JP2011075489A - Substrate for probe card, and probe card - Google Patents

Abstract

Provided are a probe card substrate capable of miniaturizing wiring and electrodes at a low cost, and a probe card using the probe card substrate.
In a probe card, a probe card substrate to which a probe unit in which a plurality of probes are provided on a probe substrate is fixed, wherein the probe card substrate includes a metal substrate having a slit therethrough, and the metal The flexible printed wiring board is passed through a slit of the board and fixed to both sides of the metal board, and wiring is formed on both sides of the metal board by the flexible printed wiring board.
[Selection] Figure 1

Description

The present invention relates to a probe card substrate and a probe card using the probe card substrate.

As a probe card used for inspection of a semiconductor device, a probe unit in which a plurality of probes are provided on a substrate is mounted on a relay wiring substrate composed of an ST substrate (space transformer substrate) and a guide plate, and the relay wiring substrate is interposed therebetween. A probe card in which a probe unit is connected to a wiring board (main board) is used.

As the ST substrate, a substrate in which a thin film wiring is formed on the surface of a ceramic substrate provided with a through wiring (see Patent Document 1) is generally used.

JP 2006-275714 A

The ST substrate in which the thin film wiring is provided on the surface of the ceramic substrate as described above has a problem that the cost is high and it is difficult to miniaturize the wiring / electrode. In addition, the substrate configuration as described above has a problem that it is difficult to process and there is a limit to high accuracy.

Accordingly, an object of the present invention is to provide a probe card substrate capable of miniaturizing wiring and electrodes at low cost, and a probe card using the probe card substrate, instead of a conventional ST substrate. To do.

The probe card substrate of the present invention is a probe card substrate to which a probe unit in which a plurality of probes are provided on the probe substrate is fixed in the probe card, and the probe card substrate has a slit therethrough. It is composed of a metal substrate and a flexible printed wiring board that is passed through the slits of the metal substrate and fixed to both surfaces of the metal substrate, and wiring is formed on both surfaces of the metal substrate by the flexible printed wiring substrate. It is characterized by being.

The flexible printed wiring board may have a wiring structure of two or more layers, or the flexible printed wiring board may be provided with a wiring layer to connect the metal substrate to the ground.

The probe card of the present invention includes a probe unit in which a plurality of probes are arranged on a probe board, a probe card board to which the probe unit is fixed, and a main board that is connected to the probe card board and receives an external signal. The probe card substrate comprises a metal substrate having a slit therethrough, and a flexible printed wiring board that is passed through the slit of the metal substrate and fixed to both surfaces of the metal substrate. The wiring is formed by the flexible printed wiring board on both surfaces of the metal substrate, the wiring of the flexible printed wiring board fixed to one surface of the metal substrate is connected to the probe by wire bonding, A flexible print arrangement fixed to the other surface of the metal substrate. Board line may be connected to the main board by a connecting member.

The flexible printed wiring board may have a wiring structure of two or more layers, or the flexible printed wiring board may be provided with a wiring layer to connect the metal substrate to the ground.

In order to increase accuracy, it is preferable to provide an alignment hole for inserting an alignment pin in the metal substrate and the flexible printed wiring board.

A through hole or counterbore can be provided in the metal substrate, and a structure in which a probe unit is fixed to the counterbore can also be adopted.

The corner of the slit with the metal substrate surface may be obtuse.

It is also possible to mount an electronic component on the portion of the flexible printed wiring board located in the slit.

A part of the metal substrate can be divided, and a space that communicates with the slit is provided on the dividing surface, and the electronic component can be electrically connected by the flexible printed wiring board. It is.

The probe card substrate of the present invention is a probe card substrate to which a probe unit in which a plurality of probes are provided on the probe substrate is fixed in the probe card, and the probe card substrate has a metal having a slit therethrough. The flexible printed wiring board is fixed to both surfaces of the metal substrate through the substrate and the slit of the metal substrate, and wiring is formed on both surfaces of the metal substrate by the flexible printed wiring substrate. Thus, it is possible to realize a substrate that can be miniaturized at low cost.

The probe card of the present invention includes a probe unit in which a plurality of probes are arranged on a probe substrate, a probe card substrate to which the probe unit is fixed, and a main substrate to which the probe card substrate is connected and an external signal is input. The probe card substrate is composed of a metal substrate and a flexible printed wiring board fixed to both surfaces of the metal substrate through a slit penetrating the metal substrate, Wiring is formed on both surfaces of the metal substrate by the flexible printed circuit board, and the wiring of the flexible printed circuit board fixed to one surface of the metal substrate is connected to the probe by wire bonding, and the metal substrate The flexible printed circuit board fixed to the other side of the By being connected to the main board by a member, is a very simple structure electrically connecting the probe with than conventional realization, wiring, it is possible to densification possible probe card of the electrodes.

The flexible printed wiring board has a wiring structure of two or more layers, or impedance matching can be achieved by providing a wiring layer on the flexible printed wiring board and connecting the metal substrate to the ground.

By providing an alignment hole for inserting an alignment pin in the metal substrate and the flexible printed circuit board, a highly accurate probe card can be realized.

By providing the metal substrate with a through hole or counterbore, the probe unit can be easily removed.

By fixing the probe unit to the counterbore, it is possible to easily and accurately position the probe unit, and it is also possible to make the wire bond fine pitch.

By performing an obtuse angle process on the corner of the slit with the surface of the metal substrate, an effect of preventing electrical interference between the wires of the bent flexible printed circuit board is brought about.

An electronic component is mounted on a portion of the flexible printed wiring board located in the slit, or a part of the metal substrate can be divided, and a space that communicates with the slit is provided on the dividing surface. By adopting a structure in which the electronic component is electrically connected by the flexible printed circuit board, the probe cannot be lengthened due to the contact between the component area and the probe area, and the mechanical characteristics are improved. It is possible to increase the density of component mounting, and it is possible to mount a capacitor near the probe, so it is possible to improve electrical characteristics by shortening the inductance It becomes.

BRIEF DESCRIPTION OF THE DRAWINGS (a) is a schematic plan view of the whole probe card board | substrate of the 1st Embodiment of this invention, (b) is AA sectional drawing in (a). It is the top view which took out a part of board | substrate for probe cards of 1st Embodiment, (a) is a top view when it sees from the top, (b) is a top view when it sees from the bottom. It is a top view in the state where a plurality of flexible printed wiring boards were formed DUT. It is the figure which expanded the corner of the slit, (a) shows the case where a corner is a right angle, (b) shows the case where a corner is an obtuse angle. (A) is a top view of the metal substrate in which the alignment hole was provided, (b) is a top view of the flexible printed wiring board in which the alignment hole was provided. It is a schematic sectional drawing of the board | substrate for probe cards of the state which performed positioning using the alignment pin. It is a schematic sectional drawing of the board | substrate for probe cards of 2nd Embodiment. It is a schematic sectional drawing of the board | substrate for probe cards of 3rd Embodiment, (a) shows the state which assembled each component, (b) shows the state which decomposed | disassembled each component. It is a schematic sectional drawing of the probe card of the 1st Embodiment of this invention. It is a schematic sectional drawing of the probe card of 2nd Embodiment. It is a figure which shows the procedure which removes the probe unit of the probe card of 2nd Embodiment. It is a schematic sectional drawing of the probe card of 3rd Embodiment. It is a figure which shows the procedure which removes the probe unit of the probe card of 3rd Embodiment. It is a schematic sectional drawing of the probe card of 4th Embodiment.

Hereinafter, the probe card of the present invention will be described in detail with reference to the drawings. First, the probe card substrate will be described. 1 and 2 show a probe card substrate 1 according to the first embodiment. FIG. 1 is a schematic plan view and a cross-sectional view taken along line AA, and FIG.

As shown in FIG. 1, the probe card substrate 1 according to the first embodiment of the present invention includes a metal substrate 2 and a flexible printed circuit board 3. The metal substrate 2 is provided with two slits 4 penetrating the metal substrate 2, and both ends of the flexible printed wiring board 3 fixed to the upper surface of the metal substrate 2 are respectively inserted into the slits 4. Then, the metal substrate 2 extends downward and is fixed on the lower surface of the metal substrate 2.

The flexible printed wiring board 3 is formed with a wiring 6 and an electrode 5 on a portion that becomes an upper surface of the metal substrate 2, and the wiring 6 extends to a lower surface of the metal substrate 2 through a slit 4. It is connected to an electrode 7 formed near the end of the flexible printed wiring board 3 located on the lower surface of the metal substrate 2.

In the flexible printed wiring board 3, the portion inserted into the slit 4 replaces the through wiring in the conventional substrate, and the portions disposed on both surfaces of the metal substrate 2 of the flexible printed wiring substrate 3 are conventional. It replaces the thin film wiring on the substrate. As a result, all wiring on the probe card substrate 1 can be performed only by the flexible printed wiring board 3.

Furthermore, impedance matching can be achieved by forming the wiring in the flexible printed wiring board 3 to have a wiring structure of two layers (for example, a wiring layer and a ground layer) or more. The number of layers can be changed as needed. Further, instead of the ground layer, the metal substrate 2 is grounded to the ground, the ground layer of the flexible printed wiring board 3 is omitted, and the insulating film / cup wiring of the flexible printed wiring board 3 in contact with the metal substrate 2 is impedance-matched. It is also possible to take it.

As shown in FIG. 3, the flexible printed wiring board 3 is formed by forming a plurality of DUTs on a single board and selecting non-defective products. Since the ceramic substrate is not wasted and a large processing facility is not required, it is possible to manufacture at a lower cost. In addition, the wiring can be made finer than before.

The material of the metal substrate 2 is preferably a low thermal expansion 42 alloy or the like, but may be a carbon substrate or a metal substrate. By using a metal substrate, the cost can be greatly reduced as compared with a conventional ceramic substrate. In addition, it is possible to easily increase the plate thickness, and it is possible to easily ensure the mechanical strength. Further, the slit 4 can be easily formed by using a metal substrate.

The corner 8 of the slit 4 with the surface of the metal substrate 2 is normally formed at a right angle as shown in FIG. 4A, but the obtuse angle is formed at the corner 8 as shown in FIG. 4B. Processing may be performed. This prevents the flexible printed wiring board 3 from being bent at a right angle at the corner 8 and damaging the wiring 6 when the corner 8 is at a right angle, and is electrically connected by the wires of the bent flexible printed wiring board 3. It has the effect of preventing interference.

As described above, the flexible printed wiring board 3 in which a plurality of DUTs are formed and the non-defective products are selected is inserted into the slit 4 of the metal board 2, and the flexible printed wiring board 3 is bonded to both surfaces of the metal board 2 with an adhesive. By fixing, the probe card substrate 1 is manufactured. At this time, positioning the flexible printed wiring board 3 with respect to the metal substrate 2 in an accurate position affects the accuracy of the probe card substrate 1. Therefore, it is preferable to provide alignment holes in the flexible printed wiring board 3 and the metal substrate 2.

As shown in FIG. 5 (b), four alignment holes 9 are provided in the portion of the flexible printed wiring board 3 that is not inserted into the slit 4, and the alignment of the metal substrate 2 is performed as shown in FIG. 5 (a). Similarly, four alignment holes 10 are provided at positions facing the holes 9. When assembling the probe card substrate 1, both ends of the flexible printed wiring board 3 are inserted into the two slits 4, and then the four alignment holes 9 of the flexible printed wiring board 3 are inserted into the metal substrate 2. The four alignment holes 10 are aligned, and the alignment pins 11 are inserted into the alignment holes 9 and 10 as shown in FIG.

Accordingly, the flexible printed wiring board 3 and the metal board 2 are accurately positioned. In this state, the flexible printed wiring board 3 is fixed to the metal board 2. Thereafter, when the alignment pin 11 is removed, the probe card substrate 1 is completed. In this way, the flexible printed wiring board 3 is placed at an accurate position and can be fixed to the metal board 2, thereby realizing a highly accurate probe card board 1.

In addition to the electrodes 5 and 7, electronic components such as capacitors and resistors can be mounted on the probe card substrate 1 by several methods. FIG. 7 shows a probe card substrate 1 ′ of the second embodiment when the electronic component 12 is mounted in the slit 4.

In the probe card substrate 1 ′ of the second embodiment, the electronic component 12 is formed on the substrate. The width of the slit 4 provided in the metal substrate 2 is formed so that the electronic component 12 can be arranged. Then, after the flexible printed wiring board 3 is inserted into the slit 4 and the electronic component 12 is disposed in the slit 4, the flexible printed wiring board 3 is fixed to the metal substrate 2. As a result, the probe card substrate 1 ′ in which the electronic component 12 is disposed in the slit 4 is completed.

Similarly, the probe card substrate 1 ″ according to the third embodiment on which the electronic component 12 is mounted has a metal substrate having a two-divided structure, and a space 16 communicating with the slit 4 ′ is provided on the dividing surface. 12 is arranged. As shown in FIG. 8, the metal substrate 2 ′ of the probe card substrate 1 ″ is a first metal in which a recess 13 communicating with the slit 4 ′ is formed between the slits 4 ′ provided at two locations. It comprises a substrate 14 and a second metal substrate 15 that is fixed in the recess 13.

The surface of the second metal substrate 15 in contact with the first metal substrate 14 is provided with a notch that communicates with the slit 4 'when fixed. By providing the notch, a space 16 is formed on the contact surface between the first metal substrate 14 and the second metal substrate 15. In order to arrange the electronic component 12 in the space 16, the electronic component 12 is formed on the flexible printed wiring board, and the flexible printed wiring board is fixed so that the portion where the electronic component 12 is arranged is located in the space. . For this purpose, it is necessary to divide the flexible printed wiring board.

Therefore, in the present embodiment, a case where the flexible printed wiring board is divided into three will be described. As shown in FIG. 8, the first flexible printed wiring board 18 is disposed on the surface of the second metal board 15, and the second flexible printed wiring board 19 on which the electronic component 12 is formed is passed through the slit 4 '. Arranged from the surface of the second metal substrate 15 to the space 16. Further, the third flexible printed circuit board 20 is disposed from the space 16 to the surface of the first metal substrate 14 through the slit 4 ′.

Since the electrode 5 and the wiring are formed on the first flexible printed wiring board 18, and the electronic component 12 and the wiring are formed on the second flexible printed wiring board 19, On the surface, the end portions of the first flexible printed wiring board 18 and the second flexible printed wiring board 19 are fixed so that the respective wirings are connected. Further, since the electrode 7 and the wiring are formed on the third flexible printed wiring board 20, the electronic component 12 or the wiring of the second flexible printed wiring board 19 and the third flexible printed circuit are formed in the space 16. The wiring of the wiring board 20 is fixed so as to be connected. In this way, the divided flexible printed wiring board is arranged on the surface of the second metal substrate 15, the slit 4 'and the surface of the first metal substrate 14, and all the wiring is formed. Electronic components are mounted in the space 16.

The method for assembling the probe card substrate 1 ″ is as follows. First, the third flexible printed wiring board 20 and the first flexible printed wiring board 18 are fixed to the first metal board 14 and the second metal board 15 in the divided state, respectively. At this time, the first flexible printed wiring board 18 is fixed to the surface of the second metal substrate 15, and the third flexible printed wiring board 20 is provided with the slit 4 provided on the first metal substrate 14. The both ends of the metal plate 14 are inserted into the surface of the first metal substrate 14 and the space 16 of the recess 13 to be fixed.

Next, the second flexible printed wiring board 19 is connected to the third flexible printed wiring board 20 and fixed to the first metal board 15. At this time, the electronic component 12 provided on the second flexible printed wiring board 19 is arranged so as to be positioned in the space 16. In this way, when a part of the second flexible printed wiring board 19 is fixed to the first metal board 14, the second metal board 15 is fixed to the recess 13 of the first metal board 14. .

At this time, the second flexible printed wiring board 19 is disposed so as to be inserted into the slit 4 ′ formed by the first metal substrate 14 and the second metal substrate 15, When the second metal substrate 15 is fixed to the first metal substrate 14, the end of the second flexible printed wiring board 19 is connected to the first flexible printed wiring board 18. It is fixed to the second metal substrate 15. In this way, the metal substrate is divided into two parts, the space 16 communicating with the slit 4 ′ is provided on the dividing surface, and the probe card substrate 1 ″ in which the electronic component 12 is arranged in the space 16 is completed.

A probe card substrate in which the electronic component 12 is disposed in the slit 4 or the space 16 is used as a substitute for the space transformer substrate of the probe card, so that the probe is conventionally lengthened for the connection between the component area and the probe area. It was possible to increase the density of component mounting, and it was possible to mount a capacitor near the probe, so the inductance was shortened. This makes it possible to improve electrical characteristics.

Next, a probe card according to the present invention in which the above-described probe card substrate is used in place of the space transformer substrate will be described with reference to the drawings. First, the probe card 21 using the probe card substrate 1 of the first embodiment will be described, but the probe card substrates of the second and third embodiments can also be used.

As shown in FIG. 9, the probe card 21 includes a probe unit 24 in which a plurality of probes 23 are arranged on a probe substrate 22, a probe card substrate 1 to which the probe unit 24 is fixed, and the probe card substrate 1. The probe card substrate 1 is held by a holder 17, and the external signal is input to the external electrode 38.

The probe card substrate 1 includes a metal substrate 2 and a flexible printed wiring board 3 that is passed through a slit 4 penetrating the metal substrate 2 and fixed to both surfaces of the metal substrate 2. Electrodes 5 and 7 and wiring 6 are formed on the printed wiring board 3. Then, the electrode 7 formed on the portion of the flexible printed wiring board 3 located on the lower surface of the metal substrate 2 is connected to the probe 23 by the wire bond 26 and formed on the portion located on the upper surface of the metal substrate 2. The electrode 5 is connected to the electrode of the main substrate 25 by a plurality of IC pins 27 which are connecting members. Instead of the IC pin 27, a resilient connecting member such as a spring pin can be used.

Thus, the probe 23 is electrically connected to the main board 24 by the wire bond 26, the flexible printed wiring board 3, and the IC pin 27. By using the flexible printed wiring board 3, The electrical connection of the probe 23 is realized with a very simple structure as compared with the prior art. Furthermore, a probe card capable of increasing the density of wiring and electrodes can be realized.

The probe card may need to be replaced depending on the method of use and usage conditions. Therefore, in order to easily replace the probe unit, it is preferable that the probe unit can be easily detached from the probe card substrate. Then, the probe card using the board | substrate for probe cards which can remove a probe unit easily next is demonstrated.

First, a probe card 21 'of the second embodiment using a probe card substrate 28 provided with a through hole will be described. Since the structure other than the probe card substrate 28 is the same as that of the probe card 21, the description other than the probe card substrate 28 and the probe unit 24 is omitted.

As shown in FIG. 10, the metal substrate 2 'of the probe card substrate 28 used for the probe card 21' is provided with a plurality of through holes 29 where the probe unit 24 is fixed. In the state used for the probe card 21 ′, the through hole 29 is hidden by the flexible printed wiring board 3 and the probe unit 24.

When replacing the probe unit 24, first, as shown in FIG. 11A, the probe card substrate 28 is removed from the probe card 21 'in a state where the probe unit 24 is fixed to the probe card substrate 28. . Then, as shown in FIG. 11B, all of the wire bonds 26 and the flexible printed wiring board 3 are removed. From this state, the probe unit 24 is removed from the probe card substrate 28 using the through hole 29. At this time, two kinds of methods are possible.

First, as shown in FIG. 11C, a rod 35 is inserted into the through-hole 29 and the probe substrate 22 of the probe unit 24 is pushed, so that the probe unit 24 is removed from the probe card substrate 28. As shown in FIG. 11 (d), the second is a method of injecting a stripping solution 36 into the through-hole 29 to release the probe card substrate 28 and the probe substrate 22 from being fixed, and the probe unit. In this method, 24 probe boards 22 are removed from the probe card board 28. Thus, the probe unit 24 can be easily detached from the probe card substrate 28 by appropriately selecting two types of methods according to various conditions.

Next, a probe card 21 '' of the third embodiment using a probe card substrate 28 'provided with counterbore will be described. Since the structure other than the probe card substrate 28 ′ is the same as that of the probe cards 21, 21 ′, the description other than the probe card substrate 28 ′ and the probe unit 24 is omitted.

As shown in FIG. 12, a plurality of counterbore 30 are provided on the outer peripheral portion of the place where the probe unit 24 is fixed on the probe card substrate 28 ′ used in the probe card 21 ″. In the state used for the probe card 21 ″, a part of the counterbore 30 is exposed from the periphery of the probe substrate 22 of the probe unit 24.

When exchanging the probe unit 24, first, as shown in FIG. 13A, the probe card substrate 28 is removed from the probe card 21 'with the probe unit 24 fixed. Then, as shown in FIG. 13B, all of the wire bonds 26 and the flexible printed wiring board 3 are removed. From this state, using the counterbore 30, the probe unit 24 is removed from the probe card substrate 28 '.

As shown in FIG. 13 (c), a rod is inserted into the counterbore 30, and the rod is used like a lever to move in the direction of the arrow, so that the probe substrate 22 of the probe unit 24 is moved to the probe card substrate. Remove from 28 '. In this manner, the probe unit 24 can be easily removed from the probe card substrate 28 ′ by providing the counterbore 30.

In the probe card 21 ″, the counterbore is used for removing the probe unit 24, but the probe card 31 of the fourth embodiment in which the counterbore can be used for positioning the probe unit 24 will be described. The probe card 31 has the same structure as the probe cards 21, 21 ′, and 21 ″ except for the probe card substrate 32, and therefore, the description other than the probe card substrate 32 and the probe unit 24 is omitted.

As shown in FIG. 14A, the probe card substrate 32 used in the probe card 31 is provided with a counterbore 33 into which the probe unit 24 is fitted on the surface of the metal substrate 34 on which the probe unit 24 is fixed. The probe unit 24 is fitted and fixed to the counterbore 33. Therefore, by forming the counterbore 33 with high accuracy, accurate positioning can be performed only by fitting the probe unit 24 into the counterbore 33.

For this purpose, it is necessary to form the counterbore 33 with high accuracy. As a method for this, a method of forming a counterbore on the metal substrate 34 using a high-precision machine tool or a surface of the metal substrate 34 is used. It can be realized by attaching a dry film, patterning the counterbore 33, and performing etching to remove the dry film.

Further, by using the counterbore 33, the height from the surface of the metal substrate 34 to the tip of the probe 23 can be increased as compared with other types of probe cards 21, 21 ′, 21 ″ using the same probe unit 24. The depth of the counterbore 33 can be lowered. Thereby, the fine pitch of the wire bond 26 can be achieved. Furthermore, the counterbore 33 can be applied to a probe card with a single pin arrangement by reducing the size and providing the same number of the counterbore 33 as shown in FIG. 14B.

As described above, the probe card of the present invention uses a probe card substrate composed of a flexible printed wiring board and a metal substrate, so that not only the wiring and electrodes can be densified, but also various devices can be added. As a result, usability is further improved and a probe card with higher accuracy is realized.

1, 1 ′, 1 ″ Probe card substrate 2, 2 ′ Metal substrate 3 Flexible printed wiring substrate 4, 4 ′ Slit 5 Electrode 6 Wiring 7 Electrode 8 Corner 9 Alignment hole 10 Alignment hole 11 Alignment pin 12 Electronic component 13 Dimple 14 1st metal board 15 2nd metal board 16 Space 18 1st flexible printed wiring board 19 2nd flexible printed wiring board 20 3rd flexible printed wiring boards 21, 21 ', 21''Probe card 22 Probe Substrate 23 Probe 24 Probe unit 25 Main substrate 26 Wire bond 27 IC pin 28 Probe card substrate 29 Through hole 30 Counterbore 31 Probe card 32 Probe card substrate 33 Counterbore 34 Metal substrate 35 Bar 36 Stripping solution 37 Bar 38 External electrode

Claims (10)

A metal substrate having a slit to penetrate, and a flexible printed wiring board that is passed through the slit of the metal substrate and fixed to both surfaces of the metal substrate,
A probe card substrate, wherein wiring is formed on both surfaces of the metal substrate by the flexible printed circuit board. A probe card comprising a probe unit having a plurality of probes arranged on a probe substrate, a probe card substrate to which the probe unit is fixed, and a main substrate connected to the probe card substrate and to which an external signal is input. And
The probe card substrate includes a metal substrate having a slit therethrough, and a flexible printed wiring board that is passed through the slit of the metal substrate and fixed to both surfaces of the metal substrate. The flexible printed wiring board forms a wiring,
The wiring of the flexible printed wiring board fixed to one surface of the metal substrate is connected to the probe by wire bonding, and the wiring of the flexible printed wiring board fixed to the other surface of the metal substrate is connected by a connecting member. A probe card connected to the main board. The probe card according to claim 2, wherein the flexible printed wiring board has a wiring structure of two or more layers. The probe card according to claim 2, wherein a wiring layer is provided on the flexible printed wiring board, and the metal substrate is connected to a ground. The probe card according to any one of claims 2 to 4, wherein an alignment hole for inserting an alignment pin is provided in the metal substrate and the flexible printed wiring board. The probe card substrate according to claim 2, wherein a through hole or a counterbore is provided in the metal substrate. The probe card according to claim 6, wherein the probe unit is fixed to the counterbore. The probe card according to any one of claims 2 to 7, wherein an obtuse angle is applied to a corner of the slit with the surface of the metal substrate. The probe card according to any one of claims 2 to 8, wherein an electronic component is mounted on a portion of the flexible printed wiring board located in the slit. A part of the metal substrate can be divided, an electronic component is arranged with a space communicating with the slit on a dividing surface, and the electronic component is electrically connected by the flexible printed wiring board. The probe card according to any one of claims 2 to 9.