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JP2011077214A - Led lamp - Google Patents

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JP2011077214A
JP2011077214A JP2009225733A JP2009225733A JP2011077214A JP 2011077214 A JP2011077214 A JP 2011077214A JP 2009225733 A JP2009225733 A JP 2009225733A JP 2009225733 A JP2009225733 A JP 2009225733A JP 2011077214 A JP2011077214 A JP 2011077214A
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Prior art keywords
led lamp
hollow envelope
phosphor layer
visible light
led chip
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Akihiro Kato
陽弘 加藤
Akihito Raikubo
彰人 雷久保
Masaharu Wakatsuki
雅晴 若月
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Okaya Electric Industry Co Ltd
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Okaya Electric Industry Co Ltd
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Priority to JP2009225733A priority Critical patent/JP2011077214A/en
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    • H10W72/536
    • H10W72/5363
    • H10W90/756

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Abstract

【課題】前方向だけでなく側方向や後方向からも視認できる広視野角であると共に光度が高く、尚且つ、側方向や後方向に比べて前方向の光度を高めたLEDランプを実現する。
【解決手段】LEDチップ28を略リング状の枠体22で囲繞すると共に、該枠体22上にLEDチップ28を覆う先端に凸レンズ部33を有するドーム型と成された透光性の中空外囲体32を配置して成り、上記中空外囲体32の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成したLEDランプ10。
【選択図】図1
To realize an LED lamp having a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction, high luminous intensity, and higher luminous intensity in the forward direction compared to the side direction and the rear direction. .
An LED chip 28 is surrounded by a substantially ring-shaped frame body 22, and a light-transmitting hollow outer space formed into a dome shape having a convex lens portion 33 at the tip covering the LED chip 28 on the frame body 22. An LED lamp 10 having a phosphor layer 34 formed by arranging an enclosure 32 and converting the light emitted from the LED chip 28 into visible light having a predetermined wavelength and radiating it over the entire inner surface of the hollow envelope 32.
[Selection] Figure 1

Description

この発明はLEDランプ(発光ダイオードランプ)に係り、特に、前方向だけでなく側方向や後方向からも視認できる広視野角であると共に光度が高く、尚且つ、側方向や後方向に比べて前方向の光度を高めたLEDランプに関する。   The present invention relates to an LED lamp (light-emitting diode lamp), and in particular, has a wide viewing angle that can be seen not only from the front direction but also from the side direction and the rear direction, and has a high luminous intensity, and compared to the side direction and the rear direction The present invention relates to an LED lamp with increased forward luminous intensity.

近年、白熱電球や蛍光灯等に替わる照明用光源として、低消費電力で長寿命なLED(Light Emitting Diode)ランプが注目されている。
従来の一般的なLEDランプは、LEDチップを樹脂等より成る砲弾型の透光性外囲体で覆った構造となっているが、この構造では透光性外囲体の先端部に凸レンズが形成されるため、前方向への光の出射量が多く明るく発光するものの、側方向や後方向へは光が殆ど出射せず、視野角が狭かった。
2. Description of the Related Art In recent years, LED (Light Emitting Diode) lamps with low power consumption and long life are attracting attention as illumination light sources that replace incandescent bulbs and fluorescent lamps.
A conventional general LED lamp has a structure in which an LED chip is covered with a shell-type translucent envelope made of resin or the like. In this structure, a convex lens is provided at the tip of the translucent envelope. As a result, the amount of light emitted in the forward direction is large and the light is emitted brightly, but light is hardly emitted in the lateral direction and the backward direction, and the viewing angle is narrow.

このため、例えば、特許文献1においては、LEDチップを覆う透光性外囲体の表面に、球面状又は多角形状のビーズ、突起又は凹部を設け、LEDチップからの光を上記ビーズ、突起又は凹部で多方向に拡散させることにより、前方向だけでなく、側方向や後方向からも光を視認できるLEDランプが提案されている。
特開2000−4050号公報
For this reason, for example, in Patent Document 1, spherical or polygonal beads, protrusions, or recesses are provided on the surface of the translucent envelope that covers the LED chip, and light from the LED chip is transmitted to the beads, protrusions, or There has been proposed an LED lamp in which light can be visually recognized not only from the front direction but also from the side direction and the rear direction by diffusing in multiple directions with the concave portions.
Japanese Patent Laid-Open No. 2000-4050

しかしながら、特許文献1で提案されたLEDランプは、発光源であるLEDチップから発光された光を拡散させて多方向へ放射するものであるため、光が拡散することによる光度低下の問題を生じていた。このため、広視野角でありながら、光度の高いLEDランプの実現が望まれていた。
尚、LEDランプは、主として前方向の対象物に対して光を照射するものとして用いられることが多いため、広視野角な場合でも、側方向や後方向に比べて前方向の光度の高いものが望まれている。
However, the LED lamp proposed in Patent Document 1 diffuses the light emitted from the LED chip, which is a light source, and radiates it in multiple directions, which causes a problem of a decrease in luminous intensity due to the diffusion of light. It was. For this reason, it has been desired to realize an LED lamp having a high luminous intensity while having a wide viewing angle.
Note that LED lamps are often used mainly to irradiate light on an object in the forward direction, and therefore have a higher forward luminous intensity than in the lateral direction and the backward direction even when the viewing angle is wide. Is desired.

本発明は、上記従来の問題点に鑑みてなされたものであり、その目的は、前方向だけでなく側方向や後方向からも視認できる広視野角であると共に光度が高く、尚且つ、側方向や後方向に比べて前方向の光度を高めたLEDランプを実現することにある。   The present invention has been made in view of the above-described conventional problems, and the object thereof is a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction, has a high luminous intensity, and has a side. The object is to realize an LED lamp in which the luminous intensity in the forward direction is increased compared to the direction and the backward direction.

上記の目的を達成するため、本発明の請求項1に記載のLEDランプは、
LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の先端に凸レンズ部を形成すると共に、上記中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成したことを特徴とする。
In order to achieve the above object, an LED lamp according to claim 1 of the present invention comprises:
An LED lamp comprising an LED chip and a light-transmitting hollow envelope covering the LED chip, wherein a convex lens portion is formed at a tip of the hollow envelope, and the entire inner surface of the hollow envelope is formed. The phosphor layer for converting the light emitted from the LED chip into visible light having a predetermined wavelength and emitting the same is formed.

本発明の請求項2に記載のLEDランプは、請求項1に記載のLEDランプにおいて、
上記凸レンズ部が、中空外囲体の先端の肉厚を最大とすると共に、先端から周縁に向かって漸次薄肉となる球面状と成すことによって形成されていることを特徴とする。
The LED lamp according to claim 2 of the present invention is the LED lamp according to claim 1,
The convex lens portion is formed by maximizing the thickness of the tip of the hollow envelope and forming a spherical shape that gradually becomes thinner from the tip toward the periphery.

本発明の請求項3に記載のLEDランプは、
LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の先端内面に、透光材を接合して凸レンズ部を形成すると共に、上記透光材が接合された部分以外の中空外囲体の内面全域及び透光材の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成したことを特徴とする。
The LED lamp according to claim 3 of the present invention is
An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, and a convex lens portion is formed by bonding a translucent material to the inner surface of the tip of the hollow envelope, A phosphor layer that converts the emitted light of the LED chip into visible light of a predetermined wavelength and radiates it on the entire inner surface of the hollow envelope other than the portion where the light transmitting material is joined and the entire inner surface of the light transmitting material. It is characterized by.

本発明の請求項4に記載のLEDランプは、
LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成し、また、中空外囲体の先端位置の上記蛍光体層の肉厚が最大となる共に、中空外囲体の先端位置から周縁位置に向かって蛍光体層の肉厚が漸次薄肉となる球面状と成すことによって、上記中空外囲体の先端に凸レンズ部を形成したことを特徴とする。
The LED lamp according to claim 4 of the present invention is
An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, wherein the light emitted from the LED chip is converted into visible light having a predetermined wavelength over the entire inner surface of the hollow envelope. The phosphor layer is formed, and the thickness of the phosphor layer at the tip position of the hollow envelope is maximized, and the thickness of the phosphor layer is increased from the tip position of the hollow envelope toward the peripheral position. A convex lens portion is formed at the tip of the hollow envelope by forming a spherical surface with a gradually decreasing thickness.

本発明の請求項1又は2に記載のLEDランプにあっては、LEDチップを覆う透光性の中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成しており、蛍光体層で波長変換された可視光は様々な方向へ放射されるので、中空外囲体の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、可視光の発光源である蛍光体層を中空外囲体の内面に形成したので、可視光が出射する中空外囲体の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、LEDチップを覆う中空外囲体の先端に凸レンズ部を形成したことから、中空外囲体の先端内面の蛍光体層から放射される可視光、及び、中空外囲体先端方向へ向かう可視光が、上記凸レンズ部で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
In the LED lamp according to claim 1 or 2 of the present invention, the light emitted from the LED chip is converted into visible light having a predetermined wavelength and radiated over the entire inner surface of the translucent hollow envelope covering the LED chip. Visible light that has been wavelength-converted by the phosphor layer is emitted in various directions, so that visible light is emitted in various directions from the entire surface of the hollow envelope. It is possible to realize an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction.
Moreover, since the phosphor layer, which is a visible light source, is formed on the inner surface of the hollow envelope, the light source exists near the surface of the hollow envelope from which visible light is emitted, and the LED has a high luminous intensity. A lamp is realized.
Further, since the convex lens portion is formed at the tip of the hollow envelope that covers the LED chip, visible light emitted from the phosphor layer on the inner surface of the tip of the hollow envelope and visible toward the tip of the hollow envelope. Since the light is condensed by the convex lens part and emitted in the forward direction, an LED lamp having a higher luminous intensity in the forward direction than in the lateral direction and the backward direction is realized.

本発明の請求項3に記載のLEDランプにあっては、透光材が接合された部分以外の中空外囲体の内面全域及び透光材の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成しており、蛍光体層で波長変換された可視光は様々な方向へ放射されるので、中空外囲体の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、可視光の発光源である蛍光体層を中空外囲体の内面及び凸レンズ部を構成する透光材の内面に形成したので、可視光が出射する中空外囲体の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、LEDチップを覆う中空外囲体の先端に凸レンズ部を形成したことから、中空外囲体の先端内面に接合した透光材内面の蛍光体層から放射される可視光、及び、中空外囲体先端方向へ向かう可視光が、上記凸レンズ部で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
In the LED lamp according to claim 3 of the present invention, the LED chip emits light of a predetermined wavelength over the entire inner surface of the hollow envelope and the entire inner surface of the translucent material other than the portion where the translucent material is joined. A phosphor layer that converts and emits visible light is formed, and visible light that has been wavelength-converted by the phosphor layer is emitted in various directions, so that visible light varies from the entire surface of the hollow envelope. The LED lamp having a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the phosphor layer, which is a visible light emission source, is formed on the inner surface of the hollow envelope and the inner surface of the translucent material constituting the convex lens portion, the emission source is located near the surface of the hollow envelope from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Further, since the convex lens portion is formed at the tip of the hollow envelope that covers the LED chip, visible light emitted from the phosphor layer on the inner surface of the transparent material joined to the tip inner surface of the hollow envelope, and the hollow outer Visible light traveling toward the front end of the enclosure is condensed by the convex lens portion and emitted forward, so that an LED lamp having a higher luminous intensity in the front direction than in the lateral direction and the rear direction is realized.

本発明の請求項4に記載のLEDランプにあっては、LEDチップを覆う透光性の中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成しており、蛍光体層で波長変換された可視光は様々な方向へ放射されるので、中空外囲体の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、可視光の発光源である蛍光体層を中空外囲体の内面に形成したので、可視光が出射する中空外囲体の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、LEDチップを覆う中空外囲体の先端に凸レンズ部を形成したことから、中空外囲体の先端内面の蛍光体層から放射される可視光、及び、中空外囲体先端方向へ向かう可視光が、上記凸レンズ部で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。しかも、上記凸レンズ部を蛍光体層で構成した結果、凸レンズ部からも可視光を放射できるので、高光度の可視光を前方向へ出射することができる。
In the LED lamp according to claim 4 of the present invention, the fluorescence emitted by converting the light emitted from the LED chip into visible light having a predetermined wavelength is emitted over the entire inner surface of the translucent hollow envelope covering the LED chip. Since the visible light that has undergone wavelength conversion in the phosphor layer is emitted in various directions, visible light is emitted in various directions from the entire surface of the hollow envelope. A wide viewing angle LED lamp that can be viewed not only in the direction but also in the lateral direction and the rear direction can be realized.
Moreover, since the phosphor layer, which is a visible light source, is formed on the inner surface of the hollow envelope, the light source exists near the surface of the hollow envelope from which visible light is emitted, and the LED has a high luminous intensity. A lamp is realized.
Further, since the convex lens portion is formed at the tip of the hollow envelope that covers the LED chip, visible light emitted from the phosphor layer on the inner surface of the tip of the hollow envelope and visible toward the tip of the hollow envelope. Since the light is condensed by the convex lens part and emitted in the forward direction, an LED lamp having a higher luminous intensity in the forward direction than in the lateral direction and the backward direction is realized. In addition, as a result of forming the convex lens portion with the phosphor layer, visible light can be emitted from the convex lens portion, and thus high-luminance visible light can be emitted in the forward direction.

以下、図面に基づき、本発明に係るLEDランプの実施形態を説明する。
本発明に係る第1のLEDランプ10は図1及び図2に示すように、LED素子12と、枠部材14と、放熱部材16を備え、これらを一体化して構成されている。図1において、18は高熱伝導性絶縁接着材であり、該高熱伝導性絶縁接着材18を介してLED素子12と放熱部材16とが接続されている。該高熱伝導性絶縁接着材18の厚さは20〜30μmと成されている。
Hereinafter, embodiments of an LED lamp according to the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the first LED lamp 10 according to the present invention includes an LED element 12, a frame member 14, and a heat radiating member 16, and these are integrated. In FIG. 1, reference numeral 18 denotes a high heat conductive insulating adhesive, and the LED element 12 and the heat radiating member 16 are connected via the high heat conductive insulating adhesive 18. The high thermal conductive insulating adhesive 18 has a thickness of 20 to 30 μm.

LED素子12は、図3及び図4に示すように、樹脂等より成り、孔20が形成された略リング状の枠体22と、第1のリードフレーム24及び第2のリードフレーム26を有している。これらリードフレーム24,26の板厚は0.3mm程度と成されている。
第1のリードフレーム24は、上記枠体22の底面22aの略全面を覆う略円板状の先端部24aと、枠体22を貫通して外方へ向かって水平方向に取り出される後端部24bを有している。
第1のリードフレーム24の先端部24aの一部は上記孔20内に露出しており、該孔16内に露出した第1のリードフレーム24の先端部24aに、LEDチップ28をダイボンドすることにより、第1のリードフレーム24とLEDチップ28底面の一方の電極(図示せず)とを電気的に接続している。この結果、LEDチップ28は、略リング状の枠体22で囲繞されることとなる。
また、第2のリードフレーム26は、上記枠体22を貫通して孔20内に露出する先端部26aと、枠体22の外方へ向かって水平方向に取り出されている後端部26bを有しており、第2のリードフレーム26の先端部26aと、上記LEDチップ28上面の他方の電極(図示せず)とをボンディングワイヤ30を介して電気的に接続して成る。
As shown in FIGS. 3 and 4, the LED element 12 includes a substantially ring-shaped frame 22 made of resin or the like and having a hole 20, and a first lead frame 24 and a second lead frame 26. is doing. The lead frames 24 and 26 have a thickness of about 0.3 mm.
The first lead frame 24 includes a substantially disc-shaped front end portion 24a that covers substantially the entire bottom surface 22a of the frame body 22, and a rear end portion that passes through the frame body 22 and is taken out in the horizontal direction. 24b.
A part of the tip 24a of the first lead frame 24 is exposed in the hole 20, and the LED chip 28 is die-bonded to the tip 24a of the first lead frame 24 exposed in the hole 16. Thus, the first lead frame 24 and one electrode (not shown) on the bottom surface of the LED chip 28 are electrically connected. As a result, the LED chip 28 is surrounded by the substantially ring-shaped frame 22.
The second lead frame 26 includes a front end portion 26a that penetrates the frame body 22 and is exposed in the hole 20, and a rear end portion 26b that is taken out in the horizontal direction toward the outside of the frame body 22. And is formed by electrically connecting the tip end portion 26a of the second lead frame 26 and the other electrode (not shown) on the upper surface of the LED chip 28 via a bonding wire 30.

上記第1のリードフレーム24の先端部24aと、第2のリードフレーム26の先端部26aは、上下方向に所定の間隙を設けて対向配置されることにより、相互に絶縁されている。
而して、第1のLEDランプ10にあっては、第1のリードフレーム24の先端部24aと、第2のリードフレーム26の先端部26aを同一平面上に配置せず、上下方向に所定の間隙を設けて対向配置したことにより、第1のリードフレーム24の先端部24で枠体22の底面22aの略全面を覆っても、第1のリードフレーム24と第2のリードフレーム26間の絶縁性を確保できるのである。
The distal end portion 24a of the first lead frame 24 and the distal end portion 26a of the second lead frame 26 are insulated from each other by being arranged to face each other with a predetermined gap in the vertical direction.
Thus, in the first LED lamp 10, the front end portion 24a of the first lead frame 24 and the front end portion 26a of the second lead frame 26 are not arranged on the same plane, and are predetermined in the vertical direction. Since the front end portion 24 of the first lead frame 24 covers the substantially entire bottom surface 22a of the frame body 22, the gap between the first lead frame 24 and the second lead frame 26 is provided. Insulating properties can be secured.

上記LEDチップ28は、電圧が印加されると、後述する蛍光体を励起する紫外線や青色可視光等の所定波長の光を発光し、例えば、窒化ガリウム系半導体結晶で構成されている。   When a voltage is applied, the LED chip 28 emits light of a predetermined wavelength such as ultraviolet light or blue visible light that excites a phosphor described later, and is made of, for example, a gallium nitride based semiconductor crystal.

図1及び図3において、32は、先端に凸レンズ部33を有するドーム型と成された透光性の中空外囲体であり、該中空外囲体32をLED素子12の枠体22上に配置することにより、LEDチップ28を覆っている。
上記中空外囲体32は、例えば、透光性ガラスや、アクリル、ポリカーボネート、エポキシ等の透光性樹脂で構成することができる。尚、無機材料であるガラスで中空外囲体32を構成した場合には、無機材料はLEDチップ28から発光される紫外線等の高エネルギーの短波長光を殆ど吸収せず、また、短波長光を吸収したとしても分子結合力が強いため劣化することが殆どないため、耐久性に優れている。
上記凸レンズ部33は、中空外囲体32の先端の肉厚を最大とすると共に、先端から周縁に向かって漸次薄肉となる球面状と成すことによって形成されている。
In FIG. 1 and FIG. 3, 32 is a translucent hollow envelope formed in a dome shape having a convex lens portion 33 at the tip, and the hollow envelope 32 is placed on the frame 22 of the LED element 12. By disposing, the LED chip 28 is covered.
The hollow envelope 32 can be made of, for example, translucent glass, translucent resin such as acrylic, polycarbonate, or epoxy. When the hollow envelope 32 is made of glass, which is an inorganic material, the inorganic material hardly absorbs high-energy short-wavelength light such as ultraviolet rays emitted from the LED chip 28, and short-wavelength light Even if it absorbs, since the molecular bonding force is strong, it hardly deteriorates, so it has excellent durability.
The convex lens portion 33 is formed by maximizing the thickness of the tip of the hollow envelope 32 and forming a spherical surface that gradually becomes thinner from the tip toward the periphery.

また、上記中空外囲体32の内面全域に蛍光体層34が形成されている。この蛍光体層34は、LEDチップ28から発光される紫外線や青色可視光等の光を、所定波長の可視光に変換して放射するものである。
上記蛍光体層34を構成する蛍光体としては、例えば以下の組成のものを用いることができる。
紫外線を赤色可視光に変換する赤色発光用の蛍光体として、MS:Eu(Mは、La、Gd、Yの何れか1種)、0.5MgF・3.5MgO・GeO:Mn、2MgO・2LiO・Sb:Mn、Y(P,V)O4:Eu、YVO4:Eu、(Sr,Mg)3(PO4):Sn、Y:Eu、CaSiO:Pb,Mn等がある。
また、紫外線を緑色可視光に変換する緑色発光用の蛍光体として、BaMgAl1627:Eu,Mn、ZnSiO4:Mn、(Ce,Tb,Mn)MgAl1119、LaPO4:Ce,Tb、(Ce,Tb)MgAl1119、YSiO:Ce,Tb、ZnS:Cu,Al、ZnS:Cu,Au,Al、(Zn,Cd)S:Cu,Al、SrAl:Eu、SrAl:Eu,Dy、SrAl1425:Eu,Dy、YAl12:Tb、Y(Al,Ga)12:Tb、YAl12:Ce、Y(Al,Ga)12:Ce等がある。
更に、紫外線を青色可視光に変換する青色発光用の蛍光体として、(SrCaBa)(PO)Cl:Eu、BaMgAl1627:Eu、(Sr,Mg)7:Eu、Sr7:Eu、Sr:Sn、Sr(PO4Cl:Eu、BaMgAl1627:Eu、CaWO4、CaWO4:Pb、ZnS:Ag,Cl、ZnS:Ag,Al、(Sr,Ca,Mg)10(PO)Cl:Eu等がある。
また、青色可視光を発光するLEDチップを光源に用いて白色光を得る場合等において、LEDチップから放射される青色可視光を緑色可視光に変換する緑色発光用の蛍光体16として、Y(Al,Ga)12:Ce、SrGa:Eu、CaScSi12:Ce、α−SiAlON:Eu、β−SiAlON:Eu等がある。
さらに、青色可視光を発光するLEDチップを光源に用いた場合等において、LEDチップから放射される青色可視光を赤色可視光に変換する赤色発光用の蛍光体16として、(Sr,Ca)S:Eu、(Ca,Sr)Si:Eu、CaSiN:Eu、CaAlSiN:Eu等がある。
上記赤色発光用の蛍光体、緑色発光用の蛍光体、青色発光用の蛍光体を適宜選択・混合して用いることで、種々の色の発色が可能である。
尚、蛍光体層34を構成する蛍光体は、有機、無機の蛍光染料や、有機、無機の蛍光顔料を含むものである。
A phosphor layer 34 is formed on the entire inner surface of the hollow envelope 32. The phosphor layer 34 emits light such as ultraviolet light or blue visible light emitted from the LED chip 28 by converting it into visible light having a predetermined wavelength.
As the phosphor constituting the phosphor layer 34, for example, one having the following composition can be used.
As a phosphor for red light emission that converts ultraviolet light into red visible light, M 2 O 2 S: Eu (M is any one of La, Gd, and Y), 0.5 MgF 2 .3.5MgO.GeO 2 : Mn , 2MgO · 2LiO 2 · Sb 2 O 3 : Mn, Y (P, V) O 4 : Eu, YVO 4 : Eu, (Sr, Mg) 3 (PO 4 ): Sn, Y 2 O 3 : Eu, CaSiO 3 : Pb, Mn, etc.
Further, as a phosphor for green emission for converting ultraviolet light to green visible light, BaMg 2 Al 16 O 27: Eu, Mn, Zn 2 SiO 4: Mn, (Ce, Tb, Mn) MgAl 11 O 19, LaPO 4 : Ce, Tb, (Ce, Tb) MgAl 11 O 19, Y 2 SiO 5: Ce, Tb, ZnS: Cu, Al, ZnS: Cu, Au, Al, (Zn, Cd) S: Cu, Al, SrAl 2 O 4 : Eu, SrAl 2 O 4 : Eu, Dy, Sr 4 Al 14 O 25 : Eu, Dy, Y 3 Al 5 O 12 : Tb, Y 3 (Al, Ga) 5 O 12 : Tb, Y 3 Al 5 O 12 : Ce, Y 3 (Al, Ga) 5 O 12 : Ce, and the like.
Further, as a phosphor for blue light emission that converts ultraviolet light into blue visible light, (SrCaBa) 5 (PO 4 ) 3 Cl: Eu, BaMg 2 Al 16 O 27 : Eu, (Sr, Mg) 2 P 2 O 7 : Eu, Sr 2 P 2 O 7: Eu, Sr 2 P 2 O 7: Sn, Sr 5 (PO 4) 3 Cl: Eu, BaMg 2 Al 16 O 27: Eu, CaWO 4, CaWO 4: Pb, ZnS : Ag, Cl, ZnS: Ag, Al, (Sr, Ca, Mg) 10 (PO 4 ) 6 Cl 2 : Eu and the like.
Further, when white light is obtained using an LED chip that emits blue visible light as a light source, Y 3 is used as the green light emitting phosphor 16 that converts blue visible light emitted from the LED chip into green visible light. (Al, Ga) 5 O 12 : Ce, SrGa 2 S 4 : Eu, Ca 3 Sc 2 Si 3 O 12 : Ce, α-SiAlON: Eu, β-SiAlON: Eu, and the like.
Further, when an LED chip that emits blue visible light is used as a light source, (Sr, Ca) S is used as a red light emitting phosphor 16 that converts blue visible light emitted from the LED chip into red visible light. : Eu, (Ca, Sr) 2 Si 5 N 8 : Eu, CaSiN 2 : Eu, CaAlSiN 3 : Eu, and the like.
By appropriately selecting and mixing the phosphors for red light emission, green light emission, and blue light emission, various colors can be developed.
The phosphor constituting the phosphor layer 34 includes organic and inorganic fluorescent dyes and organic and inorganic fluorescent pigments.

中空外囲体32の内面に蛍光体層34を形成するには、例えば、透光性を有する無機結合剤中に蛍光体を分散させた蛍光体分散液を中空外囲体32内面に塗着させた後、焼成すれば良い。
無機結合剤としては、例えば、アルカリシリケート結合物、エチルシリケート結合物、アルコキシラン結合物、有機官能基を部分的に導入したアルコキシラン結合物及び有機ポリマーを反応させたアルコキシラン結合物等の無機結合材やハイブリッド系無機結合材を好適に用いることができる。
In order to form the phosphor layer 34 on the inner surface of the hollow envelope 32, for example, a phosphor dispersion liquid in which a phosphor is dispersed in a light-transmitting inorganic binder is applied to the inner surface of the hollow envelope 32. Then, firing may be performed.
Examples of the inorganic binder include inorganic substances such as an alkali silane bond, an ethyl silicate bond, an alkoxy lane bond, an alkoxy lane bond in which an organic functional group is partially introduced, and an alkoxy lane bond obtained by reacting an organic polymer. A binder or a hybrid inorganic binder can be preferably used.

図5〜図8は、放熱部材16を示すものであり、図5は正面図、図6は平面図、図7は側面図、図8は図6のB−B断面図である。
放熱部材16は、熱伝導性が良好なアルミニウム等の導電材料で構成されており、本体部36と、一対の切欠部38(図6)を有している。
5 to 8 show the heat radiating member 16. FIG. 5 is a front view, FIG. 6 is a plan view, FIG. 7 is a side view, and FIG.
The heat radiating member 16 is made of a conductive material such as aluminum having good thermal conductivity, and has a main body portion 36 and a pair of notches 38 (FIG. 6).

図9〜図11は、枠部材14を示すものであり、図9は平面図、図10は側面図、図11は図9のC−C断面図である。
枠部材14は、樹脂等の絶縁材料で構成されており、導電材料で構成された上記放熱部材16と、LED素子12の第1のリードフレーム24、第2のリードフレーム26との絶縁性を確保するために用いられるものである。
9 to 11 show the frame member 14. FIG. 9 is a plan view, FIG. 10 is a side view, and FIG. 11 is a cross-sectional view taken along the line CC in FIG.
The frame member 14 is made of an insulating material such as a resin, and provides insulation between the heat dissipation member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12. It is used to secure.

上記枠部材14は、上記LED素子12の枠体22の側周面22b(図3参照)に当接して囲繞する略リング状の本体部40と、該本体部40の下端に形成され、上記放熱部材16の切欠部38形成位置の本体部36の側周面36a(図6参照)に当接して覆う一対の垂下部42と、本体部40上端から垂下部42下端に至るまで形成された一対の切欠部44を有している。
また、上記垂下部42には、LED素子12を載置する段部46が形成されており、該段部46にLED素子12を載置した際、LED素子12の第1のリードフレーム24先端部24aと放熱部材16との間に20〜30μmの間隙が形成されるよう設計されている。
さらに、上記切欠部44の幅は、LED素子12の第1のリードフレーム24及び第2のリードフレーム26の幅と略同一と成されている。
The frame member 14 is formed at a substantially ring-shaped main body portion 40 that abuts and surrounds a side peripheral surface 22b (see FIG. 3) of the frame body 22 of the LED element 12, and a lower end of the main body portion 40. A pair of drooping portions 42 that are in contact with and cover the side peripheral surface 36a (see FIG. 6) of the main body portion 36 at the position where the cutout portion 38 of the heat radiation member 16 is formed, and formed from the upper end of the main body portion 40 to the lower end of the drooping portion 42 A pair of notches 44 is provided.
The hanging portion 42 is formed with a step portion 46 on which the LED element 12 is placed. When the LED element 12 is placed on the step portion 46, the tip of the first lead frame 24 of the LED element 12 is placed. It is designed such that a gap of 20 to 30 μm is formed between the portion 24a and the heat radiating member 16.
Further, the width of the notch 44 is substantially the same as the width of the first lead frame 24 and the second lead frame 26 of the LED element 12.

上記LED素子12、枠部材14、放熱部材16は、図12に示す要領で一体化される。すなわち、表面に高熱伝導性絶縁接着材18を20〜30μmの厚さで被着した放熱部材16に枠部材14を嵌合し、以て、放熱部材16の切欠部38形成位置の本体部側周面36aを、枠部材14の垂下部42で覆う。
次に、LED素子12を、枠部材14の垂下部42の段部46上に載置し、LED素子12の枠体22の側周面22bを、枠部材14の本体部40で囲繞することにより、LED素子12と枠部材14との嵌合を行う。
この結果、LED素子12の枠体底面の22aの略全面を覆う第1のリードフレーム先端部24aと放熱部材16とが高熱伝導性絶縁接着材18を介して接続され、上記第1のLEDランプ10が完成する。
The LED element 12, the frame member 14, and the heat radiating member 16 are integrated in the manner shown in FIG. That is, the frame member 14 is fitted to the heat radiating member 16 having a high heat conductive insulating adhesive 18 applied to the surface thereof in a thickness of 20 to 30 μm, so that the notch 38 forming position of the heat radiating member 16 on the main body side. The peripheral surface 36 a is covered with the hanging part 42 of the frame member 14.
Next, the LED element 12 is placed on the step portion 46 of the hanging portion 42 of the frame member 14, and the side peripheral surface 22 b of the frame body 22 of the LED element 12 is surrounded by the main body portion 40 of the frame member 14. Thus, the LED element 12 and the frame member 14 are fitted.
As a result, the first lead frame tip 24a covering the substantially entire surface 22a of the bottom surface of the frame of the LED element 12 and the heat radiating member 16 are connected via the high thermal conductive insulating adhesive 18, and the first LED lamp 10 is completed.

上記の通り、枠部材14の切欠部44の幅が、LED素子12の第1のリードフレーム24及び第2のリードフレーム26の幅と略同一と成されているので、第1のリードフレーム24及び第2のリードフレーム26を上記切欠部44内に挿通することにより、LED素子12と枠部材14との嵌合時の位置決めを容易に行うことができると共に、LED素子12の第1のリードフレーム24及び第2のリードフレーム26が切欠部44内でガタツキを生じることがなく、LED素子12と枠部材14とを強固に固定できる。   As described above, the width of the cutout portion 44 of the frame member 14 is substantially the same as the widths of the first lead frame 24 and the second lead frame 26 of the LED element 12. By inserting the second lead frame 26 into the notch 44, the LED element 12 and the frame member 14 can be easily positioned when fitted, and the first lead of the LED element 12 can be obtained. The frame 24 and the second lead frame 26 are not rattled in the notch 44, and the LED element 12 and the frame member 14 can be firmly fixed.

上記高熱伝導性絶縁接着材18としては、例えば、熱伝導性が良好な金属粉末を、シリコン樹脂、エポキシ樹脂、ポリイミド樹脂等の樹脂中に混合して成る高熱伝導性樹脂が該当する。
尚、高熱伝導性絶縁接着材18の厚さが大きいと、熱伝導性を阻害するため、100μm以下の厚さとするのが適当であり、より好ましくは、上記の通り20〜30μmの厚さとするのが良い。
The high thermal conductive insulating adhesive 18 corresponds to, for example, a high thermal conductive resin obtained by mixing a metal powder having good thermal conductivity in a resin such as a silicon resin, an epoxy resin, or a polyimide resin.
In addition, when the thickness of the high thermal conductive insulating adhesive 18 is large, the thermal conductivity is hindered. Therefore, the thickness is suitably 100 μm or less, and more preferably 20 to 30 μm as described above. Is good.

上記第1のLEDランプ10は、第1のリードフレーム24及び第2のリードフレーム26を介してLEDチップ28に電圧が印加されると、LEDチップ28から上記蛍光体層34を励起する紫外線や青色可視光等の光が発光する。LEDチップ28から発光された光の照射を蛍光体層34が受けると、蛍光体層34はLEDチップ28の光を所定波長の可視光に変換して様々な方向へ放射し、この可視光が中空外囲体32を透過して外部へ放射されるのである。   When a voltage is applied to the LED chip 28 via the first lead frame 24 and the second lead frame 26, the first LED lamp 10 has ultraviolet rays that excite the phosphor layer 34 from the LED chip 28. Light such as blue visible light is emitted. When the phosphor layer 34 receives the light emitted from the LED chip 28, the phosphor layer 34 converts the light from the LED chip 28 into visible light of a predetermined wavelength and emits it in various directions. The light passes through the hollow envelope 32 and is emitted to the outside.

而して、本発明の第1のLEDランプ10にあっては、LEDチップ28を覆う透光性の中空外囲体32の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体32の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第1のLEDランプ10は、可視光の発光源である蛍光体層34を中空外囲体32の内面に形成したので、可視光が出射する中空外囲体32の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
尚、蛍光体層34から放射された可視光の一部は、中空外囲体32内方へ向かうが、この可視光の殆どは最終的に蛍光体層34を透過して外部へ放射される。
さらに、第1のLEDランプ10にあっては、LEDチップ28を覆う中空外囲体32の先端に凸レンズ部33を形成したことから、中空外囲体32の先端内面の蛍光体層34から放射される可視光、及び、中空外囲体32先端方向へ向かう可視光が、上記凸レンズ部33で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, in the first LED lamp 10 of the present invention, the light emitted from the LED chip 28 is converted into visible light having a predetermined wavelength over the entire inner surface of the translucent hollow envelope 32 covering the LED chip 28. Since the visible light that has been wavelength-converted by the phosphor layer 34 is emitted in various directions, the visible light is emitted from the entire surface of the hollow envelope 32 in various directions. Thus, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the first LED lamp 10 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 32, the light source near the surface of the hollow envelope 32 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Part of the visible light emitted from the phosphor layer 34 is directed toward the inside of the hollow envelope 32, but most of the visible light is finally transmitted through the phosphor layer 34 and emitted to the outside. .
Further, in the first LED lamp 10, since the convex lens portion 33 is formed at the tip of the hollow envelope 32 that covers the LED chip 28, the radiation is emitted from the phosphor layer 34 on the inner surface of the tip of the hollow envelope 32. Visible light and visible light toward the distal end of the hollow envelope 32 are collected by the convex lens portion 33 and emitted forward, so that the luminous intensity of the front direction is larger than that of the side direction and the rear direction. A high LED lamp is realized.

尚、上記第1のLEDランプ10にあっては、LEDチップ28が配置された第1のリードフレーム24の先端部24aが、高熱伝導性絶縁接着材18を介して放熱部材16と接続されているので、LEDチップ28の発熱は、第1のリードフレーム24及び高熱伝導性絶縁接着材18を介して放熱部材16へと伝導し、第1のLEDランプ10外部へ効率良く放熱することができる。
しかも、上記LED素子12において、LEDチップ28が配置された第1のリードフレーム24の先端部24aは、枠体底面22aの略全面を覆う形状と成されているので、放熱面積を大きく確保することができ、放熱効果が高くなっている。上記第1のリードフレーム24は、熱伝導性が良好な導電材料である銅合金で構成することができる。
In the first LED lamp 10, the leading end 24 a of the first lead frame 24 on which the LED chip 28 is disposed is connected to the heat radiating member 16 through the high thermal conductive insulating adhesive 18. Therefore, the heat generated by the LED chip 28 is conducted to the heat radiating member 16 through the first lead frame 24 and the high thermal conductive insulating adhesive 18 and can be efficiently radiated to the outside of the first LED lamp 10. .
In addition, in the LED element 12, the tip 24a of the first lead frame 24 on which the LED chip 28 is disposed is formed to cover the substantially entire surface of the frame bottom surface 22a, so that a large heat radiation area is ensured. The heat dissipation effect is high. The first lead frame 24 can be made of a copper alloy, which is a conductive material having good thermal conductivity.

尚、放熱部材16の本体部底面36bを、他の放熱部材(図示省略)上に表面実装することにより、本体部底面36bを他の放熱部材に接触させれば、LEDチップ28の発熱を、放熱部材16を介して、更に他の放熱部材へと効率良く放熱することができる。   If the main body bottom surface 36b is brought into contact with another heat radiating member by mounting the main body bottom surface 36b of the heat radiating member 16 on another heat radiating member (not shown), the heat generated by the LED chip 28 is Heat can be efficiently radiated to another heat radiating member via the heat radiating member 16.

上記した通り、絶縁材料で構成された枠部材14は、導電材料で構成された放熱部材16と、LED素子12の第1のリードフレーム24、第2のリードフレーム26との絶縁性を確保するために用いられるものである。
すなわち、LED素子12を枠部材14の垂下部42の段部46上に載置した際、LED素子12の第1のリードフレーム先端部24aと放熱部材16間に20〜30μmの間隙が形成されるので、LED素子12の第1のリードフレーム先端部24aと放熱部材16との物理的な接触が阻止され絶縁性が確保される。
As described above, the frame member 14 made of an insulating material ensures insulation between the heat radiating member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12. It is used for this purpose.
That is, when the LED element 12 is placed on the stepped portion 46 of the hanging part 42 of the frame member 14, a gap of 20 to 30 μm is formed between the first lead frame tip 24 a of the LED element 12 and the heat dissipation member 16. Therefore, physical contact between the first lead frame tip 24a of the LED element 12 and the heat radiating member 16 is prevented, and insulation is ensured.

而して、導電材料で構成された放熱部材16と、LED素子12の第1のリードフレーム24、第2のリードフレーム26との絶縁性を確保するのは、例えば、第1のLEDランプ10を、他の導電性の放熱部材(図示省略)上に多数個配置して使用する場合等、複数個の第1のLEDランプ10を同一の導電部材上に配置して使用する場合があるためである。   Thus, the insulation between the heat dissipation member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12 can be ensured by, for example, the first LED lamp 10. In some cases, a plurality of first LED lamps 10 are arranged on the same conductive member, such as when many are arranged on another conductive heat radiating member (not shown). It is.

図13は、本発明に係る第2のLEDランプ48を示す概略断面図であり、該第2のLEDランプ48は、先端に凸レンズ部49を有する中空外囲体50が略球状型と成されている点に特徴を有するものであり、その他の構成は上記第1のLEDランプ10と実質的に同一である。
この第2のLEDランプ48の略球状型の中空外囲体50は、その側周面が、LEDチップ28を囲繞する枠体22の外端から外方へ膨出している。
上記凸レンズ部49は、中空外囲体50の先端の肉厚を最大とすると共に、先端から周縁に向かって漸次薄肉となる球面状と成すことによって形成されている。
FIG. 13 is a schematic cross-sectional view showing a second LED lamp 48 according to the present invention. The second LED lamp 48 has a hollow envelope 50 having a convex lens portion 49 at the tip of a substantially spherical shape. The other features are substantially the same as those of the first LED lamp 10 described above.
The substantially spherical hollow envelope 50 of the second LED lamp 48 has its side peripheral surface bulging outward from the outer end of the frame 22 surrounding the LED chip 28.
The convex lens portion 49 is formed by maximizing the thickness of the tip of the hollow envelope 50 and forming a spherical surface that gradually becomes thinner from the tip toward the periphery.

而して、第2のLEDランプ48にあっても、第1のLEDランプ10と同じく、LEDチップ28を覆う透光性の中空外囲体50の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体50の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第2のLEDランプ48は、可視光の発光源である蛍光体層34を中空外囲体50の内面に形成したので、可視光が出射する中空外囲体50の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
また、第2のLEDランプ48は、略球状型の中空外囲体50の側周面が、LEDチップ28を囲繞する枠体22の外端から外方へ膨出しているので、蛍光体層34から放射された後方向へ向かう可視光が枠体22に遮られることを抑制でき、後方向からの視認性が向上する。
さらに、第2のLEDランプ48にあっては、LEDチップ28を覆う中空外囲体50の先端に凸レンズ部49を形成したことから、中空外囲体50の先端内面の蛍光体層34から放射される可視光、及び、中空外囲体50先端方向へ向かう可視光が、上記凸レンズ部49で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, even in the second LED lamp 48, as in the first LED lamp 10, the LED chip 28 emits light over the entire inner surface of the light-transmitting hollow envelope 50 that covers the LED chip 28. A phosphor layer 34 is formed that radiates by converting into visible light having a wavelength. Since visible light that has been wavelength-converted by the phosphor layer 34 is emitted in various directions, the entire surface of the hollow envelope 50 is exposed. Since visible light is emitted in various directions, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the second LED lamp 48 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 50, the light source near the surface of the hollow envelope 50 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
In the second LED lamp 48, the side surface of the substantially spherical hollow envelope 50 bulges outward from the outer end of the frame 22 surrounding the LED chip 28. It is possible to suppress the visible light radiated from the rearward direction 34 from being blocked by the frame body 22, and the visibility from the rear direction is improved.
Further, in the second LED lamp 48, since the convex lens portion 49 is formed at the tip of the hollow envelope 50 that covers the LED chip 28, the radiation is emitted from the phosphor layer 34 on the inner surface of the tip of the hollow envelope 50. Visible light and visible light toward the distal end of the hollow envelope 50 are collected by the convex lens portion 49 and emitted forward, so that the luminous intensity of the forward direction is higher than that of the lateral direction and the backward direction. A high LED lamp is realized.

図14は、本発明に係る第3のLEDランプ52を示す概略断面図であり、該第3のLEDランプは、LEDチップ搭載用の第1のリードフレーム54の先端部54aに、その底面から上方に向かって孔径が徐々に拡大する略漏斗形状の凹部を設けると共に該凹部内面を反射面と成してリフレクタ56を形成し、該リフレクタ56の底面上にLEDチップ28をダイボンドにより接続固定し、以て、上記第1のリードフレーム54と、LEDチップ28底面の一方の電極(図示せず)とを電気的に接続している。
また、第2のリードフレーム58の先端部58aと、上記LEDチップ28上面の他方の電極(図示せず)とをボンディングワイヤ30を介して電気的に接続して成る。
FIG. 14 is a schematic cross-sectional view showing a third LED lamp 52 according to the present invention. The third LED lamp is formed on the front end portion 54a of the first lead frame 54 for mounting an LED chip from the bottom surface thereof. A concave portion having a substantially funnel shape in which the hole diameter gradually increases toward the upper side is provided, and a reflector 56 is formed by forming the inner surface of the concave portion as a reflecting surface, and the LED chip 28 is connected and fixed on the bottom surface of the reflector 56 by die bonding. Thus, the first lead frame 54 and one electrode (not shown) on the bottom surface of the LED chip 28 are electrically connected.
Further, the leading end portion 58a of the second lead frame 58 and the other electrode (not shown) on the upper surface of the LED chip 28 are electrically connected through a bonding wire 30.

上記LEDチップ28、第1のリードフレーム54の先端部54a及び端子部54bの上端、第2のリードフレーム58の先端部58a及び端子部58bの上端は、先端に凸レンズ部59を有する砲弾型と成された透光性の中空外囲体60で覆われている。
上記凸レンズ部59は、中空外囲体60の先端の肉厚を最大とすると共に、先端から周縁に向かって漸次薄肉となる球面状と成すことによって形成されている。
また、上記中空外囲体60の内面全域に、LEDチップ28から発光される紫外線や青色可視光等の光を、所定波長の可視光に変換して放射する蛍光体層34が形成されている。
さらに、中空外囲体60の内部には、水ガラス、ゾルゲルガラス等の無機材料、或いは、エポキシ樹脂、アクリル樹脂等の有機材料で構成された透光性を有する充填材64が封入されている。
尚、第1のリードフレーム54の端子部54bの下端、第2のリードフレーム58の端子部58bの下端は、上記充填材64を貫通して中空外囲体60外部へ導出されている。
The LED chip 28, the top end portion 54a of the first lead frame 54 and the top end of the terminal portion 54b, the top end portion 58a of the second lead frame 58 and the top end of the terminal portion 58b are a shell type having a convex lens portion 59 at the tip. The light-transmitting hollow envelope 60 is covered.
The convex lens portion 59 is formed by maximizing the thickness of the tip of the hollow envelope 60 and forming a spherical surface that gradually becomes thinner from the tip toward the periphery.
In addition, a phosphor layer 34 is formed on the entire inner surface of the hollow envelope 60 to convert light such as ultraviolet light and blue visible light emitted from the LED chip 28 into visible light having a predetermined wavelength and emit it. .
Further, inside the hollow envelope 60, a transparent material 64 made of an inorganic material such as water glass or sol-gel glass, or an organic material such as epoxy resin or acrylic resin is enclosed. .
The lower end of the terminal portion 54b of the first lead frame 54 and the lower end of the terminal portion 58b of the second lead frame 58 are led out of the hollow envelope 60 through the filler 64.

次に、図15乃至図18に基づいて、第3のLEDランプ52の製造方法を説明する。
先ず、第1のリードフレーム54の先端部54aに形成したリフレクタ56の底面上に、LEDチップ28をAgペースト等を介してダイボンドした後、ボンディングワイヤ30を介して第2のリードフレーム58の先端部58aとLEDチップ28とを接続する(図15)。
Next, a method for manufacturing the third LED lamp 52 will be described with reference to FIGS.
First, the LED chip 28 is die-bonded via Ag paste or the like on the bottom surface of the reflector 56 formed at the distal end portion 54a of the first lead frame 54, and then the distal end of the second lead frame 58 via the bonding wire 30. The part 58a and the LED chip 28 are connected (FIG. 15).

次に、図16に示すように、固定冶具66の凹部66a内に、上記中空外囲体60を、先端側から挿入していき、固定する。この結果、中空外囲体60の開口部が、上方側に配置されることとなる。尚、固定冶具66への固定前に、中空外囲体60の内面全域に予め蛍光体層34を形成しておく。上記の通り、中空外囲体60の内面に蛍光体層34を形成するには、例えば、無機結合剤中に蛍光体を分散させた蛍光体分散液を中空外囲体60内面に塗着させた後、焼成すれば良い。
次に、上記中空外囲体60の開口部から、中空外囲体60内に未硬化状態の充填材64を所定量注入する(図17)。
次に、図18に示すように、LEDチップ28が接続・配置された第1のリードフレーム54の先端部54a及び端子部54bの上端、第2のリードフレーム58の先端部58a及び端子部58bの上端を、中空外囲体60内に収容する。
その後、所定温度で加熱する等して、上記充填材64を硬化させることにより、上記第3のLEDランプ52が完成する。
Next, as shown in FIG. 16, the hollow envelope 60 is inserted into the recess 66a of the fixing jig 66 from the tip side and fixed. As a result, the opening of the hollow envelope 60 is arranged on the upper side. Prior to fixing to the fixing jig 66, the phosphor layer 34 is formed in advance on the entire inner surface of the hollow envelope 60. As described above, in order to form the phosphor layer 34 on the inner surface of the hollow envelope 60, for example, a phosphor dispersion liquid in which a phosphor is dispersed in an inorganic binder is applied to the inner surface of the hollow envelope 60. And then firing.
Next, a predetermined amount of uncured filler 64 is injected into the hollow envelope 60 from the opening of the hollow envelope 60 (FIG. 17).
Next, as shown in FIG. 18, the upper end of the leading end portion 54a and the terminal portion 54b of the first lead frame 54 to which the LED chip 28 is connected and arranged, and the leading end portion 58a and the terminal portion 58b of the second lead frame 58 are connected. Is accommodated in the hollow envelope 60.
Thereafter, the third LED lamp 52 is completed by curing the filler 64 by heating at a predetermined temperature.

上記第3のLEDランプ52は、第1のリードフレーム54及び第2のリードフレーム58を介してLEDチップ28に電圧が印加されると、LEDチップ28から上記蛍光体層34を励起する紫外線や青色可視光等の光が発光する。LEDチップ28から発光された光の照射を蛍光体層34が受けると、蛍光体層34はLEDチップ28の光を所定波長の可視光に変換し、この可視光が中空外囲体60を透過して外部へ放射されるのである。   When a voltage is applied to the LED chip 28 via the first lead frame 54 and the second lead frame 58, the third LED lamp 52 is configured to emit ultraviolet light that excites the phosphor layer 34 from the LED chip 28. Light such as blue visible light is emitted. When the phosphor layer 34 receives the light emitted from the LED chip 28, the phosphor layer 34 converts the light from the LED chip 28 into visible light having a predetermined wavelength, and this visible light passes through the hollow envelope 60. Then it is radiated to the outside.

而して、本発明の第3のLEDランプ52も、第1のLEDランプ10及び第2のLEDランプ48と同じく、LEDチップ28を覆う透光性の中空外囲体60の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体60の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第3のLEDランプ52は、可視光の発光源である蛍光体層34を中空外囲体60の内面に形成したので、可視光が出射する中空外囲体60の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第3のLEDランプ52にあっては、LEDチップ28を覆う中空外囲体60の先端に凸レンズ部59を形成したことから、中空外囲体60の先端内面の蛍光体層34から放射される可視光、及び、中空外囲体60先端方向へ向かう可視光が、上記凸レンズ部59で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, the third LED lamp 52 of the present invention is also applied to the entire inner surface of the translucent hollow envelope 60 that covers the LED chip 28, like the first LED lamp 10 and the second LED lamp 48. A phosphor layer 34 is formed which converts the emitted light of the LED chip 28 into visible light having a predetermined wavelength and emits it. The visible light wavelength-converted by the phosphor layer 34 is emitted in various directions. Visible light is emitted in various directions from the entire surface of the enclosure 60, and an LED lamp having a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, the third LED lamp 52 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 60, so that the light source near the surface of the hollow envelope 60 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Further, in the third LED lamp 52, since the convex lens portion 59 is formed at the tip of the hollow envelope 60 that covers the LED chip 28, the radiation is emitted from the phosphor layer 34 on the inner surface of the tip of the hollow envelope 60. Visible light and visible light traveling toward the distal end of the hollow envelope 60 are collected by the convex lens portion 59 and emitted forward, so that the luminous intensity of the forward direction is larger than that of the lateral direction and the backward direction. A high LED lamp is realized.

尚、上記充填材64を水ガラス、ゾルゲルガラス等の無機材料で構成した場合には、無機材料はLEDチップ28から発光される紫外線や青色可視光等の高エネルギーの短波長光を殆ど吸収しないため、LEDチップ28から発光され、上記蛍光体層34を励起する紫外線や青色可視光等の短波長光が殆ど損失することなく蛍光体層34に照射できる。   When the filler 64 is made of an inorganic material such as water glass or sol-gel glass, the inorganic material hardly absorbs high-energy short-wavelength light such as ultraviolet light or blue visible light emitted from the LED chip 28. Therefore, the phosphor layer 34 can be irradiated with almost no loss of short wavelength light such as ultraviolet light and blue visible light emitted from the LED chip 28 and exciting the phosphor layer 34.

図19は、本発明に係る第4のLEDランプ68を示すものであり、該第4のLEDランプ70は、中空外囲体69先端の凸レンズ部71を、中空外囲体69の先端内面に透光材72を接合することにより構成している。すなわち、上記凸レンズ部71は、中空外囲体69先端位置の透光材72の肉厚を最大とすると共に、中空外囲体69の先端位置から周縁位置に向かって透光材72が漸次薄肉となる球面状と成すことによって形成されている。
尚、凸レンズ部71を構成する上記透光材72は、中空外囲体69の先端を下側に配置した状態で、透光性を有する無機結合剤等の液状の透光材72を中空外囲体69内に所定量充填した後、固化させることにより形成できる。
また、上記透光材72が接合された部分以外の中空外囲体69の内面全域及び透光材72の内面全域に蛍光体層34が形成されている。
上記以外の第4のLEDランプ70の構成は、第1のLEDランプ10と同様である。
FIG. 19 shows a fourth LED lamp 68 according to the present invention. The fourth LED lamp 70 has a convex lens portion 71 at the tip of the hollow envelope 69 on the tip inner surface of the hollow envelope 69. The light-transmitting material 72 is joined. That is, the convex lens portion 71 maximizes the thickness of the translucent material 72 at the distal end position of the hollow envelope 69, and the translucent material 72 gradually decreases in thickness from the distal end position to the peripheral position of the hollow envelope 69. It is formed by forming a spherical shape.
The translucent material 72 constituting the convex lens portion 71 is formed by disposing the translucent liquid material 72 such as an inorganic binder having translucency in a state where the front end of the hollow envelope 69 is disposed on the lower side. A predetermined amount can be filled in the enclosure 69 and then solidified.
Further, the phosphor layer 34 is formed on the entire inner surface of the hollow envelope 69 and the entire inner surface of the translucent material 72 other than the portion where the translucent material 72 is joined.
The configuration of the fourth LED lamp 70 other than the above is the same as that of the first LED lamp 10.

而して、本発明の第4のLEDランプ70にあっては、透光材72が接合された部分以外の中空外囲体69の内面全域及び透光材72の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体69の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第4のLEDランプ70は、可視光の発光源である蛍光体層34を中空外囲体69の内面及び凸レンズ部71を構成する透光材72の内面に形成したので、可視光が出射する中空外囲体69の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第4のLEDランプ70にあっては、LEDチップ28を覆う中空外囲体69の先端に凸レンズ部71を形成したことから、中空外囲体69の先端内面に接合した透光材71内面の蛍光体層34から放射される可視光、及び、中空外囲体69先端方向へ向かう可視光が、上記凸レンズ部71で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, in the fourth LED lamp 70 of the present invention, the LED chip 28 is provided over the entire inner surface of the hollow envelope 69 and the entire inner surface of the light transmissive material 72 other than the portion where the light transmissive material 72 is joined. The phosphor layer 34 is formed by converting the emitted light into visible light having a predetermined wavelength, and the visible light wavelength-converted by the phosphor layer 34 is emitted in various directions. Visible light is emitted from the entire surface of the LED in various directions, and an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
Moreover, in the fourth LED lamp 70, the phosphor layer 34, which is a visible light source, is formed on the inner surface of the hollow envelope 69 and the inner surface of the translucent material 72 constituting the convex lens portion 71. A light emission source exists near the surface of the hollow envelope 69 that emits, and an LED lamp with high luminous intensity is realized.
Further, in the fourth LED lamp 70, since the convex lens portion 71 is formed at the tip of the hollow envelope 69 that covers the LED chip 28, the translucent material 71 joined to the inner surface of the tip of the hollow envelope 69. Visible light radiated from the phosphor layer 34 on the inner surface and visible light toward the tip of the hollow envelope 69 are collected by the convex lens portion 71 and emitted forward, so that the lateral direction and the backward direction Compared to the above, an LED lamp having a higher forward luminous intensity is realized.

図20は、本発明に係る第5のLEDランプ74を示すものであり、該第5のLEDランプ74は、中空外囲体76先端の凸レンズ部77を、中空外囲体76の先端内面に透光材78を接合することにより構成している。すなわち、上記凸レンズ部77は、中空外囲体76先端位置の透光材78の肉厚を最大とすると共に、中空外囲体76の先端位置から周縁位置に向かって透光材78が漸次薄肉となる球面状と成すことによって形成されている。
また、上記透光材78が接合された部分以外の中空外囲体76の内面全域及び透光材78の内面全域に蛍光体層34が形成されている。
上記以外の第5のLEDランプ74の構成は、第2のLEDランプ48と同様である。
FIG. 20 shows a fifth LED lamp 74 according to the present invention. The fifth LED lamp 74 has a convex lens portion 77 at the tip of the hollow envelope 76 on the inner surface of the tip of the hollow envelope 76. The light transmitting material 78 is joined. That is, the convex lens portion 77 maximizes the thickness of the translucent material 78 at the distal end position of the hollow envelope 76, and the translucent material 78 gradually becomes thinner from the distal end position of the hollow envelope 76 toward the peripheral position. It is formed by forming a spherical shape.
Further, the phosphor layer 34 is formed on the entire inner surface of the hollow envelope 76 and the entire inner surface of the light-transmitting material 78 other than the portion where the light-transmitting material 78 is joined.
The configuration of the fifth LED lamp 74 other than the above is the same as that of the second LED lamp 48.

而して、本発明の第5のLEDランプ74にあっては、透光材78が接合された部分以外の中空外囲体76の内面全域及び透光材78の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体76の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第5のLEDランプ74は、可視光の発光源である蛍光体層34を中空外囲体76の内面及び凸レンズ部77を構成する透光材78の内面に形成したので、可視光が出射する中空外囲体76の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第5のLEDランプ74にあっては、LEDチップ28を覆う中空外囲体76の先端に凸レンズ部77を形成したことから、中空外囲体76の先端内面に接合した透光材78内面の蛍光体層34から放射される可視光、及び、中空外囲体76先端方向へ向かう可視光が、上記凸レンズ部77で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, in the fifth LED lamp 74 of the present invention, the LED chip 28 is provided over the entire inner surface of the hollow envelope 76 and the entire inner surface of the light transmissive material 78 other than the portion where the light transmissive material 78 is joined. The phosphor layer 34 is formed by converting the emitted light into visible light having a predetermined wavelength, and the visible light wavelength-converted by the phosphor layer 34 is emitted in various directions. Visible light is emitted from the entire surface of the LED in various directions, and an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
Moreover, in the fifth LED lamp 74, the phosphor layer 34, which is a visible light emission source, is formed on the inner surface of the hollow envelope 76 and the inner surface of the translucent material 78 constituting the convex lens portion 77. A light emission source exists in the vicinity of the surface of the hollow envelope 76 that emits light, and an LED lamp with high luminous intensity is realized.
Further, in the fifth LED lamp 74, since the convex lens portion 77 is formed at the tip of the hollow envelope 76 covering the LED chip 28, the translucent material 78 joined to the inner surface of the tip of the hollow envelope 76. Visible light radiated from the phosphor layer 34 on the inner surface and visible light toward the tip of the hollow envelope 76 are collected by the convex lens portion 77 and emitted forward, so that the lateral direction and the backward direction Compared to the above, an LED lamp having a higher forward luminous intensity is realized.

図21は、本発明に係る第6のLEDランプ79を示すものであり、該第6のLEDランプ79は、中空外囲体80先端の凸レンズ部81を、中空外囲体80の先端内面に透光材82を接合することにより構成している。すなわち、上記凸レンズ部81は、中空外囲体80先端位置の透光材82の肉厚を最大とすると共に、中空外囲体80の先端位置から周縁位置に向かって透光材82が漸次薄肉となる球面状と成すことによって形成されている。
また、上記透光材82が接合された部分以外の中空外囲体80の内面全域及び透光材82の内面全域に蛍光体層34が形成されている。
上記以外の第6のLEDランプ79の構成は、第3のLEDランプ52と同様である。
FIG. 21 shows a sixth LED lamp 79 according to the present invention. The sixth LED lamp 79 has a convex lens portion 81 at the tip of the hollow envelope 80 on the inner surface of the tip of the hollow envelope 80. The light transmitting member 82 is joined. That is, the convex lens portion 81 maximizes the thickness of the translucent material 82 at the distal end position of the hollow envelope 80, and the translucent material 82 gradually becomes thinner from the distal end position of the hollow envelope 80 toward the peripheral position. It is formed by forming a spherical shape.
Further, the phosphor layer 34 is formed on the entire inner surface of the hollow envelope 80 and the entire inner surface of the light transmitting material 82 other than the portion where the light transmitting material 82 is joined.
The configuration of the sixth LED lamp 79 other than the above is the same as that of the third LED lamp 52.

而して、本発明の第6のLEDランプ79にあっては、透光材82が接合された部分以外の中空外囲体80の内面全域及び透光材82の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層34を形成しており、蛍光体層34で波長変換された可視光は様々な方向へ放射されるので、中空外囲体80の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第6のLEDランプ79は、可視光の発光源である蛍光体層34を中空外囲体80の内面及び凸レンズ部81を構成する透光材82の内面に形成したので、可視光が出射する中空外囲体80の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第6のLEDランプ79にあっては、LEDチップ28を覆う中空外囲体80の先端に凸レンズ部81を形成したことから、中空外囲体80の先端内面に接合した透光材82内面の蛍光体層34から放射される可視光、及び、中空外囲体80先端方向へ向かう可視光が、上記凸レンズ部81で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。
Thus, in the sixth LED lamp 79 of the present invention, the LED chip 28 is provided on the entire inner surface of the hollow envelope 80 and the entire inner surface of the light-transmitting material 82 other than the portion where the light-transmitting material 82 is joined. The phosphor layer 34 is formed by converting the emitted light into visible light having a predetermined wavelength, and the visible light wavelength-converted by the phosphor layer 34 is emitted in various directions. Visible light is emitted from the entire surface of the LED in various directions, and an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
Moreover, in the sixth LED lamp 79, the phosphor layer 34, which is a visible light emission source, is formed on the inner surface of the hollow envelope 80 and the inner surface of the translucent material 82 constituting the convex lens portion 81. A light emission source exists in the vicinity of the surface of the hollow envelope 80 that emits, and an LED lamp with high luminous intensity is realized.
Further, in the sixth LED lamp 79, since the convex lens portion 81 is formed at the tip of the hollow envelope 80 that covers the LED chip 28, the translucent material 82 joined to the inner surface of the tip of the hollow envelope 80. Visible light radiated from the phosphor layer 34 on the inner surface and visible light toward the tip of the hollow envelope 80 are collected by the convex lens portion 81 and emitted forward, so that the lateral direction and the backward direction Compared to the above, an LED lamp having a higher forward luminous intensity is realized.

図22は、本発明に係る第7のLEDランプ84を示すものであり、該第7のLEDランプ84は、中空外囲体69先端の凸レンズ部85を、透光性の蛍光体層86により構成している。すなわち、中空外囲体69の内面全域に蛍光体層86が形成されているが、中空外囲体69先端位置の蛍光体層86の肉厚が最大となると共に、中空外囲体69の先端位置から周縁位置に向かって蛍光体層86の肉厚が漸次薄肉となる球面状と成すことによって、上記凸レンズ部85が形成されている。また、上記球面状の凸レンズ部85を構成する蛍光体層86の肉厚は、凸レンズ部85を構成しない蛍光体層86の肉厚より大と成されている。
上記凸レンズ部85は、中空外囲体69の先端を下側に配置した状態で、透光性を有する無機結合剤中に蛍光体を分散させた蛍光体分散液を中空外囲体69内に所定量充填すると共に、中空外囲体69内面に蛍光体分散液を塗着させた後、焼成すれば良い。
上記以外の第7のLEDランプ84の構成は、第4のLEDランプ68と同様である。
FIG. 22 shows a seventh LED lamp 84 according to the present invention. In the seventh LED lamp 84, a convex lens portion 85 at the tip of the hollow envelope 69 is formed by a translucent phosphor layer 86. It is composed. That is, the phosphor layer 86 is formed over the entire inner surface of the hollow envelope 69, and the thickness of the phosphor layer 86 at the tip of the hollow envelope 69 is maximized, and the tip of the hollow envelope 69 is The convex lens portion 85 is formed by forming the phosphor layer 86 into a spherical shape in which the thickness gradually decreases from the position toward the peripheral position. The thickness of the phosphor layer 86 constituting the spherical convex lens portion 85 is larger than the thickness of the phosphor layer 86 not constituting the convex lens portion 85.
The convex lens portion 85 has a phosphor dispersion liquid in which a phosphor is dispersed in a light-transmitting inorganic binder in a state where the tip of the hollow envelope 69 is arranged on the lower side. A predetermined amount may be filled, and the phosphor dispersion may be applied to the inner surface of the hollow envelope 69 and then fired.
The configuration of the seventh LED lamp 84 other than the above is the same as that of the fourth LED lamp 68.

而して、本発明の第7のLEDランプ84にあっては、LEDチップ28を覆う透光性の中空外囲体69の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層86を形成しており、蛍光体層86で波長変換された可視光は様々な方向へ放射されるので、中空外囲体69の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第7のLEDランプ84は、可視光の発光源である蛍光体層86を中空外囲体69の内面に形成したので、可視光が出射する中空外囲体69の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第7のLEDランプ84にあっては、LEDチップ28を覆う中空外囲体69の先端に凸レンズ部85を形成したことから、中空外囲体69の先端内面の蛍光体層86から放射される可視光、及び、中空外囲体69先端方向へ向かう可視光が、上記凸レンズ部85で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。しかも、上記凸レンズ部85を蛍光体層34で構成した結果、凸レンズ部85からも可視光を放射できるので、高光度の可視光を前方向へ出射することができる。
Thus, in the seventh LED lamp 84 of the present invention, the light emitted from the LED chip 28 is converted into visible light having a predetermined wavelength over the entire inner surface of the translucent hollow envelope 69 covering the LED chip 28. The phosphor layer 86 that radiates is formed, and the visible light wavelength-converted by the phosphor layer 86 is radiated in various directions, so that the visible light is radiated from the entire surface of the hollow envelope 69 in various directions. Thus, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the seventh LED lamp 84 has the phosphor layer 86, which is a visible light source, formed on the inner surface of the hollow envelope 69, the light source near the surface of the hollow envelope 69 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Further, in the seventh LED lamp 84, since the convex lens portion 85 is formed at the tip of the hollow envelope 69 that covers the LED chip 28, the radiation is emitted from the phosphor layer 86 on the inner surface of the tip of the hollow envelope 69. Visible light and visible light traveling toward the distal end of the hollow envelope 69 are collected by the convex lens unit 85 and emitted forward, so that the luminous intensity of the forward direction is higher than that of the lateral direction and the backward direction. A high LED lamp is realized. In addition, as a result of the convex lens portion 85 being configured by the phosphor layer 34, visible light can be emitted also from the convex lens portion 85, and thus high-luminance visible light can be emitted in the forward direction.

図23は、本発明に係る第8のLEDランプ88を示すものであり、該第8のLEDランプ88は、中空外囲体76先端の凸レンズ部89を、透光性の蛍光体層90により構成している。すなわち、中空外囲体76の内面全域に蛍光体層90が形成されているが、中空外囲体76先端位置の蛍光体層90の肉厚が最大となると共に、中空外囲体76の先端位置から周縁位置に向かって蛍光体層90の肉厚が漸次薄肉となる球面状と成すことによって、上記凸レンズ部89が形成されている。また、上記球面状の凸レンズ部89を構成する蛍光体層90の肉厚は、凸レンズ部89を構成しない蛍光体層90の肉厚より大と成されている。
上記以外の第8のLEDランプ88の構成は、第5のLEDランプ74と同様である。
FIG. 23 shows an eighth LED lamp 88 according to the present invention. In the eighth LED lamp 88, the convex lens portion 89 at the tip of the hollow envelope 76 is formed by a translucent phosphor layer 90. It is composed. That is, the phosphor layer 90 is formed over the entire inner surface of the hollow envelope 76, but the thickness of the phosphor layer 90 at the tip of the hollow envelope 76 is maximized, and the tip of the hollow envelope 76 is The convex lens portion 89 is formed by forming the phosphor layer 90 into a spherical shape in which the thickness gradually decreases from the position toward the peripheral position. Further, the thickness of the phosphor layer 90 constituting the spherical convex lens portion 89 is made larger than the thickness of the phosphor layer 90 not constituting the convex lens portion 89.
The configuration of the eighth LED lamp 88 other than the above is the same as that of the fifth LED lamp 74.

而して、本発明の第8のLEDランプ88にあっては、LEDチップ28を覆う透光性の中空外囲体76の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層90を形成しており、蛍光体層90で波長変換された可視光は様々な方向へ放射されるので、中空外囲体76の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第8のLEDランプ88は、可視光の発光源である蛍光体層90を中空外囲体76の内面に形成したので、可視光が出射する中空外囲体76の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第8のLEDランプ88にあっては、LEDチップ28を覆う中空外囲体76の先端に凸レンズ部89を形成したことから、中空外囲体76の先端内面の蛍光体層90から放射される可視光、及び、中空外囲体76先端方向へ向かう可視光が、上記凸レンズ部89で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。しかも、上記凸レンズ部89を蛍光体層90で構成した結果、凸レンズ部89からも可視光を放射できるので、高光度の可視光を前方向へ出射することができる。
Thus, in the eighth LED lamp 88 of the present invention, the light emitted from the LED chip 28 is converted into visible light having a predetermined wavelength over the entire inner surface of the translucent hollow envelope 76 covering the LED chip 28. The visible light that has been wavelength-converted by the phosphor layer 90 is emitted in various directions, so that the visible light is emitted in various directions from the entire surface of the hollow envelope 76. Thus, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
Moreover, since the eighth LED lamp 88 has the phosphor layer 90, which is a visible light source, formed on the inner surface of the hollow envelope 76, the light source near the surface of the hollow envelope 76 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Further, in the eighth LED lamp 88, since the convex lens portion 89 is formed at the tip of the hollow envelope 76 covering the LED chip 28, the radiation is emitted from the phosphor layer 90 on the inner surface of the tip of the hollow envelope 76. Visible light and visible light toward the distal end direction of the hollow envelope 76 are collected by the convex lens portion 89 and emitted forward, so that the luminous intensity of the forward direction is larger than that of the lateral direction and the backward direction. A high LED lamp is realized. In addition, as a result of the convex lens portion 89 being constituted by the phosphor layer 90, visible light can be emitted also from the convex lens portion 89, so that high-luminance visible light can be emitted in the forward direction.

図24は、本発明に係る第9のLEDランプ92を示すものであり、該第9のLEDランプ92は、中空外囲体80先端の凸レンズ部94を、透光性の蛍光体層96により構成している。すなわち、中空外囲体80の内面全域に蛍光体層96が形成されているが、中空外囲体80先端位置の蛍光体層96の肉厚が最大となると共に、中空外囲体80の先端位置から周縁位置に向かって蛍光体層96の肉厚が漸次薄肉となる球面状と成すことによって、上記凸レンズ部94が形成されている。また、上記球面状の凸レンズ部94を構成する蛍光体層96の肉厚は、凸レンズ部94を構成しない蛍光体層96の肉厚より大と成されている。
上記以外の第9のLEDランプ92の構成は、第6のLEDランプ79と同様である。
FIG. 24 shows a ninth LED lamp 92 according to the present invention. The ninth LED lamp 92 has a convex lens portion 94 at the tip of the hollow envelope 80 formed by a translucent phosphor layer 96. It is composed. That is, the phosphor layer 96 is formed over the entire inner surface of the hollow envelope 80. The thickness of the phosphor layer 96 at the tip of the hollow envelope 80 is maximized, and the tip of the hollow envelope 80 is The convex lens portion 94 is formed by forming the phosphor layer 96 into a spherical shape in which the thickness gradually decreases from the position toward the peripheral position. The thickness of the phosphor layer 96 constituting the spherical convex lens portion 94 is larger than the thickness of the phosphor layer 96 not constituting the convex lens portion 94.
The configuration of the ninth LED lamp 92 other than the above is the same as that of the sixth LED lamp 79.

而して、本発明の第9のLEDランプ92にあっては、LEDチップ28を覆う透光性の中空外囲体80の内面全域に、LEDチップ28の発光を所定波長の可視光に変換して放射する蛍光体層96を形成しており、蛍光体層96で波長変換された可視光は様々な方向へ放射されるので、中空外囲体80の表面全域から可視光が様々な方向へ出射されることとなり、前方向だけでなく側方向や後方向からも視認できる広視野角なLEDランプを実現できる。
しかも、第9のLEDランプ92は、可視光の発光源である蛍光体層96を中空外囲体80の内面に形成したので、可視光が出射する中空外囲体80の表面近傍に発光源が存在することになり、光度の高いLEDランプが実現される。
さらに、第9のLEDランプ92にあっては、LEDチップ28を覆う中空外囲体80の先端に凸レンズ部94を形成したことから、中空外囲体80の先端内面の蛍光体層96から放射される可視光、及び、中空外囲体80先端方向へ向かう可視光が、上記凸レンズ部94で集光されて前方向へ出射されるので、側方向や後方向に比べて前方向の光度の高いLEDランプが実現される。しかも、上記凸レンズ部94を蛍光体層96で構成した結果、凸レンズ部94からも可視光を放射できるので、高光度の可視光を前方向へ出射することができる。
Thus, in the ninth LED lamp 92 of the present invention, the light emitted from the LED chip 28 is converted into visible light having a predetermined wavelength over the entire inner surface of the translucent hollow envelope 80 covering the LED chip 28. The phosphor layer 96 that radiates is formed, and the visible light wavelength-converted by the phosphor layer 96 is emitted in various directions, so that the visible light is emitted in various directions from the entire surface of the hollow envelope 80. Thus, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the ninth LED lamp 92 has the phosphor layer 96, which is a visible light source, formed on the inner surface of the hollow envelope 80, the light source near the surface of the hollow envelope 80 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Further, in the ninth LED lamp 92, since the convex lens portion 94 is formed at the tip of the hollow envelope 80 that covers the LED chip 28, the radiation is emitted from the phosphor layer 96 on the inner surface of the tip of the hollow envelope 80. Visible light and visible light traveling toward the distal end of the hollow envelope 80 are collected by the convex lens portion 94 and emitted in the forward direction. A high LED lamp is realized. In addition, as a result of the convex lens portion 94 being composed of the phosphor layer 96, visible light can also be emitted from the convex lens portion 94, so that high-luminance visible light can be emitted in the forward direction.

本発明に係る第1のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 1st LED lamp which concerns on this invention. 本発明に係る第1のLEDランプの中空外囲体を取り外した状態における平面図である。It is a top view in the state where the hollow envelope of the 1st LED lamp concerning the present invention was removed. 本発明に係る第1のLEDランプのLED素子を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the LED element of the 1st LED lamp which concerns on this invention. 本発明に係る第1のLEDランプのLED素子の中空外囲体を取り外した状態における平面図である。It is a top view in the state where the hollow envelope of the LED element of the 1st LED lamp concerning the present invention was removed. 本発明に係る第1のLEDランプの放熱部材を模式的に示す正面図である。It is a front view showing typically the heat dissipation member of the 1st LED lamp concerning the present invention. 本発明に係る第1のLEDランプの放熱部材を模式的に示す平面図である。It is a top view which shows typically the heat radiating member of the 1st LED lamp which concerns on this invention. 本発明に係る第1のLEDランプの放熱部材を模式的に示す側面図である。It is a side view which shows typically the heat radiating member of the 1st LED lamp which concerns on this invention. 図6のB−B概略断面図である。It is BB schematic sectional drawing of FIG. 本発明に係る第1のLEDランプの枠部材を模式的に示す平面図である。It is a top view which shows typically the frame member of the 1st LED lamp which concerns on this invention. 本発明に係る第1のLEDランプの枠部材を模式的に示す側面図である。It is a side view which shows typically the frame member of the 1st LED lamp which concerns on this invention. 図9のC−C概略断面図である。It is CC schematic sectional drawing of FIG. 本発明に係る第1のLEDランプのLED素子、枠部材、放熱部材の一体化の方法を示す説明図である。It is explanatory drawing which shows the integration method of the LED element of the 1st LED lamp which concerns on this invention, a frame member, and a heat radiating member. 本発明に係る第2のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 2nd LED lamp which concerns on this invention. 本発明に係る第3のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 3rd LED lamp which concerns on this invention. 本発明に係る第3のLEDランプの製造過程をに示す説明図である。It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. 本発明に係る第3のLEDランプの製造過程をに示す説明図である。It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. 本発明に係る第3のLEDランプの製造過程をに示す説明図である。It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. 本発明に係る第3のLEDランプの製造過程をに示す説明図である。It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. 本発明に係る第4のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 4th LED lamp which concerns on this invention. 本発明に係る第5のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 5th LED lamp which concerns on this invention. 本発明に係る第6のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 6th LED lamp which concerns on this invention. 本発明に係る第7のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 7th LED lamp which concerns on this invention. 本発明に係る第8のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 8th LED lamp which concerns on this invention. 本発明に係る第9のLEDランプを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 9th LED lamp which concerns on this invention.

10 第1のLEDランプ
12 LED素子
14 枠部材
16 放熱部材
18 高熱伝導性絶縁接着材
20 孔
22 枠体
24 第1のリードフレーム
24a第1のリードフレームの先端部
24b第1のリードフレームの後端部
26 第2のリードフレーム
26a第2のリードフレームの先端部
26b第2のリードフレームの後端部
28 LEDチップ
30 ボンディングワイヤ
32 中空外囲体
33 凸レンズ部
34 蛍光体層
36 放熱部材の本体部
36a本体部の側周面
36b本体部の底面
38 放熱部材の切欠部
40 枠部材の本体部
42 枠部材の垂下部
44 枠部材の切欠部
46 枠部材の段部
48 第2のLEDランプ
49 凸レンズ部
50 中空外囲体
52 第3のLEDランプ
54 第1のリードフレーム
54a第1のリードフレームの先端部
54b第1のリードフレームの端子部
56 リフレクタ
58 第2のリードフレーム
58a第2のリードフレームの先端部
58b第2のリードフレームの端子部
59 凸レンズ部
60 中空外囲体
64 充填材
66 固定冶具
66a固定冶具の凹部
68 第4のLEDランプ
69 中空外囲体
71 凸レンズ部
72 透光材
74 第5のLEDランプ
76 中空外囲体
77 凸レンズ部
78 透光材
79 第6のLEDランプ
80 中空外囲体
81 凸レンズ部
82 透光材
84 第7のLEDランプ
85 凸レンズ部
86 蛍光体層
88 第8のLEDランプ
89 凸レンズ部
90 蛍光体層
92 第9のLEDランプ
94 凸レンズ部
96 蛍光体層
10 First LED lamp
12 LED elements
14 Frame member
16 Heat dissipation member
18 High thermal conductivity insulating adhesive
20 holes
22 Frame
24 First lead frame
24a First lead frame tip
24b Rear end of first lead frame
26 Second lead frame
26a Tip of second lead frame
26b Rear end of second lead frame
28 LED chip
30 Bonding wire
32 Hollow enclosure
33 Convex lens
34 Phosphor layer
36 Heat sink body
Side surface of 36a body
Bottom of 36b body
38 Notch in heat dissipation member
40 Frame body
42 Hanging part of frame member
44 Notch in frame member
46 Step of frame member
48 Second LED lamp
49 Convex lens
50 Hollow enclosure
52 Third LED lamp
54 First lead frame
54a First lead frame tip
54b Terminal part of the first lead frame
56 Reflector
58 Second lead frame
58a Tip of second lead frame
58b Terminal area of second lead frame
59 Convex lens
60 Hollow enclosure
64 Filler
66 Fixing jig
Recess of 66a fixing jig
68 Fourth LED lamp
69 Hollow enclosure
71 Convex lens
72 Translucent material
74 Fifth LED lamp
76 Hollow enclosure
77 Convex lens
78 Translucent material
79 Sixth LED lamp
80 Hollow enclosure
81 Convex lens
82 Translucent material
84 Seventh LED lamp
85 Convex lens
86 Phosphor layer
88 8th LED lamp
89 Convex lens
90 phosphor layer
92 9th LED lamp
94 Convex lens
96 phosphor layer

Claims (4)

LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の先端に凸レンズ部を形成すると共に、上記中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成したことを特徴とするLEDランプ。   An LED lamp comprising an LED chip and a light-transmitting hollow envelope covering the LED chip, wherein a convex lens portion is formed at a tip of the hollow envelope, and the entire inner surface of the hollow envelope is formed. An LED lamp characterized by forming a phosphor layer that emits light emitted from an LED chip by converting it into visible light having a predetermined wavelength. 上記凸レンズ部が、中空外囲体の先端の肉厚を最大とすると共に、先端から周縁に向かって漸次薄肉となる球面状と成すことによって形成されていることを特徴とする請求項1に記載のLEDランプ。   2. The convex lens portion according to claim 1, wherein the convex lens portion has a spherical shape that maximizes the thickness of the tip of the hollow envelope and gradually becomes thinner from the tip toward the periphery. LED lamp. LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の先端内面に、透光材を接合して凸レンズ部を形成すると共に、上記透光材が接合された部分以外の中空外囲体の内面全域及び透光材の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成したことを特徴とするLEDランプ。   An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, and a convex lens portion is formed by bonding a translucent material to the inner surface of the tip of the hollow envelope, A phosphor layer that converts the emitted light of the LED chip into visible light of a predetermined wavelength and radiates it on the entire inner surface of the hollow envelope other than the portion where the light transmitting material is joined and the entire inner surface of the light transmitting material. LED lamp characterized by LEDチップと、該LEDチップを覆う透光性の中空外囲体を備えたLEDランプであって、上記中空外囲体の内面全域に、LEDチップの発光を所定波長の可視光に変換して放射する蛍光体層を形成し、また、中空外囲体の先端位置の上記蛍光体層の肉厚が最大となる共に、中空外囲体の先端位置から周縁位置に向かって蛍光体層の肉厚が漸次薄肉となる球面状と成すことによって、上記中空外囲体の先端に凸レンズ部を形成したことを特徴とするLEDランプ。   An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, wherein the light emitted from the LED chip is converted into visible light having a predetermined wavelength over the entire inner surface of the hollow envelope. The phosphor layer is formed, and the thickness of the phosphor layer at the tip position of the hollow envelope is maximized, and the thickness of the phosphor layer is increased from the tip position of the hollow envelope toward the peripheral position. An LED lamp, wherein a convex lens portion is formed at the tip of the hollow envelope by forming a spherical shape with a gradually decreasing thickness.
JP2009225733A 2009-09-30 2009-09-30 Led lamp Pending JP2011077214A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012145421A1 (en) * 2011-04-22 2012-10-26 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
KR101265073B1 (en) 2011-10-17 2013-05-20 주식회사 루멘스 Light emitting device package, assembly of printed circuit board and light emitting device package, and backlight unit comprising the same
WO2013131227A1 (en) * 2012-03-05 2013-09-12 胡斌 Led light guide lens
US8659043B1 (en) 2013-02-19 2014-02-25 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9029887B2 (en) 2011-04-22 2015-05-12 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
WO2012145421A1 (en) * 2011-04-22 2012-10-26 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
US10804447B2 (en) 2011-04-22 2020-10-13 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
US10243120B2 (en) 2011-04-22 2019-03-26 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
US10002994B2 (en) 2011-04-22 2018-06-19 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
KR101265073B1 (en) 2011-10-17 2013-05-20 주식회사 루멘스 Light emitting device package, assembly of printed circuit board and light emitting device package, and backlight unit comprising the same
WO2013131227A1 (en) * 2012-03-05 2013-09-12 胡斌 Led light guide lens
US8659043B1 (en) 2013-02-19 2014-02-25 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8933479B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US9142738B2 (en) 2013-02-19 2015-09-22 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US9425368B2 (en) 2013-02-19 2016-08-23 Cooledge Lighting, Inc. Engineered-phosphor LED packages and related methods
US8853729B2 (en) 2013-02-19 2014-10-07 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8754435B1 (en) 2013-02-19 2014-06-17 Cooledge Lighting Inc. Engineered-phosphor LED package and related methods
US8722439B1 (en) 2013-02-19 2014-05-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods

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