a result, the processed surface 1w is easily noticeable.

  On the other hand, as shown in FIG. 5B, the processing surface 1w does not stand perpendicular to the surface 1s as described above, and a tangential plane at an arbitrary position of the processing surface 1w (FIG. 5B). However, the effect on the display of the processed surface 1w is not accumulated in the observation direction D, and the processed surface 1w is made inconspicuous. be able to.

  Therefore, as a processed shape, as shown in FIG. 5B, it is desirable that the tangent plane at an arbitrary position of the processed surface 1w is parallel or inclined with respect to the surface 1s. In order to obtain such a processed shape, for example, the spraying speed of the abrasive grains 12a sprayed from the correction head 12 may be changed depending on the defect position. For example, when trying to obtain a recess having a shape as shown in FIG. 5B, the spray speed of the abrasive grains 12a is increased at the center of the recess, and the abrasive grains are directed outward from the center of the recess. What is necessary is just to slow down the injection speed of 12a gradually.

  Moreover, as shown in FIG. 6, it is desirable to fill the recess formed by the removal process with the transparent material 2. By filling the depression with a transparent material, the refractive index change in the depression can be reduced as compared with an empty state in the depression. As a result, the dent can be made inconspicuous. In order to fill the hollow formed by the removal process with the transparent material 2 in this way, a liquid transparent resin may be filled into the hollow and solidified.

  In the defect correction apparatus 10, alumina is used as the abrasive grains 12a, but the present invention is not limited to this, and silicon carbide, boron carbide, cerium oxide, or the like may be used. Further, the grain size of the abrasive grains 12a is not limited to 800, but may be other grain sizes, more preferably after finishing with 800 and finishing with 2000, and may be changed according to the object to be ground. .

  Although the above description is intended to correct the glass substrate 1 on which the internal bubbles 1b as internal defects are formed, as shown in FIG. 7, the glass substrate 1 on which the internal foreign matter 1c as internal defects is formed. May be the correction target. Even in this case, it is possible to reduce the lens effect and polarization state disturbance described above. Further, in the case where the internal foreign matter 1c is made of a light-shielding material, an effect of removing black spots can be obtained by performing processing that completely removes the internal foreign matter 1c.

  Further, in the present embodiment, an example of the defect correction method assuming the internal bubbles 1b and the internal foreign matter 1c formed inside the glass substrate 1 as the defects to be corrected has been described, but in the following Embodiment 2, A description will be given of an example in which the defects to be corrected are removed by grinding the projections as surface defects formed on the glass substrate.

[Embodiment 2]
The second embodiment of the present invention will be described as follows. For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.

  The defect correction method of this embodiment is a glass substrate defect correction method for constituting a display panel, and the defect to be corrected is a protrusion as a surface defect formed on the glass substrate. As described in the first embodiment, this protrusion may be formed due to the presence of an internal defect, but may be formed independently of the internal defect.

  Moreover, the defect correction method of this embodiment is applicable to the glass substrate for comprising various display panels, such as a liquid crystal display panel and a plasma display panel (PDP), similarly to the case of Embodiment 1. FIG.

  Further, the defect correction method of the present embodiment can be performed at various stages in the manufacture of the glass substrate and the display panel, as in the case of the first embodiment.

  FIG. 8 is a cross-sectional view of the glass substrate 1 on which protrusions 1p as surface defects to be corrected are formed. As the apparatus for carrying out the defect correcting method of the present embodiment, the defect correcting apparatus 10 described in the first embodiment can be used.

  Fig.9 (a)-FIG.9 (e) are figures which show the progress of grinding. When the abrasive grains 12 a are ejected by the correction head 12, the grinding starts as the ejected abrasive grains 12 a come into contact with the protrusions 1 p of the glass substrate 1 as shown in FIG. When the abrasive grains 12a are continuously sprayed, the height of the protrusion 1p is lowered as shown in FIG. 9B. When the abrasive grains 12a are continuously sprayed, the protrusion 1p is removed as shown in FIG. 9C. FIGS. 9A to 9C are diagrams for explaining brittle processing. Furthermore, as shown in FIG. 9 (d), the abrasive grains 12a are continuously injected at the above-described injection speed at a shallower angle than in the case shown in FIG. 9 (b). In this state, the abrasive grains 12a are further sprayed, and the glass material is completely removed until the correction surface 1f becomes smooth (mirror surface) as shown in FIG. 9 (e). FIG. 9D and FIG. 9E are diagrams for explaining ductility processing.

  Since the above-mentioned grinding progresses by the accumulation of fine brittleness processing caused by the collision of the injected abrasive grains 12a, fine and high-quality processing can be performed. Furthermore, since the grinding proceeds by switching from brittle machining to ductile machining, the substrate surface after machining can be smoothed.

  In the defect correction method of the present embodiment, removal processing up to the state of FIG. 9 (e) may be performed. Thus, in the defect correction method of the present embodiment, the height of the protrusion 1p is lowered by removing a part or all of the protrusion 1p, and this is referred to as flattening of the protrusion 1p. Thereby, the surface 1s on which the protrusion 1p is formed can be brought close to the original surface shape. As a result, it is possible to make it difficult to generate a bright spot due to the protrusion 1p.

  Note that, by flattening the protrusion 1p, a slight depression may be formed in the portion where the protrusion 1p was formed. In this case, as a processing shape, as shown in FIG. 5B in Embodiment 1, the tangent plane at an arbitrary position of the processing surface 1w is parallel or inclined with respect to the surface 1s. desirable. Moreover, as shown in FIG. 6 in Embodiment 1, it is desirable to fill the formed recess with the transparent material 2.

  As the abrasive grains 12a, as in the first embodiment, alumina having a particle size of 800 is used and injected at a processing speed of 0.2 mm / s to 0.6 mm / s (injection speed of 150 to 200 m / s). You may make it do, and you may change the material of the abrasive grain 12a, a particle size, and an injection speed as needed.

  As described above, in the second embodiment, the defect to be corrected for the glass substrate 1 is the protrusion 1p. However, in the following third embodiment, the defect to be corrected for the glass substrate 1 is a surface scratch. An example will be described.

[Embodiment 3]
The third embodiment of the present invention will be described as follows. For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.

  The defect correction method of this embodiment is a glass substrate defect correction method for constituting a display panel, and the defect to be corrected is a scratch as a surface defect formed on the glass substrate.

  Moreover, the defect correction method of this embodiment is applicable to the glass substrate for comprising various display panels, such as a liquid crystal display panel and a plasma display panel (PDP), similarly to the case of Embodiment 1. FIG.

  Further, the defect correction method of the present embodiment can be performed at various stages in the manufacture of the glass substrate and the display panel, as in the case of the first embodiment.

  FIG. 10 is a cross-sectional view of the glass substrate 1 on which scratches 1v as surface defects to be corrected are formed. As the apparatus for carrying out the defect correcting method of the present embodiment, the defect correcting apparatus 10 described in the first embodiment can be used.

  Fig.11 (a)-FIG.11 (d) are figures which show the progress of a grinding process. When the abrasive grains 12 a are ejected by the correction head 12, the grinding starts as the ejected abrasive grains 12 a come into contact with the surface 1 s of the glass substrate 1 as shown in FIG. And the surface formed by the damage | wound 1v with respect to the original surface 1s of the glass substrate 1 as shown in FIG.11 (b) by spraying the abrasive grain 12a, making the correction head 12 rock | fluctuate in a horizontal direction. The angle formed by can be reduced. FIG. 11A and FIG. 11B are diagrams illustrating brittle processing. Further, as shown in FIG. 11 (c), the abrasive grains 12a are continuously injected at the above-described injection speed at a shallower angle than the case shown in FIG. 11 (a). In this state, the abrasive grains 12a are continuously sprayed, and as shown in FIG. 11D, the angle formed by the surface formed by the scratch 1v is reduced until the correction surface 1f becomes smooth (mirror surface). To do. In addition, FIG.11 (c) and FIG.11 (d) are figures explaining a ductile process.

  Since the above-mentioned grinding progresses by the accumulation of fine brittleness processing caused by the collision of the injected abrasive grains 12a, fine and high-quality processing can be performed. Furthermore, since the grinding proceeds by switching from brittle machining to ductile machining, the substrate surface after machining can be smoothed.

  As described above, in the defect correction method of the present embodiment, the angle formed by the surface formed by the scratch 1v with respect to the original surface 1s of the glass substrate 1 is reduced, and this is smoothed. Called. Thereby, the surface 1s on which the scratch 1v is formed can be brought close to the original surface shape. As a result, it is possible to make it difficult to generate a bright spot due to the scratch 1v.

  In addition, as a processed shape of the dent formed by smoothing the scratches 1v, as shown in FIG. 5B in Embodiment 1, a tangential plane at an arbitrary position of the processed surface 1w is formed on the surface 1s. It is desirable to be parallel or inclined with respect to it. Moreover, as shown in FIG. 6 in Embodiment 1, it is desirable to fill the formed recess with the transparent material 2.

  The liquid crystal display panel 20 as a display panel configured using the glass substrate 1 described in the first to third embodiments is shown in FIG. FIG. 12A is a plan view showing a liquid crystal display panel in an embodiment of the present invention, and FIG. 12B is a cross-sectional view showing the liquid crystal display panel.

  The liquid crystal display panel 20 is configured by sealing two glass substrates 1 facing each other at a predetermined interval and sandwiching a liquid crystal 21 between them. Although not shown, a polarizing plate or the like is attached to the outer surfaces of the two glass substrates 1.

  The two glass substrates 1 have a processed surface 1w on the surface in the display region 20a of the liquid crystal display panel 20 on which the glass material removal processing described in the first to third embodiments is performed. In addition, this processed surface 1w may have both of the two glass substrates 1, and may have either one. The processed surface 1w is preferably filled with a transparent material.

  In the liquid crystal display panel 20, the glass material removal processing described in the first to third embodiments is applied to the internal defects and surface defects originally formed on the two glass substrates 1, and as a result, display is performed. The adverse effect is reduced, and the liquid crystal display panel 20 that had to be handled as a defective product in the past can also be made non-defective.

  Moreover, in above-mentioned Embodiment 1-3, as shown to Fig.3 (a), the defect correction apparatus 10 in which the correction head 12 was installed so that the injection direction of the abrasive grain 12a might become a horizontal direction with respect to the ground. However, the present invention is not limited to this. For example, as shown in FIG. 13, the spray direction of the abrasive grains 12a is perpendicular to the ground (perpendicular to the glass substrate 1). It is also possible to use the defect correction apparatus 110 in which the correction head 12 is installed.

  The defect correcting device 110 includes a casing 111 having a mounting surface 111a for mounting the glass substrate 1, and a correcting head 12 that is suspended from the ceiling portion of the casing 111 and is movable in the horizontal direction and the vertical direction. And a reflecting plate mounting base 15 mounted with a rotating member 16 fixed to an ejection direction changing member 19 provided with the reflecting plate 18 and the reflecting plate supporting member 17.

  The defect correction apparatus 10 moves the correction head 12 above the internal bubbles 1b of the glass substrate 1 or above the reflector 18 and at the position, the abrasive grains 12a are placed on the surface 1s of the glass substrate 1 or the surface of the reflector 18. It is designed to perform grinding by spraying.

  Further, in the correction head 12, as shown in FIG. 4, since only supply air is supplied, the supply air supply control directly controls the injection / stop of the abrasive grains 12a. In order to inject only air that does not include 12a, it is necessary to control the opening / closing of the opening / closing lid of the abrasive grain tank 122.

  Accordingly, FIG. 14 shows a correction head that can inject only air that does not contain the abrasive grains 12a without performing opening / closing control of the opening / closing lid of the abrasive tank 122.

  The correction head 112 shown in FIG. 14 has an acceleration nozzle 124 added to the correction head 12 shown in FIG. 4 so that acceleration air can be supplied in addition to supply air. Other components are the same as those of the correction head 12 shown in FIG.

  As shown in FIG. 14, the correction head 112 has a structure in which an acceleration nozzle 124 that accelerates and injects the abrasive grains 12 a supplied by the abrasive supply nozzle 121 is newly added.

  The acceleration nozzle 124 includes an injection hole 124a for injecting the abrasive grains 12a to the outside, an air supply hole 124b for supplying acceleration air for accelerating the abrasive grains 12a and injecting the abrasive grains 12a from the injection holes 124a, A mixing chamber 124c is formed between the injection hole 124a and the air supply hole 124b, and mixes the abrasive grains 12a and the accelerating air and guides them to the injection hole 124a.

  The cylindrical tip hole 121a of the abrasive grain supply nozzle 121 is disposed so as to protrude into the mixing chamber 124c of the acceleration nozzle 124.

  Therefore, in the correction head 112 having the above-described configuration, when the high-speed solenoid valve 123 is in the open state, the abrasive grains 12a are supplied from the abrasive supply nozzle 121 to the acceleration nozzle 124 by the supply air, and are taken in from the air supply hole 124b. The air including the abrasive grains 12a is ejected from the ejection holes 124a by the accelerated air. Further, when the high-speed solenoid valve 123 is in the closed state, the supply air is not supplied to the abrasive grain supply nozzle 121, so that the abrasive grains 12 a are not supplied to the acceleration nozzle 124. For this reason, only the air which does not contain the abrasive grain 12a is injected from the injection hole 124a of the acceleration nozzle 124.

  Each air supply is adjusted so that the relationship of P1 <P2 is established, where P1 is the acceleration air pressure and P2 is the supply air pressure. As a result, the abrasive grains 12a in the abrasive grain supply nose 121 are always supplied to the accelerating nozzle 124, and no backflow occurs.

  Normally, when the abrasive grains 12 a are continuously sprayed from the correction head 112 onto the surface 1 a of the glass substrate 1 or the surface of the reflector 18, the abrasive grains 12 a remain on the ground portion of the glass substrate 1. In such a case, the newly-injected abrasive grains 12a collide with the abrasive grains 12a remaining in the grinding site and cannot be directly ground on the actual grinding target surface, resulting in a problem of reduced grinding efficiency. .

  Therefore, by supplying a pulsed drive signal to the high-speed solenoid valve 124 of the correction head 112, the air taken in from the air intake port 123b is intermittently supplied to the connecting cylinder 123a, so that the abrasive grains If the supply of the abrasive grains 12a from the supply nozzle 121 to the accelerating nozzle 124 is intermittently performed, the injection of the abrasive grains 12a and the injection of only air, which is a medium for injecting the abrasive grains 12a, are alternately performed. By performing the above, it is possible to remove the abrasive grains 12a remaining in the grinding portion by jetting only air. Thereby, it becomes possible to improve the grinding efficiency.

  The correction head 112 shown in FIG. 14 can be mounted on either the defect correction apparatus 10 shown in FIG. 3A or the defect correction apparatus 110 shown in FIG. 13 in the same manner as the correction head 12 shown in FIG. .

  In the above-described first to third embodiments, the example in which abrasive particles that are powders are jetted by air to grind the correction target has been described. That is, it is possible to grind the object to be corrected by spraying water or the like. In this case, the correction head 12 may be changed to a head that ejects water.

  Here, FIG. 15 is a diagram illustrating an appearance of the surface of the glass substrate 1 before and after the grinding process in the above-described first to third embodiments. FIG. 15A shows the appearance of the surface of the glass substrate 1 before grinding, and FIG. 15B shows the appearance of the surface of the glass substrate 1 after grinding. According to FIG. 15, it became clear that the substrate surface after processing can be smoothed by switching from brittle processing to ductile processing.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used in all fields for processing brittle materials. For example, it can be suitably used for a glass substrate constituting a flat display panel such as a liquid crystal display panel or a plasma display panel (PDP).

1 Glass substrate (substrate)
1a Surface 1b Internal bubbles (defects to be corrected, internal defects)
1c Internal foreign matter (fixed defect, internal defect)
1d Glass material 1d Winding part 1e Correction surface 1f Correction surface 1p Protrusion (defect to be corrected, internal defect)
1s Surface 1v Scratches (defects to be corrected, internal defects)
1w Processing surface 2 Transparent material 10 Defect correction device (processing device)
11 Housing 11a Placement surface 12 Correction head (jetting member)
12a Abrasive grain 13 Substrate mounting table 14 Head mounting table 15 Reflecting plate mounting table 16 Rotating member 17 Reflecting plate support member 18 Reflecting plate (injection direction changing member)
DESCRIPTION OF SYMBOLS 19 Injection direction change member 20 Liquid crystal display panel 20a Display area 21 Liquid crystal 25 Rotating shaft 27 Reflector control member (injection direction control member)
121 Abrasive grain supply nozzle 121a Cylindrical tip hole 121b Cylindrical rear end hole 121c Abrasive grain supply hole 122 Acceleration nozzle 122a Injection hole 122b Air supply hole 122c Mixing chamber 123 Abrasive tank 124 High-speed solenoid valve 124a Connection cylinder 124b Air intake port

Claims (10)

A substrate processing apparatus in which the abrasive particle injection member is arranged so that the angle between the abrasive particle injection direction and the substrate processing surface is an angle in brittle processing,
In order to change the angle of entry of the abrasive grains into the processing surface of the substrate from the angle in the brittle processing to the angle in ductile processing between the spray member in the spray direction of the abrasive grains and the processing surface of the substrate The injection direction changing member is arranged,
The substrate processing apparatus, wherein the spray direction changing member is movable.   The substrate processing apparatus according to claim 1, further comprising a rotating member for rotating the injection direction changing member around the injection direction of the abrasive grains.   The substrate processing apparatus according to claim 1, further comprising: an injection direction control member for changing an angle of the injection direction changing member with respect to the injection direction of the abrasive grains. .   The substrate processing apparatus according to claim 1, wherein the jetting direction changing member contains at least one of silicon carbide and silicon nitride.   The substrate processing apparatus according to claim 1, wherein the substrate is a glass substrate, and the abrasive grains are alumina.   The substrate processing apparatus according to claim 1, wherein the abrasive grains and a medium for ejecting the abrasive grains are alternately ejected and only the medium is ejected.   The substrate processing apparatus according to claim 1, wherein a transparent material is filled in a processing portion of the substrate.   The substrate processing apparatus according to claim 1, wherein the substrate is for constituting a liquid crystal display panel. Processing using the substrate processing apparatus according to claim 1,
A substrate processing method comprising performing ductility processing of a substrate after brittle processing of the substrate.   A method for manufacturing a processed substrate, comprising a step of using the substrate processing method according to claim 9.