JP2011091071A - Teaching assisting unit and teaching method - Google Patents

Abstract

Teaching is performed with high accuracy without opening a maintenance door.
A substrate, a distance sensor, a momentary push button, a communication unit, a charging power receiving unit, a power storage unit, and a unit control unit, wherein the distance sensor is disposed on an outer periphery of the substrate. The momentary push button teaches the mini-environment wafer transfer device using a teaching support unit disposed on the back surface of the substrate.
[Selection] Figure 3

Description

  The present invention relates to a teaching support unit in a mini-environment wafer transfer apparatus, and a teaching method using the teaching support unit.

  Teaching position regenerative robots (hereinafter referred to as robots) are often used for wafer transport by mini-environment wafer transfer devices (hereinafter also referred to as mini-enes).

  Minienes must be regularly inspected and adjusted because the transport position is shifted due to the influence of vibration during long-term use.

  When a deviation in conveyance accuracy is detected by inspection, it is necessary to cause the robot to re-record the conveyance position by teaching work (teaching work). However, the teaching work is time-consuming work even if it is performed by a highly skilled worker who is proficient in the work, and in addition, there is often a variation in position accuracy.

  Also, in the teaching work in mini-en, the maintenance opening of the device is often opened to check the teaching position, but at this time the clean environment inside the device is lowered, so the idling after performing the teaching work It becomes necessary to perform operation and cleaning of the inside of the apparatus, and downtime is extended.

  Furthermore, when the apparatus opening is opened, the worker may put a part of the body into the apparatus, so that there remains a problem regarding work safety.

  Problems in the above teaching work have been conventionally recognized. For example, Patent Document 1 discloses a calibration jig using a digital meter and a calibration wafer with a reflector attached thereto for the purpose of improving positional accuracy. A teaching apparatus and teaching method for teaching based on numerical information by linking the above are disclosed.

  However, since a plurality of calibration jigs are necessary and a calibration jig needs to be installed for each teaching point, there is room for improvement in terms of work time.

JP 2008-84938 A

  In the teaching work method in the mini-environment wafer transfer apparatus, improvement has been achieved by linking a teaching robot with an alternative robot hand to which a sensor is attached or an alternative wafer for calibration. However, when these methods are applied, maintenance work is required by opening the inside of the apparatus.

  When the maintenance door is opened, the degree of cleanliness inside the apparatus is reduced, so that idling operation and cleaning work inside the apparatus are necessary, and downtime is extended.

  An object of the present invention is to perform highly accurate teaching without opening a maintenance door.

  The teaching support unit of the present invention includes a substrate, a distance sensor, a momentary push button, a communication unit, a charging power receiving unit, a power storage unit, and a unit control unit, and the distance sensor is an outer periphery of the substrate. The momentary push button is disposed on the back surface of the substrate.

  According to the present invention, highly accurate teaching can be performed without opening the maintenance door.

  In addition, according to the present invention, the operator can perform minute position adjustment and confirmation based on the numerical value of the teaching operation panel, and it is not necessary to put a part of the head or body inside the apparatus, thereby improving work safety. It can be secured.

  In addition, according to the present invention, teaching can be performed with the apparatus opening being closed, so that idling operation without carrying out or cleaning inside the apparatus is not necessary, and downtime can be shortened.

  Further, according to the present invention, since the numerical data output from the distance sensor and the inclination sensor is used as a reference, it is possible to acquire objective and highly accurate teaching position data that is not affected by the technical ability or training level of the operator. Can do.

It is an external appearance perspective view which shows the miniene which concerns on this invention. It is a schematic plan view which shows the inside of the miniene of the Example by this invention. It is an external appearance perspective view which shows the teaching assistance unit of the Example by this invention. It is an external appearance perspective view which shows the back surface of the teaching assistance unit of the Example by this invention. It is a top view which shows the robot hand of the Example by this invention. It is an external appearance perspective view which shows the base of the teaching assistance unit of the Example by this invention. It is an external appearance perspective view which shows the teaching operation panel of the Example by this invention. It is a flowchart which shows the operation | movement procedure of the teaching method of the Example by this invention. It is a back view which shows the positional relationship of the teaching support unit of the Example by this invention, and the robot hand before holding | grip this. It is a reverse view which shows the positional relationship of the teaching support unit of the Example by this invention, and the robot hand when this is hold | gripped. It is PP sectional drawing of FIG. 10A. It is a flowchart which shows the operation | work procedure which hold | grips the teaching support unit of the Example by this invention in a hand reference position. It is a flowchart which shows the calibration process process in the teaching method of the Example by this invention. FIG. 13 is a flowchart showing calibration processing steps subsequent to FIG. 12. It is an expanded back view which shows the operation | movement range of the hand in the calibration process process of the teaching method of the Example by this invention. It is an enlarged back view which shows the coordinate for calculating the facing angle (theta) of the teaching assistance unit of an Example by this invention, and a hand. It is a flowchart which shows the work procedure in the teaching process of the pre-aligner of the Example by this invention. It is a flowchart which shows the operation | movement procedure in the teaching process of the wafer storage container of the Example by this invention. It is the schematic of the display screen which shows the teaching process of the wafer storage container of the Example by this invention. It is a schematic diagram which shows the relationship between the clearance distance of FIG. 18, and a distance sensor value.

  In the present invention, a pedestal is provided inside the mini-en device, and a wafer type teaching support unit (hereinafter also referred to as a teaching unit) is permanently installed. During teaching work, the teaching unit stored in the apparatus is held by a robot hand (hereinafter also simply referred to as a hand). The teaching unit is equipped with a distance sensor, tilt sensor, and momentary pushbutton switch. At each teaching point, the distance to the wafer storage container and the relative tilt with the hand are measured, and the sensor value (detected) Value) to the teaching operation panel. The operator can interactively operate the robot hand position while checking the sensor value displayed on the teaching operation panel and the clearance value calculated from the sensor value.

  Hereinafter, a teaching support unit, a robot hand, a teaching support unit base, a teaching operation panel, a mini-environment wafer transfer device, and a teaching method using these will be described according to an embodiment of the present invention.

  Preferably, the teaching support unit includes a tilt sensor.

  The power storage unit of the teaching support unit is preferably a battery.

  The teaching support unit preferably has a wireless communication unit.

  In the teaching support unit, it is desirable that the power receiving unit for charging is a non-contact type.

  In the teaching support unit, the shape of the outer edge portion of the substrate is preferably the same as the shape of the outer edge portion of the wafer.

  In the teaching support unit, the substrate preferably has a notch or an orientation flat.

  The robot hand has a wafer suction port for vacuum-sucking a wafer, the teaching support unit can be gripped by the wafer suction port, and has a teaching unit reference hole corresponding to a momentary push button.

  The teaching support unit base includes a teaching support unit support member for stopping the teaching support unit, and a power feeding unit of the charging power receiving unit.

  In the teaching support unit base, it is preferable that the power feeding unit is a contactless type.

  The teaching operation panel includes a display screen, an interface for giving a command to the mini-environment wafer transfer device, and a connection unit for transmitting and receiving signals to and from the mini-environment wafer transfer device, from the teaching support unit The transmitted sensor value, the ON / OFF state of the momentary push button, and the clearance value between the teaching support unit and the inner wall surface of the wafer storage container are displayed on the display screen.

  The mini-environment wafer transfer apparatus includes a wafer transfer robot, a load port for fixing a wafer storage container, a pre-aligner, a mini-en control unit, a teaching operation panel, and the teaching support unit.

  In the teaching method, the teaching support unit is gripped at the reference position of the robot hand using the robot hand, and the teaching support unit is transported to the pre-aligner by the robot hand, and the pre-aligner is taught. A step of conveying the teaching support unit to the wafer storage container by the robot hand and teaching the wafer storage container; and a step of conveying the teaching support unit to the wafer stage by the robot hand and teaching the wafer stage. The process of performing.

  The teaching method may use the sensor value of the distance sensor to calculate the normal angle between the wafer storage container and the robot hand and the clearance value between the inner wall surface of the wafer storage container and the teaching support unit. desirable.

  The teaching method grips the teaching support unit at the reference position of the robot hand by aligning the momentary push button of the teaching support unit with the position of the teaching unit reference hole provided in the robot hand. Is.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Fig. 1 shows the appearance of the miniene.

  The mini-en 101 takes out the wafer 104 from the wafer storage container 103 installed in the load port 102 and supplies the wafer 104 to the semiconductor manufacturing apparatus 105, and also takes out the processed wafer 104 from the semiconductor manufacturing apparatus 105. This is a device for storing again.

  Inside the mini-en 101, clean air is circulated by the FFU 106 (fan filter unit). The inside of the wafer storage container 103 has a slit structure, and a plurality of circular thin wafers (for example, 300 mm in diameter) can be accommodated side by side in the vertical direction. The stored state of the wafer in the slit can be confirmed from the outside.

  A viewing window 107 and a maintenance door 108 are installed on the side surface of the mini-en 101. The observation window 107 and the maintenance door 108 are also installed on the opposite side surface, and the operation inside the mini-en 101 can be observed through the observation window 107. When necessary for inspection / adjustment, the maintenance door 108 is opened to perform maintenance work.

  FIG. 2 shows a schematic configuration inside the miniene and a wafer transfer method will be described.

  The wafer 104 stored in the wafer storage container 103 is taken out by the robot hand 202 of the robot 201 (wafer transfer robot). The robot 201 includes a horizontal operation, a vertical operation, and a turning operation mechanism, and the robot hand 202 has a vacuum suction mechanism for gripping the back surface of the wafer 104. The robot 201 transports the wafer 104 to the pre-aligner 203 and performs pre-alignment processing. In the pre-alignment process, the position of the outer edge portion and notch or orientation flat (orientation flat, OF) when the wafer 104 is rotated is read by the line sensor 204 to calculate the wafer position eccentricity and determine the direction.

  After completing the pre-alignment process, the robot 201 takes out the wafer 104 from the pre-aligner 203 and transfers it to the wafer stage 205 installed in the semiconductor manufacturing apparatus 105. At this time, the wafer position in the wafer storage container 103 is corrected by transporting the wafer 104 to a position obtained by adding the wafer position eccentricity value to the teaching coordinates of the wafer stage 205. The wafer 104 that has been processed by the semiconductor manufacturing apparatus 105 is taken out of the wafer stage 205 by the robot hand 202 and stored in the wafer storage container 103 in a series of wafer conveyance. The mini-en control unit 206 is connected to the robot 201, the load port 102, the mini-en built-in device, and the semiconductor manufacturing apparatus 105, and controls the operation of the mini-en by software.

  The above is the wafer transfer method in the mini-en, but if the apparatus is used for a long period of time, the wafer transfer position is shifted, so that periodic inspection and adjustment are required.

  In the present embodiment, the teaching operation panel 209 is connected to the mini-en control unit 206 via a cable 210 (teaching operation panel connection cable). In this figure, the connection unit for transmitting and receiving signals is a wired cable 210, but it has a function as a connection unit for transmitting and receiving signals between the mini-environment wafer transfer device and the mini-en control unit 206. If it has, it does not necessarily need to be a wired type, it may be a wireless type, and a contact terminal for transmitting and receiving signals may be provided instead of the cable 210.

  In the inspection / adjustment of the wafer transfer position, the robot 201 and the load port 102 are operated according to a command from the teaching operation panel 209. In this teaching operation, the teaching unit base 207 ( Hereinafter, by using the teaching unit 208 that is permanently installed in the teaching support unit storage base, the teaching work time and the apparatus down time can be shortened, and a highly accurate teaching work can be realized.

  FIG. 3 shows the appearance of the teaching support unit (teaching unit).

  In this figure, the substrate 301 of the teaching unit 208 has a circular shape with the same diameter (for example, 300 mm) as the wafer, and the notch 302 is processed similarly to the wafer. For mini-en, where the wafer to be transferred is orientation flat, orientation flat is processed.

  Distance sensors 303 are mounted at four locations on the outer edge of the top surface of the teaching unit 208. In the center of the upper surface of the teaching unit 208, a tilt sensor 304 for measuring the tilt of the teaching unit 208, a wireless communication unit 305 for receiving commands from the mini-en control unit and transmitting processing results (for example, Bluetooth method) ), Teaching unit control for executing a control program for receiving a command from the contactless charging type power receiving unit 306, the power source battery 307, and the mini-en control unit 206 and transmitting the sensor value and the remaining battery level to the mini-en control unit Part 308 is implemented.

  Here, instead of using the tilt sensor 304, a teaching unit 208 is used by using a plurality of distance sensors 303 or a distance sensor added to the support surface of the robot 201 or the vicinity of a wafer pop-up sensor (not shown) of the load port 102. A method of detecting the inclination (shift in the vertical direction) may be employed.

  The power supply battery 307 (battery) is a secondary battery and can be collectively referred to as a power storage unit. As the power storage unit, a capacitor may be used instead of the battery.

  FIG. 4 shows the appearance of the back surface of the teaching unit.

  The teaching unit back surface 401 is mirror-finished so that it can be vacuum-sucked by the robot hand 202 shown in FIG. 2. Two momentary push buttons 402 are provided at positions corresponding to the teaching unit reference holes machined in the robot hand 202. It is attached.

  FIG. 5 shows the shape of the robot hand.

  The robot hand 202 can grip the wafer by placing the wafer suction port 502 against the back surface of the wafer and vacuum-sucking from the wafer suction port 502. When the position of the momentary push button 402 on the back surface 401 of the teaching unit shown in FIG. 4 is aligned with the two teaching unit reference holes 501 machined on the surface of the robot hand 202, the momentary push button 402 is turned OFF, thereby teaching. The momentary push button 402 protrudes from the back surface 401 of the unit, and the teaching unit can be fixed at the position of the teaching unit reference hole 501 of the robot hand 202.

  FIG. 6 shows the appearance of the teaching unit base.

  The teaching unit base is installed on the mini-en housing member 603, and includes a teaching unit support member 601 for stopping the teaching unit and a contactless power supply unit 602. When the teaching unit is not in use, always install the teaching unit on the teaching unit base and perform contactless charging on the teaching unit.

  FIG. 7 shows the appearance of the teaching operation panel.

  The teaching operation panel 209 is an interface that interactively operates mini-en components including a robot, a load port, and a pre-aligner during teaching work and maintenance, and an interface 701 (for example, buttons, A display screen 702 that conveys the result of the command and the current state, and an emergency stop button 703. The teaching operation panel is connected to the mini-en control unit 206 via the operation panel connection cable 704.

  In the teaching operation panel 209 according to the present invention, in addition to the function of the conventional teaching operation panel, switching between the standby state and the operating state of the teaching unit, the distance sensor display value 705 (of the distance sensor 303 installed in the teaching unit) Real-time value), tilt sensor display value 706 of tilt sensor 304 (real-time value), momentary push button ON / OFF state display 707, and the battery level display 708 of the teaching unit are implemented.

  FIG. 8 is a flowchart of the teaching work procedure according to the present invention.

  First, the teaching unit is gripped at the reference position (hand reference position) of the robot hand (step S801). This step S801 includes a calibration process.

  Next, the teaching work of the pre-aligner 203 serving as a reference for the wafer transfer position is performed (step S802). After the teaching work of the pre-aligner 203 is completed, the teaching work of the wafer storage container 103 and the wafer stage 205 is sequentially performed using the same method (step S803).

  When the teaching unit 208 is placed on the teaching unit base 207 after completion of the teaching operation at a predetermined wafer transfer location (step S804), the teaching operation is completed.

  Hereinafter, the teaching unit gripping at the hand reference position (calibration process, step S801) and the pre-aligner teaching method (step S802) shown in the teaching work flowchart of FIG. The teaching method (step S803) will be described in the second embodiment.

  FIG. 9 shows a relative position between the teaching unit 208 and the robot hand 202 before gripping the teaching unit at the hand reference position. 10A and 10B show the relative positions of the teaching unit 208 and the robot hand 202 after gripping at the hand reference position.

  In order to hold the teaching unit 208 at the reference position of the robot hand 202 with the XY coordinate axis 901 as a reference, the X-axis deviation, Y-axis deviation, and vertical deviation in the positional relationship between the robot hand 202 and the teaching unit 208 The robot hand 202 is moved to a position where the (Z-axis deviation) is zero, and the angle θ formed by the robot hand center line 902 and the wafer center line 903 needs to be zero degrees.

  Two momentary push buttons 402 are provided on the back surface of the teaching unit 208. The robot hand 202 has a reference hole 501 having an inner diameter dimension through which the momentary push button 402 penetrates with almost no gap when the teaching unit 208 is placed at the reference position of the robot hand 202.

  When the positional relationship shown in FIG. 10A is reached, as shown in FIG. 10B, which is a cross-sectional view along PP, two momentary push buttons 402 pass through the reference hole 501, so that both of them are in the OFF state, and the robot Since the wafer suction of the hand 202 is turned on, it can be considered that the robot hand 202 grips the teaching unit 208 at the reference position.

  FIG. 11 shows an operation flowchart for gripping the teaching unit at the hand reference position.

  It is assumed that the operator issues a command from the teaching operation panel while confirming the rough positional relationship of the devices inside the apparatus from the outside of the apparatus viewing window 107 or the wafer storage container 103 shown in FIG.

  (Step S1101) The operator connects the teaching operation panel 209 to the mini-en.

  (Step S1102) The teaching unit 208 is released from standby using the teaching operation panel 209. On the screen of the teaching operation panel 209, as shown in FIG. 7, the sensor value of the teaching unit 208 and the remaining battery level are displayed, and a command can be transmitted to the teaching unit 208.

  (Step S1103) The teaching unit 208 is taken out from the teaching unit base 207 by the robot hand 202.

  (Step S1104) When the takeout result is an error, since the conveyance accuracy has deteriorated outside the allowable range, maintenance of the robot and the minien is necessary. In this case, the teaching work is interrupted.

  (Step 1105) If the extraction result is normal, the inclination sensor value 706 of the teaching unit 208 is read.

  (Step S1106) The teaching unit 208 is conveyed to the pre-aligner 203.

  (Step S1107) Pre-alignment processing is executed. If the pre-alignment result is an error, it is determined that the conveyance accuracy has deteriorated outside the allowable range, and the teaching operation is interrupted (step S1104).

  (Step S1108) The inclination sensor value 706 of the teaching unit 208 is read. The difference from the inclination sensor value 706 read in step S1105 is the relative inclination of the robot hand 202 with respect to the pre-aligner 203. If the relative inclination with respect to the robot hand 202 is outside the allowable range of the conveyance accuracy, the maintenance work for the robot and the pre-aligner 203 is necessary, so the teaching work is interrupted (S1104).

  (Step S1109) If the difference of the tilt sensor value 706 is within the allowable range, the operator executes calibration processing from the teaching operation panel 209. When the calibration process is completed, the deviations of the X, Y, and Z axes and the direct angle θ shown in FIG. 9 are adjusted to zero degrees, and the teaching unit 208 is held at the hand reference position.

  The calibration process is automatically controlled by the program of the mini-en control unit 206 according to the calibration process operation flow shown in FIGS. 12 and 13 according to an instruction from the teaching operation panel 209.

  FIG. 14 shows the relative positional relationship between the robot hand 202 and the momentary push button 402 of the teaching unit 208 in accordance with the calibration operation flow.

  In FIG. 14, a square whose center side is the intersection (x0, y0) of the center line 903 of the teaching unit 208 and the push button unit reference line 1403 and whose length of one side is 2 dm (twice dm) is defined as the allowable error range 1402. .

  In the following description, the current position of the robot hand 202 is represented by (x, y, z), the tolerance of the hand horizontal position is dm, the pre-alignment teaching initial value is (x0, y0, z0), the center of the teaching unit 208 An angle formed by the line 903 and the center line 902 of the robot hand is represented by θ.

  (Step S1201) The robot hand 202 is moved to (x0-dm, y0-dm, z0) shown in FIG.

  (Step S1202) It is confirmed that the momentary push button 402 of the teaching unit 208 is in the ON state.

  (Step S1203) The robot hand 202 is continuously finely operated in the X-axis direction within a range where x0−dm ≦ x and x ≦ x0 + dm. If the momentary push button 402 is turned off during the continuous minute movement, the robot hand 202 is immediately stopped (S1208).

  (Step S1204) When the current position of the X axis becomes x0 + dm <x or x <x0−dm, a slight operation is performed in the positive direction of the Y axis.

  (Step S1205) The robot hand 202 is continuously finely operated in the negative direction of the X axis within a range where x0−dm ≦ x is satisfied. If the momentary push button 402 is turned off during the continuous minute movement, the robot hand 202 is immediately stopped (S1208).

  (Step S1206) When the current position of the X-axis becomes x0 + dm <x or x <x0-dm, a slight operation is once performed in the positive direction of the Y-axis.

  (Step S1207) Steps S1203 to S1206 are repeated within a range where y0−dm ≦ y and y ≦ y0 + dm.

  (Step S1208) When the momentary push button 402 of the teaching unit 208 changes from the ON state to the OFF state while performing Steps S1203 to S1206, the minute operation of the robot hand 202 is immediately stopped.

  (Step 1209) If neither momentary push button 402 changes to the OFF state during the execution of Steps S1203 to S1207, the hand reference position does not exist within the allowable error dm. The process ends with an error.

  (Step S1210) If both the momentary push buttons 402 of the teaching unit 208 pass through the reference hole 501 of the robot hand 202 when the robot hand 202 is stopped in step S1208, the robot hand 202 is brought to the reference position. It is determined that the teaching unit 208 is held, and the calibration process is terminated.

  (Step S1212) When any of the momentary push buttons 402 changes from the ON state to the OFF state during the execution of Steps S1203 to S1206 (Step S1211), the coordinate values at that time are set to (xa, ya, za). As a temporary store.

  The robot hand 202 repeats minute movements along the robot hand movement trajectory 1401 in FIG. 14 according to the operation flow from step S1203 to step S1207, thereby allowing the robot hand 202 to move within the allowable error range 1402 (the length of one side is 2 dm). A position where the momentary push button 402 on the back surface of the teaching unit 208 passes through the teaching unit reference hole 501 machined in 202 is scanned.

  (Step S1213) After temporarily recording (xa, ya, za), the hand reference position is moved to the coordinates (x0 + dm, y0 + dm, z0) in FIG. Starting from (x0 + dm, y0 + dm, z0), the push button unit on one side matches the teaching unit reference hole 501 of the robot hand 202 by minutely moving the robot hand 202 in the direction opposite to the flow of FIGS. The point is scanned, and the coordinate value at this time is temporarily stored as (xb, yb, zb) (step S1215).

  (Step S1215) Based on (xa, ya, za) and (xb, yb, zb), an angle θ formed by the robot hand center line 902 and the teaching unit center line 903 is calculated.

  FIG. 15 shows an analysis graphic showing the calculation process of θ.

  In a right-angled triangle 1503 formed with an X coordinate difference 1501 (xb−xa) and a Y coordinate difference 1502 (yb−ya) as two sides, an angle θ (facing angle) formed between the hypotenuse and the Y coordinate difference 1502. Is represented by the following formula (1).

  Therefore, the directly facing angle θ can be calculated by the following formula (2).

  (Step S1216) The hand angle is turned by (−θ), the angle formed with the teaching unit 208 is corrected to zero, and the process returns to step S1201.

  If the angle θ formed by the robot hand 202 and the teaching unit 208 is corrected to zero, the deviation between the robot hand 202 and the teaching unit 208 is reduced in the horizontal direction (x-axis and y-axis directions). The teaching unit 208 can be held at the reference position of the robot hand 202 in accordance with the conditions of steps S1208 and S1210.

  The above is the description of the calibration process.

  After completion of the calibration process, the teaching work of the pre-aligner 203 is performed.

  A teaching work flow of the pre-aligner 203 is shown in FIG.

  (Step S 1601) The calibrated teaching unit 208 is transported to the pre-aligner 203.

  (Step S1602) The teaching unit 208 is realigned.

  (Step S1603) The eccentricity correction values (Δx, Δy) are read from the pre-aligner 203.

  (Step S1605) While the suction of the robot hand 202 is turned on, the robot hand 202 is raised (S1604), and the height position at which the suction sensor is turned on is set as a new Z-axis teaching record value.

  (Step S1606) The coordinate value obtained by adding the eccentricity correction values (Δx, Δy) to the pre-alignment teaching initial values (x1, y1, z1) is set as a new teaching recording value of x, y.

  A teaching work flow of the wafer storage container 103 is shown in FIG.

  The operator confirms the numerical value displayed on the teaching operation panel 209 through the apparatus viewing window 107 and the wafer storage container 103 while confirming the approximate positional relationship of the devices inside the apparatus, and operates the robot 201.

  (Step S1701) Calibration processing is performed, and the teaching unit 208 is held at the hand reference position.

  (Step S1702) The robot hand 202 is moved to the insertion start position of the wafer storage container 103 while holding the teaching unit 208 with the robot hand 202.

  (Step S 1703) The robot hand 202 is inserted into the wafer storage container 103 while confirming the clearance between the teaching unit 208 and the wafer storage container 103.

  (Step S1704) The sensor value of the inclination sensor 304 is read.

  (Step S1705) The vacuum suction is turned off and the teaching unit 208 is stored in the wafer storage container 103.

  (Step S1706) The sensor value of the inclination sensor 304 is read.

  (Step S1707) The difference between the inclination sensor value read in Step 1704 and the sensor value in Step S1706 is the relative inclination of the robot hand 202 with respect to the wafer storage container 103. If the inclination is outside the allowable range, the teaching operation is interrupted, and the maintenance operation for the robot 201, the wafer storage container 103, and the load port 102 is performed (step 1708).

  (Step S1709) The teaching unit 208 is gripped by the robot hand 202.

  FIG. 18 shows a display screen 702 of the teaching operation panel 209 during teaching work for the wafer storage container 103. The display screen 702 displays a teaching unit status display 1801, a wafer storage container wall surface display 1802 (display of the inner wall surface of the wafer storage container), and a clearance distance display 1803 (clearance distance display) along with each distance sensor value display 1804. .

  A correlation between the clearance distance display 1803 and the distance sensor value display 1804 is shown in FIG. If the inner width of the wafer storage container 103 is D, the diameter of the teaching unit 1802 is R, the left distance sensor value is a, the right distance sensor value is b, and the front angle ξ between the robot hand and the wafer storage container is From the relationship between the angle ξ at the apex α of the right triangle αβγ, the hypotenuse (a + b + R), and the base D, the following equation (3) is derived.

  Therefore, the directly facing angle ξ can be calculated by the following equation (4).

  19, the relationship between the base ομ (the length of the side is A + R / 2), the hypotenuse οα (the length of the side is a + R / 2), and the angle ξ of the angle αομ formed by them. Is represented by the following formula (5).

  When this is solved for A, the following equation (6) is obtained.

  Similarly, for the right triangle βον, the relationship between the base ον (the length of the side is B + R / 2), the hypotenuse οβ (the length of the side is b + R / 2), and the angle ξ of the angle βον formed by them. Is represented by the following formula (7).

  The clearance distances A and B between the teaching unit state display 1801 and the wafer container surface display 1802 are obtained by applying the ξ obtained by the above expression (4) to the cos ξ of the above expressions (6) and (7). Can do.

  The clearance distance of the depth can also be obtained using the same calculation formula as the above formulas (6) and (7) using the distance sensor value and the facing angle ξ.

  (Step S1710) The operator sets the facing angle to zero degrees on the basis of the facing angle ξ, the distance sensor value display 1804, and the clearance distance display 1803 obtained by the above calculation formula displayed in real time on the display unit. The robot hand 202 is turned so as to be (0 deg). When the facing angle is zero degrees, the distance sensor value a = the clearance distance A and the distance sensor value b = the clearance distance B are established.

  (Step S1711) The right and left and depth of the teaching unit 208 are adjusted and moved to predetermined positions (for example, 5 mm from the left and right wall surfaces and 5 mm from the depth wall surface) to obtain new teaching recording coordinates and recorded in the mini-en control unit 206. , Teaching work is completed.

  As described above, by calculating the clearance distance based on the sensor value of the inclination sensor 304 and the distance sensor 303 installed in the teaching unit 208, visually communicating those numerical information to the operator, and realizing interactive operation, Objective and highly accurate teaching position coordinates can be obtained.

  The teaching method described with reference to FIG. 17 can also be applied to teaching of the wafer stage 205 in which the clearance between the depth and the left and right and the height coordinate are fixed.

  According to the present invention, as long as the operator can grasp a rough position from the outside of the viewing window or the wafer storage container, the teaching unit installed inside the apparatus itself has a clearance from the housing, a distance to the wafer storage container, and an inclination. In order to detect the degree, it is possible to carry out minute position adjustment and confirmation based on the numerical value of the teaching operation panel, and it is not necessary to put a part of the head or body into the apparatus, thereby ensuring work safety.

  In addition, according to the present invention, if the positional deviation is within an allowable range, the teaching work can be performed with the apparatus opening closed, so there is no need for idling operation or cleaning inside the apparatus, and downtime is reduced. Can be shortened.

  Further, according to the present invention, since the numerical data output from the distance sensor and the inclination sensor is used as a reference, teaching is performed based on objective and highly accurate position data regardless of the technical skill and skill level of the operator. Can be done.

  101: Mini-en, 102: Load port, 103: Wafer storage container, 104: Wafer, 105: Semiconductor manufacturing equipment, 106: FFU, 107: Viewing window, 108: Maintenance door, 201: Robot, 202: Robot hand, 203 : Pre-aligner, 204: Line sensor, 205: Wafer stage, 206: Mini-en controller, 207: Teaching unit base, 208: Teaching unit, 209: Teaching operation panel, 210: Cable, 301: Substrate, 302: Notch, 303: Distance sensor, 304: Inclination sensor, 305: Wireless communication unit, 306: Power receiving unit, 307: Power supply battery, 308: Teaching unit control unit, 309: Board, 401: Back surface of teaching unit, 402: Momentary push button, 5 1: Teaching unit reference hole, 502: Wafer suction port, 601: Teaching unit support member, 602: Contactless power supply unit, 603: Mini-en housing member, 701: Interface, 702: Display screen, 703: Emergency stop button, 704: Operation panel connection cable, 705: Distance sensor display value, 706: Tilt sensor display value, 707: Momentary push button ON / OFF state display, 708: Battery remaining amount display, 901: XY coordinate axis, 1401: Robot hand operation Trajectory, 1402: Allowable error range, 1403: Push button unit reference line, 1501, 1502: Difference, 1503: Right triangle, 1801: Teaching unit status display, 1802: Wafer storage container wall surface display, 1803: Clearance distance display, 1804: Distance Sen Value display.

Claims (15)

  Including a substrate, a distance sensor, a momentary push button, a communication unit, a charging power receiving unit, a power storage unit, and a unit control unit, wherein the distance sensor is disposed on an outer peripheral portion of the substrate, and the momentary type A teaching support unit, wherein the push button is disposed on the back surface of the substrate.   The teaching support unit according to claim 1, further comprising an inclination sensor.   The teaching support unit according to claim 1, wherein the power storage unit is a battery.   The teaching support unit according to claim 1, wherein the communication unit is wireless.   The teaching support unit according to claim 1, wherein the charging power receiving unit is a non-contact type.   The teaching support unit according to claim 1, wherein a shape of an outer edge portion of the substrate is the same as a shape of an outer edge portion of the wafer.   The teaching support unit according to claim 1, wherein the substrate has a notch or an orientation flat.   A teaching unit that has a wafer suction port for vacuum-sucking a wafer, enables the teaching support unit according to any one of claims 1 to 7 to be held by the wafer suction port, and corresponds to the momentary push button. A robot hand characterized by having a reference hole.   A teaching support unit pedestal comprising: a teaching support unit support member for stopping the teaching support unit according to any one of claims 1 to 7; and a power feeding unit of the charging power receiving unit.   The teaching support unit base according to claim 9, wherein the power feeding unit is a contactless type.   A display screen, an interface for giving a command to the mini-environment wafer transfer device, and a connection part for transmitting and receiving signals to and from the mini-environment wafer transfer device, The sensor value transmitted from the teaching support unit described above, the ON / OFF state of the momentary push button, and the clearance value between the teaching support unit and the inner wall surface of the wafer storage container are displayed on the display screen. Teaching operation panel.   It includes a wafer transfer robot, a load port for fixing a wafer storage container, a pre-aligner, a mini-en control unit, a teaching operation panel, and the teaching support unit according to any one of claims 1 to 7. Mini environment wafer transfer device.   A step of gripping the teaching support unit according to any one of claims 1 to 7 at a reference position of the robot hand using the robot hand according to claim 8, and the teaching support unit by the robot hand. Transporting to the pre-aligner and teaching the pre-aligner; transporting the teaching support unit to the wafer storage container by the robot hand; teaching the wafer storage container; and teaching the teaching support unit by the robot hand A teaching method comprising: transferring the wafer stage to the wafer stage and teaching the wafer stage.   2. The front angle between the wafer storage container and the robot hand and the clearance value between the inner wall surface of the wafer storage container and the teaching support unit are calculated using the sensor value of the distance sensor. 13. The teaching method according to 13.   The teaching support unit according to any one of claims 1 to 7, wherein the momentary push button of the teaching support unit according to any one of claims 1 to 7 is aligned with a position of the teaching unit reference hole provided in the robot hand. At a reference position of the robot hand.

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