JP2011049354A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small electronic component storage package capable of firmly joining a lid and an electronic device excellent in reliability.
An insulating substrate having a recess, a plurality of wiring conductors disposed on a bottom surface of the recess, and a plurality of cuts formed on at least a pair of opposing inner wall surfaces of the inner wall surfaces of the recess. The notch 4, the lid 5 disposed so as to cover the recess 2, and the joining for joining the lid 5 and the insulating base 1 by filling the space between the upper surface of the side wall and the lid 5 and the inside of the notch 4. An electronic device comprising an agent 7 and an electronic component 5 mounted on the bottom surface of the recess 2, wherein the notch 4 is formed from the top surface of the side wall portion to the middle between the top surface of the side wall portion and the bottom surface of the recess 2. In addition, the width on the bottom surface side of the recess 2 is wider than the width on the upper surface side of the side wall portion. Since the bonding agent 7 is caught by the notch 4, even if a force for peeling the lid 8 is applied, the possibility that the bonding agent 7 is peeled from the insulating substrate 1 and the lid 8 is peeled can be reduced. .
[Selection] Figure 2

Description

  The present invention relates to an electronic device in which electronic components such as a semiconductor element, a crystal oscillator, and an image sensor are housed in an electronic component housing package.

  Conventionally, an electronic component storage package for mounting an electronic component such as a semiconductor element or a crystal resonator is made of, for example, tungsten or molybdenum on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by arranging a wiring conductor made of a metallized conductor using metal powder.

  In such an electronic component storage package, a concave portion for accommodating an electronic component is usually formed on the upper surface, and a wiring conductor is disposed so as to be led out from the bottom surface of the concave portion to the lower surface or side surface of the insulating base. ing. And while accommodating an electronic component in the recessed part of such an electronic component storage package, each electrode of an electronic component is electrically connected to each corresponding wiring conductor via electrical connection means, such as solder and a bonding wire. Then, a lid made of metal, ceramics, glass, resin, or the like is joined to the upper surface of the insulating base so as to cover the concave portion, and the electronic component is sealed, whereby the electronic device is manufactured. The lid is bonded to the upper surface of the side wall around the recess by, for example, a bonding agent such as resin (see, for example, Patent Document 1).

JP2003-163297

  In recent years, electronic devices have been required to be downsized and highly functional. For example, when electronic parts that have become large due to high functionality are stored in recesses, small electronic parts can be used as resistance elements, When accommodating in a recessed part with small passive elements, such as a capacitive element, a certain magnitude | size is required in order to accommodate them in a recessed part. Thus, in order to reduce the size of the electronic component storage package after the recess has a certain size, it is required to reduce the width of the side wall portion around the recess of the electronic component storage package. . If the width of the side wall portion is narrowed, the area for bonding the electronic component storage package and the lid with the bonding agent is reduced, so that the bonding between the electronic component storage package and the bonding agent is weakened, and the electronic component storage package is used. There arises a problem that the bonding agent tends to be peeled off from the package. In this case, the lid body is easily peeled off from the electronic component storage package, and there is a concern that the lid body cannot be satisfactorily bonded to the electronic component storage package.

  For example, in the case of an imaging device that is an electronic device equipped with an imaging device as an electronic component, if the lid peels off due to the bonding agent peeling from the electronic component storage package, dust enters the recess. As a result, a shadow is generated on the image pickup surface of the image pickup device, and good image pickup cannot be performed. Also, the purpose of sealing the image sensor and protecting it from the external environment cannot be achieved.

  The present invention has been devised in view of the above-described problems of the prior art, and an object of the present invention is to provide an electronic device that is small in size, has a lid firmly joined to an electronic component storage package, and has excellent reliability. It is in.

  The electronic device according to the present invention includes an insulating base having a recess, a plurality of wiring conductors disposed on the bottom surface of the recess, and a plurality of at least a pair of inner walls facing each other among the inner walls of the recess. A notch, a lid disposed so as to cover the recess, a space between the upper surface of the side wall around the recess and the lid, and filling the inside of the notch, the lid and the insulating base are joined. An electronic device comprising a bonding agent and an electronic component mounted on the bottom surface of the concave portion, wherein the notch is midway between the top surface of the side wall portion and the top surface of the side wall portion and the bottom surface of the concave portion. And the width on the bottom surface side of the concave portion is wider than the width on the upper surface side of the side wall portion.

  The electronic device of the present invention is characterized in that, in the above configuration, the plurality of notches are connected to each other on the bottom surface side of the recess.

  According to the electronic device of the present invention, the notch on the inner wall surface of the recess is formed from the upper surface of the side wall portion to the middle between the upper surface of the side wall portion and the bottom surface of the recess portion, and on the upper surface side of the side wall portion. Since the width on the bottom surface side of the recess is wider than the width, the bonding agent filled in the notch is also wider on the bottom surface side of the recess than on the upper surface side of the side wall portion. Therefore, the bonding agent is caught on the inner surface of the notch at the part where the width of the notch is narrowed. Therefore, even if a force for peeling the lid is applied, the bonding agent is peeled off from the insulating base and the lid is removed. The possibility that the body peels off can be reduced. Accordingly, the bonding strength between the insulating base and the lid can be improved, and a small electronic device in which the lid is firmly bonded is obtained.

  In addition, since the notch is opened to the concave portion side, for example, when the bonding agent made of resin is filled in the notch, air hardly remains in the notch. Therefore, it is easy to fill the notch with the bonding agent while suppressing the generation of gaps due to residual air. Accordingly, the bonding area between the bonding agent and the insulating base in the notch is prevented from being reduced due to a gap or the like, and a portion where the bonding agent is caught on the inner surface of the notch can be sufficiently secured.

  According to the electronic device of the present invention, in the above configuration, when the plurality of notches are connected to each other on the bottom surface side of the recess, the portions where the bonding agent is connected, that is, the notches Since it is also caught under the side wall portion between the two, the possibility that the bonding agent peels off from the insulating substrate and the lid body peels off more effectively even when a force for peeling the lid body is applied. Can do.

It is sectional drawing which shows an example of embodiment of the electronic device of this invention. (A) is a top view which shows an example of embodiment of the electronic component storage package used for the electronic device of this invention, (b) is sectional drawing in the AA of (a). It is sectional drawing which shows the other example of embodiment of the electronic component storage package used for the electronic device of this invention. It is a top view which shows the other example of embodiment of the electronic component storage package used for the electronic device of this invention. (A) is a top view which shows an example of embodiment of the multi-cavity board | substrate for manufacturing the package for electronic component storage used for the electronic device of this invention, (b) is AA of (a). It is sectional drawing in a line. (A) is a principal part enlarged plan view which shows the A section of Fig.5 (a), (b) is sectional drawing in the AA of (a). (A) is a principal part enlarged plan view which shows the other example of embodiment of the multi-cavity board | substrate for manufacturing the electronic component storage package of this invention, (b) is AA of (a). It is sectional drawing in a line.

  The electronic device of the present invention will be described with reference to the accompanying drawings.

  1 to 4 show an electronic device according to the present invention and an electronic component storage package used in the electronic device, and FIGS. 5 to 7 show a plurality of electronic component storage packages used in the electronic device according to the present invention. Each example of the embodiment of the substrate is shown. In these drawings, 1 is an insulating substrate, 2 is a recess, 3 is a wiring conductor, 4 is a notch, 5 is an electronic component, 6 is a connection member, 7 is a bonding agent, 8 is a lid, and 9 is for storing an electronic component. A package, 11 is a mother board, 11a is a package area for storing electronic components, 11b is a dummy area, 11c is a dummy recess, 12 is a planned dividing line, and 12a is a divided groove. 2 (a), FIG. 4, FIG. 5 (a), FIG. 6 (a), and FIG. 7 (a) are plan views, but the wiring conductor 3 and the notch 4 are hatched for easy recognition. Has been given.

  As shown in the example shown in FIG. 1, the electronic device of the present invention is at least opposed to an insulating base 1 having a recess 2, a plurality of wiring conductors 3 disposed on the bottom surface of the recess 2, and an inner wall surface of the recess 2. A plurality of cutouts 4 formed on a pair of inner wall surfaces, a lid 5 disposed so as to cover the recess 2, a space between the upper surface of the side wall portion and the lid 5 and the inside of the cutout 4 An electronic device including a bonding agent (7) for bonding a lid (5) and an insulating substrate (1) and an electronic component (5) mounted on the bottom surface of the recess (2), wherein the notch (4) is formed from the top surface of the side wall portion to the top surface of the side wall portion. And the bottom surface of the recess 2 is formed partway, and the width of the bottom surface of the recess 2 is wider than the width of the top surface of the side wall. Thus, the notch 4 is formed from the top surface of the side wall portion to the middle between the top surface of the side wall portion and the bottom surface of the recess 2, and is closer to the bottom surface side of the recess 2 than the width of the top surface side of the side wall portion. Since the width is wider, the bonding agent 7 in the notch 4 is also hardened because the width on the bottom surface side of the concave portion is wider than the width on the upper surface side of the side wall portion, so that the bonding agent 7 is notched. 4, even if a force is applied to peel off the lid 8, the possibility that the bonding agent 7 is peeled off from the insulating base 1 and the lid 8 is peeled off can be reduced.

  Further, when the notch 4 is filled with the bonding agent 7 made of resin, for example, there is a portion opened to the recess 2 side, so that air does not easily accumulate in the notch 4. It is possible to satisfactorily fill the bonding agent 7, widen the bonding area with the insulating base 1, and sufficiently secure a portion where the cured bonding agent 7 is caught on the inner surface of the notch 4.

  Further, the electronic component storage package 9 used in the electronic device of the present invention has a plurality of adjacent cutouts 4 connected to each other on the bottom surface side of the recess 2 as shown in FIG. Since the connected portion, that is, the lower side of the side wall portion between the notches 4 is also caught, the bonding agent 7 is surely caught by the notches 4 and a force to peel off the lid 8 is applied. The possibility that the bonding agent 7 is peeled off from the insulating substrate 1 and the lid 8 is peeled off can be more effectively reduced.

  Further, by providing a plurality of cutouts 4 along the inner wall surface of the recess 2 in the side wall portion, there is a region of the insulating base 1 between the adjacent cutouts 4. Compared with the case where two large cutouts are provided, it is possible to suppress the mechanical strength of the side wall portion from being reduced, and it is possible to reduce the possibility of occurrence of cracks or chips in the side wall portion. In addition, when one large cutout is provided, if a part of the bonding agent 7 is peeled off, the peeling spreads over a wide area within the cutout 4, but a plurality of cutouts 4 are provided. Therefore, even if the bonding agent 7 in one notch 4 is partially peeled and the peeling is spread, it is possible to suppress the peeling from spreading to the other plurality of notches 4. Can be effectively prevented from peeling off from the upper surface of the side wall portion.

  The insulating base 1 is made of an insulating material such as ceramic or resin. If the insulating substrate 1 is made of ceramics, the insulating substrate 1 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. It consists of

  If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. Then, this is formed into a sheet by a known doctor blade method or calender roll method to obtain a ceramic green sheet, and then, the ceramic green sheet is appropriately punched and laminated to form a laminate. And this is baked at high temperature (about 1500-1800 degreeC), and what consists of a several insulating layer is manufactured.

  The concave portion 2 of the insulating substrate 1 is formed by forming through holes for the concave portion 2 by laser processing, punching processing, or the like in some ceramic green sheets of the ceramic green sheets used when the insulating substrate 1 is manufactured. It is formed by laminating a green sheet on a ceramic green sheet in which a through hole for the recess 2 is not formed.

  The wiring conductor 3 includes a wiring conductor layer disposed between the surface of the insulating base 1 and the insulating layer, and a through conductor that electrically connects the wiring conductor layers that pass through the insulating layer and are positioned above and below. For the wiring conductor layer, a metallized paste for the wiring conductor layer is printed on the ceramic green sheet for the insulating base 1 by printing means such as a screen printing method to form a laminate for the insulating base 1, and this is fired. Formed by. Prior to the printing and application of the metallized paste for forming the wiring conductor 3, the through conductor is formed in the ceramic green sheet for the insulating substrate 1 by punching by die or punching or laser processing, etc. Then, the through hole is filled with a metallized paste for through conductors by a printing means such as a screen printing method to form a laminated body that becomes the insulating substrate 1 and is fired.

  The metallized paste is prepared by adding an organic binder and an organic solvent to the metal powder of the main component, adding a dispersant as necessary, and mixing and kneading by a kneading means such as a ball mill, a three roll mill, a planetary mixer or the like. . Further, glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the insulating substrate 1 after firing. The metallized paste for the through conductor is adjusted to a higher viscosity suitable for filling than the metallized paste for the wiring conductor layer, depending on the type and amount of the organic binder or organic solvent.

  The exposed surface of the wiring conductor 3 is coated with a metal having excellent corrosion resistance, such as nickel or gold, as necessary. Accordingly, corrosion of the wiring conductor 3 can be effectively suppressed, the bonding between the wiring conductor 3 and an electronic component, the bonding between the wiring conductor 3 and a connecting member such as a bonding wire, and the wiring conductor 3 Bonding with the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surface of the wiring conductor 3, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially coated by an electrolytic plating method or an electroless plating method. Worn.

  A plurality of cutouts 4 are formed on each of at least a pair of opposed inner wall surfaces among the inner wall surfaces of the recess 2. Such a notch 4 is formed from the upper surface of the side wall portion to the middle between the upper surface of the side wall portion and the bottom surface of the recess 2 as in the example shown in FIG. The width on the bottom surface side of the recess 2 is wider than the width on the upper surface side. When the bonding agent 7 is filled in the notch 4 and the lid 8 and the insulating base 1 are bonded via the bonding agent 7, the bonding agent 7 in the notch 4 is also larger than the width on the upper surface side of the side wall portion. Also, the width of the bottom surface side of the recess 2 is hardened in a wider shape. Therefore, since the bonding agent 7 is caught on the inner surface of the notch 4, there is a possibility that the bonding agent 7 is peeled off from the insulating base 1 and the lid 8 is peeled off even when a force for peeling the lid 8 is applied. Can be reduced.

  Further, as in the example shown in FIG. 2B, when the notch 4 has a step 4a in which the width on the bottom surface side of the recess 2 is wider than the width on the upper surface side of the side wall portion, Since the bonding agent 7 filled and cured in 4 is caught by the step 4a of the notch 4, it is more effective in reducing the possibility that the bonding agent 7 is peeled off from the insulating base 1 and the lid 8 is peeled off. is there.

  Such a notch 4 is formed as follows, for example. First, the ceramic green sheet used for producing the insulating substrate 1 and having the through holes for the recesses 2 is removed from the uppermost layer from the ceramic green sheet, except at least the lowermost layer. All of the through holes for the notches 4 are formed by a hole processing method such as laser processing or punching using a punching die. At this time, the through hole for the cutout 4 of the ceramic green sheet serving as the upper layer is formed to be smaller than the through hole for the cutout 4 of the ceramic green sheet serving as the lower layer. Then, the through holes for the recesses 2 and the notches 4 are formed in these ceramic green sheets by punching the through holes for the recesses 2 so as to partially overlap the through holes for the notches 4. And the ceramic green sheet in which the small through-hole was formed is laminated | stacked so that through-holes may overlap on the ceramic green sheet in which the large through-hole was formed. Thereafter, a ceramic green sheet not forming the through hole for the recess 2 is laminated on the lower side of the laminate (not shown) of the ceramic green sheet in which the through hole for the recess 2 is formed. By firing the ceramic green sheet at the same time, the insulating substrate 1 having the notch 4 having a step 4a in the width direction along the inner wall surface of the recess 2 is formed. Lamination of the ceramic green sheet in which the through hole for the recess 2 is formed and the ceramic green sheet in which the through hole is not formed may be performed simultaneously without being separately performed as described above. In addition, if the through-hole for the recessed part 2 provided with the area | region used as the notch 4 is formed in an inner wall surface by one punching using a dedicated punching die, the recessed part 2 and the notch 4 will be formed efficiently. be able to.

  Further, the notch 4 may be gradually widened from the upper surface side of the narrow side wall portion to the bottom surface side of the wide concave portion, and in the case of the notch 4 whose inner wall surface is an inclined surface, The diameter on the bottom side of the ceramic green sheet for forming the through hole for the notch 4 is larger than the diameter on the opening side by a hole machining method such as laser machining or punching using a punching die. A through hole for the notch 4 having an inclined inner wall surface is formed and the ceramic green sheets are laminated. For example, if the through hole for the cutout 4 is formed by punching, the ceramic green sheet is placed on a base having a hole having a diameter larger than that of the punching pin, and the ceramic green sheet is placed from the upper surface to the lower surface. By punching with a pin toward the hole, it is possible to form a through hole in which the inner wall surface is inclined from the upper surface to the lower surface of the ceramic green sheet. Since the inner wall surface of the notch 4 becomes an inclined surface in the length direction of the side wall portion from the opening toward the bottom surface, the bonding agent is easily filled in the notch 4 without a gap. It is also possible to effectively reduce the formation of unfilled portions.

  In addition, as in the example shown in FIG. 3, when the plurality of notches 4 are connected to each other on the bottom surface side of the recess 2, the bonding agent 7 in the notch 4 Since it is connected and hardened on the bottom surface side, the bonding agent 7 is also caught on the lower surface of the side wall portion between the notches 4 on the upper surface side of the side wall portion, and a force for peeling the lid body 8 is applied. The possibility that the bonding agent 7 is peeled off from the insulating substrate 1 and the lid 8 is peeled off can be more effectively reduced.

  The shape of the cutout 4 is preferably a semicircular shape, a semielliptical shape, or a semielliptical shape in plan view as in the example shown in FIG. In the case of the cutouts 4 having these shapes, it is easy to satisfactorily fill the bonding agent 7 in the cutouts 4 as compared with the case where the cutouts 4 are polygonal shapes such as a square shape. Further, when an impact is applied to the electronic component storage package 9 from the outside, there is no corner portion where stress concentrates in the notch 4, so that the notch between the notch 4 and the outer wall surface of the insulating substrate 1 or adjacent to the notch 4. Generation of cracks between the four members can be suppressed.

  The width of the upper surface side of the side wall of the notch 4 is preferably 0.3 mm or more, and the distance between the notch 4 and the outer wall surface of the insulating base 1 and the distance between adjacent notches 4 are preferably 0.2 mm or more. . When the size of the opening of the notch 4 is 0.3 mm or more, the bonding agent 7 is easily filled into the notch 4 when the bonding agent 7 made of resin is applied to the upper surface of the side wall portion. Further, when the distance between the notch 4 and the outer wall surface of the insulating base 1 and the distance between the adjacent notches 4 are set to 0.2 mm or more, the notch between the notch 4 and the outer wall surface of the insulating base 1 and the adjacent notch. It can suppress effectively that a crack generate | occur | produces by the impact from the outside between four.

  Further, as in the example shown in FIG. 2B, when the width of the notch 4 on the bottom surface side of the recess 2 is larger than the width on the upper surface side of the side wall portion, the width of the wall portion is increased. It is preferable to keep it. In this case, since the thickness of the side wall portion between the notch 4 and the outer wall surface of the insulating substrate 1 can be made relatively thick, the thickness in the width direction of the side wall portion has formed the notch 4. A decrease in mechanical strength due to thinning can be suppressed. In addition, when the ceramic green sheets forming the insulating base 1 are laminated, the distance between the portion that becomes the notch 4 and the portion that becomes the outer wall surface of the insulating base 1 can be made relatively wide. In addition, it is possible to suppress the generation of voids between the outer wall surface of the insulating substrate 1 and the notch 4 without the ceramic green sheets being satisfactorily stacked around the notch 4 due to deformation of the ceramic green sheet or the like. it can.

  The electronic component 5 is a semiconductor element such as an IC chip or an LSI chip, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, or various sensors.

  For example, when the electronic component 5 is a flip-chip type semiconductor element, the electronic component 5 is mounted on the bottom surface of the concave portion 2 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin). This is performed by electrically and mechanically connecting the electrode of the semiconductor element and the wiring conductor 3 disposed in the recess 2 through the member 6. In this case, an underfill may be injected between the electronic component 5 and the bottom surface of the recess 2 after connecting via the bumps that are the connecting members 6. Alternatively, for example, when the electronic component 5 is a wire bonding type semiconductor element, the semiconductor element is fixed to the bottom surface of the recess 2 with a bonding material such as glass, resin, or a brazing material, and then the bonding wire as the connection member 6 is attached. This is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 3 via the wiring. For example, when the electronic component 5 is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the piezoelectric element is fixed by the connecting member 6 such as a conductive resin in a state where the piezoelectric element has a space necessary for the piezoelectric vibration. Electrical connection between the element electrode and the wiring conductor 3 is performed. In either case, a small electronic component such as a resistance element or a capacitive element may be mounted around the electronic component 5 as necessary.

  The lid 8 is a flat plate made of metal, ceramics, glass, resin, or the like. The lid 8 preferably has a thermal expansion coefficient close to that of the insulating base 1. For example, the insulating base 1 is made of an aluminum oxide sintered body, and the lid 8 is made of a metal. For example, an Fe-Ni (iron-nickel) alloy or an Fe-Ni-Co (iron-nickel-cobalt) alloy may be used. When the electronic component 5 is a solid-state imaging element or a light emitting element, a translucent plate made of glass or resin may be used, or a translucent lens made of glass or resin may be used. Or it is good also as the cover body 8 using the board | plate material to which the lens was attached.

  Moreover, you may fill and enclose resin, such as an epoxy resin and a silicone resin, in the recessed part 2 as needed. For example, when the electronic component 5 is a light emitting element, a resin containing a phosphor may be filled in the recess 2 so that the light emitted from the light emitting element is wavelength-converted by the phosphor.

  As the bonding agent 7, a resin material such as an acrylic resin, an epoxy resin, a phenol resin, a cresol resin, a silicone resin, or a polyether amide resin, such as thermosetting or photocuring, can be used. The bonding agent 7 may be mixed with dark pigments or dyes such as black, brown, dark brown, dark green or dark blue as necessary. In this case, for example, when the electronic component 5 is a solid-state image sensor and a lid 8 having a light-transmitting plate or lens attached to a light-shielding plate, undesired light is bonded to the bonding agent 7. It is possible to block the penetration through. Further, when the electronic component 5 is a light emitting element and the lid 8 made of a light-shielding plate material to which a light-transmitting plate material is similarly attached is bonded, the light from the light emitting element transmits the bonding agent 7. Thus, leakage to the side of the recess 2 can be blocked.

  The insulating base 1 and the lid 8 are joined, for example, as follows. First, the uncured bonding agent 7 made of resin is applied to the upper surface of the side wall portion of the recess 2 of the insulating substrate 1 using a dispenser or the like. Thereafter, the lid body 8 is disposed on the bonding agent 7 before curing, and the bonding agent 7 is cured by heating or irradiating the bonding agent 7 before curing with ultraviolet rays, thereby bonding the insulating substrate 1 and the lid body 8 together. 7 is joined. At this time, when the bonding agent 7 before curing is applied to the upper surface of the side wall portion of the concave portion 2 of the insulating base 1 using a dispenser or the like, the discharge port of the discharge nozzle of the dispenser opens the notch 4 on the upper surface of the side wall portion. The bonding agent 7 is surely filled into the plurality of notches 4 by moving the discharge nozzle so as to pass above and applying the bonding agent 7 so as to surely pass through the opening of the notch 4.

  Further, when the electronic device of the present invention is manufactured, as shown in FIGS. 5 and 6, the electronic component storing package region that becomes the electronic component storing package 9 constituting the electronic device of the present invention after division. When a plurality of 11a are arranged in the form of a so-called multi-chip substrate in which a plurality of 11a are arranged vertically and horizontally, a large number of electronic component storage packages 9 can be efficiently manufactured.

  In such a multi-chip substrate, for example, a plurality of electronic component storage package regions 11a are arranged vertically and horizontally in the center of the mother substrate 11. Then, by cutting the mother board 11 along the planned dividing line 12 or dividing it along the dividing grooves 12a formed on the planned dividing line 12, a large number of electronic component storage packages 9 can be obtained. It is formed. In addition, after electronic components are mounted on the bottom surface of the recess 2 of each electronic component storage package area 11a, a lid is joined so as to cover each recess 2 and divided along the planned dividing line 12 of the mother board 11. A large number of electronic devices may be manufactured. Such a multi-piece substrate is obtained by forming the recess 2, the wiring conductor 3, and the notch 4 on the mother substrate 11 by using the same material as that of the insulating base 1 described above. .

  When the mother board 1 is cut and divided along the planned dividing line 12 by a dicing method or the like, a bonding agent made of resin is applied to the upper surface of the side wall portion of the recess 2 and the notch 4 to bond the lid. Then, when the substrate is cut by a dicing method or the like, the mother substrate 11 is divided in a state where the notch 4 is filled with the bonding agent. Therefore, when cutting, the outer periphery of the notch 4 and each electronic component storage package region 11a is divided. It is effective to suppress the occurrence of cracks in the side wall between the two.

When the mother substrate 1 is divided along the dividing groove 12a, the recess 2 and the plurality of cutouts 4 are arranged symmetrically with respect to the dividing groove 12a as the center line (W _1L = W _1R , W _2L = W _2R ), the stress at the time of division can be applied equally to both sides across the division groove 12a. This is effective in reducing the possibility of burrs and chips. Further, when the depth of the dividing groove 12a is made deeper than the depth of the notch 4, when the dividing is performed by applying a force to bend along the dividing groove 12a, the side of the notch 4 from the bottom of the dividing groove 12a. This is effective in reducing the possibility of cracks.

  Further, as in the example shown in FIG. 5, in order to improve the productivity and workability of the multi-piece substrate, dummy areas 11b may be provided around each electronic component storage package area 11a. Good.

  In the case where the dummy area 11b is provided, although not shown, in order to divide each electronic component storage package area 11a and the dummy area 11b satisfactorily, the division line 12 is formed on the recess 2 and the dummy area 11b. On the dummy area 11b, it becomes the center line of the area between the provided dummy recess 11c and the center line of the area between the notch 4 and the notch 4 provided on the dummy area 11b. Alternatively, the dummy recess 11c and the notch 4 may be arranged. By arranging in this way, the stress at the time of division can be applied equally to both sides across the division groove 12a, so that there is a possibility that burrs and chips will occur in the electronic component storage package 9 at the time of division. This is effective in reducing.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the electronic device shown in FIG. 1, the wiring conductor 3 is led out from the bottom surface of the recess 2 to the lower surface of the insulating base 1, but the wiring conductor 3 may be led out to the side surface of the insulating base 1. Further, a cutout may be formed on the side surface of the insulating base 1, and the wiring conductor 3 functioning as an external terminal may be led out to the inner surface of the cutout, so that the wiring conductor 3 may be a so-called castellation conductor.

DESCRIPTION OF SYMBOLS 1: Insulation base | substrate 2: Recessed part 3: Wiring conductor 4: Notch 5: Electronic component 6: Connection member 7: Bonding agent 8: Lid 9: Package for electronic component accommodation
11: Mother board
11a: Package area for storing electronic components
11b: Dummy area
11c: Dummy hole
12: Scheduled line
12a: Dividing groove

Claims (2)

  An insulating base having a recess, a plurality of wiring conductors disposed on the bottom surface of the recess, a plurality of notches formed on at least a pair of the inner wall surfaces facing each other among the inner wall surfaces of the recess, and the recess A lid disposed so as to cover, a bonding agent filling the gap between the upper surface of the side wall portion around the recess and the lid and the inside of the notch, and bonding the lid and the insulating base; and the recess The notch is formed from the upper surface of the side wall portion to the middle between the upper surface of the side wall portion and the bottom surface of the recess, and 2. An electronic device according to claim 1, wherein a width on a bottom surface side of the concave portion is wider than a width on an upper surface side of the side wall portion.   2. The electronic device according to claim 1, wherein adjacent ones of the plurality of notches are connected to each other on a bottom surface side of the concave portion.

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