JP2011082344A - Method for locking electronic component and electronic apparatus - Google Patents

Abstract

An object of the present invention is to prevent stress from being applied to a soldering portion of an insertion mounting type semiconductor element without applying a rotational force of a fastening member to the insertion mounting type semiconductor element mounted on a printed wiring board.
A plurality of insertion mounting type semiconductor elements 20 are mounted on a printed wiring board 10 by soldering, and the plurality of semiconductor elements 20 are fastened to a metal case 30 by screwing fastening members 71 passing through fastening through holes. Has been. The anti-rotation plate 50 is interposed between the main body 21 of each semiconductor element 20 and the head 71 a of the fastening member 71, extends along the arrangement position of each semiconductor element 20, and the fastening through hole of each semiconductor element 20 And the fastening member 71 passes through the through hole. The detent plate 50 is supported by the set pins 60 and 61 so as not to rotate in the rotation direction of the fastening member 71.
[Selection] Figure 1

Description

  The present invention relates to an electronic component fixing method and an electronic apparatus.

  In an electronic device in which an insertion mounting type semiconductor element is mounted on a printed wiring board by soldering and the insertion mounting type semiconductor element is thermally coupled to a heat radiating member, the following method is adopted for fixing the insertion mounting type semiconductor element. It has been.

  As a first method, after the insertion mounting type semiconductor element mounted on the printed wiring board is fastened to the heat radiating member with a screw, the soldered portion is remelted to eliminate the stress (residual stress) of the soldered portion. This method was used when lead was contained in the solder. However, since lead-free solder is used from the viewpoint of the environment, the remelting temperature becomes high and this method cannot be used.

  As a second method, an insertion mounting type semiconductor element mounted on a printed wiring board is fixed to a heat dissipation member by a leaf spring. For example, in Patent Document 1, a fixing plate for fixing six switching elements arranged in a row on a printed board to a heat sink is provided, and the fixing plate is a single metal plate. It is made by molding. In addition, the fixed plate has a base portion that is elongated in the direction in which the switching element is disposed, and extends to one side of the base portion so as to be spaced apart from each other, and is connected to the base portion via the connecting portion. It has an element pressing part. This element pressing part has a lateral width that holds two switching elements as a set in the longitudinal direction of the base part, and a screw through hole that clamps the switching element at the center in the width direction and fastens to the heat sink is formed Has been. On the other hand, the connecting portion is formed to have a narrower width than the element pressing portion so that the element pressing portion can be tilted with respect to the heat radiating plate when the element pressing portion is fastened to the heat sink with the switching element interposed therebetween. Yes. Thereby, even when there are variations in thickness among the six switching elements, the single fixing plate can securely contact the heat sink.

  In this second method, a mounting space for fixing the leaf spring itself is required. In particular, when a large number of insertion-mounting semiconductor elements are arranged side by side, it is not possible to hold each insertion-mounting semiconductor element with a single leaf spring, and a plurality of leaf springs must be used. Is required.

  As a third method, after fixing the insertion mounted semiconductor element to a heat dissipation member (metal case or the like), a through hole of a printed wiring board is inserted into a terminal of the insertion mounted semiconductor element and soldered by a robot. In the third method, the cost is high and the reliability of the robot itself is not established.

JP 2004-289076 A

  In the case where the insertion mounting type semiconductor element is screwed to the heat dissipation member and thermally coupled, the insertion mounting type semiconductor element is mounted on the printed wiring board, and then the fastening member (metal case, heat sink, etc.) When fixing with screws or bolts, the rotational force of the fastening member (screw, etc.) is applied to the insertion mounting type semiconductor element due to friction between the head of the fastening member (head of the screw, etc.) and the insertion mounting type semiconductor element. . As a result, the insertion mounting type semiconductor element is pre-soldered to the printed wiring board, so if a force in the rotational direction is applied, stress is applied to the soldered portion, which may cause a market failure or deterioration over time. There is.

  The present invention has been made under such a background, and an object of the present invention is to provide an insertion mounting type semiconductor element without applying a rotational force of a fastening member to the insertion mounting type semiconductor element mounted on a printed wiring board. The purpose is to prevent the soldering part from being stressed.

  According to the first aspect of the present invention, a first step of mounting an insertion mounting type semiconductor element having terminals extended from a main body having a fastening through hole on a printed wiring board by soldering; and the insertion mounting type A second step of disposing a non-rotating plate member having a through-hole corresponding to the fastening through-hole of the insertion mounting type semiconductor element with respect to the main body portion of the semiconductor element in a non-rotatable state in the rotation direction of the fastening member; And a third step of fastening the insertion-mounting semiconductor element by screwing a fastening member that passes through the through-hole of the detent plate member and the fastening through-hole of the insertion-mounting semiconductor element. To do.

  According to the first aspect of the present invention, in the first step, the insertion mounting type semiconductor element in which the terminal is extended from the main body portion having the fastening through hole is mounted on the printed wiring board by soldering. In the second step, the anti-rotation plate having a through hole corresponding to the fastening through hole of the insertion mounting type semiconductor element is not rotatable in the rotation direction of the fastening member with respect to the main body of the insertion mounting type semiconductor element. Be placed. In the third step, the insertion mounting type semiconductor element is fastened by screwing a fastening member that passes through the through hole of the rotation preventing plate member and the fastening through hole of the insertion mounting type semiconductor element.

  When the insertion mounting type semiconductor element is fastened by the fastening member in the third step, the rotational force of the fastening member is not applied to the insertion mounting type semiconductor element by the non-rotating plate material that cannot rotate in the rotation direction of the fastening member. It is possible to prevent stress from being applied to the soldered portion of the type semiconductor element.

  In the invention according to claim 2, the insertion mounting type semiconductor element in which the terminal is extended from the main body portion having the fastening through hole is mounted on the printed wiring board by soldering, and the insertion mounting type semiconductor element is In an electronic device fastened by screwing a fastening member passing through the fastening through-hole, the electronic device is interposed between a body portion of the insertion mounting type semiconductor element and a head of the fastening member, and fastens the insertion mounting type semiconductor element. A through hole for fastening corresponding to the through hole for fastening, and the anti-rotation plate member through which the fastening member passes through the fastening through hole, and the anti-rotation plate member cannot be rotated in the rotation direction of the fastening member at least at one place And a support member for supporting the above.

  According to the second aspect of the present invention, the insertion mounting type semiconductor element is mounted on the printed wiring board by soldering, and the insertion mounting type semiconductor element mounted on the printed wiring board is connected to the fastening member passing through the fastening through hole. Fastened by screwing.

  On the other hand, the detent plate member is interposed between the body portion of the insertion mounting type semiconductor element and the head of the fastening member, and has a fastening through hole corresponding to the fastening through hole of the insertion mounting type semiconductor element. The fastening member passes through the fastening through hole. The rotation preventing plate is supported by the support member so as not to rotate in the rotation direction of the fastening member at least at one place. When the insertion mounting type semiconductor element is fastened by the fastening member, the rotation force of the fastening member is not applied to the insertion mounting type semiconductor element by the non-rotating plate material supported non-rotatably in the rotation direction of the fastening member. It is possible to prevent stress from being applied to the soldered portion of the semiconductor element.

According to a third aspect of the present invention, in the electronic device according to the second aspect, the detent plate material may be made of a resin sheet.
According to a fourth aspect of the present invention, in the electronic device according to the second or third aspect, a support through hole is formed in the anti-rotation plate, and the support through hole is inserted into the support member. Thus, when the anti-rotation plate is supported so as not to rotate in the rotation direction of the fastening member, the anti-rotation plate can be easily obtained by inserting the support through hole formed in the anti-rotation plate into the support member. The fastening member can be supported in a non-rotatable direction.

  According to a fifth aspect of the present invention, in the electronic device according to the fourth aspect, a plurality of the support through holes are formed in the anti-rotation plate, and at least one of the plurality of support through holes is a long hole. It is good to be.

  According to the present invention, it is possible to prevent stress from being applied to the soldered portion of the insertion mounted semiconductor element without applying a rotational force of the fastening member to the insertion mounted semiconductor element mounted on the printed wiring board.

(A) is a partial top view of the electronic device in this embodiment, (b) is a longitudinal cross-sectional view in the AA line of (a). (A) is a longitudinal cross-sectional view in the BB line of Fig.1 (a), (b) is a longitudinal cross-sectional view in the CC line of Fig.1 (a). 1 is a partial perspective view of an electronic device according to an embodiment. 1 is a partially exploded perspective view of an electronic device according to an embodiment. (A) is a top view of the board material for rotation prevention in this embodiment, (b) is a front view of the board material for rotation prevention in this embodiment. The front view for demonstrating the assembly process of the electronic device in this embodiment. (A), (b) is a longitudinal cross-sectional view for demonstrating the assembly process of the electronic device in this embodiment. (A), (b) is a longitudinal cross-sectional view for demonstrating the assembly process of the electronic device in this embodiment. (A) is a top view of the board material for rotation prevention of another example, (b) is a front view of the board material for rotation prevention of another example. (A) is a top view of the plate material for rotation prevention of another example, (b) is a front view of the plate material for rotation stop of another example.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
As shown in FIGS. 1 to 4, the electronic device 1 includes a printed wiring board 10, a plurality of insertion-mounting semiconductor elements (packages) 20, a metal case 30 as a heat dissipation member, an insulating sheet 40, A stop plate member 50, stop pins 60 and 61 as support members, a plurality of fastening members 70, and a plurality of fastening members 71 are provided. In the present embodiment, the fastening members 70 and 71 are screws.

  The electronic device 1 according to the present embodiment is used for a switching power supply device mounted on a plug-in hybrid vehicle, and specifically, a device (inverter, converter) for charging an in-vehicle battery with a home AC power source. ). This device includes a plurality of semiconductor switching elements, and the semiconductor switching elements constitute an arm (upper arm, lower arm) and the like. Specifically, an IGBT or a power MOSFET is used as the semiconductor switching element. The insertion mounting type semiconductor element 20 constituting the semiconductor switching element generates heat by driving. This heat is released from the metal case 30.

  The metal case 30 is made of aluminum, and the metal case 30 has a box shape with an open top surface. That is, in the metal case 30, the bottom plate portion 31 has a quadrangular shape, and the rectangular frame portion 32 stands on the outer peripheral portion of the bottom plate portion 31. The printed wiring board 10, the insertion mounting type semiconductor element 20, etc. are accommodated in the metal case 30.

  The printed wiring board 10 has a conductive wiring pattern formed on the surface of an insulating substrate. Further, as shown in FIG. 4, a plurality of through holes 11 for attachment are formed in the printed wiring board 10. Further, a plurality of through holes 12 are formed in the printed wiring board 10.

  The insertion mounting type semiconductor element 20 is composed of a main body 21 and three leads 22 as terminals. The main body 21 contains a semiconductor chip (not shown). Specifically, the semiconductor chip is mounted on one of the three lead frames, and the three lead frames and the semiconductor chip are electrically connected using bonding wires, etc. Molded. The leading ends of these three lead frames are exposed from the mold resin (main body portion 21), and constitute three leads 22 extending from the main body portion 21. The three leads 22 extending from the main body 21 are bent in an L shape.

  The lead frame is not covered with the mold resin on the back surface (lower surface in FIG. 2) of the main body portion 21 of the insertion mounting type semiconductor element 20. Further, the main body 21 of the insertion mounting type semiconductor element 20 has a fastening through hole 23 through which a fastening member passes.

  A plurality of insertion mounting type semiconductor elements 20 are mounted on the printed wiring board 10 by soldering. Specifically, the lead 22 of the insertion-mounting semiconductor element 20 is inserted into the through hole 12 of the printed wiring board 10 and is joined (soldered) by soldering. In this embodiment, only three insertion-mounting semiconductor elements 20 are shown for convenience of explanation, but 13 are arranged along the end of the printed wiring board 10.

  In addition to the insertion mounting type semiconductor element 20, various electronic components (not shown) such as surface mounting components are mounted on the printed wiring board 10. These various electronic components are arranged on both surfaces of the printed wiring board 10.

  A plurality of printed wiring board fixing protrusions 33 are erected on the bottom plate portion 31 of the metal case 30, and screw holes 33 a are formed on the upper end surface of the printed wiring board fixing protrusions 33. The printed wiring board 10 is mounted on the upper end surface of the printed wiring board fixing protrusion 33, and the fastening member (screw) 70 is passed through the mounting through hole 11 of the printed wiring board 10 and the printed wiring board fixing protrusion 33 of the metal case 30. The printed wiring board 10 is fixed to the metal case 30 by being screwed into the screw holes 33a.

  Further, a pedestal portion 34 for placing the insertion mounting type semiconductor element 20 is projected from an end portion of the bottom plate portion 31 of the metal case 30. A plurality of screw holes 34 a are formed on the upper surface of the pedestal portion 34. A plurality of insertion mounting type semiconductor elements 20 mounted on the printed wiring board 10 are arranged on the pedestal portion 34 of the metal case 30. The fastening member (screw) 71 passing through the fastening through hole 23 of the insertion mounting type semiconductor element 20 is screwed into the screw hole 34a of the pedestal portion 34 of the metal case 30, whereby the plurality of insertion mounting type semiconductor elements 20 are made of metal. Fastened to the case 30. As a result, the plurality of insertion-mounting semiconductor elements 20 are thermally coupled to the metal case 30, and the insertion-mounting semiconductor elements 20 generate heat as the insertion-mounting semiconductor elements 20 are driven (energized). Heat is transmitted from the main body portion 21 of the insertion mounting type semiconductor element 20 to the metal case 30 and radiated from the metal case 30.

  A rectangular insulating sheet 40 is interposed between the main body portion 21 of each insertion mounting type semiconductor element 20 and the pedestal portion 34 of the metal case 30. At this time, the fastening member 71 passes through the through hole 41 (see FIG. 4) of the insulating sheet 40.

  Protrusions 35 and 36 are erected on both sides of the pedestal 34 in the bottom plate 31 of the metal case 30. A stop pin 60 as a support member is erected on the upper surface of the protrusion 35. Similarly, a stop pin 61 as a support member is erected on the upper surface of the protrusion 36. The stop pins 60 and 61 are cylindrical.

  As shown in FIG. 5, the detent plate member 50 is made of a rectangular resin sheet. The anti-rotation plate 50 is interposed between the main body 21 of each insertion mounting type semiconductor element 20 and the head 71 a of the fastening member 71. The anti-rotation plate member 50 extends in the Y direction in FIG. 1A along the arrangement position of each insertion mounting type semiconductor element 20, and the fastening through hole corresponding to the fastening through hole 23 of each insertion mounting type semiconductor element 20. A fastening member 71 passes through the fastening through-hole 51.

  A support through-hole 52 is formed at one end of the rectangular anti-rotation plate 50, and a support through-hole 53 is formed at the other end of the anti-rotation plate 50. The supporting through hole 52 has a circular shape and is slightly larger in diameter than the diameter of the retaining pin 60. The supporting through hole 53 is a long hole extending in the Y direction along the position where each insertion mounting type semiconductor element 20 is arranged, and its width is slightly larger than the diameter of the stop pin 61. A support through hole 52 for the rotation stop plate 50 is inserted into the stop pin 60, and a support through hole 53 for the rotation stop plate 50 is inserted into the stop pin 61. As a result, the anti-rotation plate 50 is supported so as not to rotate in the rotation direction X of the fastening member 71 (see FIG. 1A). In this way, the detent plate 50 is supported by the set pins 60 and 61 so as not to rotate in the rotation direction X of the fastening member 70 at two locations.

  Further, the stop pin 60 is engaged with the support through hole 52 and the stop pin 61 is inserted into the support through hole 53, but the support through hole 53 is a long hole extending in the Y direction. , And can be deformed in the Y direction. Since the anti-rotation plate 50 is made of a resin sheet, it can be deformed in the thickness direction Z (see FIG. 1B) of the main body 21 of the insertion mounting type semiconductor element 20 which is a direction other than the rotation direction of the fastening member 71. It is.

Next, an assembling method of the electronic device 1 will be described focusing on a fixing method of the insertion mounting type semiconductor element 20.
FIGS. 6, 7A, 7B, 8A, and 8B are used to describe the method for assembling the electronic apparatus 1. FIG. Here, FIG. 6, FIG. 7 (a) and FIG. 8 (a) are equivalent to the cross section in the BB line of FIG. 1 (a), FIG.7 (b) and FIG.8 (b) are figures. This corresponds to a cross section taken along line CC of 1 (a).

  First, as shown in FIG. 6, a plurality of insertion mounting type semiconductor elements 20 are mounted on the printed wiring board 10 by flow soldering. Specifically, the leading end side of the lead 22 of the insertion mounting type semiconductor element 20 is inserted into the through-hole 12 of the printed wiring board 10 from the upper surface side of the printed wiring board 10, and in this state, the flow solder is applied from the lower surface side of the printed wiring board 10. Then, the insertion mounting type semiconductor element 20 is mounted on the printed wiring board 10.

  Then, as shown in FIG. 7, the insertion mounting type semiconductor element 20 and the printed wiring board 10 are arranged in the metal case 30 in a state where the insulating sheet 40 is arranged on the lower surface of the main body portion 21 of the insertion mounting type semiconductor element 20. . At this time, the printed wiring board 10 is placed on the printed wiring board fixing protrusion 33 of the metal case 30, and the main body portion 21 of the insertion mounting type semiconductor element 20 is placed on the pedestal portion 34. Further, the fastening member 70 is screwed into the screw hole 33a of the printed wiring board fixing protrusion 33 of the metal case 30 through the mounting through hole 11 of the printed wiring board 10 from above the printed wiring board 10 to attach the printed wiring board 10 to the printed wiring board 10. Fix to the metal case 30.

  Subsequently, as shown in FIG. 8, a detent plate member 50 is disposed on the upper surface of the main body 21 of the insertion mounting type semiconductor element 20. At this time, the through hole 52 of the detent plate member 50 is inserted into the set pin 60 of the metal case 30, and the through hole 53 of the detent plate member 50 is inserted into the set pin 61 of the metal case 30. As a result, the anti-rotation plate 50 is disposed in a state in which it cannot rotate in the rotation direction X of the fastening member 70.

  In this way, both ends of the rotation-preventing plate member 50 are stopped by the stop pins (positioning pins) 60 and 61 so as not to move in the rotation direction X of the fastening member 71. At this time, both ends of the anti-rotation plate 50 are fixed points.

  Then, the fastening member 71 is passed from above the anti-rotation plate 50 through the fastening through hole 51 of the anti-rotation plate 50, the fastening through hole 23 of the insertion mounting type semiconductor element 20, and the through hole 41 of the insulating sheet 40. The insertion mounting type semiconductor elements 20 are fastened to the metal case 30 by screwing into the screw holes 34 a of the pedestal portion 34. At this time, the rotation force of the fastening member 71 is not applied to the insertion mounting type semiconductor element 20 by the anti-rotation plate member 50 supported so as not to rotate in the rotation direction X of the fastening member 71, and the insertion mounting type semiconductor element 20 is soldered. It is possible to prevent the portion from being stressed. In other words, the anti-rotation plate 50 tries to apply a force in the rotational direction X due to friction with the head (screw head) 71a of the fastening member 71, but both ends of the anti-rotation plate 50 are fixed. There is no operation in the rotation direction X, and only the vertical drag can be applied to the lower insertion mounting type semiconductor element 20.

  Further, the anti-rotation plate 50 is made of a resin sheet, and the anti-rotation plate 50 can be easily brought into contact with the main body portion 21 of each insertion mounting type semiconductor element 20 as the fastening member 71 is screwed. That is, even if the thicknesses of the main body portions 21 of adjacent insertion-mounting semiconductor elements 20 (indicated by reference numerals t1, t2, and t3 in FIG. 50 is deformed in the thickness direction Z of the main body portion 21 of the insertion mounting type semiconductor element 20 and comes into contact with the insertion mounting type semiconductor element 20. In addition, since an insulating resin sheet is used as the anti-rotation plate member 50, the creepage distance in the insertion mounting type semiconductor element 20 can be increased.

  Further, the support through hole 53 of the rotation preventing plate member 50 is a long hole extending in the Y direction, and a cylindrical pin 61 is inserted therein. Thereby, even if the thickness of the main body portion 21 of each insertion mounting type semiconductor element 20 is different, the anti-rotation plate 50 is inserted in the thickness direction of the main body portion 21 of the insertion mounting type semiconductor element 20 with the screwing of the fastening member 71. When deformed to Z, it can be easily deformed in the Y direction and easily contacted with the main body portion 21 of the insertion-mounting semiconductor element 20.

As described above, according to the present embodiment, the following effects can be obtained.
(1) As an electronic component fixing method, the insertion mounting type semiconductor element 20 in which the lead 22 is extended from the main body portion 21 having the fastening through-hole 23 is mounted on the printed wiring board 10 by soldering (first). Process). The anti-rotation plate member 50 having the through hole 51 corresponding to the fastening through hole 23 of the insertion mounting type semiconductor element 20 cannot be rotated in the rotation direction of the fastening member 71 with respect to the main body portion 21 of the insertion mounting type semiconductor element 20. It arrange | positions in a state (2nd process). The insertion mounting type semiconductor element 20 is fastened by screwing a fastening member 71 that passes through the through hole 51 of the rotation stopping plate member 50 and the fastening through hole 23 of the insertion mounting type semiconductor element 20 (third step). When the insertion mounting type semiconductor element 20 is fastened by the fastening member 71 in the third step, the rotational force of the fastening member 71 is caused by the rotation preventing plate member 50 that cannot rotate in the rotation direction of the fastening member 71. Don't join. As a result, it is possible to prevent stress from being applied to the soldered portion of the insertion mounted semiconductor element 20 without applying the rotational force of the fastening member 71 to the insertion mounted semiconductor element 20 mounted on the printed wiring board 10.

  (2) As a structure of the electronic device 1, the insertion mounting type semiconductor element 20 in which the lead 22 is extended from the main body portion 21 having the fastening through hole 23 is mounted on the printed wiring board 10 by soldering and inserted. In the electronic device 1 in which the mounting type semiconductor element 20 is fastened by screwing the fastening member 71 passing through the fastening through hole 23, the mounting type semiconductor element 20 is interposed between the main body portion 21 of the insertion mounting type semiconductor element 20 and the head 71a of the fastening member 71. The anti-rotation plate member 50 having the fastening through hole 51 corresponding to the fastening through hole 23 of the insertion mounting type semiconductor element 20, and the fastening member 71 passing through the fastening through hole 51, and the anti-rotation plate member 50. Stop pins 60 and 61 that are supported so as not to rotate in the rotation direction X of the fastening member 71 at least at one place. As a result, the insertion mounting type semiconductor element 20 is fastened by the fastening member 71 by interposing the detent plate member 50 between the main body 21 of the insertion mounting type semiconductor element 20 and the head 71 a of the fastening member (screw) 71. At this time, the rotational force of the fastening member 71 is not applied to the insertion mounting type semiconductor element 20 by the rotation-preventing plate member 50 supported so as not to rotate in the rotational direction of the fastening member 71. As a result, it is possible to prevent stress from being applied to the soldered portion of the insertion mounted semiconductor element 20 without applying the rotational force of the fastening member 71 to the insertion mounted semiconductor element 20 mounted on the printed wiring board 10.

  (3) Since the anti-rotation plate 50 is made of a resin sheet, even when the thicknesses t1, t2, and t3 of the main body portion 21 of each insertion mounting type semiconductor element 20 are different, insertion mounting is performed with the screwing of the fastening member 71. It easily comes into contact with the main body 21 of the type semiconductor element 20.

  (4) The through-holes 52 and 53 for support are formed in the detent plate member 50, and the detent plate member 50 is fastened to the fastening member 71 by inserting the support through-holes 52 and 53 into the set pins 60 and 61. It is supported so that it cannot rotate in the rotation direction X. Therefore, by inserting the support through holes 52 and 53 formed in the rotation stop plate 50 into the stop pins 60 and 61, the rotation stop plate 50 is easily supported in the rotation direction X of the fastening member 71 so as not to rotate. be able to.

  (5) A plurality of support through holes (52, 53) are formed in the detent plate member 50, and one of the plurality of support through holes 52, 53 is a long hole. Therefore, the stop pins 60 and 61 are inserted into the plurality of support through holes 52 and 53 formed in the rotation preventing plate member 50, and one of the plurality of support through holes 52 and 53 is a long hole. Therefore, it can be easily deformed in the extending direction of the long hole, and the anti-rotation plate member 50 is inserted as the fastening member 71 is screwed in even if the thickness of the main body portion 21 of each insertion mounting type semiconductor element 20 is different. It easily comes into contact with the main body 21 of the mountable semiconductor element 20.

The embodiment is not limited to the above, and may be embodied as follows, for example.
・ Two support through-holes 52 and 53 are formed in the rotation-preventing plate member 50, and the through-hole 53 is a long hole. Instead, as shown in FIGS. 9 (a) and 9 (b). Both of the through holes 55 and 56 may be long holes. The point is that a plurality of support through holes are formed in the anti-rotation plate, and at least one of the plurality of support through holes is a long hole. Alternatively, as shown in FIGS. 10A and 10B, both through holes 57 and 58 may be circular holes that are not long holes.

  -Although two supporting through-holes 52 and 53 are provided in the anti-rotation plate 50, only one may be used. Alternatively, three or more may be formed. Specifically, the support through holes 52 and 53 are provided at both ends of the rectangular anti-rotation plate 50, but one support through hole is provided at the center of the rectangular anti-rotation plate 50. Support holes may be provided, or support through holes may be provided at three locations on the anti-rotation plate member 50 having a rectangular shape. In other words, the anti-rotation plate 50 may be supported at one place so as not to rotate in the rotation direction X of the fastening member 71 or may be supported at two or more locations. In short, the anti-rotation plate 50 is fastened at at least one location. What is necessary is just to support in the rotation direction X of the member 71 so that rotation is impossible.

  -Although the board material 50 for rotation prevention was comprised with the resin-made sheet | seats, it is not restricted to this, A board | plate material other than resin, for example, a metal plate, may be sufficient. Specifically, when a thin copper plate is used, it can be easily deformed in the thickness direction even when the thickness of the body portion of the insertion mounting type semiconductor element is different.

Although both ends of the rotation-preventing plate member 50 are supported by the stop pins 60 and 61, they may be stopped so as not to move in the rotation direction X by using fastening members (screws) instead of the pins.
-Although the screw was used as a fastening member for fixing the insertion mounting type semiconductor element 20 to the metal case 30 as a heat radiating member, a volt | bolt may be sufficient.

  -Although metal case 30 was a heat radiating member, it may replace with this and a heat radiating member may be a heat sink. That is, a plurality of insertion mounting type semiconductor elements mounted on the printed wiring board may be fastened to the heat sink by screwing a fastening member passing through the fastening through hole.

The insertion mounting type semiconductor element 20 may be a transistor (specifically, MOSFET, bipolar transistor, IGBT, etc.) or a diode.
When the insertion mounting type semiconductor element 20 is fully molded, the insulating sheet 40 is unnecessary.

  The plurality of insertion-mounting semiconductor elements 20 do not have to be arranged in a straight line. When the plurality of insertion-mounting semiconductor elements 20 are bent and arranged, the anti-rotation plate (50) What is necessary is just to extend along the arrangement position of the insertion mounting type semiconductor element.

Although the rotation-preventing plate (50) is configured to be supported by the metal case 30 as a heat dissipation member, it is not limited thereto and may be supported by another member.
A plurality of insertion-mounting semiconductor elements 20 are mounted on the printed wiring board 10 and each insertion-mounting semiconductor element 20 is screwed into the metal case 30 as a heat dissipation member by screwing the fastening member 71 through the fastening through hole 23. Although applied to the fastened electronic device 1, it is not limited to this. The present invention may be applied to an electronic device in which one insertion mounting type semiconductor element is mounted on a printed wiring board and the insertion mounting type semiconductor element is fastened by screwing a fastening member passing through a fastening through hole. Further, the present invention may be applied to an electronic device in which an insertion mounting type semiconductor element is mounted on a printed wiring board and the insertion mounting type semiconductor element is fastened to the printed wiring board by screwing a fastening member passing through a fastening through hole.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 10 ... Printed wiring board, 20 ... Insertion mounting type semiconductor element, 21 ... Main-body part, 22 ... Lead | read | reed, 23 ... Through-hole for fastening, 30 ... Metal case, 50 ... Plate material for rotation prevention, 51 ... Fastening through hole, 52... Support through hole, 53. Support through hole, 60, 61... Stop pin, 70 and 71... Fastening member (screw), 71 a.

Claims (5)

A first step of mounting an insertion mounting type semiconductor element in which a terminal is extended from a main body portion having a fastening through hole on a printed wiring board by soldering;
A non-rotating plate member having a through hole corresponding to the fastening through hole of the insertion mounting type semiconductor element is disposed in the main body of the insertion mounting type semiconductor element in a non-rotatable state in the rotation direction of the fastening member. Two steps,
A third step of fastening the insertion mounting type semiconductor element by screwing a fastening member passing through the through hole of the detent plate member and the fastening through hole of the insertion mounting type semiconductor element;
An electronic component fixing method comprising the steps of: The insertion mounting type semiconductor element in which the terminal is extended from the main body portion having the fastening through hole is mounted on the printed wiring board by soldering, and the fastening member through which the insertion mounting type semiconductor element passes through the fastening through hole In electronic equipment that is fastened by screwing
Interposed between the main body of the insertion mounting type semiconductor element and the head of the fastening member, and has a fastening through hole corresponding to the fastening through hole of the insertion mounting type semiconductor element. A detent plate material through which the fastening member passes;
A support member that supports the rotation-preventing plate member at least in one place so as not to rotate in the rotation direction of the fastening member;
An electronic device characterized by comprising:   The electronic device according to claim 2, wherein the anti-rotation plate is made of a resin sheet.   A support through-hole is formed in the anti-rotation plate, and the anti-rotation plate is supported so as not to rotate in the rotation direction of the fastening member by inserting the support through-hole into the support member. The electronic device according to claim 2, wherein the electronic device is an electronic device.   5. The electronic device according to claim 4, wherein a plurality of the support through holes are formed in the anti-rotation plate, and at least one of the plurality of support through holes is a long hole.

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