JP2011012395A - Composite heat insulating material - Google Patents
Composite heat insulating material Download PDFInfo
- Publication number
- JP2011012395A JP2011012395A JP2009154835A JP2009154835A JP2011012395A JP 2011012395 A JP2011012395 A JP 2011012395A JP 2009154835 A JP2009154835 A JP 2009154835A JP 2009154835 A JP2009154835 A JP 2009154835A JP 2011012395 A JP2011012395 A JP 2011012395A
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- insulating material
- foam
- heat
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 title claims abstract description 161
- 239000002131 composite material Substances 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 59
- 239000006260 foam Substances 0.000 claims description 154
- 239000010410 layer Substances 0.000 claims description 107
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 239000002344 surface layer Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004898 kneading Methods 0.000 abstract description 5
- 230000002411 adverse Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 59
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 36
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 35
- 229910052782 aluminium Inorganic materials 0.000 description 35
- 239000011888 foil Substances 0.000 description 32
- 238000005187 foaming Methods 0.000 description 25
- 239000000049 pigment Substances 0.000 description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 20
- -1 polypropylene Polymers 0.000 description 20
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 16
- 239000004088 foaming agent Substances 0.000 description 16
- 239000010439 graphite Substances 0.000 description 16
- 229910002804 graphite Inorganic materials 0.000 description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 14
- 238000001125 extrusion Methods 0.000 description 13
- 239000003063 flame retardant Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 12
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 238000010030 laminating Methods 0.000 description 11
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 11
- 239000006229 carbon black Substances 0.000 description 10
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 10
- 239000004793 Polystyrene Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 229920002223 polystyrene Polymers 0.000 description 9
- 239000001569 carbon dioxide Substances 0.000 description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 description 8
- 239000004594 Masterbatch (MB) Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000001273 butane Substances 0.000 description 7
- 239000001282 iso-butane Substances 0.000 description 7
- 239000010452 phosphate Substances 0.000 description 7
- 229920005990 polystyrene resin Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000000454 talc Substances 0.000 description 7
- 229910052623 talc Inorganic materials 0.000 description 7
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 7
- 239000012463 white pigment Substances 0.000 description 7
- 239000004604 Blowing Agent Substances 0.000 description 6
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 6
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 6
- 229960003750 ethyl chloride Drugs 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000000395 magnesium oxide Substances 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 6
- 229920013716 polyethylene resin Polymers 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- 229920001890 Novodur Polymers 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical class C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012860 organic pigment Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 235000014692 zinc oxide Nutrition 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VQKFNUFAXTZWDK-UHFFFAOYSA-N 2-Methylfuran Chemical compound CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical class C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 2
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 2
- CEBRPXLXYCFYGU-UHFFFAOYSA-N 3-methylbut-1-enylbenzene Chemical compound CC(C)C=CC1=CC=CC=C1 CEBRPXLXYCFYGU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
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- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910000004 White lead Inorganic materials 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001348 alkyl chlorides Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
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- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229940050176 methyl chloride Drugs 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
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- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
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- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
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Landscapes
- Building Environments (AREA)
Abstract
Description
本発明は、熱線遮蔽層を有し熱伝導を抑制する複合断熱材に関する。 The present invention relates to a composite heat insulating material having a heat ray shielding layer and suppressing heat conduction.
近年、地球温暖化の観点から省エネルギー性が求められ、建築物などに使用される断熱材としてより大きな熱抵抗値が求められるため、より断熱性能の優れた断熱材の要求が高まってきている。従来から、プラスチック系樹脂を発泡した断熱材は広く知られている。このような断熱材は、軽量で断熱性能に優れていることから建築物などの断熱材として使用されている。 In recent years, energy saving properties are required from the viewpoint of global warming, and a higher heat resistance value is required as a heat insulating material used for buildings and the like, and therefore, there is an increasing demand for heat insulating materials with better heat insulating performance. Conventionally, a heat insulating material obtained by foaming a plastic resin is widely known. Such a heat insulating material is used as a heat insulating material for buildings and the like because it is lightweight and excellent in heat insulating performance.
例えば、スチレン系樹脂発泡体は、その製造工程において代表的な発泡剤であるフロン類が主に用いられ、熱伝導率が低いフロン類のガスを発泡体の気泡内に封じ込めることにより発泡体の熱伝導率を低く抑えることができる。しかしながら、フロン類はオゾン層を破壊し地球温暖化を招来するおそれがあり、地球環境に好ましくないため、その使用などが厳しく規制されている。 For example, styrene resin foams are mainly made of chlorofluorocarbons, which are typical foaming agents in the production process, and contain chlorofluorocarbon gases with low thermal conductivity in the foam bubbles. Thermal conductivity can be kept low. However, chlorofluorocarbons may destroy the ozone layer and cause global warming, which is not preferable for the global environment, and its use is strictly regulated.
そこで、例えば、アルミ粉、銀粉、グラファイト粉、カーボンブラック、マイカ、シリカ、炭酸カルシウムまたは酸化チタンなどの熱線遮蔽(反射・吸収)材を樹脂発泡体に混練することにより、樹脂発泡体の熱伝導率を低減する技術が提案されている(特許文献1および2)。これらの熱線遮蔽材は赤外線反射率または赤外線吸収率が高いため、スチレン系樹脂の赤外線透過率を下げることが可能である。 Therefore, for example, heat conduction of the resin foam can be achieved by kneading the resin foam with a heat ray shielding (reflection / absorption) material such as aluminum powder, silver powder, graphite powder, carbon black, mica, silica, calcium carbonate or titanium oxide. Techniques for reducing the rate have been proposed (Patent Documents 1 and 2). Since these heat ray shielding materials have high infrared reflectance or infrared absorption rate, it is possible to reduce the infrared transmittance of the styrene resin.
また、断熱材(平板状)の表面にアルミニウム箔やアルミニウム蒸着プラスチックフィルムからなるシート状物を接合し複合断熱材が提案されている(特許文献3)。この複合断熱材は、断熱材に接合したシート状物が屋外側を向くようにして用いられる。この断熱材を用いて建築物の空気層を設けた外張り断熱構造を構成すると、接合したアルミニウム箔などの遮熱効果により、断熱性能を向上させることができる。 Further, a composite heat insulating material has been proposed in which a sheet-like material made of an aluminum foil or an aluminum vapor-deposited plastic film is bonded to the surface of a heat insulating material (flat plate shape) (Patent Document 3). This composite heat insulating material is used so that the sheet-like material joined to the heat insulating material faces the outdoor side. When an external heat insulating structure provided with an air layer of a building is formed using this heat insulating material, the heat insulating performance can be improved by a heat shielding effect such as a bonded aluminum foil.
しかしながら、上記特許文献1、2で使用される熱線遮蔽材をスチレン系樹脂に添加して発泡すると、熱線遮蔽材が核点となって生成する気泡を著しく小さくしてしまい、発泡体密度が高くなる結果、コスト高となってしまう。また、製品として必要な断面サイズが確保できない場合がある。 However, when the heat ray shielding material used in Patent Documents 1 and 2 is added to a styrene resin and foamed, the heat ray shielding material becomes a core and the bubbles generated are significantly reduced, and the foam density is high. As a result, the cost increases. Moreover, the cross-sectional size required for the product may not be ensured.
また、グラファイト粉またはカーボンブラックなどの黒色系の熱線遮蔽材を用いた場合、その使用量により発泡体の色も黒味がかってしまう場合もある。この場合、例えば建築現場に断熱材として使用される発泡板が搬入されて一時的に屋外に保管した場合に、日射の影響などにより赤外線吸収が起きやすく、発泡体の表面温度が上昇し、発泡体に収縮や反りなどが発生する場合がある。 In addition, when a black heat ray shielding material such as graphite powder or carbon black is used, the color of the foam may become dark depending on the amount of use. In this case, for example, when a foam board used as a heat insulating material is brought into a building site and temporarily stored outdoors, infrared absorption easily occurs due to the influence of solar radiation, the surface temperature of the foam rises, and foaming occurs. The body may shrink or warp.
したがって、これらの副作用を起こすことなく断熱材の断熱性能を高めるためには、上述する熱線遮蔽材の使用量をなくしたり、または少なく抑えたりして、他の方法で断熱性能を高めることが望まれている。 Therefore, in order to improve the heat insulating performance of the heat insulating material without causing these side effects, it is hoped that the amount of the heat ray shielding material described above is eliminated or suppressed and the heat insulating performance is improved by other methods. It is rare.
さらに、上記特許文献3のように、アルミニウム箔などの熱線反射材(遮熱材)を断熱材の表面に接合した複合断熱材の場合には、この熱線反射材が遮熱効果を発揮するためにはその表面に空気層が必ず必要であり、空気層がない使用形態では効果を発揮しない。また、断熱材の表面に存在するアルミニウム箔などは摩擦抵抗が低いため、ハンドリング時の滑りの問題や、特に屋根断熱などに用いる場合には、人がその断熱材の上に乗って施工するために滑り落ちる危険性がある。 Furthermore, in the case of a composite heat insulating material in which a heat ray reflecting material (heat shielding material) such as an aluminum foil is joined to the surface of the heat insulating material as in Patent Document 3, the heat ray reflecting material exhibits a heat shielding effect. An air layer is necessarily required on the surface, and the effect is not exhibited in a usage form in which there is no air layer. In addition, aluminum foil, etc. present on the surface of the heat insulating material has low frictional resistance, so when using it for the problem of slipping during handling, especially for heat insulation of the roof, a person rides on the heat insulating material. There is a risk of sliding down.
本発明者らは、上記課題を解決するため鋭意検討した結果、上記問題を解決しながらも、断熱性能に優れた複合断熱材を見出し、本発明を完成させた。すなわち本発明は、以下のような複合断熱材を提供する。 As a result of intensive studies to solve the above problems, the present inventors have found a composite heat insulating material having excellent heat insulating performance while solving the above problems, and completed the present invention. That is, the present invention provides the following composite heat insulating material.
[1]複数の断熱材の層と、該断熱材の層の間に配置された熱線遮蔽材の層とを積層してなることを特徴とする複合断熱材。 [1] A composite heat insulating material obtained by laminating a plurality of heat insulating material layers and a heat ray shielding material layer disposed between the heat insulating material layers.
[2]前記複合断熱材の表面層には熱線遮蔽材の層が配置されていないことを特徴とする、上記[1]に記載する複合断熱材。 [2] The composite heat insulating material according to [1] above, wherein a layer of a heat ray shielding material is not disposed on a surface layer of the composite heat insulating material.
[3]前記断熱材が樹脂発泡体からなる、上記[1]または[2]に記載する複合断熱材。 [3] The composite heat insulating material according to [1] or [2], wherein the heat insulating material is made of a resin foam.
[4]前記樹脂発泡体が熱線遮蔽材を含有していない、上記[1]〜[3]のいずれかに記載する複合断熱材。 [4] The composite heat insulating material according to any one of [1] to [3], wherein the resin foam does not contain a heat ray shielding material.
[5]前記樹脂発泡体の気泡径が0.1mm〜0.8mmである、上記[1]〜[4]のいずれかに記載する複合断熱材。 [5] The composite heat insulating material according to any one of [1] to [4], wherein the cell diameter of the resin foam is 0.1 mm to 0.8 mm.
[6]前記熱線遮蔽材の層が1mm以上の間隔で配置される、上記[1]〜[5]のいずれかに記載する複合断熱材。 [6] The composite heat insulating material according to any one of [1] to [5], wherein the layers of the heat ray shielding material are arranged at intervals of 1 mm or more.
本発明の好ましい態様によれば、特に断熱材に熱線遮蔽材を混練しなくても優れた断熱性能を有するため、例えば、熱線遮蔽材を混練することによる気泡縮小の問題、グラファイト粉またはカーボンブラックなどの黒色系の熱線遮蔽材をスチレン樹脂へ添加することによる発泡体の収縮または反りなどの問題を解消することができる。また、本発明の好ましい態様によれば、複合断熱材の表面にはアルミニウム箔などの熱線遮蔽材が不要であるため、表面に空気層を設けなければならないといった使用上の制限をなくすことができる。 According to a preferred embodiment of the present invention, since it has excellent heat insulation performance without kneading a heat ray shielding material in particular, for example, the problem of bubble reduction by kneading the heat ray shielding material, graphite powder or carbon black The problem of shrinkage or warping of the foam due to the addition of a black heat ray shielding material such as styrene resin can be solved. Moreover, according to the preferable aspect of this invention, since the heat ray shielding materials, such as aluminum foil, are unnecessary on the surface of a composite heat insulating material, the restrictions on use that an air layer must be provided in the surface can be eliminated. .
本発明に係る複合断熱材は、複数の断熱材の層と、該断熱材の層の間に配置された熱線遮蔽材の層とを積層してなることを特徴とする複合断熱材である。断熱材の層の数や熱線遮蔽材の層の数には限定はない。また、すべての断熱材層同士の間に熱線遮蔽材の層が配置されていることが好ましいが、層間に熱線遮蔽材の層が配置されていない断熱材同士があってもよい。 The composite heat insulating material according to the present invention is a composite heat insulating material formed by laminating a plurality of heat insulating material layers and a heat ray shielding material layer disposed between the heat insulating material layers. There is no limitation on the number of layers of the heat insulating material and the number of layers of the heat ray shielding material. Moreover, although it is preferable that the layer of a heat ray shielding material is arrange | positioned between all the heat insulating material layers, there may exist heat insulating materials in which the layer of a heat ray shielding material is not arrange | positioned between layers.
また、本発明に係る複合断熱材は、例えば断熱材の各層の厚さを1mm以上にするなどして、熱線遮蔽材の層を1mm以上の間隔で配置することが好ましい。より好ましくは、3mm以上の間隔であり、さらに好ましくは5mm以上の間隔である。ここで、断熱材厚みが1mm未満であると、強度的に非常に弱く、また良好な平滑性が得にくい。また、例えば球面の断熱材として使用する場合には、湾曲可能な複合断熱材が有効であり、その場合には断熱材の材料に応じて、湾曲可能な厚みを選択する。 Moreover, it is preferable that the composite heat insulating material which concerns on this invention arrange | positions the layer of a heat ray shielding material at a 1 mm or more space | interval, for example by making the thickness of each layer of a heat insulating material into 1 mm or more. More preferably, the interval is 3 mm or more, and still more preferably 5 mm or more. Here, if the thickness of the heat insulating material is less than 1 mm, it is very weak in strength and it is difficult to obtain good smoothness. For example, when used as a spherical heat insulating material, a bendable composite heat insulating material is effective. In that case, a bendable thickness is selected according to the material of the heat insulating material.
断熱材の層
断熱材の層に用いられる材料としては、特には限定されないが、軽量で断熱性・耐圧性に優れたものが好ましく、例えば樹脂発泡体が好適である。具体的には、例えばポリスチレン系樹脂発泡体、ポリエチレン系樹脂発泡体、ポリプロピレン系樹脂発泡体、ポリウレタン系樹脂発泡体、フェノール系樹脂発泡体などの独立気泡を有する合成樹脂発泡体が好適である。特に、押出法ポリスチレンフォーム保温板(商品名「スタイロフォーム」:ダウ化工(株)製)は、高い断熱性および低い吸水性を有するため最も好ましい。
The material used for the layer of the heat insulating material is not particularly limited, but a material that is lightweight and excellent in heat insulating properties and pressure resistance is preferable. For example, a resin foam is preferable. Specifically, for example, a synthetic resin foam having closed cells such as a polystyrene resin foam, a polyethylene resin foam, a polypropylene resin foam, a polyurethane resin foam, and a phenol resin foam is preferable. In particular, an extruded polystyrene foam heat insulating plate (trade name “Styrofoam” manufactured by Dow Chemical Co., Ltd.) is most preferable because it has high heat insulation and low water absorption.
ポリスチレン系樹脂
ポリスチレン系樹脂発泡体はポリスチレン系樹脂を発泡させて得られ、ここで用いられるポリスチレン系樹脂としては、特に限定されるものではなく、スチレン単量体のみから得られるポリスチレンホモポリマー、メチルスチレン、エチルスチレン、イソプロピルスチレンン、ジメチルスチレン、クロルスチレンなどのスチレン系単量体から得られる単独重合体(ホモポリマー)、スチレン単量体とスチレンと共重合可能な単量体あるいはその誘導体から得られるランダム、ブロックあるいはグラフト共重合体、臭素化ポリスチレン、ゴム強化ポリスチレンなどの変性ポリスチレンなどが挙げられる。
Polystyrene resin Polystyrene resin foam is obtained by foaming a polystyrene resin, and the polystyrene resin used here is not particularly limited, but is a polystyrene homopolymer or methyl derived from only a styrene monomer. From homopolymers obtained from styrene monomers such as styrene, ethyl styrene, isopropyl styrene, dimethyl styrene, chlorostyrene, homopolymers that are copolymerizable with styrene monomers and styrene, or derivatives thereof Examples thereof include random, block or graft copolymers obtained, modified polystyrene such as brominated polystyrene and rubber-reinforced polystyrene.
スチレンと共重合可能な単量体としては、メチルスチレン、ジメチルスチレン、エチルスチレン、ジエチルスチレン、イソプロピルスチレン、ブロモスチレン、ジブロモスチレン、トリブロモスチレン、クロロスチレン、ジクロロスチレン、トリクロロスチレンなどのスチレン誘導体、ビニルトルエン、ビニルキシレン、ジビニルベンゼンなどのビニル化合物、アクリル酸、メタクリル酸、アクリル酸メチル、メタクリル酸メチル、アクリル酸エチル、メタクリル酸エチル、ブタジエン、アクリロニトリルなどの不飽和化合物あるいはその誘導体、無水マレイン酸、無水イタコン酸などが挙げられる。これらは単独あるいは2種以上混合して使用することができる。本発明においては、上述するスチレン系樹脂の中では、経済性、成形加工性の点からポリスチレンホモポリマーが特に好適に使用することができる。 Examples of monomers copolymerizable with styrene include methylstyrene, dimethylstyrene, ethylstyrene, diethylstyrene, isopropylstyrene, bromostyrene, dibromostyrene, tribromostyrene, chlorostyrene, dichlorostyrene, and trichlorostyrene. Vinyl compounds such as vinyltoluene, vinylxylene, divinylbenzene, acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butadiene, acrylonitrile and other unsaturated compounds or derivatives thereof, maleic anhydride And itaconic anhydride. These can be used alone or in admixture of two or more. In the present invention, among the styrenic resins described above, polystyrene homopolymers can be particularly preferably used from the viewpoints of economy and moldability.
ポリスチレン系樹脂の重量平均分子量は、10万〜35万であり、好ましくは15万〜30万、より好ましくは18万〜25万である。 The weight average molecular weight of the polystyrene resin is 100,000 to 350,000, preferably 150,000 to 300,000, more preferably 180,000 to 250,000.
ポリエチレン系樹脂発泡体
ポリエチレン系樹脂発泡体はポリエチレン系樹脂を発泡させて得られ、ここで用いられるポリエチレン系樹脂としては、特に限定されるものではなく、高密度、中密度、低密度ポリエチレン樹脂などを用いることができる。
Polyethylene resin foam The polyethylene resin foam is obtained by foaming a polyethylene resin, and the polyethylene resin used here is not particularly limited, and includes high density, medium density, low density polyethylene resin, etc. Can be used.
ポリプロピレン系樹脂発泡体
ポリプロピレン系樹脂発泡体はポリプロピレン系樹脂を発泡させて得られ、ここで用いられるポリプロピレン系樹脂としては、特に限定されるものではなく、ポロピレンと他のオレフィン樹脂との共重合体などを用いることができる。
Polypropylene resin foam Polypropylene resin foam is obtained by foaming a polypropylene resin. The polypropylene resin used here is not particularly limited, and is a copolymer of propylene and other olefin resins. Etc. can be used.
ポリウレタン系樹脂発泡体
ポリウレタン系樹脂発泡体はポリイシシアヌレート成分とポリオール成分とを発泡剤の存在下で反応させてなる硬質ポリウレタン発泡体などを用いることができる。
Polyurethane resin foam The polyurethane resin foam may be a hard polyurethane foam obtained by reacting a polyisocyanurate component and a polyol component in the presence of a foaming agent.
フェノール系樹脂発泡体
フェノール系樹脂発泡体はフェノール系樹脂を発泡させて得られ、レゾール樹脂に硬化剤、発泡剤を混合してなるフェノール系樹脂発泡体などを用いることができる。
Phenol-based resin foam A phenol-based resin foam is obtained by foaming a phenol-based resin, and a phenol-based resin foam obtained by mixing a curing agent and a foaming agent with a resol resin can be used.
発泡剤
発泡剤としては、物理発泡剤および熱分解型化学発泡剤がある。物理発泡剤としては、特に限定されないが、二酸化炭素、窒素、アルゴン、ヘリウム、空気、水などの無機ガス、メタン、エタン、プロパン、ブタン(ノルマルブタン、イソブタン)、ペンタン(ノルマルペンタン、イソペンタン、ネオペンタン、シクロペンタン)、ヘキサンなどの脂肪族炭化水素、メタノール、エタノール、プロパノールなどの脂肪族アルコール、ジメチルエーテルなどのエーテル系炭化水素などが挙げられる。この他にフロン系の発泡剤も使用可能ではあるが、オゾン層を破壊し地球温暖化を招来するおそれがあるため、環境に配慮する意味ではできる限り使用を控えることが好ましい。
Examples of the foaming agent foaming agent include physical foaming agents and pyrolytic chemical foaming agents. Although it does not specifically limit as a physical foaming agent, Inorganic gas, such as a carbon dioxide, nitrogen, argon, helium, air, water, methane, ethane, propane, butane (normal butane, isobutane), pentane (normal pentane, isopentane, neopentane) , Cyclopentane), aliphatic hydrocarbons such as hexane, aliphatic alcohols such as methanol, ethanol, and propanol, and ether hydrocarbons such as dimethyl ether. In addition, although a fluorocarbon foaming agent can be used, it is preferable to refrain from using it as much as possible in the sense of the environment because it may destroy the ozone layer and cause global warming.
他の物理発泡剤としては、特に限定されるものではないが、例えば、塩化メチル、塩化エチルなどの塩化アルキル類、ジエチルエーテル、メチルエチルエーテル、イソプロピルエーテル、n−ブチルエーテル、ジイソプロピルエーテル、フラン、フルフラール、2−メチルフラン、テトラヒドロフラン、テトラヒドロピランなどのエーテル類、ジメチルケトン、メチルエチルケトン、ジエチルケトン、メチルn−プロピルケトン、メチルn−ブチルケトン、メチルi−ブチルケトン、メチルn−アミルケトン、メチルn−ヘキシルケトン、エチルn−プロピルケトン、エチルn−ブチルケトンなどのケトン類、i−プロピルアルコール、ブチルアルコール、i−ブチルアルコール、t−ブチルアルコールなどのアルコール類、蟻酸メチルエステル、蟻酸エチルエステル、蟻酸プロピルエステル、蟻酸ブチルエステル、蟻酸アミルエステル、プロピオン酸メチルエステル、プロピオン酸エチルエステルなどのカルボン酸エステル類などを用いることができる。また、熱分解型化学発泡剤として例えばアゾ化合物などを用いることができる。これらは単独または2種以上を混合して使用することができる。これらの他の発泡剤を用いることで、良好な可塑化効果や発泡助剤効果が得られ、押出圧力を低減し、安定に発泡体の製造が可能となる。 Other physical foaming agents are not particularly limited, but examples thereof include alkyl chlorides such as methyl chloride and ethyl chloride, diethyl ether, methyl ethyl ether, isopropyl ether, n-butyl ether, diisopropyl ether, furan, furfural. , Ethers such as 2-methylfuran, tetrahydrofuran, tetrahydropyran, dimethyl ketone, methyl ethyl ketone, diethyl ketone, methyl n-propyl ketone, methyl n-butyl ketone, methyl i-butyl ketone, methyl n-amyl ketone, methyl n-hexyl ketone, Ketones such as ethyl n-propyl ketone and ethyl n-butyl ketone, alcohols such as i-propyl alcohol, butyl alcohol, i-butyl alcohol and t-butyl alcohol, methyl formate Le, ethyl formate ester, formate, propyl ester, butyl formate ester formate, amyl esters, methyl propionate, and the like can be used carboxylic acid esters such as propionic acid ethyl ester. Moreover, an azo compound etc. can be used as a thermal decomposition type chemical foaming agent. These can be used individually or in mixture of 2 or more types. By using these other foaming agents, a good plasticizing effect and a foaming aid effect can be obtained, the extrusion pressure can be reduced, and the foam can be stably produced.
上述する発泡剤のなかでも、プロパン、ノルマルブタン、イソブタン、ノルマルペンタン、イソペンタン、シクロペンタン、ネオペンタンなどの炭化水素、塩化メチル、塩化エチルなどの塩化アルキル、二酸化炭素のいずれか1種以上の組み合わせが好ましい。特にブタン、塩化エチル、二酸化炭素の組み合わせが好ましい。 Among the blowing agents described above, a combination of one or more of hydrocarbons such as propane, normal butane, isobutane, normal pentane, isopentane, cyclopentane and neopentane, alkyl chlorides such as methyl chloride and ethyl chloride, and carbon dioxide preferable. In particular, a combination of butane, ethyl chloride, and carbon dioxide is preferable.
樹脂に添加する発泡剤の量としては、スチレン系樹脂100重量部に対して3〜30重量部、好ましくは5〜15重量部、さらに好ましくは5〜10重量部である。 The amount of the foaming agent added to the resin is 3 to 30 parts by weight, preferably 5 to 15 parts by weight, and more preferably 5 to 10 parts by weight with respect to 100 parts by weight of the styrenic resin.
樹脂発泡体の気泡径は、0.1mm〜0.8mmであることが好ましく、0.15mm〜0.7mmであることがより好ましく、0.2mm〜0.6mmであることがさらに好ましい。 The cell diameter of the resin foam is preferably 0.1 mm to 0.8 mm, more preferably 0.15 mm to 0.7 mm, and further preferably 0.2 mm to 0.6 mm.
ハロゲン系難燃剤
また、難燃性を付与するために、ハロゲン系難燃剤を添加してもよく、熱可塑性樹脂に通常使用される難燃剤を特別に限定することなく使用することができる。例えば、ヘキサブロモシクロドデカンなどの脂肪族あるいは脂環族炭化水素の臭素化物、ヘキサブロモベンゼン、エチレンビスペンタブロモジフェニル、デカブロモジフェニルエーテル、オクタブロモジフェニルエーテル、2,3−ジブロモプロピルペンタブロモフェニルエーテルなどの芳香族化合物の臭素化物、テトラブロモビスフェノールA、テトラブロモビスフェノールAビス(2,3−ジブロモプロピルエーテル)、テトラブロモビスフェノールA(2−ブロモエチルエーテル)、テトラブロモビスフェノールAジグリシジルエーテル、テトラブロモビスフェノールAジグリシジルエーテルとトリブロモフェノール付加物などの臭素化ビスフェノール類およびその誘導体、テトラブロモビスフェノールAポリカーボネートオリゴマー、テトラブロモビスフェノールAジグリシジルエーテルとブロモ化ビスフェノール付加物エポキシオリゴマーなどの臭素化ビスフェノール類誘導体オリゴマー、エチレンビステトラブロモフタルイミド、エチレンビスジブロモノルボルナンジカルボキシイミド、ビス(2,4,6−トリブロモフェノキシ)エタン、臭素化SBSブロックポリマー、臭素化アクリル系樹脂などの臭素系芳香族化合物、塩素化パラフィン、塩素化ナフタレン、パークロロペンタデカン、塩素化芳香族化合物、塩素化脂環状化合物などが挙げられる。これら化合物は単独または2種以上を混合して使用できる。
Halogen Flame Retardant In order to impart flame retardancy, a halogen flame retardant may be added, and the flame retardant usually used for thermoplastic resins can be used without any particular limitation. For example, brominated products of aliphatic or alicyclic hydrocarbons such as hexabromocyclododecane, hexabromobenzene, ethylene bispentabromodiphenyl, decabromodiphenyl ether, octabromodiphenyl ether, 2,3-dibromopropylpentabromophenyl ether, etc. Brominated aromatic compounds, tetrabromobisphenol A, tetrabromobisphenol A bis (2,3-dibromopropyl ether), tetrabromobisphenol A (2-bromoethyl ether), tetrabromobisphenol A diglycidyl ether, tetrabromobisphenol Brominated bisphenols such as A diglycidyl ether and tribromophenol adducts and derivatives thereof, tetrabromobisphenol A polycarbonate oligomer Brominated bisphenol derivatives oligomers such as tetrabromobisphenol A diglycidyl ether and brominated bisphenol adduct epoxy oligomer, ethylene bistetrabromophthalimide, ethylene bisdibromonorbornane dicarboximide, bis (2,4,6-tribromophenoxy) Examples include ethane, brominated SBS block polymers, brominated aromatic compounds such as brominated acrylic resins, chlorinated paraffin, chlorinated naphthalene, perchloropentadecane, chlorinated aromatic compounds, and chlorinated alicyclic compounds. These compounds can be used individually or in mixture of 2 or more types.
ハロゲン系難燃剤では、難燃性の観点から臭素系難燃剤が好ましく、特にスチレン系樹脂との相溶性などの点からヘキサブロモシクロドデカン、臭素化SBSブロックポリマー、2,2−ビス(4’(2”,3”−ジブロモアルコキシ)−3’,5’−ジブロモフェニル)−プロパンが好ましい。 Of the halogen-based flame retardants, bromine-based flame retardants are preferable from the viewpoint of flame retardancy, and hexabromocyclododecane, brominated SBS block polymer, 2,2-bis (4 ′) are particularly preferable from the viewpoint of compatibility with styrene resins. (2 ″, 3 ″ -dibromoalkoxy) -3 ′, 5′-dibromophenyl) -propane is preferred.
発泡体中のハロゲン系難燃剤の含有量は、発泡体100重量部に対して、好ましくは0.1〜10重量部であり、さらに好ましくは1〜9重量部、特に好ましくは2〜8重量部である。0.1重量部未満では、本発明の目的とする難燃性が得られず、10重量部を越えると、発泡体を製造する際の成形性などを損なう場合がある。 The content of the halogen-based flame retardant in the foam is preferably 0.1 to 10 parts by weight, more preferably 1 to 9 parts by weight, and particularly preferably 2 to 8 parts by weight with respect to 100 parts by weight of the foam. Part. If the amount is less than 0.1 parts by weight, the flame retardancy targeted by the present invention cannot be obtained. If the amount exceeds 10 parts by weight, the moldability during production of the foam may be impaired.
ハロゲン系難燃剤とともにリン酸エステルを共存させることによって、酸化チタンを含有した燃焼性の高い場合でも、燃焼を抑制することができ、高度な断熱性を達成するとともに、JISA9511:2006Rに規定される高度の難燃性を達成することができる。 By allowing a phosphate ester to coexist with a halogen-based flame retardant, combustion can be suppressed even in the case of high flammability containing titanium oxide, achieving high heat insulation, and specified in JIS A9511: 2006R. High flame retardancy can be achieved.
用いられるリン酸エステルとしては、トリフェニルフォスフェートに限定されるものではなく、トリクレジルホスフェート、トリキシリレニルホスフェート、クレジルジフェニルフォスフェート、2−エチルヘキシルジフェニルホスフェート、トリメチルホスフェート、トリエチルホスフェート、トリブチルホスフェート、トリス(2−エチルヘキシル)ホスフェート、トリス(ブトキシエチル)ホスフェート、または縮合リン酸エステルとして、芳香族リン酸エステルが好ましく、特にリン酸トリフェニルが好ましい。 The phosphate ester used is not limited to triphenyl phosphate, but tricresyl phosphate, trixylylenyl phosphate, cresyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, trimethyl phosphate, triethyl phosphate, tributyl As the phosphate, tris (2-ethylhexyl) phosphate, tris (butoxyethyl) phosphate, or condensed phosphate, an aromatic phosphate is preferable, and triphenyl phosphate is particularly preferable.
断熱材に混練される熱線遮蔽材について
本発明においては、以下に説明する白色系顔料、黒色系顔料、有色顔料などの熱線遮蔽材は基本的には不要であり、場合によっては、断熱性能の特段の向上が得られなかったり、コスト高となることもあるが、特に問題がない場合には断熱材に熱線遮蔽材を混練してもよい。なお、以下に説明する白色系顔料、黒色系顔料、有色顔料などの熱線遮蔽材は、後述する「熱線遮蔽材の層」の材料としても好適に用いられる。
Regarding the heat ray shielding material kneaded in the heat insulating material, in the present invention, the heat ray shielding material such as a white pigment, black pigment, and colored pigment described below is basically unnecessary, and in some cases, the heat ray shielding material has a heat insulation performance. Although no particular improvement may be obtained or the cost may be high, a heat ray shielding material may be mixed with the heat insulating material if there is no particular problem. It should be noted that heat ray shielding materials such as white pigments, black pigments, and colored pigments described below are also suitably used as materials for a “heat ray shielding material layer” described later.
白色系顔料
白色系顔料としては、例えば、鉛白(塩基性炭酸鉛:(PbCO3)2・Pb(OH)2)、亜鉛華(酸化亜鉛)、酸化チタン、硫化亜鉛、リトポン(硫化亜鉛と硫酸バリウムとの混合物)、アンチモン白、雲母、酸化アルミニウム、アルミナホワイト、ホワイトカーボンなどが挙げられ、これらの中でも酸化チタンが好ましい。
As the white pigment white pigment, for example, white lead (basic lead carbonate: (PbCO 3) 2 · Pb (OH) 2), zinc white (zinc oxide), titanium oxide, zinc sulfide, lithopone (zinc sulfide and A mixture with barium sulfate), antimony white, mica, aluminum oxide, alumina white, white carbon and the like. Among these, titanium oxide is preferable.
白色系顔料(例えば酸化チタン)の平均粒径については、特に限定されるものではないが、樹脂への発色性を考慮すれば、0.1μm〜0.5μmが好ましい(0.15μm〜0.3μmがさらに好ましい)。この範囲の平均粒径であれば、分散性や発色性がよく可視光域400〜800nm付近での白色度合いを向上させることができる。一方、近赤外線から遠赤外線領域において樹脂への赤外線吸収を抑制したい場合には、0.8μm〜1.5μmが好ましい(0.8μm〜1.0μmがさらに好ましい)。これら平均粒径の異なる白色系顔料を10重量%〜90重量%の範囲内で混合することにより、赤外線領域の反射および可視光域での白色度合いを向上させた混合酸化チタンを得ることができる。 The average particle diameter of the white pigment (for example, titanium oxide) is not particularly limited, but is preferably 0.1 μm to 0.5 μm (0.15 μm to 0.005 μm) in consideration of the color developability to the resin. 3 μm is more preferable). If the average particle diameter is in this range, the dispersibility and color developability are good, and the whiteness in the visible light region of 400 to 800 nm can be improved. On the other hand, when it is desired to suppress infrared absorption to the resin in the near infrared to far infrared region, 0.8 μm to 1.5 μm is preferable (0.8 μm to 1.0 μm is more preferable). By mixing these white pigments having different average particle diameters in the range of 10 wt% to 90 wt%, it is possible to obtain a mixed titanium oxide with improved reflection in the infrared region and whiteness in the visible light region. .
断熱材に添加する白色系顔料の量としては、スチレン系樹脂100重量部に対して0.1〜10重量部、好ましくは1〜8重量部、さらに好ましくは2〜4重量部である。 The amount of the white pigment added to the heat insulating material is 0.1 to 10 parts by weight, preferably 1 to 8 parts by weight, and more preferably 2 to 4 parts by weight with respect to 100 parts by weight of the styrene resin.
黒色系顔料
黒色系顔料としては、グラファイト、カーボンブラック、クロム黒、クロム酸銅などが挙げられ、これらの中でもグラファイトやカーボンブラックが好ましい。グラファイトとしては、鱗片状黒鉛、鱗状(塊状)黒鉛、土状黒鉛、人造黒鉛または熱分解黒鉛などの天然黒鉛でもあってもよい。グラファイトは、固定炭素数80%以上が望ましく、90%以上がより望ましい。
Black pigments Examples of black pigments include graphite, carbon black, chromium black, and copper chromate. Among these, graphite and carbon black are preferable. The graphite may be natural graphite such as flaky graphite, scaly (lumpy) graphite, earthy graphite, artificial graphite, or pyrolytic graphite. Graphite desirably has a fixed carbon number of 80% or more, more preferably 90% or more.
黒色系顔料の平均粒径については、特に限定されるものではないが、例えばカーボンブラックでは10〜300nm(0.01〜0.3μm)が好ましく、200〜290nm(0.2〜0.29μm)がより好ましい。また、グラファイトでは1〜30μmが好ましく、3〜15μmがより好ましい。グラファイトの平均粒径は、酸化チタンと同様に発色性および赤外線領域での赤外線吸収/反射度合いに影響を与えるため、平均粒径10μm以上とすることが好ましい。また、グラファイトの平均粒径が30μmを超えると、発泡体の気泡の連通性が増大し断熱性能を著しく低下させる。 The average particle size of the black pigment is not particularly limited, but for example, carbon black is preferably 10 to 300 nm (0.01 to 0.3 μm), and 200 to 290 nm (0.2 to 0.29 μm). Is more preferable. Moreover, 1-30 micrometers is preferable in a graphite, and 3-15 micrometers is more preferable. The average particle size of graphite is preferably set to an average particle size of 10 μm or more in order to affect the color developability and the degree of infrared absorption / reflection in the infrared region in the same manner as titanium oxide. On the other hand, if the average particle diameter of graphite exceeds 30 μm, the connectivity of the bubbles in the foam increases and the heat insulation performance is remarkably lowered.
断熱材に添加する黒色系顔料の量としては、スチレン系樹脂100重量部に対して0.1〜2.5重量部、好ましくは0.3〜2.0重量部、さらに好ましくは0.5〜1.2重量部である。 The amount of the black pigment added to the heat insulating material is 0.1 to 2.5 parts by weight, preferably 0.3 to 2.0 parts by weight, more preferably 0.5 to 100 parts by weight of the styrene resin. -1.2 parts by weight.
有色顔料
有色顔料としては、平均粒径0.5μm以下(好ましくは0.1〜0.3μm)の有機系有色顔料が好ましく、例えば青色系であればフタロシアニンブルーが好ましい。また、無機系有色顔料は平均粒径が1μm以上のものがあり、赤外線領域で波長が大きい箇所には有効な反射作用を示す。しかしながら、無機系有色顔料は有機系顔料とは異なり発色性および分散性が乏しい場合が多く、有機系顔料に比べて多く(例えば5倍以上)の添加量が必要となる場合があることに注意する必要がある。一般に、添加物の添加量が増加すれば、発泡体を成形する際に核剤として作用し気泡径を著しく縮小させたりする場合があるのであまり好ましくなく、またコストの面からも好ましくない。
The colored pigment is preferably an organic colored pigment having an average particle size of 0.5 μm or less (preferably 0.1 to 0.3 μm). For example, phthalocyanine blue is preferable for a blue pigment. Further, some inorganic colored pigments have an average particle diameter of 1 μm or more, and exhibit an effective reflecting action at locations where the wavelength is large in the infrared region. However, note that inorganic colored pigments, unlike organic pigments, often have poor color developability and dispersibility, and may require a larger amount (for example, 5 times or more) than organic pigments. There is a need to. In general, an increase in the amount of additive added is not preferable because it may act as a nucleating agent when the foam is molded to significantly reduce the bubble diameter, and is not preferable from the viewpoint of cost.
スチレン系樹脂に添加する有色顔料の量としては、スチレン系樹脂100重量部に対して0.01〜0.5重量部、好ましくは0.03〜0.2重量部、さらに好ましくは0.05〜0.15重量部である。 The amount of the colored pigment added to the styrenic resin is 0.01 to 0.5 parts by weight, preferably 0.03 to 0.2 parts by weight, more preferably 0.05 to 100 parts by weight of the styrenic resin. ~ 0.15 parts by weight.
その他の添加剤
また、必要に応じて気泡の大きさを調整するためにタルク、ケイ酸カルシウムなどの気泡調整剤、ステアリン酸バリウム、ステアリン酸カルシウムなどの押出助剤、酸化マグネシウム、ピロリン酸テトラナトリウムなどの脱酸剤などを添加することが望ましい。
Other additives In addition, to adjust the size of bubbles as needed, bubble adjusters such as talc and calcium silicate, extrusion aids such as barium stearate and calcium stearate, magnesium oxide, tetrasodium pyrophosphate, etc. It is desirable to add a deoxidizer.
樹脂発泡体の製造方法
樹脂発泡体は、例えば押出発泡法で得ることができる。ここで用いられる押出発泡法は、例えば、樹脂を加熱溶融し、高温高圧下で、発泡剤を該溶融樹脂に圧入して混練した後、押出発泡に適する温度にまで冷却し、ダイを通じて低圧下に押出発泡して製造する公知の方法と同様であることができる。また、押出発泡した後にさらに二次発泡させてもよく、この二次発泡方法としては、特開昭63−159034号に記載された水蒸気/加熱空気トンネルなどを用いることができる。また、特開昭63−37916号に記載の成形装置に接触する方法を用いることも可能である。
Method for Producing Resin Foam Resin foam can be obtained, for example, by extrusion foaming. The extrusion foaming method used here is, for example, heat-melting a resin, pressing and kneading a foaming agent into the molten resin under high temperature and high pressure, cooling to a temperature suitable for extrusion foaming, and lowering the pressure through a die. It can be the same as the known method of producing by extrusion foaming. Further, secondary foaming may be performed after extrusion foaming, and as this secondary foaming method, a steam / heated air tunnel described in JP-A-63-159034 can be used. It is also possible to use a method for contacting a molding apparatus described in JP-A-63-37916.
例えば、ポリスチレン系樹脂を加熱溶融する際の溶融温度は、160〜240℃、好ましくは170〜230度、より好ましくは180〜220℃で、押出機によって固形原料を溶融混練する。また、発泡剤を圧入する際の圧力は、110〜200kg/cm2、より好ましくは120〜185kg/cm2である。押出機によって溶融された固形原料と発泡剤はミキサー(回転数:20〜40rpm、より好ましくは25〜35rpm)によって混練され、クーラーによってゆっくりと冷却される。また、ゲルを冷却し発泡するときの最適温度は、100〜130℃、より好ましくは110〜125度である。 For example, the melting temperature when the polystyrene resin is heated and melted is 160 to 240 ° C., preferably 170 to 230 ° C., more preferably 180 to 220 ° C., and the solid raw material is melt-kneaded by an extruder. The pressure at the time of press-fitting the blowing agent, 110~200kg / cm 2, more preferably 120~185kg / cm 2. The solid raw material and the foaming agent melted by the extruder are kneaded by a mixer (rotational speed: 20 to 40 rpm, more preferably 25 to 35 rpm) and slowly cooled by a cooler. Moreover, the optimal temperature when cooling and foaming a gel is 100-130 degreeC, More preferably, it is 110-125 degree | times.
また、ポリエチレン系樹脂発泡体、ポリプロピレン系樹脂発泡体、ポリウレタン系樹脂発泡体、フェノール系樹脂発泡体の場合は、当業者間で一般的に知られている技術を用いて製造条件を選択、調整することができる。 In the case of polyethylene resin foam, polypropylene resin foam, polyurethane resin foam, and phenol resin foam, manufacturing conditions are selected and adjusted using techniques generally known among those skilled in the art. can do.
また、上述する白色系顔料(例えば酸化チタン)、黒色系顔料(例えばグラファイト)、有色顔料およびリン酸エステルを添加する場合には、加熱溶融された樹脂に添加する前に、予め樹脂とのマスターバッチとしておくことが好ましい。 In addition, when adding the above-described white pigment (for example, titanium oxide), black pigment (for example, graphite), colored pigment, and phosphate ester, before adding to the heat-melted resin, a master with the resin in advance. It is preferable to make it a batch.
顔料のマスターバッチを製造するときには、一般的に押出機の安定性を確保するため、例えば約5%程度のステアリン酸マグネシウムなどの金属系のステアリン酸を使用する場合があるが、これらの添加は難燃性能を低下させたり、気泡径を変動させたりする場合があった。一方、トリフェニルフォスフェートの融点は49℃付近であり、発泡体の製造過程で直接押出機に投入すると、添加量0.3重量部以上では、押出機のサージングが発生したり吐出量が不安定になったりして生産性が著しく低下する場合がある。 When producing a master batch of pigment, in order to ensure the stability of the extruder, metal-based stearic acid such as about 5% magnesium stearate may be used. In some cases, the flame retardant performance was lowered or the bubble diameter was changed. On the other hand, the melting point of triphenyl phosphate is around 49 ° C., and if it is directly fed into the extruder during the foam production process, surging of the extruder occurs or the discharge amount is not good at an addition amount of 0.3 parts by weight or more. In some cases, it becomes stable and the productivity is significantly reduced.
したがって、ステアリン酸の代替として、0.1%〜10%、望ましくは5%前後のトリフェニルフォスフェートを顔料の予めマスターバッチ製造過程で投入しておくことで、これら原料の配合比の均一化、ならびにトリフェニルフォスフェートの良好な添加が可能になる。また、マスターバッチ製造過程において、リン酸トリフェニルの可塑化効果により樹脂の溶融性をより向上させることができ、顔料およびトリフェニルフォスフェートの各々を直接押出機に投入するよりもマスターバッチで投入した方が容易に均一分散させることが可能であり、さらに押出成形の後も安定した分散性を得ることが可能になる。 Therefore, as an alternative to stearic acid, triphenyl phosphate of 0.1% to 10%, preferably around 5%, is added in advance in the masterbatch production process of the pigment, so that the mixing ratio of these raw materials is made uniform. As well as good addition of triphenyl phosphate. Also, in the masterbatch manufacturing process, the resin meltability can be further improved by the plasticizing effect of triphenyl phosphate, so that each of the pigment and triphenyl phosphate is fed into the masterbatch rather than directly into the extruder. Thus, it is possible to easily disperse uniformly, and it is possible to obtain a stable dispersibility after extrusion.
熱線遮蔽材の層
熱線遮蔽材の層に用いられる材料(熱線反射材、熱線吸収材料)は、熱線を反射または吸収するものであれば特には限定されず、アルミニウムなどの金属材料、ポリエチレンテレフタレートなどの樹脂などがある。さらに酸化チタン、酸化亜鉛、硫酸バリウムなどの金属酸化物、マイカ(雲母)などのセラミック、顔料などを含んだ塗料・接着剤などが挙げられる。なお、詳しくは上記「白色系顔料」、「黒色系顔料」や「有機顔料」の欄でも説明した。これらの中でも好ましい材料として、熱線の反射効果の高いアルミニウム箔が好ましい。
Heat ray shielding material layer The material used for the heat ray shielding material layer (heat ray reflecting material, heat ray absorbing material) is not particularly limited as long as it reflects or absorbs heat rays, such as a metal material such as aluminum, polyethylene terephthalate, etc. There are resin etc. In addition, examples include metal oxides such as titanium oxide, zinc oxide, and barium sulfate, ceramics such as mica (mica), paints and adhesives containing pigments, and the like. The details are also described in the “white pigment”, “black pigment” and “organic pigment” sections. Among these, an aluminum foil having a high heat ray reflection effect is preferable as a preferable material.
また、複数の断熱材同士を接合するとともにこれらの間に熱線遮蔽材の層を形成するために、接合時に熱線遮蔽材を含んだ接着剤を用いることも好ましい。なお、接着剤としては、断熱材の層同士や断熱材の層と熱線遮蔽材の層とを接合できるものであれば特に限定されないが、エポキシ系接着剤、ウレタン系接着剤、合成ゴム系ホットメルト接着剤などが挙げられる。 Moreover, in order to join a plurality of heat insulating materials and to form a layer of a heat ray shielding material between them, it is also preferable to use an adhesive containing a heat ray shielding material at the time of joining. The adhesive is not particularly limited as long as it can join the heat insulating layers or the heat insulating material layer and the heat ray shielding material layer. However, the adhesive is not limited to epoxy adhesive, urethane adhesive, and synthetic rubber hot. Examples thereof include a melt adhesive.
また、断熱材の層として平板状のポリスチレン系発泡体を用い、熱線遮蔽材の層としてアルミニウム箔を用いる場合には、アルミニウム箔の少なくとも両方の面にポリスチレンから成るフィルムをドライラミネーションによって裏打ちしてフィルム付きアルミニウム箔とし、同フィルム付きアルミニウム箔を熱ラミネーションによって平板状のポリスチレン系発泡体に接合してもよい。また、断熱材に接着剤を塗布し、アルミニウム箔を接合してもよく、このときの接着方法は全面接着または部分接着(点付け、線状付け)のいずれでもよい。 When a flat polystyrene foam is used as the heat insulating material layer and an aluminum foil is used as the heat ray shielding material layer, a film made of polystyrene is lined by dry lamination on at least both surfaces of the aluminum foil. An aluminum foil with a film may be used, and the aluminum foil with a film may be bonded to a flat polystyrene foam by thermal lamination. Further, an adhesive may be applied to the heat insulating material, and the aluminum foil may be joined, and the bonding method at this time may be either full-surface bonding or partial bonding (dotting or linear bonding).
熱線遮蔽材の層は、断熱材の層同士の間の一面にも配置されていてもよいし、例えば短冊状の熱線遮蔽材を用いて、断熱材の層同士の間でストライプ状に配置してもよい。 The heat ray shielding material layer may be arranged on one surface between the heat insulating material layers, for example, a strip-like heat ray shielding material, and arranged in a stripe shape between the heat insulating material layers. May be.
複合断熱材の特性
本発明に係る複合断熱材の熱伝導率は、比較対象の断熱材(熱線遮蔽材の層を有さない断熱材)の熱伝導率に比べて、96.5%以下の低減割合であることが好ましく、92.0%以下の低減割合であることがより好ましく、87.0%以下の低減割合であることがさらに好ましい。なお、熱伝導率はJIS A 1412−2:1999に準拠する方法で測定する。
Characteristics of the composite heat insulating material The heat conductivity of the composite heat insulating material according to the present invention is 96.5% or less compared to the heat conductivity of the heat insulating material to be compared (heat insulating material having no heat ray shielding material layer). A reduction ratio is preferable, a reduction ratio of 92.0% or less is more preferable, and a reduction ratio of 87.0% or less is more preferable. In addition, thermal conductivity is measured by the method based on JIS A 1412-2: 1999.
以下の実施例および比較例に示すように、種々の複合断熱材を作製して、その熱伝導率を測定した。また、複合断熱材のもとになる発泡板については、その密度、気泡径(セルサイズ)を測定した。以下の各物性値の測定法を説明する。 As shown in the following Examples and Comparative Examples, various composite heat insulating materials were produced and their thermal conductivity was measured. Moreover, the density and bubble diameter (cell size) were measured about the foam board used as the base of a composite heat insulating material. A method for measuring the following physical property values will be described.
(密度)
発泡板の密度は、発泡体の重量(kg)を発泡体の体積(m3)で割ることで算出した。
(気泡径)
発泡板の気泡径は、ASTM D 3567に準拠する方法で測定した。
(熱伝導率)
発泡板の熱伝導率は、JIS A 1412−2:1999に準拠する方法で測定した。
(density)
The density of the foam plate was calculated by dividing the weight (kg) of the foam by the volume (m 3 ) of the foam.
(Bubble diameter)
The bubble diameter of the foam plate was measured by a method based on ASTM D 3567.
(Thermal conductivity)
The thermal conductivity of the foamed plate was measured by a method based on JIS A 1412-2: 1999.
<実施例1〜7、比較例1〜2で用いた発泡板(1)の製造方法>
重量平均分子量210,000のスチレン樹脂100重量部に対して、押出機の滑剤としてステアリン酸バリウム(日油社製)0.1重量部、安定剤として酸化マグネシウム(神島化学L−10)0.05重量部、気泡調整剤としてポリエチレン(ダウレックス)0.5重量部、および難燃剤としてヘキサブロモシクロドデカン(HBCD、アルベマールSAYTEX HP−900)2重量部を押出機のホッパーに投入し、発泡剤として工業ブタン(ノルマルブタン/イソブタン=65/35)2重量部、エチルクロライド4重量部、二酸化炭素3重量部を圧入(180kg/cm2)し200℃で混練した。次に、冷却機でゲルを均一に冷却して最適な発泡温度(120℃)に調整し、ダイから大気圧下に押出発泡することにより気泡径約0.58mm、密度約27Kg/cm3、厚み約30mmの発泡板を製造した(いずれもスキン層をトリミングした状態での測定値)。試験片を作製するため、押出発泡直後に、厚さ方向に5枚スライスし、1枚当たり5mm(厚み)×200mm×200mmの発泡板を5枚得た。このようにして得られた発泡板(1)を下記実施例および比較例にて使用した。
<The manufacturing method of the foam board (1) used in Examples 1-7 and Comparative Examples 1-2>
0.1 parts by weight of barium stearate (manufactured by NOF Corporation) as a lubricant for an extruder and magnesium oxide (Kamishima Chemical L-10) as a stabilizer for 100 parts by weight of a styrene resin having a weight average molecular weight of 210,000. 05 parts by weight, 0.5 part by weight of polyethylene (Daurex) as a foam control agent, and 2 parts by weight of hexabromocyclododecane (HBCD, Albemarle SAYTEX HP-900) as a flame retardant are put into a hopper of an extruder, and a foaming agent 2 parts by weight of industrial butane (normal butane / isobutane = 65/35), 4 parts by weight of ethyl chloride and 3 parts by weight of carbon dioxide were press-fitted (180 kg / cm 2 ) and kneaded at 200 ° C. Next, the gel is uniformly cooled with a cooler, adjusted to an optimal foaming temperature (120 ° C.), and extruded and foamed from the die under atmospheric pressure to obtain a bubble diameter of about 0.58 mm, a density of about 27 Kg / cm 3 , A foamed plate having a thickness of about 30 mm was produced (measured values in a state where the skin layer was trimmed). In order to produce a test piece, immediately after extrusion foaming, 5 sheets were sliced in the thickness direction to obtain 5 foam plates of 5 mm (thickness) × 200 mm × 200 mm per sheet. The foamed plate (1) thus obtained was used in the following examples and comparative examples.
<比較例1>
5枚の発泡板(1)を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例1に係る断熱材を作製した。なお、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例1〜7、比較例2においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例1〜7、比較例2においても同じ)。その結果、熱伝導率は37.7mW/mKであった(表1を参照)。
<Comparative Example 1>
Five foam plates (1) were laminated (a total of five foam plates from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 1. In addition, the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Examples 1 to 7 and Comparative Example 2 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 1 below). -7 and the same in Comparative Example 2). As a result, the thermal conductivity was 37.7 mW / mK (see Table 1).
<比較例2>
5枚の発泡板(1)を積層させ、さらに第1層目の発泡板の上に厚み11μmのアルミニウム箔(サン・アルミニウム工業株式会社)を積層させ、比較例2に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は37.7mW/mKであり、比較例1の結果と同じであった(表1を参照)。
<Comparative Example 2>
Five foam plates (1) are laminated, and an aluminum foil (Sun Aluminum Industry Co., Ltd.) having a thickness of 11 μm is further laminated on the first foam plate to produce a composite heat insulating material according to Comparative Example 2. did. The result of measuring the thermal conductivity of this composite heat insulating material was 37.7 mW / mK, which was the same as the result of Comparative Example 1 (see Table 1).
<実施例1>
5枚の発泡板(1)を積層させる際に、第1層目の発泡板と第2層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例1に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は36.2mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、96.0%に低減されたものであった(表1を参照)。
<Example 1>
When laminating five foam plates (1), an aluminum foil having a thickness of 11 μm is sandwiched between the first and second foam plates, and the composite heat insulating material according to Example 1 Was made. The result of measuring the thermal conductivity of this composite heat insulating material was 36.2 mW / mK. This result was reduced to 96.0% as compared with the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例2>
5枚の発泡板(1)を積層させる際に、第2層目の発泡板と第3層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例2に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は35.9mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、95.2%に低減されたものであった(表1を参照)。
<Example 2>
When laminating five foam plates (1), an aluminum foil having a thickness of 11 μm is sandwiched between the second and third foam plates, and the composite heat insulating material according to the second embodiment. Was made. The result of measuring the thermal conductivity of this composite heat insulating material was 35.9 mW / mK. This result was reduced to 95.2% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例3>
5枚の発泡板(1)を積層させる際に、第3層目の発泡板と第4層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例3に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は35.9mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、95.2%に低減されたものであった(表1を参照)。
<Example 3>
When laminating five foam plates (1), an aluminum foil having a thickness of 11 μm is sandwiched between the third and fourth foam plates, and the composite heat insulating material according to Example 3 Was made. The result of measuring the thermal conductivity of this composite heat insulating material was 35.9 mW / mK. This result was reduced to 95.2% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例4>
5枚の発泡板(1)を積層させる際に、第4層目の発泡板と第5層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例4に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は36.3mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、96.3%に低減されたものであった(表1を参照)。
<Example 4>
When laminating five foam plates (1), an aluminum foil having a thickness of 11 μm is sandwiched between the fourth foam plate and the fifth foam plate, and the composite heat insulating material according to Example 4 Was made. The result of measuring the thermal conductivity of this composite heat insulating material was 36.3 mW / mK. This result was reduced to 96.3% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例5>
5枚の発泡板(1)を積層させる際に、第1層目の発泡板と第2層目の発泡板との間および第4層目の発泡板と第5層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例5に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は34.6mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、91.8%に低減されたものであった(表1を参照)。
<Example 5>
When laminating the five foam plates (1), between the first layer foam plate and the second layer foam plate and between the fourth layer foam plate and the fifth layer foam plate An aluminum foil having a thickness of 11 μm was sandwiched therebetween to produce a composite heat insulating material according to Example 5. The result of measuring the thermal conductivity of this composite heat insulating material was 34.6 mW / mK. This result was reduced to 91.8% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例6>
5枚の発泡板(1)を積層させる際に、第2層目の発泡板と第3層目の発泡板との間および第3層目の発泡板と第4層目の発泡板との間に厚み11μmのアルミニウム箔を挟み込んで、実施例6に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は34.7mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、92.0%に低減されたものであった(表1を参照)。
<Example 6>
When laminating the five foam plates (1), between the second-layer foam plate and the third-layer foam plate and between the third-layer foam plate and the fourth-layer foam plate An aluminum foil having a thickness of 11 μm was sandwiched therebetween to produce a composite heat insulating material according to Example 6. The result of measuring the thermal conductivity of this composite heat insulating material was 34.7 mW / mK. This result was reduced to 92.0% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
<実施例7>
5枚の発泡板(1)を積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例7に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は32.8mW/mKであった。この結果は、比較例1に係る断熱材の熱伝導率37.7mW/mKと比較して、87.0%に低減されたものであった(表1を参照)。
<Example 7>
When the five foamed plates (1) were laminated, an aluminum foil having a thickness of 11 μm (a total of four) was sandwiched between the foamed plates to produce a composite heat insulating material according to Example 7. The result of measuring the thermal conductivity of this composite heat insulating material was 32.8 mW / mK. This result was reduced to 87.0% compared to the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 1 (see Table 1).
以上の実施例1〜7および比較例1、2の結果から、断熱材の表面にアルミニウム箔などの熱線遮蔽層を配置しても熱伝導率を低減させることはできなかったが(比較例2)、断熱材の中(各発泡板の間)に熱線遮蔽層を配置することで熱伝導率を低減できることが分かった(実施例1〜7)。また、断熱材の中に配置する熱線遮蔽層の数を多くするほど、熱伝導率をより低減できることが分かった(実施例5〜7)。 From the results of Examples 1 to 7 and Comparative Examples 1 and 2 described above, it was not possible to reduce the thermal conductivity even when a heat ray shielding layer such as an aluminum foil was disposed on the surface of the heat insulating material (Comparative Example 2). ), It was found that the heat conductivity can be reduced by disposing a heat ray shielding layer in the heat insulating material (between each foamed plate) (Examples 1 to 7). Moreover, it turned out that heat conductivity can be reduced more, so that the number of the heat ray shielding layers arrange | positioned in a heat insulating material is increased (Examples 5-7).
<実施例8、比較例3で用いた発泡板(2)の製造方法>
重量平均分子量210,000のスチレン樹脂100重量部に対して、押出機の滑剤としてステアリン酸バリウム(日油社製)0.1重量部、安定剤として酸化マグネシウム(神島化学L−10)0.08重量部、気泡調整剤としてタルク(富士タルク、タルクLMR)0.05重量部、および難燃剤としてヘキサブロモシクロドデカン(HBCD、アルベマールSAYTEX HP−900)4.5重量部を押出機のホッパーに投入し、発泡剤として工業ブタン(イソブタン)3.0重量部、エチルクロライド2.4重量部、二酸化炭素2.5重量部を圧入(180kg/cm2)し200℃で混練した。次に、冷却機でゲルを均一に冷却して最適な発泡温度(120℃)に調整し、ダイから大気圧下に押出発泡することにより気泡径約0.23mm、密度約32Kg/cm3、厚み約30mmの発泡板を製造した(いずれもスキン層をトリミングした状態での測定値)。試験片を作製するため、押出発泡直後に、厚さ方向に5枚スライスし、1枚当たり5mm(厚み)×200mm×200mmの発泡板を5枚得た。このようにして得られた発泡板(2)を下記実施例および比較例にて使用した。
<The manufacturing method of the foam board (2) used in Example 8 and Comparative Example 3>
0.1 parts by weight of barium stearate (manufactured by NOF Corporation) as a lubricant for an extruder and magnesium oxide (Kamishima Chemical L-10) as a stabilizer for 100 parts by weight of a styrene resin having a weight average molecular weight of 210,000. 08 parts by weight, 0.05 parts by weight of talc (Fuji talc, talc LMR) as a foam regulator, and 4.5 parts by weight of hexabromocyclododecane (HBCD, Albemarle SAYTEX HP-900) as a flame retardant are used in the hopper of the extruder. As a blowing agent, 3.0 parts by weight of industrial butane (isobutane), 2.4 parts by weight of ethyl chloride, and 2.5 parts by weight of carbon dioxide were injected (180 kg / cm 2 ) and kneaded at 200 ° C. Next, the gel is uniformly cooled with a cooler, adjusted to an optimal foaming temperature (120 ° C.), and extruded and foamed from a die under atmospheric pressure to obtain a bubble diameter of about 0.23 mm, a density of about 32 Kg / cm 3 , A foamed plate having a thickness of about 30 mm was produced (measured values in a state where the skin layer was trimmed). In order to produce a test piece, immediately after extrusion foaming, 5 sheets were sliced in the thickness direction to obtain 5 foam plates of 5 mm (thickness) × 200 mm × 200 mm per sheet. The foamed plate (2) thus obtained was used in the following examples and comparative examples.
<比較例3>
5枚の発泡板(2)を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例3に係る断熱材を作製した。なお、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例8においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例8においても同じ)。その結果、熱伝導率は29.9mW/mKであった(表2を参照)。
約0.58mmの気泡径を有する発泡板(1)に比べて、約0.23mmの小さい気泡径を有する発泡板(2)を用いたため、熱伝導率が比較例1の熱伝導率37.7mW/mKに比べて大きく低減している。これは、気泡径の減少により気泡膜の厚みは薄くなるが厚みあたりの総気泡膜が多くなり輻射が低減したためである。
<Comparative Example 3>
Five foam plates (2) were laminated (a total of five sheets from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 3. Note that the foam plates were not bonded to each other and overlapped in a free state (the same applies to Example 8 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by setting a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 8 below). The same applies to As a result, the thermal conductivity was 29.9 mW / mK (see Table 2).
Since the foamed plate (2) having a small bubble diameter of about 0.23 mm was used compared to the foamed plate (1) having a bubble diameter of about 0.58 mm, the thermal conductivity was 37. Compared to 7 mW / mK, it is greatly reduced. This is because the bubble film thickness is reduced due to the reduction of the bubble diameter, but the total bubble film per thickness is increased and radiation is reduced.
<実施例8>
5枚の発泡板(2)を積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例8に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は27.1mW/mKであった。この結果は、比較例3に係る断熱材の熱伝導率29.9mW/mKと比較して、90.6%に低減されたものであった(表2を参照)。
実施例8の結果から、発泡板(2)のように気泡径が比較的小さい発泡板であっても、断熱材の中(各発泡板の間)にアルミニウム箔などの熱線遮蔽層を設けることで、断熱材の熱伝導率をさらに低減できることが分かる。
<Example 8>
When the five foamed plates (2) were laminated, an aluminum foil having a thickness of 11 μm (a total of four) was sandwiched between the foamed plates to produce a composite heat insulating material according to Example 8. The result of measuring the thermal conductivity of this composite heat insulating material was 27.1 mW / mK. This result was reduced to 90.6% compared to the thermal conductivity of 29.9 mW / mK of the heat insulating material according to Comparative Example 3 (see Table 2).
From the results of Example 8, by providing a heat ray shielding layer such as an aluminum foil in the heat insulating material (between each foamed plate) even if the foam diameter is relatively small like the foamed plate (2), It can be seen that the thermal conductivity of the heat insulating material can be further reduced.
<実施例9、比較例4で用いた発泡板(3)の製造方法>
重量平均分子量210,000のスチレン樹脂100重量部に対して、押出機の滑剤としてステアリン酸バリウム(日油社製)0.1重量部、安定剤として酸化マグネシウム(神島化学L−10)0.08重量部、気泡調整剤としてタルク(富士タルク、タルクLMR)0.2重量部、および難燃剤としてヘキサブロモシクロドデカン(HBCD、アルベマールSAYTEX HP−900)6.0重量部、熱線遮蔽材として酸化チタン(TiO2、デュポンR−104)4.0重量部(酸化チタンは酸化チタン/ポリスチレン=30%/70%のマスターバッチを使用)を押出機のホッパーに投入し、発泡剤として工業ブタン(イソブタン)3.5重量部、エチルクロライド2.0重量部、二酸化炭素2.0重量部を圧入(160kg/cm2)し200℃で混練した。次に、冷却機でゲルを均一に冷却して最適な発泡温度(120℃)に調整し、ダイから大気圧下に押出発泡することにより気泡径約0.32mm、密度約32Kg/cm3、厚み約75mmの発泡板を製造した(いずれもスキン層をトリミングした状態での測定値)。試験片を作製するため、押出発泡直後に、厚さ方向に5枚スライスし、1枚当たり5mm(厚み)×200mm×200mmの発泡板を5枚得た。このようにして得られた発泡板(3)を下記実施例および比較例にて使用した。
<The manufacturing method of the foam board (3) used in Example 9 and Comparative Example 4>
0.1 parts by weight of barium stearate (manufactured by NOF Corporation) as a lubricant for an extruder and magnesium oxide (Kamishima Chemical L-10) as a stabilizer for 100 parts by weight of a styrene resin having a weight average molecular weight of 210,000. 08 parts by weight, 0.2 parts by weight of talc (Fuji talc, talc LMR) as a bubble regulator, and 6.0 parts by weight of hexabromocyclododecane (HBCD, Albemarle SAYTEX HP-900) as a flame retardant, oxidized as a heat ray shielding material 4.0 parts by weight of titanium (TiO2, DuPont R-104) (titanium oxide uses a master batch of titanium oxide / polystyrene = 30% / 70%) is introduced into the hopper of an extruder, and industrial butane (isobutane as a blowing agent) ) 3.5 parts by weight, ethyl chloride 2.0 parts by weight, carbon dioxide 2.0 parts by weight (160 kg / cm) 2 ) and kneaded at 200 ° C. Next, the gel is uniformly cooled with a cooler, adjusted to an optimum foaming temperature (120 ° C.), and extruded and foamed from the die under atmospheric pressure to obtain a bubble diameter of about 0.32 mm, a density of about 32 kg / cm 3 , A foamed plate having a thickness of about 75 mm was produced (both measured values with the skin layer trimmed). In order to produce a test piece, immediately after extrusion foaming, 5 sheets were sliced in the thickness direction to obtain 5 foam plates of 5 mm (thickness) × 200 mm × 200 mm per sheet. The foamed plate (3) thus obtained was used in the following examples and comparative examples.
<比較例4>
5枚の発泡板(3)を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例4に係る断熱材を作製した。なお、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例9においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例9においても同じ)。その結果、熱伝導率は31.8mW/mKであった(表2を参照)。
<Comparative example 4>
Five foam plates (3) were laminated (a total of five sheets from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 4. The foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 9 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring the temperature at about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 9 below). The same applies to As a result, the thermal conductivity was 31.8 mW / mK (see Table 2).
<実施例9>
5枚の発泡板(3)を積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例9に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は30.5mW/mKであった。この結果は、比較例4に係る断熱材の熱伝導率31.8mW/mKと比較して、95.9%に低減されたものであった(表2を参照)。
実施例9の結果から、発泡板(3)のように熱線遮蔽材である酸化チタンを混練した発泡板であっても、断熱材の中(各発泡板の間)にアルミニウム箔などの熱線遮蔽層を設けることで、断熱材の熱伝導率をさらに低減できることが分かる。
<Example 9>
When the five foamed plates (3) were laminated, an aluminum foil having a thickness of 11 μm (a total of four) was sandwiched between the foamed plates to produce a composite heat insulating material according to Example 9. The result of measuring the thermal conductivity of this composite heat insulating material was 30.5 mW / mK. This result was reduced to 95.9% compared to the thermal conductivity of 31.8 mW / mK of the heat insulating material according to Comparative Example 4 (see Table 2).
From the result of Example 9, even if it is a foam board kneaded with titanium oxide which is a heat ray shielding material like the foam board (3), a heat ray shielding layer such as an aluminum foil is provided in the heat insulating material (between each foam board). By providing, it turns out that the thermal conductivity of a heat insulating material can further be reduced.
<実施例10、比較例5で用いた発泡板(4)の製造方法>
重量平均分子量210,000のスチレン樹脂100重量部に対して、押出機の滑剤としてステアリン酸バリウム(日油社製)0.1重量部、安定剤として酸化マグネシウム(神島化学L−10)0.08重量部、気泡調整剤としてポリエチレン(ダウレックス)1.0重量部、および難燃剤としてヘキサブロモシクロドデカン(HBCD、アルベマールSAYTEX HP−900)3.0重量部、熱線遮蔽材としてカーボンブラック(CB、Engineered Carbons社製 Arosperse 15)7.0重量部(カーボンブラックは、カーボンブラック/ポリスチレン=30%/70%のマスターバッチを使用)を押出機のホッパーに投入し、発泡剤として工業ブタン(イソブタン)2.5重量部、シクロペンタン1.4重量部、二酸化炭素2.5重量部を圧入(160kg/cm2)し200℃で混練した。次に、冷却機でゲルを均一に冷却して最適な発泡温度(120℃)に調整し、ダイから大気圧下に押出発泡することにより気泡径約0.21mm、密度約36Kg/cm3、厚み約50mmの発泡板を製造した(いずれもスキン層をトリミングした状態での測定値)。試験片を作製するため、押出発泡直後に、厚さ方向に5枚スライスし、1枚当たり5mm(厚み)×200mm×200mmの発泡板を5枚得た。このようにして得られた発泡板(4)を下記実施例および比較例にて使用した。
<The manufacturing method of the foam board (4) used in Example 10 and Comparative Example 5>
0.1 parts by weight of barium stearate (manufactured by NOF Corporation) as a lubricant for an extruder and magnesium oxide (Kamishima Chemical L-10) as a stabilizer for 100 parts by weight of a styrene resin having a weight average molecular weight of 210,000. 08 parts by weight, polyethylene (Daulex) 1.0 part by weight as a foam regulator, 3.0 parts by weight of hexabromocyclododecane (HBCD, Albemarle SAYTEX HP-900) as a flame retardant, carbon black (CB Engineered Carbons Arosperse 15) 7.0 parts by weight (carbon black uses carbon black / polystyrene = 30% / 70% masterbatch) was introduced into the hopper of the extruder, and industrial butane (isobutane as a blowing agent). ) 2.5 parts by weight, cyclopentane 1.4 layers An amount of 2.5 parts by weight of carbon dioxide was press-fitted (160 kg / cm 2 ) and kneaded at 200 ° C. Next, the gel is uniformly cooled with a cooler, adjusted to an optimum foaming temperature (120 ° C.), and extruded and foamed from the die under atmospheric pressure, whereby a bubble diameter of about 0.21 mm, a density of about 36 Kg / cm 3 , A foam plate having a thickness of about 50 mm was produced (measured values in a state where the skin layer was trimmed). In order to produce a test piece, immediately after extrusion foaming, 5 sheets were sliced in the thickness direction to obtain 5 foam plates of 5 mm (thickness) × 200 mm × 200 mm per sheet. The foamed plate (4) thus obtained was used in the following examples and comparative examples.
<比較例5>
5枚の発泡板(4)を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例5に係る断熱材を作製した。なお、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例10においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例10においても同じ)。その結果、熱伝導率は29.6mW/mKであった(表2を参照)。
<Comparative Example 5>
Five foam plates (4) were laminated (a total of five foam plates from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 5. In addition, the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 10 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 10 below). The same applies to As a result, the thermal conductivity was 29.6 mW / mK (see Table 2).
<実施例10>
5枚の発泡板(4)を積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例10に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は29.4mW/mKであった。この結果は、比較例5に係る断熱材の熱伝導率29.6mW/mKと比較して、99.3%に低減されたものであった(表2を参照)。
発泡板(4)のように熱線遮蔽材として優れたカーボンブラックを混練した発泡板は、既に十分に低減された熱伝導率を有する。実施例10の結果からは、このような断熱材の中(各発泡板の間)にアルミニウム箔などの熱線遮蔽層を設けた場合であっても、断熱材の熱伝導率をさらに低減できることが分かる。
<Example 10>
When the five foamed plates (4) were laminated, an aluminum foil having a thickness of 11 μm (a total of four) was sandwiched between the foamed plates to produce a composite heat insulating material according to Example 10. The result of measuring the thermal conductivity of this composite heat insulating material was 29.4 mW / mK. This result was reduced to 99.3% compared to the thermal conductivity of 29.6 mW / mK of the heat insulating material according to Comparative Example 5 (see Table 2).
A foamed plate kneaded with carbon black excellent as a heat ray shielding material, such as the foamed plate (4), already has a sufficiently reduced thermal conductivity. From the results of Example 10, it can be seen that the heat conductivity of the heat insulating material can be further reduced even when a heat ray shielding layer such as an aluminum foil is provided in such a heat insulating material (between each foamed plate).
<実施例11、比較例6で用いた発泡板(5)の製造方法>
重量平均分子量210,000のスチレン樹脂100重量部に対して、押出機の滑剤としてステアリン酸バリウム(日油社製)0.1重量部、安定剤として酸化マグネシウム(神島化学L−10)0.08重量部、気泡調整剤としてポリエチレン(ダウレックス)0.5重量部、および難燃剤としてヘキサブロモシクロドデカン(HBCD、アルベマールSAYTEX HP−900)4.2重量部、熱線遮蔽材としてグラファイト(GP、Timcal Japan社製 TX−GA98/10)2.5量部(グラファイトは、グラファイト/ポリスチレン=30%/70%のマスターバッチを使用)を押出機のホッパーに投入し、発泡剤として工業ブタン(イソブタン)4.1重量部、二酸化炭素1.0重量部、水1.0重量部を圧入(180kg/cm2)し200℃で混練した。次に、冷却機でゲルを均一に冷却して最適な発泡温度(120℃)に調整し、ダイから大気圧下に押出発泡することにより気泡径約0.12mm、密度約36Kg/cm3、厚み約30mmの発泡板を製造した(いずれもスキン層をトリミングした状態での測定値)。試験片を作製するため、押出発泡直後に、厚さ方向に5枚スライスし、1枚当たり5mm(厚み)×200mm×200mmの発泡板を5枚得た。このようにして得られた発泡板(5)を下記実施例および比較例にて使用した。
<The manufacturing method of the foam board (5) used in Example 11 and Comparative Example 6>
0.1 parts by weight of barium stearate (manufactured by NOF Corporation) as a lubricant for an extruder and magnesium oxide (Kamishima Chemical L-10) as a stabilizer for 100 parts by weight of a styrene resin having a weight average molecular weight of 210,000. 08 parts by weight, 0.5 parts by weight of polyethylene (Daulex) as a bubble regulator, 4.2 parts by weight of hexabromocyclododecane (HBCD, Albemarle SAYTEX HP-900) as a flame retardant, graphite (GP, Texcal Japan TX-GA 98/10) 2.5 parts by weight (graphite is graphite / polystyrene = 30% / 70% master batch) was charged into the hopper of the extruder, and industrial butane (isobutane as a blowing agent). ) 4.1 parts by weight, carbon dioxide 1.0 part by weight, water 1.0 part by weight (18 It was kneaded in kg / cm 2) to 200 ° C.. Next, the gel is uniformly cooled with a cooler, adjusted to an optimum foaming temperature (120 ° C.), and extruded and foamed from the die under atmospheric pressure to obtain a bubble diameter of about 0.12 mm, a density of about 36 Kg / cm 3 , A foamed plate having a thickness of about 30 mm was produced (measured values in a state where the skin layer was trimmed). In order to produce a test piece, immediately after extrusion foaming, 5 sheets were sliced in the thickness direction to obtain 5 foam plates of 5 mm (thickness) × 200 mm × 200 mm per sheet. The foamed plate (5) thus obtained was used in the following examples and comparative examples.
<比較例6>
5枚の発泡板(5)を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例6に係る断熱材を作製した。なお、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例11においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例11においても同じ)。その結果、熱伝導率は27.5mW/mKであった(表2を参照)。
<Comparative Example 6>
Five foam plates (5) were laminated (a total of five foam plates from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 6. Note that the foam plates were not bonded to each other and overlapped in a free state (the same applies to Example 11 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 11 below). The same applies to As a result, the thermal conductivity was 27.5 mW / mK (see Table 2).
<実施例11>
5枚の発泡板(5)を積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例11に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は27.4mW/mKであった。この結果は、比較例6に係る断熱材の熱伝導率27.5mW/mKと比較して、99.6%に低減されたものであった(表2を参照)。
発泡板(5)のように熱線遮蔽材として優れたグラファイトを混練した発泡板は、既に十分に低減された熱伝導率を有する。実施例11の結果からは、このような断熱材の中(各発泡板の間)にアルミニウム箔などの熱線遮蔽層を設けた場合であっても、断熱材の熱伝導率をさらに低減できることが分かる。
<Example 11>
When the five foamed plates (5) were laminated, an aluminum foil having a thickness of 11 μm (a total of four) was sandwiched between the foamed plates to produce a composite heat insulating material according to Example 11. The result of measuring the thermal conductivity of this composite heat insulating material was 27.4 mW / mK. This result was reduced to 99.6% as compared with the thermal conductivity 27.5 mW / mK of the heat insulating material according to Comparative Example 6 (see Table 2).
A foamed plate kneaded with graphite excellent as a heat ray shielding material, such as the foamed plate (5), has already sufficiently reduced thermal conductivity. From the results of Example 11, it can be seen that even when a heat ray shielding layer such as an aluminum foil is provided in such a heat insulating material (between each foamed plate), the heat conductivity of the heat insulating material can be further reduced.
<比較例7>
5枚の発泡板(1)の表面に画鋲で直径約1mm、深さ約2mmの孔を約1cm四方の角(すなわち孔の密度:1個/cm2)にあけ、この孔あき発泡板を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例7に係る断熱材を作製した。なお、断熱材の両表面には孔がないように、第1層目と第5層目の発泡板は内側のみの片面に孔をあけ、第2〜第4層目の発泡板は両面に孔をあけ、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例12においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例12においても同じ)。その結果、熱伝導率は37.7mW/mKであり、孔をあけていない比較例1と同じであった(表3を参照)。
<Comparative Example 7>
A hole with a diameter of about 1 mm and a depth of about 2 mm is drilled on the surface of the five foam plates (1) at about 1 cm square (ie, hole density: 1 / cm 2 ). A heat insulating material according to Comparative Example 7 was manufactured by laminating (a total of five sheets from the first layer foam plate to the fifth layer foam plate). In addition, the first and fifth layer foam plates have holes on one side only, and the second to fourth layer foam plates are on both sides so that there are no holes on both surfaces of the heat insulating material. Holes were made, and the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 12 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 12 below). The same applies to As a result, the thermal conductivity was 37.7 mW / mK, which was the same as Comparative Example 1 in which no holes were formed (see Table 3).
<実施例12>
比較例7で用いた穴あき発泡板を5枚積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例12に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は32.4mW/mKであった。この結果は、比較例7に係る断熱材の熱伝導率37.7mW/mKと比較して、85.9%に低減されたものであり、孔をあけていない実施例7とほぼ同じであった(表3を参照)。
<Example 12>
When five perforated foam plates used in Comparative Example 7 were laminated, an aluminum foil having a thickness of 11 μm (a total of 4 sheets) was sandwiched between the foam plates to produce a composite heat insulating material according to Example 12. The result of measuring the thermal conductivity of this composite heat insulating material was 32.4 mW / mK. This result was reduced to 85.9% in comparison with the thermal conductivity of 37.7 mW / mK of the heat insulating material according to Comparative Example 7, and was almost the same as Example 7 in which no holes were formed. (See Table 3).
<比較例8>
5枚の発泡板(1)の表面に金属棒で直径約3mm、深さ約2mmの孔を約1cm四方の角(すなわち孔の密度:1個/cm2)にあけ、この孔あき発泡板を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例8に係る断熱材を作製した。なお、断熱材の両表面には孔がないように、第1層目と第5層目の発泡板は内側のみの片面に孔をあけ、第2〜第4層目の発泡板は両面に孔をあけ、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例13においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例13においても同じ)。その結果、熱伝導率は37.8mW/mKであり、孔をあけていない比較例1とほぼ同じであった(表3を参照)。
<Comparative Example 8>
Holes with a diameter of about 3 mm and a depth of about 2 mm are drilled on the surface of five foamed plates (1) at about 1 cm square (ie, hole density: 1 piece / cm 2 ). Were laminated (a total of five sheets from the first layer foam plate to the fifth layer foam plate) to produce a heat insulating material according to Comparative Example 8. In addition, the first and fifth layer foam plates have holes on one side only, and the second to fourth layer foam plates are on both sides so that there are no holes on both surfaces of the heat insulating material. Holes were made, and the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 13 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by setting a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 13 below). The same applies to As a result, the thermal conductivity was 37.8 mW / mK, which was almost the same as that of Comparative Example 1 in which no holes were formed (see Table 3).
<実施例13>
比較例8で用いた穴あき発泡板を5枚積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例13に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は32.6mW/mKであった。この結果は、比較例8に係る断熱材の熱伝導率37.8mW/mKと比較して、86.5%に低減されたものであり、孔をあけていない実施例7とほぼ同じであった(表3を参照)。
<Example 13>
When five perforated foam plates used in Comparative Example 8 were laminated, an aluminum foil having a thickness of 11 μm (total of 4 sheets) was sandwiched between the foam plates to produce a composite heat insulating material according to Example 13. The result of measuring the thermal conductivity of this composite heat insulating material was 32.6 mW / mK. This result was reduced to 86.5% in comparison with the thermal conductivity of 37.8 mW / mK of the heat insulating material according to Comparative Example 8, and was almost the same as Example 7 in which no holes were formed. (See Table 3).
<比較例9>
5枚の発泡板(4)の表面に画鋲で直径約1mm、深さ約2mmの孔を約1cm四方の角(すなわち孔の密度:1個/cm2)にあけ、この孔あき発泡板を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例9に係る断熱材を作製した。なお、断熱材の両表面には孔がないように、第1層目と第5層目の発泡板は内側のみの片面に孔をあけ、第2〜第4層目の発泡板は両面に孔をあけ、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例14においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例14においても同じ)。その結果、熱伝導率は29.5mW/mKであり、孔をあけていない比較例5とほぼ同じであった(表3を参照)。
<Comparative Example 9>
A hole having a diameter of about 1 mm and a depth of about 2 mm is drilled on the surface of the five foamed plates (4) in a square of about 1 cm (ie, hole density: 1 / cm 2 ). A heat insulating material according to Comparative Example 9 was manufactured by laminating (a total of five sheets from the first layer foam plate to the fifth layer foam plate). In addition, the first and fifth layer foam plates have holes on one side only, and the second to fourth layer foam plates are on both sides so that there are no holes on both surfaces of the heat insulating material. Holes were made, and the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 14 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 14 below). The same applies to As a result, the thermal conductivity was 29.5 mW / mK, which was almost the same as that of Comparative Example 5 in which no holes were formed (see Table 3).
<実施例14>
比較例9で用いた穴あき発泡板を5枚積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例14に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は29.4mW/mKであった。この結果は、比較例9に係る断熱材の熱伝導率29.5mW/mKと比較して、99.7%に低減されたものであり、孔をあけていない実施例10とほぼ同じであった(表3を参照)。
<Example 14>
When five perforated foam plates used in Comparative Example 9 were laminated, an aluminum foil having a thickness of 11 μm (a total of four sheets) was sandwiched between the foam plates to produce a composite heat insulating material according to Example 14. The result of measuring the thermal conductivity of this composite heat insulating material was 29.4 mW / mK. This result was reduced to 99.7% compared to the thermal conductivity of 29.5 mW / mK of the heat insulating material according to Comparative Example 9, and was almost the same as Example 10 in which no holes were formed. (See Table 3).
<比較例10>
5枚の発泡板(5)の表面に画鋲で直径約1mm、深さ約2mmの孔を約1cm四方の角(すなわち孔の密度:1個/cm2)にあけ、この孔あき発泡板を積層させて(第1層目の発泡板から第5層目の発泡板の合計5枚)、比較例10に係る断熱材を作製した。なお、断熱材の両表面には孔がないように、第1層目と第5層目の発泡板は内側のみの片面に孔をあけ、第2〜第4層目の発泡板は両面に孔をあけ、発泡板同士は接着せずフリーの状態で重ね合わせた(以下の実施例15においても同じ)。このようにして得られた断熱材の熱伝導率測定について、英弘精機株式会社製AUTO―Λ HC−072を使用して第1層目の発泡板の外側に加熱板を設置し約39.8℃にコントロールし、第5層目の発泡板の外側に熱流計および冷却板を設置して約7.9℃にコントロールし、平均温度23℃における熱伝導率を測定した(以下の実施例15においても同じ)。その結果、熱伝導率は27.5mW/mKであり、孔をあけていない比較例6と同じであった(表3を参照)。
<Comparative Example 10>
A hole having a diameter of about 1 mm and a depth of about 2 mm is drilled on the surface of the five foamed plates (5) in a square of about 1 cm (ie, hole density: 1 / cm 2 ). A heat insulating material according to Comparative Example 10 was manufactured by laminating (a total of five sheets from the first layer foam plate to the fifth layer foam plate). In addition, the first and fifth layer foam plates have holes on one side only, and the second to fourth layer foam plates are on both sides so that there are no holes on both surfaces of the heat insulating material. Holes were made, and the foamed plates were not bonded to each other and overlapped in a free state (the same applies to Example 15 below). About the thermal conductivity measurement of the heat insulating material obtained in this way, a heating plate was installed on the outside of the first-layer foam plate using AUTO-Λ HC-072 manufactured by Eihiro Seiki Co., Ltd. and about 39.8. The heat conductivity was measured at an average temperature of 23 ° C. by measuring a temperature of about 7.9 ° C. by installing a heat flow meter and a cooling plate outside the fifth layer foam plate (Example 15 below). The same applies to As a result, the thermal conductivity was 27.5 mW / mK, which was the same as that of Comparative Example 6 in which holes were not formed (see Table 3).
<実施例15>
比較例10で用いた穴あき発泡板を5枚積層させる際に、それぞれの発泡板の間に厚み11μmのアルミニウム箔(合計4枚)を挟み込んで、実施例15に係る複合断熱材を作製した。この複合断熱材の熱伝導率を測定した結果は27.4mW/mKであった。この結果は、比較例10に係る断熱材の熱伝導率27.5mW/mKと比較して、99.6%に低減されたものであり、孔をあけていない実施例11と同じであった(表3を参照)。
<Example 15>
When five perforated foam plates used in Comparative Example 10 were laminated, an aluminum foil having a thickness of 11 μm (a total of four sheets) was sandwiched between the respective foam plates to produce a composite heat insulating material according to Example 15. The result of measuring the thermal conductivity of this composite heat insulating material was 27.4 mW / mK. This result was reduced to 99.6% as compared with the thermal conductivity of 27.5 mW / mK of the heat insulating material according to Comparative Example 10, and was the same as Example 11 in which no holes were formed. (See Table 3).
実施例12〜15の結果から、発泡板の製造工程や加工工程において孔が開いたり傷がついたりしてしまうなどの欠陥が生じた場合であっても、本発明の効果に影響を与えないことが分かった。 From the results of Examples 12 to 15, even if a defect such as opening or scratching occurs in the manufacturing process or processing process of the foam plate, the effect of the present invention is not affected. I understood that.
Claims (6)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018101198A1 (en) * | 2016-11-30 | 2018-06-07 | 東北資材工業株式会社 | Foamable resin multilayer molded board and method for manufacturing same |
| CN114340887A (en) * | 2019-07-19 | 2022-04-12 | 多产研究有限责任公司 | Heat shield apparatus, materials and methods thereof |
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| JP3251000B2 (en) * | 2000-09-07 | 2002-01-28 | 松本建工株式会社 | Insulation structure of house and heat shield used |
| JP2003193586A (en) * | 2001-12-28 | 2003-07-09 | Dow Kakoh Kk | Heat insulation material for construction formed of polystyrene resin extrusion foamed body |
| JP2006142801A (en) * | 2004-10-22 | 2006-06-08 | Power Bank System:Kk | Heat insulating plate and molded product employing it |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3251000B2 (en) * | 2000-09-07 | 2002-01-28 | 松本建工株式会社 | Insulation structure of house and heat shield used |
| JP2003193586A (en) * | 2001-12-28 | 2003-07-09 | Dow Kakoh Kk | Heat insulation material for construction formed of polystyrene resin extrusion foamed body |
| JP2006142801A (en) * | 2004-10-22 | 2006-06-08 | Power Bank System:Kk | Heat insulating plate and molded product employing it |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018101198A1 (en) * | 2016-11-30 | 2018-06-07 | 東北資材工業株式会社 | Foamable resin multilayer molded board and method for manufacturing same |
| JPWO2018101198A1 (en) * | 2016-11-30 | 2019-10-24 | 東北資材工業株式会社 | Foamed resin multilayer molded board and manufacturing method thereof |
| JP7011110B2 (en) | 2016-11-30 | 2022-02-10 | 東北資材工業株式会社 | Effervescent resin multilayer molded board and its manufacturing method |
| CN114340887A (en) * | 2019-07-19 | 2022-04-12 | 多产研究有限责任公司 | Heat shield apparatus, materials and methods thereof |
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