JP2011071386A - Cooling apparatus - Google Patents

Abstract

A cooling device that can be easily formed, can control the variation in the speed of a refrigerant flowing through a microchannel, and can easily change the width of the microchannel, with an arbitrary width of the microchannel. provide.
A lower plate member 3 thermally connected to a heat generating component, a refrigerant inlet 5 and a refrigerant outlet 6, and an upper plate member 2 forming a hollow portion by being arranged opposite to the lower plate member 3, A cooling device 1 including a fin module in which fins 4 are arranged at a predetermined fin pitch arranged in a hollow portion, wherein an upper plate member 2 and a lower plate member 3 are joined by a fin module. Cooling device 1.
[Selection] Figure 1

Description

  The present invention relates to a cooling device for cooling an element to be cooled by circulating heat through a minute flow path formed therein to exchange heat with a refrigerant.

  Japanese Laid-Open Patent Publication No. 2006-247828 (Patent Document 1) discloses a microchannel structure used as a heat exchange component having high cooling performance by flowing a fluid cooling medium through a fine channel. FIG. 7 is a perspective view illustrating a microchannel structure. As shown in FIG. 7, the microchannel structure 100 disclosed in Patent Document 1 includes an outer peripheral wall member including an outer peripheral wall member upper portion 101 and an outer peripheral wall member lower portion 102 and a corrugated plate member 103.

  A housing portion 104 that houses the corrugated plate member 103 is formed inside the outer peripheral wall member. The corrugated plate member 103 is formed into a corrugated shape, and a plurality of fine flow paths 105 extending in the ridge line direction are formed. The top part 106 and the bottom part 107 of the corrugated plate member 103 are in contact with the outer peripheral wall member. A spherical member 108 is disposed on the surface of the corrugated plate member 103 to prevent the fine channel 105 from being blocked.

  Japanese Unexamined Patent Publication No. 2006-308263 (Patent Document 2) discloses a heat exchange device including a plurality of microchannels which are micro grooves. FIG. 8 is a diagram for explaining a microchannel structure disposed in a heat exchange device having a microchannel.

  As shown in FIG. 8, the heat exchange device provided with the microchannel disclosed in Patent Document 2 has a plate 202 having a plurality of slits 201 parallel to each other at a predetermined interval, and the slits 201 overlap each other. The microchannel structure 200 including a plurality of fine grooves 204 formed by stacking and joining on the joining member 203 and cutting an end portion in a direction orthogonal to the slit 201 is provided.

JP 2006-247828 A JP 2006-308263 A

  In the microchannel structure described in Patent Document 1, since the corrugated plate member is used, it is difficult to arbitrarily set the fin pitch of the corrugated plate member. Therefore, it is difficult to arbitrarily set the width of the fine flow path, and the amount and speed of the refrigerant flowing for each fine flow path vary. As a result, there is a problem in that the heat exchange performance in each fine channel varies and a temperature distribution occurs in the heat source.

  Furthermore, in the microchannel structure described in Patent Document 1, it is difficult to arbitrarily set the fin pitch of the corrugated plate member. When setting the fin pitch, a jig corresponding to each fin pitch is used. Necessary. As a result, there is a problem that the design change is not easy.

  In the microchannel structure described in Patent Document 2, after the plate 202 having a plurality of slits 201 that are parallel to each other at a predetermined interval as described above is laminated so that the slits 201 overlap, Since it is necessary to cut the laminated board so as to open, there is a problem that the manufacturing process becomes complicated and it is difficult to reduce the cost.

  Accordingly, an object of the present invention is to form easily, to set the width of the fine flow path arbitrarily, to suppress variation in the speed of the refrigerant flowing through the fine flow path, and to easily change the width of the fine flow path. It is to provide a cooling device that can do this.

  The inventor has conducted extensive research to solve the above-described conventional problems. As a result, the lower plate member thermally connected to the heat generating component, and the upper plate member that includes the refrigerant inlet and the refrigerant outlet and that is disposed opposite to the lower plate member to form the cavity portion are disposed in the cavity portion. When the fin modules are arranged with fins arranged at a predetermined fin pitch, the formation is easy, the width of the fine flow path is set arbitrarily, the variation in the speed of the refrigerant flowing through the fine flow path is suppressed, and It was found that the width of the fine channel can be easily changed.

  In addition, as a fin module in which fins are arranged at an arbitrary fin pitch, a fin having an upper surface portion, a vertical surface portion, and a lower surface portion, the upper surface portion is thermally connected to the upper plate material, and the lower surface portion is thermally connected to the lower plate material. It has been found that when a plurality of plates are arranged in parallel while being connected to each other, the upper plate member and the lower plate member can be joined by the fin module to easily form a fine channel having an arbitrary width. The present invention has been made based on the research results described above.

  A first aspect of the cooling device of the present invention includes a lower plate material thermally connected to a heat-generating component, a refrigerant inlet and a refrigerant outlet, and forms a hollow portion by being arranged opposite to the lower plate material. A cooling device including an upper plate material and a fin module in which fins are arranged at an arbitrary fin pitch and disposed in the hollow portion, wherein the upper plate material and the lower plate material are joined by the fin module. This is a cooling device.

  According to a second aspect of the cooling device of the present invention, the fin includes an upper surface portion, a vertical surface portion, and a lower surface portion, the upper surface portion is thermally connected to the upper plate material, and the lower surface portion is heated to the lower plate material. In the cooling device, the fin module is formed by arranging a plurality of the fins in parallel with each other.

  According to a third aspect of the cooling device of the present invention, the fin includes a recessed portion on a side of the upper surface portion that is connected to the vertical surface portion, and is opposed to a side of the upper surface portion that is connected to the vertical surface portion. A cooling device in which a protrusion corresponding to the recess is provided on a side to be fixed, and the protrusion is fixed to the recess between adjacent fins.

  According to a fourth aspect of the cooling device of the present invention, the fin is a thin plate-like fin having a mounting hole, the upper end side of the thin plate-like fin is connected to the upper plate material, and the lower end side of the thin plate-like fin is the lower side. A cooling device in which a plurality of fins are arranged in parallel in a state of being connected to a plate material, and are fixed by a support member inserted through the mounting hole to form the fin module.

  The 5th aspect of the cooling device of this invention is a cooling device with which the said fin module is equipped with the pressure | voltage resistant structure provided with the fin longer than the said several fin arrange | positioned in parallel.

  According to the heat sink of the present invention, the fin module in which the thin plate fins are arranged in parallel is arranged in the cavity formed by the upper plate material and the lower plate material so that the upper plate material and the lower plate material are joined to each other. Can be formed. Furthermore, since the interval between the fins can be set stably, the fine channel width can be set arbitrarily, and the heat source surface can be efficiently cooled without causing variations in the speed of the refrigerant flowing in the fine channel. it can. Furthermore, since the interval between the fins can be easily changed, the design can be easily changed.

FIG. 1 is a diagram for explaining one embodiment of the cooling device of the present invention. FIG. 1A is a perspective view. FIG. 1B is an exploded view. FIG. 2 is a diagram illustrating one embodiment of the fin module. FIG. 2A is a plan view of the fin module. FIG. 2B is a side view of the fin module. FIG.2 (c) is a perspective view of the fin which forms a fin module. FIG. 3 is a perspective view for explaining another embodiment of the fin module of the cooling device of the present invention. FIG. 4 is a perspective view for explaining another embodiment of the fin module of the cooling device of the present invention. FIG. 5 is a diagram illustrating another aspect of the fin module disposed in the cavity formed by the upper plate member and the lower plate member. FIG. 5A is a plan view. FIG. 5B is an enlarged view of one aspect of the circled portion shown in FIG. FIG.5 (c) is an enlarged view of another aspect of the circled part shown to Fig.5 (a). FIG. 6 is a diagram for explaining another aspect of the fin module disposed in the cavity formed by the upper plate member and the lower plate member. FIG. 7 is a perspective view for explaining a conventional microchannel structure. FIG. 8 is a diagram for explaining a microchannel structure disposed in a heat exchange apparatus having a conventional microchannel.

An embodiment of a cooling device of the present invention will be described with reference to the drawings.
One aspect of the cooling device of the present invention includes a lower plate member that is thermally connected to a heat-generating component, a refrigerant inlet and a refrigerant outlet, and is arranged to face the lower plate member to form a cavity. And a fin module in which fins are arranged at an arbitrary fin pitch arranged in the cavity, wherein the upper plate member and the lower plate member are joined by the fin module. It is.

FIG. 1 is a diagram for explaining one embodiment of the cooling device of the present invention. FIG. 1A is a perspective view. FIG. 1B is an exploded view. As shown in FIG. 1A, the cooling device 1 of the present invention includes an upper plate material 2 and a lower plate material 3.
The upper plate member 2 is a thin plate-like member having a refrigerant inlet 5 and a refrigerant outlet 6 and having a recess (not shown) on the inside.

  The lower plate material 3 is a thin plate-like member provided with a recess 7 corresponding to the recess of the upper plate material therein, and is disposed to face the upper plate material 2 to form a hollow portion therein. A fin module 4 in which fins are arranged at a predetermined fin pitch is disposed in a cavity formed by the upper plate member 2 and the lower plate member 3.

  In the cooling device 1, the upper portion of the fin module 4 and the inner wall of the upper plate member 2 are joined, and the lower portion of the fin module 4 and the inner wall of the lower plate member 3 are joined. Thus, since the fin module 4 and the upper board | plate material 2 and the lower board | plate material 3 are joined, a pressure | voltage resistant function can be provided. The upper plate material 2 and the lower plate material 3 are each formed of a metal material having excellent thermal conductivity, such as copper or aluminum.

  Thus, the fine flow path is formed by the fin module 4 in which the fins are arranged at a predetermined fin pitch, and the upper plate material 2 and the lower plate material 3 are joined by the fin module 4 so that the refrigerant passes through the fine flow path. A circulating cooling device 1 is formed.

  FIG. 2 is a diagram illustrating one embodiment of the fin module. FIG. 2A is a plan view of the fin module. FIG. 2B is a side view of the fin module. FIG.2 (c) is a perspective view of the fin which forms a fin module. As shown in FIG. 2 (c), the fin 8 is made of a thin plate material having a generally U-shaped cross section including an upper surface portion 9, a vertical surface portion 10, and a lower surface portion 11. The upper surface portion 9 and the lower surface portion 11 are formed to extend in the same direction from the upper end portion and the lower end portion of the vertical surface portion in parallel with each other.

  The fins 8 are formed of a metal having excellent thermal conductivity, such as copper or aluminum. The fin 8 includes at least one hollow portion 12 on the side of the upper surface portion 9 that is connected to the vertical surface portion 10. Further, the fin 8 is provided with a protruding portion 13 corresponding to the above-described depression 12 on the side facing the side of the upper surface portion 9 that is connected to the vertical surface portion 10.

  In the embodiment shown in FIG. 2C, the above-described indented portion 12 and protrusion 13 are provided on the side of the lower surface portion 11 that is connected to the vertical surface portion 10 and the side of the lower surface portion 11 that is connected to the vertical surface portion 10. Are also provided on the sides facing each other. The shape of the above-described depression and the corresponding protrusion is not limited to the shape shown in FIG. 2C, and adjacent fins are connected without affecting the flow of the refrigerant in the microchannel. Just do it.

  A plurality of fins described with reference to FIG. 2 (c) are arranged in parallel to form a fin module 4 as shown in FIGS. 2 (a) and 2 (b). As shown in FIG. 2A, the recesses 12 and the protrusions 13 of the adjacent fins are fitted, and the upper surface 15 of the fin module 4 forms a flat surface as a whole.

  Similarly, the lower surface 16 of the fin module forms a flat surface as a whole. Furthermore, as shown in FIG. 2B, in the state where a plurality of U-shaped fins 8 are arranged in parallel, the fin portion does not protrude into the space 14 serving as a fine flow path.

  As described with reference to FIG. 1, the fin module 4 is disposed in a cavity formed by the upper plate material 2 and the lower plate material 3, the upper surface 15 is joined to the inner wall of the upper plate material 1, and the lower surface 16 is the lower surface. Joined to the inner wall of the plate 3. In this way, the fine flow path 14 is easily formed at a desired fin interval.

  The fine channel formed in this way can easily set the width arbitrarily, and the speed of the refrigerant flowing in the fine channel can be set to an ideal state. Further, when the width is constant, variations in the speed of the refrigerant flowing in the fine flow path are unlikely to occur. Since the fin module 4 described with reference to FIG. 2 has the lower surface 16 joined to the lower plate member 3, the heat of the heating element can be easily transferred to the fin module 4 via the lower plate member 3. Further, a part of the heat transferred to the fin module 4 is further transferred to the upper plate 2 and radiated.

  In the cooling device 1 described with reference to FIG. 1 and FIG. 2, the refrigerant is guided from the refrigerant inlet 5 provided in the upper plate member 2 into the cavity formed by the upper plate member 2 and the lower plate member 3, and then into the cavity portion. Through the fine flow path formed between the fins of the fin module 4 arranged, the refrigerant discharged from the refrigerant outlet 6 provided in the upper plate 2 to the outside of the cooling device and cooled at a desired site circulates. It is again led into the cooling device from the refrigerant inlet. The fin module 4 according to the present invention can easily form a fine channel with a desired fin pitch by adjusting the widths of the upper surface portion 9 and the lower surface portion 10 of the fin.

  FIG. 3 is a perspective view for explaining another embodiment of the fin module used in the cooling device of the present invention. The fin module 24 according to this aspect includes a plurality of plate-like fins 25 having attachment holes 27, and the plurality of plate-like fins 25 are arranged in parallel at a predetermined pitch and are supported by a support body 26 inserted through the attachment holes 27. It is fixed and formed. The fin module 24 described with reference to FIG. 3 is arranged in a cavity formed by joining the upper plate member 2 and the lower plate member 3 so as to face each other, similarly to the fin module 4 shown in FIG.

  At that time, the upper end side of the thin plate-like fins 25 arranged at a predetermined pitch is joined to the flat inner wall of the upper plate member 2, and the lower end side of the plate-like fin 25 is joined to the flat inner wall of the lower plate member 3 and connected. It arrange | positions in a cavity part in a state. In this manner, the fine flow path 28 is easily formed with a desired fin interval.

  In the cooling device described with reference to FIG. 1 and FIG. 3, the refrigerant is guided from the refrigerant inlet 5 provided in the upper plate member 2 into the cavity portion 7 formed by the upper plate member 2 and the lower plate member 3. It passes through the fine flow path 28 formed by the adjacent fins of the fin module 24 arranged in the section, the upper plate material and the lower plate material, and is discharged out of the cooling device from the refrigerant outlet 6 provided in the upper plate material 2, The refrigerant cooled at a desired site circulates and is led again into the cooling device from the refrigerant inlet.

  FIG. 4 is a perspective view for explaining another embodiment of the fin module of the cooling device of the present invention. The fin module 34 of this aspect includes a pressure-resistant structure including a plurality of fins 25 arranged in parallel and a pressure-proof fin 29 longer than the fins 25.

  As shown in FIG. 4, the fin module 34 of this aspect includes a thin plate-like fin 25 having a mounting hole 27 and a pressure-resistant fin 29 longer than the fin-shaped fin 25, and the plurality of thin-plate fins 25 and the pressure-resistant fins 29 are predetermined. Are arranged in parallel at a pitch of and fixed by a support 26 inserted through the mounting hole 27.

  The pressure-resistant fins 29 are sequentially arranged so as to sandwich a predetermined number of thin plate-like fins 25 arranged in parallel at a predetermined pitch. The heights of the thin plate fin 25 and the pressure-resistant fin are set to be the same. The fin module 34 described with reference to FIG. 4 is disposed in a hollow portion formed by facing and joining the upper plate member 2 and the lower plate member 3 shown in FIG.

  As described with reference to FIG. 3, at that time, the upper end sides of the thin plate-like fins 25 and the pressure-resistant fins 29 arranged at a predetermined pitch are joined and connected to the flat inner wall of the upper plate member 2. The lower end sides of the thin plate-like fins 25 and the pressure-resistant fins 29 are arranged in the hollow portion in a state where they are joined and connected to the flat inner wall of the lower plate material 3. In this way, the fine flow path 38 is easily formed at a desired fin interval.

  In this embodiment, the pressure-resistant fins 29 are longer than the thin plate-like fins 25, and the joining area between the upper plate member 2 and the lower plate member 3 can be made longer. For this reason, when a refrigerant | coolant is introduce | transduced into the cavity formed by the upper board | plate material 2 and the lower board | plate material 3, the deformation | transformation of the cooling device by the pressure (positive pressure or negative pressure) can be suppressed.

  In the cooling device described with reference to FIG. 1 and FIG. 4, the refrigerant is guided from the refrigerant inlet 5 provided in the upper plate member 2 into the cavity portion 7 formed by the upper plate member 2 and the lower plate member 3. Is passed through the fine flow path 38 formed by the fins adjacent to the fin module 34 disposed in the upper plate material and the lower plate material, and is discharged out of the cooling device from the refrigerant outlet 6 provided in the upper plate material 2, as desired. The refrigerant cooled in this part circulates and is led again into the cooling device from the refrigerant inlet.

  FIG. 5 is a diagram illustrating another aspect of the fin module disposed in the cavity formed by the upper plate member and the lower plate member. FIG. 5A is a plan view. FIG. 5B is an enlarged view of one aspect of the circled portion shown in FIG. FIG.5 (c) is an enlarged view of another aspect of the circled part shown to Fig.5 (a). As shown to Fig.5 (a), the shape in the refrigerant | coolant inlet side of the fin module 4 and the refrigerant | coolant outlet side is made substantially diagonal.

  Thus, by making the refrigerant inlet side of the fin module 4 slant, the refrigerant flowing from the refrigerant inlet can be introduced between the fins 8 forming the fine flow path of the fin module 4 with a small flow resistance. it can. Similarly, by making the refrigerant outlet side of the fin module 4 oblique, the refrigerant that has come out between the fins 8 forming the fine flow path of the fin module 4 can be discharged out of the cooling device with a small flow resistance. it can.

  In the embodiment shown in FIG. 5 (b), fins 8 having a generally U-shaped cross section arranged in parallel are arranged in a staircase shape to show an oblique shape as a whole. FIG. 5B shows the upper surface portion 9 of the fin 8. In the embodiment shown in FIG. 5 (c), the upper surface portion and the lower surface portion of the fin having a substantially U-shaped cross section composed of the upper surface portion, the vertical surface portion, and the lower surface portion are cut off at a predetermined angle.

  In this way, a plurality of fins with the corners of the upper surface portion and the lower surface portion cut out are arranged in parallel to form a parallelogram fin module as a whole. In any of the modes shown in FIGS. 5B and 5C, the opening is substantially enlarged at the entrance and exit of the fine flow path of the fin module, and the flow of the refrigerant is easy. The resistance is set to be small. In the embodiment shown in FIG. 5, the opening of the fin module (the refrigerant inflow portion and the outflow portion) has been described as being stepped or linear, but may be curved.

  FIG. 6 is a diagram for explaining another aspect of the fin module disposed in the cavity formed by the upper plate member and the lower plate member. In this aspect, the ends of the individual fins on the refrigerant inlet side of the fin module 4 described with reference to FIG. 5C are bent toward the refrigerant inlet (see the circled portion). . The bent portions of the individual fins are processed to maintain a U-shaped cross section, or the upper and lower surface portions of the end portions of the fins are removed so that only the vertical surface portions are formed.

  The flow path resistance of the refrigerant can be reduced by bending the shape of the fin on the refrigerant inlet side of the fin module 4 toward the refrigerant inlet side. Even if the fin shape on the refrigerant outlet side is bent toward the refrigerant outlet side, the flow path resistance of the refrigerant can be similarly reduced.

The cooling device of the present invention will be described in more detail with reference to examples.
A cooling device (heat exchanger) according to the present invention was prepared as shown in FIG. The cooling device 1 has a width of 60 mm, a length of 120 mm, and a height of 10 mm. The upper plate 2 and the flat lower plate 3 formed by cutting, pressing, drawing, etc. are sealed using a joining method such as brazing. I let you.

  In addition, a pipe port is provided at a predetermined position of the upper plate 2 as a refrigerant inlet 5 and a refrigerant outlet 6 for circulating the refrigerant. Moreover, the fin module 4 as a fine channel structure was attached to the upper plate material 2 and the lower plate material 3 of the cooling device 1 by a joining method such as brazing.

  In addition to brazing, each member may be joined by soldering, bonding, diffusion bonding, or the like. In addition, when diffusion bonding is used, a member such as a brazing material is not required. Therefore, it is possible to reduce the member cost. Moreover, the material of the member which comprises a cooling device uses the metal with good heat conductivity, such as copper, aluminum, iron, stainless steel, according to the composition of a refrigerant | coolant.

  The fin module 4 as the fine channel structure in the cooling device of the present invention shown in the exploded view of FIG. 1B is formed from the upper surface portion, the vertical surface portion, and the lower surface portion as shown in FIGS. The cross section is formed by arranging a plurality of generally U-shaped fins in parallel. That is, 62 fin plates having a height of 5 mm and a length of 50 mm are arranged with a fin pitch of 0.8 mm (that is, the length of the upper surface portion and the lower surface portion of the fin). As the material of the fin plate, the same material as that of the container (upper plate material, lower plate material) constituting the cooling device can be used.

  When a 100 W heat source having a size of 40 mm square was attached to the cooling device of the present invention, the temperature of the heat source could be suppressed to (temperature of the refrigerant at the inlet of the cooling device + 10) ° C.

  In addition, the fin module as a fine channel structure is inserted into the support attachment holes provided by a burring process or the like at predetermined positions of the plurality of thin plate fins as shown in FIG. The desired cooling effect was obtained even when the thin plate fins were arranged at predetermined intervals.

  Further, as shown in FIG. 4, if the length of some of the thin plate-like fins is extended, it can function as a pressure-resistant structure and can prevent the hollow portion inside the cooling device from being deformed.

  As described above, according to the present invention, the formation is easy, the width of the fine flow path is arbitrarily set, the variation in the speed of the refrigerant flowing through the fine flow path is suppressed, and the width of the fine flow path is easy. It is possible to provide a cooling device that can be changed to

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Upper board | plate material 3 Lower board | plate material 4 Fin module 5 Refrigerant inlet 6 Refrigerant outlet 7 Recess 8 Fin 9 Upper surface part 10 Vertical surface part 11 Lower surface part 12 Indentation part 13 Protrusion part 14 Microchannel 15 Upper surface 16 Lower surface 24 Fin module 25 Thin plate Fin 26 Support 27 Mounting hole 28 Fine channel 29 Pressure-resistant fin

Claims (5)

A lower plate material thermally connected to the heat-generating component;
An upper plate member that includes a refrigerant inlet and a refrigerant outlet, and that forms a hollow portion by being disposed opposite to the lower plate member;
A cooling device including a fin module disposed in the cavity and having fins arranged at an arbitrary fin pitch;
The cooling apparatus, wherein the upper plate member and the lower plate member are joined by the fin module.   The fin includes an upper surface portion, a vertical surface portion, and a lower surface portion, wherein the upper surface portion is thermally connected to the upper plate material and the lower surface portion is thermally connected to the lower plate material, The cooling device according to claim 1, wherein the fin module is formed by arranging fins in parallel.   The fin includes a recessed portion on a side of the upper surface portion that is connected to the vertical surface portion, and a protruding portion corresponding to the recessed portion is formed on a side of the upper surface portion that faces the side of the upper surface portion that is connected to the vertical surface portion. The cooling device according to claim 2, wherein the protrusion is fixed to the recess between the adjacent fins.   The fin comprises a thin plate-like fin having an attachment hole, and a plurality of fins are formed in a state where the upper end side of the thin plate-like fin is connected to the upper plate member and the lower end side of the thin plate-like fin is connected to the lower plate member. The cooling device according to claim 1, wherein the fin modules are formed by being arranged in parallel and fixed by a support inserted through the attachment hole. The cooling device according to claim 4, wherein the fin module includes a pressure-resistant fin that is longer than the plurality of fins arranged in parallel.

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