JP2010236007A - Spherical silver particles, method for producing silver particles, and production apparatus - Google Patents
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Abstract
【課題】分散性に優れた適度な粒子径を有し、かつ加熱処理時の収縮率が低い球状銀粒子及び該球状銀粒子の製造方法並びに製造装置を提供する。
【解決手段】球状の結晶子集合体である中心部11と、中心部11の外周に棒状の結晶子が放射状に形成された外周部12とを有する。球状銀粒子10の平均粒子径は0.08μm〜1.0μmであり、断面組織観察における中心部11の直径は球状銀粒子10の直径の0.75〜0.99倍であることが好ましい。
【選択図】図1Disclosed are a spherical silver particle having an appropriate particle diameter excellent in dispersibility and having a low shrinkage rate during heat treatment, a method for producing the spherical silver particle, and a production apparatus.
A central part 11 is a spherical crystallite aggregate, and an outer peripheral part 12 in which rod-like crystallites are radially formed on the outer periphery of the central part 11. The average particle diameter of the spherical silver particles 10 is 0.08 μm to 1.0 μm, and the diameter of the central portion 11 in the cross-sectional structure observation is preferably 0.75 to 0.99 times the diameter of the spherical silver particles 10.
[Selection] Figure 1
Description
本発明は、分散性に優れた適度な粒子径を有し、かつ加熱に対する良好な収縮耐性を有する銀粒子及び該銀粒子の製造方法に関する。更に詳しくは、電子デバイスの配線材料や電極材料となるペースト成分として好適な粒子径と分散性を有し、かつ加熱処理時の収縮率が低い球状銀粒子及び該銀粒子の製造方法並びに製造装置に関するものである。 The present invention relates to silver particles having an appropriate particle diameter excellent in dispersibility and having good shrinkage resistance against heating, and a method for producing the silver particles. More specifically, spherical silver particles having a particle size and dispersibility suitable as a paste component to be used as a wiring material or an electrode material of an electronic device and having a low shrinkage rate during heat treatment, a method for producing the silver particles, and a production apparatus It is about.
近年、電子機器の高機能化を図るために、電子デバイスの小型化と高密度化が要請されており、配線及び電極のファイン化を達成するために、これらを形成するペースト材料に用いられる銀粒子についても、より微細で高分散性の微粒子が求められている。一方で、微粒子は加熱処理すると、粉末の収縮率が大きく、配線が細くなって高抵抗になったり、断線したりする問題がある。その理由は、次の通りである。通常、銀粒子を含む導電ペーストにより形成した微細な配線は、製造工程における乾燥又は加熱処理によりペースト中の導電阻害物である溶剤や樹脂が揮発又は燃焼消失するとともに、微粒子同士の表面の銀が拡散接合することで導電性が向上する。しかし、収縮率が大きい微粒子を用いると、乾燥又は加熱処理によって微粒子が収縮する際に、隣接する微粒子同士が接合して引き寄せられる。これにより、形成後の配線において局所的に微粒子同士が集まった箇所が生じる。その一方で、引き寄せられた微粒子が存在していた箇所では配線が細くなり、くびれが生じる。このような配線に通電すると、くびれの部分に電流が集中してしまうため高抵抗になったり、また、収縮が激しい場合には断線して完全に導通を失ったりしてしまう。 In recent years, there has been a demand for miniaturization and high density of electronic devices in order to improve the functionality of electronic devices. In order to achieve finer wiring and electrodes, silver used as a paste material for forming them As for the particles, finer and highly dispersible fine particles are required. On the other hand, when the fine particles are heat-treated, there is a problem that the shrinkage rate of the powder is large, the wiring becomes thin and becomes high resistance, or is disconnected. The reason is as follows. Usually, the fine wiring formed by the conductive paste containing silver particles is volatilized or burned away by the solvent or resin that is a conductive inhibitor in the paste by drying or heat treatment in the manufacturing process, and the silver on the surface of the fine particles is Conductivity is improved by diffusion bonding. However, when fine particles having a large shrinkage rate are used, adjacent fine particles are joined and attracted when the fine particles shrink by drying or heat treatment. Thereby, the location where microparticles | fine-particles gathered locally in the wiring after formation arises. On the other hand, in the portion where the attracted fine particles existed, the wiring becomes thin and constriction occurs. When such a wiring is energized, the current concentrates in the constricted portion, resulting in a high resistance, and in the case of severe contraction, the wire is disconnected and completely loses conduction.
従来、電子機器材料に用いられる銀粒子の製造方法として、銀塩のアンミン錯体を還元して銀粒子を沈澱させ、これを洗浄乾燥して平均粒径が数μm程度の銀粒子を得る方法が知られている(例えば、特許文献1参照。)。また、還元剤にヒドロキノンに加え、更に亜硫酸アンモニウム等を加えることによって、平均粒径1μm以下の銀粒子を得る方法が知られている(例えば、特許文献2参照。)。また、還元剤としてヒドロキノンを用い、ここにNaOH等のアルカリを加えて、酸化還元電位を制御し、なおかつ銀溶液と還元剤溶液を空中に吐出して衝突混合させることで、平均粒径1μm以下で5μm以上の粗大粒子を含まない銀粒子の製造方法が知られている(例えば、特許文献3参照)。 Conventionally, as a method for producing silver particles used in electronic equipment materials, there is a method of obtaining silver particles having an average particle diameter of about several μm by reducing silver salt ammine complex to precipitate silver particles, washing and drying the silver particles. It is known (for example, refer to Patent Document 1). Further, a method is known in which silver particles having an average particle size of 1 μm or less are obtained by adding ammonium sulfite and the like to hydroquinone as a reducing agent (see, for example, Patent Document 2). In addition, hydroquinone is used as a reducing agent, and an alkali such as NaOH is added thereto to control the oxidation-reduction potential. Further, the silver solution and the reducing agent solution are discharged into the air and collided to mix, thereby obtaining an average particle size of 1 μm or less. There is known a method for producing silver particles which do not contain coarse particles of 5 μm or more (see, for example, Patent Document 3).
しかしながら、上記特許文献1に示された製造方法では、平均粒径1μm以下の微粒子を安定して得るのが困難であり、また、粒度分布が広く、しかも粒子が凝集し易いため、粒径が均一で1μm以下の微細な銀粒子を製造するのが難しいという問題がある。また、上記特許文献2に示された方法で製造された銀粒子をペースト原料として用いた場合、分散性に乏しい等の問題がある。更に、上記特許文献3に示された方法で製造された銀粒子をペースト原料として用いた場合、銀粒子の焼成時における収縮率が高く、高抵抗化や断線等の不具合を招きやすい。 However, in the production method disclosed in Patent Document 1, it is difficult to stably obtain fine particles having an average particle size of 1 μm or less, and since the particle size distribution is wide and the particles are likely to aggregate, the particle size is small. There is a problem that it is difficult to produce uniform fine silver particles of 1 μm or less. Moreover, when the silver particle manufactured by the method shown by the said patent document 2 is used as a paste raw material, there exist problems, such as a poor dispersibility. Furthermore, when the silver particles produced by the method disclosed in Patent Document 3 are used as a paste raw material, the shrinkage rate during firing of the silver particles is high, and problems such as high resistance and disconnection are likely to occur.
本発明の目的は、分散性に優れた適度な粒子径を有し、かつ加熱処理時の収縮率が低い球状銀粒子を提供することにある。 An object of the present invention is to provide spherical silver particles having an appropriate particle diameter excellent in dispersibility and having a low shrinkage rate during heat treatment.
本発明の別の目的は、分散性に優れた適度な粒子径を有し、かつ加熱処理時の収縮率が低い球状銀粒子が安定して得ることができる球状銀粒子の製造方法及び製造装置を提供することにある。 Another object of the present invention is a method and apparatus for producing spherical silver particles, which can stably obtain spherical silver particles having an appropriate particle size with excellent dispersibility and a low shrinkage ratio during heat treatment. Is to provide.
本発明の第1の観点は、球状の結晶子集合体である中心部と、中心部の外周に棒状の結晶子が放射状に形成された外周部とを有する球状銀粒子である。 A first aspect of the present invention is a spherical silver particle having a central portion that is a spherical crystallite aggregate and an outer peripheral portion in which rod-like crystallites are radially formed on the outer periphery of the central portion.
本発明の第2の観点は、第1の観点に基づく発明であって、更に球状銀粒子の平均粒子径が0.08μm〜1.0μmであり、断面組織観察における中心部の直径が球状銀粒子の直径の0.75〜0.99倍であることを特徴とする。 A second aspect of the present invention is an invention based on the first aspect, wherein the average particle diameter of the spherical silver particles is 0.08 μm to 1.0 μm, and the diameter of the central part in the cross-sectional structure observation is the spherical silver It is characterized by being 0.75 to 0.99 times the diameter of the particles.
本発明の第3の観点は、第1又は第2の観点に基づく発明であって、更に550℃の温度で10分間加熱した時の収縮率が2〜5%であることを特徴とする。 A third aspect of the present invention is an invention based on the first or second aspect, and is characterized in that the shrinkage rate when heated at a temperature of 550 ° C. for 10 minutes is 2 to 5%.
本発明の第4の観点は、第1ないし第3の観点の球状銀粒子を製造する方法であって、銀を含む第1溶液とヒドロキノンを含有する第2溶液を、第1溶液中の銀1molに対する第2溶液中のヒドロキノンが0.25〜0.45molの範囲内となるように、第1溶液と第2溶液をそれぞれ別々に噴射して空中で衝突混合させる工程と、第1溶液及び第2溶液の混合液を、10℃以下に冷却した液体中に落下させる工程とを含むことを特徴とする。 A fourth aspect of the present invention is a method for producing spherical silver particles according to the first to third aspects, wherein the first solution containing silver and the second solution containing hydroquinone are converted into silver in the first solution. Injecting and colliding the first solution and the second solution separately in the air so that the hydroquinone in the second solution with respect to 1 mol falls within the range of 0.25 to 0.45 mol, and the first solution and And a step of dropping the liquid mixture of the second solution into a liquid cooled to 10 ° C. or lower.
本発明の第5の観点は、第1溶液と第2溶液をそれぞれ別々に噴射し、空中で衝突混合させて混合液にする第1ノズル及び第2ノズルと、空中で落下する混合液を受ける受槽とを備える球状銀粒子の製造装置において、受槽は受槽内の合成液を10℃以下に保つ冷却機構と、受槽内の合成液を受槽の底部から抜き取る吐出口とを備えることを特徴とする。 According to a fifth aspect of the present invention, the first and second solutions are separately jetted and collided and mixed in the air to form a mixed solution, and the mixed solution falling in the air is received. In a spherical silver particle manufacturing apparatus including a receiving tank, the receiving tank includes a cooling mechanism that keeps the synthetic liquid in the receiving tank at 10 ° C. or less, and a discharge port that extracts the synthetic liquid in the receiving tank from the bottom of the receiving tank. And
本発明の第1の観点の球状銀粒子では、球状の結晶子集合体である中心部と、中心部の外周に棒状の結晶子が放射状に形成された外周部とを有する構造をとることにより、外周部に結晶性の高い組織が配置されるため、加熱による収縮率を低下させることができる。 The spherical silver particles of the first aspect of the present invention have a structure having a central portion that is a spherical crystallite aggregate and an outer peripheral portion in which rod-like crystallites are radially formed on the outer periphery of the central portion. Since a highly crystalline structure is disposed on the outer peripheral portion, the shrinkage rate due to heating can be reduced.
本発明の第3の観点の球状銀粒子では、550℃で10分加熱した際の収縮率が2〜5%と低いため、これを用いて製造した導電ペーストにより微細な配線や電極等を形成すれば、配線や電極等の製造工程における加熱処理時の断線や高抵抗化を抑制できる。 In the spherical silver particles of the third aspect of the present invention, the shrinkage rate when heated at 550 ° C. for 10 minutes is as low as 2 to 5%, so that fine wirings, electrodes, etc. are formed from the conductive paste produced using this. If it does so, the disconnection and high resistance at the time of the heat processing in manufacturing processes, such as wiring and an electrode, can be suppressed.
本発明の第4の観点の製造方法では、銀アンミン錯体水溶液と還元剤溶液を空中に吐出し混合する際に、銀1モルに対して還元剤はヒドロキノン0.25〜0.45モルのみとし、補助還元剤等は用いないため、還元剤の使用量を抑制し、製造コストを低減させることができる。 In the production method of the fourth aspect of the present invention, when the silver ammine complex aqueous solution and the reducing agent solution are discharged and mixed in the air, the reducing agent is only hydroquinone 0.25 to 0.45 mol per 1 mol of silver. Since no auxiliary reducing agent or the like is used, the amount of reducing agent used can be suppressed and the manufacturing cost can be reduced.
本発明の第5の観点の製造方法では、第1溶液と第2溶液をそれぞれ別々に噴射し、空中で衝突混合させて混合液にする第1ノズル及び第2ノズルと、空中で落下する混合液を受ける受槽とを備える球状銀粒子の製造装置において、受槽は受槽内の合成液を10℃以下に保つ冷却機構と、受槽内の合成液を受槽の底部から抜き取る吐出口とを備えることにより、本発明の第1ないし第3の観点の球状銀粒子を効率よく製造することができる。 In the manufacturing method of the 5th viewpoint of this invention, the 1st solution and the 2nd solution which are jetted separately, respectively, the 1st nozzle and the 2nd nozzle which are made to collide and mix in the air to make a liquid mixture, and the mixing which falls in the air In a spherical silver particle manufacturing apparatus including a receiving tank for receiving a liquid, the receiving tank includes a cooling mechanism for keeping the synthetic liquid in the receiving tank at 10 ° C. or less, and a discharge port for extracting the synthetic liquid in the receiving tank from the bottom of the receiving tank. As a result, the spherical silver particles of the first to third aspects of the present invention can be efficiently produced.
次に本発明を実施するための形態を図面に基づいて説明する。図1及び図2に示すように、本発明の球状銀粒子10は、球状の結晶子集合体である中心部11と、中心部11の外周に棒状の結晶子が放射状に形成された外周部12とを有する構造からなる。通常の球状銀粒子は、図示しないが、その断面を透過電子顕微鏡(以下、TEMという)により観察すると、全領域で球状の結晶子の集合体のような構造になっているのが一般的である。一方、本発明の球状銀粒子10は、球状の結晶子集合体からなる中心部11と、中心部を構成する結晶子よりも大きい棒状の結晶子が、この中心部11の外周に放射状に配置された構造になっている。球状の結晶子集合体からなる中心部11を覆うように、この棒状の結晶子が放射状に配置された構造になることで、本発明の球状銀粒子10は、その外周に結晶性の高い組織が配置される。これにより、従来のものに比べて加熱による収縮率を低下させることができる。 Next, an embodiment for carrying out the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the spherical silver particles 10 of the present invention include a central portion 11 that is a spherical crystallite aggregate, and an outer peripheral portion in which rod-like crystallites are radially formed on the outer periphery of the central portion 11. 12. Although ordinary spherical silver particles are not shown in the figure, when the cross section thereof is observed with a transmission electron microscope (hereinafter referred to as TEM), it is common to have a structure like an aggregate of spherical crystallites in the entire region. is there. On the other hand, in the spherical silver particle 10 of the present invention, a central part 11 made of a spherical crystallite aggregate and a rod-like crystallite larger than the crystallite constituting the central part are radially arranged on the outer periphery of the central part 11. It has a structured. The spherical silver particles 10 of the present invention have a structure with high crystallinity on the outer periphery by having a structure in which the rod-like crystallites are radially arranged so as to cover the central portion 11 formed of the spherical crystallite aggregate. Is placed. Thereby, the shrinkage rate by heating can be reduced compared with the conventional one.
一般的な球状銀粒子の収縮率は、例えば550℃で10分加熱した場合、6〜15%である。一方、本発明の球状銀粒子の場合、同条件で加熱した際の収縮率は2〜5%程度である。そのため、本発明の球状銀粒子を用いて製造した導電ペーストにより微細な配線や電極等を形成すれば、配線や電極等の製造工程における加熱処理時の断線や高抵抗化を抑制できる。 The shrinkage rate of general spherical silver particles is, for example, 6 to 15% when heated at 550 ° C. for 10 minutes. On the other hand, in the case of the spherical silver particles of the present invention, the shrinkage rate when heated under the same conditions is about 2 to 5%. Therefore, if a fine wiring, an electrode, etc. are formed with the electrically conductive paste manufactured using the spherical silver particle of this invention, the disconnection and high resistance at the time of heat processing in manufacturing processes, such as a wiring and an electrode, can be suppressed.
本発明の球状銀粒子10の平均粒子径は、好ましくは0.08μm〜1.0μmであり、更に好ましくは0.1〜0.6μmである。また、断面組織観察における中心部11の直径は、好ましくは、球状銀粒子10の直径の0.75〜0.99倍、更に好ましくは0.80〜0.95倍である。断面組織観察における中心部11の直径が、0.75倍未満では、導電ペーストに用いる銀粒子として性能上、特に問題はないが、銀粒子の生成時に還元剤が不足して全量の銀を回収できず、製造コストが高くなるため好ましくない。一方、0.99倍を越えると、球状銀粒子10は、その殆どが中心部11により構成されることになり、上記効果が得られ難いからである。なお、本明細書中、平均粒子径とは、走査電子顕微鏡(以下、SEMという)により観察し、得られた顕微鏡写真の画像において、任意に選択した50個の粒子の粒径を実測したときのその平均値をいう。また、球状銀粒子10の中心部11の直径は、球状銀粒子10を収束イオンビーム装置(以下、FIB装置という)等により切断し、その断面径をTEMによる観察によって測定した直径をいう。また、加熱収縮率は、加熱ステージを備えたSEMにて観察し、得られた顕微鏡画像において、加熱前後の粒子径を比較することにより算出した粒子径の収縮率をいう。 The average particle diameter of the spherical silver particles 10 of the present invention is preferably 0.08 μm to 1.0 μm, and more preferably 0.1 to 0.6 μm. In addition, the diameter of the central portion 11 in the cross-sectional structure observation is preferably 0.75 to 0.99 times, more preferably 0.80 to 0.95 times the diameter of the spherical silver particles 10. When the diameter of the central portion 11 in the cross-sectional structure observation is less than 0.75 times, there is no particular problem in terms of performance as silver particles used in the conductive paste, but when the silver particles are generated, the reducing agent is insufficient and the entire amount of silver is recovered. This is not preferable because the manufacturing cost increases. On the other hand, when the ratio exceeds 0.99 times, most of the spherical silver particles 10 are constituted by the central portion 11, and it is difficult to obtain the above effect. In the present specification, the average particle diameter is observed with a scanning electron microscope (hereinafter referred to as SEM), and when the particle diameters of 50 particles selected arbitrarily are measured in an image of the obtained micrograph. The average value of The diameter of the central portion 11 of the spherical silver particles 10 is a diameter obtained by cutting the spherical silver particles 10 with a focused ion beam apparatus (hereinafter referred to as FIB apparatus) or the like and measuring the cross-sectional diameter by TEM observation. Further, the heat shrinkage rate refers to the shrinkage rate of the particle diameter calculated by observing with a SEM equipped with a heating stage and comparing the particle diameter before and after heating in the obtained microscope image.
次に、本発明の球状銀粒子の製造方法及び製造装置について説明する。先ず、本発明の球状銀粒子を製造するために用いる製造装置について説明する。図4に示すように、本発明の製造装置20は、互いに斜め下方に向かって相対する第1ノズル21及び第2ノズル22を備える。また、貯槽23,24と、貯槽23,24から第1ノズル21又は第2ノズル22に溶液を供給する管路25,26と、管路25,26に設けた送液ポンプ27,28と、送液ポンプ27,28と第1ノズル21又は第2ノズル22の間に設けられた調整部29,30と、第1ノズル21及び第2ノズル22の下方に設置された受槽50とを備える。 Next, the manufacturing method and manufacturing apparatus of the spherical silver particles of the present invention will be described. First, the manufacturing apparatus used in order to manufacture the spherical silver particle of this invention is demonstrated. As shown in FIG. 4, the manufacturing apparatus 20 of the present invention includes a first nozzle 21 and a second nozzle 22 that face each other obliquely downward. Storage tanks 23 and 24; pipes 25 and 26 for supplying a solution from the storage tanks 23 and 24 to the first nozzle 21 or the second nozzle 22; and liquid feed pumps 27 and 28 provided in the pipes 25 and 26; Adjustment units 29 and 30 provided between the liquid feed pumps 27 and 28 and the first nozzle 21 or the second nozzle 22, and a receiving tank 50 installed below the first nozzle 21 and the second nozzle 22.
そして、図3に示すように、第1ノズル21、第2ノズル22から第1溶液41、第2溶液42がそれぞれ別々に噴射され、これらは空中で衝突混合され、混合液43となった後、この混合液43は、落下して受槽50に貯留される。また、第1ノズル21及び第2ノズル22は、ノズル角θとノズル間距離hが、自由に調整できように配置される。受槽50は、受槽50内の混合液43を10℃以下に保つ冷却機構を備えている。冷却機構は、特に限定されないが、例えば、受槽50の壁内部に冷却管52が配置されたジャケット構造になっており、冷媒を冷却管52を通して受槽50の壁内部に導入する導入口51と、これを導出する導出口53とを備える。また、受槽50内に貯留された合成液を速やかに受槽50から取り出し可能な吐出口54を備える。 Then, as shown in FIG. 3, after the first solution 41 and the second solution 42 are separately jetted from the first nozzle 21 and the second nozzle 22, respectively, they are collided and mixed in the air to become a mixed solution 43. The mixed solution 43 falls and is stored in the receiving tank 50. The first nozzle 21 and the second nozzle 22 are arranged so that the nozzle angle θ and the inter-nozzle distance h can be freely adjusted. The receiving tank 50 includes a cooling mechanism that keeps the mixed solution 43 in the receiving tank 50 at 10 ° C. or lower. Although the cooling mechanism is not particularly limited, for example, it has a jacket structure in which a cooling pipe 52 is disposed inside the wall of the receiving tank 50, and an inlet 51 that introduces the refrigerant into the wall of the receiving tank 50 through the cooling pipe 52; And an outlet 53 for deriving this. Moreover, the discharge port 54 which can take out the synthetic | combination liquid stored in the receiving tank 50 from the receiving tank 50 rapidly is provided.
続いて、この製造装置20を用いて本発明の球状銀粒子を製造する方法について説明する。本発明の球状銀粒子は、銀アンミン錯体を還元して銀粒子を析出させることにより得られる。即ち、銀を含む第1溶液と還元剤であるヒドロキノンを含有する第2溶液とを所定の条件で混合し、銀粒子を析出させる方法である。 Then, the method to manufacture the spherical silver particle of this invention using this manufacturing apparatus 20 is demonstrated. The spherical silver particles of the present invention can be obtained by reducing the silver ammine complex to precipitate silver particles. That is, a silver solution is precipitated by mixing a first solution containing silver and a second solution containing hydroquinone as a reducing agent under predetermined conditions.
銀を含む第1溶液として好適な溶液には、硝酸銀溶液にアンモニア水溶液を混合して調製した銀アンミン錯体水溶液が挙げられる。この銀アンミン錯体水溶液の銀濃度は20〜180g/Lの範囲内であることが好ましく、例えば銀濃度が34〜200g/Lの硝酸銀溶液にアンモニア水溶液を混合することにより調製することができる。一方、還元剤溶液となる第2溶液は、還元剤であるヒドロキノンをイオン交換水で溶解させることにより調整される。 A solution suitable as the first solution containing silver includes a silver ammine complex aqueous solution prepared by mixing a silver nitrate solution with an aqueous ammonia solution. The silver concentration of this silver ammine complex aqueous solution is preferably in the range of 20 to 180 g / L, and can be prepared, for example, by mixing an aqueous ammonia solution with a silver nitrate solution having a silver concentration of 34 to 200 g / L. On the other hand, the 2nd solution used as a reducing agent solution is adjusted by dissolving hydroquinone which is a reducing agent with ion-exchange water.
この第1溶液、第2溶液は、上述の図4に示す製造装置20の貯槽23,24に貯えられ、送液ポンプ27,28により、管路25,26を通って第1ノズル21、第2ノズル22まで送り出される。第1ノズル21、第2ノズル22から噴射する第1溶液41、第2溶液42の流量は調整部29,30によって適宜調整され得る。第1ノズル21、第2ノズル22からそれぞれ別々に噴射された第1溶液41、第2溶液42は、空中で衝突混合される。本発明の製造方法において、還元剤であるヒドロキノンの使用量は、還元する銀1molに対して0.25〜0.45molである。通常、銀1molに対し、これを還元するために必要と考えられているヒドロキノンの量は0.5molとされているが、本発明の製造方法では、この0.5molよりも少ない量で、補助還元剤等を加えることなく反応させることができる。これは、ヒドロキノンの酸化体であるベンゾキノン、即ちヒドロキノンが銀アンミン錯体を還元し、自身が酸化されて発生するベンゾキノンが、更に銀を還元するからである。ベンゾキノンの還元力はさほど強くはないが、銀は酸化還元電位が貴な金属であり、金属銀に還元されやすいため、銀アンミン錯体はベンゾキノンによっても容易に銀に還元され得る。これにより、本発明の製造方法では、ヒドロキノンの使用量を低減させることができ、製造コストを削減できる。本発明の製造方法において、銀1モルに対して還元剤を0.25〜0.45モルとしているのは、0.25モルを下回ると還元剤が不足し全量の銀を還元できず回収率が低下してしまう不具合があるためであり、0.45モルを超えると粒子が中心部11と外周部12との2層構造にならず、加熱収縮率が大きくなってしまうためである。 The first solution and the second solution are stored in the storage tanks 23 and 24 of the manufacturing apparatus 20 shown in FIG. 4, and the first nozzle 21 and the second solution are passed through the pipelines 25 and 26 by the liquid feed pumps 27 and 28, respectively. 2 nozzles 22 are sent out. The flow rates of the first solution 41 and the second solution 42 ejected from the first nozzle 21 and the second nozzle 22 can be appropriately adjusted by the adjusting units 29 and 30. The first solution 41 and the second solution 42 sprayed separately from the first nozzle 21 and the second nozzle 22 are collision-mixed in the air. In the production method of the present invention, the amount of hydroquinone used as the reducing agent is 0.25 to 0.45 mol with respect to 1 mol of silver to be reduced. Usually, the amount of hydroquinone considered to be necessary for reducing 1 mol of silver is 0.5 mol, but in the production method of the present invention, the amount of hydroquinone is less than 0.5 mol. The reaction can be carried out without adding a reducing agent or the like. This is because benzoquinone, which is an oxidized form of hydroquinone, that is, hydroquinone reduces the silver ammine complex, and benzoquinone generated by oxidation of itself reduces silver further. Although the reducing power of benzoquinone is not so strong, since silver is a metal having a precious redox potential and is easily reduced to metallic silver, the silver ammine complex can be easily reduced to silver by benzoquinone. Thereby, in the manufacturing method of this invention, the usage-amount of hydroquinone can be reduced and manufacturing cost can be reduced. In the production method of the present invention, the reducing agent is set to 0.25 to 0.45 mol with respect to 1 mol of silver. If the amount is less than 0.25 mol, the reducing agent is insufficient and the total amount of silver cannot be reduced, and the recovery rate. This is because when the amount exceeds 0.45 mol, the particles do not have a two-layer structure of the central portion 11 and the outer peripheral portion 12, and the heat shrinkage rate increases.
第1ノズル21、第2ノズル22からの第1溶液41、第2溶液42の流量は、製造される銀粒子の粒度分布を考慮し、また、銀1molに対するヒドロキノンの使用量が上述した範囲内となるように適宜調整され得る。具体的には、銀を含む第1溶液と還元剤溶液である第2溶液を同じ流量でそれぞれのノズルから噴射して混合する場合には、例えば第1溶液中の銀濃度が20g/Lのとき、第2溶液中のヒドロキノンの濃度を5.1〜9.2g/Lとすれば良い。また、第1溶液中の銀濃度が180g/Lのときは、第2溶液中のヒドロキノンの濃度を45.9〜82.7g/Lにする。また、第1溶液と第2溶液は、同じ流量で噴射して混合する必要はなく、第1溶液に対して第2溶液を3倍の流量で噴射して混合する場合には、例えば第1溶液中の銀濃度が180g/Lのとき、第2溶液中のヒドロキノンの濃度を15.3〜27.6g/Lとすれば良い。 The flow rates of the first solution 41 and the second solution 42 from the first nozzle 21 and the second nozzle 22 consider the particle size distribution of the silver particles to be produced, and the amount of hydroquinone used per 1 mol of silver is within the above-mentioned range. Can be adjusted as appropriate. Specifically, when the first solution containing silver and the second solution that is a reducing agent solution are jetted from each nozzle at the same flow rate and mixed, for example, the silver concentration in the first solution is 20 g / L. At this time, the concentration of hydroquinone in the second solution may be 5.1 to 9.2 g / L. When the silver concentration in the first solution is 180 g / L, the concentration of hydroquinone in the second solution is 45.9 to 82.7 g / L. In addition, the first solution and the second solution do not have to be jetted and mixed at the same flow rate. When the second solution is jetted and mixed at a flow rate three times that of the first solution, for example, the first solution When the silver concentration in the solution is 180 g / L, the concentration of hydroquinone in the second solution may be 15.3 to 27.6 g / L.
また、図3において、ノズル角θを小さくしてノズル間距離hを大きくし、流圧を調整して流量を減少することによって、粒径が大きくなり、粒度分布は広がる傾向になる。一方、ノズル角θを大きくしてノズル間距離hを小さくし、流量を増加すると、粒径が小さくなり、粒度分布は狭くなる傾向になる。そのため、ノズル角θは45〜150度、ノズル間距離hは0.5〜20mmの範囲とすることが好ましい。第1溶液41、第2溶液42の流圧は、それぞれ0.5〜20kPa、0.5〜60kPaの範囲とするのが好ましい。また、第1溶液41、第2溶液42の流量は、それぞれ0.5〜15L/分、0.5〜45L/分とするのが好ましい。 In FIG. 3, by decreasing the nozzle angle θ to increase the inter-nozzle distance h and adjusting the flow pressure to decrease the flow rate, the particle size increases and the particle size distribution tends to widen. On the other hand, when the nozzle angle θ is increased to decrease the inter-nozzle distance h and the flow rate is increased, the particle size tends to decrease and the particle size distribution tends to become narrower. Therefore, it is preferable that the nozzle angle θ is 45 to 150 degrees and the inter-nozzle distance h is in the range of 0.5 to 20 mm. The flow pressures of the first solution 41 and the second solution 42 are preferably in the range of 0.5 to 20 kPa and 0.5 to 60 kPa, respectively. The flow rates of the first solution 41 and the second solution 42 are preferably 0.5 to 15 L / min and 0.5 to 45 L / min, respectively.
このような条件で、第1ノズル21、第2ノズル22から噴射し、空中で衝突混合させた第1溶液41及び第2溶液42の混合液43は、受槽50内に予め貯えられ、10℃以下に冷却した液体中に落下させる。温度を10℃以下とすることにより、図1又は図2に示すような、中心部11の結晶子集合体を構成する球状の結晶子と異なり、この結晶子よりも大きい棒状の結晶子が、中心部11の外周に、球の中心から放射状に成長する構造の球状銀粒子10を得ることができる。その技術的な理由は、ベンゾキノンによる銀イオンの還元速度は温度による影響を強く受け、液温が10℃を上回ると、ヒドロキノンによる銀イオンの還元速度と同等になり、銀粒子の全領域において同じ結晶子が成長する。しかし、10℃以下になると、ベンゾキノンによる還元速度が極端に低下してゆっくりと結晶子が成長し、この結晶性の高い結晶子が、中心部の外周に成長するからであると推定される。このため、混合液43を落下させる液体の液温は10℃以下とする。液温が10℃を超えると、製造される銀粒子が上記2層構造にならず、本発明の効果が得られない。一方、液温の下限値については、特に限定する必要はないが、冷却コストの問題や、受槽50の底部からポンプによって合成液を吐出させることを考慮すると、0℃程度までが妥当である。受槽50内に予め貯えられた液体には水の他、水とメタノール又はエタノールとの混合物や、後述する固液分離によって生じる排液等も使用できる。混合液43を直接受槽50内に落下させずに、予め受槽50内貯えられた液体中に落下させる理由は、落下中の混合液43中では還元反応が完了しておらず、直接受槽50内に落下させると、受槽50壁面に銀が析出し、これが剥がれると粗大な扁平状の銀が混入する不具合が生じるためである。 Under such conditions, the mixed solution 43 of the first solution 41 and the second solution 42 sprayed from the first nozzle 21 and the second nozzle 22 and collided and mixed in the air is stored in advance in the receiving tank 50 and is 10 ° C. Drop into the cooled liquid below. By setting the temperature to 10 ° C. or lower, unlike the spherical crystallites constituting the crystallite aggregate of the central portion 11 as shown in FIG. 1 or FIG. 2, a rod-like crystallite larger than this crystallite is obtained. Spherical silver particles 10 having a structure that grows radially from the center of the sphere can be obtained on the outer periphery of the central portion 11. The technical reason is that the reduction rate of silver ions by benzoquinone is strongly influenced by temperature, and when the liquid temperature exceeds 10 ° C, it becomes the same as the reduction rate of silver ions by hydroquinone and is the same in the entire region of silver particles. Crystallites grow. However, when the temperature is 10 ° C. or lower, the reduction rate by benzoquinone is extremely reduced, and crystallites grow slowly, and this crystallite with high crystallinity grows on the outer periphery of the central portion. For this reason, the liquid temperature of the liquid which drops the liquid mixture 43 shall be 10 degrees C or less. When the liquid temperature exceeds 10 ° C., the produced silver particles do not have the above two-layer structure, and the effect of the present invention cannot be obtained. On the other hand, the lower limit value of the liquid temperature is not particularly limited. However, considering the problem of cooling cost and the discharge of the synthetic liquid from the bottom of the receiving tank 50 by a pump, it is reasonable to reach about 0 ° C. As the liquid stored in the receiving tank 50 in advance, water, a mixture of water and methanol or ethanol, drainage liquid generated by solid-liquid separation described later, and the like can be used. The reason why the mixed solution 43 is dropped directly into the liquid stored in the receiving tank 50 without being dropped directly into the receiving tank 50 is that the reduction reaction is not completed in the falling mixed liquid 43 and is directly in the receiving tank 50. This is because, when dropped, the silver deposits on the wall surface of the receiving tank 50, and when it is peeled off, there is a problem that coarse flat silver is mixed.
受槽50内における銀が析出する合成液は、図3に示す受槽50の底部に備える吐出口54から容易に取り出され、これを固液分離することにより、銀粒子を回収することができる。回収した銀粒子は、その後、アルカリ洗浄、アミド系溶剤洗浄又は強還元剤水溶液洗浄等の洗浄工程を経ることにより、粒子表面の有機物が除去される。以上の工程により本発明の球状銀粒子が得られる。なお、本発明の製造方法では、還元反応により生成するベンゾキン又はベンゾキノンの酸化生成物が球状銀粒子の表面に付着し、球状銀粒子同士の凝集を妨げるため、何れの工程においても分散剤を用いる必要はない。 The synthetic liquid in which silver is deposited in the receiving tank 50 is easily taken out from the discharge port 54 provided at the bottom of the receiving tank 50 shown in FIG. 3, and the silver particles can be recovered by solid-liquid separation. The collected silver particles are then subjected to a cleaning process such as alkali cleaning, amide solvent cleaning or strong reducing agent aqueous solution cleaning, whereby organic substances on the particle surface are removed. The spherical silver particle of this invention is obtained by the above process. In the production method of the present invention, since the oxidation product of benzoquine or benzoquinone produced by the reduction reaction adheres to the surface of the spherical silver particles and prevents aggregation of the spherical silver particles, a dispersant is used in any step. There is no need.
次に本発明の実施例を比較例とともに詳しく説明する。 Next, examples of the present invention will be described in detail together with comparative examples.
<実施例1>
先ず、銀濃度が200g/Lの硝酸銀水溶液に、銀1molに対するアンモニアの量が3.0molとなるように、濃度が25g/Lのアンモニア水溶液を添加混合し、更にイオン交換水を加えて、銀濃度が100g/Lの銀アンミン錯体水溶液を調製し、これを第1溶液とした。一方、ヒドロキノンをイオン交換水で溶解し、濃度が25.5g/Lのヒドロキノン水溶液を調製し、これを第2溶液とした。
<Example 1>
First, an aqueous silver nitrate solution having a concentration of 25 g / L is added to and mixed with an aqueous silver nitrate solution having a silver concentration of 200 g / L so that the amount of ammonia relative to 1 mol of silver is 3.0 mol. An aqueous silver ammine complex solution having a concentration of 100 g / L was prepared, and this was used as the first solution. On the other hand, hydroquinone was dissolved in ion-exchanged water to prepare a hydroquinone aqueous solution having a concentration of 25.5 g / L, which was used as the second solution.
次に、図4に示す製造装置20の貯槽23,24に、上記調製した第1溶液、第2溶液をそれぞれ貯え、送液ポンプ27,28により、管路25,26を通って第1ノズル21、第2ノズル22まで送り出した。そして、第1ノズル21、第2ノズル22から、第1溶液41、第2溶液42を、それぞれ別々に噴射し、空中で衝突混合させて混合液43とした。このとき、第1ノズル21、第2ノズル22からの第1溶液41、第2溶液42の流量は、共に7.5L/分とした。即ち、銀1molに対するヒドロキノンの使用量を0.25molとした。また、第1溶液41、第2溶液42の流圧はいずれも5kPaとした。また、図3における第1ノズル21、第2ノズル22のノズル角θは90度とし、ノズル間距離hは2mmとした。衝突混合させた混合液43は、図3に示す、冷却機構を有する受槽50内に、予め5℃に温度に調整された水中に落下させた。 Next, the prepared first solution and second solution are respectively stored in the storage tanks 23 and 24 of the manufacturing apparatus 20 shown in FIG. 4, and the first nozzle is passed through the pipelines 25 and 26 by the liquid feed pumps 27 and 28. 21 to the second nozzle 22. And the 1st solution 41 and the 2nd solution 42 were each injected separately from the 1st nozzle 21 and the 2nd nozzle 22, and it carried out collision mixing in the air, and was set as the liquid mixture 43. At this time, the flow rates of the first solution 41 and the second solution 42 from the first nozzle 21 and the second nozzle 22 were both 7.5 L / min. That is, the amount of hydroquinone used relative to 1 mol of silver was 0.25 mol. The flow pressures of the first solution 41 and the second solution 42 were both 5 kPa. Further, the nozzle angle θ of the first nozzle 21 and the second nozzle 22 in FIG. 3 was 90 degrees, and the inter-nozzle distance h was 2 mm. The mixed solution 43 subjected to the collision mixing was dropped into water that was previously adjusted to a temperature of 5 ° C. in a receiving tank 50 having a cooling mechanism shown in FIG.
次いで、受槽50内の銀が析出する合成液を、受槽50底部に備える吐出口54から取り出し、これを固液分離により固形物を回収した。回収した中の銀1gに対して、濃度4g/Lの水酸化ナトリウムの量が4mLとなるように混合して洗浄し、銀粒子表面に付着する有機物を取り除き、これを更に遠心分離機で固液分離した。この洗浄から固液分離までの工程を1サイクルとし、これを3サイクル繰り返し行った。最後に、洗浄後の固形物を50℃で熱風乾燥することにより、銀粉末を得た。 Next, the synthesis solution in which the silver in the receiving tank 50 was deposited was taken out from the discharge port 54 provided at the bottom of the receiving tank 50, and the solid was recovered by solid-liquid separation. The collected silver is mixed and washed with 1 g of silver hydroxide so that the amount of sodium hydroxide at a concentration of 4 g / L is 4 mL, organic substances adhering to the surface of the silver particles are removed, and this is further solidified by a centrifuge. The liquid was separated. The process from this washing to solid-liquid separation was defined as 1 cycle, and this was repeated 3 cycles. Finally, the solid after washing was dried with hot air at 50 ° C. to obtain a silver powder.
<実施例2>
第2溶液中のヒドロキノン濃度を30.6g/L、即ち銀1molに対するヒドロキノンの使用量を0.30molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Example 2>
A silver powder was obtained in the same manner as in Example 1, except that the hydroquinone concentration in the second solution was 30.6 g / L, that is, the amount of hydroquinone used was 0.30 mol with respect to 1 mol of silver.
<実施例3>
第2溶液中のヒドロキノン濃度を37.5g/L、即ち銀1molに対するヒドロキノンの使用量を0.35molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Example 3>
A silver powder was obtained in the same manner as in Example 1 except that the hydroquinone concentration in the second solution was 37.5 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.35 mol.
<実施例4>
第2溶液中のヒドロキノン濃度を40.8g/L、即ち銀1molに対するヒドロキノンの使用量を0.40molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Example 4>
A silver powder was obtained in the same manner as in Example 1 except that the hydroquinone concentration in the second solution was 40.8 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.40 mol.
<実施例5>
第2溶液中のヒドロキノン濃度を45.9g/L、即ち銀1molに対するヒドロキノンの使用量を0.45molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Example 5>
A silver powder was obtained in the same manner as in Example 1 except that the hydroquinone concentration in the second solution was 45.9 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.45 mol.
<実施例6>
受槽50内の水の温度を予め1℃に設定したこと以外は、実施例3と同様に、銀粉末を得た。
<Example 6>
Silver powder was obtained in the same manner as in Example 3 except that the temperature of the water in the receiving tank 50 was set to 1 ° C. in advance.
<実施例7>
受槽50内の水の温度を予め10℃に設定したこと以外は、実施例3と同様に、銀粉末を得た。
<Example 7>
Silver powder was obtained in the same manner as in Example 3 except that the temperature of the water in the receiving tank 50 was set to 10 ° C. in advance.
<比較例1>
第2溶液中のヒドロキノン濃度を15.3g/L、即ち銀1molに対するヒドロキノンの使用量を0.15molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Comparative Example 1>
A silver powder was obtained in the same manner as in Example 1, except that the hydroquinone concentration in the second solution was 15.3 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.15 mol.
<比較例2>
第2溶液中のヒドロキノン濃度を20.4g/L、即ち銀1molに対するヒドロキノンの使用量を0.20mol以外は、実施例1と同様に、銀粉末を得た。
<Comparative example 2>
A silver powder was obtained in the same manner as in Example 1 except that the hydroquinone concentration in the second solution was 20.4 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.20 mol.
<比較例3>
第2溶液中のヒドロキノン濃度を51.0g/L、即ち銀1molに対するヒドロキノンの使用量を0.50molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Comparative Example 3>
A silver powder was obtained in the same manner as in Example 1, except that the hydroquinone concentration in the second solution was 51.0 g / L, that is, the amount of hydroquinone used relative to 1 mol of silver was 0.50 mol.
<比較例4>
第2溶液中のヒドロキノン濃度を56.1g/L、即ち銀1molに対するヒドロキノンの使用量を0.55molとしたこと以外は、実施例1と同様に、銀粉末を得た。
<Comparative example 4>
A silver powder was obtained in the same manner as in Example 1, except that the hydroquinone concentration in the second solution was 56.1 g / L, that is, the amount of hydroquinone used was 0.55 mol with respect to 1 mol of silver.
<比較例5>
受槽50内の水の温度を予め15℃に設定したこと以外は、実施例3と同様に、銀粉末を得た。
<Comparative Example 5>
A silver powder was obtained in the same manner as in Example 3 except that the temperature of the water in the receiving tank 50 was previously set to 15 ° C.
<比較試験及び評価>
実施例1〜7及び比較例1〜5で得られた銀粉末における球状銀粒子の平均粒子径、平均粒子径に対する中心部の直径、球状銀粒子の加熱収縮率を求めた。また、これらの銀粉末を用いて作製した配線における断線について評価した。これらの結果を以下の表1に示す。
<Comparison test and evaluation>
The average particle diameter of the spherical silver particles in the silver powders obtained in Examples 1 to 7 and Comparative Examples 1 to 5, the diameter of the central portion with respect to the average particle diameter, and the heat shrinkage ratio of the spherical silver particles were determined. Moreover, the disconnection in the wiring produced using these silver powder was evaluated. These results are shown in Table 1 below.
(1) 球状銀粒子の平均粒子径:得られた銀粉末をSEMにより観察し、得られた顕微鏡写真の画像において、任意に選択した50個の粒子の粒径を実測し、これらの平均値を算出した。なお、顕微鏡写真の画像において粒子同士が重なって写っているものについては、可視部の曲率から補完して径を算出した。 (1) Average particle diameter of spherical silver particles: The obtained silver powder was observed by SEM, and the particle diameters of 50 arbitrarily selected particles were measured in the image of the obtained micrograph, and the average value of these particles was measured. Was calculated. In addition, in the image of the micrograph, the particle was overlapped and the diameter was calculated by complementing from the curvature of the visible part.
(2) 球状銀粒子の平均粒子径:得られた銀粒子を、収束イオンビーム装置(FIB装置)により切断し、その断面径をTEM観察により測定した。実施例2で得られた球状銀粒子の断面をTEMにより観察した顕微鏡写真の画像を図1に示す。また、実施例3で得られた球状銀粒子の断面を表した模式図を図2に示す。なお、中心部と外周部の境界は、得られた顕微鏡写真の画像から目視により判断した。 (2) Average particle diameter of spherical silver particles: The obtained silver particles were cut with a focused ion beam apparatus (FIB apparatus), and the cross-sectional diameter was measured by TEM observation. The image of the micrograph which observed the cross section of the spherical silver particle obtained in Example 2 by TEM is shown in FIG. Moreover, the schematic diagram showing the cross section of the spherical silver particle obtained in Example 3 is shown in FIG. In addition, the boundary between the central portion and the outer peripheral portion was determined by visual observation from the obtained micrograph image.
(3) 加熱収縮率:加熱ステージを有するSEMを使用し、周辺の粒子と接触していない独立した単独粒子を発見した。そして、加熱ステージにより、550℃の温度で10分間保持する加熱処理前後の単独粒子の直径を、それぞれ顕微鏡写真の画像から測定し、これを比較することにより算出した。 (3) Heat shrinkage rate: Using a SEM having a heating stage, independent single particles that were not in contact with surrounding particles were discovered. And the diameter of the single particle | grains before and behind the heat processing hold | maintained for 10 minutes at the temperature of 550 degreeC with the heating stage was measured from the image of each micrograph, and it computed by comparing this.
(4) 断線の有無:先ず、実施例1〜7及び比較例1〜5で得られた銀粉末70gと、平均分子量10万のエチルセルロースが10wt%となるようにαテレピネオールで溶解した液25gと、ガラスフリット5gとをロールミル混合し、それぞれの導電ペーストを得た。 (4) Existence of disconnection: First, 70 g of silver powder obtained in Examples 1 to 7 and Comparative Examples 1 to 5 and 25 g of a solution in which α-terpineol was dissolved so that ethylcellulose having an average molecular weight of 100,000 was 10 wt%; Then, 5 g of glass frit was roll mill mixed to obtain each conductive paste.
これらの導電ペーストを用いて、スクリーン印刷により、線幅50μm、長さ100mmのペースト状の線をガラス基板上に印刷した。次いで、これを100℃の温度で30分乾燥した後、550℃の温度で10分間焼成することにより配線を形成した。配線は、それぞれの導電ペーストに付き10点ずつ形成した。 Using these conductive pastes, paste-like lines having a line width of 50 μm and a length of 100 mm were printed on a glass substrate by screen printing. Subsequently, after drying this for 30 minutes at the temperature of 100 degreeC, the wiring was formed by baking for 10 minutes at the temperature of 550 degreeC. Wiring was formed at 10 points for each conductive paste.
これらの配線について、形成された配線の両末端にテスターをあて、導通が得られなかった場合を断線と判断した。 With respect to these wirings, a tester was applied to both ends of the formed wirings, and a case where continuity was not obtained was judged as a disconnection.
それぞれの導電ペーストに付き10点ずつ形成された配線の内、1点でも断線有りと判断された配線があった場合を「有」、10点すべての配線において断線無しと判断された場合を「無」と評価した。 Of the wirings formed at 10 points for each conductive paste, there is a wiring that is judged to be broken even at one point, “Yes”, and the case where it is judged that there is no breaking in all 10 wirings. “No”.
また、本発明の球状銀粒子は、加熱収縮率が2〜5%と低く、これを用いて形成した配線では、断線が確認されなかった。このことから、本発明の球状銀粒子は、微細な配線を形成するのに効果的であることが確認された。 Further, the spherical silver particles of the present invention have a low heat shrinkage rate of 2 to 5%, and no disconnection was confirmed in the wiring formed using this. From this, it was confirmed that the spherical silver particles of the present invention are effective for forming fine wiring.
本発明の球状銀粒子は、小型化と高密度化が要請されている電子機器、電子デバイスの配線及び電極等を形成するためのペースト材料に好適に利用することができる。 The spherical silver particles of the present invention can be suitably used as a paste material for forming electronic equipment, electronic device wiring, electrodes, and the like that are required to be miniaturized and densified.
10 球状銀粒子
11 中心部
12 外周部
10 spherical silver particles 11 central part 12 outer peripheral part
Claims (5)
銀を含む第1溶液とヒドロキノンを含有する第2溶液を、前記第1溶液中の銀1molに対する前記第2溶液中のヒドロキノンが0.25〜0.45molの範囲内となるように、前記第1溶液と前記第2溶液をそれぞれ別々に噴射して空中で衝突混合させる工程と、
前記第1溶液及び前記第2溶液の混合液を、10℃以下に冷却した液体中に落下させる工程と
を含むことを特徴とする球状銀粒子の製造方法。 A method for producing the spherical silver particles according to any one of claims 1 to 3,
The first solution containing silver and the second solution containing hydroquinone are prepared so that the hydroquinone in the second solution with respect to 1 mol of silver in the first solution falls within the range of 0.25 to 0.45 mol. Injecting each of the first solution and the second solution separately and colliding them in the air;
Dropping the mixed solution of the first solution and the second solution into a liquid cooled to 10 ° C. or lower. A method for producing spherical silver particles, comprising:
前記受槽は前記受槽内の合成液を10℃以下に保つ冷却機構と、
前記受槽内の合成液を前記受槽の底部から抜き取る吐出口と
を備えることを特徴とする球状銀粒子の製造装置。 A spherical silver particle comprising: a first nozzle and a second nozzle that separately jet a first solution and a second solution, collide and mix in the air to form a mixed solution; and a receiving tank that receives the mixed solution that falls in the air In manufacturing equipment,
The receiving tank is a cooling mechanism for keeping the synthesis solution in the receiving tank at 10 ° C. or lower;
An apparatus for producing spherical silver particles, comprising: a discharge port for extracting the synthesis solution in the receiving tank from the bottom of the receiving tank.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011153329A (en) * | 2010-01-26 | 2011-08-11 | Mitsubishi Materials Corp | Method for forming electrode or wiring pattern |
| WO2012169628A1 (en) * | 2011-06-08 | 2012-12-13 | 住友金属鉱山株式会社 | Silver powder and process for manufacturing same |
| CN104136153A (en) * | 2012-02-24 | 2014-11-05 | 住友金属矿山株式会社 | Silver powder and method for producing same |
| WO2020106120A1 (en) * | 2018-11-23 | 2020-05-28 | 엘에스니꼬동제련 주식회사 | Method for preparing monodispersed silver powder |
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2009
- 2009-03-31 JP JP2009084466A patent/JP2010236007A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011153329A (en) * | 2010-01-26 | 2011-08-11 | Mitsubishi Materials Corp | Method for forming electrode or wiring pattern |
| WO2012169628A1 (en) * | 2011-06-08 | 2012-12-13 | 住友金属鉱山株式会社 | Silver powder and process for manufacturing same |
| CN103079728A (en) * | 2011-06-08 | 2013-05-01 | 住友金属矿山株式会社 | Silver powder and process for manufacturing same |
| JP5288063B2 (en) * | 2011-06-08 | 2013-09-11 | 住友金属鉱山株式会社 | Silver powder and method for producing the same |
| KR20140030091A (en) * | 2011-06-08 | 2014-03-11 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Silver powder and method for producing same |
| CN103079728B (en) * | 2011-06-08 | 2015-06-24 | 住友金属矿山株式会社 | Silver powder and process for manufacturing same |
| TWI574761B (en) * | 2011-06-08 | 2017-03-21 | Sumitomo Metal Mining Co | Silver powder and its manufacturing method |
| KR101885391B1 (en) * | 2011-06-08 | 2018-08-03 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Silver powder and method for producing same |
| CN104136153A (en) * | 2012-02-24 | 2014-11-05 | 住友金属矿山株式会社 | Silver powder and method for producing same |
| WO2020106120A1 (en) * | 2018-11-23 | 2020-05-28 | 엘에스니꼬동제련 주식회사 | Method for preparing monodispersed silver powder |
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