JP2011009438A - 3d steric circuit board, and circuit module using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-reliable 3D steric circuit board of a cavity structure, wherein the circuit board can be efficiently mounted without restriction of a wiring pattern even when a metal lid is used.SOLUTION: The 3D steric circuit board 10 including an insulating board 1 having a recessed part, a plurality of wiring patterns 11 formed on the recessed part 5 of the insulating board 1, and an engagement part 6 engaging with a metal lid 3 formed to seal a region surrounding the recessed part is structured such that, in the engagement part 6, a surface of at least one wiring pattern (grounding line) 11g out of the wiring patterns is formed high, and abuts on the metal lid 3.

Description

  The present invention relates to a three-dimensional circuit board and a circuit module using the same, and particularly to a shield structure with a metal lid in a package having a cavity structure.

Conventionally, a conductive circuit is formed on an insulating three-dimensional three-dimensional substrate such as an aluminum nitride substrate to form a three-dimensional three-dimensional circuit substrate (for example, Patent Document 1).
Such a three-dimensional circuit board is formed by forming a conductive thin film on the surface of an aluminum nitride substrate and irradiating a region containing at least the boundary between the circuit portion and the non-circuit portion of the conductive thin film with a high energy beam. Remove the thin film to form a pattern, and after plating the conductive thin film in the circuit section, remove the conductive thin film in the non-circuit section to easily form a circuit board with the desired circuit pattern. In recent years it has been attracting attention as being able to.

  Since such a three-dimensional circuit board can easily form a cavity structure, it is used for mounting various devices such as a solid-state imaging device, a gyro sensor, and a pressure sensor.

Among such devices, a device that forms a metal lid 103 as shown in FIG. 6 has been proposed.
Thus, in the cavity package structure in which the external connection terminals are derived from the chip component mounting surface side, if the metal lid 103 is mounted, the wiring pattern on the metal lid side is short-circuited with the wiring pattern 111 of the three-dimensional circuit board. Is the ground (ground) wiring GND only, and the other wiring patterns need to be arranged on the side without the metal lid. For this reason, there is a problem that the circuit design has a great restriction and is difficult to mount.
Further, as shown in FIG. 3, when it is necessary to form lids on both sides, one side needs to be non-metallic.

JP 2008-034555 A

As described above, although a small-sized circuit module with good manufacturing workability can be formed using a three-dimensional circuit board, when a metal lid is used, there is a limitation in forming a wiring pattern.
The present invention has been made in view of the above circumstances, and provides a highly reliable three-dimensional circuit board having a cavity structure that can be efficiently mounted even when a metal lid is used without restriction of a wiring pattern. For the purpose.

Therefore, the present invention engages with an insulating substrate having a recess, a plurality of wiring patterns formed in the recess of the insulating substrate, and a metal lid formed so as to seal a region surrounding the recess. A three-dimensional circuit board having an engagement portion, wherein the engagement portion is configured such that at least one of the wiring patterns has a high surface and is in contact with the metal lid. .
According to this configuration, since the surface of the wiring pattern of the insulating substrate is formed so as to protrude from the periphery to form a protruding portion, the wiring pattern can be selectively brought into contact with the metal lid, and the circuit It can be formed without reducing the degree of freedom of design.

According to the present invention, in the three-dimensional circuit board, the insulating substrate is formed such that a part of a region where a wiring pattern is formed protrudes from the periphery to form a protruding portion, and the wiring pattern includes a metal lid and Including those that abut.
According to this configuration, since a part of the region for forming the wiring pattern of the insulating substrate is formed so as to protrude from the periphery to form the protruding portion, the wiring pattern is formed in the same process as the periphery. And can be easily formed without affecting the characteristics.

According to the present invention, in the three-dimensional circuit board, a part of the wiring pattern is formed to protrude from the periphery to form a protruding portion, and the wiring pattern is in contact with a metal lid.
According to this configuration, the design of the 3D circuit board itself is changed by projecting a part of the wiring pattern so as to abut the metal lid by taking a method such as forming a protrusion only in a certain region. And can be easily formed.

According to the present invention, in the three-dimensional circuit board, the wiring pattern forming the protruding portion is a ground pattern.
According to this configuration, the metal lid can be used as a ground plate, noise from the outside can be quickly released to the ground potential, and the quality of the electrical signal (S / N ratio) can be improved.

According to the present invention, in the above-described three-dimensional circuit board, the wiring pattern that forms the protruding portion is formed adjacent to a wiring pattern that constitutes a signal line.
According to this configuration, the noise of the signal line can be efficiently released to the ground potential, and the quality of the electrical signal (S / N ratio) can be improved.

Further, the present invention includes the above-described three-dimensional circuit board including at least two wiring patterns forming the projecting portions and formed on sides facing each other.
According to this configuration, the metal lid can be stably supported by the protruding portion, and the metal lid can be mounted on the three-dimensional circuit board.

  The circuit module of the present invention includes an insulating substrate having a recess, a plurality of wiring patterns formed in the recess of the insulating substrate, and a metal lid formed so as to seal a region surrounding the recess. A three-dimensional circuit board in which at least one grounding wiring pattern surface of the wiring patterns is formed high in the engaging part, and the engaging part is mounted in the recess. The surface of the chip part and the surface of the grounding wiring pattern connected to the chip part are formed high, abuts on the metal lid, and is filled with a sealing resin.

  According to the present invention, in the above circuit module, the insulating substrate includes a part in which a region for forming a wiring pattern is protruded from the periphery, and the wiring pattern is in contact with a metal lid.

  According to the present invention, in the above circuit module, a part of the wiring pattern is formed so as to protrude from the periphery, and the wiring pattern is in contact with a metal lid.

  According to the present invention, in the above circuit module, the wiring pattern forming the protruding portion is a ground pattern.

  According to the present invention, in the above circuit module, the wiring pattern that forms the protruding portion includes a wiring pattern that is formed adjacent to a wiring pattern that forms a signal line.

  According to the present invention, in the above circuit module, at least two wiring patterns forming the projecting portion are formed on opposite sides.

As described above, according to the present invention, only the ground pattern is raised one step higher, and since it is connected by the metal lid and the conductive adhesive, noise from the outside is quickly released to the ground line, and an electrical signal is transmitted. Can improve the quality.
Further, the metal lid is sealed with a sealing resin such as an epoxy resin, so that intrusion of flux or the like into the sensor portion can be prevented during solder mounting.

Sectional drawing which shows the circuit module of Embodiment 1 of this invention A perspective view of a three-dimensional circuit board used in the circuit module Enlarged perspective view of the main part It is the principal part expanded sectional view, (a) is equivalent to the AA cross section of FIG. 3, (b) is equivalent to the BB cross section of FIG. 3, but shows the state which mounted the metal cover. Sectional drawing which shows the circuit module of Embodiment 1 of this invention, (a) is a figure which shows the cross section of a ground wire, (b) is a figure which shows the cross section of a signal wire | line The figure which shows the circuit module of the conventional example

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
Hereinafter, a three-dimensional circuit board according to the present embodiment and a circuit module formed using the same will be described with reference to the drawings.
1 is a cross-sectional view showing a circuit module according to the first embodiment, FIG. 2 is a perspective view of a three-dimensional circuit board used in the circuit module, FIG. 3 is an enlarged perspective view of an essential part thereof, and FIG. It is a partial expanded sectional view, (a) is equivalent to the AA cross section of FIG. 3, (b) is equivalent to the BB cross section of FIG. 3, but shows the state which mounted the metal cover.

  This circuit module is configured such that, of the wiring patterns 11, the wiring pattern constituting the ground line 11 g is formed so as to protrude from the wiring pattern constituting the signal line 11 s, and the ground line 11 g contacts the metal lid 3. The gap between the metal lid 3 and the three-dimensional circuit board 10 is filled with a sealing resin 12 made of an epoxy resin.

  That is, the circuit module includes an insulating substrate 1 made of an aluminum nitride ceramic having a recess (cavity) 5, and a plurality of wiring patterns 11 formed so as to run from the recess 5 of the insulating substrate 1 to the outer peripheral surface, An engagement portion 6 that engages with the metal lid 3 formed so as to seal the region surrounding the recess 5, and in the engagement portion 6, two of the wiring patterns 11 are connected to the grounding wiring pattern. A chip component is mounted on the three-dimensional three-dimensional circuit board 10 in which the surface of the (ground line) 11g is formed higher than the signal line 11s, and the surface of the ground line 11g connected to the chip component is formed high. In addition to being in contact with the metal lid 3, the periphery is filled with the sealing resin 12. This step is desirably 0.01 mm or more. Reference numeral 100 denotes a printed wiring board as a mounting board.

  In this wiring pattern, as shown in an enlarged view of the main part in FIG. 3, two ground lines 11g are formed so as to sandwich the two signal lines 11s. As shown in the enlarged view of the main part in FIG. 4B, the ground line 11g is formed on the three-dimensional circuit board 10 that is selectively raised one step higher, and the surface of the ground line 11g is a three-dimensional circuit board. 10 is a step higher selectively. Therefore, when the metal lid 3 is placed on the engaging portion 6, only the ground wire 11g is connected by the metal lid 3 and the conductive adhesive. Thus, the signal line 11 s is not in contact with the metal lid 3, and only the ground wire 11 g is connected to the metal lid 3 at the engaging portion 6 with the three-dimensional circuit board 10.

Here, the sensor chip 2 is housed in the cavity 5 and connected to the signal line 11 s and the ground line 11 g via the bonding wire 7.
Further, the processing chip 4 constituting the signal processing circuit is mounted on the back side of the three-dimensional circuit board 10 and is connected to the signal line 11s and the ground line 11g through the bonding wire 7 in the same manner as the sensor chip 2.

According to the above configuration, the three-dimensional circuit board 10 is raised by one step in the area where the ground line 11g is formed, and when the metal lid 3 is placed on the engaging portion 6, only the ground line 11g is the metal lid 3. And a conductive adhesive. On the other hand, since the engagement portion between the metal lid 3 and the three-dimensional circuit board 10 is filled with the sealing resin 12 made of epoxy resin, noise from the outside is quickly released to the ground wire, and the quality of the electrical signal is improved. Can be improved.
Further, the metal lid is sealed with a sealing resin such as an epoxy resin, so that intrusion of flux or the like into the sensor portion can be prevented during solder mounting.

Next, a method for manufacturing a three-dimensional circuit board constituting the circuit module will be described.
The insulating substrate 1 for forming the three-dimensional circuit board 10 is formed as an aluminum nitride substrate having a desired three-dimensional shape by molding and sintering an aluminum nitride powder material (step 1).
Next, the insulating substrate 1 is heated to oxidize the surface to form an oxide layer (thin film insulating layer) (step 2).
After that, an impact buffer layer made of metal is formed on the oxide layer (step 3).
Then, a conductive thin film is formed on the impact buffer layer through a metallization process by physical vapor deposition such as sputtering, vapor deposition, ion plating, etc. (step 4).
Then, a high energy beam such as a laser beam is irradiated to separate the circuit portion / non-circuit portion (step 5).
After that, the circuit portion is thickened by plating to form a plating layer (step 6).
Then, the conductive thin film remaining in the non-circuit portion is etched to complete the wiring pattern 11.

Here, when forming the insulating substrate 1 for forming the three-dimensional three-dimensional circuit board 10, it is formed by powder-molding and sintering aluminum nitride. Aluminum nitride powder, which is a raw material used for forming an aluminum nitride substrate material, is manufactured using a method such as a reduction nitriding method, a direct nitriding method, or a vapor phase synthesis method. Further, since aluminum nitride is a hardly sintered material, yttria (Y ₂ O ₃ ), calcia (CaO), or the like may be added to the raw material as a sintering aid.

  In the step of forming the aluminum nitride powder into a three-dimensional shape, methods such as compression molding, extrusion molding, injection molding, and tape molding that are usually used for molding ceramics can be applied. Of these, injection molding is particularly preferred. Further, depending on the molding method, an organic substance such as an organic solvent or a resin can be added in order to impart fluidity and plasticity to the raw material.

  And after shaping | molding a raw material by the above-mentioned, degreasing is performed in order to remove the organic substance contained in a molded article as needed. In this degreasing step, the temperature is gradually raised from room temperature to about 600 ° C. to elute organic substances contained in the molded product. The atmosphere during degreasing may be in the air or under an inert gas such as nitrogen.

  Then, a three-dimensional aluminum nitride substrate (insulating substrate 1) is obtained as a compacted sintered body by sintering the molded product. This sintering step is performed by substituting the atmosphere with an inert gas such as nitrogen and gradually raising the temperature to about 1800 ° C. When sintering is performed in an oxidizing atmosphere such as the air, alumina is precipitated at the grain boundaries of aluminum nitride. Therefore, not only the sintering speed decreases, but also components other than aluminum nitride are mixed, and the thermal conductivity of the sintered body also decreases. Therefore, it is necessary to sinter aluminum nitride under an inert atmosphere such as nitrogen.

  Next, in order to maintain high insulation even after irradiation with a high energy beam in the laser processing step (step 5), the surface of the aluminum nitride substrate (insulating substrate 1) is oxidized beforehand to form an oxide layer ( (Not shown). As a method of oxidation treatment for forming this oxide layer, for example, heat treatment in the atmosphere is performed. In this method, the aluminum nitride substrate material is heated from room temperature to 1000 ° C. at about 100 ° C. per hour and then held at 1000 ° C. for several hours to several tens of hours to form an oxide layer forming a thin film insulating layer on the surface. Is done.

  Further, by performing the treatment not in the atmosphere but in pressurized water vapor, the oxidation treatment can be performed at a lower temperature and in a shorter time than in the atmosphere. The formation of the oxide layer 2 is not limited to the oxidation treatment by heating, but may be performed by other film forming methods such as chemical vapor deposition (CVD) or sputtering. Of these methods, heat treatment in the atmosphere is easiest in terms of film thickness management.

  Then, a metal impact buffer layer (not shown) is easily formed on the oxide layer by physical vapor deposition (PVD method) such as sputtering, vapor deposition, ion plating, or chemical vapor deposition (CVD method) such as plasma CVD. ). The shock buffer layer is made of a metal having a higher deposition rate than the oxide layer, and has a thickness of 1 to 10 μm (preferably 2 to 5 μm). In the laser processing step (step 5), When the high energy beam is irradiated, the impact of the high energy beam is buffered to prevent the high energy beam from reaching the aluminum nitride substrate.

  Next, a conductive thin film is formed by sputtering using copper as a target (metallization process: step 4). This conductive thin film is formed by physical vapor deposition methods such as sputtering, vacuum vapor deposition, and ion plating. Moreover, you may perform by other methods, such as a chemical vapor deposition method, without being limited to a physical vapor deposition method. In addition to copper, the conductive thin film may be made of a single metal such as nickel, gold, aluminum, titanium, molybdenum, chromium, tungsten, tin, or lead, or an alloy such as brass or NiCr.

  Then, a laser processing step (Step 5) is performed. Here, a high energy beam, for example, a laser beam, which is an electromagnetic wave beam, is irradiated on the boundary portion between the circuit portion and the non-circuit portion in the conductive thin film, and the conductive thin film in that portion is evaporated and removed. The part and the non-circuit part are separated, and a predetermined circuit pattern is formed.

  Next, a plating process (step 6) is performed. Here, power is supplied to the circuit portion to cause a current to flow, and the portion of the circuit portion is thickened by, for example, electrolytic copper plating to form a plating layer. At this time, no current flows through the non-circuit portion, and the non-circuit portion is not plated, so that the film thickness remains as it is.

  Then, an etching process (step 7) is performed, and the entire circuit pattern forming surface is etched to remove the non-circuit portion and the shock buffering layer so that the underlying oxide layer appears, and the wiring pattern 11 is formed. The three-dimensional circuit board 10 is completed. Then, nickel plating and gold plating are performed on the wiring pattern constituting the external connection terminal.

  Thereafter, the sensor chip 2 and the processing chip 4 are sequentially mounted on the three-dimensional circuit board 10 and are electrically connected by wire bonding, and then a metal lid is placed thereon, and after a solder reflow process, is made of an epoxy resin. The circuit module is completed by filling the sealing resin 12.

  In the first embodiment, the 3D circuit board itself is formed so as to be higher in the ground line formation region. However, the present invention is not limited to this, and the 3D circuit board is molded into a usual shape. Alternatively, only a predetermined region on the wiring pattern may be formed with a protrusion made of a conductor such as a solder bump or a conductive resin paste so that a part of the wiring pattern protrudes so as to contact the metal lid. . Thereby, it can be formed easily without changing the design of the 3D circuit board itself.

(Embodiment 2)
Next, a second embodiment of the present invention will be described.
In the first embodiment, the three-dimensional circuit board is formed by sintering molding. However, in this embodiment, it is formed of a multilayer substrate using a multilayer ceramic, and it is easy to form a step in a cavity region formed of a recess. It is to make. FIG. 5A is a diagram showing a cross section of the ground line, and FIG. 5B is a diagram showing a cross section of the signal line.
As shown in FIGS. 5A and 5B, the circuit board according to the present embodiment includes a laminated board 110 in which an internal conductor layer 21 is formed between a plurality of insulating layers 10a to 10h, and the laminated board 110. A cavity region 5 formed by selectively removing at least one of the surface conductor layer 22 formed on the surface of the substrate and electrically connected to the internal conductor layer 21 and the insulating layers 10a to 10h of the multilayer substrate 110. Of the insulating layers 10a to 10h, the insulating layers 10g and 10b located in the second layer from the uppermost layer and the lowermost layer protrude on the plane perpendicular to the stacking direction of the stacked substrate 110, Opposing leg portions are formed, and the surface conductor layer 22 is extended so as to reach the projecting end face of the leg portion to constitute the external connection terminal portion 23.

  Here, as shown in FIGS. 5A and 5B, steps formed by the uppermost and lowermost layers 10h and 10a of the insulating layers and the end surfaces of the insulating layers 10g and 10b located in the second layer. A surface conductor layer 22 is formed so as to cover a part of the inner conductor layer 21 exposed in the vicinity of the end faces of the insulating layers 10g and 10b located in the second layer from the uppermost layer and the lowermost layer. The

  Then, when a metal lid 3 is formed after mounting a semiconductor chip (not shown) on a three-dimensional three-dimensional circuit board, as shown in FIG. Is formed on the insulating layer 10g projecting into the cavity region 5, the ground wire 11g and the metal lid come into contact with each other when the metal lid 3 is placed.

On the other hand, as shown in FIG. 5B, the inner signal line 11s of the wiring pattern is formed on a layer that is one step lower than the ground line 11g (formed on the insulating layer 10f and connected to the surface conductor layer 22 via the via hole H). The external connection terminal 23 is connected.
In the cavity region 5, one of the via holes H that electrically connect the plurality of inner conductor layers 21 is exposed on the side surfaces of the insulating layers 10 c to 10 f and the surface of the insulating layer 10 b, and the inner conductor on the end face of the via hole A surface conductor layer 22 is formed so as to cover the layer 21 and like the inner conductor layer 21 on the surface of the insulating layer 10b. The sensor chip 2 is flip-chip mounted on the surface conductor layer. The signal line 11s and the ground line 11g are constituted by a laminated film of the inner conductor layer 21 and the surface conductor layer 22 on the surface of the three-dimensional circuit board, and are constituted by the inner conductor layer 21 in the insulating layer and the via hole. Yes.

  Actually, a plurality of internal conductor layers 21 are formed between the ceramic insulating layers 10a to 10h by firing a laminated body in which ceramic green sheets having conductive paste printed and applied in a predetermined pattern are baked. And a surface conductor layer 22 formed on the surface of the multilayer substrate 10 and electrically connected to the internal conductor layer 21 via the via hole H. In this embodiment, a plurality of circuit boards are divided from one circuit board by dividing the laminated substrate 110 vertically and horizontally in the thickness direction.

  Dicing grooves (not shown) are formed vertically and horizontally on the front and back surfaces of the multilayer substrate 110. Further, a portion corresponding to each circuit board is provided with a cavity region composed of a substantially square recess 5 when viewed from the thickness direction (vertical direction in FIG. 5). The recess 5 has a depth penetrating through a plurality of layers (eight in the illustrated example) of the insulating layers 10c to 10h, and the surface of the insulating layer 10a is exposed on the bottom surface.

Next, a method for manufacturing this circuit board will be described.
And this circuit board can be formed in the following steps. First, an insulating sheet (insulating layer) having a hole (via hole) H is laminated on a predetermined area in which a pattern of a conductor layer to be an internal conductor layer 21 is formed on the surface, and a recess 5 for mounting an element is provided. In this laminating step, via holes and recess formation holes are formed in an insulating ceramic green sheet, an internal conductor layer pattern is formed, and a conductive material is filled in the via holes. A predetermined number of layers are sequentially stacked, and here, a stacked body including eight insulating layers is formed.
Then, on the front and back surfaces of this laminate, a surface conductor layer is formed to extend to reach the protruding end faces of the insulating layers on the outermost surface and the outermost surface, and to form an external connection terminal portion. A substrate 110 is formed.

  Then, the laminated substrate 110 is divided along dicing lines.

  In this way, a three-dimensional circuit board having a step can be formed very easily by using a laminated substrate, and a highly reliable circuit module can be easily formed.

  In this configuration, since the surface conductor layer extends to reach the protruding end surface of the insulating layer and constitutes the external connection terminal portion, dicing is easy and the mounting surface is aligned. High-precision vertical mounting is possible. In addition, by forming a laminated substrate in the vicinity of the dicing surface and forming the laminated substrate and dicing, a high-speed cutting can be performed and a straight cutting surface can be obtained. Accordingly, at least two of the insulating layers protrude on a surface perpendicular to the stacking direction of the stacked substrate, and it is possible to form legs that face each other through the space.

  In Embodiments 1 and 2, a ceramic three-dimensional circuit board made of an aluminum nitride substrate is used. In addition to ceramic materials such as alumina and silicon carbide, PPS (polyphenylene sulfide) and PEEK are used. Those formed from resin materials such as (polyetheretherketone) and polyphthalamide are also effective. Also, a three-dimensional circuit board, a metal core board that only needs to have insulating properties, in addition to a resin material and a ceramic material, is formed into a predetermined shape such as copper or aluminum, and is coated with an insulating material. A multilayer ceramic substrate, a laminated resin substrate, or the like can also be used.

1 Insulating substrate 2 Sensor chip 3 Metal lid 4 Processing chip 5 Recessed portion (cavity)
6 Engagement section 7 Bonding wire 10 3D circuit board 11 Wiring pattern 11g Ground line 11s Signal line 12 Sealing resin 21 Internal conductor layer 22 Surface conductor layer 23 External connection terminal section 103 Metal lid 110 Multilayer board 111 Wiring pattern

Claims (12)

An insulating substrate having a recess;
A plurality of wiring patterns formed in the recesses of the insulating substrate;
A three-dimensional circuit board having an engaging portion that engages with a metal lid formed so as to seal a region surrounding the recess,
In the engagement portion, a three-dimensional circuit board formed such that at least one of the wiring patterns has a high surface and is in contact with the metal lid. The three-dimensional circuit board according to claim 1,
The insulating substrate is a three-dimensional circuit board in which a part of a region for forming a wiring pattern is formed so as to protrude from the periphery to form a protruding portion, and the wiring pattern is in contact with a metal lid. The three-dimensional circuit board according to claim 1,
A part of the wiring pattern is formed so as to protrude from the periphery to form a protruding portion, and the wiring pattern is a three-dimensional circuit board in contact with a metal lid. A three-dimensional circuit board according to any one of claims 1 to 3,
A three-dimensional circuit board in which the wiring pattern forming the protruding portion is a ground pattern. A three-dimensional circuit board according to any one of claims 1 to 5,
The wiring pattern forming the protruding portion is a three-dimensional circuit board formed adjacent to the wiring pattern constituting the signal line. A three-dimensional circuit board according to any one of claims 1 to 5,
There are at least two wiring patterns that form the protrusions, and the three-dimensional circuit board is formed on opposite sides. An insulating substrate having a recess;
A plurality of wiring patterns formed in the recesses of the insulating substrate;
An engagement portion that engages with a metal lid that is formed to seal the region surrounding the recess,
In the engagement portion, among the wiring patterns, at least one three-dimensional circuit board formed with a high surface of the ground wiring pattern;
A chip component mounted in the recess;
The surface of the ground wiring pattern surface connected to the chip component is formed high,
A circuit module which is in contact with the metal lid and is filled with a sealing resin. The circuit module according to claim 7,
The insulating substrate is a circuit module in which a part of a region for forming a wiring pattern is formed so as to protrude from the periphery, and the wiring pattern is in contact with a metal lid. The circuit module according to claim 7,
A circuit module in which a part of the wiring pattern is formed so as to protrude from the periphery, and the wiring pattern is in contact with a metal lid. A circuit module according to any one of claims 7 to 9,
A circuit module in which the wiring pattern forming the protruding portion is a ground pattern. A circuit module according to any one of claims 7 to 10,
The circuit pattern in which the wiring pattern forming the protruding portion is formed adjacent to the wiring pattern forming the signal line. The circuit module according to any one of claims 7 to 11,
There are at least two wiring patterns that form the protrusions, and the circuit module is formed on sides facing each other.

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