JP2010212379A - Electronic component module, and method of manufacturing the same - Google Patents

Abstract

An electronic component module having high airtightness and high reliability and a method for manufacturing the same are provided.
A substrate 2 made of an insulator, a SAW device chip 10 flip-chip mounted on the upper surface of the substrate 2, a chip component 12 mounted on the upper surface of the substrate 2, and at least one of electrodes of the chip component 12; Sealing solder 18 for sealing the SAW device chip 10 and the chip component 12, a lid 16 provided on the SAW device chip 10, the chip component 12 and the sealing solder 18, and the chip component And an insulator 20 provided between the upper surface of 12 and the lid 16.
[Selection] Figure 1

Description

  The present invention relates to an electronic component module and a manufacturing method thereof, and more particularly to an electronic component module in which a device chip is flip-chip mounted on a substrate and a manufacturing method thereof.

  In recent years, with the demands for electronic components to be smaller, lower cost, and higher functionality, not only device chips but also so-called chip components such as chip inductors, chip capacitors, and chip resistors are mounted on the substrate to achieve high integration. The electronic component module which aimed at is used. If such an electronic component module has adhesion of foreign matter or intrusion of moisture from the outside, the function of the device chip may be impaired. In particular, when the device chip is an acoustic wave device such as a SAW device chip (Surface Acoustic Wave) or an FBAR (Film Bulk Acoustic Resonator), the characteristics are likely to deteriorate. In order to suppress deterioration of characteristics, a technique for sealing a device chip is used.

  Patent Document 1 discloses a technique in which a SAW chip and a solder component are mixedly mounted on a substrate and sealed with a resin side wall and a resin lid. Patent Document 2 discloses a technique in which a SAW chip and a solder component are mixedly mounted on a substrate, and only the SAW chip is sealed with a resin side wall and a resin lid.

JP 2002-76832 A JP 2002-84155 A

  However, the sealing with the resin side wall and the resin lid is not sufficiently airtight, so that the reliability of the electronic component module may be reduced. In addition, since sealing with resin makes it difficult to block influences from external radio waves, characteristics deterioration may occur particularly in high frequency electronic component modules.

  In view of the above problems, an object of the present invention is to provide an electronic component module having high airtightness and high reliability and a method for manufacturing the same.

  The present invention provides a substrate made of an insulator, a device chip flip-chip mounted on the upper surface of the substrate, a chip component mounted on the upper surface of the substrate, and at least one of the electrodes of the chip component. A sealing solder for sealing the device chip and the chip component, a lid provided on the device chip, the insulator and the sealing solder, and an upper surface of the chip component and the lid An electronic component module comprising an insulator provided therebetween. According to the present invention, it is possible to provide an electronic component module having high airtightness and high reliability.

  The said structure WHEREIN: The said insulator can be set as the structure provided in the whole surface of the said chip component. According to this configuration, it is possible to insulate the chip component from the device chip, the lid, and the sealing solder.

  The said structure WHEREIN: The said insulator is provided in the upper surface of the said chip component, It can be set as the structure by which the space is formed between the said chip component, the said device chip, and the said sealing solder. According to this configuration, it is possible to insulate the chip component from the device chip, the lid, and the sealing solder.

  In the above configuration, the height from the upper surface of the substrate to the upper surface of the insulator may be higher than the height from the upper surface of the substrate to the upper surface of the device chip. According to this configuration, the contact between the chip component and the lid can be suppressed by the insulator. Further, since the sealing solder is disposed on the upper surface of the device chip, the sealing solder functions as a shield.

  The said structure WHEREIN: It can be set as the structure which comprises the metal film provided in the surface facing the said board | substrate of the said lid. According to this configuration, since the metal film functions as a shield for protecting the device chip and the chip component, the reliability of the electronic component module is improved.

  The said structure WHEREIN: The said lid can be set as the structure which consists of metals. According to this configuration, since the lid functions as a shield for protecting the device chip and the chip component, the reliability of the electronic component module is improved.

  In the above configuration, the device chip may be an acoustic wave device chip. According to this configuration, since the acoustic wave device chip is hermetically sealed with the sealing solder, it is possible to suppress deterioration of the characteristics of the acoustic wave device chip.

  The present invention includes a step of flip-chip mounting a device chip on an upper surface of a substrate made of an insulator, a step of mounting a chip component on the upper surface of the substrate, a step of providing an insulator on at least the upper surface of the chip component, Sealing the device chip and the chip component with sealing solder so as to be separated from at least one of the electrodes of the chip component; and a lid on the device chip, the insulator, and the sealing solder. And a step of providing the electronic component module. ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an electronic component module with high airtightness and high reliability can be provided.

  The said structure WHEREIN: The process of providing the said insulator can be set as the structure which is a process of providing the said insulator on the whole surface of the said chip component. According to this configuration, it is possible to insulate the chip component from the device chip, the lid, and the sealing solder.

  In the above configuration, the step of providing the insulator is a step of providing the insulator on the top surface of the chip component, and the step of sealing is performed between the chip component and the device chip and the sealing solder. It can be set as the structure which is the process of sealing so that space may be formed. According to this configuration, it is possible to insulate the chip component from the device chip, the lid, and the sealing solder.

  In the above configuration, the step of providing the insulator includes a step of providing a mask around the upper surface of the device chip and the upper surface of the substrate, and a step of providing the insulator on the upper surface of the mask and the upper surface of the chip component. And a step of removing the mask. According to this configuration, the insulator can be accurately formed in a desired region by a simple process.

  According to the present invention, it is possible to provide a highly airtight and highly reliable electronic component module and a method for manufacturing the same.

FIG. 1 is a cross-sectional view illustrating an electronic component module according to the first embodiment. FIG. 2A to FIG. 2D are cross-sectional views illustrating the method for manufacturing the electronic component module according to the first embodiment. FIG. 3 is a cross-sectional view illustrating an electronic component module according to the second embodiment. FIG. 4A and FIG. 4B are cross-sectional views illustrating a method for manufacturing an electronic component module according to the second embodiment. FIG. 5 is a cross-sectional view illustrating an electronic component module according to the third embodiment. FIG. 6A to FIG. 6C are cross-sectional views illustrating a method for manufacturing an electronic component module according to the third embodiment. FIG. 7 is a cross-sectional view illustrating an electronic component module according to the fourth embodiment.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view illustrating an electronic component module according to the first embodiment.

  As shown in FIG. 1, a SAW device chip 10 is flip-chip mounted on the upper surface of a substrate 2 made of an insulator such as ceramic using bumps 8 made of metal such as Au. Further, for example, two chip components 12 are mounted on the upper surface of the substrate 2 by using solder 14 made of, for example, Sn-Ag. The SAW device chip 10 and the chip component 12 are spaced apart. Further, the two chip components 12 are arranged apart from each other. The bump 8 and the electrode 4 made of metal such as Au provided on the upper surface of the substrate 2 are connected. The solder 14 and the electrode 4 are connected. An insulator 20 made of, for example, an epoxy resin is provided on the entire surface of the chip component 12. In other words, the insulator 20 covers the entire surface of the chip component 12. Further, the insulator 20 and the surface of the chip component 12 are in contact with each other.

  The SAW device chip 10, the chip component 12, and the insulator 20 are sealed with a sealing solder 18 made of, for example, Sn—Ag. In other words, the insulator 20 is provided between the chip component 12 and the sealing solder 18. The sealing solder 18 is bonded to the sealing pattern 6 made of a metal such as Au provided on the upper surface of the substrate 2. On the SAW device chip 10, the insulator 20, and the sealing solder 18, a lid 16 made of a metal such as Kovar is provided. In other words, the insulator 20 is provided between the chip component 12 and the lid 16. Further, the substrate 2 and the lid 16 are joined by a sealing solder 18. Further, a protective film 22 made of a metal such as Ni is provided on the surfaces of the sealing solder 18 and the lid 16. The electrode 4, the bump 8 and the solder 14 are separated from the sealing solder 18. In other words, the SAW device chip 10 and the chip component 12 are not electrically connected to the sealing solder 18 and the lid 16 and are insulated.

  A height H1 from the upper surface of the substrate 2 to the upper surface of the SAW device chip 10 is, for example, 0.2 mm, and a height H2 from the upper surface of the substrate 2 to the upper surface of the chip component 12 is, for example, 0.3 mm. Further, the thickness of the insulator 20 on the chip component 12 is, for example, several tens of μm.

  Next, a method for manufacturing the electronic component module according to the first embodiment will be described. FIG. 2A to FIG. 2D are cross-sectional views illustrating the method for manufacturing the electronic component module according to the first embodiment.

  As shown in FIG. 2A, first, the chip component 12 is connected to the electrode 4 provided on the upper surface of the substrate 2 using the solder 14. In other words, the chip component 12 is mounted on the upper surface of the substrate 2.

  Next, as shown in FIG. 2B, the SAW device chip 10 is mounted on the electrode 4 provided on the upper surface of the substrate 2 by using the bumps 8. In other words, the SAW device chip 10 is flip-chip mounted on the upper surface of the substrate 2. In addition, you may implement the process of Fig.2 (a), and the process of FIG.2 (b), changing order.

  As shown in FIG. 2C, an insulator 20 made of, for example, an epoxy resin is provided on the entire surface of the chip component 12. The step of providing the insulator 20 is performed by a potting step, for example. In addition, the sealing solder 18 is disposed on the substrate 2, the SAW device chip 10, and the insulator 20. A lid 16 is disposed further above the sealing solder 18. While the sealing solder 18 is heated to, for example, 270 ° C., the sealing solder 18 and the lid 16 are pressurized. By this step, the melted sealing solder 18 flows on the sealing pattern 6 and seals the SAW device chip 10, the chip component 12, and the insulator 20.

  As shown in FIG. 2D, the lid 16 is provided on the SAW device chip 10, the insulator 20 and the sealing solder 18. After the step of FIG. 2D, a protective film 22 made of, for example, Ni is formed on the surfaces of the sealing solder 18 and the lid 16 by, for example, plating. Through the above steps, the electronic component module according to the first embodiment is completed as shown in FIG.

  According to the first embodiment, since the SAW device chip 10 and the chip component 12 are sealed with the sealing solder 18, the airtightness is higher than when sealing with resin. Further, since the insulator 20 covers the chip component 12, the chip component 12 and the SAW device chip 10, the sealing solder 18, and the lid 16 can be insulated. Further, the sealing solder 18 functions as a shield that shields the SAW device chip 10 and the chip component 12 from external radio waves and the like. For this reason, the reliability of an electronic component module improves. That is, according to the first embodiment, an electronic component module having high airtightness and high reliability can be realized.

  Further, since the lid 16 is made of metal, it functions as a shield. Therefore, the reliability of the electronic component module is improved as compared with the case where the resin lid is used.

  In Example 1, the insulator 20 is provided by a potting process. For this reason, the insulator 20 can be provided on the entire surface of the chip component 12 by a simple process to insulate the chip component 12 from the SAW device chip 10 and the sealing solder 18.

  Since the insulator 20 is provided, even when the height H2 from the upper surface of the substrate 2 to the upper surface of the chip component 12 is higher than the height H1 from the upper surface of the substrate 2 to the upper surface of the SAW device chip 10, Contact between the component 12 and the lid 16 is suppressed. Further, since the sealing solder 18 is disposed on the upper surface of the SAW device chip 10 and the shielding effect is further enhanced, H2 is preferably higher than H1.

  The protective film 22 may not be provided, but is preferably provided in order to protect the electronic component module from an external impact or temperature. The sealing pattern 6 is preferably formed of a metal having high wettability with respect to solder.

  Next, Example 2 will be described. FIG. 3 is a cross-sectional view illustrating an electronic component module according to the second embodiment. The description of the same configuration as that described above is omitted.

  As shown in FIG. 3, a plate-like insulator 20 made of, for example, epoxy resin and having a thickness T1 of several tens of μm, for example, is provided in contact with the upper surface of the chip component 12. Next, a method for manufacturing an electronic component module according to Example 2 will be described. FIG. 4A and FIG. 4B are cross-sectional views illustrating a method for manufacturing an electronic component module according to the second embodiment. The process before FIG. 4A is the same as the process illustrated in FIGS. 2A and 2B of the first embodiment.

  As shown in FIG. 4A, the insulator 20 is provided on the upper surface of the chip component 12. In addition, the sealing solder 18 is disposed on the substrate 2, the SAW device chip 10, and the insulator 20. A lid 16 is disposed further above the sealing solder 18. While the sealing solder 18 is heated to, for example, 270 ° C., the sealing solder 18 and the lid 16 are pressurized. By this step, the melted sealing solder 18 flows on the sealing pattern 6 and seals the SAW device chip 10, the chip component 12, and the insulator 20. At this time, a space is formed between the chip component 12 and the solder 14 and the SAW device chip 10 and the sealing solder 18 due to the surface tension of the molten sealing solder 18. A space is also formed between the two chip components 12.

  As shown in FIG. 4B, the lid 16 is provided on the SAW device chip 10, the insulator 20 and the sealing solder 18. After the step of FIG. 4B, a protective film 22 made of, for example, Ni is formed on the surfaces of the sealing solder 18 and the lid 16 by, for example, plating. Through the above steps, the electronic component module according to Example 2 illustrated in FIG. 3 is completed.

  According to the second embodiment, similarly to the first embodiment, an electronic component module having high airtightness and high reliability can be realized. Further, since surface tension is generated in the sealing solder 18, the sealing solder 18 can be prevented from contacting the chip component 12 and the solder 14 by adjusting the arrangement of the sealing pattern 6. That is, a space is formed between the chip component 12 and the solder 14 and the SAW device chip 10 and the sealing solder 18. Thereby, even when the insulator 20 is not provided on the entire surface of the chip component 12, it is possible to insulate the chip component 12 from the SAW device chip 10 and the sealing solder 18.

  The insulator 20 may be fixed on the chip component 12 with an adhesive. Alternatively, the insulator 20 may be formed of a sticky material and fixed on the chip component 12 using the stickiness of the material itself.

  Next, Example 3 will be described. FIG. 5 is a cross-sectional view illustrating an electronic component module according to the third embodiment. The description of the same configuration as that described above is omitted.

  As shown in FIG. 5, the entire surface of the chip component 12 is covered with an insulator 20 having a thickness T2 of several tens of μm, for example. In other words, the insulator 20 is formed in layers. Next, a method for manufacturing an electronic component module according to Example 3 will be described. FIG. 6A to FIG. 6C are cross-sectional views illustrating a method for manufacturing an electronic component module according to the third embodiment. In addition, the process before FIG. 6A is the same as the process illustrated in FIGS. 2A and 2B of the first embodiment.

  As shown in FIG. 6A, a mask 24 is provided on the upper surface of the sealing pattern 6 and the upper surface of the SAW device chip 10. Further, the insulator 20 is applied to the upper surface of the chip component 12 and the upper surface of the mask 24.

  As shown in FIG. 6B, the mask 24 is removed. Thereby, the sealing pattern 6 and the insulator 20 on the SAW device chip 10 are removed together with the mask 24. Further, the insulator 20 remains on the upper surface of the chip component 12. In addition, the sealing solder 18 is disposed on the substrate 2, the SAW device chip 10, and the insulator 20. A lid 16 is disposed further above the sealing solder 18. While the sealing solder 18 is heated to, for example, 270 ° C., the sealing solder 18 and the lid 16 are pressurized. By this step, the melted sealing solder 18 flows on the sealing pattern 6 and seals the SAW device chip 10, the chip component 12, and the insulator 20.

  As shown in FIG. 6C, the lid 16 is provided on the SAW device chip 10, the insulator 20 and the sealing solder 18. After the step of FIG. 6C, a protective film 22 made of, for example, Ni is formed on the surfaces of the sealing solder 18 and the lid 16 by, for example, plating. Through the above steps, the electronic component module according to the second embodiment illustrated in FIG. 5 is completed.

  According to the third embodiment, similarly to the first embodiment, an electronic component module having high airtightness and high reliability can be realized. Further, after the insulator 20 is provided over the entire surface, the insulator 20 together with the mask 24 is removed from the upper surface of the sealing pattern 6 and the upper surface of the SAW device chip 10. For this reason, the insulator 20 can be accurately provided in a desired region by a simple process. In addition, since the insulator 20 is provided on the entire surface of the chip component 12, the chip component 12 can be insulated from the SAW device chip 10 and the sealing solder 18. The insulator 20 is applied, but may be provided by other methods such as a spray method.

  Next, Example 4 will be described. FIG. 7 is a cross-sectional view illustrating an electronic component module according to the fourth embodiment. The description of the same configuration as that described above is omitted.

  As shown in FIG. 7, for example, a metal film 26 made of a metal such as Kovar is formed on the surface of the lid 16 made of an insulator such as an epoxy resin, which faces the substrate 2, more specifically on the surface facing the upper surface of the substrate 2. Is provided.

  The manufacturing method of the electronic component module according to the fourth embodiment is the same as that illustrated in FIGS. 2A to 2D except that the lid 16 provided with the metal film 26 is used.

  According to the fourth embodiment, even when the lid 16 is made of an insulator, the metal film 26 provided on the lid 16 functions as a shield that shields the SAW device chip 10 and the chip component 12 from external radio waves and the like. For this reason, the reliability of an electronic component module improves.

  The fourth embodiment is an example in which the metal film 26 is provided on the lid 16 in the first embodiment, but the present invention is not limited to this. That is, in the second or third embodiment, the metal film 26 may be provided on the lid 16. Further, if the metal film 26 is provided on a part of the surface of the lid 16 facing the substrate 2, it functions as a shield. However, in order to further enhance the effect as a shield, it is preferable that the metal film 26 is provided on the entire surface of the lid 16 facing the substrate 2.

  In each embodiment, the sealing solder 18 is not in electrical contact with the chip component 12, but may be in contact with the ground electrode of the chip component 12. That is, the sealing solder 18 may be separated from at least one of the electrodes of the chip component 12.

  In the first, third, and fourth embodiments, the insulator 20 covers the entire surface of the chip component 12 (see FIGS. 1, 5, and 7), whereas in the second embodiment, the insulator 20 is on the upper surface of the chip component 12. Provided (see FIG. 3). That is, the insulator 20 may be provided on at least the upper surface of the chip component 12.

  In Examples 1, 3 and 4, the sealing solder 18 remains between the insulator 20 and the lid 16 (see FIGS. 1, 5 and 7). On the other hand, in Example 2, the sealing solder 18 does not remain between the insulator 20 and the lid 16 (see FIG. 3). Whether the sealing solder 18 remains depends on the strength of the force pressing the lid 16. According to the embodiment, the airtightness and reliability of the electronic component module can be improved regardless of the presence or absence of the sealing solder 18 between the insulator 20 and the lid 16.

  In each embodiment, the device chip is an SAW device chip. However, the device chip may be an elastic wave device chip such as a boundary acoustic wave device chip or an FBAR. The device chip may be a device chip other than the acoustic wave device chip. In particular, in the case of an acoustic wave device chip, deterioration of characteristics is suppressed by hermetic sealing. In addition, the number of chip components 12 mounted on the substrate 2 is two, but may be one or three or more. Further, two or more device chips may be mounted.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

Board 2
Electrode 4
Sealing pattern 6
Bump 8
SAW device chip 10
Chip parts 12
Solder 14
Lid 16
Sealing solder 18
Insulator 20
Mask 24
Metal film 26

Claims (11)

A substrate made of an insulator;
A device chip flip-chip mounted on the upper surface of the substrate;
Chip components mounted on the upper surface of the substrate;
Sealing solder for sealing the device chip and the chip component so as to be separated from at least one of the electrodes of the chip component;
A lid provided on the device chip, the chip component and the sealing solder;
An insulator provided between the upper surface of the chip component and the lid;
An electronic component module comprising:   2. The electronic component module according to claim 1, wherein the insulator is provided on the entire surface of the chip component.   2. The electronic component module according to claim 1, wherein the insulator is provided on an upper surface of the chip component, and a space is formed between the chip component and the device chip and the sealing solder.   4. The electronic component module according to claim 1, wherein a height from an upper surface of the substrate to an upper surface of the insulator is higher than a height from an upper surface of the substrate to an upper surface of the device chip. .   5. The electronic component module according to claim 1, further comprising a metal film provided on a surface of the lid facing the substrate. 6.   6. The electronic component module according to claim 1, wherein the lid is made of metal.   7. The electronic component module according to claim 1, wherein the device chip is an acoustic wave device chip. Flip chip mounting a device chip on the top surface of an insulating substrate;
Mounting a chip component on the upper surface of the substrate;
Providing an insulator on at least the upper surface of the chip component;
Sealing the device chip and the chip component with sealing solder so as to be separated from at least one of the electrodes of the chip component;
And a step of providing a lid on the device chip, the insulator and the sealing solder.   9. The method of manufacturing an electronic module according to claim 8, wherein the step of providing the insulator is a step of providing the insulator on the entire surface of the chip component. The step of providing the insulator is a step of providing the insulator on the upper surface of the chip component,
9. The electronic component module according to claim 8, wherein the sealing step is a step of sealing so that a space is formed between the chip component and the device chip and the sealing solder. Production method.   The step of providing the insulator includes a step of providing a mask around the upper surface of the device chip and the upper surface of the substrate, a step of providing the insulator on the upper surface of the mask and the upper surface of the chip component, and the mask. The method of manufacturing an electronic component module as described in any one of Claims 8 to 10 characterized by including the process of removing.

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