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JP2011084418A - Method and apparatus for manufacturing optical element - Google Patents

Method and apparatus for manufacturing optical element Download PDF

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JP2011084418A
JP2011084418A JP2009237016A JP2009237016A JP2011084418A JP 2011084418 A JP2011084418 A JP 2011084418A JP 2009237016 A JP2009237016 A JP 2009237016A JP 2009237016 A JP2009237016 A JP 2009237016A JP 2011084418 A JP2011084418 A JP 2011084418A
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temperature
mold
stage
manufacturing
optical element
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Shotaro Miyake
正太郎 三宅
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Ohara Inc
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Ohara Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an optical element, capable of reducing cracking, segregation and haze of the molded optical element and increasing dimensional reproducibility of the optical element. <P>SOLUTION: In the method for manufacturing the optical element, the optical element L is manufactured by pressing a glass G. The method includes a step of successively moving a molding die 2 comprising an upper die 21 and a lower die 23 through a temperature-raising stage 11, a pressing stage 12 and a temperature-lowering stage 13 and stopping the molding die 2 at each stage to raise the temperature, press and lower the temperature of the glass G, respectively, inside the molding die 2. The moving and stopping of the molding die 2 are performed by moving a contact part 43a that contacts the molding die 2 while keeping a temperature difference of within 20°C between the contact part 43a and a contacted site of the molding die 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、光学素子製造方法及び光学素子製造装置に関する。   The present invention relates to an optical element manufacturing method and an optical element manufacturing apparatus.

従来、ガラス成形体の製造は、板ガラスから切り出したガラスをガラス成形体に近似した形状に研磨し、この研磨物を加熱成形することで行われてきた。しかし、レンズ等の光学素子を作製する場合、この方法ではガラス素材の研磨コストが嵩む。そこで、成形型を用いて原料ガラスをプレス成形することにより、レンズ等の光学素子を形成する方法が用いられている。   Conventionally, a glass molded body has been manufactured by polishing a glass cut out from a plate glass into a shape approximate to a glass molded body, and then heat-molding the polished product. However, when producing an optical element such as a lens, this method increases the polishing cost of the glass material. Therefore, a method of forming an optical element such as a lens by press-molding the raw glass using a mold is used.

ここで、光学素子を製造するガラス成形装置として、例えば図7に示すような、下型91と上型92との間にガラスGを置いた成形型90を用いたガラス成形装置が開示されている(特許文献1参照)。このガラス成形装置では、成形型90は、下型91の下側及び上型92の上側から加熱されながら、金型搬送ユニット96の移動及び停止によって搬送される。   Here, as a glass forming apparatus for manufacturing an optical element, for example, a glass forming apparatus using a forming mold 90 in which a glass G is placed between a lower mold 91 and an upper mold 92 as shown in FIG. 7 is disclosed. (See Patent Document 1). In this glass forming apparatus, the forming mold 90 is conveyed by moving and stopping the mold conveying unit 96 while being heated from the lower side of the lower mold 91 and the upper side of the upper mold 92.

特開2006−199537号公報JP 2006-199537 A

しかしながら、特許文献1で開示されたガラス成形装置では、成形されるガラス成形体には、割れ、偏析及び曇りが生じ易かった。また、特にガラス成形体をそのまま光学素子として用いる場合には、光学素子に確実に所望の光学性能を付与させるために、ガラス成形体の寸法の再現性を高めることが求められる。   However, in the glass forming apparatus disclosed in Patent Document 1, cracks, segregation, and fogging are likely to occur in the formed glass molded body. In particular, when the glass molded body is used as an optical element as it is, it is required to improve the reproducibility of the dimensions of the glass molded body in order to surely impart desired optical performance to the optical element.

本発明は、以上の実情に鑑みてなされたものであり、成形される光学素子の割れ、偏析及び曇りを低減しながらも、光学素子の寸法の再現性を高めることが可能な光学素子の製造方法及び製造装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, and manufacture of an optical element capable of improving the reproducibility of the dimensions of the optical element while reducing cracks, segregation, and fogging of the molded optical element. An object is to provide a method and a manufacturing apparatus.

本発明者らは、成形型を搬送する搬送手段のうち、成形型に接触する接触部の温度を所定の範囲内に調節することにより、成形型の被接触箇所と搬送手段の接触部との温度差が低減されながら、搬送手段の駆動力が接触部を介して成形型に伝えられることを見出し、本発明を完成するに至った。   The present inventors adjust the temperature of the contact portion in contact with the molding die within a predetermined range among the conveying means for conveying the molding die, so that the contact portion of the molding die and the contact portion of the conveying means are in contact with each other. It has been found that the driving force of the conveying means is transmitted to the mold through the contact portion while the temperature difference is reduced, and the present invention has been completed.

(1) ガラスをプレスして光学素子を製造する製造方法であって、上型及び下型を有する成形型を、昇温ステージ、押圧ステージ、及び降温ステージの各々と順次移動及び停止させて、前記成形型内のガラスを昇温、押圧、及び降温する工程を有し、前記移動及び停止は、前記成形型のうち被接触箇所との温度差を20℃以内に維持した接触部で前記成形型に接触しつつ、前記接触部を動かすことで行う製造方法。   (1) A method of manufacturing an optical element by pressing glass, wherein a mold having an upper mold and a lower mold is sequentially moved and stopped with each of a heating stage, a pressing stage, and a cooling stage, The step of raising, pressing, and lowering the glass in the mold is performed, and the moving and stopping are performed at the contact portion where the temperature difference from the contacted portion of the mold is maintained within 20 ° C. The manufacturing method performed by moving the said contact part, contacting a type | mold.

(2) 前記接触部を、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージの各々と熱伝導可能に接続することで加温する(1)記載の製造方法。   (2) The manufacturing method according to (1), wherein the contact portion is heated by being connected to each of the temperature raising stage, the pressing stage, and the temperature lowering stage so as to be able to conduct heat.

(3) 前記接触部と前記成形型との接触状態を、前記移動及び停止の間、持続する(1)又は(2)記載の製造方法。   (3) The manufacturing method according to (1) or (2), wherein the contact state between the contact portion and the mold is maintained during the movement and stop.

(4) 前記接触部として前記移動の方向に可動である可動床を用い、この可動床上に前記成形型を載置した状態で前記移動及び停止を行う(3)記載の製造方法。   (4) The manufacturing method according to (3), wherein a movable floor movable in the direction of movement is used as the contact portion, and the movement and stop are performed in a state where the molding die is placed on the movable floor.

(5) 前記接触部を、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージとは異なる加温手段によって加温する(1)記載の製造方法。   (5) The manufacturing method according to (1), wherein the contact portion is heated by a heating means different from the temperature raising stage, the pressing stage, and the temperature lowering stage.

(6) (1)から(5)いずれか記載の製造方法で製造される光学素子を用いる光学機器の製造方法。   (6) A method for manufacturing an optical device using the optical element manufactured by the manufacturing method according to any one of (1) to (5).

(7) ガラスをプレスして光学素子を製造する製造装置であって、上型及び下型を有する成形型を昇温する昇温ステージ、押圧する押圧ステージ、及び降温する降温ステージを有するチャンバと、前記成形型を前記昇温ステージ、前記押圧ステージ、及び前記降温ステージへの各々と順次移動及び停止させる搬送手段と、を備え、前記搬送手段は、前記成形型に接触する接触部と、この接触部を動かす駆動部と、を有し、前記製造装置は、前記接触部に接触される前記成形型の被接触箇所の温度を検出する検出手段と、この検出手段の検出結果に基づいて前記接触部の温度を調節する温度調節手段と、を更に備える製造装置。   (7) A manufacturing apparatus for manufacturing an optical element by pressing glass, and a chamber having a temperature raising stage for raising a temperature of a mold having an upper mold and a lower mold, a pressing stage for pressing, and a temperature lowering stage for lowering the temperature. A conveying means for sequentially moving and stopping the molding die to the temperature raising stage, the pressing stage, and the temperature lowering stage, and the conveying means includes a contact portion that contacts the molding die, A drive unit that moves the contact unit, and the manufacturing apparatus detects the temperature of the contacted portion of the mold that is in contact with the contact unit, and the detection unit detects the temperature based on the detection result of the detection unit. And a temperature adjusting means for adjusting the temperature of the contact portion.

(8) 前記接触部は、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージの各々と熱伝導可能に接続され、これにより加温されている(7)記載の製造装置。   (8) The manufacturing apparatus according to (7), wherein the contact portion is connected to each of the temperature raising stage, the pressing stage, and the temperature lowering stage so as to be able to conduct heat and thereby heated.

(9) 前記接触部は、前記移動及び停止の間、前記成形型との接触状態を持続する(7)又は(8)記載の製造装置。   (9) The manufacturing apparatus according to (7) or (8), wherein the contact portion maintains a contact state with the mold during the movement and stop.

(10) 前記接触部は、前記成形型が載置され且つ前記移動の方向に可動である可動床を有する(9)記載の製造装置。   (10) The manufacturing apparatus according to (9), wherein the contact portion includes a movable floor on which the mold is placed and is movable in the moving direction.

(11) 前記接触部を加温し、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージとは異なる加温手段を更に備える(7)記載の製造装置。   (11) The manufacturing apparatus according to (7), further comprising heating means that heats the contact portion and is different from the heating stage, the pressing stage, and the cooling stage.

(12) (7)から(11)いずれか記載の製造装置と、この製造装置で製造される光学素子から光学機器を製造する製造装置と、を備える光学機器製造システム。   (12) An optical apparatus manufacturing system comprising: the manufacturing apparatus according to any one of (7) to (11); and a manufacturing apparatus that manufactures an optical apparatus from an optical element manufactured by the manufacturing apparatus.

本発明によれば、成形型を搬送する搬送手段のうち、成形型の被接触箇所に接触する接触部の温度を所定の範囲内に調節することにより、被接触箇所と接触部の温度差が低減されながら、搬送手段の駆動力が接触部を介して成形型に伝えられる。そのため、成形されるガラスにおける局所的な温度の変動を抑制でき、金型の押圧時における上型の傾きを低減できる。従って、成形される光学素子の割れ、偏析及び曇りを低減しながらも、光学素子の寸法の再現性を高めることができる。   According to the present invention, the temperature difference between the contacted part and the contact part is adjusted by adjusting the temperature of the contact part that contacts the contacted part of the molding die within a predetermined range among the transporting means for transporting the mold. While being reduced, the driving force of the conveying means is transmitted to the mold through the contact portion. Therefore, local temperature fluctuations in the glass to be molded can be suppressed, and the inclination of the upper mold when the mold is pressed can be reduced. Therefore, the reproducibility of the dimensions of the optical element can be improved while reducing cracks, segregation and fogging of the molded optical element.

本発明の第1実施形態に係る光学素子の製造方法の好ましい一例を示す断面図である。It is sectional drawing which shows a preferable example of the manufacturing method of the optical element which concerns on 1st Embodiment of this invention. 図1の接触部の近傍を拡大した断面図である。It is sectional drawing to which the vicinity of the contact part of FIG. 1 was expanded. 本発明の第1実施形態に係る光学素子の製造方法の好ましい一例を示す平面図である。It is a top view which shows a preferable example of the manufacturing method of the optical element which concerns on 1st Embodiment of this invention. 本発明の第1実施形態に係る光学素子の製造方法の変形例を示す平面図である。It is a top view which shows the modification of the manufacturing method of the optical element which concerns on 1st Embodiment of this invention. 本発明の第2実施形態に係る光学素子の製造方法の好ましい一例を示す断面図である。It is sectional drawing which shows a preferable example of the manufacturing method of the optical element which concerns on 2nd Embodiment of this invention. 本発明の第3実施形態に係る光学素子の製造方法の好ましい一例を示す断面図である。It is sectional drawing which shows a preferable example of the manufacturing method of the optical element which concerns on 3rd Embodiment of this invention. 従来技術に係る成形型の移送態様を示す断面図である。It is sectional drawing which shows the transfer aspect of the shaping | molding die concerning a prior art.

本発明の光学素子の製造方法は、ガラスをプレスして光学素子を製造する製造方法であって、上型及び下型を有する成形型を、昇温ステージ、押圧ステージ、及び降温ステージの各々と順次移動及び停止させて、前記成形型内のガラスを昇温、押圧、及び降温する工程を有し、前記移動及び停止は、前記成形型のうち被接触箇所との温度差を20℃以内に維持した接触部で前記成形型に接触しつつ、前記接触部を動かすことで行う。   The optical element manufacturing method of the present invention is a manufacturing method in which an optical element is manufactured by pressing glass, and a mold having an upper mold and a lower mold is connected to each of a temperature raising stage, a pressing stage, and a temperature lowering stage. Steps of sequentially moving and stopping to raise, press, and lower the temperature of the glass in the mold, and the movement and stop of the mold within a temperature difference of 20 ° C. with respect to the contacted portion. It is performed by moving the contact portion while contacting the mold with the maintained contact portion.

また、本発明の光学素子の製造装置は、ガラスをプレスして光学素子を製造する製造装置であって、上型及び下型を有する成形型を昇温する昇温ステージ、押圧する押圧ステージ、及び降温する降温ステージを有するチャンバと、前記成形型を前記昇温ステージ、前記押圧ステージ、及び前記降温ステージへの各々と順次移動及び停止させる搬送手段と、を備え、前記搬送手段は、前記成形型に接触する接触部と、この接触部を動かす駆動部と、を有し、前記製造装置は、前記接触部に接触される前記成形型の被接触箇所の温度を検出する検出手段と、この検出手段の検出結果に基づいて前記接触部の温度を調節する温度調節手段と、を更に備える。   Further, the optical element manufacturing apparatus of the present invention is a manufacturing apparatus for manufacturing an optical element by pressing glass, a temperature rising stage for raising the temperature of a mold having an upper mold and a lower mold, a pressing stage for pressing, And a chamber having a temperature-decreasing stage for lowering the temperature, and conveying means for sequentially moving and stopping the molding die to each of the temperature-rising stage, the pressing stage, and the temperature-decreasing stage, and the conveying means includes the molding A contact unit that contacts the mold, and a drive unit that moves the contact unit, and the manufacturing apparatus detects a temperature of a contacted portion of the mold that is in contact with the contact unit, Temperature adjusting means for adjusting the temperature of the contact portion based on the detection result of the detecting means.

以下、本発明の成形型、着脱式転倒抑制構造体及び光学素子の製造方法の実施形態について詳細に説明するが、本発明は、以下の実施形態に何ら限定されるものではなく、本発明の目的の範囲内において、適宜変更を加えて実施することができる。なお、説明が重複する箇所については、適宜説明を省略する場合があるが、発明の趣旨を限定するものではない。   Hereinafter, embodiments of the mold, the detachable toppling-suppressing structure, and the optical element manufacturing method of the present invention will be described in detail, but the present invention is not limited to the following embodiments at all. Within the range of the objective, it can implement by changing suitably. In addition, although description may be abbreviate | omitted suitably about the location where description overlaps, the meaning of invention is not limited.

<第1実施形態>
本発明の第1実施形態は、成形型2とその搬送手段4aとが接触する部分における、成形型2の温度及び搬送手段4aの接触部43aの温度を検出する検出手段5と、成形型2を加熱する熱源6を用いて接触部43aの温度を調節する温度調節手段(図示せず)と、を備える光学素子製造装置1aを用いた光学素子の製造方法である。図1〜図3は、光学素子の製造方法の好ましい一例を示す図である。図4は、光学素子の製造方法の変形例を示す図である。
<First Embodiment>
In the first embodiment of the present invention, the detecting means 5 for detecting the temperature of the forming mold 2 and the temperature of the contact portion 43a of the conveying means 4a in the portion where the forming mold 2 and the conveying means 4a are in contact, and the forming mold 2 Temperature adjusting means (not shown) for adjusting the temperature of the contact portion 43a using the heat source 6 for heating the optical element manufacturing apparatus 1a. 1-3 is a figure which shows a preferable example of the manufacturing method of an optical element. FIG. 4 is a diagram showing a modification of the method for manufacturing an optical element.

[光学素子製造装置]
光学素子製造装置1aは、ガラスGをプレスして光学素子Lを製造する。ここで、光学素子製造装置は、成形型2を移動させて停止させる工程と、成形型2内のガラスGを昇温、押圧、及び降温する工程と、を行うことができる装置の中から適宜選択される。例えば、図1に示す光学素子製造装置1aは、チャンバ10と、チャンバ10の内部で成形型2を順次移動及び停止させる搬送手段4aと、搬送手段4a及び成形型2が接触する部分(図2に示す被接触箇所24a及び接触部43a)の温度を検出する検出手段5と、を有する。
[Optical element manufacturing equipment]
The optical element manufacturing apparatus 1a presses the glass G to manufacture the optical element L. Here, the optical element manufacturing apparatus appropriately selects from among apparatuses capable of performing the process of moving and stopping the mold 2 and the process of heating, pressing, and cooling the glass G in the mold 2. Selected. For example, the optical element manufacturing apparatus 1a shown in FIG. 1 includes a chamber 10, a transport unit 4a for sequentially moving and stopping the mold 2 inside the chamber 10, and a portion where the transport unit 4a and the mold 2 are in contact (FIG. 2). And a detecting means 5 for detecting the temperature of the contacted portion 24a and the contact portion 43a).

〔チャンバ〕
チャンバ10は、内部で成形型2に収容されたガラスGを昇温できるように構成される。図1及び図3に示すチャンバ10は、上型21及び下型23を有する成形型2を加熱する昇温ステージ11、成形型2を押圧する押圧ステージ12、及び成形型2を降温する降温ステージ13を有する。
[Chamber]
The chamber 10 is configured so that the glass G housed in the mold 2 can be heated inside. A chamber 10 shown in FIGS. 1 and 3 includes a temperature raising stage 11 for heating a mold 2 having an upper mold 21 and a lower mold 23, a pressing stage 12 for pressing the mold 2, and a temperature lowering stage for lowering the mold 2. 13

ここで、チャンバ10は、成形型2の供給及び排出が行われないときには、シャッターSにより密閉可能であることが好ましい。これにより、チャンバ10の外気の流れによる成形型2の冷却が低減されるため、成形型2の局所的な温度の変動を低減できる。   Here, the chamber 10 is preferably sealable by the shutter S when the mold 2 is not supplied and discharged. Thereby, since cooling of the shaping | molding die 2 by the flow of the external air of the chamber 10 is reduced, the fluctuation | variation of the local temperature of the shaping | molding die 2 can be reduced.

チャンバ10に収容されたガラスGを加熱する熱源6は、成形型2をガラスGの成形温度に加熱できる手段であれば特に限定されないが、例えば赤外線加熱、ガスバーナ、誘導コイル、電熱線等を用いることができる。   The heat source 6 for heating the glass G accommodated in the chamber 10 is not particularly limited as long as it is a means capable of heating the mold 2 to the molding temperature of the glass G. For example, infrared heating, a gas burner, an induction coil, a heating wire or the like is used. be able to.

〔搬送手段〕
搬送手段4aは、例えば図2に示すように、成形型2の被接触箇所24aに接触する接触部43aと、接触部43aを動かす図示しない駆動部と、接触部43aの温度を調節する図示しない温度調節手段と、を有する。これにより、接触部43aの温度が調節されながら、駆動部の駆動力が接触部43aを介して成形型2に伝えられるため、成形型2の被接触箇所24aの温度低下を低減して成形型2の温度バランスを保ちながらも、成形型2を所望の位置に搬送できる。
[Conveying means]
For example, as illustrated in FIG. 2, the transport unit 4 a includes a contact portion 43 a that contacts the contacted portion 24 a of the mold 2, a drive unit (not illustrated) that moves the contact unit 43 a, and a temperature that does not illustrate the contact unit 43 a Temperature adjusting means. As a result, the driving force of the drive unit is transmitted to the molding die 2 through the contact portion 43a while the temperature of the contact portion 43a is adjusted. Therefore, the temperature drop of the contacted portion 24a of the molding die 2 is reduced and the molding die is reduced. The mold 2 can be conveyed to a desired position while maintaining the temperature balance of 2.

搬送手段4aを用いて上述のチャンバ10で成形型2を搬送する手順では、チャンバ10の外部から、昇温ステージ11、押圧ステージ12、降温ステージ13への各々と順次移動及び停止させ、その後に降温ステージ13の上からチャンバ10の外部に成形型2を移動する。   In the procedure of transporting the mold 2 in the chamber 10 using the transport means 4a, the mold 10 is sequentially moved and stopped from the outside of the chamber 10 to each of the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13, and thereafter The mold 2 is moved from the temperature lowering stage 13 to the outside of the chamber 10.

ここで、搬送手段4aは、成形型2の移動及び停止の間、接触部43aにおける成形型2との接触状態を持続することが好ましい。これにより、接触部43aと成形型2とが離間して再度接触したときに生じる衝撃が回避されるため、これらが接触した際の衝撃によるガラスGの成形型2に対する位置のずれを低減でき、ひいては光学素子Lの形状の再現性をより高めることができる。   Here, it is preferable that the conveying means 4a maintains the contact state with the mold 2 in the contact portion 43a during the movement and stop of the mold 2. Thereby, since the impact that occurs when the contact portion 43a and the mold 2 are separated and contacted again is avoided, the displacement of the position of the glass G relative to the mold 2 due to the impact when these contact can be reduced, As a result, the reproducibility of the shape of the optical element L can be further enhanced.

また、接触部43aが昇温ステージ11、押圧ステージ12、及び降温ステージ13に各々設けられた熱源6と熱伝導可能に接続されるように、搬送手段4aを設けることが好ましい。これにより、接触部43aが熱源6によって加温されるため、新たな熱源を設けなくても、接触部43aを介して成形型2の温度を調節できる。なお、接触部43aを加温する手段は上述に限定されず、図6のように熱源6とは異なる加熱手段(加温手段48d)を設けてもよい。また、「熱伝導可能に接続する」とは、図2のように昇温ステージ11、押圧ステージ12、及び降温ステージ13を介して接続する形態であってもよく、他の熱伝導性の部材を介して接続する形態であってもよく、熱源6と接触部43aとを直接接触させて接続する形態であってもよい。   Moreover, it is preferable to provide the conveyance means 4a so that the contact part 43a is connected to the heat source 6 provided in each of the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13 so as to be able to conduct heat. Thereby, since the contact part 43a is heated by the heat source 6, even if it does not provide a new heat source, the temperature of the shaping | molding die 2 can be adjusted via the contact part 43a. The means for heating the contact portion 43a is not limited to the above, and a heating means (heating means 48d) different from the heat source 6 may be provided as shown in FIG. Further, “connecting so as to be capable of conducting heat” may be a form of connection via the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13 as shown in FIG. 2, and other heat conductive members. It is also possible to use a configuration in which the heat source 6 and the contact portion 43a are in direct contact with each other.

ここで、搬送手段4aの接触部43aと熱源6との接続に関する具体的な態様としては、昇温ステージ11、押圧ステージ12、及び降温ステージ13で成形型2が載置される加熱面62に、接触部43aに隣接する伝熱部42aを接触させる態様が一例として挙げられる。特に、昇温ステージ11、押圧ステージ12、及び降温ステージ13の各々で、加熱面62と伝熱部42aとを接触させてもよい。これにより、搬送手段4aが昇温ステージ11、押圧ステージ12、及び降温ステージ13の各々の加熱面62の温度に応じて接触部43aが加温される。そのため、成形型2を昇温、押圧、及び降温する一連の工程の各々において、接触部43aと被接触箇所24aとの温度差を低減し易くすることができる。   Here, as a specific aspect regarding the connection between the contact portion 43a of the transport unit 4a and the heat source 6, the heating surface 62 on which the molding die 2 is placed in the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13 is provided. An example in which the heat transfer part 42a adjacent to the contact part 43a is brought into contact with each other is given as an example. In particular, the heating surface 62 and the heat transfer part 42a may be brought into contact with each of the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13. Thereby, the contact part 43a heats the conveyance means 4a according to the temperature of each heating surface 62 of the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13. Therefore, it is possible to easily reduce the temperature difference between the contact portion 43a and the contacted portion 24a in each of a series of steps of heating, pressing, and cooling the mold 2.

搬送手段4aの形状は、熱伝導性を有し且つ成形型2を搬送できる形状の中から適宜選択される。特に、搬送手段4aの接触部43aの形状は、図2及び図3に示すような、成形型2の搬送方向Tに対して垂直な平面を備えた平板形状であることが好ましい。これにより、成形型2の被接触箇所24aと搬送手段4aの接触部43aとの接触面積が低減され、接触部43aと被接触箇所24aとの間で熱のやりとりが起こり難くなる。そのため、成形型2の水平方向の温度バランスへの影響を低減しつつ、熱源6からの限られた熱によっても接触部43aの温度の調節を速やかに行うことができる。   The shape of the conveying means 4a is appropriately selected from shapes that have thermal conductivity and can convey the mold 2. In particular, the shape of the contact portion 43a of the transport unit 4a is preferably a flat plate shape having a plane perpendicular to the transport direction T of the mold 2 as shown in FIGS. Thereby, the contact area of the contacted part 24a of the shaping | molding die 2 and the contact part 43a of the conveyance means 4a is reduced, and heat exchange does not occur easily between the contact part 43a and the contacted part 24a. Therefore, it is possible to quickly adjust the temperature of the contact portion 43a with limited heat from the heat source 6 while reducing the influence on the temperature balance in the horizontal direction of the mold 2.

搬送手段4aの材質は、ガラスGの成形温度に耐え、且つ熱源6からの熱を加熱面62に伝導できる材質の中から適宜選択される。特に、搬送手段4aの接触部43a及び伝熱部42aに用いられる材質の熱伝導率の下限は、好ましくは1.0W/mK、より好ましくは5.0W/mK、最も好ましくは10.0W/mKである。これにより、接触部43cの温度が調整され易くなるため、被接触箇所24cとの温度差を保ち易くして、光学素子Lの成形の再現性をより高めることができる。このような耐熱性と熱伝導性とを兼ね備えた材質として、例えばSUS等の金属や、SiC等のセラミックが挙げられる。   The material of the conveying means 4 a is appropriately selected from materials that can withstand the molding temperature of the glass G and can conduct the heat from the heat source 6 to the heating surface 62. In particular, the lower limit of the thermal conductivity of the material used for the contact part 43a and the heat transfer part 42a of the conveying means 4a is preferably 1.0 W / mK, more preferably 5.0 W / mK, and most preferably 10.0 W / m. mK. Thereby, since the temperature of the contact part 43c becomes easy to adjust, it is easy to maintain a temperature difference with the contacted part 24c, and the reproducibility of molding of the optical element L can be further enhanced. Examples of the material having both heat resistance and thermal conductivity include metals such as SUS and ceramics such as SiC.

搬送手段4aの駆動部(図示せず)は、成形型2を動かす駆動力を、動力伝達手段41aを介して接触部43aに与える。これにより、成形型2が搬送されるため、成形型2に収容されたガラスGを順次成形できる。   A driving unit (not shown) of the conveying unit 4a gives a driving force for moving the mold 2 to the contact unit 43a via the power transmission unit 41a. Thereby, since the shaping | molding die 2 is conveyed, the glass G accommodated in the shaping | molding die 2 can be shape | molded sequentially.

なお、例えば図4の光学素子製造装置1bに示すように、搬送手段4bは、成形型2の搬送方向Tに対して前方及び後方の各々に、成形型2が収容される間隔で、平板形状の接触部43bを備えてもよい。これにより、駆動部を駆動及び停止させた際に成形型2に慣性力が作用しても、成形型と接触部43bとの接触状態が持続する。そのため、成形型2における温度バランスを高めながらも、ガラスGの成形型2に対する位置のずれを低減できる。   For example, as shown in the optical element manufacturing apparatus 1b of FIG. 4, the conveying means 4b has a flat plate shape with an interval at which the mold 2 is accommodated in each of the front and rear with respect to the conveying direction T of the mold 2. The contact part 43b may be provided. Thereby, even if inertia force acts on the shaping | molding die 2 when driving and stopping a drive part, the contact state of a shaping | molding die and the contact part 43b continues. Therefore, the position shift of the glass G with respect to the mold 2 can be reduced while increasing the temperature balance in the mold 2.

〔検出手段〕
検出手段5は、例えば図2に示すように、成形型2の被接触箇所24aの温度及び搬送手段4aの接触部43aの温度を検出する。これにより、被接触箇所24aの温度が、接触部43aに対して所望の温度であるか否かが明らかになるため、その検出結果に基づいて被接触箇所24aの温度を調整できる。
[Detection means]
For example, as shown in FIG. 2, the detecting means 5 detects the temperature of the contacted portion 24a of the mold 2 and the temperature of the contact portion 43a of the conveying means 4a. Thereby, since it becomes clear whether the temperature of the to-be-contacted location 24a is a desired temperature with respect to the contact part 43a, the temperature of the to-be-contacted location 24a can be adjusted based on the detection result.

この検出手段5は、被接触箇所24aの温度を測定できる温度測定手段の中から適宜選択される。その中でも、接触部43aや被接触箇所24aと接触しない温度測定手段、例えば放射温度計等を用いることが好ましい。これにより、接触部43aや被接触箇所24aと、検出手段5との間で、熱のやり取りが行われ難くなる。そのため、成形型2の温度バランスを維持できる。   The detecting means 5 is appropriately selected from temperature measuring means that can measure the temperature of the contacted portion 24a. Among these, it is preferable to use a temperature measuring means that does not come into contact with the contact portion 43a or the contacted portion 24a, such as a radiation thermometer. This makes it difficult for heat to be exchanged between the contact portion 43a or the contacted portion 24a and the detection means 5. Therefore, the temperature balance of the mold 2 can be maintained.

検出手段5を用いた温度の測定箇所は、被接触箇所24a及び接触部43aであることが好ましい。これにより、被接触箇所24a及び接触部43aの温度が直接的に測定されるため、被接触箇所24a及び接触部43aの正確な温度を検出でき、接触部43aと被接触箇所24aとの温度差を正確に調節し易くできる。なお、検出手段5を用いた温度の測定箇所は、上述の箇所に限定されず、被接触箇所24a及び接触部43aの近傍、例えば成形型2の加熱面62に対する高さが略等しい箇所であってもよい。これにより、被接触箇所24a及び接触部43aの接触状態を持続したままであっても、加熱面62による加熱の状態が被接触箇所24aと略等しい箇所に対して温度が測定される。そのため、ガラスGと成形型2との間の位置のずれを低減しながらも、測定される温度の精度を高めることができる。   The temperature measurement locations using the detection means 5 are preferably the contact location 24a and the contact portion 43a. Thereby, since the temperature of the to-be-contacted part 24a and the contact part 43a is measured directly, the exact temperature of the to-be-contacted part 24a and the contact part 43a can be detected, and the temperature difference of the contact part 43a and the to-be-contacted part 24a Can be easily adjusted accurately. Note that the temperature measurement location using the detection means 5 is not limited to the above-described location, but is a location in the vicinity of the contacted location 24a and the contact portion 43a, for example, a location where the height relative to the heating surface 62 of the mold 2 is substantially equal. May be. Thereby, even if the contact state of the contacted part 24a and the contact part 43a is maintained, the temperature is measured at a part where the heating state by the heating surface 62 is substantially equal to the contacted part 24a. For this reason, it is possible to increase the accuracy of the measured temperature while reducing the displacement of the position between the glass G and the mold 2.

〔温度調節手段〕
温度調節手段(図示せず)は、検出手段5の検出結果に基づき、接触部43aの温度を調節する。具体的には、接触部43aの温度が被接触箇所24aの温度より低いときは、温度調節手段を用いて搬送手段4aの伝熱部42aと加熱面62とを熱伝導可能に接続させる。また、接触部43aの温度が被接触箇所24aの温度より高いときは、温度調節手段を用いて搬送手段4aの伝熱部42aと加熱面62とを離隔させる。これにより、加熱面62と伝熱部42aとを接続させたときに接触部43aの温度が上昇し、加熱面62と伝熱部42aとを離隔させたときに接触部43aの温度が低下する。そのため、接触部43aの温度を被接触箇所24aの温度に対して所定の範囲内におくことができる。従って、成形される光学素子Lを割れ難くすることができ、光学素子Lの偏析や曇りを低減でき、光学素子Lの寸法の再現性を高めることができる。
[Temperature control means]
The temperature adjusting means (not shown) adjusts the temperature of the contact portion 43 a based on the detection result of the detecting means 5. Specifically, when the temperature of the contact portion 43a is lower than the temperature of the contacted portion 24a, the heat transfer portion 42a of the transport means 4a and the heating surface 62 are connected so as to be able to conduct heat using temperature adjusting means. Moreover, when the temperature of the contact part 43a is higher than the temperature of the to-be-contacted location 24a, the heat transfer part 42a and the heating surface 62 of the conveying means 4a are separated from each other using the temperature adjusting means. Thereby, the temperature of the contact part 43a increases when the heating surface 62 and the heat transfer part 42a are connected, and the temperature of the contact part 43a decreases when the heating surface 62 and the heat transfer part 42a are separated. . Therefore, the temperature of the contact portion 43a can be set within a predetermined range with respect to the temperature of the contacted portion 24a. Therefore, the molded optical element L can be made difficult to break, segregation and fogging of the optical element L can be reduced, and the reproducibility of the dimensions of the optical element L can be enhanced.

なお、温度調節手段は、加熱面62と伝熱部42aとを接続及び/又は離隔させる手段に限定されない。例えば、搬送手段4aとして成形型2よりも熱伝導性が高い材料を用いた上で、加熱面62と伝熱部42aとを常時熱伝導可能に接続させておき、出力調整手段61を用いて、ガラスGのプレス成形に影響が及ばない範囲で熱源6の出力を調節するようにしてもよい。これにより、熱源6の出力を調節した際に、搬送手段4aの温度が成形型2よりも優先的に調節されるため、温度調節手段と出力調整手段61とを兼ねることができ、光学素子製造装置1aをより簡素な構成にすることができる。   The temperature adjusting means is not limited to means for connecting and / or separating the heating surface 62 and the heat transfer section 42a. For example, after using a material having higher thermal conductivity than the mold 2 as the conveying unit 4 a, the heating surface 62 and the heat transfer part 42 a are always connected so as to be able to conduct heat, and the output adjusting unit 61 is used. The output of the heat source 6 may be adjusted within a range that does not affect the press forming of the glass G. Thereby, when the output of the heat source 6 is adjusted, the temperature of the conveying means 4a is preferentially adjusted over the molding die 2, so that both the temperature adjusting means and the output adjusting means 61 can be used. The device 1a can have a simpler configuration.

〔成形型〕
搬送手段4aによって搬送される成形型2は、ガラスGを光学素子Lに成形できる金型から適宜選択される。例えば、上型21及び下型23を有しており、下型23の上側の面と上型21の下側の面には、対向するようにガラスGを成形する成形面26、27が設けられたものを用いる。上型21及び下型23の材質は、ガラスGの硬さやガラス転移点(Tg)等に応じて適宜設定されるが、プレス成形時の圧力に耐えられる点で、タングステンカーバイト(WC)等の超硬部材を用いることが好ましい。なお、成形面26、27には、それぞれ図示しない保護膜が形成されていてもよい。
[Mold]
The mold 2 conveyed by the conveying means 4a is appropriately selected from molds that can mold the glass G into the optical element L. For example, it has the upper mold | type 21 and the lower mold | type 23, and the molding surfaces 26 and 27 which shape | mold the glass G are provided in the upper surface of the lower mold | type 23, and the lower surface of the upper mold | type 21 so that it may oppose. Use what is provided. The materials of the upper mold 21 and the lower mold 23 are appropriately set according to the hardness of the glass G, the glass transition point (Tg), etc., but tungsten carbide (WC), etc., because it can withstand the pressure during press molding. It is preferable to use a cemented carbide member. A protective film (not shown) may be formed on each of the molding surfaces 26 and 27.

成形型2には、上型21及び下型23を取り囲むように胴型22が設けられていることが好ましい。これにより、押圧時における上型21の下型23に対する傾きが低減されつつ、下型23と上型21との水平方向についての位置関係が規定されるため、光学素子Lの寸法の再現性をより高めることができる。   The molding die 2 is preferably provided with a barrel die 22 so as to surround the upper die 21 and the lower die 23. Accordingly, the positional relationship in the horizontal direction between the lower mold 23 and the upper mold 21 is regulated while the inclination of the upper mold 21 with respect to the lower mold 23 is reduced, so that the dimensional reproducibility of the optical element L can be reduced. Can be increased.

成形型2の上型21及び下型23の間にガラスGを供給する手段、及び、成形型2の上型21及び下型23の間から光学素子Lを取り出す手段は、ガラスGの大きさや成形型2の形状等に応じて適宜選択できるが、例えば、ポンプの吸引力によってガラスGや光学素子Lを吸着して保持する吸着手段(図示せず)を備えることができる。また、上型21及び下型23を成形型2に組み立てる手段、及び成形型2を上型21及び下型23に分解する手段も特に限定されるものではないが、例えば図示しない保持アームを用い、その保持力によって上型21を保持しつつ下型23の上に載置することができる。   The means for supplying the glass G between the upper mold 21 and the lower mold 23 of the mold 2 and the means for taking out the optical element L from between the upper mold 21 and the lower mold 23 of the mold 2 are the size of the glass G Although it can select suitably according to the shape of the shaping | molding die 2, etc., the adsorption | suction means (not shown) which adsorb | sucks and hold | maintains the glass G and the optical element L with the attraction | suction force of a pump can be provided, for example. The means for assembling the upper mold 21 and the lower mold 23 into the mold 2 and the means for disassembling the mold 2 into the upper mold 21 and the lower mold 23 are not particularly limited. For example, a holding arm (not shown) is used. The upper die 21 can be placed on the lower die 23 while being held by the holding force.

<光学素子の製造方法>
本発明の一実施形態に係る光学素子の製造方法を、上述の光学素子製造装置1aを参照しつつ、図1〜図3を用いて説明する。この光学素子の製造方法では、成形型2をチャンバ10の外部から昇温ステージ11に移動してガラスGを昇温させ、次いで成形型2を押圧ステージ12に移動して押圧手段7を用いてガラスGを押圧し、次いで成形型2を降温ステージ13に移動してガラスGを降温させ、その後に成形型2をチャンバ10の外部に移動する。
<Optical element manufacturing method>
An optical element manufacturing method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3 with reference to the above-described optical element manufacturing apparatus 1a. In this optical element manufacturing method, the mold 2 is moved from the outside of the chamber 10 to the temperature raising stage 11 to raise the temperature of the glass G, and then the mold 2 is moved to the pressing stage 12 and the pressing means 7 is used. The glass G is pressed, then the mold 2 is moved to the temperature lowering stage 13 to lower the temperature of the glass G, and then the mold 2 is moved to the outside of the chamber 10.

成形型2の移動及び停止は、搬送手段4aの接触部43aと成形型2の被接触箇所24aとが接触する部分における、接触部43aと被接触箇所24aとの温度差を20℃以内に維持しつつ、搬送手段4aの接触部43aを動かすことで行う。これにより、成形型2やガラスGの内部における温度差が低減されつつ、成形型2が移動される。そのため、成形型2を押圧した際における上型の傾きを低減しつつ、成形型2をチャンバ10の所定の位置におくことができる。従って、成形される光学素子Lの割れ、偏析及び曇りを低減しつつ、光学素子Lの寸法の再現性を高めることができる。   The movement and stop of the mold 2 keep the temperature difference between the contact part 43a and the contacted part 24a within 20 ° C. at the part where the contact part 43a of the conveying means 4a and the contacted part 24a of the mold 2 contact. However, it is performed by moving the contact portion 43a of the transport means 4a. Thereby, the mold 2 is moved while the temperature difference in the mold 2 and the glass G is reduced. Therefore, the mold 2 can be placed at a predetermined position in the chamber 10 while reducing the inclination of the upper mold when the mold 2 is pressed. Therefore, the reproducibility of the dimension of the optical element L can be improved while reducing cracks, segregation and fogging of the optical element L to be molded.

ここで、接触部43aと被接触箇所24aとの温度差の検出は、これらの温度を測定できる温度測定手段を用いて行われる。その中でも、接触部43aや被接触箇所24aと接触しない温度測定手段、例えば放射温度計等を用いて行うことが好ましい。これにより、接触部43aや被接触箇所24aと、検出手段5との間で、熱のやり取りが行われなくなるため、成形型2の温度バランスを維持できる。   Here, the detection of the temperature difference between the contact portion 43a and the contacted portion 24a is performed using a temperature measuring means capable of measuring these temperatures. Among these, it is preferable to use a temperature measuring means that does not come into contact with the contact portion 43a or the contacted portion 24a, such as a radiation thermometer. Thereby, since heat exchange is not performed between the contact portion 43a or the contacted portion 24a and the detection means 5, the temperature balance of the mold 2 can be maintained.

また、接触部43a及び被接触箇所24aの温度の測定は、被接触箇所24a及び接触部43aに対して直接行うことが好ましい。これにより、被接触箇所24a及び接触部43aの正確な温度が検出されるため、接触部43aと被接触箇所24aとの温度差を所定の範囲内に調節し易くできる。なお、接触部43a及び被接触箇所24aの温度の測定は、上述の形態に限定されず、被接触箇所24a及び接触部43aの近傍に対して行ってもよい。この場合は、被接触箇所24a及び/又は接触部43aの温度と測定と行った箇所の温度との温度差を用いて、測定を行った箇所の温度を調整することで、被接触箇所24a及び/又は接触部43aの温度を求めることができる。   Moreover, it is preferable to measure the temperature of the contact part 43a and the contacted part 24a directly with respect to the contacted part 24a and the contact part 43a. Thereby, since the exact temperature of the to-be-contacted location 24a and the contact part 43a is detected, it can be easy to adjust the temperature difference of the contact part 43a and the to-be-contacted location 24a within the predetermined range. In addition, the measurement of the temperature of the contact part 43a and the contacted part 24a is not limited to the above-mentioned form, You may perform with respect to the contacted part 24a and the vicinity of the contact part 43a. In this case, by using the temperature difference between the temperature of the contacted part 24a and / or the contact part 43a and the temperature of the measured part, the temperature of the measured part is adjusted to adjust the contacted part 24a and The temperature of the contact part 43a can be calculated | required.

ここで、接触部43aと被接触箇所24aとの温度差の最大値は、好ましくは20℃、より好ましくは18℃、最も好ましくは15℃を上限とする。これにより、接触部43a及び被接触箇所24aを介した熱のやり取りが少なくなり、ガラスGの内部における温度差が小さくなる。そのため、押圧ステージ12で軟化させたときの、ガラスGの粘度に関する局所的な変動を低減できる。従って、成形される光学素子Lの割れ、偏析及び曇りをより低減できる。   Here, the maximum value of the temperature difference between the contact portion 43a and the contacted portion 24a is preferably 20 ° C., more preferably 18 ° C., and most preferably 15 ° C. Thereby, heat exchange through the contact portion 43a and the contacted portion 24a is reduced, and the temperature difference inside the glass G is reduced. Therefore, the local fluctuation | variation regarding the viscosity of the glass G when it softens with the press stage 12 can be reduced. Therefore, cracks, segregation and fogging of the optical element L to be molded can be further reduced.

接触部43aの温度の調整は、例えば図2に示すように、接触部43aと、昇温ステージ11、押圧ステージ12、及び/又は降温ステージ13の熱源6とを各々熱伝導可能に接続することで行う。これにより、接触部43aと熱源6とを接続した際には、伝熱部42aを介して接触部43aが加熱される。また、接触部43aと熱源6とを離隔した際には、接触部43aが放冷されることで降温される。従って、接触部43aと被接触箇所24aとの温度差を所定の範囲内に保つことができる。なお、特に接触部43aの加熱手段と熱源6とが別に設けられている場合、接触部43aの温度の調整は、熱源6によらなくてもよい。   For example, as shown in FIG. 2, the temperature of the contact portion 43 a is adjusted by connecting the contact portion 43 a and the heat source 6 of the temperature raising stage 11, the pressing stage 12, and / or the temperature lowering stage 13 so as to conduct heat. To do. Thereby, when the contact part 43a and the heat source 6 are connected, the contact part 43a is heated via the heat-transfer part 42a. Moreover, when the contact part 43a and the heat source 6 are separated, the temperature is lowered by allowing the contact part 43a to cool. Therefore, the temperature difference between the contact portion 43a and the contacted portion 24a can be kept within a predetermined range. In particular, when the heating means of the contact part 43a and the heat source 6 are provided separately, the temperature of the contact part 43a need not be adjusted by the heat source 6.

そして、接触部43aは、チャンバ10の内部で成形型2を順次移動及び停止させる間、成形型2との接触状態を持続することが好ましい。これにより、接触部43aと成形型2とが離間した後でこれらを再度接触させた際に生じる衝撃が回避される。そのため、成形型2の水平方向についての熱バランスを保ちながらも、成形型2を搬送する際の衝撃によるガラスGの成形への影響を低減できる。   The contact portion 43 a preferably maintains the contact state with the mold 2 while sequentially moving and stopping the mold 2 inside the chamber 10. Thereby, after the contact part 43a and the shaping | molding die 2 leave | separated, the impact which arises when these are made to contact again is avoided. Therefore, while maintaining the heat balance in the horizontal direction of the mold 2, the influence on the molding of the glass G due to the impact when the mold 2 is conveyed can be reduced.

[光学機器の作製]
上述の光学素子製造装置1aによって、レンズやプリズム等の光学素子Lが作製される。また、光学素子製造装置1aと、光学素子Lからカメラやプロジェクタ等の光学機器を製造する光学機器製造装置(図示せず)と、を備える光学機器製造システムを構築し、光学機器を製造することも好ましい。これにより、より高い精度でガラスGがプレス成形され、成形型2の寿命が長くなるため、光学素子L及び光学機器の製造コストを低減することができる。
[Production of optical equipment]
An optical element L such as a lens or a prism is manufactured by the above-described optical element manufacturing apparatus 1a. Also, an optical device manufacturing system including an optical device manufacturing apparatus 1a and an optical device manufacturing apparatus (not shown) that manufactures an optical device such as a camera or a projector from the optical element L is constructed to manufacture the optical device. Is also preferable. Thereby, since the glass G is press-molded with higher accuracy and the life of the molding die 2 is extended, the manufacturing costs of the optical element L and the optical apparatus can be reduced.

<第2実施形態>
本発明の第2実施形態は、搬送手段4cの接触部43cとして、成形型2を載置可能な可動床44c〜46cを備える光学素子製造装置1cを用いた光学素子の製造方法である。図5は、光学素子の製造方法に用いられる光学素子製造装置1cの好ましい一例を示す図である。
Second Embodiment
2nd Embodiment of this invention is an optical element manufacturing method using the optical element manufacturing apparatus 1c provided with the movable floors 44c-46c which can mount the shaping | molding die 2 as the contact part 43c of the conveyance means 4c. FIG. 5 is a diagram illustrating a preferred example of an optical element manufacturing apparatus 1c used in the method for manufacturing an optical element.

〔搬送手段〕
搬送手段4cは、例えば図5に示すように、成形型2が載置される加熱面62を備え、且つ成形型2の搬送方向Tについて可動である可動床44c〜46cを有する接触部43cと、接触部43cを搬送方向Tについて移動及び停止させる駆動部47cと、接触部43cの温度を調節する温度調節手段49cと、を有する。これにより、加熱面62を備えた接触部43cと、成形型2の被接触箇所24cとが熱伝導可能に接触されながら、成形型2が搬送される。そのため、成形型2を搬送する際の接触部43cと成形型2との離間及び接触による衝撃を低減しつつ、被接触箇所24cの近傍のみならず成形型2の全体の温度を、接触部43cを介して調節できる。従って、ガラスGの成形型2に対する位置のずれを低減しつつ、成形型2の水平方向(加熱面62と平行な方法)の温度バランスを高めることができる。なお、接触部43cは、可動床44c〜46cからなるものに限定されず、昇温ステージ11、押圧ステージ12、及び降温ステージ13について設けられた接触部43cの一部が可動でなくてもよい。
[Conveying means]
For example, as illustrated in FIG. 5, the transport unit 4 c includes a contact portion 43 c that includes a heating surface 62 on which the mold 2 is placed and has movable floors 44 c to 46 c that are movable in the transport direction T of the mold 2. The driving unit 47c moves and stops the contact unit 43c in the transport direction T, and the temperature adjusting unit 49c adjusts the temperature of the contact unit 43c. Thereby, the shaping | molding die 2 is conveyed, contacting the contact part 43c provided with the heating surface 62, and the to-be-contacted location 24c of the shaping | molding die 2 so that heat conduction is possible. Therefore, while reducing the impact due to separation and contact between the contact portion 43c and the mold 2 when the mold 2 is conveyed, the temperature of the entire mold 2 as well as the vicinity of the contacted portion 24c is reduced. Can be adjusted via. Therefore, it is possible to increase the temperature balance in the horizontal direction of the mold 2 (a method parallel to the heating surface 62) while reducing the displacement of the position of the glass G with respect to the mold 2. In addition, the contact part 43c is not limited to what consists of movable floors 44c-46c, A part of contact part 43c provided about the temperature rising stage 11, the press stage 12, and the temperature decreasing stage 13 may not be movable. .

搬送手段4cの具体的態様は、成形型2を載置し且つ搬送できる態様の中から適宜選択される。特に、接触部43cは、図5に示すように、昇温ステージ11について設けられる第1可動床44c、押圧ステージ12について設けられる第2可動床45c、及び降温ステージ13について設けられる第3可動床46cを有し、これらが互いに別体であることが好ましい。これにより、第1可動床44c、第2可動床45c及び第3可動床46cの温度が昇温ステージ11、押圧ステージ12、及び降温ステージ13の各々に適した温度に設定されつつ、成形型2が第1可動床44c、第2可動床45c及び第3可動床46cに順に搬送される。そのため、成形型2の水平方向の温度バランスを高めつつ、成形型2が搬送される可動床44c〜46cを変えていくことで、成形型2を移動させる際の成形型2の温度変化を速やかに行うことができる。   A specific mode of the transport unit 4c is appropriately selected from modes in which the mold 2 can be placed and transported. In particular, as shown in FIG. 5, the contact portion 43 c includes a first movable floor 44 c provided for the temperature raising stage 11, a second movable floor 45 c provided for the pressing stage 12, and a third movable floor provided for the temperature lowering stage 13. 46c, which are preferably separate from each other. Thereby, the mold 2 is set while the temperatures of the first movable floor 44c, the second movable floor 45c, and the third movable floor 46c are set to temperatures suitable for the temperature raising stage 11, the pressing stage 12, and the temperature lowering stage 13, respectively. Are sequentially conveyed to the first movable floor 44c, the second movable floor 45c, and the third movable floor 46c. Therefore, by changing the movable floors 44c to 46c to which the molding die 2 is conveyed while increasing the temperature balance in the horizontal direction of the molding die 2, the temperature change of the molding die 2 when the molding die 2 is moved is quickly changed. Can be done.

搬送手段4cの可動床44c〜46cの材質及び形状は、耐熱性及び熱伝導性を有し、且つ弾性変形する性質を有する材質及び形状を用いることが好ましい。より具体的には、例えばヤング率が小さく降伏応力が大きい材料(SUS等の金属等)からなる、フィルムやシートの形状に成形された成形品を用いることができる。これにより、可動床44c〜46cが搬送手段4cの形状に合わせて弾性変形することで、平坦な加熱面62が形成される。そのため、加熱面62と成形型2の被接触箇所24cとの密着性を高めることができ、ひいては成形型2の水平方向の温度バランスをより高めることができる。なお、可動床44c〜46cは上述の形態に限定されず、例えばヤング率が高く弾性変形し難い材料(SiC等のセラミック等)を板状又は棒状に複数成形し、これらを互いに可動になるように隣接させて可動床44c〜46cを形成してもよい。   As the material and shape of the movable floors 44c to 46c of the conveying means 4c, it is preferable to use a material and shape having heat resistance and heat conductivity and elastic deformation. More specifically, for example, a molded product formed into a film or sheet shape made of a material having a low Young's modulus and a high yield stress (metal such as SUS) can be used. As a result, the movable floors 44c to 46c are elastically deformed according to the shape of the conveying means 4c, so that a flat heating surface 62 is formed. Therefore, the adhesion between the heating surface 62 and the contacted portion 24c of the mold 2 can be increased, and as a result, the temperature balance in the horizontal direction of the mold 2 can be further increased. The movable floors 44c to 46c are not limited to the above-described form. For example, a plurality of materials (such as ceramics such as SiC) that have a high Young's modulus and are difficult to elastically deform are formed into a plate shape or a rod shape so that they can move relative to each other. The movable floors 44c to 46c may be formed adjacent to each other.

〔温度調節手段〕
搬送手段4cの温度調節手段49cは、熱源6の出力調整手段61を用いる。ここで、出力調整手段61は、ガラスGのプレス成形に影響が及ばない範囲で熱源6の出力を調節する。
[Temperature control means]
The temperature adjusting means 49c of the conveying means 4c uses the output adjusting means 61 of the heat source 6. Here, the output adjusting means 61 adjusts the output of the heat source 6 within a range that does not affect the press forming of the glass G.

<第3実施形態>
本発明の第3実施形態は、成形型2とその搬送手段4dとの接触部43dの温度を検出する検出手段5と、成形型2を加熱する熱源6と独立して設けられる加温手段48dを用いて接触部43dの温度を調節する温度調節手段49dと、を備える光学素子製造装置1dを用いた光学素子の製造方法である。図6は、光学素子の製造方法の好ましい一例を示す図である。
<Third Embodiment>
In the third embodiment of the present invention, the detecting means 5 for detecting the temperature of the contact portion 43d between the mold 2 and its conveying means 4d and the heating means 48d provided independently of the heat source 6 for heating the mold 2 are provided. And a temperature adjusting means 49d for adjusting the temperature of the contact portion 43d using the optical element manufacturing apparatus 1d. FIG. 6 is a diagram illustrating a preferred example of a method for manufacturing an optical element.

〔温度調節手段〕
温度調節手段49dは、接触部43dを加温する加温手段48dの出力を調整する。ここで、加温手段48dは、成形型2を加温する熱源6と独立して設けられる。これにより、成形型2を加温する加熱面62と独立した温度の制御が可能になるため、接触部43dと成形型2との温度差をより縮めることができ、成形型2の水平方向の温度バランスをより高めることができる。
[Temperature control means]
The temperature adjusting means 49d adjusts the output of the heating means 48d that heats the contact portion 43d. Here, the heating means 48d is provided independently of the heat source 6 for heating the mold 2. As a result, the temperature independent of the heating surface 62 for heating the mold 2 can be controlled, so that the temperature difference between the contact portion 43d and the mold 2 can be further reduced, and the horizontal direction of the mold 2 can be reduced. The temperature balance can be further increased.

このとき、図6に示すように、搬送手段4dと加熱面62とを常時離隔させてもよいが、これらを必要に応じて接触させてもよい。特に、搬送手段4dと加熱面62とを常時離隔させることにより、温度調節手段49dによって調整される加温手段48dの出力の大きさが、接触部43dの温度にそのまま反映されるため、接触部43dの温度の制御機構を単純化することができる。一方で、接触部43dと加熱面62とを必要に応じて接触させることにより、加温手段48dと加熱面62との双方によって接触部43dが加温されるため、接触部43dの昇温に必要となる熱量を低減できる。   At this time, as shown in FIG. 6, the conveying means 4d and the heating surface 62 may be always separated from each other, but they may be brought into contact as necessary. In particular, by always separating the conveying means 4d and the heating surface 62, the magnitude of the output of the heating means 48d adjusted by the temperature adjusting means 49d is directly reflected in the temperature of the contact part 43d. The temperature control mechanism of 43d can be simplified. On the other hand, since the contact part 43d is heated by both the heating means 48d and the heating surface 62 by bringing the contact part 43d and the heating surface 62 into contact as necessary, the temperature of the contact part 43d is increased. The amount of heat required can be reduced.

以下、実施例を用いて本発明を更に詳細に説明するが、本発明は以下の実施例に限定されるものではない。   EXAMPLES Hereinafter, although this invention is demonstrated further in detail using an Example, this invention is not limited to a following example.

光学素子製造装置は、原料ガラスを成形型の下側から誘導コイルで昇温する熱源と、原料ガラスをプレスする押圧手段と、をチャンバの内部に備えるように構成し、昇温ステージ、押圧ステージ、及び降温ステージを順に備えるようにした。このとき、光学素子製造装置のチャンバは、シャッターで必要に応じて遮断及び開放できるようにして、成形型の出し入れを容易にした。   The optical element manufacturing apparatus comprises a heat source for raising the temperature of the raw material glass from the lower side of the mold with an induction coil, and a pressing means for pressing the raw material glass. , And a temperature lowering stage were sequentially provided. At this time, the chamber of the optical element manufacturing apparatus can be shut off and opened as necessary with a shutter to facilitate the insertion and removal of the mold.

ここで、光学素子製造装置には、図2に示す形状の部材を搬送手段として用いた。すなわち、搬送手段として、光学素子製造装置で成形型を昇温する加熱面に平行に設けられた平面からなる伝熱部と、この加熱面に垂直に設けられ且つ成形型の搬送方向に対して垂直に設けられた平面からなる接触部と、を有するSUS(熱伝導率:約15〜20W/mK)からなる部材を用いた。ここで、温度調節手段の面積は25mmとした。 Here, in the optical element manufacturing apparatus, a member having the shape shown in FIG. 2 was used as the conveying means. That is, as a conveying means, a heat transfer section consisting of a plane provided in parallel with a heating surface for raising the temperature of the mold in the optical element manufacturing apparatus, and a direction perpendicular to the heating surface and the conveying direction of the mold A member made of SUS (thermal conductivity: about 15 to 20 W / mK) having a contact portion made of a plane provided vertically was used. Here, the area of the temperature adjusting means was 25 mm 2 .

プレス成形用の成形型として、各々直径15mm、高さ10mmであり、WCからなる直円柱形状の上型及び下型を用いた。これら上型及び下型には、互いに対向するように、直径20mm、深さ2mmの球面からなる成形面を各々設けた。そして、これら上型及び下型に隣接し且つこれらを取り囲むように、外径21mm、内径15mm、高さ21mmの直円筒形状の胴型を設けた。   As the molds for press molding, an upper mold and a lower mold each having a diameter of 15 mm and a height of 10 mm and made of WC were used. The upper mold and the lower mold were each provided with a molding surface composed of a spherical surface having a diameter of 20 mm and a depth of 2 mm so as to face each other. Then, a cylindrical body having a right cylindrical shape having an outer diameter of 21 mm, an inner diameter of 15 mm, and a height of 21 mm was provided so as to be adjacent to and surround the upper mold and the lower mold.

ここで、成形型を光学素子製造装置の所定の位置に供給し、保持具を用いて上型を持ち上げて原料ガラス(ガラス転移点:566℃)を成形型の下型に供給し、上型を下型の上に載せ、上型及び下型を成形型に組み立てた。   Here, the mold is supplied to a predetermined position of the optical element manufacturing apparatus, the upper mold is lifted using a holder, and the raw glass (glass transition point: 566 ° C.) is supplied to the lower mold of the mold. Was placed on the lower mold, and the upper mold and the lower mold were assembled into a mold.

組み立てられた成形型を、光学素子製造装置のチャンバの内部に供給した。光学素子製造装置に供給された成形型は、搬送手段の駆動手段を駆動させて、昇温ステージ、押圧ステージ及び降温ステージを順に移動及び停止させた。このうち昇温ステージでは、成形型のうちガラスが載置された高さ位置における部分の温度が620℃のプレス成形温度になるように成形型を昇温し、原料ガラスを軟化した。そして、成形型が押圧ステージの所定位置に移動したところで成形型の移動を停止させ、押圧手段を用いて上型を降ろしてガラスを押圧し、ガラスをプレス成形した。プレス成形の後、押圧手段を成形型から離隔させて成形型を更に移動させ、降温ステージ上を順次移動させながら、成形型を徐々に降温させた。降温ステージで降温された成形型は、搬送手段を用いてチャンバの外部に移動した。   The assembled mold was supplied into the chamber of the optical element manufacturing apparatus. The mold supplied to the optical element manufacturing apparatus drives the driving means of the conveying means, and sequentially moves and stops the temperature raising stage, the pressing stage, and the temperature lowering stage. Of these, in the temperature raising stage, the temperature of the part at the height position where the glass was placed in the mold was raised to a press molding temperature of 620 ° C., and the raw glass was softened. Then, when the molding die moved to a predetermined position of the pressing stage, the movement of the molding die was stopped, the upper die was lowered using the pressing means, the glass was pressed, and the glass was press-molded. After press molding, the pressing means was separated from the mold, the mold was further moved, and the mold was gradually cooled while being moved on the temperature lowering stage sequentially. The molding die cooled at the temperature lowering stage moved to the outside of the chamber using the conveying means.

成形型がチャンバの内部に供給されてからチャンバの外部に移動されるまでの間、搬送手段の接触部が成形型の側面に接触されるようにした。また、検出手段として放射温度計(型番:IR−AhS、株式会社チノー製)を用い、成形型がチャンバの内部にある間における、成形型の被接触箇所の温度と搬送手段の接触部の温度を測定した。それらの測定結果に基づき、接触部の温度が被接触箇所の温度より20℃以上低いときは、温度調節手段を加熱面に接触させるようにした。また、接触部の温度が被接触箇所の温度より20℃以上高いときは、搬送手段の伝熱部を加熱面から離隔するようにした。   The contact portion of the conveying means is brought into contact with the side surface of the mold from when the mold is supplied to the inside of the chamber until it is moved to the outside of the chamber. Further, a radiation thermometer (model number: IR-AhS, manufactured by Chino Co., Ltd.) is used as the detection means, and the temperature of the contacted portion of the mold and the temperature of the contact portion of the conveying means while the mold is inside the chamber. Was measured. Based on the measurement results, when the temperature of the contact portion is 20 ° C. or more lower than the temperature of the contacted portion, the temperature adjusting means is brought into contact with the heating surface. Moreover, when the temperature of the contact portion was 20 ° C. or more higher than the temperature of the contacted portion, the heat transfer portion of the conveying means was separated from the heating surface.

降温ステージで降温された成形型は、搬送手段を用いてチャンバの外部に移動し、上型及び下型に分解して光学素子を取り出した。得られた光学素子について、100倍の光学顕微鏡(型番:LV−150、株式会社ニコン製)を用いて、光学素子の割れ、偏析及び曇りの状態を確認するとともに、光学素子の厚さの分布をデジマチックキャリパ(型番:CD−15CSX、株式会社ミツトヨ製)で測定した。   The molding die lowered in temperature at the temperature lowering stage was moved to the outside of the chamber using the conveying means, and was disassembled into an upper die and a lower die, and the optical element was taken out. About the obtained optical element, while using a 100 times optical microscope (model number: LV-150, Nikon Co., Ltd.), the state of cracking, segregation and cloudiness of the optical element is confirmed, and the thickness distribution of the optical element Was measured with a Digimatic caliper (model number: CD-15CSX, manufactured by Mitutoyo Corporation).

比較例として、搬送手段を昇温ステージ、押圧ステージ、及び降温ステージの加熱面から浮上させて、搬送手段の接触部を昇温しない場合についても、実施例と同様の試験を行った。また、接触部の温度を被接触箇所の温度より25℃〜30℃低い状態で維持した場合についても、実施例と同様の試験を行った。   As a comparative example, the same test as in the example was performed even when the conveying unit was lifted from the heating surface of the temperature raising stage, the pressing stage, and the temperature lowering stage and the temperature of the contact portion of the conveying unit was not increased. Moreover, the test similar to an Example was done also about the case where the temperature of a contact part is maintained in the state 25-25 degreeC lower than the temperature of a to-be-contacted location.

その結果、光学素子製造装置の搬送手段の接触部を加温しなかった場合は、形成される光学素子に割れ、偏析又は曇りが生じたもの、及び光学素子の形状が所定の形状にならなかったもの(成形不良品)が約5%の割合で発生したが、光学素子製造装置の搬送手段の接触部を加温した場合は、光学素子に割れ、偏析又は曇りが生じたもの、及び光学素子の成形不良品が約1%に低減された。一方で、接触部の温度を被接触箇所の温度より25℃〜30℃低い状態で維持した場合は、光学素子に割れ、偏析又は曇りが生じたもの、及び光学素子の成形不良品が約5%であった。実施例と比較例で作製される光学素子について比較すると、搬送手段の接触部を加温することで、光学素子に割れ、偏析及び曇りが生じ難く、寸法の再現性の高められた光学素子をより高確率に形成できることがわかる。   As a result, when the contact part of the conveying means of the optical element manufacturing apparatus is not heated, the formed optical element is cracked, segregated or clouded, and the shape of the optical element does not become a predetermined shape. (Formation defective product) occurred at a rate of about 5%, but when the contact part of the conveying means of the optical element manufacturing apparatus was heated, the optical element was cracked, segregated or clouded, and optical The defective molding of the element was reduced to about 1%. On the other hand, when the temperature of the contact portion is maintained at a temperature lower by 25 ° C. to 30 ° C. than the temperature of the contacted portion, the optical element is cracked, segregated, or cloudy, and the optical element has a molding defect of about 5 %Met. Comparing optical elements produced in Examples and Comparative Examples, by heating the contact portion of the conveying means, it is difficult to cause cracking, segregation and fogging in the optical element, and an optical element with improved dimensional reproducibility is obtained. It can be seen that it can be formed with higher probability.

G ガラス
L 光学素子
T 搬送方向
1a〜1d 光学素子製造装置
10 チャンバ
11 昇温ステージ
12 押圧ステージ
13 降温ステージ
2 成形型
21 上型
22 胴型
23 下型
24a〜24d 被接触箇所
26、27 成形面
4a〜4d 搬送手段
41a、41b、41d 動力伝達手段
42a〜42d 伝熱部
43a〜43d 接触部
44c 第1接触部
45c 第2接触部
46c 第3接触部
47c 駆動部
48d 加温手段
49c、49d 温度調整手段
5 検出手段
6 熱源
61 出力調整手段
62 加熱面
7 押圧手段
G Glass L Optical element T Transport direction 1a to 1d Optical element manufacturing apparatus 10 Chamber 11 Temperature rising stage 12 Pressing stage 13 Temperature decreasing stage 2 Mold 21 Upper mold 22 Body mold 23 Lower mold 24a to 24d Contacted portions 26 and 27 Molding surface 4a-4d Conveying means 41a, 41b, 41d Power transmission means 42a-42d Heat transfer parts 43a-43d Contact part 44c First contact part 45c Second contact part 46c Third contact part 47c Driving part 48d Heating means 49c, 49d Temperature Adjustment means 5 Detection means 6 Heat source
61 Output adjustment means 62 Heating surface 7 Press means

Claims (12)

ガラスをプレスして光学素子を製造する製造方法であって、
上型及び下型を有する成形型を、昇温ステージ、押圧ステージ、及び降温ステージの各々と順次移動及び停止させて、前記成形型内のガラスを昇温、押圧、及び降温する工程を有し、
前記移動及び停止は、前記成形型のうち被接触箇所との温度差を20℃以内に維持した接触部で前記成形型に接触しつつ、前記接触部を動かすことで行う製造方法。
A manufacturing method for manufacturing an optical element by pressing glass,
A step of sequentially moving and stopping the mold having the upper mold and the lower mold with each of the temperature raising stage, the pressing stage, and the temperature lowering stage to raise, press and lower the temperature of the glass in the mold; ,
The said movement and a stop are the manufacturing methods performed by moving the said contact part, contacting the said shaping | molding die in the contact part which maintained the temperature difference with a to-be-contacted place within 20 degreeC among the said shaping | molding die.
前記接触部を、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージの各々と熱伝導可能に接続することで加温する請求項1記載の製造方法。   The manufacturing method of Claim 1 which heats the said contact part by connecting with each of the said temperature rising stage, the said press stage, and the said temperature fall stage so that heat conduction is possible. 前記接触部と前記成形型との接触状態を、前記移動及び停止の間、持続する請求項1又は2記載の製造方法。   The manufacturing method of Claim 1 or 2 with which the contact state of the said contact part and the said shaping | molding die is maintained during the said movement and a stop. 前記接触部として前記移動の方向に可動である可動床を用い、この可動床上に前記成形型を載置した状態で前記移動及び停止を行う請求項3記載の製造方法。   The manufacturing method according to claim 3, wherein a movable floor movable in the direction of movement is used as the contact portion, and the movement and stop are performed in a state where the mold is placed on the movable floor. 前記接触部を、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージとは異なる加温手段によって加温する請求項1記載の製造方法。   The manufacturing method according to claim 1, wherein the contact portion is heated by a heating means different from the temperature raising stage, the pressing stage, and the temperature lowering stage. 請求項1から5いずれか記載の製造方法で製造される光学素子を用いる光学機器の製造方法。   The manufacturing method of the optical instrument using the optical element manufactured with the manufacturing method in any one of Claim 1 to 5. ガラスをプレスして光学素子を製造する製造装置であって、
上型及び下型を有する成形型を昇温する昇温ステージ、押圧する押圧ステージ、及び降温する降温ステージを有するチャンバと、
前記成形型を前記昇温ステージ、前記押圧ステージ、及び前記降温ステージへの各々と順次移動及び停止させる搬送手段と、を備え、
前記搬送手段は、前記成形型に接触する接触部と、この接触部を動かす駆動部と、を有し、
前記製造装置は、前記接触部に接触される前記成形型の被接触箇所の温度を検出する検出手段と、この検出手段の検出結果に基づいて前記接触部の温度を調節する温度調節手段と、を更に備える製造装置。
A manufacturing apparatus for manufacturing an optical element by pressing glass,
A temperature raising stage for raising the temperature of a mold having an upper mold and a lower mold, a pressing stage for pressing, and a chamber having a temperature lowering stage for lowering temperature;
Conveying means for sequentially moving and stopping the molding die to each of the temperature raising stage, the pressing stage, and the temperature lowering stage, and
The transport means has a contact portion that contacts the mold, and a drive unit that moves the contact portion,
The manufacturing apparatus includes a detection unit that detects a temperature of a contacted portion of the mold that is in contact with the contact unit, a temperature adjustment unit that adjusts the temperature of the contact unit based on a detection result of the detection unit, A manufacturing apparatus further comprising:
前記接触部は、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージの各々と熱伝導可能に接続され、これにより加温されている請求項7記載の製造装置。   The manufacturing apparatus according to claim 7, wherein the contact portion is connected to each of the temperature raising stage, the pressing stage, and the temperature lowering stage so as to be able to conduct heat and thereby heated. 前記接触部は、前記移動及び停止の間、前記成形型との接触状態を持続する請求項7又は8記載の製造装置。   The manufacturing apparatus according to claim 7, wherein the contact portion maintains a contact state with the mold during the movement and stop. 前記接触部は、前記成形型が載置され且つ前記移動の方向に可動である可動床を有する請求項9記載の製造装置。   The manufacturing apparatus according to claim 9, wherein the contact portion includes a movable floor on which the mold is placed and movable in the direction of movement. 前記接触部を加温し、前記昇温ステージ、前記押圧ステージ、及び前記降温ステージとは異なる加温手段を更に備える請求項7記載の製造装置。   The manufacturing apparatus according to claim 7, further comprising heating means for heating the contact portion and different from the temperature raising stage, the pressing stage, and the temperature lowering stage. 請求項7から11いずれか記載の製造装置と、この製造装置で製造される光学素子から光学機器を製造する製造装置と、を備える光学機器製造システム。   An optical apparatus manufacturing system comprising: the manufacturing apparatus according to claim 7; and a manufacturing apparatus that manufactures an optical apparatus from an optical element manufactured by the manufacturing apparatus.
JP2009237016A 2009-10-14 2009-10-14 Method and apparatus for manufacturing optical element Pending JP2011084418A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021147292A (en) * 2020-03-23 2021-09-27 芝浦機械株式会社 Glass molding machine, mold transportation positioning method and carrier device of carrying object

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021147292A (en) * 2020-03-23 2021-09-27 芝浦機械株式会社 Glass molding machine, mold transportation positioning method and carrier device of carrying object
JP7309645B2 (en) 2020-03-23 2023-07-18 芝浦機械株式会社 Glass forming machine and conveying device for conveyed object

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