JP2010219175A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure of an electronic component generating heat inside a housing of an on-vehicle electronic device, which is hard to be influenced by the vibrations or deformations of the housing and which can increase a heat radiation amount. <P>SOLUTION: In the electronic device wherein the electronic component generating heat is mounted on a substrate and the electronic component is coupled to a housing internal surface by a heat conduction member, the heat conduction member, which couples the electronic component generating heat to the housing internal surface, includes at least two members for one electronic component, a plurality of one-ends of the heat conduction member are connected so that heat conduction effectively operates on the electronic component generating heat, and the respective other side ends of the heat conduction member are fixed to mutually different surfaces of the housing internal surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to electronic devices such as car navigation and car audio.

  As a structure for dissipating heat by mounting electronic components that generate heat inside, a structure shown in Japanese Patent No. 2930923 has been proposed.

Japanese Patent No. 2930923

  Japanese Patent No. 2930923 discloses a technique for spreading the heat of an electronic component mounted on a substrate and generating heat to the surface of a portable electronic device casing.

  The configuration of this document will be described. First, a flexible pressing member having substantially the same outer shape and size as those of the electronic component and the package is attached to the surface of the casing. Next, the pressing member and the inner surface of the housing are widely covered and adhered in two perpendicular directions with two belt-like heat conductive sheets. Finally, the heat-generating electronic component mounted on the electronic board is pressed from above the heat conductive sheet covered on the pressing member.

  With the above configuration, the heat generated in the electronic component can be transmitted to the two heat conductive sheets and spread over a wide area of the housing. As described above, Patent Document 1 intends to reduce the maximum temperature of an electronic component by spreading heat generated by the electronic component that generates heat to the housing surface.

  However, in terms of heat dissipation performance, the previous housing in which the heat conductive sheet divided into a plurality of electronic components is in close contact is the surface of the housing that faces the wiring board on which the electronic components are mounted. Therefore, there has been a problem that the amount of heat radiation cannot be increased by increasing the heat radiation area as compared with a heat conductive sheet that is not divided into a plurality of parts.

  Further, regarding the followability to the deformation of the casing, in the above invention, the displacement of the casing surface in the vertical direction can be absorbed by the elasticity of the flexible pressing member, and the pressing to the electronic component is possible. The influence of force can be reduced. For example, in the modification of a mobile phone or the like, the influence on electronic components such as a flat package arranged in parallel with a relatively wide back surface in the housing can be reduced.

  However, there is a problem that the deformation in the direction parallel to the surface of the housing is limited to a range in which the heat conductive sheet that is adhered can be deformed.

  The object of the present invention is to provide an excellent heat radiation performance by increasing the heat radiation area from the housing, without applying excessive pressing force to the electronic components even when deformation, vibration, etc. during running are applied An object of the present invention is to provide an electronic device having an improved performance.

  In the electronic device in which an electronic component that generates heat is mounted on a substrate inside the housing, and the electronic component and the inner surface of the housing are connected by a heat conducting member, the electronic component that generates heat and the inner surface of the housing are The heat conducting member to be connected is composed of at least two members for one electronic component, and one end of the two or more heat conducting members is thermally connected to the heat generating electronic component, respectively. The opposite end of the heat conducting member is thermally connected and fixed to the inner surface of the housing.

  Thus, one end of the plurality of heat conducting members is connected to the heat generating electronic component so that the heat conducting action is effective, and the opposite end of each of the heat conducting members is connected to a different surface of the inner surface of the housing. Therefore, the electronic components that generate heat inside the housing are less susceptible to the vibration and deformation of the housing, and the heat dissipation of the electronic device that can increase the amount of heat dissipation becomes possible.

  According to the present invention, even when deformation, vibration, or the like during traveling is applied, the electronic component is not subjected to excessive pressing force, the connection portion is excellent in reliability, and the heat dissipation performance is increased by increasing the heat dissipation area from the housing. It is possible to provide an electronic device with improved performance.

It is a longitudinal cross-sectional view of the car navigation of 1st Example by this invention. It is a cross-sectional view of the car navigation system of the first embodiment according to the present invention. It is a cross-sectional view of the vicinity of the electronic component for explaining the first embodiment according to the present invention. It is a figure explaining the external appearance of an in-dash type car navigation, and the attachment method to a vehicle body. It is a longitudinal cross-sectional view explaining the subject in a prior art. It is a cross-sectional view of the car navigation system of the second embodiment according to the present invention. It is a cross-sectional view of the car navigation of the third embodiment according to the present invention. It is a longitudinal cross-sectional view of the car navigation system of 4th Example by this invention. It is a transverse cross section explaining the effect in the simple type car navigation of the 5th example by the present invention. It is a cross-sectional view of the car navigation of the sixth embodiment according to the present invention. It is a longitudinal cross-sectional view of the car navigation of 7th Example by this invention. It is a cross-sectional view of the car navigation system of the eighth embodiment according to the present invention. It is a cross-sectional view of the car navigation of the ninth embodiment according to the present invention. It is a cross-sectional view of the car navigation system according to the tenth embodiment of the present invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

First, an example of a mounting form of a general vehicle-mounted electronic device targeted by the present invention will be described with reference to FIG.
FIG. 4 is a perspective view of a general on-vehicle electronic device.
In FIG. 4, the car navigation 1 (common name: in-dash type) embedded and mounted in the console panel of the vehicle has an external structure as shown in FIG. 4. In the front part, there is a display 11 with a touch panel for displaying map information for road guidance to the driver, video of a TV or a DVD (Digital Versatile Disc), etc. when stopped.
On the back side, there is a harness connector in which a large number of wires for connecting sensors such as a power source and a vehicle speed signal (not shown) are bundled. On the side surfaces 12 and 13, mounting and fixing brackets 120 and 130 according to the vehicle manufacturer and the type of the vehicle body are attached.

Next, a method of attaching the in-dash type car navigation related to the present invention to the vehicle body will be described. When the console panel on the vehicle side (not shown) is removed, standard dimensions (1 DIN [German Industrial Standard: Deut]
sches Institut fur Normung]: width 180 mm, height 50 mm, 2 DIN: width 180 mm, height 100 mm).

  A plurality of harness connectors 81 extending from the vehicle side are connected to connectors on the back side of the car navigation 1, and the car navigation 1 is inserted into the storage unit 8. Next, the car navigation 1 is fastened and fixed to the mounting portion 83 of the vehicle body with a plurality of mounting screws 82 from the front portion. Finally, the installation of the vehicle body of the car navigation is completed by attaching the panel of the console part which has a hole in the display 11 part on the surface side and enhances the design of the vehicle.

  The characteristic internal structure of the present invention will be described with reference to FIGS.

FIG. 1 is an in-vehicle electronic device including an embodiment of the present invention, and is a cross-sectional view taken along line AA in FIG.
2 is a cross-sectional view taken along the line BB in FIG.
1 and 2, for example, a DVD drive 21, a hard disk drive 22 that stores map information, and a plurality of multilayer boards 3 on which a large number of electronic components are mounted are mounted at a high density in the housing of the car navigation 1. ing.

  On the substrate 3, an electronic component 4 having a large calorific value and other electronic components are mounted by performing arithmetic processing such as changing map information. The electronic component 4 is a component in which, for example, an LSI chip is housed in a ceramic or resin flat package and connected to the substrate 3 by a solder ball (BGA: ball grid array) 41 to input and output signals together with power feeding.

  Next, features of the present invention will be described. On the upper surface side of the package of the electronic component 4, a heat conducting member 61 having an L-shaped cross section cut by a cross section parallel to the cross section of FIG. 1 is attached via a flexible heat conducting sheet 51. On the further upper surface of the heat conducting member 61, a heat conducting sheet 52 is attached, and the heat conducting member 62 is adhered thereto. The ends 610 and 620 of the heat conducting members 61 and 62 opposite to the vicinity of the electronic components are fixed to the inner surfaces of the side surfaces 13 and 12 with screws, respectively.

  That is, the heat conducting members 61 and 62 are cantilever beams having the side surfaces 13 and 12 as support portions, respectively. The heat conductive sheets 51 and 52 are preferably provided with an adhesive sheet, and the electronic component 4 and the heat conductive member 61, and the heat conductive members 61 and 62 are preferably bonded to each other, but only one side is an adhesive sheet, and the other side is a surface. If the accuracy is high, a configuration in which only surface contact is made may be used. Further, the heat conductive sheet may be indefinite as long as it has a relatively high heat conductivity and is more elastic and flexible than a heat conductive member, such as a paste-like heat conductive grease containing a filler having a high heat conductivity. good. Furthermore, there is no heat conductive sheet, and the electronic component 4, the heat conductive member 61, and the heat conductive member 62 may be slidable in contact with each other with high surface accuracy.

Next, the operation of the present invention will be described with reference to FIGS.
When the car navigation is activated by setting the engine key of the car to I (ACC) or II (ON), the electronic component 4 is energized and starts to generate heat. Further, when the processing load such as the search for map information increases due to the use of the user, the amount of heat generation increases, and if there is no heat dissipation structure, the temperature will continue to rise until it is damaged.

  Therefore, in the configuration according to the present invention, the heat conductive sheet 51 is attached to the upper surface of the package of the electronic component 4, and the heat generated in the electronic component is transmitted to the heat conductive member 61. The heat conducting member 61 is made of a material having a relatively high thermal conductivity such as aluminum or copper alloy, and the heat is guided to the end 610 on the low temperature side on the opposite side. Since the end portion 610 is fixed to the inner surface of the side surface 13 with a plurality of screws, heat is transferred to the side surface 13. On the other hand, another heat conductive sheet 52 is attached on the heat conductive member 61 on the upper surface of the electronic component 4 to bond the heat conductive member 62.

  As a result, the heat conducting member 62 can also guide the heat from the electronic component 4 to the low temperature side end portion 620 via the heat conducting sheet 52 and transmit it to the inner surface of the side surface 12, similarly to 61. The heat transmitted to the side surfaces 12 and 13 is dissipated by convection of air in the console section and radiation to the low temperature section. Further, the heat on the housing surface is transmitted from the brackets 120 and 130 shown in FIG. 4 to the vehicle chassis via the mounting portion 83 of the storage portion, and is finally radiated from the chassis to the air inside and outside the vehicle. In addition, if a heat conductive sheet is interposed between the inner surfaces of the side surfaces 12 and 13 and the heat conducting member end portions 610 and 620, the contact heat resistance of this portion can be reduced, and the heat radiation amount can be further increased. it can.

  FIG. 2 shows a structure in which the fan 9 is provided on the rear surface 14 side of the car navigation 1. In general, even if a high-performance car navigation system has a fan structure, it may be difficult to improve heat dissipation performance. Specifically, the front part of the car navigation is not provided with a large opening from the viewpoint of improving the design and preventing dust from entering. Therefore, air can flow into the housing main body only from a small gap 111 formed by the main body and the display 11 or the like. In addition, there is a case where it is difficult to ensure the air volume because the mounting density of components is high and the air flow path is narrow. As a result, the convection effect due to air in the vicinity of the electronic component is small and effective heat dissipation is difficult.

  In addition, in the DVD drive 21 or the like, in order to prevent a user from touching a disk that has become hot when a disk is inserted or removed, the housing of the DVD drive 21 is not heated by heat generated from the electronic component 4 or the like. In some cases, the heat dissipation path from the electronic component 4 to the housing is restricted.

  In that respect, as in the present invention, the heat generated in the electronic component 4 is guided by heat conduction members 61 and 62 to different side surfaces of the housing by heat conduction, whereby a heat radiation path can be defined. Thus, a wider heat radiation area can be effectively utilized than the heat radiation to one housing surface of the housing, and the electronic component 4 can be effectively cooled.

  In the case of assembling a plurality of substrates 3, DVD drives 21 and the like from the lower side in the apparatus having the configuration shown in FIG. 1, heat conduction is performed without significantly increasing the height of the electronic component 4 and the electronic component 4 in the plane direction. Since the members 61 and 62 are configured, the lower surface of the DVD drive 21, the electronic component 4, and the heat conducting members 61 and 62 do not physically interfere with each other. Therefore, problems such as management of assembly accuracy in the gap between the heat conducting member and the bottom surface of the DVD drive can be avoided.

Next, the operation of the present invention when the vehicle starts traveling will be described with reference to FIGS. 1, 2, and 3.
FIG. 3 is an enlarged sectional view of the vicinity of the electronic component for explaining the first embodiment.
In FIG. 3, as the vehicle travels, vibration and deformation occur in the vehicle main body console portion depending on the operation of the engine and the road surface condition. Due to this vibration and deformation, the side surfaces 12 and 13 of the car navigation that fasten the case side portion with the vehicle console as shown in FIG. 4 are subjected to compressive force and tensile force.

FIG. 5 is a longitudinal sectional view of an in-vehicle electronic device for explaining the problems of the prior art.
As shown in FIG. 5, as in the invention of FIGS. 1 and 2, for the purpose of improving the performance by increasing the heat radiation area, a heat conducting member in contact with the electronic component 4 is integrally provided so as to connect the side surfaces 12 and 13. Let us assume a so-called doubly supported beam configuration.

  As shown by the arrows in FIG. 5, when a compressive force is applied from both side surfaces of the housing, the metallic heat conducting member 63 bends and causes elastic deformation in the vertical direction of the paper as indicated by the broken lines in the drawing. When the deformation force is small, the displacement deflected by the heat conductive sheet 50 including the heat insulating layer interposed between the heat conductive member 63 and the electronic component 4 can be absorbed. However, when the amount of deformation is large, although an external force is partially absorbed due to elastic deformation of the heat conductive sheet, an excessive external force is applied to the electronic component 4 mechanically connected to the heat conductive member 63. If this external force is significant, the fine solder balls 41 may be damaged or the internal circuit of the electronic component package may be damaged. Further, it is conceivable that the same phenomenon occurs when the heat conducting member 63 expands due to a temperature change at rest.

  On the other hand, the structure of the present invention shown in FIG. 1 and FIG. 2 can prevent the influence of deformation of the casing due to external force on the electronic component by the configuration described below.

  FIG. 3 shows details of the positional relationship between the electronic component 4, the heat conducting member 61, and the heat conducting member 62. A broken line in the figure shows a state in which the displacement in the directions 611 and 612 is caused by an external force. The displacements 611 and 612 due to the compressive force and tensile force on the side surface of the housing can be absorbed by deformation in the shear direction of the heat conductive sheets 51 and 52 having a heat insulating layer that is more elastic and flexible than the heat conductive member. Here, the most important feature of the present invention is that the two heat conducting members 61 and 62 are not mechanically fastened. As a result, it is possible to produce a relative displacement relative to each other and to prevent an increase in pressing force on the electronic component 4.

  Note that the pressing force of the heat conducting members 61 and 62 against the electronic component 4 can be arbitrarily set by selecting the longitudinal elastic modulus and thickness of the material and fixing them in advance to the inner surface of the side casing in a predetermined positional relationship. is there.

  Furthermore, by setting the pressing force of the heat conducting member 62 higher than the pressing force due to the elasticity of the heat conducting member 61, the two heat conducting members can be stably pressed against the electronic component 4.

  Thus, according to the configuration of the present invention, it is possible to effectively and stably dissipate heat from an electronic component that generates heat without being affected by vibration or deformation during vehicle travel.

FIG. 6 is a cross-sectional view of a car navigation system provided with the second embodiment.
6, the invention in FIG. 1 shows the heat radiation structure to both sides of the car navigation housing, but in the invention in FIG. 6, the end portion 620 of one heat conducting member 62 is fixed to the inner surface on the back surface 14 side. is doing. With such a configuration, the housing surface on the back side can be used as a heat radiating surface, and at the same time, heat can be radiated using the heat conducting member 62 itself as a heat sink (enlarged heat conducting surface).
That is, the heat transfer rate of the upper and lower surfaces of the heat conducting member 62 can be increased by the fast air flow 91 in the vicinity of the fan 9. In addition, heat can be dissipated outside the housing by making use of a portion having a relatively larger space volume than the back and side surfaces of the console storage portion 8.

  In addition, although not shown, when one end of the inner surface fixed side of the heat conducting member 62 is attached near the back of the display 11 at the front of the case, the air intake port of the case is in the vicinity. The heat radiation effect by the convection of the coldest air immediately after being sucked into the housing by the operation of 9 can be expected.

FIG. 7 is a cross-sectional view of a car navigation system provided with the third embodiment.
7 differs from the invention of FIG. 6 in that the heat conductive members 61 and 62 are bonded to each other with a gap 64 on the same plane of the upper surface of the heat conductive sheet 53 attached to the upper surface of the electronic component 4. is there. The gap 64 is set in such a size that the heat conducting members 61 and 62 do not interfere with each other at the maximum deformation of the assumed housing in consideration of assembly. With such a configuration, the heat conduction member shown in FIG. 1 can be made thinner than the configuration in which the electronic component 4 overlaps the upper part. Further, when the thickness equal to that in FIG. 1 can be allowed, the thickness of each heat conducting member can be made thicker than that in FIG. 1, so that the heat resistance of the heat conducting member portion is reduced and the heat radiation amount is increased. be able to.

  In FIG. 7, the heat conducting members 61 and 62 are shown as being fixed at right angles to the side surface 13 and the back surface 14 side, but they are opposed to each other in the side surface direction or the front surface and the back surface direction while ensuring a gap 64. The effect of the present invention can be achieved even if the configuration is arranged from the direction of the movement.

FIG. 8 is a longitudinal sectional view of the car navigation system according to the fourth embodiment.
In FIG. 8, the heat conducting members 61 and 62 have a bimetallic structure in which a plurality of metals 61a and 61b having different linear expansion coefficients are bonded together as in 62a and 62b. With such a configuration, even when the temperature of the heat conducting members 61 and 62 is detected and deforms itself, and the casing itself that fixes the end portion is thermally deformed, the heat conducting member is applied to the electronic component 4 with an optimum force. 61 and 62 can be pressed. For example, when an iron plate is assumed for the housing, the linear expansion coefficient of iron is 12 (× 10 ⁻⁶ / K). In this case, if the deformation of the substrate is ignored, a temperature distribution is generated in the heat conducting members 61 and 62 due to a temperature rise due to heat generation of the electronic component 4. Since the surface close to the electronic component 4 side is high in temperature, the elongation is large and the elongation on the opposite side is small. Therefore, the pressing force of the heat conducting member to the electronic component 4 tends to be small.

Therefore, the upper surface sides 61b and 62b of the heat conducting member are made of aluminum having a relatively large linear expansion coefficient of 23 (× 10 ⁻⁶ / K), while the heat conducting member members 61a and 62a on the lower surface side have a linear expansion coefficient of 17. By constituting with (× 10 ⁻⁶ / K) copper, the free end to which the electronic component 4 is attached can be deformed downward due to temperature rise, and a pressing force can be generated on the electronic component.

FIG. 9 is a cross-sectional view of a simplified car navigation system having a fifth embodiment.
FIG. 9 shows a structure in which the configuration shown in FIG. 6 of the present invention is applied to a simple car navigation system (PND: personal navigation device). Simple car navigation is a simple function car navigation without a DVD drive or the like, and is characterized by small size and light weight. For this reason, the main body is often fixed on the dashboard of the vehicle or the inner surface of the windshield by using the dedicated mounting bracket 93 in the mounting hole 92 on the back surface.

  In FIG. 9, the heat conducting member 62 is guided and fixed to the back surface 14. With this configuration, heat radiation by natural convection from the back surface 14 away from the user side close to the display 11 can be promoted, and the heat transmitted to the back surface 14 can be radiated to the outside by heat conduction through the mounting bracket 93. It becomes possible. Even in this case, effective heat dissipation is possible while reducing the influence of external force on the electronic component 4 against vibration and deformation.

FIG. 10 is a cross-sectional view of the car navigation system according to the sixth embodiment.
In FIG. 10, the heat conducting member 62 is configured so as not to interfere with an electronic component 42 such as a capacitor having a high component height mounted on the substrate 3. With such a configuration, the cross-sectional area of the heat conducting member 62 is partially reduced, so that the heat conduction characteristics are slightly affected. However, restrictions on mounting electronic components can be suppressed, and the board mounting design can be There is an effect that the degree of freedom of design is improved such as being able to be separated to some extent.

FIG. 11 is a longitudinal sectional view of the car navigation system according to the seventh embodiment.
In FIG. 11, only predetermined portions of the heat conducting members 61 and 62 overlapping on the upper surface of the electronic component 4 are thinned. With such a configuration, the heat dissipation structure can be thinned, interference with other components can be avoided, and the degree of freedom of mounting is improved. In the figure, the heat conducting member 61 is composed of one component, but the effect of the present invention can be achieved even if the thin plate portion and the thick portion are combined. Further, the heat conducting member may be bent in the longitudinal direction and have a step.

FIG. 12 is a cross-sectional view of the car navigation system of the eighth embodiment.
In FIG. 12, the end portion 610 of the heat conducting member 61 and the end portion 620 of the heat conducting member 62 are extended to the vicinity of brackets 120 and 130 attached to the outer surfaces of the side surfaces 12 and 13, respectively. With such a configuration, heat transmitted from the heat conducting members 61 and 62 can be transported to the brackets 120 and 130 with low thermal resistance. Furthermore, if the side surfaces 12 and 13 are partly cut and the heat conducting member end 610 and the bracket 130 are directly fastened by screws, heat radiation from the heat conducting member to the vehicle chassis side is further reduced. A route can be realized.

  As described above, according to the present invention, in an electronic device incorporating an electronic component that generates heat inside the housing, the electronic component is not easily affected by vibration or deformation of the housing that occurs as the vehicle travels. In addition, it is possible to provide a heat dissipation structure for an electronic component that increases the heat dissipation amount by increasing the heat dissipation area from the housing.

FIG. 13 is a cross-sectional view of the car navigation system of the ninth embodiment.
In FIG. 13, in the invention from FIG. 1 to FIG. 12, the heat conduction member is shown connected to the side surface, front surface, and back surface of the housing. In the invention of FIG. 13, it is an example of connecting to the upper surface of the housing and using it as a heat dissipation surface. Although the length of the heat conducting member 62 is increased by such a structure, effective heat radiation is possible when connection to the side surface portion is difficult. The present invention is also effective when connected to the lower surface of the housing.

FIG. 14 is a cross-sectional view of the car navigation system of the tenth embodiment.
In FIG. 14, in the invention from FIG. 1 to FIG. 13, the heat conducting member is shown as a structure made of a highly rigid material such as metal. In the present embodiment, as shown in FIG. 14, a material having a high thermal conductivity such as a graphite sheet or a rubber containing carbon is interposed between 61 c and 62 c of a part of the heat conducting member. With such a configuration, the deformation at this portion is facilitated, and a larger deformation can be absorbed, so that the external force on the electronic component 4 can be kept small.

DESCRIPTION OF SYMBOLS 1 Car navigation 3 Board | substrate 4, 42 Electronic component 8 Storage part 9 Fan 11 Display 12, 13 Side surface 14 Back surface 21 DVD drive 22 Hard disk drive 41 Solder ball 51, 52 Thermal conduction sheet 61, 62 Thermal conduction member 64 Gap 81 Connector 82 Attachment Screw 83 Mounting portion 91 Air flow 92 Mounting hole 93 Mounting bracket 111 Display portion gap 120, 130 Brackets 610, 620 End portions 611, 622 Displacement

Claims (14)

In an electronic device in which an electronic component that generates heat is mounted on a substrate inside the housing, and the electronic component and the inner surface of the housing are connected by a heat conducting member,
The heat conducting member that connects the electronic component that generates heat and the inner surface of the housing is composed of at least two rigid members for one electronic component, and ends of the two or more heat conducting members. Is thermally connected to the electronic component that generates heat, and the opposite end located on the opposite side of the end of each heat conducting member is thermally connected and fixed to the inner surface of the housing. An electronic device. The electronic device according to claim 1.
The electronic device that generates heat is connected to a plurality of surfaces on the inner surface of the housing via the two or more heat conducting members. The electronic device according to claim 1.
The electronic device, wherein the heat conducting member that connects the electronic component that generates heat and the inner surface of the housing overlaps each other on an upper surface of the electronic component. The electronic device according to claim 1.
The heat conducting member that connects the electronic component that generates heat and the inner surface of the housing is thermally connected to the upper surface of the electronic component so as to face each other with a predetermined gap on the upper surface of the electronic component. Electronic device characterized. The electronic device according to claim 1.
The electronic device is characterized in that the heat conducting member is formed by bonding metals having different linear expansion coefficients. The electronic device according to claim 1.
The electronic device is characterized in that the heat conducting member is formed in a shape that avoids a space where an electronic component mounted on the substrate exists. The electronic device according to claim 1.
The electronic device according to claim 1, wherein a thickness of the heat conducting member in a direction perpendicular to a surface thermally connected to the electronic component is thinner at the end portion than at the opposite end portion. The electronic device according to claim 1.
The electronic device according to claim 1, wherein the opposite end portion of the heat conducting member is disposed in a mounting portion of a mounting bracket on the outer surface of the housing. The electronic device according to claim 1.
2. The electronic device according to claim 1, wherein the opposite end portions of the two or more heat conducting members are fixed to different surfaces of the inner surface of the housing through a member that is more flexible than the heat conducting member. The electronic device according to claim 1.
The electronic device is characterized in that the end portions of the two or more heat conducting members are bonded onto the electronic component via a member that is more flexible than the heat conducting member. The electronic device according to claim 9-10.
The electronic device, wherein the flexible member is a heat conductive sheet or a heat conductive grease. The electronic device according to claim 1.
The electronic apparatus is an in-vehicle electronic apparatus. The electronic device according to claim 1.
The heat conducting member is made of a material in which metals having different linear expansion coefficients are bonded together, and the metal on the side farther from the side near the electronic component side that generates heat has a higher coefficient of linear expansion on the metal. An electronic device characterized by the above. The electronic device according to claim 1.
The electronic device according to claim 1, wherein the heat conducting member includes an elastic body at least partially.

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