JP2010212561A - Laser oscillator and laser beam machine - Google Patents

Abstract

An object of the present invention is to provide a laser oscillation apparatus and a laser processing machine apparatus that can improve machining performance, are inexpensive and have high reliability.
A switching element 5 constituting a high voltage power supply 4 is fixed to a heat radiating structure 7, and the heat radiating structure 7 is cooled by circulating a cooling medium 8 having a temperature lower than the ambient temperature of the high voltage power supply 4 inside. The switching element 5 has a lead terminal 6 connected to the electric circuit 9 on the same surface, and the lead terminal 6 of the switching element 5 is pulled out vertically or at an angle of 45 to 90 with respect to the horizontal. It is attached to the heat dissipating structure 7 so as to be less than 5 degrees.
[Selection] Figure 1

Description

  The present invention relates to a laser oscillation device and a laser processing machine using a gas as a laser medium.

  2. Description of the Related Art In recent years, laser oscillators and laser processing machines are widely used for cutting and welding of various materials and shapes because of the feature that a workpiece can be processed in a non-contact manner and with little thermal influence.

  Conventionally, a laser oscillation apparatus having a high-voltage power source constituted by switching elements as shown in FIG. 8 has been used. Hereinafter, a description will be given with reference to FIG.

  As shown in the figure, the conventional laser oscillation device is an optical resonance constituted by a discharge tube 1 made of a dielectric having a laser gas disposed therein, and a reflecting mirror 2a and a partial reflecting mirror 2b disposed at both ends of the discharge tube 1. 2, an electrode 3 provided on the discharge tube 1 for discharging the laser gas in the discharge tube 1, and a high voltage power source 4 connected to the electrode 3 to supply electric power.

  The high voltage power supply 4 obtains a high voltage of several tens of kV required for discharge excitation from a commercial 200 V voltage or the like, and is generally composed of an inverter using a switching element 30 such as a transistor and a step-up transformer.

  A plurality of the switching elements 30 are used to form an inverter, and the heat dissipating structure 7 that fixes the switching elements 30 circulates a cooling medium 8 having a temperature lower than the ambient temperature of the high voltage power supply 4 to cool the structure. A cooling unit is provided.

  In addition, a module product in which one or a plurality of switching elements 30 are collectively molded with a resin is often used for the convenience of manufacturing and assembling. The module component of the switching element 30 is isolated from the atmosphere by resin-molding the switching element and the wiring connection between them and the control signal, and also condenses the distance between the lead terminal for connection to the electric circuit of the switching element 30 and the heat radiation surface. In the case where there are a plurality of lead terminals of the switching element 30, the distance between the lead terminals can also be separated, and electrical insulation is easily secured.

  In some cases, the switching element 30 does not employ the module product and constitutes a high-voltage power supply (see, for example, Patent Document 1).

In this case, an electromagnetic valve is provided in the piping path of the cooling medium to be circulated in the heat dissipation structure, and the solenoid valve is opened / closed according to the temperature of the heat dissipation structure to prevent overcooling of the switching element and to prevent condensation. This prevents a decrease in electrical insulation due to the above.
Utility Model Registration No. 2592675

  In the conventional laser oscillation device or laser processing machine, when the operation speed of the switching element 30 of the high voltage power supply 4 is to be increased, switching is performed in order to cope with an increase in the amount of heat generated with the improvement of the operation speed. The heat dissipating structure 7 for fixing the element 30 has a structure in which a cooling medium 8 having a temperature lower than the ambient temperature of the high-voltage power supply 4 is circulated therein to cool the switching element. 30 and the surface of the heat radiating structure 7 have dew condensation, and this dew adheres between the lead terminals, lowers the electrical insulation, and may cause a failure.

  In addition, when a solenoid valve is provided in the cooling medium piping path to open and close the solenoid valve according to the temperature of the heat dissipation structure and prevent condensation, the addition of the solenoid valve and solenoid valve opening / closing control circuit makes the device expensive. In addition, periodic maintenance of the solenoid valve is necessary, which has a problem in practical use.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a laser oscillation device and a laser processing machine device that can improve machining performance and are inexpensive and highly reliable.

  In order to solve the above problems, the present invention comprises a discharge tube in which a laser gas is disposed, an electrode provided in the discharge tube, and a high voltage power source for supplying power to the electrode, and constitutes the high voltage power source. A switching element is fixed to the heat dissipation structure, the heat dissipation structure includes a cooling unit that circulates a cooling medium having a temperature lower than the ambient temperature of the high-voltage power supply, and the switching element includes an electric circuit. A lead terminal to be connected is provided on the same surface, and the lead terminal of the switching element is attached to the heat radiating structure so that the lead direction of the switching element is vertical or less than 45 degrees with respect to the horizontal. is there.

  With this configuration, the lead terminal of the switching element is attached to the heat dissipating structure so that the direction from which the lead terminal of the switching element is drawn is 45 to less than 90 degrees with respect to the vertical or horizontal. The generated water droplets are dripped along the lead terminals and no water droplet retention occurs, which is effective for ensuring electrical insulation.

  With the above configuration, the present invention can be used without causing damage to a non-molded switching element that is inexpensive and operates at high speed even when condensation occurs, improves the processing performance of the laser oscillator and the laser processing machine, and is inexpensive and reliable. It is possible to provide a laser oscillation apparatus and a laser processing machine apparatus with high height.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 are explanatory diagrams of a laser oscillation apparatus according to an embodiment of the present invention, and FIG. 7 is an explanatory diagram of a laser beam machine according to an embodiment of the present invention.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to FIG.

  The discharge tube 1, the optical resonator 2, the electrode 3, and the high voltage power supply 4 have the same configuration as the conventional ones, and are denoted by the same reference numerals and description thereof is omitted.

  The features of this embodiment will be described below.

  As shown in FIG. 1, the switching element 5 constituting the high voltage power supply 4 is fixed to a heat radiating structure 7, and the heat radiating structure 7 contains a cooling medium 8 having a temperature lower than the ambient temperature of the high voltage power supply 4 inside. The switching element 5 has a structure in which it is circulated and cooled, and the switching element 5 has a lead terminal 6 provided on the same surface for connection to an electric circuit, and the lead-out direction of the switching element 5 is vertical. It is attached to the structure 7 for heat dissipation.

  The operation of the laser oscillation apparatus configured as described above will be described.

  Since the temperature T1 of the cooling medium 8 circulating inside the heat dissipation structure 7 and the ambient temperature T2 of the high-voltage power supply 4 have a relationship of T1 <T2, the operation of the switching element 5 is for heat dissipation depending on the stop state or the like. When the structure 7 is sufficiently cooled by the cooling medium 8 and the surface temperature T3 of the heat dissipation structure 7 is in a relationship of T3 <T2 with respect to the ambient temperature T2 and is a humid atmosphere, the difference in saturated water vapor amount As a result, condensation occurs on the surface of the heat dissipation structure 7 and on the surface of the switching element 5 in a cooled state.

  This condensation forms water droplets over time, grows and begins to drip in the direction of gravity. However, it stays if there is an obstacle in the structure in the direction of gravity.

  Since the lead terminal 6 of the switching element 5 is generally not covered with an insulating coating, if the water droplet retention occurs in the vicinity of the electric circuit connection lead terminal 6, there is a risk of causing an electrical insulation failure.

  However, according to the present embodiment, since the lead terminal 6 of the switching element 5 is attached to the heat radiating structure 7 so that the lead-out direction of the lead terminal 6 is vertical, water droplets due to the condensation are dripped along the lead terminal 6. Water droplet retention does not occur and electrical insulation can be ensured.

(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to FIG.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1 and the past, and the description is abbreviate | omitted.

  The feature of the second embodiment shown in FIG. 2 is that the drawing direction of the electric circuit connection lead terminal 6 of the switching element 5 constituting the high-voltage power supply 4 is from 45 degrees to less than 90 degrees with respect to the horizontal. It is attached to the structure 7 for heat dissipation.

  When water droplets are generated due to the condensation, the water droplets flow along the lead terminals 6 of the switching element 5 and the lead terminal 6 is pulled out in an angle of 45 degrees to less than 90 degrees with respect to the horizontal. Therefore, the water droplets dripped from the lead terminal 6 reach the surface of the heat dissipation structure 7 and then flow along the surface of the heat dissipation structure 7, so that the switching element 5 and the surrounding electric circuit It is possible to prevent water droplets from staying in and to ensure electrical insulation.

(Embodiment 3)
A third embodiment of the present invention will be described below with reference to FIG.

  In addition, the same code | symbol is attached | subjected about Embodiment 1, 2 and the same structure as the past, and the description is abbreviate | omitted.

  The feature of the third embodiment shown in FIG. 3 is that the position of the electric circuit connected to the lead terminal 6 of the switching element 5 constituting the high-voltage power supply 4 is as follows. 6 is prohibited from being placed at a position other than vertically below, that is, placed below the lead terminal 6 vertically.

  With this configuration, even when water droplets condensed along the switching element 5 and the lead terminal 6 flow, they do not drop on the electric circuit, and electrical insulation can be ensured.

(Embodiment 4)
Embodiment 4 of the present invention will be described below with reference to FIG.

  Note that the same reference numerals are given to the same configurations as in the first to third embodiments and the related art, and the description thereof is omitted.

  The feature of the fourth embodiment shown in FIG. 4 is that it is horizontal with respect to a part of the connection wiring path of the electric circuit 9 connected to the lead terminal 6 of the switching element 5 constituting the high-voltage power supply 4. It is to provide a configuration with an elevation angle of 0 degree or more.

  With this configuration, even if water droplets condensed along the switching element 5 and the lead terminal 6 flow, the water droplets temporarily stay in a component having an elevation angle of 0 ° or more with respect to the horizontal of the connection wiring path, and then drop in the direction of gravity. Therefore, water drops do not reach the electric circuit 9, and electrical insulation can be ensured.

(Embodiment 5)
Embodiment 5 of the present invention will be described below with reference to FIG.

  In addition, the same code | symbol is attached | subjected about Embodiment 1 to 4 and the same structure as the past, and the description is abbreviate | omitted.

  A feature of the fifth embodiment shown in FIG. 5 is that a bending configuration with an angle of 90 degrees or less is used as a connection wiring path of the electric circuit 9 connected to the lead terminal 6 of the switching element 5 constituting the high-voltage power supply 4. It is to have established.

  With this configuration, even when water droplets condensed along the switching element 5 and the lead terminal 6 flow, the water droplets are temporarily retained at the bent component portion of the connection wiring path at an angle of 90 degrees or less, and then dropped in the direction of gravity. When the circuit 9 has a wiring material that does not reach the circuit 9 and can be bent at an angle of 90 degrees or less, electrical insulation can be ensured.

  It should be noted that a plurality of lead terminals 6 of the switching element 5 constituting the high voltage power supply 4 are provided, all of the plurality of lead terminals 6 of the switching element 5 and a plurality of connections of electric circuits connected to the lead terminals 6 of the switching element 5. By arranging so that the relative positions of all of the plurality of lead terminals 6 of the switching element 5 and all of the plurality of connection wiring paths of the electric circuit do not overlap in the vertical direction in a range where at least the electric charging part of the wiring path is exposed. Even if water droplets condensed along one lead terminal 6 flow, they do not drop on the other electric circuit connection lead terminals 6 and the connected electric circuit, and electrical insulation can be ensured.

  Further, for each of the above-described configurations, at least the lead terminal 6 of the switching element 5 constituting the high-voltage power supply 4 or an electric circuit connected to the lead terminal 6 with an electrical insulator having a low moisture permeation amount for the purpose of preventing condensation. It is not necessary to cover the connection wiring path, that is, it is not covered with an electrical insulating material that prevents dew condensation, so that the production cost can be reduced, and it is inexpensive and does not interfere with ensuring electrical insulation. Can be configured.

  Further, in the configuration in which the distance between the lead terminals 6 of the switching element 5 constituting the high voltage power supply 4 is 3 mm or more, a higher density and smaller switching element can be developed and adopted, and also in the growth of water droplets due to condensation. It can be dripped before short-circuiting between the plurality of electrical circuit connection lead terminals 6 to ensure electrical insulation.

(Embodiment 6)
Embodiment 6 of the present invention will be described below with reference to FIG.

  In addition, about the same structure as Embodiment 1-5 and the past, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The feature of the sixth embodiment shown in FIG. 6 is that the switching element 5 constituting the high-voltage power supply 4 is mounted on a plurality of the heat dissipating structures 7 so as to overlap each other in the vertical direction. By adding to the configurations of Embodiments 1 to 5, electrical insulation is ensured, a high-density configuration is possible, and the high-voltage power supply 4 can be reduced in size at low cost.

(Embodiment 7)
A laser beam machine according to Embodiment 7 of the present invention will be described below with reference to FIG.

  As shown in FIG. 7, the laser beam 10 is reflected by the reflecting mirror 15 and guided to the vicinity of the workpiece 16. The laser beam 10 is condensed into a high-density energy beam by a condensing lens 18 provided inside the torch 17, irradiated onto the workpiece 16, and processed. The workpiece 16 is fixed on the machining table 19, and the torch 17 is moved relative to the workpiece 16 by the X-axis motor 20 or the Y-axis motor 21, whereby a predetermined shape is machined.

  The feature of the seventh embodiment is that the laser processing apparatus described in the first to sixth embodiments is used for the laser processing machine described above, so that it can be stably used continuously even in a humid environment. High laser processing machine can be obtained.

  INDUSTRIAL APPLICABILITY The present invention is useful as a highly reliable laser oscillation device and laser processing machine that can be used without causing failure of a non-molded switching element that is inexpensive and operates at high speed even in a humid environment where condensation occurs.

Explanatory drawing of the laser oscillation apparatus in Embodiment 1 of this invention Explanatory drawing of the laser oscillation apparatus in Embodiment 2 of this invention Explanatory drawing of the laser oscillation apparatus in Embodiment 3 of this invention Explanatory drawing of the laser oscillation apparatus in Embodiment 4 of this invention Explanatory drawing of the laser oscillation apparatus in Embodiment 5 of this invention Explanatory drawing of the laser oscillation apparatus in Embodiment 6 of this invention Explanatory drawing of the laser processing machine in Embodiment 7 of this invention Illustration of conventional laser oscillator

DESCRIPTION OF SYMBOLS 1 Discharge tube 2 Optical resonator 3 Electrode 4 High voltage power supply 5 Switching element 6 Lead terminal 7 Structure for heat dissipation 8 Refrigerant 9 Electric circuit 10 Laser beam 15 Reflection mirror 16 Work 17 Torch 18 Condensing lens 19 Processing table 20 X axis motor 21 Y-axis motor

Claims (8)

A discharge tube in which a laser gas is disposed; an electrode provided in the discharge tube; and a high-voltage power supply that supplies power to the electrode, and fixing a switching element that constitutes the high-voltage power supply to a heat dissipation structure, The heat dissipating structure has a cooling unit for circulating a cooling medium having a temperature lower than the ambient temperature of the high-voltage power source, and the switching element is provided with a lead terminal connected to an electric circuit on the same surface, A laser oscillation device attached to the heat dissipation structure so that a lead terminal of the switching element is pulled out vertically. A discharge tube in which a laser gas is disposed; an electrode provided in the discharge tube; and a high-voltage power supply that supplies power to the electrode, and fixing a switching element that constitutes the high-voltage power supply to a heat dissipation structure, The heat dissipating structure has a cooling unit for circulating a cooling medium having a temperature lower than the ambient temperature of the high-voltage power source, and the switching element is provided with a lead terminal connected to an electric circuit on the same surface, A laser oscillation device attached to the heat dissipation structure such that a lead terminal drawing direction of the switching element is 45 to less than 90 degrees with respect to the horizontal. The laser oscillation device according to claim 1 or 2, wherein the electric circuit is disposed at a position other than vertically below the lead terminal as a position of the electric circuit connected to the lead terminal. 4. The laser oscillation device according to claim 1, wherein a connection wiring path of an electric circuit connected to the lead terminal is configured such that a part of the connection wiring path has an elevation angle of 0 degrees or more with respect to the horizontal. . The laser oscillation device according to any one of claims 1 to 4, wherein a connection wiring path of an electric circuit connected to the lead terminal has a bending configuration with an angle of 90 degrees or less. A plurality of the lead terminals, and the lead terminals and the leads within a range where at least the electric charging portion is exposed among all the lead terminals and a plurality of connection wiring paths of the electric circuit connected to the lead terminals. The laser oscillation device according to any one of claims 1 to 5, wherein a relative position of a plurality of connection wiring paths of an electric circuit connected to a terminal is arranged so as not to overlap in a vertical direction. The laser oscillation device according to any one of claims 1 to 6, wherein a plurality of the switching elements are attached to the heat dissipation structure so as to overlap each other in the vertical direction. 8. A laser according to claim 1, a machining table on which a workpiece is placed, drive means for moving at least one of the movement of the machining table and a laser machining torch, a numerical controller for controlling the drive means, and the laser according to claim 1. Laser processing machine equipped with an oscillation device.

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