JP2011014525A - 保護回路基板、二次電池及び電池パック - Google Patents
保護回路基板、二次電池及び電池パック Download PDFInfo
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- JP2011014525A JP2011014525A JP2009289670A JP2009289670A JP2011014525A JP 2011014525 A JP2011014525 A JP 2011014525A JP 2009289670 A JP2009289670 A JP 2009289670A JP 2009289670 A JP2009289670 A JP 2009289670A JP 2011014525 A JP2011014525 A JP 2011014525A
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- circuit board
- substrate body
- bare cell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/147—Lids or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/584—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
- H01M50/59—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries characterised by the protection means
- H01M50/591—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
- H01M2200/10—Temperature sensitive devices
- H01M2200/106—PTC
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Protection Of Static Devices (AREA)
- Structure Of Printed Boards (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】充放電可能な二次電池または二次電池を含む電池パック300と、これらに備えられる保護回路基板100に関し、前記保護回路基板100の基板ボディ110の内部に2次保護素子を設置して、製造工程を簡素化し、2次保護回路の性能を向上させながら2次保護素子と二次電池の絶縁構造を省略することができる。このため、差別化された電池パックの開発を実現でき、他の製品に比べて競争力を向上させることができる。
【選択図】図6
Description
前記基板ボディの上下面には、絶縁層が形成される。
110:基板ボディ
120:PTC素子
200:二次電池
210:ベアセル
300:電池パック
Claims (23)
- 基板ボディ;及び
前記基板ボディに内蔵された2次保護素子を含むことを特徴とする保護回路基板。 - 前記基板ボディは、略直方体形状に形成され、中央に形成されたホール、一面に実装されて電流を外部に伝達する外部端子、及び他側面に実装された充放電素子を有することを特徴とする請求項1に記載の保護回路基板。
- 前記基板ボディは、少なくとも2層または4層の回路層を含み、前記2次保護素子は、上端部が前記回路層の最上層と連結され、下端部が前記回路層の最下層と連結されたことを特徴とする請求項1に記載の保護回路基板。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項1に記載の保護回路基板。
- 前記絶縁層はPSRからなることを特徴とする請求項4に記載の保護回路基板。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項1に記載の保護回路基板。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項1に記載の保護回路基板。
- 前記PTC素子は、略直方体に形成されたPTC本体と、前記PTC本体の少なくとも二面を取り囲む第1導電部と、前記第1導電部と離隔して前記PTC本体の前記第1導電部が取り囲まない他の面を取り囲む第2導電部とを含むことを特徴とする請求項7に記載の保護回路基板。
- ベアセル;及び
前記ベアセルに電気的に連結される保護回路基板を含み、
前記保護回路基板は、2次保護素子が内蔵された基板ボディを含むことを特徴とする二次電池。 - 前記ベアセルは、缶、前記缶に収容される電極組立体、及び前記缶の開口部を密封するキャップ組立体を含むことを特徴とする請求項9に記載の二次電池。
- 前記保護回路基板において、前記基板ボディの中央に前記ベアセルの第1電極と接続される電極端子が具備され、前記基板ボディの両端部下面には前記ベアセルの第2電極と接続されるリードプレートが設けられたことを特徴とする請求項9に記載の二次電池。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項9に記載の二次電池。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項9に記載の二次電池。
- 前記絶縁層はPSRからなることを特徴とする請求項13に記載の二次電池。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項9に記載の二次電池。
- ベアセル;
前記ベアセルに電気的に連結される保護回路基板;及び
前記保護回路基板を前記ベアセルの一面に結合するトップケース及び前記ベアセルの他側面に結合されるボトムケースを含み、
前記保護回路基板は、2次保護素子が内蔵された基板ボディを含むことを特徴とする電池パック。 - 前記ベアセルは、缶、前記缶に収容される電極組立体、及び前記缶の開口部を密封するキャップ組立体を含むことを特徴とする請求項16に記載の電池パック。
- 前記保護回路基板において、前記基板ボディの中央に前記ベアセルの第1電極と接続される電極端子が具備され、前記基板ボディの両端部下面には前記ベアセルの第2電極と接続されるリードプレートが設けられたことを特徴とする請求項16に記載の電池パック。
- 前記2次保護素子は、前記基板ボディの内部で前記基板ボディの外表面に露出されないことを特徴とする請求項16に記載の電池パック。
- 前記基板ボディの上下面には、絶縁層が形成されたことを特徴とする請求項16に記載の電池パック。
- 前記絶縁層はPSRからなることを特徴とする請求項20に記載の電池パック。
- 前記2次保護素子は、PTC素子またはこれと等価の保護素子であることを特徴とする請求項16に記載の電池パック。
- 前記ベアセルとトップケース及びボトムケースの側面を包むラベル紙をさらに含むことを特徴とする請求項16に記載の電池パック。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090060165A KR20110002616A (ko) | 2009-07-02 | 2009-07-02 | 보호회로 기판 및 이차 전지 및 전지 팩 |
| KR10-2009-0060165 | 2009-07-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011014525A true JP2011014525A (ja) | 2011-01-20 |
| JP5286244B2 JP5286244B2 (ja) | 2013-09-11 |
Family
ID=42732584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009289670A Expired - Fee Related JP5286244B2 (ja) | 2009-07-02 | 2009-12-21 | 保護回路基板、二次電池及び電池パック |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110003179A1 (ja) |
| EP (1) | EP2271192A3 (ja) |
| JP (1) | JP5286244B2 (ja) |
| KR (1) | KR20110002616A (ja) |
| CN (1) | CN101944584A (ja) |
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| KR102040194B1 (ko) * | 2013-03-25 | 2019-11-04 | 삼성에스디아이 주식회사 | 이차전지 연결용 회로기판 |
| KR101650027B1 (ko) * | 2013-09-27 | 2016-08-22 | 주식회사 엘지화학 | 보호회로 모듈을 포함하는 이차전지 팩 |
| CN104810878B (zh) * | 2014-01-28 | 2017-05-10 | 广东欧珀移动通信有限公司 | 过压过流保护电路和移动终端 |
| USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
| USD754131S1 (en) * | 2014-09-01 | 2016-04-19 | Samsung Electronics Co., Ltd. | Portable solid state disk |
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| US11456565B2 (en) * | 2016-08-02 | 2022-09-27 | Bourns, Inc. | Connector with integrated resettable thermal fuse |
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| US10355317B2 (en) | 2016-11-29 | 2019-07-16 | Microsoft Technology Licensing, Llc | Battery circuit in sealed pouch |
| USD950564S1 (en) * | 2021-04-08 | 2022-05-03 | Guangjun Zhou | Video capture card |
| CN114744302B (zh) * | 2022-03-31 | 2026-02-10 | 宁德新能源科技有限公司 | 电子器件、电路板、二次电池和用电装置 |
| CN118265222B (zh) * | 2024-04-09 | 2024-09-20 | 江门全合精密电子有限公司 | 一种新能源电池用高精密线路板结构 |
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-
2010
- 2010-06-11 US US12/814,250 patent/US20110003179A1/en not_active Abandoned
- 2010-07-01 CN CN2010102203498A patent/CN101944584A/zh active Pending
- 2010-07-02 EP EP10168198A patent/EP2271192A3/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2271192A2 (en) | 2011-01-05 |
| EP2271192A3 (en) | 2011-01-12 |
| JP5286244B2 (ja) | 2013-09-11 |
| CN101944584A (zh) | 2011-01-12 |
| KR20110002616A (ko) | 2011-01-10 |
| US20110003179A1 (en) | 2011-01-06 |
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