JP2011052064A - Polyimide and method for preparing the same - Google Patents
Polyimide and method for preparing the same Download PDFInfo
- Publication number
- JP2011052064A JP2011052064A JP2009200332A JP2009200332A JP2011052064A JP 2011052064 A JP2011052064 A JP 2011052064A JP 2009200332 A JP2009200332 A JP 2009200332A JP 2009200332 A JP2009200332 A JP 2009200332A JP 2011052064 A JP2011052064 A JP 2011052064A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- bis
- aminophenoxy
- salt
- phenylenediamine derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 57
- 239000004642 Polyimide Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title abstract description 6
- -1 tetracarboxylic anhydride Chemical class 0.000 claims abstract description 55
- 150000004986 phenylenediamines Chemical class 0.000 claims abstract description 35
- 150000003839 salts Chemical class 0.000 claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 239000003638 chemical reducing agent Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 229910052717 sulfur Inorganic materials 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical group CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 claims description 8
- 238000002834 transmittance Methods 0.000 claims description 8
- 238000012694 Lactone Polymerization Methods 0.000 claims description 6
- 239000002685 polymerization catalyst Substances 0.000 claims description 6
- 230000033116 oxidation-reduction process Effects 0.000 claims description 5
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- 125000003277 amino group Chemical group 0.000 abstract description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 30
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 21
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 15
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 14
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 229920005575 poly(amic acid) Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000005711 Benzoic acid Substances 0.000 description 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 150000003462 sulfoxides Chemical class 0.000 description 4
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 4
- DPYROBMRMXHROQ-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-diol Chemical compound NC1=CC(N)=C(O)C=C1O DPYROBMRMXHROQ-UHFFFAOYSA-N 0.000 description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HVXLKRWRWNFGBA-UHFFFAOYSA-N 2,5-diaminobenzene-1,4-dithiol;dihydrochloride Chemical compound Cl.Cl.NC1=CC(S)=C(N)C=C1S HVXLKRWRWNFGBA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000009102 absorption Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- CJYIPJMCGHGFNN-UHFFFAOYSA-N bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic acid Chemical compound C1C2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O CJYIPJMCGHGFNN-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000001226 reprecipitation Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- LERREUOVCXYKGR-UHFFFAOYSA-N (2-phenoxyphenyl)-phenylmethanone Chemical compound C=1C=CC=C(OC=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 LERREUOVCXYKGR-UHFFFAOYSA-N 0.000 description 1
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- GSHMRKDZYYLPNZ-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)C=C1OC1=CC=CC=C1 GSHMRKDZYYLPNZ-UHFFFAOYSA-N 0.000 description 1
- PHPTWVBSQRENOR-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C(C=C1N)=CC=C1OC1=CC=CC=C1 PHPTWVBSQRENOR-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- HFAMSBMTCKNPRG-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)=C1 HFAMSBMTCKNPRG-UHFFFAOYSA-N 0.000 description 1
- NILYJZJYFZUPPO-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C(OC=2C=CC=CC=2)=C1 NILYJZJYFZUPPO-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- YLHUPYSUKYAIBW-UHFFFAOYSA-N 1-acetylpyrrolidin-2-one Chemical compound CC(=O)N1CCCC1=O YLHUPYSUKYAIBW-UHFFFAOYSA-N 0.000 description 1
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 description 1
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-UHFFFAOYSA-N 3-(2,5-dioxooxolan-3-yl)oxolane-2,5-dione Chemical compound O=C1OC(=O)CC1C1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ZDBWYUOUYNQZBM-UHFFFAOYSA-N 3-(aminomethyl)aniline Chemical compound NCC1=CC=CC(N)=C1 ZDBWYUOUYNQZBM-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- MFTFTIALAXXIMU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MFTFTIALAXXIMU-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 description 1
- JERFEOKUSPGKGV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(SC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 JERFEOKUSPGKGV-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- KUMOYHHELWKOCB-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-diol;dihydrochloride Chemical compound Cl.Cl.NC1=CC(N)=C(O)C=C1O KUMOYHHELWKOCB-UHFFFAOYSA-N 0.000 description 1
- GAKFXHZPQGSWHQ-UHFFFAOYSA-N 4,6-diaminobenzene-1,3-diol;hydrochloride Chemical compound Cl.NC1=CC(N)=C(O)C=C1O GAKFXHZPQGSWHQ-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- MITHMOYLTXMLRB-UHFFFAOYSA-N 4-(4-aminophenyl)sulfinylaniline Chemical compound C1=CC(N)=CC=C1S(=O)C1=CC=C(N)C=C1 MITHMOYLTXMLRB-UHFFFAOYSA-N 0.000 description 1
- BFWYZZPDZZGSLJ-UHFFFAOYSA-N 4-(aminomethyl)aniline Chemical compound NCC1=CC=C(N)C=C1 BFWYZZPDZZGSLJ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- FLDONXPDUZAKQB-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C(F)(F)F)(C(F)(F)F)C1CCC(N)CC1 FLDONXPDUZAKQB-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- QXCRYCTXLXDDST-UHFFFAOYSA-N 4-[4-[2-[3-[2-[4-(4-amino-2-fluorophenoxy)phenyl]propan-2-yl]phenyl]propan-2-yl]phenoxy]-3-fluoroaniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)F)=CC=2)=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1F QXCRYCTXLXDDST-UHFFFAOYSA-N 0.000 description 1
- QJZDVFLOHJFIAK-UHFFFAOYSA-N 4-[4-[2-[3-[2-[4-(4-amino-2-methylphenoxy)phenyl]propan-2-yl]phenyl]propan-2-yl]phenoxy]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1OC1=CC=C(C(C)(C)C=2C=C(C=CC=2)C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)C)=CC=2)C=C1 QJZDVFLOHJFIAK-UHFFFAOYSA-N 0.000 description 1
- RIMWCPQXJPPTHR-UHFFFAOYSA-N 4-[4-[2-[3-[2-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]propan-2-yl]phenyl]propan-2-yl]phenoxy]-3-(trifluoromethyl)aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F RIMWCPQXJPPTHR-UHFFFAOYSA-N 0.000 description 1
- SCPMRYRMHUNXQD-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=C(C)C=2)=CC(C)=C1OC1=CC=C(N)C=C1 SCPMRYRMHUNXQD-UHFFFAOYSA-N 0.000 description 1
- FDLMASCMQVDQHD-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)=CC(C)=C1OC1=CC=C(N)C=C1 FDLMASCMQVDQHD-UHFFFAOYSA-N 0.000 description 1
- ALFOPRUBEYLKCR-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]propan-2-yl]-2-methylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=CC=2)=CC=C1OC1=CC=C(N)C=C1 ALFOPRUBEYLKCR-UHFFFAOYSA-N 0.000 description 1
- USUYHTDSFPTEFF-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3-methylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)=CC=C1OC1=CC=C(N)C=C1 USUYHTDSFPTEFF-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- HBVLEOCILWODGB-UHFFFAOYSA-N 4-[4-[3-[4-(4-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)C(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 HBVLEOCILWODGB-UHFFFAOYSA-N 0.000 description 1
- GIQDBONDPVCPBF-UHFFFAOYSA-N 4-[4-[3-[4-(4-aminophenoxy)phenyl]butyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)CCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 GIQDBONDPVCPBF-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- SXTPNMJRVQKNRN-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1SC(C=C1)=CC=C1OC1=CC=C(N)C=C1 SXTPNMJRVQKNRN-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- ORIJQRKZCCBPAX-UHFFFAOYSA-N 4-[4-[4-[4-(4-aminophenoxy)phenyl]butyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1CCCCC(C=C1)=CC=C1OC1=CC=C(N)C=C1 ORIJQRKZCCBPAX-UHFFFAOYSA-N 0.000 description 1
- CNABHHDNHRETRU-UHFFFAOYSA-N 4-[4-[4-[4-[4-(4-aminophenoxy)phenoxy]phenyl]sulfonylphenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(OC=4C=CC(N)=CC=4)=CC=3)=CC=2)C=C1 CNABHHDNHRETRU-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- SNHKMHUMILUWSJ-UHFFFAOYSA-N 5-(1,3-dioxo-3a,4,5,6,7,7a-hexahydro-2-benzofuran-5-yl)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CC2C(=O)OC(=O)C2CC1C1CC2C(=O)OC(=O)C2CC1 SNHKMHUMILUWSJ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- AHUNLCWALDZRQE-UHFFFAOYSA-N 5-amino-2-azaniumyl-4-sulfanylbenzenethiolate Chemical compound NC1=CC(S)=C(N)C=C1S AHUNLCWALDZRQE-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- KEUCYUPOICDBOG-UHFFFAOYSA-N [2-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C2C(CN)CC1C(CN)C2 KEUCYUPOICDBOG-UHFFFAOYSA-N 0.000 description 1
- JYYBEGXDDHNJMX-UHFFFAOYSA-N [3-(4-amino-3-phenoxybenzoyl)phenyl]-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(C=CC=2)C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 JYYBEGXDDHNJMX-UHFFFAOYSA-N 0.000 description 1
- OTKFKCIRTBTDKK-UHFFFAOYSA-N [3-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C(CN)C2C(CN)CC1C2 OTKFKCIRTBTDKK-UHFFFAOYSA-N 0.000 description 1
- WYYLAHMAYZBJOI-UHFFFAOYSA-N [3-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=C(C=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WYYLAHMAYZBJOI-UHFFFAOYSA-N 0.000 description 1
- CTEMSXOAFRWUOU-UHFFFAOYSA-N [4-(3-amino-4-phenoxybenzoyl)phenyl]-(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 CTEMSXOAFRWUOU-UHFFFAOYSA-N 0.000 description 1
- VQXJDOIQDHMFPQ-UHFFFAOYSA-N [4-(4-amino-3-phenoxybenzoyl)phenyl]-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 VQXJDOIQDHMFPQ-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- JAGJCSPSIXPCAK-UHFFFAOYSA-N [4-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 JAGJCSPSIXPCAK-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- FOLJMFFBEKONJP-UHFFFAOYSA-N adamantane-1,3-diamine Chemical compound C1C(C2)CC3CC1(N)CC2(N)C3 FOLJMFFBEKONJP-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- ANUAIBBBDSEVKN-UHFFFAOYSA-N benzene-1,2,4,5-tetramine Chemical compound NC1=CC(N)=C(N)C=C1N ANUAIBBBDSEVKN-UHFFFAOYSA-N 0.000 description 1
- BZDGCIJWPWHAOF-UHFFFAOYSA-N benzene-1,2,4,5-tetramine;hydron;tetrachloride Chemical compound Cl.Cl.Cl.Cl.NC1=CC(N)=C(N)C=C1N BZDGCIJWPWHAOF-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- XQBSPQLKNWMPMG-UHFFFAOYSA-N bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic acid Chemical compound C1CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O XQBSPQLKNWMPMG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- SONDVQSYBUQGDH-UHFFFAOYSA-N bis(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 SONDVQSYBUQGDH-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- JUNWLZAGQLJVLR-UHFFFAOYSA-J calcium diphosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])(=O)OP([O-])([O-])=O JUNWLZAGQLJVLR-UHFFFAOYSA-J 0.000 description 1
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229940043256 calcium pyrophosphate Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- AIAQXKGTFNQZJX-UHFFFAOYSA-N cyclohex-2-ene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)=CC1C(O)=O AIAQXKGTFNQZJX-UHFFFAOYSA-N 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000019821 dicalcium diphosphate Nutrition 0.000 description 1
- 235000019700 dicalcium phosphate Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000003949 imides Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VMXAIJCDNKFKPO-UHFFFAOYSA-N n-ethynylaniline Chemical compound C#CNC1=CC=CC=C1 VMXAIJCDNKFKPO-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BUZHLYBJNNZTPL-UHFFFAOYSA-N pentane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)CC(C(O)=O)CC(C(O)=O)CC(O)=O BUZHLYBJNNZTPL-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- OAXARSVKYJPDPA-UHFFFAOYSA-N tert-butyl 4-prop-2-ynylpiperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(CC#C)CC1 OAXARSVKYJPDPA-UHFFFAOYSA-N 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
本発明は、フェニレンジアミン誘導体および/またはその塩を原料モノマーとして得られ、溶解性および接着性に優れたポリイミド、およびその製造方法に関するものである。 The present invention relates to a polyimide obtained by using a phenylenediamine derivative and / or a salt thereof as a raw material monomer and excellent in solubility and adhesiveness, and a method for producing the same.
ポリイミドの一般的な製造方法は、高純度のテトラカルボン酸二無水物とジアミン化合物とを等モル量混合し、極性溶媒中で低温縮重合反応を行わせて、先ず高分子量のポリアミック酸を生成させ、次いで、ポリアミック酸溶液をキャスト形成して、加熱または無水酢酸添加による化学処理によって脱水閉環反応を行わせる方法が採用されている。ポリイミドは、熱安定性が極めて高く、例えば電気絶縁材料、耐熱性被覆膜材料、高性能プリント回路基板材料などとして有用な高分子物質である。 The general method for producing polyimide is to mix a high-purity tetracarboxylic dianhydride and a diamine compound in equimolar amounts, and perform a low-temperature polycondensation reaction in a polar solvent to produce high molecular weight polyamic acid first. Then, a method is adopted in which a polyamic acid solution is cast and a dehydration ring closure reaction is performed by chemical treatment by heating or acetic anhydride addition. Polyimide is extremely high in thermal stability and is a polymer substance useful as an electrical insulating material, a heat-resistant coating film material, a high-performance printed circuit board material, and the like.
ポリイミドの製造方法において、中間体として生成するポリアミック酸は、一般的に溶媒に可溶性であるが、ポリアミック酸溶液は常温における保存安定性が劣り、さらに、熱に対して極めて不安定である。したがって、製品として使用する場合には、ポリイミドの形態で使用することが好ましい。 In the polyimide production method, the polyamic acid produced as an intermediate is generally soluble in a solvent, but the polyamic acid solution is inferior in storage stability at room temperature and is extremely unstable to heat. Accordingly, when used as a product, it is preferably used in the form of polyimide.
特に、フェノール基、チオール基、アミン基など親水基を持つモノマーを出発原料として得られるポリイミドは、優れた溶解性および接着性を持つため、半導体素子の表面保護膜、層間絶縁膜、バッファーコートなど分野において、優れた耐熱性、電気特性、機械特性などを併せ持つ材料として期待されている(例えば、下記非特許文献1参照)。 In particular, polyimides obtained by using monomers with hydrophilic groups such as phenol groups, thiol groups, and amine groups as starting materials have excellent solubility and adhesive properties, so surface protection films for semiconductor elements, interlayer insulation films, buffer coats, etc. In the field, it is expected as a material having excellent heat resistance, electrical characteristics, mechanical characteristics and the like (for example, see Non-Patent Document 1 below).
ここで、下記特許文献1に記載のとおり、4,6−ジアミノレゾルシノール、2,5−ジアミノー1,4―ベンゼンジチオール、1,2,4,5−テトラアミノベンゼンなどのフェニレンジアミン誘導体および/またはその塩は、テレフタル酸などの芳香族ジカルボン酸と縮重合反応させることで、ポリベンゾオキサゾール、ポリベンズチアゾール、ポリベンズイミダゾールなどのポリベンザゾールを与えることが知られている。 Here, as described in Patent Document 1 below, phenylenediamine derivatives such as 4,6-diaminoresorcinol, 2,5-diamino-1,4-benzenedithiol, 1,2,4,5-tetraaminobenzene and / or It is known that the salt gives polybenzazole such as polybenzoxazole, polybenzthiazole, polybenzimidazole, etc. by polycondensation reaction with an aromatic dicarboxylic acid such as terephthalic acid.
しかしながら、これらのフェニレンジアミン誘導体および/またはその塩とテトラカルボン酸無水物とを縮重合反応させるポリイミドの製造方法に関する研究は極めて少ない。 However, there are very few studies on a method for producing a polyimide by subjecting these phenylenediamine derivatives and / or salts thereof to a tetracarboxylic anhydride with a polycondensation reaction.
上述したフェニレンジアミン誘導体および/またはその塩を出発原料として得られるポリイミドは、その製造が極めて困難である。その理由の一つは、フェニレンジアミン誘導体が酸化され易い性質を有することであると考えられる。例えば、4,6−ジアミノレゾルシノールは、酸化を防ぐため、通常は比較的安定な無機酸塩の形態で使用されるが、酸無水物と反応し、重合が進行する際、重合系では4,6−ジアミノレゾルシノールの形態に戻る必要がある。しかしながら、4,6−ジアミノレゾルシノールは、無機酸塩の形態でなくなると直ちに酸化され、薄いピンクから赤、黒までに変色してしまうため、高分子量ポリマーの合成が困難である上に、重合系の着色はひどくなり、得られたポリマーの透明性をはじめ、諸物性に悪影響をもたらすことがあった。 The polyimide obtained using the above-mentioned phenylenediamine derivative and / or salt thereof as a starting material is extremely difficult to produce. One of the reasons is considered to be that the phenylenediamine derivative has a property of being easily oxidized. For example, 4,6-diaminoresorcinol is usually used in the form of a relatively stable inorganic acid salt to prevent oxidation. However, when it reacts with an acid anhydride and polymerization proceeds, There is a need to return to the 6-diaminoresorcinol form. However, 4,6-diaminoresorcinol is immediately oxidized when it is no longer in the form of an inorganic acid salt, and discolors from light pink to red and black. Therefore, it is difficult to synthesize a high molecular weight polymer. The coloration of the polymer became severe, and the physical properties of the resulting polymer, including the transparency, could be adversely affected.
本発明は上記実情に鑑みてなされたものであり、その目的は、溶解性および接着性に優れたポリイミドを提供すること、さらにはフェニレンジアミン誘導体および/またはその塩の酸化を抑制しながら、これと酸無水物とを直接イミド化反応させるポリイミドの製造方法を提供することにある。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a polyimide having excellent solubility and adhesiveness, while further suppressing oxidation of a phenylenediamine derivative and / or a salt thereof. Another object of the present invention is to provide a method for producing polyimide in which an acid anhydride and an acid anhydride are directly imidized.
すなわち、本発明に係るポリイミドは、下記一般式(1)および(2)のいずれか少なくとも1つで表されるフェニレンジアミン誘導体および/またはその塩:
また、本発明に係るポリイミドの製造方法は、還元剤の存在下で、下記一般式(1)および(2)のいずれか少なくとも1つで表されるフェニレンジアミン誘導体および/またはその塩:
上記ポリイミドの製造方法において、前記還元剤に加えて、さらにラクトン系重合触媒の存在下で、前記一般式(1)および(2)のいずれか少なくとも1つで表されるフェニレンジアミン誘導体および/またはその塩と、テトラカルボン酸無水物と、を直接イミド化反応させるものであることが好ましい。 In the polyimide production method, in addition to the reducing agent, in the presence of a lactone polymerization catalyst, a phenylenediamine derivative represented by at least one of the general formulas (1) and (2) and / or It is preferable that the salt is directly imidized with tetracarboxylic anhydride.
また、上記ポリイミドの製造方法において、前記還元剤の標準酸化還元電位が、−0.20volt以上、0.34volt以下であることが好ましい。なお、本発明における「標準酸化還元電位」とは、水中、25℃での値である。 Moreover, in the said manufacturing method of a polyimide, it is preferable that the standard oxidation-reduction potential of the said reducing agent is -0.20 volt or more and 0.34 volt or less. The “standard oxidation-reduction potential” in the present invention is a value at 25 ° C. in water.
上記ポリイミドの製造方法において、前記ラクトン系重合触媒が、γ―バレロラクトンであることが好ましい。 In the polyimide production method, the lactone polymerization catalyst is preferably γ-valerolactone.
さらに、本発明に係る成形体は前記記載のポリイミドを成形して得られるものである。 Furthermore, the molded body according to the present invention is obtained by molding the polyimide described above.
本発明によれば、フェニレンジアミン誘導体および/またはその塩の酸化を抑制しながら、これと酸無水物とを直接イミド化反応させることにより、溶解性および接着性に優れたポリイミドを製造することができる。また、本発明に係るポリイミドは、特に500nmにおける光線透過率が高く、有機EL基板などの透明性が必要な用途に好適に使用することができる。 According to the present invention, it is possible to produce a polyimide having excellent solubility and adhesiveness by directly imidizing a phenylenediamine derivative and / or salt thereof with an acid anhydride while suppressing oxidation of the phenylenediamine derivative and / or salt thereof. it can. The polyimide according to the present invention has a particularly high light transmittance at 500 nm, and can be suitably used for applications that require transparency, such as an organic EL substrate.
以下に、本発明の実施形態について説明するが、これらは本発明の実施形態の一例であり、これらの内容に限定されない。 Although embodiments of the present invention will be described below, these are examples of the embodiments of the present invention, and are not limited to these contents.
本発明において、フェニレンジアミン誘導体としては、下記一般式(1)および(2)のいずれか少なくとも1つで表されるフェニレンジアミン誘導体および/またはその塩が挙げられる。
フェニレンジアミン誘導体の塩としては、通常フェニレンジアミン誘導体の塩酸塩が挙げられる。上記一般式(1)または(2)で表されるフェニレンジアミン誘導体が塩酸塩である場合は、特に下記一般式(1A)または(2A):
本発明において、フェニレンジアミン誘導体の塩酸塩としては、4,6−ジアミノレゾルシノール二塩酸塩、2,5−ジアミノー1,4−ベンゼンジチオール二塩酸塩、1,2,4,5−テトラアミノベンゼン四塩酸塩のいずれかであることが好ましい。 In the present invention, the hydrochloride of the phenylenediamine derivative includes 4,6-diaminoresorcinol dihydrochloride, 2,5-diamino-1,4-benzenedithiol dihydrochloride, 1,2,4,5-tetraaminobenzene tetrahydrochloride. It is preferably one of hydrochlorides.
なお、本発明において、フェニレンジアミン誘導体の塩としては、フェニレンジアミン誘導体の塩酸塩に限定されず、硫酸塩、リン酸塩などの無機酸塩、テレフタル酸塩、酢酸塩などの有機酸塩であってもよい。 In the present invention, the salt of the phenylenediamine derivative is not limited to the hydrochloride of the phenylenediamine derivative, but may be an inorganic acid salt such as sulfate or phosphate, or an organic acid salt such as terephthalate or acetate. May be.
ポリイミドの製造に使用するテトラカルボン酸無水物は、芳香族または脂肪族酸無水物であり、構造に関して特に限定されないが、好ましいテトラカルボン酸無水物の例としては、例えば、無水ピロメリット酸、ビフェニル−3,4,3’,4’−テトラカルボン酸二無水物、ベンゾフェノン−3,4,3’,4’−テトラカルボン酸二無水物、オキシジフタル酸二無水物、ジフェニルスルホン−3,4,3’,4’−テトラカルボン酸二無水物、4,4’−(2,2−ヘキサフルオロイソプロピリデン)ジフタル酸二無水物、ブタン−1,2,3,4−テトラカルボン酸二無水物、ペンタン−1,2,4,5−テトラカルボン酸二無水物、シクロブタンテトラカルボン酸二無水物、シクロペンタン−1,2,3,4−テトラカルボン酸二無水物、シクロヘキサン−1,2,4,5−テトラカルボン酸二無水物、シクロヘキサ−1−エン−2,3,5,6−テトラカルボン酸二無水物、3−エチルシクロヘキサ−1−エン−3−(1,2),5,6−テトラカルボン酸二無水物、1−メチル−3−エチルシクロヘキサン−3−(1,2),5,6−テトラカルボン酸二無水物、1−メチル−3−エチルシクロヘキサ−1−エン−3−(1,2),5,6−テトラカルボン酸二無水物、1−エチルシクロヘキサン−1−(1,2),3,4−テトラカルボン酸二無水物、1−プロピルシクロヘキサン−1−(2,3),3,4−テトラカルボン酸二無水物、1,3−ジプロピルシクロヘキサン−1−(2,3),3−(2,3)−テトラカルボン酸二無水物、ジシクロヘキシル−3,4,3’,4’−テトラカルボン酸二無水物、ビシクロ[2.2.1]ヘプタン−2,3,5,6−テトラカルボン酸二無水物、1−プロピルシクロヘキサン−1−(2,3),3,4−テトラカルボン酸二無水物、1,3−ジプロピルシクロヘキサン−1−(2,3),3−(2,3)−テトラカルボン酸二無水物、ジシクロヘキシル−3,4,3’,4’−テトラカルボン酸二無水物、ビシクロ[2.2.1]ヘプタン−2,3,5,6−テトラカルボン酸二無水物、ビシクロ[2.2.2]オクタン−2,3,5,6−テトラカルボン酸二無水物、ビシクロ[2.2.2]オクト−7−エン−2,3,5,6−テトラカルボン酸二無水物などが挙げられる。これらのテトラカルボン酸二無水物は単独で用いてもよいし、二種以上を併用してもよい。 The tetracarboxylic acid anhydride used in the production of the polyimide is an aromatic or aliphatic acid anhydride and is not particularly limited with respect to the structure. Examples of preferred tetracarboxylic acid anhydrides include, for example, pyromellitic anhydride, biphenyl -3,4,3 ', 4'-tetracarboxylic dianhydride, benzophenone-3,4,3', 4'-tetracarboxylic dianhydride, oxydiphthalic dianhydride, diphenylsulfone-3,4 3 ′, 4′-tetracarboxylic dianhydride, 4,4 ′-(2,2-hexafluoroisopropylidene) diphthalic dianhydride, butane-1,2,3,4-tetracarboxylic dianhydride , Pentane-1,2,4,5-tetracarboxylic dianhydride, cyclobutane tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride , Cyclohexane-1,2,4,5-tetracarboxylic dianhydride, cyclohex-1-ene-2,3,5,6-tetracarboxylic dianhydride, 3-ethylcyclohex-1-ene- 3- (1,2), 5,6-tetracarboxylic dianhydride, 1-methyl-3-ethylcyclohexane-3- (1,2), 5,6-tetracarboxylic dianhydride, 1-methyl -3-Ethylcyclohex-1-ene-3- (1,2), 5,6-tetracarboxylic dianhydride, 1-ethylcyclohexane-1- (1,2), 3,4-tetracarboxylic acid Dianhydride, 1-propylcyclohexane-1- (2,3), 3,4-tetracarboxylic dianhydride, 1,3-dipropylcyclohexane-1- (2,3), 3- (2,3 ) -Tetracarboxylic dianhydride, dicyclohexyl-3, , 3 ′, 4′-tetracarboxylic dianhydride, bicyclo [2.2.1] heptane-2,3,5,6-tetracarboxylic dianhydride, 1-propylcyclohexane-1- (2,3 ), 3,4-tetracarboxylic dianhydride, 1,3-dipropylcyclohexane-1- (2,3), 3- (2,3) -tetracarboxylic dianhydride, dicyclohexyl-3,4, 3 ′, 4′-tetracarboxylic dianhydride, bicyclo [2.2.1] heptane-2,3,5,6-tetracarboxylic dianhydride, bicyclo [2.2.2] octane-2, 3,5,6-tetracarboxylic dianhydride, bicyclo [2.2.2] oct-7-ene-2,3,5,6-tetracarboxylic dianhydride and the like. These tetracarboxylic dianhydrides may be used alone or in combination of two or more.
本発明では、ポリイミドの重合反応性およびポリイミドの要求特性を損なわない範囲で、該ポリイミドを重合する際に、上記フェニレンジアミン誘導体および/またはその塩以外の芳香族ジアミン、あるいは脂肪族ジアミンを原料モノマーとして使用してもよい。但し、ポリイミドの重合反応性およびポリイミドの要求特性を考慮した場合、フェニレンジアミン誘導体および/またはその塩と、フェニレンジアミン誘導体および/またはその塩以外のジアミンと、の配合割合は、重量比で50:50〜100:0であることが好ましく、80:20〜100:0であることがより好ましい。 In the present invention, when the polyimide is polymerized as long as the polymerization reactivity of polyimide and the required characteristics of polyimide are not impaired, aromatic diamines other than the phenylenediamine derivatives and / or salts thereof, or aliphatic diamines are used as raw material monomers. May be used as However, when the polymerization reactivity of polyimide and the required characteristics of polyimide are taken into consideration, the blending ratio of the phenylenediamine derivative and / or salt thereof and the diamine other than the phenylenediamine derivative and / or salt thereof is 50: It is preferable that it is 50-100: 0, and it is more preferable that it is 80: 20-100: 0.
本発明において、部分的に使用可能な芳香族ジアミンとしては、特に限定されないが、例えば、4,4’−ビス(3−アミノフェノキシ)ビフェニル、ビス[4−(3−アミノフェノキシ)フェニル]ケトン、ビス[4−(3−アミノフェノキシ)フェニル]スルフィド、ビス[4−(3−アミノフェノキシ)フェニル]スルホン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(3−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、m−フェニレンジアミン、o−フェニレンジアミン、p−フェニレンジアミン、m−アミノベンジルアミン、p−アミノベンジルアミン、3,3’−ジアミノジフェニルエーテル、3,4’−ジアミノジフェニルエーテル、4,4’−ジアミノジフェニルエーテル、3,3’−ジアミノジフェニルスルフィド、3,3’−ジアミノジフェニルスルホキシド、3,4’−ジアミノジフェニルスルホキシド、4,4’−ジアミノジフェニルスルホキシド、3,3’−ジアミノジフェニルスルホン、3,4’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルスルホン、3,3’−ジアミノベンゾフェノン、3,4’−ジアミノベンゾフェノン、4,4’−ジアミノベンゾフェノン、3,3’−ジアミノジフェニルメタン。 In the present invention, the partially usable aromatic diamine is not particularly limited, and examples thereof include 4,4′-bis (3-aminophenoxy) biphenyl and bis [4- (3-aminophenoxy) phenyl] ketone. Bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl] sulfone, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2 -Bis [4- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine P-aminobenzylamine, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4, '-Diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfoxide, 3,4'-diaminodiphenyl sulfoxide, 4,4'-diaminodiphenyl sulfoxide, 3,3'-diaminodiphenyl sulfone, 3,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 3,3′-diaminobenzophenone, 3,4′-diaminobenzophenone, 4,4′-diaminobenzophenone, 3,3′-diaminodiphenylmethane.
3,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、ビス[4−(4−アミノフェノキシ)フェニル]メタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(4−アミノフェノキシ)フェニル]エタン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、1,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、1,3−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、1,1−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、1,3−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、1,4−ビス[4−(4−アミノフェノキシ)フェニル]ブタン、2,2−ビス[4−(4−アミノフェノシ)フェニル]ブタン、2,3−ビス[4−(4−アミノフェノキシ)フェニル]ブタン。 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, bis [4- (4-aminophenoxy) phenyl] methane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1, 2-bis [4- (4-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] propane, 1,2-bis [4- (4-aminophenoxy) phenyl] Propane, 1,3-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,1-bis [4- (4-amino) Phenoxy) phenyl] butane, 1,3-bis [4- (4-aminophenoxy) phenyl] butane, 1,4-bis [4- (4-aminophenoxy) phenyl] butane Emissions, 2,2-bis [4- (4-Aminofenoshi) phenyl] butane, 2,3-bis [4- (4-aminophenoxy) phenyl] butane.
2−[4−(4−アミノフェノキシ)フェニル]−2−[4−(4−アミノフェノキシ)−3−メチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)−3−メチルフェニル]プロパン、2−[4−(4−アミノフェノキシ)フェニル]−2−[4−(4−アミノフェノキシ)−3,5−ジメチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)−3,5−ジメチルフェニル]プロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、1,4−ビス(3−アミノフェノキシ)ベンゼン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,4−ビス(4−アミノフェノキシ)ベンゼン、4,4’−ビス(4−アミノフェノキシ)ビフェニル、ビス[4−(4−アミノフェノキシ)フェニル]ケトン、ビス[4−(4−アミノフェノキシ)フェニル]スルフィド、ビス[4−(4−アミノフェノキシ)フェニル]スルホキシド、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、ビス[4−(3−アミノフェノキシ)フェニル]エーテル、ビス[4−(4−アミノフェノキシ)フェニル]エーテル、1,3−ビス[4−(4−アミノフェノキシ)ベンゾイル]ベンゼン、1,3−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、1,4−ビス[4−(3−アミノフェノキシ)ベンゾイル]ベンゼン、4,4’−ビス[(3−アミノフェノキシ)ベンゾイル]ベンゼン、1,1−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、1,3−ビス[4−(3−アミノフェノキシ)フェニル]プロパン、3,4’−ジアミノジフェニルスルフィド、2,2−ビス[3−(3−アミノフェノキシ)フェニル]−1,1,1,3,3,3−ヘキサフルオロプロパン、ビス[4−(3−アミノフェノキシ)フェニル]メタン、1,1−ビス[4−(3−アミノフェノキシ)フェニル]エタン、1,2−ビス[4−(3−アミノフェノキシ)フェニル]エタン、ビス[4−(3−アミノフェノキシ)フェニル]スルホキシド、4,4’−ビス[3−(4−アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’−ビス[3−(3−アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ベンゾフェノン、4,4’−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ジフェニルスルホン、ビス[4−{4−(4−アミノフェノキシ)フェノキシ}フェニル]スルホン。 2- [4- (4-Aminophenoxy) phenyl] -2- [4- (4-aminophenoxy) -3-methylphenyl] propane, 2,2-bis [4- (4-aminophenoxy) -3- Methylphenyl] propane, 2- [4- (4-aminophenoxy) phenyl] -2- [4- (4-aminophenoxy) -3,5-dimethylphenyl] propane, 2,2-bis [4- (4 -Aminophenoxy) -3,5-dimethylphenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 1,4 -Bis (3-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) bif Nyl, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] sulfide, bis [4- (4-aminophenoxy) phenyl] sulfoxide, bis [4- (4 -Aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 1,3-bis [4- (4-aminophenoxy) Benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 4,4′-bis [(3- Aminophenoxy) benzoyl] benzene, 1,1-bis [4- (3-aminophenoxy) phenyl] propane, 1,3-bis [ -(3-aminophenoxy) phenyl] propane, 3,4'-diaminodiphenyl sulfide, 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexa Fluoropropane, bis [4- (3-aminophenoxy) phenyl] methane, 1,1-bis [4- (3-aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl ] Ethane, bis [4- (3-aminophenoxy) phenyl] sulfoxide, 4,4′-bis [3- (4-aminophenoxy) benzoyl] diphenyl ether, 4,4′-bis [3- (3-aminophenoxy) ) Benzoyl] diphenyl ether, 4,4′-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone, 4,4 ′ Bis [4- (4-amino-.alpha., alpha-dimethylbenzyl) phenoxy] diphenyl sulfone, bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone.
1,4−ビス[4−(4−アミノフェノキシ)フェノキシ−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノフェノキシ)フェノキシ−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−トリフルオロメチルフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−フルオロフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−メチルフェノキシ)−α,α−ジメチルベンジル]ベンゼン、1,3−ビス[4−(4−アミノ−6−シアノフェノキシ)−α,α−ジメチルベンジル]ベンゼン、3,3’−ジアミノ−4,4’−ジフェノキシベンゾフェノン、4,4’−ジアミノ−5,5’−ジフェノキシベンゾフェノン、3,4’−ジアミノ−4,5’−ジフェノキシベンゾフェノン、3,3’−ジアミノ−4−フェノキシベンゾフェノン、4,4’−ジアミノ−5−フェノキシベンゾフェノン、3,4’−ジアミノ−4−フェノキシベンゾフェノン、3,4’−ジアミノ−5’−フェノキシベンゾフェノン、3,3’−ジアミノ−4,4’−ジビフェノキシベンゾフェノン、4,4’−ジアミノ−5,5’−ジビフェノキシベンゾフェノン、3,4’−ジアミノ−4,5’−ジビフェノキシベンゾフェノン、3,3’−ジアミノ−4−ビフェノキシベンゾフェノン、4,4’−ジアミノ−5−ビフェノキシベンゾフェノン、3,4’−ジアミノ−4−ビフェノキシベンゾフェノン、3,4’−ジアミノ−5’−ビフェノキシベンゾフェノン、1,3−ビス(3−アミノ−4−フェノキシベンゾイル)ベンゼン、1,4−ビス(3−アミノ−4−フェノキシベンゾイル)ベンゼン、1,3−ビス(4−アミノ−5−フェノキシベンゾイル)ベンゼン、1,4−ビス(4−アミノ−5−フェノキシベンゾイル)ベンゼン、1,3−ビス(3−アミノ−4−ビフェノキシベンゾイル)ベンゼン、1,4−ビス(3−アミノ−4−ビフェノキシベンゾイル)ベンゼン、1,3−ビス(4−アミノ−5−ビフェノキシベンゾイル)ベンゼン、1,4−ビス(4−アミノ−5−ビフェノキシベンゾイル)ベンゼン、2,6−ビス[4−(4−アミノ−α,α−ジメチルベンジル)フェノキシ]ベンゾニトリルおよび上記芳香族ジアミンにおける芳香環上の水素原子の一部もしくは全てがハロゲン原子、炭素数1〜3のアルキル基またはアルコキシル基、シアノ基、またはアルキル基またはアルコキシル基の水素原子の一部もしくは全部がハロゲン原子で置換された炭素数1〜3のハロゲン化アルキル基またはアルコキシル基で置換された芳香族ジアミンなどが挙げられる。これらのジアミンは単独で用いてもよいし、二種以上を併用してもよい。 1,4-bis [4- (4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-aminophenoxy) phenoxy-α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-trifluoromethylphenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-fluorophenoxy) -α , Α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6-methylphenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-amino-6) -Cyanophenoxy) -α, α-dimethylbenzyl] benzene, 3,3′-diamino-4,4′-diphenoxybenzophenone, 4,4′-diamino-5,5′-diphenoxybenzopheno 3,4′-diamino-4,5′-diphenoxybenzophenone, 3,3′-diamino-4-phenoxybenzophenone, 4,4′-diamino-5-phenoxybenzophenone, 3,4′-diamino-4- Phenoxybenzophenone, 3,4'-diamino-5'-phenoxybenzophenone, 3,3'-diamino-4,4'-dibiphenoxybenzophenone, 4,4'-diamino-5,5'-dibiphenoxybenzophenone, 3, 4'-diamino-4,5'-dibiphenoxybenzophenone, 3,3'-diamino-4-biphenoxybenzophenone, 4,4'-diamino-5-biphenoxybenzophenone, 3,4'-diamino-4-bi Phenoxybenzophenone, 3,4'-diamino-5'-biphenoxybenzophenone, 1,3-bis 3-amino-4-phenoxybenzoyl) benzene, 1,4-bis (3-amino-4-phenoxybenzoyl) benzene, 1,3-bis (4-amino-5-phenoxybenzoyl) benzene, 1,4-bis (4-amino-5-phenoxybenzoyl) benzene, 1,3-bis (3-amino-4-biphenoxybenzoyl) benzene, 1,4-bis (3-amino-4-biphenoxybenzoyl) benzene, 1, 3-bis (4-amino-5-biphenoxybenzoyl) benzene, 1,4-bis (4-amino-5-biphenoxybenzoyl) benzene, 2,6-bis [4- (4-amino-α, α -Dimethylbenzyl) phenoxy] benzonitrile and some or all of the hydrogen atoms on the aromatic ring in the aromatic diamine are halogen atoms, carbon number 1 3 alkyl group or alkoxyl group, cyano group, or aromatic group substituted with a halogenated alkyl group having 1 to 3 carbon atoms or alkoxyl group in which some or all of hydrogen atoms of alkyl group or alkoxyl group are substituted with halogen atoms Group diamine and the like. These diamines may be used alone or in combination of two or more.
本発明において、部分的に使用可能な脂肪族ジアミンとしては、特に限定されないが、例えば、4、4‘−メチレンビス(シクロヘキシルアミン)、イソホロンジアミン、トランスー1,4−ジアミノシクロヘキサン、シスー1,4−ジアミノシクロヘキサン、1,4−シクロヘキサンビス(メチルアミン)、2,5−ビス(アミノメチル)ビシクロ[2,2,1]ヘプタン、2,6−ビス(アミノメチル)ビシクロ[2,2,1]ヘプタン、3,8−ビス(アミノメチル)トリシクロ[5,2,1,0]デカン、1,3−ジアミノアダマンタン、2,2−ビス(4−アミノシクロヘキシル)プロパン、2,2−ビス(4−アミノシクロヘキシル)ヘキサフルオロププロパン、1,3−プロパンジアミン、1,4−テトラメチレンジアミン、1,5−ペンタメチレンジアミン、1,6−ヘキサメチレンジアミン、1,7−ヘプタメチレンジアミン、1,8−オクタメチレンジアミン、1,9−ノナメチレンジアミンなどが挙げられる。またこれらを2種類以上併用することもできる。 In the present invention, the partially usable aliphatic diamine is not particularly limited. For example, 4,4′-methylenebis (cyclohexylamine), isophoronediamine, trans-1,4-diaminocyclohexane, cis-1,4- Diaminocyclohexane, 1,4-cyclohexanebis (methylamine), 2,5-bis (aminomethyl) bicyclo [2,2,1] heptane, 2,6-bis (aminomethyl) bicyclo [2,2,1] Heptane, 3,8-bis (aminomethyl) tricyclo [5,2,1,0] decane, 1,3-diaminoadamantane, 2,2-bis (4-aminocyclohexyl) propane, 2,2-bis (4 -Aminocyclohexyl) hexafluoropropane, 1,3-propanediamine, 1,4-tetramethylenediamine, , 5-pentamethylenediamine, 1,6-hexamethylenediamine, 1,7-heptamethylene diamine, 1,8-octamethylene diamine, 1,9-like nonamethylenediamine, and the like. Two or more of these may be used in combination.
本発明のポリイミドを製造する際のモノマー混合比(モル比)は、(テトラカルボン酸無水物)/(フェニレンジアミン誘導体および/またはその塩を含むジアミン)の表記方法で、好ましくは0.800〜1.200/1.200〜0.800、より好ましくは0.900〜1.100/1.100〜0.900、更に好ましくは0.950〜1.150/1.150〜0.950である。 The monomer mixing ratio (molar ratio) in producing the polyimide of the present invention is a notation method of (tetracarboxylic anhydride) / (diamine containing phenylenediamine derivative and / or salt thereof), preferably 0.800. 1.200 / 1.200 to 0.800, more preferably 0.900 to 1.100 / 1.100 to 0.900, still more preferably 0.950 to 1.150 / 1.150 to 0.950 is there.
本発明のポリイミドは、500nmにおける光線透過率が50%以上であることが好ましい。ポリイミドの、500nmにおける光線透過率が50%以上であると、有機EL基板などの透明性が必要な用途に好適に使用することができる。透明性が必要な用途に使用する場合、ポリイミドの、500nmにおける光線透過率は60%以上であることがより好ましく、70%以上であることが特に好ましい。 The polyimide of the present invention preferably has a light transmittance at 500 nm of 50% or more. When the light transmittance at 500 nm of polyimide is 50% or more, it can be suitably used for applications requiring transparency such as an organic EL substrate. When used for applications that require transparency, the light transmittance at 500 nm of polyimide is more preferably 60% or more, and particularly preferably 70% or more.
本発明のポリイミドは、固有粘度が0.3〜4.0dL/gであることが好ましく、0.5〜2.5dL/gであることが好ましい。 The polyimide of the present invention preferably has an intrinsic viscosity of 0.3 to 4.0 dL / g, and preferably 0.5 to 2.5 dL / g.
また、本発明の分子末端封鎖のためにジカルボン酸無水物、トリカルボン酸無水物、アニリン誘導体などの末端封止剤を用いることが出来る。本発明で好ましく用いられるのは、無水フタル酸、無水マレイン酸、エチニルアニリンであり、無水マレイン酸の使用がより好ましい。末端封止剤の使用量は、フェニレンジアミン誘導体および/またはその塩1モル当たり0.001〜1.0モル比である。 Moreover, terminal blockers, such as a dicarboxylic acid anhydride, a tricarboxylic acid anhydride, and an aniline derivative, can be used for the molecular terminal blockage of the present invention. Preferred for use in the present invention are phthalic anhydride, maleic anhydride, and ethynylaniline, and the use of maleic anhydride is more preferred. The usage-amount of terminal blocker is 0.001-1.0 molar ratio with respect to 1 mol of phenylenediamine derivatives and / or its salts.
本発明における還元剤は、標準酸化還元電位が−0.20volt以上、0.34volt以下の化合物であることが好ましく、0.0volt以上、0.20volt以下の化合物であることがより好ましい。還元剤の標準酸化還元電位が−0.20volt未満であると、フェニレンジアミン誘導体塩酸塩を初め、反応物の副反応を招く場合がある。また、還元剤の標準酸化還元電位が0.34voltを超えると、フェニレンジアミン誘導体塩酸塩の標準酸化還元電位が0.34voltであるため、効果が発揮されない場合がある。 The reducing agent in the present invention is preferably a compound having a standard oxidation-reduction potential of −0.20 vol. Or more and 0.34 vol. Or less, more preferably 0.0 vol. Or more and 0.20 vol. Or less. If the standard oxidation-reduction potential of the reducing agent is less than −0.20 volt, side reactions of the reactants may be caused including phenylenediamine derivative hydrochloride. In addition, when the standard redox potential of the reducing agent exceeds 0.34 volt, the effect may not be exhibited because the standard redox potential of the phenylenediamine derivative hydrochloride is 0.34 volt.
本発明において使用可能な還元剤の具体例としては、TiCl3、CuCl、SnCl2などの金属塩、次亜燐酸、チオ硫酸ナトリウムなどのリンまたは硫黄の還元性酸化物が挙げられる。この中で、特にTiCl3、CuCl、SnCl2などの金属塩化物は、使用量が少量であっても効果が大きいので好ましい。特にSnCl2およびその水和物は、有機溶媒に可溶で、無色であるので、最も好ましい。 Specific examples of the reducing agent that can be used in the present invention include metal salts such as TiCl 3 , CuCl, and SnCl 2, and phosphorus or sulfur reducing oxides such as hypophosphorous acid and sodium thiosulfate. Among these, metal chlorides such as TiCl 3 , CuCl, and SnCl 2 are particularly preferable because they are effective even when used in small amounts. In particular, SnCl 2 and its hydrate are most preferred because they are soluble in organic solvents and are colorless.
本発明において、還元剤の配合量は、その種類により必要とされる量が様々であるが、少なくとも0.01重量%以上(還元剤重量/フェニレンジアミン誘導体および/またはその塩の重量)含有していることが好ましく、0.1重量%以上含有していることがより好ましく、0.5重量%以上含有していることが特に好ましい。還元剤の配合量が0.01重量%未満では、還元剤による安定化の効果が充分出ない場合があり、還元剤の配合量が30重量%を超えると、その効果は充分であるが、コストの上昇を招くだけでなく、ポリマーの精製および廃液中に多量の還元剤が混入してくるなど、好ましくない点が多い。 In the present invention, the compounding amount of the reducing agent varies depending on the type, but it is at least 0.01% by weight (reducing agent weight / phenylenediamine derivative and / or salt weight). It is preferable to contain 0.1% by weight or more, and it is particularly preferable to contain 0.5% by weight or more. When the blending amount of the reducing agent is less than 0.01% by weight, the effect of stabilization by the reducing agent may not be sufficient, and when the blending amount of the reducing agent exceeds 30% by weight, the effect is sufficient, In addition to incurring an increase in cost, there are many unfavorable points such as polymer purification and a large amount of reducing agent mixed in the waste liquid.
本発明のポリイミドを製造する際に使用する有機溶剤としては、原料モノマーおよび中間生成物であるポリアミド酸、生成物であるポリイミドのいずれも溶解するものであれば特に限定されないが、例えば、o−クレゾール、m−クレゾール、p−クレゾール、N−メチル−2−ピロリドン,N−アセチル−2−ピロリドン、N,N−ジメチルホルムアミド、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、ジメチルスルホキシド、スルホラン、ハロゲン化フェノール類などがあげられ、これらの溶媒は,単独あるいは混合して使用することができる。極性有機溶媒の使用量は、仕込みモノマーを溶解するのに十分な量であればよく、通常は1〜50質量%であり好ましくは5〜30質量%の固形分を含むものであればよい。 The organic solvent used when producing the polyimide of the present invention is not particularly limited as long as it dissolves both the raw material monomer, the intermediate product polyamic acid, and the product polyimide, but, for example, o- Cresol, m-cresol, p-cresol, N-methyl-2-pyrrolidone, N-acetyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, Examples include sulfolane and halogenated phenols, and these solvents can be used alone or in combination. The amount of the polar organic solvent used may be an amount sufficient to dissolve the charged monomer, and is usually 1 to 50% by mass, preferably 5 to 30% by mass.
ラクトン系重合触媒としては、γ―バレロラクトン、γ―ブチルラクトンあるいはγ―テトロン酸などが使用される。ラクトン系重合触媒の使用量は、フェニレンジアミン誘導体および/またはその塩の重量を基準として、0.001〜0.5重量%であることが好ましい。 As the lactone polymerization catalyst, γ-valerolactone, γ-butyllactone, γ-tetronic acid or the like is used. The amount of the lactone polymerization catalyst used is preferably 0.001 to 0.5% by weight based on the weight of the phenylenediamine derivative and / or salt thereof.
本発明の製造方法では、フェニレンジアミン誘導体および/またはその塩と、テトラカルボン酸無水物と、を直接イミド化反応させる。この反応は、有機溶媒中で撹拌および/または混合しながら、室温から60〜250℃の温度範囲まで、10分〜30時間連続して進めた後、必要により重合反応を分割したり、温度を上下させてもかまわない。この場合に、両反応体の添加順序には特に制限はないが、フェニレンジアミン誘導体および/またはその塩類の溶液中にテトラカルボン酸無水物類を添加するのが好ましい。 In the production method of the present invention, a phenylenediamine derivative and / or a salt thereof and a tetracarboxylic acid anhydride are directly imidized. This reaction is carried out continuously for 10 minutes to 30 hours from room temperature to a temperature range of 60 to 250 ° C. with stirring and / or mixing in an organic solvent. You can move it up and down. In this case, the order of adding both reactants is not particularly limited, but it is preferable to add tetracarboxylic acid anhydrides to the solution of the phenylenediamine derivative and / or its salt.
本発明の製造方法では、閉環触媒を用いることが好ましい。本発明で使用可能な閉環触媒の具体例としては、安息香酸、o−安息香酸、m−安息香酸、p−安息香酸などの芳香族カルボン酸、トリメチルアミン、トリエチルアミンなどの脂肪族第3級アミン、イソキノリン、ピリジン、ベータピコリンなどの複素環式第3級アミンなどが挙げられるが、複素環式第3級アミンから選ばれる少なくとも一種のアミンを使用することが好ましい。閉環触媒の含有量は、(閉環触媒の含有量(モル))/(前駆体であるポリアミド酸の含有量(モル))で、0.01〜10.00となる範囲が好ましい。 In the production method of the present invention, it is preferable to use a ring-closing catalyst. Specific examples of the ring-closing catalyst usable in the present invention include aromatic carboxylic acids such as benzoic acid, o-benzoic acid, m-benzoic acid and p-benzoic acid, aliphatic tertiary amines such as trimethylamine and triethylamine, Examples include heterocyclic tertiary amines such as isoquinoline, pyridine, and betapicoline. At least one amine selected from heterocyclic tertiary amines is preferably used. The content of the ring-closing catalyst is preferably (the content of the ring-closing catalyst (mole)) / (the content of the polyamic acid as the precursor (mole)) and a range of 0.01 to 10.00.
本発明の製造方法では、脱水剤を使用しても良い。例えば、無水酢酸、無水プロピオン酸、無水酪酸などの脂肪族カルボン酸無水物、および無水安息香酸などの芳香族カルボン酸無水物などが挙げられるが、効率よく脱水できるものであれば、特にこれらに限定されない。脱水剤の含有量は、脱水剤の含有量(モル)/ポリアミド酸の含有量(モル)が0.01〜10.00となる範囲が好ましい。 In the production method of the present invention, a dehydrating agent may be used. Examples thereof include aliphatic carboxylic acid anhydrides such as acetic anhydride, propionic anhydride, and butyric anhydride, and aromatic carboxylic acid anhydrides such as benzoic anhydride. It is not limited. The content of the dehydrating agent is preferably in a range where the content of dehydrating agent (mole) / polyamic acid content (mole) is 0.01 to 10.00.
本発明の製造方法では、水を共沸させるために共溶媒を用いても良い。例えば、トルエン、キシレンなどが挙げられるが、効率よく水を共沸させることができるものであればこれらに限定されない。 In the production method of the present invention, a cosolvent may be used to azeotrope water. Examples thereof include toluene and xylene, but are not limited to these as long as water can be efficiently azeotroped.
本発明では、反応によって得られたポリイミドを適当な貧溶媒を用いて反応溶液から再沈殿させても良い。貧溶媒としては、アセトン、メタノール、エタノール、水などが挙げられるが、効率よく再沈殿させることができるものであれば、特にこれらに限定されない。また、再沈殿した後の残存反応溶媒を除去する溶媒についても特に限定されないが、再沈殿させた際に用いた溶媒を使用することが好ましい。 In the present invention, the polyimide obtained by the reaction may be reprecipitated from the reaction solution using an appropriate poor solvent. Examples of the poor solvent include acetone, methanol, ethanol, water, and the like. However, the poor solvent is not particularly limited as long as it can be efficiently re-precipitated. Moreover, although it does not specifically limit about the solvent which removes the residual reaction solvent after reprecipitation, It is preferable to use the solvent used at the time of reprecipitation.
本発明では更に、ポリイミドの性能向上を目的として、ポリイミドに添加物を加えたポリイミド組成物としても良い。これら、添加物は、その目的によって様々であり、特に限定されるものではない。また、添加方法、添加時期においても特に限定されるものではない。添加物の例としては、酸化珪素、酸化チタン、酸化アルミニウム、などの金属酸化物、リン酸カルシウム、リン酸水素カルシウム、ピロリン酸カルシウムなどのリン酸塩など、有機、無機の公知のフィラーが挙げられる。 In this invention, it is good also as a polyimide composition which added the additive to the polyimide for the purpose of the performance improvement of a polyimide further. These additives vary depending on the purpose and are not particularly limited. Further, the addition method and the addition time are not particularly limited. Examples of the additive include known organic and inorganic fillers such as metal oxides such as silicon oxide, titanium oxide, and aluminum oxide, and phosphates such as calcium phosphate, calcium hydrogen phosphate, and calcium pyrophosphate.
次に、本発明の実施の形態を説明する。本発明はこれら実施例に限定されるものではない。なお、実施例などにおける評価項目は下記のようにして測定を行った。 Next, an embodiment of the present invention will be described. The present invention is not limited to these examples. In addition, the evaluation item in an Example etc. measured as follows.
(1)固有粘度(dL/g)
ポリイミドの固有粘度は、N,N−ジメチルアセトアミドに0.04g/20mLの濃度で溶解した後、25℃に調整して測定した。
(1) Intrinsic viscosity (dL / g)
The intrinsic viscosity of the polyimide was measured by adjusting it to 25 ° C. after dissolving it in N, N-dimethylacetamide at a concentration of 0.04 g / 20 mL.
(2)接着性
室温でJISK5400の碁盤目試験に準じて塗膜に100個/cm2の枡目を作成し、その上からセロハンテープを貼り付け、充分に転圧した後、セロハンテープを一気に剥離させて基材上に残った枡目の数により接着性を調べた。セロハンテープを剥離後、基材上に残った残留升目の数が多いほど、接着性に優れることを意味する。
(3)光線透過率
日本SHIMAZU社製紫外可視光分光光度計(UV−2450)を用い、ポリイミドのフィルム(膜厚約10μm)に500nmの光線を照射し、500nmにおける光線透過率(%)を測定した。
(2) Adhesion Create a 100 / cm 2 grid on the coating film at room temperature according to the cross-cut test of JISK5400, affix the cellophane tape on top of it, and roll it down sufficiently. The adhesion was examined by the number of cells that were peeled off and remained on the substrate. The greater the number of residual cells remaining on the substrate after peeling the cellophane tape, the better the adhesion.
(3) Light transmittance Using a UV-visible light spectrophotometer (UV-2450) manufactured by SHIMAZU Japan, a polyimide film (thickness: about 10 μm) is irradiated with 500 nm light, and the light transmittance (%) at 500 nm is calculated. It was measured.
実施例1
攪拌機を取り付けた100mLのセパラブル3つ口フラスコにシリコンコック付きトラップを備えた玉付冷却管を取り付けることによって反応槽を構成し、この反応槽に、4,6−ジアミノレゾルシノール塩酸塩(以下、DARという、2,13g)、塩化スズ0.20g、トリエチルアミン2.08g、オキシジフタル酸二無水物(以下、ODPAという)3.10g、γ―バレロラクトン0.2g、ピリジン0.16g、N−メチルー2−ピロリドン(以下、NMPという)25mLおよびトルエン8mLを入れ、室温および窒素ガス雰囲気において攪拌機で10分間攪拌した。
Example 1
A reaction vessel was constructed by attaching a condenser tube with a ball equipped with a trap with a silicon cock to a 100 mL separable three-necked flask equipped with a stirrer, and this reaction vessel contained 4,6-diaminoresorcinol hydrochloride (hereinafter referred to as DAR). 2,13 g), tin chloride 0.20 g, triethylamine 2.08 g, oxydiphthalic dianhydride (hereinafter referred to as ODPA) 3.10 g, γ-valerolactone 0.2 g, pyridine 0.16 g, N-methyl-2 -25 mL of pyrrolidone (hereinafter referred to as NMP) and 8 mL of toluene were added, and the mixture was stirred for 10 minutes with a stirrer at room temperature and in a nitrogen gas atmosphere.
次いで、反応槽の内容物を180℃に加熱昇温させて5時間攪拌した。反応溶液は透明、均一であった。その後、室温まで冷却した。なお、反応中に生成した水は、シリコンコックより外部へ排除した。 Next, the contents of the reaction vessel were heated to 180 ° C. and stirred for 5 hours. The reaction solution was clear and uniform. Then, it cooled to room temperature. The water generated during the reaction was excluded from the silicon cock.
次に、得られた反応液にNMP20mLを添加し、希釈した後、大量のメタノール中に投入することによって生成沈殿物を分離し、これに、粉砕、ろ過、洗清および減圧乾燥処理を順に施すことによって薄黄色なポリマーを採取した。このポリマーの赤外吸収スペクトルを測定したところ、1,715cm−1および1,785cm−1の吸収帯において明確なイミド環の特性吸収が認められ、ポリイミドであることが確認された。更に、ポリマーの1H―NMRスペクトル(測定の際の溶媒はDMSO−d6)を測定したところ、10.1ppm付近でフェノール由来するピークが確認され、アミドNH由来するピークが消失したため、得られたポリマーはポリイミドであることが確認された。 Next, 20 mL of NMP is added to the obtained reaction liquid, diluted, and then poured into a large amount of methanol to separate the produced precipitate, and this is subjected to pulverization, filtration, washing and reduced-pressure drying in order. A pale yellow polymer was collected. This was measured infrared absorption spectrum of the polymer, observed characteristic absorptions distinct imide ring in the absorption band of 1,715Cm -1 and 1,785Cm -1, it is polyimide was confirmed. Furthermore, when the 1 H-NMR spectrum of the polymer (the solvent at the time of measurement was DMSO-d6) was measured, a phenol-derived peak was confirmed in the vicinity of 10.1 ppm, and the peak derived from amide NH disappeared. The polymer was confirmed to be polyimide.
得られたポリイミドをNMP溶液に溶かし(約13wt%)、シリコンウエハにキャストしてから、250℃で1時間熱処理を行い、厚さ10μm付近のポリマーのフィルムを作製した。碁盤目試験にて接着性の評価を行った。得られたポリイミドの評価結果を表1に示す。 The obtained polyimide was dissolved in an NMP solution (about 13 wt%), cast on a silicon wafer, and then heat-treated at 250 ° C. for 1 hour to produce a polymer film having a thickness of about 10 μm. Adhesion was evaluated by a cross-cut test. The evaluation results of the obtained polyimide are shown in Table 1.
実施例2
実施例1で使用した反応槽に無水ピロメリット酸2.20g、2,5−ジアミノー1,4−ベンゼンジチオール二塩酸塩2.45gを等モルで入れた他、トリエチルアミン2.08g、γ―バレロラクトン0.2g、ピリジン0.16g、NMP25mLおよびトルエン8mLを収容し、実施例1と同一手順を経ることにより反応溶液を得た。この反応溶液を、実施例1と同様の処理を行い、ポリマーを採取し、このポリマーを実施例1と同様の方法で分析したところ、ポリイミドであることが確認された。得られたポリイミドの評価結果を表1に示す。
Example 2
The reaction vessel used in Example 1 was charged with 2.20 g of pyromellitic anhydride and 2.45 g of 2,5-diamino-1,4-benzenedithiol dihydrochloride in equimolar amounts, 2.08 g of triethylamine, and γ-valero. A reaction solution was obtained by containing 0.2 g of lactone, 0.16 g of pyridine, 25 mL of NMP and 8 mL of toluene and passing through the same procedure as in Example 1. When this reaction solution was treated in the same manner as in Example 1, a polymer was collected, and the polymer was analyzed in the same manner as in Example 1, it was confirmed to be polyimide. The evaluation results of the obtained polyimide are shown in Table 1.
実施例3〜5
実施例1における塩化スズの代わりに表1に示す還元剤を添加した以外(実施例3:TiCl3添加量0.2g、実施例4:CuCl添加量0.2g、実施例5:H3PO3添加量0.2g)は全て実施例1と同様の条件にして重合反応を行った。目的物であるポリイミドの生成はIRおよびNMRにより確認できた。
Examples 3-5
Example 1 except that the reducing agent shown in Table 1 was added instead of tin chloride in Example 1 (Example 3: TiCl 3 addition amount 0.2 g, Example 4: CuCl addition amount 0.2 g, Example 5: H 3 PO The polymerization reaction was carried out under the same conditions as in Example 1 for 3 addition amounts of 0.2 g). The formation of the target polyimide was confirmed by IR and NMR.
比較例1
還元剤である塩化スズを添加しないこと以外は、実施例1と同様にして重合反応を行ったところ、反応開始後まもなく、重合系は着色、濁り、暫くして真っ黒になった。反応終了後、黒色のポリマーが得られた。この黒色ポリマーをNMP溶媒に溶解させたところ、溶液は濁り、ポリマーの一部は不溶であった。
Comparative Example 1
The polymerization reaction was carried out in the same manner as in Example 1 except that the reducing agent tin chloride was not added. As soon as the reaction started, the polymerization system became colored and turbid and turned black after a while. After completion of the reaction, a black polymer was obtained. When this black polymer was dissolved in the NMP solvent, the solution became cloudy and a part of the polymer was insoluble.
比較例2〜3
実施例1における塩化スズに代えて、表1に示す還元剤を添加したこと以外は実施例1と同様にして重合反応を行ったところ、反応進行とともに、重合系の着色が激しく、できたポリマーの色も濃かった。このポリマーをNMP溶媒に溶解させたところ、溶液は濁り、ポリマーの一部は不溶であった。また、Znを使用した比較例3では、水素が発生する危険性があり、操業が非常に困難であった。
Comparative Examples 2-3
A polymerization reaction was carried out in the same manner as in Example 1 except that the reducing agent shown in Table 1 was added instead of tin chloride in Example 1. The color of was also dark. When this polymer was dissolved in the NMP solvent, the solution became cloudy and a part of the polymer was insoluble. Further, in Comparative Example 3 using Zn, there was a risk of hydrogen generation, and the operation was very difficult.
以上説明したように、本発明によれば、酸無水物とフェニレンジアミン誘導体および/またはその塩とからの直接イミド化反応に基づくとともに、上記一般式(3)或いは(4)の分子構造を与えることによって、保存安定性、溶解性および接着性に優れたポリイミドを提供することができる。本発明に係るポリイミドは、半導体デバイスなどの製造での電気、電子絶縁材料として、詳しくは、ICやLSIなどの半導体素子の表面保護膜、層間絶縁膜などへの用途展開に極めて有意義である。 As described above, according to the present invention, based on a direct imidization reaction from an acid anhydride and a phenylenediamine derivative and / or a salt thereof, the molecular structure of the above general formula (3) or (4) is given. By this, the polyimide excellent in storage stability, solubility, and adhesiveness can be provided. The polyimide according to the present invention is extremely useful for the development of applications for surface protection films, interlayer insulation films, etc. of semiconductor elements such as ICs and LSIs, in particular, as electrical and electronic insulation materials in the production of semiconductor devices and the like.
Claims (6)
(前記一般式(1)または(2)中、ZはO,SまたはNHを表し、互いに異なっていても同じであってよい。)と、テトラカルボン酸無水物と、の直接イミド化反応によって得られ、下記一般式(3)および(4)のいずれか少なくとも1つで表される繰り返し単位:
(前記一般式(3)または(4)中、ZはO,SまたはNHを表し、互いに異なっていても同じであってもよく、R1はテトラカルボン酸無水物の残基である。)を含有し、500nmにおける光線透過率が50%以上であることを特徴とするポリイミド。 A phenylenediamine derivative represented by at least one of the following general formulas (1) and (2) and / or a salt thereof:
(In the general formula (1) or (2), Z represents O, S, or NH, which may be the same or different from each other) by a direct imidization reaction with a tetracarboxylic anhydride. A repeating unit obtained and represented by at least one of the following general formulas (3) and (4):
(In the general formula (3) or (4), Z represents O, S or NH, which may be the same or different from each other, and R 1 is a residue of a tetracarboxylic anhydride.) And a light transmittance at 500 nm of 50% or more.
(前記一般式(1)または(2)中、ZはO,SまたはNHを表し、互いに異なっていても同じであってよい。)と、テトラカルボン酸無水物と、を直接イミド化反応させることにより、
下記一般式(3)および(4)のいずれか少なくとも1つで表される繰り返し単位:
(前記一般式(3)または(4)中、ZはO,SまたはNHを表し、互いに異なっていても同じであってもよく、R1はテトラカルボン酸無水物の残基である。)を含有するポリイミドの製造方法。 In the presence of a reducing agent, a phenylenediamine derivative represented by at least one of the following general formulas (1) and (2) and / or a salt thereof:
(In the general formula (1) or (2), Z represents O, S or NH, which may be the same or different from each other) and a tetracarboxylic anhydride are directly imidized. By
A repeating unit represented by at least one of the following general formulas (3) and (4):
(In the general formula (3) or (4), Z represents O, S or NH, which may be the same or different from each other, and R 1 is a residue of a tetracarboxylic anhydride.) The manufacturing method of the polyimide containing this.
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