JP2011046970A - Copper alloy material and method for producing the same - Google Patents

Abstract

To provide a copper alloy material excellent in punching workability while maintaining strength and conductivity required for electronic parts such as connector terminals in a Cu-Co-Si based copper alloy.
Co containing 0.5 to 2.5 mass%, Si containing 0.1 to 1 mass%, and the ratio of Co and Si content Co / Si is between 2.5 and 4.5, Furthermore, a copper alloy material containing 0.01 to 0.2 mass% of at least one additive element selected from the group consisting of Cr, Fe, Ni, Al, Nb, Ti, V and Zr, with the balance being Cu and inevitable impurities A copper having a diameter of 0.05 to 5 μm and a density of 10 ³ to 10 ⁵ pieces / mm ² and a compound of Si and at least one element selected from the group consisting of the additive element and Co Alloy material.
[Selection figure] None

Description

  The present invention relates to a copper alloy material for electronic equipment, which is suitable for electronic parts such as terminals and connectors, and is excellent in strength, electrical conductivity, and punchability, and a method for producing the same.

  In recent years, electronic devices that carry a large current have been reduced in size and weight, and electronic component materials are strongly required to have high conductivity and excellent strength. A copper alloy containing Co and Si as main additive elements is considered to be suitable for the electronic component because it has excellent mechanical strength and electrical conductivity. These electronic components are mainly manufactured by punching with a high-speed press using a mold, and at the time of manufacturing, the material is punched into a predetermined shape by causing shear deformation or fracture deformation by the punch of the mold. . However, as the number of press shots increases, the cutting edge of the die punch advances and the fracture shape is disturbed, making it impossible to maintain the product shape. As a means of reducing the cost of mold maintenance, there is a need for a copper alloy with excellent punchability that can reduce mold wear or maintain the press shape even when the wear progresses from the initial mold shape ( Patent References 1 to 6).

JP-A-61-87838 JP-A 63-307232 Japanese Patent Laid-Open No. 02-129326 Japanese Patent Laid-Open No. 02-277735 JP 2008-88512 A JP 2008-55977 A

However, the copper alloys with Co and Si as the main additive elements proposed in Patent Documents 1 to 6 are all focused on high strength, high conductivity, hot workability, etc. There is no description. In the copper alloy manufacturing methods described in these documents, it can be seen that the compound control necessary for improving the press punching processability is not performed.
Then, this invention makes it a subject to provide the copper alloy material which is excellent in stamping workability, maintaining the intensity | strength and electroconductivity which are requested | required of electronic components, such as a terminal for connectors, in a Cu-Co-Si type alloy.

  The present inventors have found that the above problem can be solved by controlling a compound that improves the punching workability in a Cu—Co—Si based alloy. That is, by controlling the compound size and density in the alloy within a specific range by defining the alloy composition and casting / heat treatment conditions, the punching workability can be improved while maintaining the strength and conductivity characteristics of conventional copper alloys. Based on this finding, the inventors have found that the present invention can be improved.

The above problems are solved by the following invention.
(1) Co is contained at 0.5 to 2.5 mass%, Co / Si content ratio Co / Si is between 2.5 and 4.5, and Cr, Fe, Ni, Al, Nb , A copper alloy material containing 0.01 to 0.2 mass% of at least one additive element selected from the group consisting of Ti, V and Zr, with the balance being Cu and inevitable impurities, the diameter of which is 0.05 to A copper alloy material having a compound of Si and at least one element selected from the group consisting of the additive element and Co, having a density of 10 to 105 / mm 2 at 5 μm.
(2) Co is contained in an amount of 1.4 mass% to 2.5 mass%, the Co / Si content ratio Co / Si is between 3.0 and 5.0, and the balance is made of Cu and inevitable impurities. A copper alloy material having a compound composed of Co and Si having a diameter of 0.05 to 5 μm and a density of 103 to 105 pieces / mm 2, which is a copper alloy material.
(3) Co is contained in an amount of 0.5 mass% to less than 1.4 mass%, the Co / Si content ratio Co / Si is between 3.0 and 5.0, and the balance is made of Cu and inevitable impurities. A copper alloy material having a compound composed of Co and Si having a diameter of 0.05 to 5 μm and a density of 103 to 105 pieces / mm 2, which is a copper alloy material.
(4) The copper alloy composition of the copper alloy material according to any one of (1) to (3) further contains 0.01 to 1 mass% of at least one selected from the group consisting of Sn, Zn and Mg. A copper alloy material having a diameter of 0.05 to 5 μm and a density of 103 to 105 / mm 2, at least one element selected from the group consisting of the additive element and Co, and a compound consisting of Si Copper alloy material.
(5) A method for producing the copper alloy material according to any one of (1) to (4), wherein the ingot is produced under a condition where the cooling rate during casting is 1 to 30 ° C / second. A method for producing a copper alloy material, characterized by performing cold rolling and intermediate annealing, homogenizing, repeating finish rolling and strain relief annealing.
(6) The ingot produced under the condition that the cooling rate during casting is 1 to 30 ° C./second is homogenized, and after hot rolling, a process of repeating cold rolling and intermediate annealing is performed, and the conditions are as follows: (A) At the time of cooling after completion of hot rolling, the temperature decreasing rate up to 600 ° C. is set to 1 ° C./second or more and 30 ° C./second or less, solution heat treatment and / or recrystallization heat treatment (hereinafter, both are solution heat treatment) When the temperature rise rate at 600 ° C. or higher and the temperature decrease rate to 600 ° C. is set to 30 ° C./second or higher, or (B) the temperature decrease rate to 600 ° C. at the time of cooling after completion of hot rolling. When the solution heat treatment is performed at 30 ° C / second or higher, the temperature is increased at 600 ° C or higher and the temperature decrease rate to 600 ° C is set at 1 ° C / second or higher and 30 ° C / second or lower, and then aging is performed. (5) characterized by performing heat treatment, finish rolling and strain relief annealing Method for producing a copper alloy material according.
(7) The ingot produced under the condition that the cooling rate during casting is 1 to 30 ° C./second is homogenized, and after hot rolling, a process of repeating cold rolling and intermediate annealing is performed. (C) A heat treatment step is newly provided between the hot rolling step and the cold rolling step, and held at 600 to 750 ° C. for 50 to 600 seconds and then rapidly cooled, or (D) the cold rolling step. After the material is made 0.05 to 0.5 mm thick, before the solution heat treatment step, a heat treatment step is newly provided, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled. (E) A heat treatment step is newly provided between the solution heat treatment step and the aging heat treatment step, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled. Furthermore, after that, perform aging heat treatment, finish rolling, strain relief annealing Characterized method of the copper alloy material according to (5) or (6).
The “compound” in the present invention is an intermetallic compound composed of two or more elements described above, and a crystallized product (intermetallic compound that appears when transforming from liquid to solid) and a precipitate (when transforming from solid to solid). For example, an intermetallic compound appearing from a solid solution state).

  The copper alloy material of the present invention is improved in punching workability without impairing strength and electrical conductivity. Therefore, it has high-level characteristics required for copper alloy materials when used as parts for electronic equipment such as terminals and connectors, etc., and cost performance is improved by extending the die life in stamping. .

The preferred embodiments of the present invention will be described below. In the present invention, the copper alloy material means a copper alloy processed into a specific shape such as a plate material, a strip material, or a foil by a rolling process.
The composition of the first embodiment of the copper alloy material of the present invention is Co, Si and other additive elements (at least one selected from the group consisting of Cr, Fe, Ni, Al, Nb, Ti, V, and Zr). And the balance contains Cu and inevitable impurities.

  In the copper alloy material of the present embodiment, the Co content is 0.5 to 2.5 mass%. The reason for this is to ensure sufficient strength as a product. If it is less than 0.5 mass%, the strength obtained by precipitation with Si becomes insufficient. On the other hand, if it exceeds 2.5 mass%, it will not be able to be completely dissolved and will not contribute to strengthening of the alloy, and it will become an alloy which is inferior in competitiveness in terms of price due to the increase in the amount of cobalt with high metal cost. Preferably it is 0.6-2.2 mass%, More preferably, it is 0.7-2.0 mass%.

  It is preferable that the Si content satisfies a range of at least 0.1 to 1 mass%. This is also for ensuring sufficient strength as a product. If the amount is too small, the strength obtained by precipitation with Co may be insufficient. Moreover, when there is too much, electrical conductivity may fall by solid solution. In the present embodiment, the mass ratio of Co and Si and Co / Si are set to 2 to 4.5.

In this embodiment, in addition to Co and Si, at least one additive element selected from the group consisting of Cr, Fe, Ni, Al, Nb, Ti, V, and Zr is included.
Cr, Fe, Ni, Al, Nb, Ti, V, and Zr crystallize as a compound together with Co and Si, and are effective in improving the punching workability. The total content of the elements is 0.01 to 0.2 mass%. If it is less than 0.01 mass%, the effect of improving the punching workability cannot be obtained sufficiently. On the other hand, if it exceeds 0.2 mass%, most of Co and Si become compounds that do not contribute to the strength, so that the material strength is lower than the required strength.

In the present embodiment, the copper alloy contains at least one element selected from Co and other additive elements (Cr, Fe, Ni, Al, Nb, Ti, V, Zr) and Si, and has a diameter of 0.05. It has 10 ³ to 10 ⁵ compounds / mm ^{2 of} ˜5 μm size. And the compound, specifically, (the x 1 or 2) in addition to _{Co 2-x Cr x Si,} Co 2-x Fe x Si of _Co 2 Si and the like.
The diameter and density of the compound are obtained by taking a photograph of a cross section in the rolling parallel direction with a scanning electron microscope and measuring the particle size and density of the compound on the photograph.
Regarding the addition amount of Co and Si, the ratio of Co (mass%) to Si (mass%), Co / Si is set to 2 to 4.5. The reason for this ratio is that during the aging heat treatment, it is easy to promote the precipitation of the Co ₂ Si compound that contributes most to strengthening and electrical conductivity recovery in the same system. In the present embodiment including elements other than Co and Si, the above compound is formed with Co, Si and other elements, and becomes a compound containing a slightly large amount of Si, so that Co / Si promotes Co ₂ Si precipitation. In order to maintain the solid solution state of the ratio, the ratio is such that the amount of Si is slightly increased as compared with a form not including other elements described later. An objective alloy material can be obtained by satisfying the above ratio. Co / Si in this embodiment is preferably 2.5-4, more preferably 3-3.5.

  The reason why the diameter of the compound is 0.05 to 5 μm is that the compound particles having this diameter improve the punching processability. Particles having a diameter of less than 0.05 μm cannot improve punching processability, and particles having a diameter of more than 5 μm contribute very little to both material strengthening and pressability improvement by the compound. Preferably it is 0.1-1 micrometer.

The reason why the density of the compound is defined as 10 ³ to 10 ⁵ pieces / mm ² is that the improvement of the punching workability and the material strength are compatible. If it is less than 10 ³ pieces / mm ^{2, the} number of cracks at the start of the punching process is small, and therefore the punching processability cannot be improved. If it exceeds 10 ⁵ pieces / mm ² , the compound of 0.05 to ⁵ μm, which has a relatively small contribution to the strength compared to the compound of less than 0.05 μm in diameter, occupies a large proportion of the whole, and the material cannot be strengthened, and the product The required characteristics cannot be obtained. Preferably it is 5 * 10 < ³ > -5 * 10 < ⁴ > piece / mm < ² >.

  The composition of the second embodiment of the copper alloy material of the present invention is that Co is contained in an amount of 1.4 mass% to 2.5 mass%, and the Co / Si content ratio Co / Si is 3.0 to 5.0. And the balance contains Cu and inevitable impurities.

  In the copper alloy material of this embodiment, the reason why the Co content is 1.4 mass% or more and 2.5 mass% or less is that the precipitation amount of the compound that improves the punching workability and the compound that improves the strength is both This is to make the amount suitable, and particularly to meet the demand for high-strength materials. By making the Co content within the above range and controlling the heat treatment conditions and the like in the manufacturing method of the alloy material, the crystallization and precipitation of the compound can be made into a high-strength material with good punchability. The amount can be made. The content of Co is preferably 1.4 mass% or more and 2.0 mass% or less.

  It is preferable that the Si content satisfies at least a range of 0.3 to 1.0 mass%. The reason for this is to make the amount of precipitation of the compound that improves the punching workability and the compound that improves the strength appropriate for both, as well as the amount of Co added, especially to meet the demand for high strength materials. is there. If the amount is too small, the total amount of precipitation for improving both punchability and strength may not be satisfied, and either one of the properties may be deteriorated. On the other hand, if the amount is too large, the amount of crystallization and precipitation of the compound that contributes effectively may be saturated. In the present embodiment, the mass ratio of Co and Si and Co / Si are set to 3.0 to 5.0.

In this embodiment, the copper alloy has Co and Si compounds. Specifically, this compound is Co ₂ Si. The diameter and density of the compound are the same as those in the embodiment containing the other additive elements, and the preferred ranges thereof are also the same.
Co / Si is set to 3.0 to 5.0. The reason for setting such an addition ratio is that during the aging heat treatment, it is easy to promote precipitation of the Co ₂ Si compound that contributes most to strengthening and restoring electrical conductivity in the same system. Co / Si in this embodiment is preferably 3.2 to 4.5, more preferably 3.5 to 4.2.

  The composition of the third embodiment of the copper alloy material of the present invention contains 0.5 mass% or more and less than 1.4 mass% of Co, and the Co / Si content ratio of Co / Si is 3.0 to 5.0. And the balance contains Cu and inevitable impurities.

  In the copper alloy material of this embodiment, the reason why the Co content is 0.5 mass% or more and less than 1.4 mass% is that the precipitation amount of the compound that improves the punching processability and the compound that improves the strength is both This is to make the amount appropriate, and particularly to meet the demand for highly conductive materials. By making the Co content within the above range and controlling the heat treatment conditions and the like in the manufacturing method of the alloy material, the crystallization and precipitation of the compound can be made into a highly conductive material with good punchability. The amount can be made.

  It is preferable that the Si content satisfies at least a range of 0.1 to 0.5 mass%. The reason for this is to make the amount of precipitation of the compound that improves the punching processability and the compound that improves the strength appropriate in both cases, and in particular, to meet the demand for a highly conductive material. If the amount is too small, the total amount of precipitation for improving both punchability and strength may not be satisfied, and either one of the properties may be deteriorated. Moreover, when there is too much, high conductivity may not be able to be maintained.

Also in this embodiment, the copper alloy has Co and Si compounds. The type, diameter, and density of this compound are the same as those in the above embodiment, and the preferred range is also the same.
Co / Si is set to 3.0 to 5.0 as in the above embodiment. The preferable range is also the same.

The copper alloy material of the present invention may have a composition containing at least one selected from the group consisting of Sn, Zn and Mg in addition to the above Co, Si and other additive elements. The total amount of these elements added is 0.01 to 1 mass%, preferably 0.05 to 0.7 mass%, more preferably 0.1 to 0.5 mass%. By adding these elements, effects of solid solution strengthening of the base material and an increase in work hardening amount during rolling can be obtained.
Also in this copper alloy material, the copper alloy has a compound made of Si and at least one element selected from Co and other additive elements (Cr, Fe, Ni, Al, Nb, Ti, V, Zr). The type, diameter, and density of this compound are the same as those in the above embodiment, and the preferred range is also the same.

The copper alloy material of the present invention is subjected to cold rolling and intermediate annealing after homogenizing an ingot produced at a casting rate of 1 to 30 ° C./second, preferably 3 to 25 ° C./second. After repeating, it can manufacture by performing finish rolling and strain relief annealing.
An example of a preferred embodiment of the method for producing a copper alloy material of the present invention is as follows. Co and Si, in some embodiments, other additive elements, and an alloy composed of Cu as the balance are melted and cast using a high-frequency melting furnace or the like. Is cast at a cooling rate of 1 to 30 ° C./second to obtain an ingot. Under these conditions, it is possible to control the tissue containing 10 ³ to 10 ⁵ / mm ² of the above compound having a diameter of 0.05 to 5 μm. Then, for example, after processing to a thickness of 8 to 15 mm by hot rolling, quenching is quickly performed by water cooling (rapid cooling), and the rolled surface is removed on one side to remove the oxide film on the surface. After 5-5 mm chamfering to 4-13 mm, it is processed by cold rolling to a thickness of about 0.1-0.3 mm. Further, a solution heat treatment (preferably at a temperature of 800 to 1025 ° C. for 1 to 100 seconds) is added, and after water cooling, the material is subjected to an aging heat treatment at 300 to 600 ° C. for 1 to 10 hours. The target copper alloy material can be obtained by adding 0-30% rolling after this heat treatment and further performing low-temperature heat treatment at 200-450 ° C. for 0.5-5 hours.

When it corresponds to the composition of the third embodiment, separately from the above manufacturing method, the casting ingot is subjected to a homogenization treatment, a hot rolling, and then a step of repeating cold rolling and intermediate annealing, and the following ( A production method in which a heat treatment having the conditions of A) or (B) is added, followed by aging heat treatment, finish rolling, and strain relief annealing is also preferable.
(A) When cooling after completion of hot rolling, the rate of temperature decrease to 600 ° C. is set to 1 ° C./second or more and 30 ° C./second or less, and when performing solution heat treatment, the temperature increase rate at 600 ° C. or more and up to 600 ° C. The cooling rate is set to 30 ° C./second or more.
(B) When cooling after the end of hot rolling, the rate of temperature decrease to 600 ° C. is set to 30 ° C./second or more, and the temperature increasing rate at 600 ° C. or higher and the temperature decreasing rate to 600 ° C. are set to 1 ° C. / Second to 30 ° C./second.
In cooling after the end of hot rolling, the rate of temperature decrease to 600 ° C. is set to 30 ° C./second, and when the solution heat treatment is performed, the temperature increase rate at 600 ° C. or higher and the temperature decrease rate to 600 ° C. are set to 30 ° C./second. The process to satisfy the conditions of both (A) and (B), but this is also treated as a heat treatment having the conditions of (A) or (B).
In addition to the step (A) or (B) described above, a production method in which a heat treatment having any one of the following conditions (C) to (E) is performed, followed by aging heat treatment, finish rolling, and strain relief annealing Is also preferable.
(C) A heat treatment step is newly provided between the hot rolling step and the cold rolling step, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled.
(D) After making the material 0.05 to 0.5 mm in the cold rolling process, before the solution heat treatment process, a new heat treatment process is provided and held at 600 to 750 ° C. for 50 to 600 seconds, Then cool quickly.
(E) A heat treatment step is newly provided between the solution heat treatment step and the aging heat treatment step, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled.
The “rapid cooling” in the above processes (C) to (E) is preferably performed at 50 ° C./second or more. In addition, the solution heat treatment in the treatments (A) and (B) is preferably carried out by holding for 1 to 100 seconds in a temperature range of 800 to 1025 ° C. The solution treatment is a treatment for precipitating and crystallizing (compound) into a solid solution state. When solution treatment is performed at the above temperature, recrystallization heat treatment (treatment for controlling the crystal grain size) can be performed in the same heat treatment step.
Here, in the above processing conditions (A) to (E), the cooling rate after cooling at the end of hot rolling in (A) and (B) to 600 ° C., 600 ° C. or higher during solution heat treatment When the processing in which the temperature rising rate at 600 ° C. and the temperature decreasing rate to 600 ° C. are changed to less than 1 (° C./second) or the processing in which the holding time of (C) to (E) is longer than 600 seconds is performed, etc. Even if the heat treatment conditions are satisfied in this step, the strength may be insufficient, and the target copper alloy material cannot be obtained.
On the other hand, in the processing conditions of (A) to (E) above, when the processing changed to less than 50 seconds for the holding time of (C) to (E), even if this heat treatment is performed once, If one of the other heat treatment conditions (A) to (E) is applied within the range of the above treatment conditions (A) to (E), the intended copper alloy material can be obtained.
That is, in each of the heat treatment steps, when a heat treatment having a cooling rate slower than the predetermined range of (A) to (E) or a longer holding time is performed, the other steps (A) to (E) are performed. Although the target copper alloy material cannot be recovered even if the conditions described in (2) are satisfied, the heat treatment is performed at a faster cooling rate or shorter holding time than the predetermined range. By applying under the conditions, the crystal grain size is in an appropriate range, and the target copper alloy material is obtained.

  Although the copper alloy material of this invention is not specifically limited, For example, it can use suitably for electronic electrical equipment components, such as a connector, a terminal, a relay, a switch, and also a lead frame.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

  The copper alloy materials shown in Table 1, Table 2, Table 3-1, and Table 3-2 were prepared as follows. Table 1 shows the evaluation results in a reference example for confirming the effect of the present invention. The compositions of samples showing good characteristics in this reference example are shown in Table 2, Table 3-1, Table 3-2. Various evaluations are performed. Table 2 shows the evaluation results regarding the first embodiment and the second embodiment, and Tables 3-1 and 3-2 show the evaluation results regarding the third embodiment.

(Production conditions for alloy materials)
An alloy consisting of Co, Si, other additive elements and the balance Cu in the amounts shown in each table is melted in a high-frequency melting furnace, and this is cast to form an ingot having a thickness of 30 mm, a width of 100 mm, and a length of 150 mm. Obtained. About the cooling rate at the time of casting, it was set as 5 degree-C / sec about each sample of Table 1, and about each sample of Table 2-Table 3-1, Table 3-2, Table 2, Table 3-1, Table 3-2 It was shown to. In each sample, the sample having a fast cooling rate was 5 mm in thickness, the sample having a slow cooling rate was 100 mm, and the cooling rate was changed by using a heat insulating material for the mold.

  Next, this ingot was hot-rolled immediately after being subjected to a homogenization treatment at 950 ° C. for 1 hour (the temperature decreasing rate up to 600 ° C. was 30 ° C./second), and both sides were each 1 mm chamfered to form an oxide film. Was removed. Next, the plate thickness was reduced to 0.1 to 0.3 mm by cold rolling, and then solution heat treatment (reaching 1000 ° C., both heating and cooling rates were 50 ° C./second) was performed in an inert gas atmosphere.

  After water cooling, the material was subjected to an aging heat treatment (select the temperature having the highest strength in 2 hours at 475 to 575 ° C). 0-30% rolling was added after this heat treatment, and further low-temperature heat treatment (strain relief annealing) was performed at 200-450 ° C. for 0.5-5 hours.

In the examples and comparative examples in the third embodiment shown in Tables 3-1 and 3-2, the following conditions were further imposed to produce alloy materials. (In Tables 3-1 and 3-2, the column indicated by “-” indicates that the corresponding heat treatment is not performed.)
Condition (1) The temperature increase rate at 600 ° C. or higher after the hot rolling and the temperature decrease rate to 600 ° C. are shown in the table.
Condition (2) After the hot rolling, a heat treatment was performed at the temperature and holding time shown in the table to rapidly cool (temperature decrease rate: 100 ° C./second).
Condition (3) After the cold rolling, a heat treatment was performed at the temperature and holding time shown in the table to rapidly cool (temperature decrease rate: 100 ° C./second).
Condition (4) The heating rate at 600 ° C. or higher and the cooling rate to 600 ° C. during the solution heat treatment were set as shown in the table.
Condition (5) The solution was heat-treated at the temperature and holding time shown in the table between the solution heat treatment and the aging heat treatment and rapidly cooled (temperature decrease rate: 100 ° C./second).

The following characteristic investigation was performed by using each plate material thus obtained as a test material. The measurement method for each evaluation item is as follows.
a. Tensile strength (TS, YS):
Three test pieces of JIS Z2201-13B cut out from the rolling parallel direction of the test pieces were measured according to JIS Z2241, and the average values are shown in Table 1. Moreover, with respect to the characteristics shown in Table 1 as evaluation, the strengths of the alloys having the same composition in Table 2, Table 3-1, and Table 3-2 (both tensile strength (TS) and 0.2% proof stress (YS)) When the decrease was less than 30 MPa, the strength required for the product was satisfied, and when it was 30 MPa or more, it was evaluated as ×, and the results were shown in Table 2, Table 3-1, and Table 3-2. In Table 1, for the compositions having a tensile strength (TS) of 550 MPa or more and a 0.2% proof stress (YS) of 400 MPa or more, alloy materials under the conditions described in Table 2, Table 3-1, and Table 3-2. Were manufactured and evaluated.
b. Conductivity (EC) measurement:
Using a four-terminal method, conductivity (EC) was measured for two of each test piece in a thermostat controlled at 20 ° C. (± 1 ° C.), and the average value (% IACS) is shown in Table 1. Indicated. At this time, the distance between terminals was set to 100 mm. Note that, as an evaluation standard, one having an electrical conductivity (EC) of 57% IACS or more is considered to have excellent conductivity.
c. Press punching process After polishing the mold, each sample was subjected to continuous pressing, and the burr on the fracture surface of the sample press was measured every 100,000 times. A stage where a burr exceeding 5 μm is generated on the press fracture surface of the material is considered to be particularly excellent in punching performance that satisfies the number of shots of 2 million shots, ◎, those of 1 million times to less than 2 million times The results are shown in Table 2, Table 3-1, and Table 3-2 as ○ when the punching property is good, and as × when the punching property is inferior when the punching property is less than 1 million times.

The ratio of crystallization and precipitates (compounds) was determined by measuring 10 crystallization and precipitates having a diameter of 0.05 to 5 μm with the EDX attached to the SEM, determining the constituent elements, and calculating the average value by quantitative measurement. (If there are multiple types of compounds, all are listed).
The number per 1 mm ² of the compound having a diameter of 0.05 to 5 μm is the result of counting the size corresponding compound existing in the area of 400 μm ² by changing the measurement place 10 times and multiplying the average value by 2500 times. .

Reference Example Copper alloy material having the composition shown in Table 1 (Composition of the first embodiment: Test No. 101 to 108, Composition of the second embodiment: Test No. 109 to 113, Composition of the third embodiment: Test Nos. 114 to 115 and comparative compositions: Test Nos. 151 to 168) were produced as described above, and tensile strength (TS, YS) and conductivity (EC) were measured. The results are also shown in Table 1. The copper alloy material of the comparative composition has a test number of either or both of strength and conductivity. It has fallen with respect to 101-115. Details are as follows.
Comparative composition test no. In 151 to 162, the addition ratio of Co and Si is not within the range defined by the present invention. Test No. Either 101 or 115 is inferior in strength, conductivity, or both. In addition, Test No. Since Nos. 163 to 168 have too much addition amount of other additive elements, Test No. Either 101 or 115 is inferior in strength, conductivity, or both.
In contrast, test no. 101 to 115 were all good in strength and conductivity.
Regarding the influence of crystallized substances and precipitates (compounds), if a compound of Co or Si is made for the additive element, the total amount of Co ₂ Si compound that contributes to the strength is reduced. Further, since the composition ratio of the additive element and Co—Si is different from that of Co ₂ Si, the characteristic value deteriorates unless the total amount of the Co ₂ Si compound contributing to the strength is secured by adjusting the addition amount of Co or Si. There is a tendency to end up.

Example 1
With the compositions shown in Table 2, the pressability and strength of the alloy material samples obtained as described above were evaluated. The results are shown in Table 2. Table 2 shows the evaluation results regarding the first embodiment and the second embodiment. When the casting speed is in the range of 1 to 30 ° C./second, the diameter and density of the Co—Si based compound are controlled, and the press Alloy materials with a balance of punching workability and strength have been obtained. When the casting speed is too slow, the desired size of the Co—Si-based compound is too much and the strength is reduced. In addition, when the casting speed is too high, there are too few Co-Si compounds of a desired size, and the press punching processability is lowered. In the case where the selective element (Cr, Fe, Ni, Al, Nb, Ti, V, Zr) is not included and the compound is not properly generated, the press punching processability is lowered.

Example 2 and Comparative Example For the alloys having the compositions shown in Tables 3-1 and 3-2, the pressability and strength of the alloy material samples obtained as described above were evaluated.
The alloy material of the comparative example shown in Table 3-2 has an evaluation of x for both strength and punchability, whereas the alloy material of the present invention example shown in Table 3-1 has both strength and punchability. Are compatible.
About the comparative example shown to Table 3-2, since none of the requirements of (A)-(E) in the manufacturing method of the alloy material of this invention is satisfy | filled, the target alloy material is not obtained.
For samples with a slow cooling rate, a long heat treatment time, or a higher heat treatment temperature, the compound contributing to the strength becomes coarser, and the pressability is good but the strength is poor. If the heating is further excessive, the number of compounds having a size larger than the range effective for pressability will increase, resulting in poor strength and pressability characteristics.
Conversely, for samples with a fast cooling rate, a short heat treatment time, or a heat treatment temperature deviating to a lower temperature, there is little heating, the compound does not grow to the specified compound density and size, and it contributes to the strength, but the press The number of compounds that do not contribute to the properties increases, and the strength is good, but the press properties are poor.

Claims (7)

Co containing 0.5 to 2.5 mass%, Co / Si content ratio Co / Si is between 2.5 and 4.5, and Cr, Fe, Ni, Al, Nb, Ti, A copper alloy material containing 0.01 to 0.2 mass% of at least one additive element selected from the group consisting of V and Zr, the balance being Cu and inevitable impurities, having a diameter of 0.05 to 5 μm, A copper alloy material having a compound of Si and at least one element selected from the group consisting of the additive element and Co, having a density of 10 ³ to 10 ⁵ pieces / mm ² .   A copper alloy material containing Co in an amount of 1.4 mass% to 2.5 mass%, the Co / Si content ratio Co / Si being between 3.0 and 5.0, the balance being Cu and inevitable impurities A copper alloy material having a compound composed of Co and Si having a diameter of 0.05 to 5 μm and a density of 103 to 105 pieces / mm 2.   Copper alloy material containing Co of 0.5 mass% or more and less than 1.4 mass%, Co / Si content ratio Co / Si between 3.0 and 5.0, the balance being Cu and inevitable impurities A copper alloy material having a compound composed of Co and Si having a diameter of 0.05 to 5 μm and a density of 103 to 105 pieces / mm 2.   A copper alloy material containing 0.01 to 1 mass% of at least one selected from the group consisting of Sn, Zn and Mg in the copper alloy composition of the copper alloy material according to any one of claims 1 to 3. A copper alloy material having a compound of Si and at least one element selected from the group consisting of the additive element and Co, having a diameter of 0.05 to 5 μm and a density of 103 to 105 pieces / mm 2.   A method for producing the copper alloy material according to any one of claims 1 to 4, wherein the ingot produced under conditions of a cooling rate during casting of 1 to 30 ° C / second is homogenized, A method for producing a copper alloy material, characterized by performing finish rolling and strain relief annealing after repeating cold rolling and intermediate annealing.   The ingot produced under the condition that the cooling rate during casting is 1 to 30 ° C./second is homogenized, and after hot rolling, a process of repeating cold rolling and intermediate annealing is performed, and the condition is (A) When cooling after the end of hot rolling, the rate of temperature decrease to 600 ° C. is set to 1 ° C./second or more and 30 ° C./second or less, and when performing solution heat treatment, the temperature increase rate at 600 ° C. or more and the temperature decrease rate to 600 ° C. are set. 30 ° C./second or higher, or (B) When cooling after completion of hot rolling, the rate of temperature decrease to 600 ° C. is set to 30 ° C./second or higher. And a temperature decreasing rate up to 600 ° C. is set to 1 ° C./second or more and 30 ° C./second or less, and further subjected to aging heat treatment, finish rolling, and strain relief annealing. Method for producing a copper alloy material.   The ingot produced under conditions where the cooling rate during casting is from 1 to 30 ° C./second is homogenized, and after hot rolling, a process of repeating cold rolling and intermediate annealing is performed, and (C) A heat treatment step is newly provided between the hot rolling step and the cold rolling step, and held at 600 to 750 ° C. for 50 to 600 seconds and then rapidly cooled, or (D) the material in the cold rolling step After the thickness of 0.05 to 0.5 mm, before the solution heat treatment step, a heat treatment step is newly provided, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled or (E ) A heat treatment step is newly provided between the solution heat treatment step and the aging heat treatment step, held at 600 to 750 ° C. for 50 to 600 seconds, and then rapidly cooled, and then subjected to any heat treatment. Features aging heat treatment, finish rolling and strain relief annealing To method of the copper alloy material according to claim 5 or 6.