JP2011081204A - Method for manufacturing liquid crystal display panel, and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a shape defect at an end of a portion corresponding to a tooth of a pixel electrode in a manufacturing method of a liquid crystal display device in which a comb-like pixel electrode is formed by using maskless exposure.
A liquid crystal display panel manufacturing method including a step of exposing the photosensitive resist with an exposure apparatus including a spatial light modulation element that generates an exposure pattern by numerical control using drawing data. A first operation for performing exposure while moving a region that can be exposed at a time in a first direction of a region to be exposed; and a second operation for moving the region that can be exposed at a time in a direction orthogonal to the first direction. The operation is repeated to expose the entire area to be exposed, and the drawing data is numerical data in which the position and exposure amount of the area to be irradiated with light in the exposure target area are designated, and the drawing data As the exposure amount, either a standard exposure amount necessary and sufficient for exposing the photosensitive resist or an exposure amount larger than the standard exposure amount is designated.
[Selection] Figure 5 (c)

Description

  The present invention relates to a liquid crystal display device and a method for manufacturing the same, and more particularly to a technique effective when applied to a method for manufacturing a liquid crystal display panel having comb-shaped electrodes.

  Conventionally, some liquid crystal display devices have a liquid crystal display panel in which a pixel electrode and a common electrode are disposed on one of a pair of substrates sandwiching a liquid crystal layer. At this time, the arrangement method of the pixel electrode and the common electrode is roughly divided into a method of stacking these electrodes through an insulating layer and a method of arranging them on the same surface of the insulating layer.

  In the method of laminating the pixel electrode and the common electrode, the planar shape of the electrode closer to the liquid crystal layer is generally a comb shape, and the planar shape of the far electrode is a flat plate shape. Further, in the method of disposing the pixel electrode and the common electrode on the same surface of the insulating layer, the planar shape of these electrodes is changed to a region where the pixel electrode and the common electrode are alternately arranged with a predetermined gap. Make the shape as if you have it. In such a liquid crystal display panel, when a potential difference is generated between the pixel electrode and the common electrode, an electric field called a fringe electric field is applied to the liquid crystal layer, and the alignment of the liquid crystal layer is changed by the fringe electric field.

  By the way, in such a conventional liquid crystal display panel, for example, the orientation of the liquid crystal layer is disturbed at the end corresponding to the teeth of the comb-shaped electrode, and the display quality is related to, for example, a decrease in transmittance. Problems arise. Therefore, in such a liquid crystal display panel, in recent years, it has been proposed that the orientation of the liquid crystal layer is less likely to be disturbed by devising the shape of the end corresponding to the teeth of the comb-shaped electrode ( For example, see Patent Document 1 and Patent Document 2.) Specifically, for example, the end of the portion corresponding to the teeth of the comb-shaped electrode is formed into a shape having a protrusion protruding in a direction different from the extending direction of the tooth portion, or the extending direction of the tooth The shape is bent in different directions.

JP 2005-107535 A JP 2009-122595 A

  In the method of manufacturing a liquid crystal display panel, when forming a comb-shaped electrode, a transparent conductive film such as ITO is formed by etching. When the transparent conductive film is etched, a photosensitive resist is formed on the conductive film, and the photosensitive resist is exposed and developed to form an etching resist (mask).

  For example, when the interdigital electrode has a variation in the dimension of the gap corresponding to the tooth, the strength of the fringe electric field varies, and the light transmittance and reflectance vary. Therefore, high dimensional accuracy is required for forming the comb-shaped electrode.

  By the way, a method of manufacturing a liquid crystal display panel is generally a method of collectively manufacturing a plurality of liquid crystal display panels using a set of mother glasses, which is called multi-chamfering.

  Moreover, in the conventional manufacturing method of a liquid crystal display panel, exposure of the photosensitive resist is generally performed by an exposure apparatus using a photomask.

  However, when manufacturing a liquid crystal display panel based on a set of layout data, for example, it is often manufactured in parallel on a plurality of manufacturing lines. Therefore, when exposing a photosensitive resist using a photomask, at least the same number of photomasks as the production line are required.

  In addition, when exposing a photosensitive resist using a photomask, for example, if layout data is changed, it is necessary to recreate the photomask based on the changed layout data.

  For these reasons, in recent liquid crystal display panel manufacturing methods, a method of performing exposure of a photosensitive resist without using a photomask (hereinafter referred to as maskless exposure) has been studied. As maskless exposure, for example, a method is known in which exposure is performed using a spatial light modulation element that generates a light pattern to be irradiated onto a photosensitive resist by numerical control based on layout data.

  In maskless exposure, exposure is performed while controlling the spatial light modulator with drawing data (numerical data) created based on layout data. Therefore, in the case of maskless exposure, even if the layout data is changed, the pattern of light applied to the photosensitive resist can be changed only by changing the drawing data (numerical data) based on the changed layout data. .

  However, in the maskless exposure, for example, the minimum dimension that can be set as the exposure resolution, in other words, the region that is irradiated with light or the region that is not irradiated in the drawing data is larger than when exposure is performed using a photomask. Therefore, when the exposure of the photosensitive resist is maskless exposure, for example, the portion of the resist pattern obtained after development corresponding to the acute-angle pattern on the layout data may not have an acute-angle shape. is there.

  For example, in the layout data relating to the comb-shaped pixel electrode, when an acute angle protrusion is provided at the end of the portion corresponding to the tooth, the etching resist obtained by developing after exposure based on the layout data is In addition, it must have a planar shape having acute-angled protrusions at the portions corresponding to the ends of the portions corresponding to the teeth. However, when maskless exposure is applied, acute-angled protrusions may not be formed in the etching resist obtained by development. Since the pixel electrode formed at this time does not have an acute-angled projection at the end of the portion corresponding to the tooth, when the orientation of the liquid crystal layer is disturbed at the end portion when external pressure is applied, for example, Problems such as a decrease in transmittance occur and display quality is deteriorated.

  An object of the present invention is, for example, in a manufacturing method of a liquid crystal display device in which a comb-teeth-shaped pixel electrode is formed using maskless exposure, and the shape defect at the end corresponding to the tooth of the pixel electrode is reduced. It is to provide a technology that can.

  Another object of the present invention is, for example, in a liquid crystal display device having a comb-shaped pixel electrode formed by using maskless exposure, and can prevent deterioration in display quality due to disorder of the alignment of the liquid crystal layer. To provide technology.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The outline of typical inventions among the inventions disclosed in the present application will be described as follows.

  (1) The process of exposing and developing the photosensitive resist is performed a plurality of times, and at least one of the plurality of processes is performed by using layout data prepared in advance. A manufacturing method of a liquid crystal display panel performed by an exposure apparatus having a spatial light modulation element that generates a pattern of light irradiated to the photosensitive resist by numerical control using drawing data created based on the spatial light, the spatial light The exposure of the photosensitive resist performed by the exposure apparatus having a modulation element is such that the size of the region that can be exposed at one time is smaller than the exposure target region of the photosensitive resist, and the region that can be exposed at one time is the exposure target. A first operation of performing exposure while moving the region in the first direction and a second operation of moving the region that can be exposed at one time in a direction perpendicular to the first direction are repeated. Returning to expose the entire exposure target area, the drawing data is numerical data in which the position and exposure amount of the area to be irradiated with light in the exposure target area is specified, and the drawing data of the drawing data As for the position of the region to be irradiated with light, the minimum value that can be specified as the dimension in the first direction is larger than the minimum value that can be specified as the dimension in the second direction, and the exposure amount in the drawing data Is one of a standard exposure amount necessary and sufficient for exposing the photosensitive resist or an exposure amount greater than the standard exposure amount, and the region designated to irradiate the light in the drawing data. A method for manufacturing a liquid crystal display panel having a portion exposed at the standard exposure amount and a portion exposed at an exposure amount larger than the standard exposure amount around a boundary with a region not irradiated with light.

  (2) The method for manufacturing a liquid crystal display panel according to (1), wherein there are two or more exposure amounts larger than the standard exposure amount.

  (3) In the method for manufacturing a liquid crystal display panel according to (1), the exposure of the photosensitive resist performed by the exposure apparatus having the spatial light modulator is a step of exposing and developing the photosensitive resist a plurality of times. The layout data used for exposure has an acute-angled pattern, and one of two sides constituting the acute-angled pattern is substantially parallel to the second direction. A method for manufacturing a liquid crystal display panel.

  (4) In the method of manufacturing a liquid crystal display panel according to (1), the exposure of the photosensitive resist performed by the exposure apparatus having the spatial light modulator is performed by etching a transparent conductive film to form a comb-shaped pixel electrode. The layout data used for exposing the photosensitive resist in the forming step has an acute-angled protrusion pattern at the end of the portion corresponding to the teeth of the pixel electrode, and the acute angle A method for manufacturing a liquid crystal display panel, wherein one of the two sides constituting the projection pattern is substantially parallel to the second direction.

  (5) A liquid crystal display device having a display region in which pixels having comb-shaped pixel electrodes are arranged in a matrix, and the pixel electrodes change in size stepwise at the end corresponding to the teeth. A liquid crystal display device having a substantially acute-angled protrusion shape.

  (6) In the liquid crystal display device of (5), the protrusion has a shape in which one side of the two sides constituting the acute angle is substantially parallel to a direction in which portions corresponding to the teeth of the pixel electrode are arranged. A liquid crystal display device.

  (7) A liquid crystal display device having a display region in which pixels having comb-shaped pixel electrodes are arranged in a matrix, and the pixel electrodes change in size stepwise at the end corresponding to the teeth. A liquid crystal display device having a substantially acute cutout shape.

  (8) In the liquid crystal display device according to (7), the cutout shape is substantially parallel to a direction in which one side of the two sides constituting the acute angle is aligned with a portion corresponding to the tooth of the pixel electrode. A liquid crystal display device.

  According to the method for manufacturing a liquid crystal display device of the present invention, for example, when a comb-shaped pixel electrode is formed using maskless exposure, the shape defect at the end corresponding to the tooth of the pixel electrode is reduced. can do.

  In addition, according to the liquid crystal display device of the present invention, it is possible to prevent display quality from being deteriorated due to, for example, disorder of the alignment of the liquid crystal layer caused by external pressure.

It is a schematic plan view which shows an example of the plane structure of the pixel in the liquid crystal display panel of one Example by this invention. It is a schematic cross section which shows an example of the cross-sectional structure in the A-A 'line of Fig.1 (a). It is a schematic plan view which shows an example of the external shape of a liquid crystal display panel. It is a schematic top view which shows an example of the imposition method in the manufacturing method of a liquid crystal display panel of a multi-cavity. It is a schematic plan view which shows another example of the imposition method in the manufacturing method of a multi-panel liquid crystal display panel. It is a schematic plan view which shows an example of the exposure procedure of maskless exposure. It is the model top view which expanded and showed area | region AR1 of Fig.3 (a). It is a schematic cross section which shows an example of the control method of the pattern of the light irradiated to the photosensitive material film | membrane. It is the schematic diagram which visualized an example of the drawing data used with exposure apparatus. It is a schematic plan view which shows an example of the exposure conditions from which a favorable acute-angled pattern is obtained. It is a schematic plan view which shows an example of the exposure conditions which a shape defect produces in an acute-angled pattern. It is a schematic cross section for demonstrating the principle of the maskless exposure in the manufacturing method of the liquid crystal display panel of a present Example. It is a schematic diagram which shows an example of the relationship between exposure amount and the line | wire width of the pattern which remains after image development. It is a schematic plan view which shows the 1st example of the drawing data in the manufacturing method of the liquid crystal display panel of a present Example. It is a schematic plan view which shows the 2nd example of the drawing data in the manufacturing method of the liquid crystal display panel of a present Example. It is a schematic diagram for demonstrating the resist pattern obtained by using the drawing data shown to Fig.6 (a). It is a schematic plan view which shows the modification of the 2nd example of drawing data. It is a schematic plan view which shows the 3rd example of drawing data. It is a schematic plan view which shows an example of the manufacturing method of the liquid crystal display panel to which the application of the maskless exposure concerning this invention is desired. It is a schematic diagram which shows one example of the conventional layout data and drawing data of area | region AR2 of Fig.8 (a). It is a schematic diagram which shows an example of the layout data and drawing data of area | region AR2 at the time of applying the maskless exposure concerning this invention. FIG. 9 is a schematic diagram illustrating an example of a region exposed when exposed using the drawing data illustrated in FIG. 8C and a resist pattern obtained by development after exposure. FIG. 9 is a schematic diagram showing a relationship between an example of the shape of a pixel electrode formed by etching using the resist pattern shown in FIG. 8D and layout data. It is a schematic diagram which shows an example of the layout data and drawing data of area | region AR3 of Fig.8 (a). FIG. 9 is a schematic diagram illustrating an example of a region exposed when exposed using the drawing data illustrated in FIG. 8F and a resist pattern obtained by development after exposure. It is a schematic diagram which shows the relationship between an example of the shape of the pixel electrode formed by the etching using the resist pattern shown in FIG.8 (g), and layout data.

Hereinafter, the present invention will be described in detail together with embodiments (examples) with reference to the drawings.
In all the drawings for explaining the embodiments, parts having the same function are given the same reference numerals and their repeated explanation is omitted.

FIG. 1A and FIG. 1B are schematic views showing a schematic configuration of a main part of a liquid crystal display panel according to an embodiment of the present invention.
FIG. 1A is a schematic plan view illustrating an example of a planar configuration of a pixel in a liquid crystal display panel according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view showing an example of a cross-sectional configuration taken along line AA ′ in FIG.

  In this embodiment, as an example of a liquid crystal display panel to which the present invention is desired, an IPS active matrix TFT liquid crystal display panel (hereinafter simply referred to as an IPS liquid crystal) in which each pixel has a comb-like pixel electrode. A display panel).

  For example, as shown in FIGS. 1A and 1B, the IPS liquid crystal display panel includes a TFT substrate 1, a counter substrate 2, a liquid crystal layer 3, a first polarizing plate 4, and a second polarizing plate. It has a plate 5. The first polarizing plate 4 is a polarizing plate that is necessary when, for example, a transmissive type modulates light from a backlight to display an image or an image, and a reflective type modulates external light. This is not necessary when displaying images and images.

  The TFT substrate 1 includes a first insulating substrate 6 such as a glass substrate and a first thin film laminate (not shown) formed on the surface of the first insulating substrate 6. The first thin film stack includes, for example, a scanning signal line 7, a first insulating layer 8, a TFT element semiconductor layer 9, a video signal line 10, a first source-drain electrode 11, a second insulating layer 12, It consists of a common electrode 13, a third insulating layer 14, a pixel electrode 15, and a first alignment film 16.

  The counter substrate 2 includes a second insulating substrate 17 such as a glass substrate, and a second thin film stack (not shown) formed on the surface of the second insulating substrate 17. The second thin film stack includes, for example, a black matrix 18, a color filter 19, a planarizing layer 20, a second alignment film 21, and the like.

  Each pixel of the IPS liquid crystal display panel includes a TFT element, a pixel electrode 15, a common electrode 13, and a liquid crystal layer 3. At this time, the semiconductor layer 9 of the TFT element is laminated on the scanning signal line 7 via the first insulating layer 8. In addition to the semiconductor layer 9 of the TFT element, a video signal line 10 and a first source-drain electrode 11 are formed on the first insulating layer 8. At this time, a portion of the video signal line 10 branched in the direction in which the scanning signal line 7 extends (x-axis direction) and a part of the first source-drain electrode 11 run on the semiconductor layer 9 respectively. . That is, in the TFT element of each pixel, a part of the scanning signal line 7 is used as a gate electrode, and a part branched from the video signal line 10 in the extending direction of the scanning signal line 7 is used as a second source-drain electrode.

  Further, as shown in FIG. 1B, the pixel electrode 15 is connected to the first source-drain electrode 11 through a through hole. Therefore, when a predetermined voltage is applied to the scanning signal line 7 (the gate electrode of the TFT element) to turn on the TFT element, the potential of the pixel electrode 15 is substantially the same as the gradation voltage applied to the video signal line 10. Become potential.

  At this time, if there is a potential difference between the pixel electrode 15 and the common electrode 13, as shown in FIG. 1B, an arch-shaped line of electric force 22 passing through the liquid crystal layer 3 is generated. An electric field is applied to When an electric field is applied to the liquid crystal layer 3, the alignment state changes according to the strength of the electric field.

  After passing through the first polarizing plate 4, the polarization state of light that passes through the liquid crystal layer 3 and enters the second polarizing plate 5 changes according to the alignment state of the liquid crystal layer 3. Therefore, by controlling the potential difference between the pixel electrode 15 and the common electrode 13, the amount of light passing through the second polarizing plate 5, that is, the luminance (gradation) of the pixel is controlled.

  By the way, in the IPS type liquid crystal display panel, the alignment of the liquid crystal layer 3 in a state where an electric field is not applied is a homogeneous alignment, and the major axis of the liquid crystal molecule is a portion 15T (hereinafter simply referred to as a tooth of the pixel electrode 15). The direction in which the teeth extend) is different from the extending direction. When an electric field is applied, the liquid crystal molecules rotate so that the major axis is directed in the direction of the electric field.

  In addition, the alignment of the liquid crystal layer 3 in a state where no electric field is applied is controlled by the alignment direction (for example, the rubbing direction) of the first alignment film 16 and the second alignment film 21. The teeth 15T of the pixel electrode 15 in the conventional IPS liquid crystal display panel are usually a simple parallelogram. For example, the liquid crystal layer 3 is disturbed in alignment by external pressure or the like, and the display is caused by a decrease in transmittance. Problems such as quality degradation were likely to occur.

Therefore, in the liquid crystal display panel of recent IPS method, for example, as shown in FIG. 1 (a), by bending the end 15T _E of the teeth 15T of the pixel electrode 15, reducing the alignment disorder of the liquid crystal layer 3 In addition, the decrease in transmittance is suppressed.

However, when the end 15T _E of the tooth 15T of the pixel electrode 15 is bent, a shape defect occurs at the end 15T _{E of the} tooth 15T depending on the method of forming the pixel electrode 15.

2 (a) to 2 (c), 3 (a) to 3 (d), 4 (a), and 4 (b) are examples of a method of manufacturing a liquid crystal display panel and its problems. It is a schematic diagram for demonstrating.
FIG. 2A is a schematic plan view showing an example of the outer shape of the liquid crystal display panel. FIG. 2B is a schematic plan view showing an example of the imposition method in the method of manufacturing a multi-panel liquid crystal display panel. FIG. 2C is a schematic plan view showing another example of the imposition method in the method of manufacturing the multi-panel liquid crystal display panel.
FIG. 3A is a schematic plan view showing an example of an exposure procedure of maskless exposure. FIG. 3B is a schematic plan view showing the area AR1 of FIG. FIG. 3C is a schematic cross-sectional view showing an example of a method for controlling the pattern of light applied to the photosensitive material film. FIG. 3D is a schematic diagram visualizing an example of drawing data used in the exposure apparatus.
FIG. 4A is a schematic plan view showing an example of an exposure condition for obtaining a good acute-angle pattern. FIG. 4B is a schematic plan view showing an example of an exposure condition in which a shape defect occurs in an acute angle pattern.
FIG. 3C is a schematic cross-sectional view showing an example of a cross-sectional configuration viewed in the BB ′ line direction of FIG.
4 (a) and 4 (b) are schematic diagrams each showing a pattern in which the upper (α) is designated by the layout data, and the lower (β) is an exposure based on the layout data. It is a schematic diagram which shows the pattern of the resist obtained by developing after developing.

  The liquid crystal display panel usually has a substantially quadrangular planar shape. In addition, the planar shape of the liquid crystal display panel is, for example, the dimension Px in the direction in which the scanning signal line 7 extends (hereinafter referred to as the x-axis direction) and the direction in which the video signal line 10 extends (hereinafter referred to as the y-axis direction). ) Is different from the size Py. Note that the extending direction of the scanning signal lines 7 and the extending direction of the video signal lines 10 are directions in the display area DA, respectively.

  In this embodiment, as an example of the planar shape of the liquid crystal display panel, for example, as shown in FIG. 2A, the dimension Px in the x-axis direction is smaller than the dimension Py in the y-axis direction. Such a flat liquid crystal display panel is mainly used as a liquid crystal display of a portable electronic device such as a mobile phone terminal. At this time, the dimension Px in the x-axis direction and the dimension Py in the y-axis direction of the liquid crystal display panel are each about several centimeters to several tens of centimeters.

  As a method for manufacturing such a liquid crystal display panel, a method of collectively manufacturing a plurality of liquid crystal display panels using a set of mother glasses, which is called multi-chamfering, is generally used.

  When a liquid crystal display panel is manufactured with multiple surfaces, a plurality of regions to be cut out as the TFT substrate 1 are set in one mother glass, and the scanning signal line 7, the video signal line 10, the TFT element, and the pixel electrode 15 are set in each region. Etc. are formed in parallel. At this time, a plurality of regions corresponding to the region to be cut out as the TFT substrate 1 are set in the other mother glass, and the black matrix 18 and the color filter 19 are formed in each region.

  Moreover, when manufacturing a liquid crystal display panel by multi-chamfering, it is usually desired to increase the number of liquid crystal display panels obtained from a set of mother glasses as much as possible. At this time, a method of setting a region to be cut out as the TFT substrate 1 in the mother glass, that is, an imposition method, is roughly classified into two types depending on the relationship between the size of the mother glass and the size of the TFT substrate 1.

  The first imposition method is, for example, a method of setting the x-axis direction of the TFT substrate 1 and the short side direction (u-axis direction) of the mother glass 23 to be parallel as shown in FIG. It is. The second imposition method is, for example, a method of setting the x-axis direction of the TFT substrate 1 and the long side direction (v-axis direction) of the mother glass to be parallel as shown in FIG. is there.

  The pixel electrode 15 provided on the TFT substrate 1 is usually formed by etching a transparent conductive film such as ITO. That is, the process of forming the pixel electrode 15 usually includes a process of forming a transparent conductive film, a process of forming an etching resist (mask) on the transparent conductive film, and a process of removing unnecessary portions of the transparent conductive film. Have.

  The step of forming an etching resist includes a step of forming an unexposed photosensitive resist on the transparent conductive film, a step of exposing the photosensitive resist, a step of developing the exposed photosensitive resist, and development. And a step of fixing the remaining photosensitive resist.

  Conventionally, exposure of a photosensitive resist is performed by an exposure apparatus using a photomask. However, in recent liquid crystal display panel manufacturing methods, as described above, application of maskless exposure not using a photomask is being studied.

As described above, maskless exposure is an exposure method using a spatial light modulation element that generates a light pattern (exposure pattern) to be applied to a photosensitive resist by numerical control based on layout data, instead of a photomask. At this time, the pattern of light generated by the spatial light modulator needs to be controlled in units of several μm. Therefore, in the case of maskless exposure, considering the controllability of the spatial light modulator, the area that can be exposed at one time is several mm ² to several cm ² . That is, in the case of maskless exposure, the area that can be exposed at one time is much smaller than the exposure target area of the photosensitive resist.

  Therefore, when the photosensitive resist is exposed by maskless exposure, for example, as shown in FIG. 3A, the position of an area ER that can be exposed at one time (hereinafter simply referred to as an exposure area ER) is set on the mother glass 23. A first operation for performing exposure while shifting in the long side direction (v-axis direction) and a second operation for shifting the position of the exposure region ER in the short side direction (u-axis direction) of the mother glass 23 are repeated. The entire resist is exposed. At this time, the width Qu (the dimension in the u-axis direction) of the strip-shaped region exposed in one first operation is, for example, about 2 mm to 1 cm.

  When attention is paid to the first operation of one time, the band-like region exposed by the operation is divided into a number of fine band-like regions as shown in FIGS. 3B and 3C, for example. The exposure is performed independently for each belt-like region. At this time, the width Ru (dimension in the u-axis direction) of the fine strip region is, for example, about 0.5 μm.

  At this time, the spatial light modulation element 24 has a large number of irradiation control elements 24a for switching between a light irradiation state and a non-irradiation state. The irradiation control elements 24a are, for example, the short sides of the mother glass 23. Are aligned in the direction (u-axis direction). In addition, each irradiation control element 24a has independent control of switching between a state in which light is irradiated and a state in which light is not irradiated. Therefore, in the exposed region ER of the photosensitive resist 26 formed on the transparent conductive film 25, as shown in FIG. 3C, a region exposed by exposure and a region not exposed are formed. Can do. Note that the photosensitive resist 26 shown in FIG. 3C is a region where a portion provided with a dot pattern is exposed by exposure, and a white portion is a region not exposed.

  In addition, the switching control between the irradiation state and the non-irradiation state in each irradiation control element 24a is performed by drawing data created based on the layout data. This drawing data is numerical data. For example, the position of the light irradiation area, in other words, the position to switch from the light irradiation state to the non-irradiation state, the position to switch from the non-light irradiation state to the irradiation state, etc. are designated. Has been. When this drawing data is visualized, the relationship between the region where light is irradiated and the region where light is not irradiated is, for example, as shown in FIG. In the drawing data shown in FIG. 3D, a region with a dot pattern is a region where light is irradiated, and a white region is a region where light is not irradiated.

  By the way, in the drawing data used in the conventional maskless exposure, when designating the region to be irradiated with light and the region to be unirradiated, the irradiation is performed from the position where the light irradiation state is switched to the non-irradiation state and the light irradiation state. The position to switch to the state is specified in increments of distance Δs, for example. Therefore, the dimension R1v in the v-axis direction of the region that irradiates light and the dimension R2v in the v-axis direction of the region that does not irradiate each have a value that is a natural number multiple of the distance Δs.

  In the drawing data used in the conventional maskless exposure, for example, from the viewpoint of controllability of switching between the irradiation state and the non-irradiation state in the irradiation control element 24a, the light irradiation region in the v-axis direction is used. The minimum value that can be set as the dimension R1v and the dimension R2v in the v-axis direction of the non-irradiated region is often twice or more the distance Δs. In the case of conventional maskless exposure, the minimum values that can be set as the dimension R1v in the v-axis direction of the region to which light is irradiated and the dimension R2v in the v-axis direction of the region that is not irradiated are each about 1.5 μm, for example. .

  On the other hand, in the case of conventional maskless exposure, the width Ru (dimension in the u-axis direction) of the fine strip region is, for example, about 0.5 μm. For this reason, in conventional maskless exposure, the minimum dimension of the light irradiation region and the non-irradiation region is normally a rectangle whose longitudinal direction is the direction (v-axis direction) in which the exposure region ER moves in the first operation. .

  Therefore, if the photosensitive resist exposure performed in the process of forming the comb-shaped pixel electrode 15 is performed by such conventional maskless exposure, for example, the following occurs.

  First, in the layout data used for forming the comb-shaped pixel electrode 15, for example, as shown in (α) of FIG. 4A, the teeth 15T extend in the u-axis direction, and the teeth 15T A case where there is an acute-angled protrusion protruding in the −v direction at the end will be described. At this time, if the dimension Wu in the u-axis direction and the dimension Wv in the v-axis direction of the protrusion are about 2.0 μm to 3.0 μm, respectively, the photosensitive resist is removed by maskless exposure based on the layout data. The planar shape of the resist 26T obtained by developing after exposure is, for example, a shape as shown in (β) of FIG. In other words, the apex angle portion of the protrusion (the portion surrounded by the two-dot difference line) has a relatively good acute-angle shape, although it does not conform to the layout data.

  Next, in the layout data used for forming the comb-shaped pixel electrode 15, for example, as shown in (α) of FIG. 4B, the tooth 15T extends in the v-axis direction, and the tooth 15T A case where there is an acute-angled protrusion protruding in the + u direction at the end of the substrate will be described. At this time, if the dimension Wu in the u-axis direction and the dimension in the v-axis direction Wv of the protrusion are about 2.0 μm to 3.0 μm, respectively, the photosensitive resist is removed by maskless exposure based on the layout data. The planar shape of the resist 26T obtained by developing after exposure is, for example, a shape as shown in (β) of FIG. That is, the apex angle portion of the protrusion (the portion surrounded by the two-dot difference line) has a large difference from the layout data, and cannot be called an acute angle shape.

  As described above, in the conventional maskless exposure, when there is an acute-angled pattern in the layout data, the relationship between the direction of the two sides constituting the acute angle and the direction in which the exposure region ER moves in the first operation, A difference occurs in the shape of the resist remaining after development. That is, when one of the two sides constituting the acute angle is substantially parallel to the direction in which the exposure region ER moves in the first operation, the resist remaining after development has a relatively good acute shape. If one of the two sides constituting the acute angle is substantially orthogonal to the direction in which the exposure region ER moves in the first operation, the resist remaining after development has a shape that cannot be called an acute angle.

  Therefore, for example, when the TFT substrate 1 having the comb-shaped pixel electrode 15 as shown in FIG. 1A is manufactured by multi-chamfering, maskless exposure is performed in the process of forming the pixel electrode 15. The following happens.

  First, as shown in FIG. 2B, the method of imposing on the mother glass 23 is such that the x-axis direction of the TFT substrate 1 is parallel to the short side direction (u-axis direction) of the mother glass 23, and When the moving direction of the exposure region ER is the v-axis direction in the first operation of maskless exposure, the ends of the teeth 15T of the pixel electrode 15 have a relatively good shape reflecting the layout data.

  On the other hand, as shown in FIG. 2C, the method of imposing on the mother glass 23 is such that the x-axis direction of the TFT substrate 1 and the long side direction (v-axis direction) of the mother glass 23 are parallel. When the moving direction of the exposure region ER is the v-axis direction in the first operation of the maskless exposure, the end of the tooth 15T of the pixel electrode 15 does not have a shape reflecting the layout data, so that a so-called defective shape is obtained. Become.

  In the exposure apparatus used in maskless exposure, the dimensions of the usable mother glass and the relationship between the direction in which the exposure area ER is moved in the first operation and the long side direction of the mother glass are usually fixed. Therefore, when exposing the photosensitive resist 26 formed on the mother glass 23 of a certain standard (dimension) in a certain exposure apparatus, depending on the dimension (imposition method) of the TFT substrate 1, There are cases where the x-axis direction is orthogonal to the direction in which the exposure region ER moves in the first operation, and may be parallel.

  Accordingly, when a liquid crystal display panel having a comb-like pixel electrode 15 as shown in FIG. 1 is manufactured by multi-chamfering, in order to prevent a defective shape of the pixel electrode 15 due to restrictions on maskless exposure, for example, a TFT substrate Regardless of the size of 1, the y-axis direction of the TFT substrate 1 needs to be faced so as to be parallel to the direction (v-axis direction) in which the exposure region ER moves in the first operation. However, in that case, depending on the dimensions of the TFT substrate 1, the number of liquid crystal display panels obtained from a set of mother glasses does not become the maximum value. For example, a piece of glass remaining after cutting the TFT substrate 1 from the mother glass 23, That is, the amount of glass pieces that are wasted increases.

  In the present invention, the defective shape of the pixel electrode 15 due to the maskless exposure restriction as described above is prevented, and, for example, the display quality is lowered and the manufacturing yield is lowered due to the defective shape of the pixel electrode 15. ) To reduce waste.

5 (a) to 5 (c), 6 (a) to 6 (c), and 7 are diagrams for explaining an outline of maskless exposure in the method of manufacturing the liquid crystal display panel of this embodiment. It is a schematic diagram.
FIG. 5A is a schematic cross-sectional view for explaining the principle of maskless exposure in the manufacturing method of the liquid crystal display panel of this embodiment. FIG. 5B is a schematic diagram showing an example of the relationship between the exposure amount and the line width of the pattern remaining after development. FIG. 5C is a schematic plan view showing a first example of drawing data in the manufacturing method of the liquid crystal display panel of the present embodiment.
FIG. 6A is a schematic plan view showing a second example of drawing data in the method of manufacturing the liquid crystal display panel of the present embodiment. FIG. 6B is a schematic diagram for explaining a resist pattern obtained by using the drawing data shown in FIG. FIG. 6C is a schematic plan view showing a modification of the second example of the drawing data.
FIG. 7 is a schematic plan view showing a third example of drawing data.

  When the photosensitive resist 26 is exposed not only to maskless exposure but also to a conventional exposure apparatus, the exposure amount of the photosensitive resist 26 is usually necessary and sufficient to expose a region designated to be irradiated with light. Exposure amount. In recent years, there are cases where the exposure amount in one exposure is two or more, as in an exposure method called half exposure, but in this case as well, the maximum exposure amount is usually irradiated with light. The exposure amount is sufficient to expose the designated area.

  In contrast, in the exposure of the photosensitive resist 26 performed in the manufacturing method of the liquid crystal display panel of the present embodiment, among the areas designated to irradiate light, the areas designated not to irradiate light. In the vicinity of the boundary, a portion to be exposed with an exposure amount larger than an exposure amount necessary and sufficient for exposure is provided.

  When a positive photosensitive resist is exposed and developed to form a resist pattern, it is the unexposed area that remains on the mother glass 23 after development. Therefore, when a positive photosensitive resist is exposed and developed to form a resist pattern having a width d, the drawing data is, for example, when exposed at a standard exposure amount as shown in FIG. The width of the non-exposed region (non-exposed region) is designated to be d. Note that the photosensitive resist 26 shown in FIG. 5A is a portion that is exposed when a portion with a dot pattern is exposed with a standard exposure amount.

  When the photosensitive resist 26 is exposed using such drawing data and with an exposure amount larger than the standard exposure amount, overexposure is performed and the width of the exposed region is widened. Therefore, the width of the non-photosensitive region is d ′. (= D−2 · Δd). Note that the photosensitive resist 26 shown in FIG. 5A is a portion that is exposed when a portion with a group of parallel diagonal lines that descend to the right is exposed with an exposure amount larger than the standard exposure amount.

  At this time, the width d shown in FIG. 5A is the dimension R2y of the region that does not irradiate light in the direction (v-axis direction) in which the exposure region ER moves in the first operation of maskless exposure, and If the minimum dimension that can be set in the drawing data is exposed, the dimension in the direction of the resist pattern is made smaller than the minimum dimension that can be set in the drawing data by exposing with an exposure amount larger than the standard exposure amount. be able to.

  That is, in the area designated to irradiate light, the portion exposed at the standard exposure amount near the boundary with the area designated not to irradiate light, and the exposure amount greater than the standard exposure amount. If a portion to be exposed is provided, a pattern smaller than the minimum dimension that can be set by the drawing data can be formed.

  Further, when the positive photosensitive resist is exposed with an exposure amount larger than the standard exposure amount, the larger the difference between the exposure amount and the standard exposure amount, the larger the protrusion amount Δd of the photosensitive region, and the non-photosensitive region. The width d ′ is narrowed. Therefore, when the positive photosensitive resist is exposed with an exposure amount larger than the standard exposure amount, the dimension of the resist pattern remaining after development can be set to a desired value by adjusting the exposure amount.

Therefore, the inventors of the present application examined the relationship between the exposure amount and the line width of the pattern remaining after development when exposing and developing a positive photosensitive resist, and the curve shown in FIG. There was such a relationship. FIG. 5B is a graph of the exposure amount E (mJ / cm ² ) on the horizontal axis and the line width d (μm) of the pattern remaining after development on the vertical axis. FIG. 5B shows the drawing data such that the line width of the remaining pattern becomes 2.5 μm when the photosensitive resist formed so that the standard exposure amount is 50 mJ / cm ² is exposed and developed. Is a result of examining the relationship between the exposure amount E and the line width d of the remaining pattern. Further, the table shown in the graph of FIG. 5B shows the relative value QoE (%) with respect to the standard exposure amount at several exposure amounts and the protruding amount Δd (μm) of the exposed area.

That is, as a result of investigation by the inventors of the present application, when the exposure amount E is 72 mJ / cm ² (144% exposure amount of the standard exposure amount), the protruding amount Δd of the exposed region is 0.28 μm. Further, when the exposure dose E is 96 mJ / cm ² (192% exposure dose of the standard exposure dose), the protrusion amount Δd of the exposed area is 0.45 μm, and the exposure dose E is 120 mJ / cm ² (standard exposure dose). 240% of the exposure amount), the protrusion amount Δd of the exposed area becomes 0.55 μm.

  At this time, for example, as shown in FIG. 5C, the drawing data created on the basis of the layout data includes a fine band-shaped region in which the exposure amount before and after the region designated not to be irradiated with light is set as the standard exposure amount. If a fine band-shaped region having an exposure amount larger than the standard exposure amount is provided, the width (dimension in the v-axis direction) of the non-photosensitive portion when the positive photosensitive resist is exposed using the drawing data is set. It can be narrowed in stages. For this reason, the pattern obtained by exposing the positive photosensitive resist using the drawing data and developing the pattern becomes a pattern like the thick line shown in FIG. be able to. Note that the drawing data shown in FIG. 5C is a region where the portion with the dot pattern is designated to irradiate light, and the relationship between the density of the dot pattern and the exposure amount is shown in FIG. It is as shown in the table at the bottom of c). In addition, each group of parallel diagonal lines shown in FIG. 5C is a region that is exposed when overexposed with a specified exposure amount.

  At this time, if the dimension R2v in the v-axis direction of the white area in the drawing data shown in FIG. 5C, that is, the area not irradiated with light is the minimum dimension that can be specified by the drawing data, it is obtained after development. A pattern smaller than the minimum dimension that can be designated by the drawing data is formed at the end of the pattern to be formed.

  By the way, when creating drawing data, as described above, the position where light irradiation starts and the position where light irradiation ends can be specified at intervals of Δs. For this reason, in the case where a fine band-like region having an exposure amount larger than the standard exposure amount is provided in the drawing data created based on the layout data, for example, as shown in FIG. The end position can also be shifted stepwise in the −v direction. When a positive type photosensitive resist is exposed using such drawing data, for example, the region to which the dot pattern shown in FIG. 6B and the region to which the parallel oblique lines are attached are exposed. Therefore, the pattern obtained by developing after exposing the photosensitive resist using the drawing data becomes a pattern like the thick line shown in FIG. That is, it is possible to form an acute-angle pattern in which one of the two sides constituting the acute angle is substantially orthogonal to the direction (u-axis direction) in which the exposure region ER moves in the first operation. The drawing data shown in FIG. 6A and FIG. 6B is an area designated so that the portion with the dot pattern is irradiated with light, and the relationship between the density of the dot pattern and the exposure amount. Is as shown in the table at the bottom of each figure. Further, the group of parallel diagonal lines shown in FIG. 6B is a region that is exposed when overexposed with a specified exposure amount.

  In the example shown in FIGS. 6A and 6B, the region exposed with an exposure amount larger than the standard exposure amount can be set with a constant dimension R1v (eg, drawing data) regardless of the exposure amount. (Minimum dimension). However, in the case where areas to be exposed with an exposure amount larger than the standard exposure amount are provided in the drawing data, the dimensions of these regions are not limited to this. For example, as shown in FIG. You may make it the position of the boundary with the area | region to perform align.

  In the example shown in FIG. 6A, the region exposed with an exposure amount larger than the standard exposure amount is shifted stepwise in the −v direction, and the lower side of the two sides constituting the acute angle is shifted. The side is substantially orthogonal to the direction (u-axis direction) in which the exposure region ER moves in the second operation.

  However, in the case where a fine band-like region having an exposure amount larger than the standard exposure amount is provided in the drawing data created based on the layout data, for example, as shown in FIG. The position can also be shifted stepwise in the + v direction. When a positive type photosensitive resist is exposed using such drawing data, for example, the region to which the dot pattern of FIG. 7 is applied and the region to which the group of parallel diagonal lines are attached are exposed. Therefore, the pattern obtained by developing after exposing the photosensitive resist using the drawing data is a pattern like the thick line shown in FIG. That is, when the photosensitive resist exposure method according to the present invention is used, the upper side of the two sides constituting the acute angle is substantially orthogonal to the direction (u-axis direction) in which the exposure region ER moves in the second operation. A pattern can also be formed. Note that the drawing data shown in FIG. 7 is an area in which a portion with a dot pattern is designated to emit light, and the relationship between the density of the dot pattern and the exposure amount is at the bottom of FIG. It is as shown in the table. In addition, the parallel diagonal lines shown in FIG. 7 are areas that are exposed when overexposed with a specified exposure amount.

FIGS. 8A to 8H are schematic views for explaining a specific example of maskless exposure and an example of the shape of a pattern formed at that time in the manufacturing method of the liquid crystal display panel of this embodiment. is there.
FIG. 8A is a schematic plan view showing an example of a manufacturing method of a liquid crystal display panel to which application of maskless exposure according to the present invention is desired. FIG. 8B is a schematic diagram showing a conventional example of layout data and drawing data of the area AR2 in FIG. FIG. 8C is a schematic diagram showing an example of layout data and drawing data of the area AR2 when maskless exposure according to the present invention is applied. FIG. 8D is a schematic diagram showing an example of a region exposed when exposed using the drawing data shown in FIG. 8C and a resist pattern obtained by development after exposure. FIG. 8E is a schematic diagram showing a relationship between an example of the shape of a pixel electrode formed by etching using the resist pattern shown in FIG. 8D and layout data.
FIG. 8F is a schematic diagram illustrating an example of layout data and drawing data of the area AR3 in FIG. FIG. 8G is a schematic diagram showing an example of a region exposed when exposed using the drawing data shown in FIG. 8F and a resist pattern obtained by development after exposure. FIG. 8H is a schematic diagram showing a relationship between an example of the shape of a pixel electrode formed by etching using the resist pattern shown in FIG. 8G and layout data.

  Turning back to the case where the TFT substrate 1 having the comb-shaped pixel electrode 15 as shown in FIG. 1A is manufactured by multi-chamfering, the u-axis direction and the v-axis direction of the mother glass 23 The relationship between the TFT substrate 1 with respect to the x-axis direction and the y-axis direction has the two types as described above. That is, there are a case where the x-axis direction of the TFT substrate 1 is parallel to the u-axis direction of the mother glass and a case where the x-axis direction of the TFT substrate 1 is parallel to the v-axis direction of the mother glass.

  In the tooth 15T of the pixel electrode 15 shown in FIG. 1A, the angle formed with the x-axis direction of the TFT substrate 1 is smaller than the angle formed with the y-axis direction. Further, an acute-angled protrusion shape having a side parallel to the y-axis direction of the TFT substrate 1 is provided at the end of the tooth 15T.

  Therefore, when the TFT substrate 1 having the comb-shaped pixel electrode 15 as shown in FIG. 1A is manufactured by multi-chamfering, it is desired to apply the maskless exposure according to the present invention as shown in FIG. As shown in (a), the x-axis direction of the TFT substrate 1 is parallel to the v-axis direction of the mother glass 23.

  When the exposure performed in the process of forming the pixel electrode 15 is performed by conventional maskless exposure using a positive photosensitive resist, the relationship between the layout data and the drawing data for the area AR2 shown in FIG. For example, the relationship is as shown in FIG. In FIG. 8B, the bold line is a pattern in the layout data.

  That is, in the case of conventional maskless exposure, the drawing data around the acute-angled protrusion shape at the end of the tooth 15T of the pixel electrode 15 is an area that is not irradiated with light (white background) due to the influence of the minimum dimension that can be set. Cannot be changed step by step along the layout data. Therefore, in the pattern obtained by developing after exposure using the drawing data, the shape of the end of the tooth 15T of the pixel electrode 15 does not become an acute angle.

  On the other hand, in the manufacturing method of the liquid crystal display panel (TFT substrate) of the present embodiment, the relationship between the layout data and the drawing data for the area AR2 is, for example, as shown in FIG. In FIG. 8C, the bold line is the pattern in the layout data. Further, the drawing data shown in FIG. 8C is a region where the portion with the dot pattern is designated to emit light, and the relationship between the density of the dot pattern and the exposure amount is shown in FIG. It is as shown in the table at the bottom of c).

  That is, the drawing data in the vicinity of the acute-shaped protrusion shape at the end of the tooth 15T of the pixel electrode 15 shifts a region where light is not irradiated (white background region) stepwise in the −v direction and irradiates light. The amount of exposure in the area to be increased is increased step by step. At this time, just looking at the relationship between the layout data and the drawing data, the drawing data around the acute-angled protrusion shape at the end of the tooth 15T of the pixel electrode 15 does not seem to reflect the shape in the layout data. Looks like.

  However, in the drawing data shown in FIG. 8C, the exposure amount at the tip of the protrusion shape increases stepwise. For this reason, when maskless exposure is performed using the drawing data, for example, as shown in FIG. 8D, the non-photosensitive region at the tip end portion of the protrusion shape gradually decreases. Therefore, the resist pattern obtained by developing after the exposure has an acute-angled projection shape that gradually decreases as shown by the thick line shown in FIG. Note that the drawing data shown in FIG. 8D is an area in which the portion with the dot pattern is designated to irradiate light, and the relationship between the density of the dot pattern and the exposure amount is shown in FIG. It is as shown in the table at the bottom of d). Further, the group of parallel diagonal lines shown in FIG. 8D is a region that is exposed when overexposure is performed with a specified exposure amount.

  Therefore, when a transparent conductive film (for example, an ITO film) is etched using a resist pattern obtained by development after exposure by maskless exposure according to the present invention, as shown in FIG. A substantially acute-shaped protrusion shape is formed at the end of the 15 teeth 15T. That is, a shape having a portion whose dimension in the v-axis direction is smaller than the minimum dimension that can be set in the drawing data is formed at the end of the tooth 15T of the pixel electrode 15. The broken lines and dotted lines shown in FIG. 8E are a pattern in the layout data and a resist pattern obtained after development, respectively.

  At this time, as in the area AR3 shown in FIG. 8A, the relationship between the layout data and the drawing data in the part forming the obtuse angle shape constituted by two sides is, for example, FIG. ). In FIG. 8F, the bold line is a pattern in the layout data. Further, the drawing data shown in FIG. 8F is an area designated so that a portion with a dot pattern is irradiated with light.

  That is, when the relationship between the two sides constituting the obtuse angle is a relationship in which both the exposed part and the unexposed part become obtuse angles, the boundary between the unexposed area and the exposed area is shifted step by step. The boundary can be set along the layout data. On the other hand, if the relationship between the two sides constituting the obtuse angle is a relationship where the exposed part is an acute angle and the non-exposed part is an obtuse angle, the area to be exposed is at the acute angle end of the exposed part of the drawing data. Cannot be set.

  Therefore, when maskless exposure is performed using the drawing data, a pattern obtained by development after exposure has a shape as shown by a thick line in FIG. 8G, for example. That is, the relationship between the two sides constituting the obtuse angle is such that both the exposed part and the unexposed part have an obtuse angle and have substantially the same shape as the layout data. On the other hand, when the relationship between the two sides constituting the obtuse angle is such that the exposed portion is an acute angle and the unexposed portion is an obtuse angle, no acute notch is formed.

  Therefore, when a transparent conductive film (for example, an ITO film) is etched using a resist pattern obtained by development after exposure by maskless exposure according to the present invention, as shown in FIG. The notch at the joint between the end of the portion corresponding to the tooth and the portion connecting the plurality of teeth has a large deviation from the layout data. The broken line and the dotted line shown in FIG. 8H are a pattern in the layout data and a resist pattern obtained after development, respectively.

  That is, when the maskless exposure according to the present invention is used for the exposure performed in the process of forming the comb-shaped pixel electrode 15, when the photosensitive resist 26 is a positive type, the acute angle shape in the pattern remaining after development, With the acute angle shape in the removed pattern to be removed, the acute angle shape in the pattern remaining after development is a better shape reflecting the layout data.

  As described above, according to the manufacturing method of the liquid crystal display panel (TFT substrate) of the present embodiment, when the comb-shaped pixel electrode 15 is formed, the layout data is applied to the ends of the teeth 15T of the pixel electrode 15. A substantially acute-angled projection shape reflecting the above can be formed. Therefore, the manufacturing method of the liquid crystal display panel (TFT substrate 1) of the present embodiment is such that the shape of the end of the tooth 15T of the pixel electrode 15 when the comb-shaped pixel electrode 15 is formed using maskless exposure. Defects can be reduced.

  In addition, the liquid crystal display panel of the present embodiment has an imposition method in multi-chamfering, that is, a direction in which the exposure region ER moves in the first operation in maskless exposure, and a direction of an edge forming an acute angle in the layout data. Regardless of the relationship, sharp-angled protrusions can be formed at the ends of the portions corresponding to the teeth of the comb-shaped pixel electrode. For this reason, the liquid crystal display panel of this embodiment prevents display quality deterioration (for example, reduction in transmittance) due to disorder of the orientation of the liquid crystal layer 3 caused by external pressure at the pixel electrode 15 regardless of the substrate size. be able to.

  The present invention has been specifically described above based on the above-described embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. is there.

  For example, in the embodiment, as an example of the planar shape of the comb-shaped pixel electrode 15, as shown in FIG. 1A, the portion corresponding to the tooth is in the x-axis direction (scanning signal line) of the TFT substrate 1. The shape provided so that the angle formed with the extending direction of 7) becomes smaller. However, the present invention is not limited to this, and the shape is such that the angle formed by the tooth 15T of the pixel electrode 15 and the y-axis direction (the direction in which the video signal line 10 extends) of the TFT substrate 1 becomes smaller. Of course, it is applicable.

In the above embodiment, and the standard exposure quantity, as an example of more exposure than the standard exposure ^{quantity, 50mJ / cm 2, 72mJ /} cm 2, 96mJ / cm 2, and has been given a 120 mJ / cm ^2, Of course, the combination of exposure amounts is not limited to this, and can be changed as appropriate. At this time, the exposure amount larger than the standard exposure amount is not limited to three, and may be one, two, or four or more.

  In the above embodiment, as shown in FIG. 1B, the common electrode 13 and the pixel electrode 15 are stacked with the third insulating layer 14 interposed therebetween. However, the present invention is not limited to this, and it is needless to say that the present invention can be applied even when the common electrode 13 and the pixel electrode 15 are arranged on the same surface of the insulating layer.

  Moreover, in the said Example, the shape which bent the edge of the tooth | gear 15T is mentioned as an example of the planar shape of the pixel electrode 15 of a comb-tooth shape, as shown to Fig.1 (a). However, the present invention is not limited to this and can be applied regardless of the shape of the end of the tooth 15T.

  Moreover, in the said Example, the exposure in the process of forming the comb-tooth-shaped pixel electrode 15 is mentioned as an example of maskless exposure. However, the present invention is not limited to this, and can of course be applied to exposure in a process of forming another conductive layer or semiconductor layer.

  Moreover, in the said Example, the case where the positive photosensitive resist 26 is exposed as an example of maskless exposure is mentioned. However, the present invention is not limited to this, and can be applied to the exposure of a negative photosensitive resist.

DESCRIPTION OF SYMBOLS 1 TFT substrate 2 Opposite substrate 3 Liquid crystal layer 4 1st polarizing plate 5 2nd polarizing plate 6 1st insulating substrate 7 Scanning signal line 8 1st insulating layer 9 Semiconductor layer (TFT element) 10 Video signal line 11 First source-drain electrode 12 Second insulating layer 13 Common electrode 14 Third insulating layer 15 Pixel electrode 15T (Pixel electrode) 16 First alignment film 17 Second insulating substrate 18 Black matrix 19 Color filter 20 planarization layer 21 second alignment film 22 lines of electric force 23 mother glass 24 spatial light modulation element 24a irradiation control element 25 transparent conductive film 26 photosensitive resist

Claims (8)

The process of exposing and developing the photosensitive resist is performed a plurality of times, and at least one of the plurality of the processes is performed based on layout data prepared in advance. A method of manufacturing a liquid crystal display panel performed by an exposure apparatus having a spatial light modulation element that generates a pattern of light irradiated to the photosensitive resist by numerical control using the created drawing data,
The exposure of the photosensitive resist performed by the exposure apparatus having the spatial light modulator is such that the size of the region that can be exposed at one time is smaller than the exposure target region of the photosensitive resist,
A first operation for performing exposure while moving the region that can be exposed at a time in a first direction of the exposure target region; and a first operation for moving the region that can be exposed at a time in a direction orthogonal to the first direction. Repeat the operation of 2 to expose the entire exposure target area,
The drawing data is numerical data in which a position and an exposure amount of a region to be irradiated with light in the exposure target region are designated,
The position of the region to which the light is irradiated in the drawing data is such that the minimum value that can be specified as the dimension in the first direction is larger than the minimum value that can be specified as the dimension in the second direction,
The exposure amount of the drawing data is designated as either a standard exposure amount necessary and sufficient for exposing the photosensitive resist or an exposure amount greater than the standard exposure amount,
Of the region designated to irradiate the light in the drawing data, a portion exposed at the standard exposure amount around the boundary with the region not irradiated with light, and an exposure amount larger than the standard exposure amount A method for producing a liquid crystal display panel, characterized in that there is a portion exposed in step (b).   2. The method of manufacturing a liquid crystal display panel according to claim 1, wherein there are two or more exposure amounts larger than the standard exposure amount.   The exposure of the photosensitive resist performed by the exposure apparatus having the spatial light modulator is a pattern in which the layout data used for exposure is an acute angle pattern in a process of exposing and developing the photosensitive resist a plurality of times. 2. The liquid crystal display panel according to claim 1, wherein one of two sides constituting the acute angle pattern is substantially parallel to the second direction. Method. The exposure of the photosensitive resist performed by the exposure apparatus having the spatial light modulation element is performed when the photosensitive resist is exposed in a process of forming a comb-shaped pixel electrode by etching the transparent conductive film,
The layout data used for the exposure has an acute projection pattern at the end of the portion corresponding to the teeth of the pixel electrode, and one of the two sides constituting the acute projection pattern is the side. The method for manufacturing a liquid crystal display panel according to claim 1, wherein the liquid crystal display panel is substantially parallel to the second direction. A liquid crystal display device having a display area in which pixels having comb-shaped pixel electrodes are arranged in a matrix,
2. The liquid crystal display device according to claim 1, wherein the pixel electrode has a substantially acute-angled protrusion shape whose dimension changes stepwise at an end corresponding to a tooth.   6. The projection shape according to claim 5, wherein one side of the two sides constituting the acute angle is substantially parallel to a direction in which portions corresponding to the teeth of the pixel electrode are arranged. Liquid crystal display device. A liquid crystal display device having a display area in which pixels having comb-shaped pixel electrodes are arranged in a matrix,
2. The liquid crystal display device according to claim 1, wherein the pixel electrode has a substantially acute cutout shape whose dimensions change stepwise at the end corresponding to the tooth.   8. The cutout shape according to claim 7, wherein one of two sides constituting the acute angle is substantially parallel to a direction in which portions corresponding to the teeth of the pixel electrode are arranged. Liquid crystal display device.

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