JP2011040503A - Method of manufacturing semiconductor device, and printing tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To identify mounting positions on a conveyance tray after an assembling process when the assembling process is implemented for package substrates as individual pieces. <P>SOLUTION: The method of manufacturing the semiconductor device includes: a process of mounting a plurality of mutually independent package substrates at a plurality of different positions on a support and assembling semiconductor devices on the respective package substrates; and a process of printing positional information specifying the positions on the support on the plurality of respective package substrates. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a semiconductor device and a printing jig.

  In general, a semiconductor package is inspected after assembling to select non-defective products and defective products.

  Conventionally, as represented by PBGA production, the mainstream is a manufacturing method in which chips are arranged in a matrix on a large-sized substrate and cut into individual pieces after batch sealing. However, in recent years, large semiconductor packages represented by FCBGA need to be separated into pieces by a substrate manufacturer in advance, and a plurality of semiconductor devices are assembled at the same time in the same process. In such a manufacturing method, a defect caused by the assembly process may occur depending on a position where each semiconductor package is arranged in the assembly process. In such a case, in order to analyze the cause of the defect or the like, it is required to specify the position where the semiconductor package determined to be a defective product is arranged in the assembly process.

  Patent Document 1 (Japanese Patent Application Laid-Open No. 2006-303517) discloses a process of mounting a plurality of semiconductor chips on a wiring board, and dividing the plurality of semiconductor chips mounted on the wiring board into a plurality of blocks and using a resin. A method of manufacturing a semiconductor device is disclosed that includes a step of obtaining a plurality of resin-sealed semiconductor devices by dividing each of the blocks into a plurality of pieces after sealing. In this semiconductor device manufacturing method, prior to the step of dividing each block into a plurality of pieces, each of a plurality of resin-encapsulated semiconductor devices is formed on a part of a mounting surface of a wiring board or a part of a resin-encapsulated body The address information is assigned. FIG. 1 is a plan view of a matrix substrate described in Patent Document 1. FIG.

JP 2006-303517 A

  According to the method of manufacturing a semiconductor device described in Patent Document 1, address information is given to a part of the wiring board before the wiring board is divided into pieces. The package substrate is divided into a plurality of pieces after an assembly process (a process of mounting a semiconductor chip and a sealing process using a resin). Even after the division, it is possible to know in which part of the wiring board the semiconductor device is located by the address information. That is, it is possible to know the position where the semiconductor device has been arranged in the assembly process.

  On the other hand, as described above, when the division into individual pieces is not performed after the assembly process, but is divided before the assembly process, and the assembly process is performed on the divided package substrate, the support is provided. A plurality of individual package substrates are mounted on the body (conveying tray). The plurality of package substrates are transferred to a processing apparatus used in an assembly process by a transfer tray. Then, the semiconductor device is assembled on each package substrate to obtain a semiconductor package. In this case, the position of each package substrate in the assembly process depends on the position on the transport tray. Therefore, in the failure analysis, it is desirable to be able to identify where each package substrate is placed on the transport tray even after the assembly process. However, the manufacturing method of the semiconductor device described in Patent Document 1 is premised on the separation being performed after the assembly process. Therefore, when an assembly process is performed on an individual package substrate, the position where the individual package substrate was placed on the transport tray is identified after the assembly process. There was a problem that it was not possible.

  A method of manufacturing a semiconductor device according to the present invention includes a step of mounting a plurality of independent package substrates at a plurality of different positions on a support, and assembling the semiconductor device on each of the package substrates, and the plurality of package substrates Each of which includes a step of printing position information for specifying a position on the support.

  A printing jig according to the present invention includes a plurality of mark forming surfaces provided corresponding to a plurality of positions on a support, and a connecting portion that connects the plurality of mark forming surfaces. Each of the plurality of mark forming surfaces is formed with a mark for transferring position information to a package substrate mounted at a plurality of corresponding positions. The position information is information for specifying a position on the support.

  According to the present invention, even when an assembling process is performed on an individual package substrate, the position of each package substrate in the assembling process can be identified, and a printing method can be identified. Tools are provided.

It is a top view of a matrix substrate. 3 is a flowchart showing a method for manufacturing a semiconductor device. It is the schematic which shows a conveyance tray. It is a perspective view which shows a printing jig | tool roughly. It is a perspective view when a printing jig is viewed from above. It is sectional drawing which shows each package board | substrate at the time of printing. It is a top view which shows an example of an electrode ball formation surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 is a flowchart showing the method for manufacturing the semiconductor device according to this embodiment.

Step S1: Mounting of package substrates First, a plurality of package substrates are prepared. Then, the plurality of package substrates are mounted on a transport tray (support). Here, each of the plurality of package substrates is an individual piece. That is, the plurality of package substrates are independent of each other. As will be described later, each package substrate has a main surface on which a semiconductor chip or the like is mounted and an electrode ball forming surface on which a large number of electrode balls are formed. In this step, each package substrate is mounted on the transport tray 1 with the main surface side facing upward.

  FIG. 3 is a schematic view showing the transport tray 1. As shown in FIG. 3, the transport tray 1 is provided with a plurality of mounting areas 2 (A1 to A8, B1 to B8, C1 to C8). Each of the plurality of package substrates is mounted on each of the plurality of mounting areas 2.

Step S2: Assembly Next, the plurality of package substrates 8 are transported to the processing apparatus by the transport tray 1. Then, the semiconductor device is assembled on the main surface of each package substrate 8. Specifically, mounting of a semiconductor chip, sealing with a sealing body, and the like are performed.

Step S3: Printing and Ball Electrode Formation Subsequently, the front and back of each package substrate are reversed. That is, each package substrate is placed on the transport tray 1 with the ball electrode formation surface side facing up. At this time, the mounting area 2 on which each package substrate is placed is not changed. That is, each package substrate is turned upside down at the same position on the transport tray 1. Thereafter, position information is printed on the ball electrode formation surface. A ball electrode is formed on the ball electrode formation surface.

  The position information is information for specifying the mounting position on the transport tray 1. The position information is printed by the printing jig 3.

  FIG. 4 is a perspective view schematically showing the printing jig 3. As shown in FIG. 4, the printing jig 3 includes a connecting portion 4 and a plurality of pins 5. The connection part 4 is flat form. The plurality of pins 5 are attached to the lower surface of the connecting portion 4 and extend so as to protrude from the lower surface of the connecting portion 4. The plurality of pins 5 are arranged so as to correspond to the plurality of mounting areas 2 in the transport tray 1. A mark forming surface 6 is provided at the tip of each of the plurality of pins 5.

  FIG. 5 is a perspective view when the printing jig 3 is viewed from above. As shown in FIG. 5, a mark 7 for printing position information indicating the corresponding mounting area 2 is drawn on the mark forming surface 6. The mark 7 is formed by unevenness, for example.

  FIG. 6 is a cross-sectional view of each package substrate 8 during printing. Each package substrate 8 has an electrode ball forming surface 10 on which a large number of electrode balls 9 are formed. The mark forming surface 6 of the printing jig 3 is heated and then pressed against the electrode ball forming surface 10 of each package substrate 8. Thereby, the position information indicating the corresponding mounting area 2 is printed on the electrode ball forming surface 10. The electrode ball forming surface 10 is not covered with a sealing body or the like. Accordingly, the printed position information is not erased in a subsequent process.

  FIG. 7 is a plan view showing an example of the electrode ball forming surface 10. As shown in FIG. 7, the position information 11 “A1” is printed at the corner of the electrode ball forming surface 10 after printing. That is, it is shown that the package substrate 8 is mounted on the mounting area 2 corresponding to “A1”.

  A plurality of semiconductor devices are obtained through the steps up to step S4 described above.

Step S4; Pass / Fail Judgment Thereafter, a plurality of semiconductor devices are taken out from the transport tray 1. Next, each of the plurality of semiconductor devices is inspected to determine whether it is a non-defective product or a defective product.

Step S5: Reading of position information Thereafter, the position information printed on each semiconductor device is read. Thereby, it is specified in which position on the transport tray 1 each semiconductor device is mounted.

Step S6: Failure Analysis Thereafter, failure analysis is performed based on the inspection result in step S4 and the position information read in step S5. For example, a correlation between the position of the mounting area 2 on the transport tray 1 and the occurrence frequency of defects is required.

  As described above, according to the present embodiment, position information is printed on each package substrate 8 in step S3. In subsequent step S5, the position information printed on each package substrate 8 is read. Therefore, even when the assembly process is performed on the individual package substrate 8, it is possible to know where each package substrate 8 is arranged in the assembly process after the assembly process.

  In the present embodiment, after the assembly is performed on the main surface of each package substrate 8 (after step S2), the position information is printed (step S3). However, printing may be performed at any stage as long as each package substrate is mounted on the transport tray 1 and is taken out from the transport tray 1. The printing process may be performed in a process separate from the electrode ball forming process. However, when printing is performed, each package substrate 1 needs to be mounted with the ball electrode formation surface 10 facing upward. Therefore, if the formation of the ball electrode and the printing of the position information are performed in the same process, it is not necessary to reverse the front and back of each package substrate 8 many times. That is, it is preferable because the manufacturing process is not complicated.

  In the present embodiment, an example in which position information is printed by the printing jig 3 has been described. However, the position information is not necessarily printed by the printing jig 3. For example, a stamping machine may be prepared and position information may be printed on each package substrate 8 by the stamping machine. As the stamping machine, an apparatus for marking with ink may be used, or an apparatus for marking with laser may be used. When the printing jig 3 is used, the printing jig 3 must be prepared for each type of the transport tray 1. On the other hand, when a stamping machine is used, any type of transport tray 1 can be handled by creating data. Therefore, when a stamping machine is used, it is preferable from the viewpoint of versatility and cost.

DESCRIPTION OF SYMBOLS 1 Transport tray 2 Mounting area 3 Printing jig 4 Connection part 5 Pin 6 Mark formation surface 7 Mark 8 Package board 9 Electrode ball 10 Electrode ball formation surface 11 Position information

Claims (6)

Mounting a plurality of package substrates independent of each other at a plurality of positions on the support, and assembling a semiconductor device on each package substrate;
A step of printing position information for specifying a position on the support on each of the plurality of package substrates;
A method for manufacturing a semiconductor device comprising: A method of manufacturing a semiconductor device according to claim 1,
Furthermore,
The assembling step includes
A step of determining pass / fail of the semiconductor device;
Reading the position information printed on the semiconductor device, and specifying the position on the support;
A method for manufacturing a semiconductor device, comprising: performing a failure analysis based on the pass / fail judgment result and the position information. A method of manufacturing a semiconductor device according to claim 1 or 2,
Each package substrate has an electrode ball forming surface on which electrode balls are formed,
The said printing process is a manufacturing method of the semiconductor device provided with the process of printing the said positional information on the said electrode ball formation surface. A method for manufacturing a semiconductor device according to any one of claims 1 to 3,
The step of printing includes a step of printing the position information using a printing jig,
A method for manufacturing a semiconductor device, wherein the printing jig is provided with marks for transferring the position information at positions corresponding to a plurality of positions on the support. A method for manufacturing a semiconductor device according to any one of claims 1 to 3,
The said printing process is a manufacturing method of the semiconductor device provided with the process of printing the said positional information using a laser. A plurality of mark forming surfaces provided corresponding to each of a plurality of positions on the support;
A connecting portion for connecting the plurality of mark forming surfaces;
Comprising
Each of the plurality of mark forming surfaces is formed with a mark for transferring position information to a package substrate mounted at a plurality of corresponding positions,
The printing tool, wherein the position information is information for specifying a position on the support.

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