JP2010221373A - Method for measuring dimensions of functional element, method for manufacturing substrate with functional element, substrate with functional element, and electronic apparatus - Google Patents

Abstract

Provided is a method for measuring a dimension of a functional element, which can accurately determine the dimension of the functional element, and can accurately estimate the frequency characteristic of the functional element.
A method for measuring a dimension of a functional element is obtained by comparing a functional element 3 with a functional element substrate 1 having a substrate 2 and a functional element 3 having a fixed electrode 31 and a movable electrode 32 provided on the substrate 2. The first inspection film 41 is formed at the same time as the fixed electrode 31 and the movable electrode 32 is formed at the same time as the fixed electrode 31 is formed. The step of forming the second inspection film 42 by the same method as the formation of, and the dimensions of a predetermined part of the inspection body 4 comprising the first inspection film 41 and the second inspection film 42 are measured. It has a process and the process of calculating | requiring the dimension of the predetermined site | part of the functional element 3 from the result of a measurement.
[Selection] Figure 1

Description

  The present invention relates to a method for measuring a dimension of a functional element, a method for manufacturing a substrate with a functional element, a substrate with a functional element, and an electronic apparatus.

2. Description of the Related Art In recent years, electronic devices such as sensors, resonators, and communication devices that use MEMS (Micro Electro Mechanical System) technology and have a MEMS element on a semiconductor substrate have attracted attention. Such an electronic device includes a substrate, a functional element (MEMS element) formed on the substrate, and an element surrounding structure that is provided on the substrate and defines a cavity in which the functional element is disposed. An electronic device is known (for example, Patent Document 1).
In such an electronic device, the frequency characteristic of the functional element depends on the dimension of the functional element, and in particular, greatly depends on the shape, size, formation position, and the like of the movable plate included in the functional element.

The dimension of the functional element can be measured, for example, when the functional element is formed on the substrate. However, when measuring the dimension of the movable plate, for example, it is difficult to grasp the boundary of the movable plate, and it is difficult to accurately measure the dimension. It is also possible to grasp the dimension value of the functional element by measuring the dimension value and the alignment value for each part. However, these values are representative values away from the functional elements and are not suitable for accurate measurement value grasping.
Thus, unless the dimension of the functional element can be measured accurately, the frequency characteristic of the functional element cannot be grasped until the functional element is actually operated. For this reason, an electronic device will be produced also about the functional element which does not have a desired frequency characteristic, without understanding the frequency characteristic of the functional element formed on the board | substrate.

JP 2008-212435 A

  An object of the present invention is to provide a method for measuring a dimension of a functional element, which can accurately determine the dimension of the functional element, and can accurately estimate the frequency characteristics of the functional element, a method of manufacturing the substrate with the functional element, An object is to provide a substrate with an element and an electronic device.

Such an object is achieved by the present invention described below.
The method for measuring dimensions of a functional element of the present invention includes a substrate, a fixed electrode provided on the substrate, and a functional element having a movable electrode provided with a movable portion arranged to face the fixed electrode with a gap therebetween. A method for measuring the dimensions of the functional element with respect to the substrate with the functional element,
Simultaneously with the formation of the fixed electrode, a step of forming a first inspection film at a position not in contact with the fixed electrode on the substrate by the same method as the fixed electrode;
Simultaneously with the formation of the movable electrode, a step of forming a second inspection film on a portion of the substrate that is not in contact with the fixed electrode and the movable electrode by a method similar to the formation of the movable electrode;
Measuring a dimension of a predetermined part of an inspection body comprising the first inspection film and the second inspection film;
And a step of obtaining a dimension of a predetermined portion of the functional element from the result of the measurement.
Thereby, the dimension of a functional element can be calculated | required with high precision, and the measuring method of the dimension of a functional element which can estimate the frequency characteristic of a functional element with high precision can be provided.

In the method for measuring the dimension of the functional element according to the present invention, the designed dimension of the predetermined part where the dimension of the functional element is required is A [μm], and the target dimension of the predetermined part to be measured of the inspection object is the target dimension. When B [μm] is satisfied, it is preferable to satisfy the relationship of 0.1 ≦ A / B ≦ 1000.
Thereby, the dimension of a functional element can be grasped | ascertained more correctly.
In the method for measuring the dimension of the functional element of the present invention, the dimension of the predetermined part of the inspection object is measured in parallel with the direction of the dimension of the predetermined part where the dimension of the functional element is required,
It is preferable that one end of the first inspection film and one end of the second inspection film are used for measuring the dimensions of the inspection object.
Thereby, the positional relationship between the first inspection film corresponding to the fixed electrode and the second inspection film corresponding to the movable electrode and the deviation of the size and shape thereof are reflected in the measurement result of the dimensions of the inspection object, The dimensions of the functional element can be obtained with higher accuracy.

In the method for measuring a dimension of a functional element of the present invention, the first inspection film having a substantially rectangular shape and the second inspection film having a substantially rectangular shape are orthogonal to each other.
The side of the first inspection film that does not overlap the second inspection film and the side of the second inspection film that overlaps the first inspection film and is further away from the side Is preferably used for measuring dimensions.
Thereby, the base point of the measurement of the dimension of the inspection object becomes clear, and the dimension measurement of the inspection object can be suitably performed.

In the method for measuring a dimension of a functional element of the present invention, the second inspection film is provided so as to overlap the first inspection film, and at least a part of an end portion of the first inspection film. Has an opening formed so as to be exposed,
It is preferable that an end portion of the first inspection film exposed from the opening and an end of the outer peripheral portion of the second inspection film are used for measurement of dimensions.
Thereby, the measurement precision of the dimension in the predetermined part of a functional element improves.

In the functional element dimension measuring method of the present invention, the movable electrode is provided opposite to the fixed electrode, and a pair of support portions that support the movable portion are connected to the support portions and the movable portion. And a pair of connecting parts
The second inspection film is provided so as to overlap the first inspection film, and a first opening formed so that at least a part of one end of the first inspection film is exposed. And a second opening formed so that at least a part of the other end opposite to the one end of the first inspection film is exposed,
The one end of the first inspection film exposed from the first opening and the other end of the first inspection film exposed from the second opening are used for dimension measurement. Is preferred.
Thereby, the dimension in the predetermined site | part of the functional element by which the movable plate was supported at both ends can be calculated | required suitably.

In the method for measuring a dimension of a functional element of the present invention, two or more inspection bodies are formed on one of the functional elements on the substrate.
Of the two or more inspection bodies, the pair of inspection bodies are preferably formed to face each other with the functional element interposed therebetween.
Thereby, the measurement precision of the dimension in the predetermined part of a functional element improves.

In the method for measuring the dimension of the functional element of the present invention, the dimension of the predetermined part of the functional element is compared with the target dimension of the predetermined part of the inspection object to be formed and the measured dimension. Is preferably obtained.
Thereby, the dimension of a functional element can be calculated | required accurately.
In the method for measuring the dimension of the functional element of the present invention, the third inspection is performed in the same manner as the second inspection film in the vicinity of the second inspection film simultaneously with the formation of the second inspection film. It is preferable to form a coating film.
Thereby, the measurement precision of the dimension in the predetermined part of a functional element improves.

In the method for measuring dimensions of a functional element of the present invention, it is preferable that the first inspection film and the fixed electrode are made of the same material.
As a result, errors such as a shape and a positional deviation that occur in the fixed electrode are easily reflected to the same extent by errors that occur in the first inspection film.
In the method for measuring dimensions of a functional element of the present invention, it is preferable that the second inspection film and the movable electrode are made of the same material.
As a result, errors such as the shape and displacement caused by the movable electrode are easily reflected to the same extent by the error generated by the second inspection film.

In the measuring method of the dimension of the functional element of the invention, it is preferable that the inspection object is disposed at a position where the distance from the functional element is 0.1 to 1000 μm.
As a result, the inspection object easily reflects an error in the dimensions of the functional element (an error due to a positional deviation, a shape of the functional element, etc.). In addition, the test object is prevented from affecting the frequency characteristics of the functional element.

In the method for measuring dimensions of the functional element of the invention, a plurality of the functional elements are arranged on the substrate,
It is preferable that one or more inspection bodies are formed for each functional element on the substrate.
Thereby, the measurement precision of the dimension in the predetermined part of a functional element improves.
In the measuring method of the dimension of the functional element of the invention, in the two inspection bodies, by comparing the positional relationship between the first inspection film and the second inspection film in each inspection body, It is preferable to estimate an arrangement angle with respect to the fixed electrode.
Thereby, the arrangement angle of the movable electrode with respect to the fixed electrode can be estimated.

The method for manufacturing a substrate with a functional element of the present invention includes a step of forming a fixed electrode and a first inspection film on the substrate by the same method,
Forming a movable electrode and a second inspection film on the substrate by the same method;
Have
The functional element constituted by the fixed electrode and the movable electrode is formed so as not to come into contact with the inspection body constituted by the first inspection film and the second inspection film,
The inspection object is used for obtaining a dimension of a predetermined part of the functional element by measuring a dimension of the predetermined part.
Thereby, the dimension of a functional element can be calculated | required accurately and the manufacturing method of the board | substrate with a functional element which can estimate the frequency characteristic of a functional element accurately can be provided.

The substrate with a functional element of the present invention includes a substrate,
A functional element having a movable electrode that is disposed on the substrate and includes a fixed electrode provided on the substrate and a movable portion that is disposed to face the fixed electrode across a gap;
By measuring the dimension of the predetermined part, it has an inspection body for obtaining the dimension of the predetermined part of the functional element,
The inspection object is formed on the substrate at a position not in contact with the functional element by a first inspection film formed by the same method as the fixed electrode and a second method formed by the same method as the movable electrode. And an inspection film.
Thereby, the dimension with a functional element can be calculated | required accurately, and the board | substrate with a functional element which can estimate the frequency characteristic of a functional element accurately can be provided.
An electronic device according to the present invention includes the substrate with a functional element according to the present invention.
As a result, it is possible to provide an electronic apparatus that can accurately determine the dimensions of the provided functional elements and that can accurately estimate the frequency characteristics of the functional elements.

It is a top view which shows the board | substrate with a functional element which concerns on 1st Embodiment of this invention. It is sectional drawing (xx sectional view) of the board | substrate with a functional element shown in FIG. 1, and an enlarged plan view of the functional element shown in FIG. It is an enlarged plan view of the test body with which the board | substrate with a functional element of FIG. 1 is provided. It is sectional drawing which shows the manufacturing method of the board | substrate with a functional element shown in FIG. 1 (y line sectional drawing of the board | substrate with a functional element of FIG. 1). 1 is a cross-sectional view of an electronic device according to a first embodiment of the present invention. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows the manufacturing method of the electronic device shown in FIG. It is an enlarged plan view which shows the test body with which the board | substrate with a functional element which concerns on 2nd Embodiment of this invention is provided. It is a top view which shows the board | substrate with a functional element which concerns on 3rd Embodiment of this invention. It is a top view which shows the board | substrate with a functional element which concerns on 4th Embodiment of this invention. It is sectional drawing (x'-x 'line sectional drawing) of the board | substrate with a functional element shown in FIG. It is an enlarged plan view of the test | inspection body with which the board | substrate with a functional element of FIG.

Hereinafter, the present invention will be described in detail based on each embodiment shown in the accompanying drawings.
<First Embodiment>
FIG. 1 is a plan view showing a substrate with functional elements according to the first embodiment of the present invention. FIG. 2 is a sectional view (cross-sectional view taken along line xx) of the substrate with functional elements shown in FIG. 3 is an enlarged plan view of the functional element, FIG. 3 is an enlarged plan view of an inspection body provided in the substrate with functional elements in FIG. 1, and FIG. 4 is a cross-sectional view showing a method for manufacturing the substrate with functional elements shown in FIG. FIG. 5 is a cross-sectional view of the electronic device according to the first embodiment of the present invention, and FIGS. 6 and 7 show a method for manufacturing the electronic device shown in FIG. It is sectional drawing. In the following, for convenience of explanation, the upper side of FIGS. 1 to 6 is referred to as “upper”, the lower side is referred to as “lower”, the right side is referred to as “right”, and the left side is referred to as “left”.

First, prior to the description of the method for measuring the dimensions of the functional element of the present invention and the method of manufacturing the substrate with functional elements, the substrate with functional elements of the present invention will be described.
A substrate 1 with a functional element shown in FIGS. 1 and 2 includes a substrate 2, a functional element 3, an inspection body 4, and a semiconductor circuit (not shown). Each of these parts will be described in turn below.
The substrate 2 is a plate member having a substantially circular shape in plan view, for example. Such a substrate 2 is configured by laminating an insulating film 22 and a nitride film 23 in this order on a semiconductor substrate 21 made of a semiconductor. The substrate 2 may have any other shape such as a substantially square shape, a substantially rectangular shape, or a substantially oval shape in plan view.

The functional element 3 has a fixed electrode 31 formed on the substrate 2 and a movable electrode 32.
The fixed electrode 31 has a substantially rectangular shape when seen in a plan view, and wiring (not shown) for electrical connection with other circuits is arranged from the vicinity of the center of one long side.
The movable electrode 32 has a substantially rectangular shape when viewed from above, and a part of the movable electrode 32 overlaps the fixed electrode 31 so that one long side thereof is arranged on the fixed electrode 31. The movable electrode 32 includes a support portion 321 formed on the nitride film 23 of the substrate 2, a movable plate (movable portion) 322 arranged to face the fixed electrode 31 with a gap, a support portion 321, and a movable plate 322. And a connecting portion 323 for connecting the two. The movable plate 322 is cantilevered by the support portion 321 through the connecting portion 323.

When a high frequency having a frequency equivalent to the natural frequency of the movable plate 322 is applied to the movable plate 322, the movable plate 322 vibrates (resonates) and changes in capacitance, whereby a current flows between the fixed electrode 31 and the movable plate 322. Flows, and the current is output (detected) from the fixed electrode 31.
Although a plurality of functional elements 3 are arranged on the substrate 2, in order to simplify the description, one functional element 3 is arranged on the substrate 2 in the configuration shown in the drawing.

  As shown in FIGS. 1 and 3, the inspection body 4 is provided at a position not in contact with the functional element 3 on the substrate 2, and has a first inspection film 41 and a second inspection film 42. Yes. In addition, two inspection bodies 4 for one functional element 3 are arranged to face each other with the functional element 3 in a direction parallel to the direction of the long side of the movable plate 32 of the movable electrode 32. In addition, said two test body 4 has the same structure.

As will be described later, the inspection body 4 is used to estimate the size of a predetermined part of the functional element 3 and to estimate the frequency characteristic by measuring the dimension of the predetermined part.
In addition, the inspection body 4 has a shape suitable for measuring dimensions compared to the case where the functional element 3 is directly measured.
In addition, the inspection body 4 has such a size that an error from a target dimension of a predetermined part of the inspection body 4 is measured with sufficient accuracy, and has a smaller area in plan view than the functional element 3. It has become.

Further, the inspection body 4 is arranged at a predetermined distance from the functional element 3. As described above, the inspection body 4 and the functional element 3 are arranged at a predetermined distance, thereby preventing the inspection body 4 from affecting the frequency characteristics when the functional element 3 is driven.
Moreover, in this embodiment, it is preferable that the separation distance of the test body 4 and the functional element 3 is 0.1-10000 micrometers. As described above, by arranging the inspection body 4 sufficiently close to the functional element 3, the inspection body 4 easily reflects an error in the dimensions of the functional element 3 (an error due to a positional deviation, a shape of the functional element 3, etc.). It will be a thing. In addition, the inspection body 4 is prevented from affecting the frequency characteristics of the functional element 3.

Further, as described above, in the present embodiment, two inspection bodies 4 are arranged for one functional element 3. For this reason, for each of the plurality of functional elements 3 on the substrate 2, it is possible to estimate the dimensions described later by the inspection body 4, and the accuracy of dimension measurement of a predetermined part of the functional elements 3 is improved.
As shown in FIG. 3, the first inspection film 41 has a substantially rectangular shape and is arranged such that the long side direction is perpendicular to the long side direction on the movable plate 322 of the movable electrode 32. . The first inspection film 41 is made of the same material as that of the fixed electrode 31 and is formed by the same method as that of the fixed electrode 31.

The second inspection film 42 has a substantially rectangular shape, the long side direction is parallel to the direction of the long side on the movable plate 322 of the movable electrode 32, and the first inspection film 41 They are arranged to intersect at right angles. The second inspection film 42 is made of the same material as that of the movable electrode 32, and is formed by the same method as that of the movable electrode 32.
1 to 3, a semiconductor circuit (not shown) is formed on and above the semiconductor substrate 21. This semiconductor circuit has circuit elements such as active elements such as MOS transistors, capacitors, inductors, resistors, diodes, and wiring (including the electrode wiring and wiring layers 42 and 44) formed as necessary. .

As described above, the substrate 1 with a functional element, as described later, can accurately estimate an error from the designed value of the dimension of a desired part of the functional element 3 by using the inspection body 4. The frequency characteristics such as the size of the part of the functional element 3 and the natural frequency of the functional element 3 can be easily grasped with high accuracy.
The functional element-equipped substrate 1 has a sacrificial layer 220 described later around the second inspection film 42, but is omitted in FIGS. 1 and 3 for the sake of simplicity.

Next, the manufacturing method of the board | substrate with a functional element of this invention and the measuring method of the dimension of a functional element are demonstrated.
Further, the method for manufacturing a substrate with a functional element of the present invention includes a fixed electrode forming step (first inspection film forming step) in which a fixed electrode and a first inspection film are simultaneously formed by the same method, A movable electrode forming step (second inspection film forming step) for forming a movable electrode and a second inspection film on the substrate by a similar method is provided.

  The method for measuring the dimensions of the functional element according to the present invention includes the above-described first inspection film formation step (fixed electrode formation step) and second inspection film formation step (movable electrode formation step) on the substrate. In addition, an inspection body measuring step for measuring a dimension of a predetermined portion of the inspection body including the first inspection film and the second inspection film, and a predetermined result of the functional element based on the measurement result. A dimension measuring step for obtaining a dimension of the part.

Hereinafter, each process will be described sequentially.
[Board preparation process]
Prior to the first inspection film formation step, the substrate 2 is prepared.
First, as shown in FIG. 4A, a semiconductor substrate 100 made of a semiconductor such as a silicon substrate is prepared. Note that a ceramic substrate, a glass substrate, a sapphire substrate, a diamond substrate, a synthetic resin substrate, or the like may be used instead of the semiconductor substrate 100. Next, a silicon oxide film (insulating film) 110 is formed by thermally oxidizing the surface (upper surface) of the prepared semiconductor substrate 100. Further, a silicon nitride film 120 is formed on the silicon oxide film 110 by sputtering, CVD, or the like. Form. Thereby, the substrate 2 is obtained.

  The silicon oxide film 110 functions as an element isolation film when a semiconductor circuit is formed on the semiconductor substrate 100 and above. Further, the silicon nitride film 120 has durability against etching performed in a release process performed later, and functions as a so-called etching stop layer. The silicon nitride film 120 is formed by a patterning process so as to be limited to a range including a plane range where the functional element 3 and the inspection body 4 are formed. As a result, the semiconductor substrate 100 and a semiconductor circuit formed thereon are not obstructed. Note that the silicon nitride film 120 can be formed without any limitation in order to form a circuit element such as a capacitor, if necessary.

[First inspection film forming step (fixed electrode forming step)]
Next, as shown in FIG. 4B, a silicon film 200 for forming the fixed electrode 31 and the first inspection film 41 is formed on the silicon nitride film 120 by sputtering, CVD, or the like. The silicon film 200 is doped with impurity ions such as phosphorus ions, boron, and arsenic to impart conductivity. Then, a photoresist is applied on the silicon film 200 and patterned into the shape of the fixed electrode 31 and the first inspection film 41 (the shape in plan view) to form a photoresist film 210. Note that the silicon constituting the silicon film 200 may be polycrystalline silicon or amorphous silicon.

Next, as shown in FIG. 4C, after the silicon film 200 is etched using the patterned photoresist film 210 as a mask, the photoresist film 210 is removed.
Next, as shown in FIG. 4D, a sacrificial layer 220 made of PSG (phosphorus-doped glass), silicon oxide film or the like is covered with a thermal oxidation method or a sputtering method so as to cover the fixed electrode 31 and the first inspection film 41. It is formed by a CVD method or the like.
Thereby, the fixed electrode 31 and the first inspection film 41 are simultaneously formed by the same method. Further, the fixed electrode 31 and the first inspection film 41 are formed of the same material by being simultaneously formed by the same method as described above.

[Second Inspection Film Formation Step (Moving Electrode Formation Step)]
Next, as shown in FIG. 4E, a silicon film 230 for forming the movable electrode 32 and the second inspection film 42 is formed on the silicon nitride film 120 and the sacrificial layer 220 by sputtering, CVD, or the like. Then, the formed silicon film 230 is doped with impurity ions such as phosphorus ions, boron, and arsenic to impart conductivity. Then, a photoresist is applied on the silicon film 230 and patterned into the shape of the movable electrode 32 (planar shape) and the shape of the second inspection film 42 (planar shape) to form a photoresist film 240. Note that the silicon constituting the silicon film 230 may be polycrystalline silicon or amorphous silicon.

  Next, as shown in FIG. 4F, after the silicon film 230 is etched using the photoresist film 240 as a mask, the photoresist film 240 is removed. Thereby, the movable electrode 32 and the second inspection film 42 are simultaneously formed by the same method. The movable electrode 32 is integrally formed with a support portion 321, a movable plate 322, and a connecting portion 323. In addition, the movable electrode 32 and the second inspection film 42 are formed of the same material by being simultaneously formed by the same method as described above.

Then, when the sacrificial layer 220 between the movable electrode 32 and the fixed electrode 31 is removed by a method similar to the release process described later, the functional element 3 having the fixed electrode 31 and the movable electrode 32 and the first inspection are performed. The inspection body 4 having the application film 41 and the second inspection film 42 is formed.
The substrate 1 with a functional element can be manufactured through the steps as described above. Note that circuit elements such as active elements such as MOS transistors, capacitors, inductors, resistors, diodes, wirings, and the like included in the semiconductor circuit included in the substrate 1 with functional elements can be formed in the middle of the above-described appropriate steps. . For example, an isolation film between circuit elements is formed together with the silicon oxide film 110, a gate electrode, a capacitive electrode, a wiring, etc. are formed together with the fixed electrode 31 and the movable electrode 32, or a gate insulating film and a capacitive dielectric layer are formed together with the sacrificial layer 220. An interlayer insulating film can be formed.

[Inspection measurement process]
Next, the dimension of the predetermined part of the test body 4 is measured about the manufactured board | substrate 1 with a functional element.
The first inspection film 41 of the inspection body 4 corresponds to the fixed electrode 31 and has a similar displacement (error) corresponding to the deviation of the position, shape, and size of the fixed electrode 31 from the ideal value. ). Further, the second inspection film 42 corresponds to the movable electrode 32, and has the same degree of deviation (error) corresponding to the deviation of the position, shape, and size of the movable electrode 32 from the ideal value. Is assumed to have.

That is, since the inspection body 4 and the functional element 3 are formed by the same method at the same time, for example, when the positional displacement between the fixed electrode 31 and the movable electrode 32 occurs due to the displacement of the mask or the like during patterning. The distance and direction of the positional deviation are substantially the same as the distance and direction of the positional deviation that occurred between the first inspection film 41 and the second inspection film 42.
Similarly, for example, when the fixed electrode 31 is excessively etched, the degree to which the fixed electrode 31 is excessively etched and the degree to which the first inspection film 41 is excessively etched are substantially the same.

As described above, the functional element 3 and the inspection body 4 are affected to the same extent by the positional shift and the excessive or insufficient etching regardless of the size and shape. In particular, when the constituent materials of the first inspection film 41 and the fixed electrode 31 are the same and the constituent materials of the second inspection film 42 and the movable electrode 32 are the same, such a tendency becomes remarkable. .
For this reason, the dimensions of a predetermined part (hereinafter also referred to as “measured part”) of the inspection body 4 are used instead of the part (hereinafter also referred to as “desired measurement part”) where the original dimension of the functional element 3 is desired to be measured. By measuring, as will be described later, it is possible to estimate an error from the target value (design value) of the dimension of the desired measurement portion of the functional element 3, and to obtain the dimension of the desired measurement portion of the functional element 3. Can do.

In this step, first, the desired measurement site of the corresponding functional element 3 is determined before the measurement site of the test body 4 is determined. When the functional element 3 is viewed in plan, the desired measurement site is a line segment having two base points.
The desired measurement site of the functional element 3 is preferably a site that easily affects the frequency characteristics. For this reason, as an index for comprehensively judging the positional deviation between the fixed electrode 31 and the movable electrode 32 and the shape and size of the vibrating portion of the movable electrode 32 (particularly the movable plate 322), for example, FIG. b), the line A passing through the long side of the fixed electrode 31 on the movable electrode 32 side (left side in FIG. 2) is the line A, and the long side on the fixed electrode 31 of the movable electrode 32 (long side on the right side in FIG. 2). When the line passing through is defined as line B, it is conceivable to measure the distance between line A and line B. In this embodiment, a desired measurement site is defined between point A1 passing through line A and point B1 passing through line B. To do. When an error from the designed dimension occurs in such a desired measurement site and the position of the fixed electrode 31 and the movable electrode 32 is shifted or the size of the movable electrode 32 changes, the vibration part of the movable electrode 32 The mass and the mass distribution change greatly, and the frequency characteristics of the functional element 3 are greatly affected.

Next, the actual measurement part of the test body 4 corresponding to the desired measurement part of the functional element 3 is determined.
In the present embodiment, for the inspection body 4 provided in the vicinity of the functional element 3 shown in FIG. 3, one short side 411 (the short side on the left side in FIG. 3) of the first inspection film 41 as an actual measurement site, The distance from the long side 421 (the long side on the right side in FIG. 3) on the opposite side of the short side 411 of the second inspection film 42 is measured, and the point D and the long side 421 on the short side 411 are measured. Let it be an actual measurement site with the point E above as a base point. Such an actual measurement site is a line segment parallel to the desired actual measurement site described above. In addition, since the first inspection film 41 and the second inspection film 42 are used for the measurement, the first inspection film 41 in the measurement direction of the actual measurement part and the dimension measured in the actual measurement part are measured. The positional relationship with the second inspection film 42 is reflected, and the size and shape of the first inspection film 41 (deviation due to etching or the like due to formation) and the size of the second inspection film 42 are reflected. The deviation of the shape (the deviation of etching or the like due to the formation) is reflected. The point D described above is at the boundary between the first inspection film 41 and the substrate 2, and the point E is at the boundary between the second inspection film 42 and the first inspection film 41. These points can be clearly recognized and used as measurement base points.

  Further, when the designed dimension of the desired measurement site of the functional element 3 is A [μm] and the designed dimension of the actual measurement site of the test body 4 is B [μm], 0.1 ≦ A / B ≦ 1000 It is preferable to satisfy the relationship, and it is more preferable to satisfy the relationship of 1.0 ≦ A / B ≦ 10. Thereby, the error of the dimension of the functional element 3 can be grasped more accurately in the dimension to be measured of the inspection body 4.

By the way, it is conceivable to directly measure the dimensions of the functional element 3 itself.
However, when the functional element 3 is observed, when the distance between the line A and the line B is measured at the point A1 to the point B1 in FIG. 2B, the movable electrode 32 covers the fixed electrode 31 at the point A1. Therefore, the position becomes unclear. Further, when the distance between the line A and the line B is measured at a point B2 that is on the point A2 and the line B on the line A in FIG. In the movable electrode 32 formed by, for example, the corners of the movable electrode 32 are rounded, and it is difficult to accurately grasp the point B2 that is the intersection of the long side and the short side of the movable electrode 32.

  It is also conceivable to measure the distance between the line C formed by the connecting portion 323 of the movable electrode 32 and the line A instead of the line B. A line C is a boundary between the support portion 321 and the connection portion 323 of the movable electrode 32 formed on the fixed electrode 31 via the sacrificial layer 220. For this reason, the line C is arranged at a position reflecting the position of the fixed electrode 31. However, the line C in the functional element 3 is observed like a wrinkle, and a clear boundary cannot be determined.

In addition, a method of determining the shape and size of the functional element 3 by observing the entire functional element 3 is also conceivable, but the shape and size of the functional element 3 are set to have a frequency characteristic within a predetermined range. Since only a narrow range of error is allowed, it may be difficult to measure the error. For example, in such a case, observation is performed with a scale range (for example, 5 μm) that is too large for an allowable error (for example, ± 0.02 μm or less) of the dimension to be measured, and it is difficult to measure the error.
In addition, as means for observing the inspection body 4, observation means such as various electron microscopes, optical microscopes, CCD cameras, and the like can be used.

[Dimension measurement process]
Next, the designed value of the dimension of the desired measurement part of the functional element 3 is compared with the target dimension (designed dimension) of the actual measurement part and the measured dimension from the above measurement results. Error (dimension error) is estimated, and the dimension of the desired measurement site of the functional element 3 is obtained.
A comparison between the target (designed) dimension (Si [μm]) of the measurement site of the formed inspection body 4 and the measured dimension (Sa [μm]) is, for example, an error (Sa-Si [μm]). ]).

In the present embodiment, the dimensional error of the functional element 3 can be, for example, an error (Sa−Si [μm]) in the inspection body 4.
Moreover, the dimension of the desired measurement site | part of the functional element 3 is obtained by adding the dimension error of the functional element 3 to the designed dimension of the desired measurement site | part, for example.
The estimation of the frequency characteristic of the functional element 3 can be performed by referring to a function or a database regarding the dimension and frequency characteristic of the desired measurement site and applying the obtained dimension of the functional element 3 to these. The estimation of the frequency characteristic of the functional element 3 is performed, for example, by referring to a function or database regarding the dimensional error and frequency characteristic of the functional element 3 and applying the dimensional error of the functional element 3 to these functions. Also good.

  Moreover, in this embodiment, as above-mentioned, a pair of test body 4 is formed so that it may oppose through the functional element 3. FIG. For this reason, in the pair of inspection bodies 4, the arrangement angle of the movable electrode 32 with respect to the fixed electrode 31 is compared by comparing the positional relationship between the first inspection film 41 and the second inspection film 42 in each inspection body 4. Can be estimated. Thereby, stricter dimension management of the functional element 3 can be performed.

  Specifically, for example, an error in an actual measurement part of each inspection object 4 is calculated. If there is a difference between errors in the actually measured parts of the respective inspection bodies 4, it is estimated that the positional relationship between the first inspection film 41 and the second inspection film 42 is different between the two inspection bodies 4. Therefore, regarding the arrangement angle of the movable electrode 32 with respect to the fixed electrode 31, for example, whether the long side of the movable electrode 32 is parallel to the long side of the fixed electrode 31, and how much is the angle? Etc. can be estimated.

  As described above, the dimensions of the functional element 3 are reflected, and the dimensions of the functional element 3 can be obtained with high accuracy by using the dimensions of the inspection body 4 that allows easy measurement of the dimensions as a reference. Management becomes easier. As a result, the frequency characteristics of the functional element 3 can be easily grasped, and the cause can be analyzed when the performance of the functional element 3 is not sufficiently exhibited. The above method is particularly effective when the scale (number of digits) differs greatly between the designed dimension of the desired measurement site of the functional element 3 and the allowable dimension error range of the desired measurement site. is there.

In particular, even if the desired measurement site of the functional element 3 is a site that is difficult to measure, the dimensions of the desired measurement site can be obtained with high accuracy by measuring the corresponding actual measurement site of the test body 4.
In addition, when the dimension of the functional element 3 is not within the required range, or when the estimated frequency characteristic is not within the desired characteristic range, for example, the functional element 3 is recreated or a desired frequency is obtained as necessary. The functional element 3 having no characteristics can be discarded, or the functional element 3 can be adjusted so that the functional element 3 has a desired frequency characteristic. As an example of the adjustment method, there is a method in which a part of the movable plate 322 is removed by laser irradiation or the like to reduce the mass, and conversely a method in which a weight is applied to the movable plate 322 to increase the weight. The degree of increase / decrease in the weight of the movable plate 322 is determined from the obtained dimensions.

  Moreover, in this embodiment, although the said test body measurement process and error dimension estimation process were performed with respect to the board | substrate 1 with a functional element, you may perform these processes before removing the sacrificial layer 220. FIG. The sacrificial layer 220 is made of oxidized silicon and is very thin, so that it is optically transparent and does not affect the measurement of the dimensions of the inspection body 4. Does not affect the measurement of dimensions.

Next, the electronic device of the present invention will be described.
As shown in FIG. 5, the electronic device 500 includes a substrate 1 with functional elements and an element surrounding structure 5.
The element surrounding structure 5 is formed so as to define a cavity 6 in which the functional element 3 is disposed. Such an element surrounding structure 5 includes an interlayer insulating film 51 formed on the substrate 2 so as to surround the functional element 3, a wiring layer 52 formed on the interlayer insulating film 51, a wiring layer 52, and an interlayer insulating film. An interlayer insulating film 53 formed on the film 53; a wiring layer 54 formed on the interlayer insulating film 53 and having a covering layer 541 having a plurality of pores (openings); the wiring layer 54 and the interlayer insulating film; The surface protective film 55 formed on the surface 53 and the sealing layer 56 provided on the coating layer 541 are included.

  In such an element surrounding structure 5, as shown in FIG. 5, the inspection body 4 is provided outside the cavity 6 defined by the element surrounding structure 5, and includes an interlayer insulating film 51 and an interlayer insulating film 53. Buried. By disposing the inspection body 4 outside the cavity 6 in this manner, the functional element 3 is prevented from becoming a parasitic capacitance, and the functional element 3 is likely to vibrate at a desired frequency. The inspection body 4 has a sacrificial layer 220 between the first inspection film 41 and the second inspection film 42.

In addition, the element surrounding structure 5 having such a configuration is formed with an opening (not shown) partially missing. An electrode wiring (not shown) is connected to each of the fixed electrode 31 and the movable electrode 32 of the functional element 3, and these wirings are drawn out to the outside of the element surrounding structure 5 through the opening.
Further, when a defect occurs in the electronic device 500, the inspection body 4 is exposed by removing the interlayer insulating film 51 and the interlayer insulating film 53 by a method similar to a release process described later, if necessary. By measuring the predetermined part, the dimension of the functional element 3 can be obtained, and the cause of the malfunction of the electronic device 500 can be investigated. Further, when an optical device such as an optical microscope or a CCD camera is used for measurement, the measurement can be performed without exposing the specimen.
Next, a method for manufacturing the electronic device 500 as described above will be described. The electronic device 500 can be manufactured by performing the following steps.

[Insulating film formation process]
First, the substrate 1 with a functional element described above (provided that the sacrificial layer 220 as shown in FIG. 4F is not removed) is prepared.
Next, as shown in FIG. 6A, an interlayer insulating film 300 made of a silicon oxide film or the like is formed on the silicon nitride film 120, the functional element 3, and the inspection body 4 of the substrate 1 with a functional element by sputtering or CVD. Etc. are formed. Further, an annular opening 301 surrounding the functional element 3 in a plan view of the semiconductor substrate 100 is formed in the interlayer insulating film 300 by a patterning process (for example, a patterning process using a photoresist as described above). At this time, the patterning process is performed so that the inspection body 4 is outside the annular opening 301. Note that the opening 301 may not have an annular shape in plan view of the semiconductor substrate 100, and a part of the opening 301 may be missing.

  Next, as shown in FIG. 6B, a layer made of aluminum, for example, is formed on the interlayer insulating film 300 by sputtering, CVD, or the like, and then a wiring layer 310 is formed by patterning. The wiring layer 310 has an annular shape in plan view of the semiconductor substrate 100 so as to correspond to the opening 301. Further, a part of the wiring layer 310 is electrically connected to a wiring (wiring forming a part of a semiconductor circuit (not shown)) formed on and above the semiconductor substrate 100 through the opening 301. Note that the wiring layer 310 is formed so as to exist only in a portion surrounding the functional element 3, but in general, a part of the wiring layer constituting a part of a semiconductor circuit (not shown) is formed in the wiring layer 310. Is configured.

Next, as shown in FIG. 6C, an interlayer insulating film 320 made of a silicon oxide film or the like is formed on the interlayer insulating film 300 and the wiring layer 310 by a sputtering method, a CVD method, or the like. Further, an annular opening 324 surrounding the functional element 3 in a plan view of the semiconductor substrate 100 is formed in the interlayer insulating film 320 by a patterning process or the like. At this time, the patterning process is performed so that the inspection body 4 is outside the annular opening 324. Note that, like the opening 301, the opening 324 may not have an annular shape in plan view of the semiconductor substrate 100, and a part thereof may be missing.
Such a laminated structure of the interlayer insulating film and the wiring layer is formed by a normal CMOS process, and the number of laminated layers is appropriately set as necessary. In other words, more wiring layers may be stacked via an interlayer insulating film as necessary.

[Coating layer forming step]
As shown in FIG. 7A, a wiring layer 330 is formed by patterning after forming a layer made of, for example, aluminum on the interlayer insulating film 320 by sputtering, CVD, or the like. A part of the wiring layer 330 is electrically connected to the wiring layer 310 through the opening 324. A part of the wiring layer 330 constitutes a coating layer 331 that is located above the functional element 3 and in which a plurality of pores 332 are formed. Such a wiring layer 330 is generally constituted by a part of a wiring layer constituting a part of a semiconductor circuit (not shown), similarly to the wiring layer 310 described above.

  Next, as shown in FIG. 7B, a surface protective film 340 made of, for example, a silicon nitride film, a resist, or other resin material is formed on the wiring layer 330 and the interlayer insulating film 320 by sputtering, CVD, or the like. The surface protective film 340 is formed so as not to seal the pores 332 of the coating layer 331. The constituent material of the surface protective film 340 is not particularly limited as long as it has resistance to an etching process performed in a release process described later.

[Release process]
As shown in FIG. 7C, the interlayer insulating films 300 and 320 on the functional element 3 are removed through the plurality of pores 332 formed in the coating layer 331, and the fixed electrode 31 and the movable plate 322 are removed. The sacrificial layer 220 in between is removed. Thereby, the cavity 6 in which the functional element 3 is disposed is formed, and the fixed electrode 31 and the movable plate 322 are separated from each other, and the functional element 3 can be driven.

The interlayer insulating films 300 and 320 and the sacrificial layer 220 can be removed by, for example, wet etching that supplies hydrofluoric acid, buffered hydrofluoric acid, or the like as an etchant from the plurality of pores 332 or fluorine gas as an etching gas from the plurality of pores 332. The dry etching can be performed by supplying a hydrofluoric acid gas or the like.
Note that the inside of the cavity 6 may be cleaned.

[Sealing process]
Finally, as shown in FIG. 7D, a sealing layer 350 made of a silicon oxide film, a silicon nitride film, a metal film such as Al, W, Ti or the like is formed on the wiring layer 330 by sputtering, CVD, or the like. And each pore 332 is sealed.
The electronic device 500 can be manufactured through the steps as described above. Note that active elements such as MOS transistors included in the semiconductor circuit included in the electronic device 500, circuit elements such as capacitors, inductors, resistors, diodes, wirings, and the like are in the above-described appropriate steps (for example, insulating film forming step, covering layer forming) Step, sealing layer forming step) It can be made in the middle. For example, a gate insulating film, a capacitive dielectric layer, and an interlayer insulating film can be formed together with the interlayer insulating films 300 and 320, and an in-circuit wiring can be formed together with the wiring layers 310 and 330.
Further, such an electronic device 500 is divided into electronic devices for each functional element 3 by a dicing process or the like as necessary.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.
FIG. 8 is an enlarged plan view showing an inspection object provided in the substrate with functional elements according to the second embodiment of the present invention.
Hereinafter, the second embodiment of the present invention will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.
The second embodiment of the present invention is the same as the first embodiment described above except that the configuration of the test object is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

As shown in FIG. 8, the functional element-equipped substrate 1A includes an inspection body 4A.
The inspection body 4A includes a first inspection film 41A, a second inspection film 42A, and third inspection films 43A and 43B.
The first inspection film 41 </ b> A has a substantially rectangular shape and is arranged such that the long side direction is perpendicular to the long side direction on the movable plate 322 of the movable electrode 32.

The second inspection film 42A has a substantially rectangular shape, the long side direction is parallel to the long side direction on the movable plate 322 of the movable electrode 32, and the first inspection film 41A. It is arranged to be orthogonal.
The third inspection films 43A and 43B have the same shape as the second inspection film 42A, respectively, and face the second inspection film 42A so as to face the second inspection film 42A. They are arranged in parallel. The third inspection film 43A is disposed on the left side of the second inspection film 42A, and is provided directly on the substrate 2 so as not to overlap with the first inspection film 41. On the other hand, the third inspection film 43B is provided on the right side of the second inspection film 42A and is disposed so as to be orthogonal to the first inspection film 41A.

Further, the third inspection films 43A and 43B and the second inspection film 42A are provided with a predetermined interval according to the design rule in manufacturing the substrate with functional elements 1A.
The third inspection films 43A and 43B are made of the same material as the movable electrode 32 and the second inspection film 42A, and are formed by the same method as the movable electrode 32 and the second inspection film 42A. Is formed.

  Since the inspection body 4A includes the third inspection films 43A and 43B, the shape and size errors when the second inspection film 42A is formed are different from the shapes and sizes when the movable electrode 32 is formed. It becomes easier to deal with the error of the height. For example, the influence of the error due to the etching of the second inspection film 42A when the second inspection film 42A is formed is close to the influence of the error due to the etching of the movable electrode 32 when the movable electrode 32 is formed. As a result, the measurement accuracy of the dimension of the desired measurement site of the functional element 3 is improved.

In addition, when the desired measurement site | part of the functional element 3 is a site | part similar to 1st Embodiment, the measurement site | part in the test body 4A is one short side of the 1st test | inspection film | membrane 41 similarly to 1st Embodiment. The point F on the short side 411A and the point G on the long side 421A that can measure the distance between 411A and the long side 421A close to the short side opposite to the short side 411A of the second inspection film 42A And can be used as a base point.
According to the second embodiment as described above, the same effect as that of the first embodiment can be exhibited.

<Third Embodiment>
Next, a third embodiment of the present invention will be described.
FIG. 9 is a plan view showing a substrate with functional elements according to the third embodiment of the present invention.
Hereinafter, the third embodiment of the present invention will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.

The third embodiment of the present invention is the same as the first embodiment described above except that the configuration of the test object is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.
As shown in FIG. 9, the functional element-equipped substrate 1 </ b> B has two inspection bodies 4 </ b> B disposed to face each other with the functional element 3 interposed therebetween.
The inspection body 4B has a first inspection film 41B and a second inspection film 42B.

The first inspection film 41 </ b> B is substantially similar to the fixed electrode 31, has a substantially rectangular shape, and is arranged so that its long side is parallel to the long side of the fixed electrode 31.
The outer shape of the second inspection film 42B is substantially similar to that of the movable electrode 32, is substantially rectangular, has a long side parallel to the long side of the movable electrode 32, and has a long right side. The side 421B is disposed so as to overlap the first inspection film 41B so that the side 421B is disposed on the first inspection film 41B.

The second inspection film 42B has an opening 423B. The opening 423B has a substantially rectangular shape whose long side is parallel to the long side 421B. A part of the long side 412B on the left side of the first inspection film 41B is exposed from the opening 423B.
In this way, by using the inspection body 4B having a shape closer to the shape of the functional element 3, the measurement accuracy of the dimension of the desired measurement site of the functional element 3 is compared with the case where the inspection body 4 of the first embodiment is used. Will improve.

  When the desired measurement site of the functional element 3 is the same site as in the first embodiment, the actual measurement site in the test body 4B is the long side 412B of the first test film 41A exposed from the opening 423B. In order to measure the distance from the long side 421B of the second inspection film 42B, the point H on the long side 412B and the point I on the long side 421 can be used as base points. Note that the point H-point I, which is an actual measurement site of the inspection object 4B, is a location corresponding to the point A1-point B1, which is the desired measurement site of the functional element 3.

In addition, when the inspection body 4B has the same shape as the functional element 3, it is difficult to set the actual measurement site. However, since the inspection body 4B is provided with the opening 423B, the actual measurement site is preferably provided. Can be set.
According to the third embodiment as described above, the same effect as that of the first embodiment can be exhibited.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described.
10 is a plan view showing a substrate with functional elements according to the fourth embodiment of the present invention, FIG. 11 is a cross-sectional view (cross-sectional view taken along line x′-x ′) of the substrate with functional elements shown in FIG. FIG. 11 is an enlarged plan view of an inspection object provided in the substrate with functional elements in FIG. 10.

Hereinafter, the fourth embodiment of the present invention will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.
The fourth embodiment of the present invention is the same as the first embodiment described above except that the configuration of the functional element and the test object are different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

The functional element-equipped substrate 1C includes a functional element 3A formed on the substrate 2 and an inspection body 4C.
The functional element 3A includes a fixed electrode 31A formed on the substrate 2 and a movable electrode 32A.
The fixed electrode 31A has a substantially rectangular shape when seen in a plan view, and wiring (not shown) for electrical connection with other circuits is arranged from the vicinity of the center of one short side.
The movable electrode 32A has a substantially rectangular shape when seen in a plan view, and is arranged so as to be orthogonal to the fixed electrode 31A.

  The movable electrode 32A is configured near its short side, and a pair of support portions 321 formed on the nitride film 23 of the substrate 2 and a movable plate (movable portion) 322A arranged to face the fixed electrode 31A with a gap therebetween. And two connecting portions 323A that connect each supporting portion 321A and the movable plate 322A. The movable plate 322A is supported at both ends by the support portions 321A via the connection portions 323A.

  As shown in FIGS. 10 and 12, the inspection body 4C is provided at a position not in contact with the functional element 3A on the substrate 2, and has a first inspection film 41C and a second inspection film 42C. Yes. In addition, two inspection bodies 4C are disposed so as to face each functional element 3A in a direction parallel to the direction of the short side of the movable electrode 32A via the functional element 3A. In addition, said two test body 4C has the same structure.

The first inspection film 41C has a substantially rectangular shape when seen in a plan view, and is arranged such that its long side is parallel to the long side of the fixed electrode 31A. The first inspection film 41C is substantially similar to the fixed electrode 31A in its outer shape.
The second inspection film 42C has a substantially rectangular outer shape when viewed in plan, and is arranged so as to be orthogonal to and overlap with the first inspection film 41C. The outer shape of the second inspection film 42C is substantially similar to the movable electrode 32A in plan view.

  The second inspection film 42C has two openings 423C. Each of the openings 423C has a substantially rectangular shape whose long side is parallel to the long side 411C of the first inspection film 41C. Further, from the opening 423C on the left side, the long side 411C of the first inspection film 41C is exposed to the extent that it can be used as a base point for measuring dimensions. From the opening 423C on the right side, the long side 412C of the first inspection film 41C is exposed to the extent that it can be used as a dimensional measurement reference point.

Thus, by using the test body C having a shape close to the shape of the functional element 3A, the measurement accuracy of the dimension of the desired measurement site of the functional element 3A can be made relatively high.
In the present embodiment, as the desired measurement site of the functional element 3A, for example, in order to measure the distance between the long sides of the fixed electrode 31A, the point J on the left long side of the fixed electrode 31A and the right side The base point can be a point K on the long side. As described in detail in the first embodiment, the functional element 3A is manufactured by forming the fixed electrode 31A and forming the movable electrode 32A via the sacrificial layer 220 on the fixed electrode 31A. For this reason, in the functional element 3A, by measuring the distance between the point J and the point K of the fixed electrode 31A, the width of the fixed electrode 31A is measured and the movable electrode 32A formed on the fixed electrode 31A is measured. The width of the movable plate 322A is also indirectly measured. Accordingly, it is considered that the weight of the movable electrode 32A and the overlapping area of the movable electrode 32A and the fixed electrode 31A can be estimated to some extent, and the tendency of the frequency characteristics of the functional element 3A can be estimated.

  In addition, as an actual measurement part of the inspection body 4C corresponding to the measurement of the dimension of the desired measurement part, for example, for the purpose of measuring the distance between the long side 411C and the long side 412C of the first inspection film 41. The point L on the long side 411C and the point M on the long side 412C can be used as base points. Note that point L-point M, which is an actually measured part of the inspection object 4C, is a part corresponding to point J-point K, which is a desired measurement part of the similar functional element 3.

According to the fourth embodiment as described above, the same effect as that of the first embodiment can be exhibited.
As mentioned above, although this invention was demonstrated based on each embodiment of illustration, this invention is not limited to these. For example, the configuration of each unit can be replaced with any configuration having a similar function. Moreover, other arbitrary structures and processes may be added. In addition, the electronic device manufacturing method of the present invention may be a combination of any two or more configurations (features) of the above embodiments.
Further, for example, in the above-described embodiment, two inspection bodies are provided for each functional element. However, one or more inspection bodies may be provided on the substrate, and one inspection body is provided for each of the plurality of functional elements. An inspection body may be used.

1, 1A, 1B, 1C ... Substrate with functional element 2 ... Substrate 21 ... Semiconductor substrate 22 ... Insulating film 23 ... Nitride film 3, 3A ... Functional element 31, 31A ... Fixed electrode 32, 32A ... ... Moving electrodes 321, 321A ... Supporting parts 322,322A ... Moving plates 323,323A ... Connecting parts 4,4A, 4B, 4C ... Inspection bodies 41, 41A, 41B, 41C ... First inspection film 411, 411A: Short side 412B, 412C, 411C: Long side 42, 42A, 42B, 42C ... Second inspection film 421, 421A, 421B ... Long side 423B, 423C: Opening 43A, 43B …… Third test film 5 …… Element peripheral structure 51, 53 …… Interlayer insulating film 52, 54 …… Wiring layer 541 …… Coating layer 55 …… Surface protective film 56 …… Sealing layer 6 Cavity 100 ... Semiconductor substrate 110 ... Silicon oxide film 120 ... Silicon nitride film 200, 230 ... Silicon film 210, 240 ... Photoresist film 220 ... Sacrificial layer 300, 320 ... Interlayer insulating film 301, 324 ... Openings 310, 330 ... Wiring layer 331 ... Cover layer 332 ... Pore 340 ... Surface protective film 350 ... Sealing layer 500 ... Electronic device

Claims (10)

The size of the functional element with respect to the substrate with a functional element having a substrate and a functional element having a fixed electrode provided on the substrate and a movable electrode provided with a movable portion opposed to the fixed electrode with a gap therebetween A method of measuring
Simultaneously with the formation of the fixed electrode, a step of forming a first inspection film at a position not in contact with the fixed electrode on the substrate by the same method as the fixed electrode;
Simultaneously with the formation of the movable electrode, a step of forming a second inspection film on a portion of the substrate that is not in contact with the fixed electrode and the movable electrode by a method similar to the formation of the movable electrode;
Measuring a dimension of a predetermined part of an inspection body comprising the first inspection film and the second inspection film;
And a step of obtaining a dimension of a predetermined part of the functional element from the result of the measurement.   When the designed dimension of a predetermined part where the dimension of the functional element is required is A [μm], and the target dimension of the predetermined part to be measured of the test object is B [μm], 0.1 ≦ The measuring method of the dimension of the functional element of Claim 2 which satisfies the relationship of A / B <= 1000. Measuring the dimension of the predetermined part of the specimen parallel to the direction of the dimension of the predetermined part for which the dimension of the functional element is required,
The method for measuring a dimension of a functional element according to claim 1 or 2, wherein one end of the first inspection film and one end of the second inspection film are used for measuring the dimension of the inspection object. In the inspection body, the first inspection film having a substantially rectangular shape and the second inspection film having a substantially rectangular shape are orthogonal to each other,
The side of the first inspection film that does not overlap the second inspection film and the side of the second inspection film that overlaps the first inspection film and is further away from the side The method for measuring dimensions of a functional element according to any one of claims 1 to 3, wherein is used for measuring dimensions. The second inspection film is provided so as to overlap with the first inspection film, and has an opening formed so that at least a part of an end of the first inspection film is exposed. Have
5. The function according to claim 1, wherein an end portion of the first inspection film exposed from the opening and an end of the outer peripheral portion of the second inspection film are used for measurement of dimensions. Method for measuring element dimensions. The movable electrode is provided opposite to the fixed electrode, and has a pair of support portions that support the movable portion, and a pair of connection portions that connect the support portions and the movable portion,
The second inspection film is provided so as to overlap the first inspection film, and a first opening formed so that at least a part of one end of the first inspection film is exposed. And a second opening formed so that at least a part of the other end opposite to the one end of the first inspection film is exposed,
The one end of the first inspection film exposed from the first opening and the other end of the first inspection film exposed from the second opening are used for dimension measurement. Item 6. A method for measuring dimensions of a functional element according to any one of Items 1 to 5. On the substrate, two or more inspection bodies are formed for each functional element,
The method for measuring a dimension of a functional element according to any one of claims 1 to 6, wherein, among the two or more inspection bodies, a pair of the inspection bodies are formed so as to face each other with the functional element interposed therebetween. Forming a fixed electrode and a first inspection film on the substrate by a similar method;
Forming a movable electrode and a second inspection film on the substrate by the same method;
Have
The functional element constituted by the fixed electrode and the movable electrode is formed so as not to come into contact with the inspection body constituted by the first inspection film and the second inspection film,
The method of manufacturing a substrate with a functional element, wherein the inspection body is used for obtaining a dimension of a predetermined part of the functional element by measuring a dimension of the predetermined part. A substrate,
A functional element having a movable electrode that is disposed on the substrate and includes a fixed electrode provided on the substrate and a movable portion that is disposed to face the fixed electrode across a gap;
By measuring the dimension of the predetermined part, it has an inspection body for obtaining the dimension of the predetermined part of the functional element,
The inspection object is formed on the substrate at a position not in contact with the functional element by a first inspection film formed by the same method as the fixed electrode and a second method formed by the same method as the movable electrode. A substrate with a functional element, comprising: a test film.   The electronic device which has a board | substrate with a functional element of Claim 9.

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