JP2011062782A - Polishing device - Google Patents

Abstract

【Task】
An object of the present invention is to provide a wafer polishing apparatus in which a cooling structure is simplified.
[Solution]
A rotatable polishing table 1 to which a polishing pad 2 is adhered and a workpiece 8 are held, and the polishing table 1 is brought into contact with the polishing pad 2 and rotated while the polishing table 1 is in contact with the polishing pad 2. 4, an airflow generating mechanism 10 including a blade that generates an airflow F with respect to the exposed surface of the polishing pad 2 by the rotation of the polishing target holding mechanism 4, and polishing for supplying an abrasive 21 to the polishing pad 2 A polishing apparatus comprising an agent supply mechanism 20.
[Selection] Figure 1

Description

  The present invention relates to a polishing apparatus used for polishing a surface of an object to be polished in a method for manufacturing a semiconductor device.

  In recent years, chemical mechanical polishing (hereinafter referred to as “CMP”) has been used as a method for planarizing the surface of a semiconductor wafer.

  The CMP process used here rotates both the polishing head body holding the wafer and the turntable with the polishing pad attached, and polishes a slurry (abrasive) containing abrasive grains such as alumina and colloidal silica. The surface of the wafer is flattened and polished into a mirror surface by pressing the wafer polishing surface against the polishing pad with a constant force while supplying the pad.

  At this time, since the polishing layer of the polishing pad is generally formed of a resin such as polyurethane, the frictional heat between the wafer polishing surface and the polishing layer of the polishing pad in the polishing surface or when polishing the wafer polishing surface The surface temperature of the polishing layer rises due to the reaction heat of the generated chemical reaction. As a result, there arises a problem that the polishing rate of the wafer decreases due to the increase in surface temperature.

  From the above viewpoint, as a technique for preventing the temperature rise of the polishing layer, for example, the surface of the polishing pad is cooled by spraying a fluid from a fluid blowing mechanism such as a blowing nozzle on the polishing pad constituting the wafer polishing apparatus. There is a known method (see, for example, Patent Document 1).

  However, in the conventional cooling method, a fluid blowing mechanism that blows fluid apart from an apparatus necessary for polishing (wafer polishing apparatus), a control mechanism that controls the fluid blowing mechanism, and a power source that drives these mechanisms must be provided. In other words, there is a problem that the structure for cooling the surface of the polishing pad becomes complicated. For this reason, a simple cooling mechanism for preventing the temperature rise of the polishing layer is required.

JP 2007-181910 A

  Therefore, the present invention provides a polishing apparatus having a simplified cooling structure.

  In order to achieve the above object, a polishing apparatus according to one embodiment of the present invention includes a rotatable polishing table to which a polishing pad is attached, a target object, and the target object in contact with the target pad. A polishing object holding mechanism that can rotate together with the polishing object holding mechanism; an airflow generation mechanism that includes a blade plate that generates an airflow with respect to the exposed surface of the polishing pad by rotation of the polishing object holding mechanism; and supplying an abrasive to the polishing pad And an abrasive supply mechanism.

  According to the present invention, it is possible to provide a wafer polishing apparatus with a simplified cooling structure.

1 is a perspective view showing an overview of a wafer polishing apparatus according to a first embodiment of the present invention. 1 is a side view showing an overview of a wafer polishing apparatus according to a first embodiment of the present invention. The top view for demonstrating the airflow generation mechanism of the wafer polisher in the 1st Embodiment of this invention. The side view for demonstrating the airflow generation mechanism of the wafer polisher in the 1st Embodiment of this invention. The schematic diagram which shows the airflow produced at the time of grinding | polishing of the wafer polisher in the 1st Embodiment of this invention. The side view which shows the general view of the wafer polishing apparatus in the 2nd Embodiment of this invention. The top view which shows the general view of the wafer polishing apparatus in the 2nd Embodiment of this invention. The side view which shows the general view of the wafer polishing apparatus in the 3rd Embodiment of this invention. The side view for demonstrating the modification of the airflow generation mechanism of the wafer polisher in each embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
In the first embodiment, the present invention is applied to a wafer polishing apparatus and will be described with reference to FIGS. 1 is a perspective view showing an overview of a wafer polishing apparatus according to a first embodiment of the present invention, FIG. 2 is a side view showing an overview of the wafer polishing apparatus, and FIG. 3 shows an airflow generation mechanism in the wafer polishing apparatus. FIG. 4 is a top view for explaining, and FIG. 4 is a side view for explaining an airflow generation mechanism of the wafer polishing apparatus.

  As shown in FIGS. 1 and 2, the wafer polishing apparatus according to the present embodiment holds a rotatable polishing table to which a polishing pad is attached, a target object, and contacts the target object with the polishing pad. An air flow generating mechanism including a rotatable polishing body holding mechanism, a blade plate that generates an air flow with respect to the exposed surface of the polishing pad by rotation of the polishing body holding mechanism, and an abrasive supply for supplying the polishing pad with the polishing agent It consists mainly of mechanisms.

  A polishing table (hereinafter referred to as a turntable) 1 has a polishing surface formed by attaching a polishing pad 2 to an upper surface. The turntable 1 is provided so as to be rotatable in the direction of arrow R1 by a drive mechanism (not shown) such as a motor connected to the turntable rotating shaft 3.

  The object holding mechanism 4 includes a polishing head body 5 installed above the turntable 1. The polishing head main body 5 is pivotally attached to the lower end of a polishing head rotating shaft (also referred to as a polishing target holding rotating shaft) 6 for holding a wafer as a polishing target and pressing the wafer against the polishing pad 2 for contact. It is provided so as to be movable in the vertical direction by a drive mechanism (not shown), and is provided so as to be rotatable in the direction of arrow R2 about the polishing head rotating shaft 6.

  A wafer 8 is held on the lower surface of the polishing head body 5 as shown in FIG. A retainer ring 7 is detachably mounted on the outer peripheral portion of the lower surface of the polishing head body 5 as shown in FIG. The retainer ring 7 is provided to prevent the wafer 8 from jumping out from the lower surface of the polishing head body 5.

  The airflow generation mechanism 10 is for generating an airflow for cooling the surface (exposed surface) of the polishing pad 2 by the rotation of the polishing head body 5. In this embodiment, a plurality of, for example, 16 blades are used. It consists of a plate. Each of the blade plates 10 is attached to the side surface (outer peripheral surface) of the polishing head body 5 and has a shape protruding in the radially outward direction of the polishing head body 5.

  3 and 4 are diagrams for explaining the blade plate 10. FIG. 3 is a top view of the blade plate attached to the polishing head main body as viewed from above, and FIG. 4 is a blade attached to the polishing head main body. FIG. 4 is a side view of the plate viewed from the side, and FIG. 4 schematically shows an enlarged main part of one blade in the same state.

  Each of the slats 10 has a rectangular shape as shown in FIG. 3 when viewed from the upper surface and a flat plate shape with a uniform thickness as shown in FIG. 4 when viewed from the side. Yes. The blade plate 10 is provided so as to have an angle of attack with respect to the airflow toward the blade plate 10 viewed from the polishing head body 5 during the rotation of the polishing head body 5.

  Further, as shown in FIG. 4, each of the blade plates 10 has a front end surface when a front side is defined as a front end surface portion 10 a and a rear side is defined as a rear end surface portion 10 b with respect to the rotation direction R <b> 2 of the polishing head rotation shaft 6. The portion 10a is inclined such that the height ta from the bottom surface 5a of the polishing head body 5 is higher than the height tb from the bottom surface 5a of the polishing head body of the rear end surface portion 10b, that is, with respect to the polishing head rotating shaft 6. The front side end face portion 5a is attached so as to be inclined to the upper right so that it is upward.

  An abrasive supply mechanism (hereinafter referred to as a slurry supply mechanism) 20 is for supplying an abrasive (hereinafter referred to as a slurry) 21 between the polishing pad 2 and the wafer 8, and is a nozzle (hereinafter referred to as a slurry supply nozzle). The supplied slurry 21 is taken into the contact surface between the polishing pad 2 and the wafer 8 by the rotation of the turntable 1.

  Next, a method for cooling the surface of the polishing pad when the wafer is polished by the wafer polishing apparatus having the above configuration will be described with reference to FIGS.

  As shown in FIG. 2, the polishing head main body 5 holding the wafer 8 is moved to the polishing position above the turntable 1. Then, the drive mechanism rotates around the polishing head rotation shaft 6 in the direction of arrow R2, and the turntable 1 rotates around the turntable rotation shaft 3 in the direction of arrow R1.

  Next, while supplying the slurry 21 from the slurry supply nozzle 20 onto the polishing pad 2, the polishing head main body 5 is lowered and the surface to be polished of the wafer 8 held on the lower surface of the polishing head main body 5 is pressed (shown). (Omitted) is pressed against the polishing pad 2. Thus, the surface to be polished of the wafer 8 is polished by the relative movement of the surface to be polished of the wafer 8 and the polishing pad 2. At this time, the temperature of the surface of the polishing pad 2 rises due to frictional heat between the surface of the wafer 8 and the polishing pad 2 and heat of chemical reaction between the surface of the wafer 8 and the slurry 21.

  During polishing of the wafer 8, as the polishing head main body 5 rotates, the blade plate 10 attached to the side surface of the polishing head main body 5 similarly rotates around the polishing head rotating shaft 6.

  FIG. 5 is a schematic diagram showing an air flow generated during wafer polishing of the wafer polishing apparatus according to the first embodiment of the present invention. As shown in FIG. 5, when the wafer 8 is polished, an air flow F from the polishing head body 5 toward the surface of the polishing pad 2 is generated by the rotation of the blade plate 10.

  As a result, the airflow F directly cools the surface of the polishing pad 2 because air directly hits the surface of the polishing pad 2. This is due to heat exchange between the surface of the polishing pad 2 and air, and heat of vaporization due to vaporization of moisture contained in the chiller 21 existing on the polishing pad 2.

  In the wafer polishing apparatus of the present embodiment, the blade plate 10 is attached to the side surface of the polishing head main body 5 so that the rotation of the polishing head main body 5 is used to move from the polishing head main body 5 to the surface of the polishing pad 2. An air flow F is generated to cool the surface of the polishing pad 2. Therefore, it is not necessary to provide a special fluid blowing mechanism, a control mechanism, a power mechanism and the like for cooling separately from the apparatus necessary for polishing, and the structure for cooling the surface of the polishing pad 2 is simplified. Can be provided.

  Further, since the air flow F is generated by the rotation of the polishing head main body 5, power is saved.

  Further, the blade plate 10 has a height ta from the bottom surface 5a of the front end surface portion 10a of the blade plate 10 with respect to the rotation direction R2 of the polishing head rotation shaft 6, and the height ta of the polishing head main body of the rear end surface portion 10b. It is inclined (inclined to the right) so as to be higher than the height tb from the bottom surface 5a. Therefore, it is possible to generate an airflow F from the polishing head body 5 toward the surface of the polishing pad 2, and to apply air from the airflow F directly to the surface of the polishing pad 2, effectively cooling the entire surface of the polishing pad 2. can do.

  In the wafer polishing apparatus of this embodiment, since the entire surface to be polished of the wafer 8 is pressed against the polishing pad 2, the air flow F does not directly hit the surface to be polished of the wafer 8. Therefore, the following problems do not occur.

  That is, when the air generated by the airflow F is directly applied to the wafer 8, moisture contained in the chiller 21 that polishes the wafer 8 evaporates. As a result, a solid substance (hereinafter referred to as a watermark) from which the water content of the slurry 21 is evaporated adheres to the wafer 8. For example, a contact is formed on the metal wiring by attaching the watermark on the metal wiring. The wafer is abnormal because it cannot be removed.

  Further, the static electricity generated between the wafer 8 and the air generated by the airflow F may corrode the metal wiring incorporated in the wafer 8.

  On the other hand, in the present embodiment, since the air due to the airflow F does not directly hit the wafer 8, there is no fear of the above-described abnormality of the wafer due to the watermark or the problem of corrosion of the metal wiring.

  Further, since a plurality of blade plates 10 are provided on the side surface of the polishing head main body 5, the air volume on the surface of the polishing pad 2 is increased as compared with the case where the blade plate 10 is one. For this reason, the surface of the polishing pad 2 can be further cooled.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a side view showing an overview of a wafer polishing apparatus in the second embodiment of the present invention. FIG. 7 is a top view showing an overview of the wafer polishing apparatus according to the second embodiment of the present invention.

  The airflow generation mechanism of the wafer polishing apparatus according to the second embodiment of the present invention is configured by the blade plate 10 in the wafer polishing apparatus according to the first embodiment, whereas the blade plate 10, the rectifier 11, and the like. In other respects, the other components have the same configuration. Accordingly, in the following description, the same components as those in the first embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and different components are described.

  As shown in FIGS. 6 and 7, in the wafer polishing apparatus in the present embodiment, the airflow generation mechanism 30 is disposed on the side surface of the polishing head body 5, the outer side of the blade plate 10, and polished. The rectifier 11 surrounds the side surface of the head body 5 and the blade 10.

The rectifying body 11 rectifies the air flow F generated by the rotation of the blade plate 10 and prevents the air flow F from diffusing in the radially outward direction of the polishing head body 5.

  In the present embodiment, the rectifying body 11 is formed in a cylindrical shape having a radius from the center of the polishing head body 5 to the tip of the blade plate 5, and each blade plate 10 is formed at the tip of the blade plate 10. Is inserted so as to be inserted, and is fixedly or detachably connected.

  In the wafer polishing apparatus according to the second embodiment, the cylindrical rectifier 11 surrounds the blade plate 10 at the tip of the blade plate 10 and rectifies the airflow F generated by the rotation of the blade plate 10. Thereby, since the airflow F does not diffuse in the radially outward direction of the polishing head main body 5, the air volume toward the surface of the polishing pad 2 can be increased as compared with the first embodiment. Further, air can be applied to the vicinity of the outer periphery of the polishing head body 5 on the surface of the polishing pad 2. As a result, the contact-polished portion can be cooled immediately after the wafer is brought into contact with the polishing pad 2 and polished. Thereby, the surface of the polishing pad 2 can be efficiently cooled.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 8 is a side view showing an overview of a wafer polishing apparatus according to the third embodiment of the present invention. The air flow generation mechanism 40 of the wafer polishing apparatus in the third embodiment of the present invention is composed of the blade plate 10 in the wafer polishing apparatus in the first embodiment, whereas the rotation transmission mechanism 41 and the air flow generation It differs by the point comprised by the rotating shaft 45 and the blade board 10, and it has the same structure about another component. Therefore, in the following description, the same components as those in the first embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and different components are described.

  As shown in FIG. 8, in the wafer polishing apparatus according to the present embodiment, the rotation transmission mechanism 41 is for transmitting the rotational drive of the polishing head body 1 to the airflow generation rotation shaft 45 and is attached to the polishing head rotation shaft 6. The first gear 42, the third gear 43 connected to the first gear 42, and the second gear 44 connected to the third gear 43. The first gear may be attached to the polishing head body 5.

  The airflow gas generating rotation shaft 45 is installed separately from the polishing head rotation shaft 6 in the polishing head body 5. The airflow generating rotary shaft 45 is installed at a position above the turntable 1 and different from the polishing head body 5. The airflow generating rotation shaft 45 is attached to the second gear 44 and is rotated in accordance with the rotation of the polishing head rotation shaft 6, that is, the rotation of the polishing head main body 5.

  The airflow generating rotary shaft 45 is preferably formed to have a diameter smaller than the diameter of the polishing head rotary shaft 6. This is because, for example, when the rotation transmission mechanism 41 is a gear, the number of teeth depends on the diameter of the rotating shaft, so the number of teeth of the first gear 42 attached to the polishing head rotating shaft 6 is generated as an air flow. The number of teeth of the second gear 44 attached to the rotating shaft 45 is made larger, and the number of rotations of the airflow generating rotating shaft 45 is made larger than the number of rotations of the polishing head rotating shaft 6.

  The vane plate 10 is attached to the side surface of the airflow generation rotating shaft 45. The shape, the number, the material, and the direction of the blade plate 10 are the same as those in the first embodiment, and thus the description thereof is omitted.

  In the wafer polishing apparatus having the above configuration, when the polishing head main body 5 rotates around the polishing head rotating shaft 6 during polishing of the wafer, the rotation transmission mechanism 41 (the first gear 42, the first gear 42, the second gear) is rotated by the rotation of the polishing head rotating shaft 6. 3 and the second gear 44), the airflow generating rotary shaft 45 rotates. As a result, the blade 10 attached to the side surface of the airflow generation rotating shaft 45 also rotates.

  As a result, as shown in FIG. 8, an airflow F is generated from the airflow generation rotating shaft 45 toward the surface of the polishing pad 2 by the rotation of the blade plate 10. As a result, since the air generated by the airflow F directly hits the surface of the polishing pad 2, the surface of the polishing pad 2 is cooled.

  In the wafer polishing apparatus of the third embodiment described above, the rotation of the polishing head rotation shaft 6 is transmitted to the airflow generation rotation shaft 45 via the rotation transmission mechanism 41, and the airflow generation rotation shaft 45 is rotated. As a result, the air flow F toward the surface of the polishing pad 2 is generated by the blades 10 attached to the side surfaces of the air flow generation rotating shaft 45, and the surface of the polishing pad 2 is cooled. Therefore, it is not necessary to provide a special power mechanism or the like, and it is possible to provide a wafer polishing apparatus in which the structure for cooling the surface of the polishing pad 2 is simplified with power saving.

  In the wafer polishing apparatus of the third embodiment, the airflow generation rotating shaft 45 is installed at a position different from the polishing head body 5 above the turntable 1. As a result, the polishing pad 2 exposed by the rotation of the turntable 1 immediately after the wafer is brought into contact with the polishing pad 2 and polished can be cooled. Thereby, the surface of the polishing pad 2 can be efficiently cooled.

  Further, the diameter of the airflow generating rotary shaft 45 is made smaller than the diameter of the polishing head rotating shaft 6, and the rotational speed of the airflow generating rotating shaft 45 is made larger than the rotational speed of the polishing head rotating shaft 6. As a result, the air volume F generated by the rotation of the blade plate 10 increases in proportion to the rotational speed of the air flow generating rotary shaft 45, so that the cooling efficiency of the surface of the polishing pad 2 can be further improved.

  In the third embodiment, as in the second embodiment, a rectifier 11 that is disposed outside the blade plate 10 and surrounds the side surface of the airflow generation rotary shaft 45 and the blade plate 10 may be provided. . In this case, the airflow F is rectified by the rectifier 11. As a result, since the air flow F does not diffuse in the radially outward direction of the polishing head body 5, the amount of air toward the surface of the polishing pad 2 can be increased, and the cooling efficiency can be further improved.

  In the third embodiment, a plurality of airflow generation mechanisms 40 may be installed. In this case, the first gear 42 and each of the second gears 44 of the plurality of airflow generation rotating shafts 45 are connected to the polishing head rotating shaft 6 by separate third gears 43, and the polishing head rotating shaft 6 rotates. Thus, the plurality of airflow generation rotating shafts 45 are rotated respectively. Further, a plurality of first gears 42 are provided on the polishing head rotating shaft 6, and each of the second gears 44 of the plurality of airflow generating rotating shafts 45 is connected via a plurality of third gears 43, respectively. The plurality of airflow generation rotating shafts 45 are rotated by the rotation of the rotating shaft 6. Further, a plurality of third gears 43 are prepared, and the first gear 42 of the polishing head rotating shaft 6 and the second gear 44 of the first airflow generating rotating shaft 45 are connected by, for example, the third gear 43a. The second gear 44 of the first airflow generation rotating shaft 45 and the second gear 44 of the second airflow generation rotating shaft 45 are connected by the third gear 43b, and further the second airflow generation The second gear 44 of the rotating shaft 45 and the second gear 44 of the third airflow generating rotating shaft 45 are connected by a third gear 43c, and the first airflow generating rotating shaft is rotated by the rotation of the polishing head rotating shaft 6. 45, the second airflow generation rotation shaft 45 is rotated by the rotation of the first airflow generation rotation shaft 45, and the third gas generation rotation shaft 45 is rotated by the rotation of the second airflow generation rotation shaft 45. You may do it.

  By installing a plurality of airflow generation mechanisms 40 in this way, the cooling efficiency can be further improved as compared with the case where there is one airflow generation mechanism.

  Further, in the third embodiment, the third gears 43a, 43b, and 43c that connect the plurality of first gears 42 and the plurality of second gears 44 are used, but each has a predetermined length. You may change into the 1st pinion which has, the 2nd pinion, and the 3rd pinion.

  In the third embodiment, the rotation transmission mechanism 41 uses the first to third gears 42, 44, and 43. However, a chain mechanism or a belt mechanism may be used. For example, a sprocket and a chain may be used in the case of a chain mechanism, and a pulley and a belt may be used in the case of a belt mechanism. Also in this case, the same effect as the third embodiment can be obtained.

  The present invention is not limited only to the first to third embodiments described above and modifications thereof, and various modifications can be made without departing from the scope of the present invention.

  For example, in the second embodiment and the third embodiment, the rectifying body 11 is disposed outside the blade plate 10 and surrounds the side surface of the polishing head body 5 (or the airflow generation rotating shaft 45) and the blade plate 10. Although the structure is adopted, a structure may be adopted in which the blades 10 are disposed between the adjacent blades 10 at the tip portion.

  In each embodiment, the blade 10 has a rectangular shape when viewed from the top surface and a flat plate shape with a uniform thickness when viewed from the side surface. The shape may be any shape as long as the airflow is generated by the rotation of the airflow generation rotating shaft 45. For example, when viewed from the side, a flat plate having a uniform thickness may be curved, or a propeller shape in which the tip of the blade plate 10 is twisted down may be used. Or as shown in FIG. 9, when it sees from a side surface, the structure which has a triangle shape may be sufficient.

  In each embodiment, the blade plate 10 is attached to the side surface of the polishing head body 5, but may be attached to the side surface of the polishing head rotating shaft 6 or the retainer ring 7.

  In each embodiment, a plurality of blades 10 are provided in order to improve cooling efficiency. However, at least one blade may be provided. The number of blades 10 may be selected according to the optimum value of the surface temperature of the polishing pad 2 depending on the combination of the material of the wafer 8 and the slurry 21.

  In each embodiment, the blade plate 10 is fixed to the side surface of the polishing head main body 5 or the side surface of the airflow generation rotation shaft 45, but may be detachably attached to the polishing head body 5 or the airflow generation rotation shaft 45. Good. As a result, since the number of blades 10 can be changed, the surface of the polishing pad 2 can be cooled more optimally.

  Furthermore, you may combine 1st Embodiment and 3rd Embodiment. In this case, the cooling efficiency on the surface of the polishing pad can be further improved as compared with the case where it is used alone.

The present invention can be configured as described in the following supplementary notes.

(Appendix 1)
A rotatable polishing table with a polishing pad attached thereto;
A polishing target holding mechanism that holds the polishing target, allows the polishing target to contact the polishing pad on the polishing table, and is rotatable.
An airflow generating mechanism including a blade that generates an airflow with respect to the exposed surface of the polishing pad by rotation of the object holding mechanism;
A polishing apparatus comprising: an abrasive supply mechanism for supplying an abrasive to the polishing pad.

(Appendix 2)
The polishing apparatus according to claim 1, wherein the blade plate of the airflow generation mechanism is attached to a side surface of the object holding mechanism.

(Appendix 3)
The polished body holding mechanism includes a rotating shaft and a polishing head main body connected to a tip portion of the rotating shaft,
The polishing apparatus according to appendix 2, wherein the blade is attached to a side surface of the polishing head body.

(Appendix 4)
The polishing apparatus according to claim 2 or 3, wherein the blade plate of the airflow generation mechanism is attached to be inclined with respect to a rotation axis of the object holding mechanism.

(Appendix 5)
The blade has a front end face part and a rear end face part with respect to a rotation direction of the polished object holding mechanism, and a distance between the front end face part and the bottom surface of the polished object holding mechanism is the rear end face part. The wafer polishing apparatus according to appendix 4, wherein the wafer polishing apparatus is inclined so as to be longer than a distance from a bottom surface of the workpiece holding mechanism.

(Appendix 6)
The airflow generation mechanism further includes a cylindrical rectifier disposed on the outer side of the blade plate in the radially outward direction and surrounding the side surface of the polishing head body and the blade plate. 4. The wafer polishing apparatus according to any one of 4 above.

(Appendix 7)
The airflow generation mechanism is installed on the polishing table at a position different from the object holding mechanism, and an airflow generation rotating shaft with the blades attached to the side surfaces thereof, and the rotation of the object holding mechanism is rotated by the airflow. The wafer polishing apparatus according to claim 1, further comprising a rotation transmission mechanism that transmits the generated rotation shaft.

(Appendix 8)
The rotation transmission mechanism includes a first gear provided on the rotating shaft of the polished object holding mechanism and a second gear provided on the airflow generating rotating shaft, and the first gear and the first gear The wafer polishing apparatus according to appendix 7, wherein two gears are connected.

(Appendix 9)
9. The wafer polishing according to claim 8, wherein the rotation transmission mechanism further includes a third gear for connecting the first gear and the second gear, and at least one third gear is provided. apparatus.

(Appendix 10)
The rotation transmission mechanism includes a first sprocket provided on the rotating shaft of the polished object holding mechanism, a second sprocket provided on the airflow generating rotating shaft, the first sprocket, and the second sprocket. The wafer polishing apparatus according to appendix 7, further comprising a chain connecting the sprocket.

(Appendix 11)
The rotation transmission mechanism includes a first pulley provided on the rotating shaft of the object holding mechanism, a second pulley provided on the airflow generating rotating shaft, the first pulley, and the second pulley. The wafer polishing apparatus according to appendix 7, further comprising a belt connecting the pulley.

(Appendix 12)
9. The wafer polishing apparatus according to appendix 8, wherein the rotation speed of the second gear is greater than the rotation speed of the first gear.

(Appendix 13)
The wafer polishing apparatus according to appendix 10, wherein the rotation speed of the second sprocket is greater than the rotation speed of the first sprocket.

(Appendix 14)
12. The wafer polishing apparatus according to appendix 11, wherein the second pulley has a rotational speed greater than that of the first pulley.

(Appendix 15)
The polishing apparatus according to any one of appendices 7 to 14, wherein the blade plate of the airflow generation mechanism is attached to be inclined with respect to the airflow generation rotation axis.

(Appendix 16)
The vane plate has a front end surface portion and a rear end surface portion with respect to a rotation direction of the airflow generation rotation shaft, and a distance between the front end surface portion and the bottom surface of the airflow generation rotation shaft is the rear end surface. 16. The wafer polishing apparatus according to claim 15, wherein the wafer polishing apparatus is inclined so as to be longer than a distance between the portion and a bottom surface of the airflow generation rotation shaft.

(Appendix 17)
The appendix 7 to appendix 16, wherein the airflow generation mechanism further includes a cylindrical rectifier that is disposed outside the blade plate and surrounds the side surface of the airflow generation rotating shaft and the blade plate. Wafer polishing equipment.

DESCRIPTION OF SYMBOLS 1 ... Turntable 2 ... Polishing pad 3 ... Turntable rotating shaft 4 ... Polishing body holding mechanism 5 ... Polishing head main body 5a ... Polishing head main body 6 ... Polishing head rotating shaft 7 ... Retainer ring 8 ... Wafer 10 ... Air flow generation Mechanism, blade 10a ... front end side end face part 10b ... rear end side end face part 11 ... rectifier 20 ... slurry supply mechanism 21 ... slurry 30, 40 ... air flow generation mechanism 41 ... rotation transmission mechanism 42 ... first gears 43 and 43a , 43b, 43c ... third gear 44 ... second gear 45 ... airflow generation rotation axis R1 ... turntable rotation direction R2 ... polishing head rotation direction F ... airflow

Claims (5)

A rotatable polishing table with a polishing pad attached thereto;
A polishing target holding mechanism that holds the polishing target, allows the polishing target to contact the polishing pad on the polishing table, and is rotatable.
An airflow generating mechanism including a blade that generates an airflow with respect to the exposed surface of the polishing pad by rotation of the object holding mechanism;
A polishing apparatus comprising: an abrasive supply mechanism for supplying an abrasive to the polishing pad. The polishing apparatus according to claim 1, wherein the blade plate of the airflow generation mechanism is attached to a side surface of the polished object holding mechanism. The polished body holding mechanism includes a rotating shaft and a polishing head main body connected to a tip portion of the rotating shaft,
The polishing apparatus according to claim 2, wherein the blade is attached to a side surface of the polishing head main body.   The airflow generation mechanism is installed on the polishing table at a position different from the object holding mechanism, and an airflow generation rotating shaft with the blades attached to the side surfaces thereof, and the rotation of the object holding mechanism is rotated by the airflow. The wafer polishing apparatus according to claim 1, further comprising a rotation transmission mechanism that transmits the generated rotation shaft. The rotation transmission mechanism includes a first gear provided on the rotating shaft of the polished object holding mechanism and a second gear provided on the airflow generating rotating shaft, and the first gear and the first gear 5. The wafer polishing apparatus according to claim 4, wherein two gears are connected.

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