JP2010207879A - Laser beam machining method and laser beam machining apparatus - Google Patents

Abstract

An object of the present invention is to provide a laser processing method and a laser processing apparatus that can be adjusted easily according to a workpiece and can perform rapid processing.
A step of outputting laser light from a laser light source, a step of dividing the outputted laser light into a plurality of steps, and an interval of each laser light when the divided laser light is irradiated onto a workpiece. A step of deciding, and a step of irradiating a predetermined position of the workpiece with laser light having a predetermined interval. More specifically, as a step of determining the interval of each laser beam when the divided laser beam is irradiated onto the workpiece, the mirror angle is changed, the prism is moved, the diffractive optical element is rotated, etc. The drive frequency of the acousto-optic element is changed or the beam splitter is moved.
[Selection] Figure 1

Description

  The present invention relates to a laser processing method and a laser processing apparatus for processing a workpiece by dividing a laser.

  In recent years, electronic devices have become more and more multifunctional, and accordingly, many materials have been used in complicated configurations. In particular, when a brittle material is included in the structure, taking out an electronic device in the final cutting step has been a problem due to the high production cost due to extremely low productivity and low yield in conventional dicing. .

  In recent years, therefore, laser scribing has been introduced in a form that assists conventional dicing. Laser scribing is performed as a pre-dicing process for the purpose of grooving on both sides so that microcracks do not propagate to the electronic device side, and laser scribing is a non-contact method that does not apply dicing stress to brittle materials. Has attracted attention (see, for example, Patent Document 1).

  FIG. 11 shows a schematic diagram of such a conventional laser processing apparatus.

  In the figure, the laser light emitted from the laser oscillator 101 is split into two by the beam splitter 102, one laser light is passed through the mirror 103, and the other laser light is guided to the lens 104. The transmitted laser light is reflected by the mirror 103 and guided to the lens 105.

  The laser light condensed by the lenses 104 and 105 is applied to the brittle substrate 106 placed on the processing table 107 so as to scribe the coating layer of the brittle substrate 106.

  The processing table 107 moves in the XY axis (left and right and up and down in the drawing) direction, and the processing position is moved by relatively moving the laser beam and the brittle substrate 106.

In the case where the brittle substrate 106 is a semiconductor wafer, the method of performing the scribing process only increases the number of processes, and the production cost increases as a result of the low productivity of the laser scribing process. Had a general problem. While the increase in the production cost of electronic devices is unacceptable in the market, it is a major proposition to reduce the production cost as much as possible. For this reason, laser light is applied to both ends of the processing part called street between circuit forming parts. The positions of the lens 104 and the lens 105 are shifted so as to be positioned so that processing can be performed at twice the throughput.
JP-T-2004-526335 (paragraph number 0042)

  However, in the conventional laser processing apparatus, it is necessary to determine the processing width by scribing with the lens 104 and the lens 105, that is, the processing width in the street, and there is a problem that it takes time to adjust according to the workpiece. .

  SUMMARY OF THE INVENTION An object of the present invention is to provide a laser processing method and a laser processing apparatus that can be adjusted easily according to a workpiece and can perform rapid processing.

  In order to solve the above problems, the present invention provides a laser scribing process at both ends of a certain region of a composite material having a structure using a brittle material as compared with the base material in at least one layer provided on the surface of the base material. In the process of applying, a step of outputting laser light from a laser light source, a step of dividing the outputted laser light into a plurality of parts, and an interval of each laser light when the divided laser light is irradiated onto a workpiece And a step of irradiating a predetermined position of the workpiece with a laser beam having a determined interval.

  More specifically, as a step of determining the interval of each laser beam when the divided laser beam is irradiated onto the workpiece, the mirror angle is changed, the prism is moved, the diffractive optical element is rotated, etc. The drive frequency of the acousto-optic element is changed or the beam splitter is moved.

  Thereby, the interval of each laser beam can be easily determined, and processing corresponding to the workpiece can be performed quickly.

  In the present invention, when simultaneously processing a composite material having a configuration using a brittle material as compared with the base material in at least one layer provided on the surface of the base material with a laser beam divided into two or more, The interval of each laser beam can be easily changed, which makes it possible to reduce the product changeover time, improve the factory operation rate, and reduce the production cost.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

(Embodiment 1)
FIG. 1 is a diagram showing an outline of a laser processing apparatus according to Embodiment 1 of the present invention. In FIG. 1, laser light emitted from a laser oscillator 1 serving as means for outputting laser light from a laser light source is applied to a mask 2 for beam shaping. Bends as means for irradiating a predetermined position of the workpiece (brittle substrate 6) by branching into two when passing through the laser beam splitting unit 3 of the means for splitting and passing the output laser beam into a plurality of The light is reflected by the mirror 4 and guided to the condenser lens 5.

  The brittle substrate placed on the processing table 7 so that the laser light condensed to an energy density equal to or higher than the processing threshold by the condensing lens 5 scribes the brittle material (coating layer) of the brittle substrate 6 made of a base material and a brittle material. 6 is irradiated.

  The processing table 7 moves in the X and Y axes (left and right and up and down in the drawing) and rotates, and the processing position is moved by relatively moving the laser beam and the brittle substrate 6.

  For example, the electronic devices 6a such as semiconductor wafers are arranged in a lattice pattern, and after completing laser processing in one direction, the processing table 7 is rotated 90 degrees to perform processing in the remaining directions.

  The feature of the first embodiment is that the laser beam positioning control device 8 controls the interval between the two branched laser beams as means for determining the interval between the laser beams. The laser beam positioning control device 8 is controlled by a control device 9 that controls the laser oscillator 1 and the processing table 7.

  For example, when a diffractive optical element (hereinafter abbreviated as DOE) is used as the laser beam splitting unit 3, a mechanism for rotating the DOE is used as the laser beam positioning control device 8.

  Although details will be described later, the DOE branches the incident laser light into a plurality of parts, and the interval between the branched laser lights can be controlled by rotating the DOE at a predetermined angle.

  As described above, the laser processing method includes a step of outputting laser light from the laser oscillator 1 as described above, a step of dividing the output laser light into a plurality of pieces by the laser light dividing unit 3, and the divided laser light is processed. The step of determining the interval of each laser beam when irradiated on the (brittle substrate 6) by the laser beam positioning control device 8, and the laser beam having the determined interval covered by the bend mirror 4, the condensing lens 5 and the processing table 7. It consists of a step of irradiating a predetermined position of the workpiece (brittle substrate 6).

  At this time, the interval between the respective laser beams is set to the maximum interval of the processed portion of the workpiece during the initial relative movement, and thereafter the interval is reduced. More preferably, the two preceding laser beams of the divided laser beams process the position of the outermost width, and then the other divided laser beams process the inside thereof.

  Specifically, as shown in FIG. 2, the first scribe processing is performed with the outermost width W1 on the electronic device 6a side, and the second scribe processing is performed with the inner width W2. I take the. In the drawing, the first scribe groove 11, the second scribe groove 12, and the street 6 b of the brittle substrate 6 to be processed are shown.

  At that time, it is necessary to select the laser energy, pulse width, pulse frequency, spatial beam overlap, condensing diameter, wavelength, etc. while paying attention to micro cracks when processing the outermost width. At the time of processing, the outer scribe groove 11 prevents the propagation of microcracks, so that the conditions can be set only by the processing efficiency.

  In addition, by first processing the outermost width, a scribe groove 11 that prevents the propagation of microcracks is formed, and it is possible to widen the tolerance of the processing conditions with respect to the subsequent central processing, with emphasis on productivity. The machining conditions can be selected.

  As described above, according to the present embodiment, the time required for processing can be reduced, and the productivity can be improved also in the entire throughput including loading and unloading of the workpiece and positioning alignment of the workpiece.

(Embodiment 2)
FIG. 3 is a diagram showing an outline of the laser processing apparatus according to the second embodiment of the present invention. The same components as those in the first embodiment shown in FIG. 1 and FIG.

  As shown in the figure, the feature of the second embodiment is that, after the laser light emitted from the laser oscillator 1 is shaped by the mask 2, it is first branched into two by the beam splitter 4a, and one of the branched ones. The laser beam is guided to the laser beam splitting unit 3a, the other laser beam is reflected by the bend mirror 4b and guided to the laser beam splitting unit 3b, and further divided into two by each laser beam splitting unit 3a, 3b, and the condenser lens It leads to 5a, 5b.

  Among these, the condensing lens 5a is arrange | positioned so that a scribe process may be performed ahead, and the condensing lens 5b is arrange | positioned so that a scribe process may be followed.

  At this time, the laser beam positioning control device 8a that controls the laser beam splitting unit 3a has a width that allows the processing with the outermost width W1 on the electronic device 6a side to be performed in the same manner as the first scribing process in the first embodiment described above. The laser beam positioning control device 8b that controls the branching and controls the laser beam splitting unit 3b controls the branching to a width that can be processed with the inner width W2 as in the second scribing process in the first embodiment described above. I have to. As in the first embodiment, the control device 9 controls the laser oscillator 1, the processing table 7, and the laser beam positioning control devices 8a and 8b.

  And the laser energy, pulse width, pulse frequency, spatial beam overlap amount, condensing diameter and wavelength, etc. that do not generate micro cracks are selected for the outermost width position of the processing site using the preceding condensing lens 5a Then, using the condensing lens 5b that follows, the inner part of the preceding laser processing is performed with the remaining pulse energy and the pulse frequency, pulse width, and wavelength set for the preceding laser processing.

  However, the distance between the preceding laser beam and the laser beam that continuously processes the inside of the laser beam is limited by the thermal effect that does not affect the operation (thermal damage) of the electronic device 6a of the workpiece (brittle substrate 6). The interval is set by wavelength, pulse width, pulse energy, etc. so as to maintain a sufficient distance.

  Note that the amount of overlap of the spatial beam, the condensing diameter, and the like can be made different parameters for the preceding laser beam and the following laser beam by beam shaping. In this case, the beam pattern is selected based on the balance between the sensitivity of damage to thermal processing of the electronic device and the required productivity.

  As described above, according to the present embodiment, the preceding condenser lens 5a and the following condenser lens 5b are mounted, the laser beam is divided into four parts, and the laser has the outermost width W1 and the inner width W2. By performing machining at the same time, the time required for machining can be reduced by a factor of two, and productivity can be improved more than twice even when looking at the total throughput including workpiece loading / unloading and workpiece positioning alignment. is there.

  In the second embodiment, the number of divisions of laser light is four. However, the number of divisions can be increased according to the number of passes required for laser processing. Furthermore, as described above, since the processing conditions are selected for the center with emphasis on processing efficiency, it is also possible to select processing with three laser beams at both ends and the center. In this way, by dividing the laser beam arbitrarily and changing the beam shape with the preceding laser that processes both ends and the following laser beam that processes the center, the cost of the laser scribing process can be further reduced, and the overall production cost Can also be reduced.

(Embodiment 3)
FIG. 4 is a diagram for explaining a laser processing method according to Embodiment 3 of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1, 2, and the description is abbreviate | omitted.

  The third embodiment uses the laser processing apparatus described in the second embodiment, and when processing a workpiece having a plurality of processing sites as the processing pattern, the interval between adjacent processing sites or at least one The interval between the laser beams is controlled in accordance with the interval between the processing parts separated as described above, and the divided laser beam shown in FIG. 4 is applied to a plurality of electronic device processing.

  The (a) pattern 1 and (b) pattern 2 shown in the figure are often applied to a relatively large electronic device 6a.

  In general, the electronic device 6a is often repeatedly arranged on the brittle substrate 6. (a) In the pattern 1, the laser light preceding the street 6b of the adjacent electronic device 6a and the following laser light are separately arranged. Thus, it is possible to simultaneously process two or more rows.

  Further, (b) Pattern 2 divides the entire work piece (brittle substrate 6) in half, and distributes the laser light that follows the laser light that precedes the two places from the end and the center, and advances the processing simultaneously. Is possible.

  In either case, it is important to accurately read the position of the electronic device including the manufacturing intersection and accurately position the laser beam interval.

  (C) The pattern 3 is applied to a relatively small electronic device. The preceding laser beam across the electronic device 6a is processed on both sides of the electronic device 6a, and the following laser beam is applied to the inner electronic device 6a. Process to pinch. In this case, precise positioning of the laser beam is necessary.

  (D) The pattern 4 controls the interval of each laser beam in the relative movement direction so that the locus of each laser beam becomes substantially equal. Specifically, the width of the laser beam following the preceding laser beam is controlled. It is effective when the required machining is deep.

  Since electronic devices generally flow mixedly on a line, patterns 1 to 3 are selected when the processing depth is shallow, and pattern 4 is selected when the processing depth is deep.

  In the laser processing apparatus shown in Embodiment 2, when processing a plurality of processing parts by the control means 9 that controls the laser processing apparatus, if the processing parts are odd numbers, the interval between adjacent processing parts, or at least The interval of each laser beam is controlled in accordance with the interval of one or more machining sites, and the laser beam is irradiated at least once without removing the dividing means from the optical path of the laser beam. By moving the light splitting unit 3b in and out of the optical axis, it is possible to use a following laser beam having energy twice that of the preceding laser beam, and deep processing can be performed with the following laser beam.

  Note that the pattern 4 is not only employed when performing deep machining, but is also effective as a method of adjusting a machining row when the number of machining examples is an odd number. The interval between the laser beams is controlled in accordance with the interval between one or more machining sites, and at least once, the intervals between the laser beams are provided in the relative movement direction so that the trajectories of the laser beams become substantially equal.

  In such a case, when the intervals of the laser beams are provided in the relative movement direction so that the trajectories of the laser beams are substantially equal, the energy of each laser beam is reduced to about half of the normal energy. The laser beam is adjusted to about half the processing energy in order to match the depth of processing with the processing of the other rows.

(Embodiment 4)
FIG. 5 is a diagram showing an outline of a laser processing apparatus according to Embodiment 4 of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-3, and the description is abbreviate | omitted.

  The feature of the fourth embodiment is that when the laser beam is divided, one laser beam divided by the half mirror and the other laser beam divided by the half mirror are irradiated substantially in the same direction on the same axis. And a means for controlling the interval of each laser beam by changing the angle of the reflection angle variable mirror disposed on the optical path of the laser beam reflected by the plurality of mirrors and reflected by the plurality of mirrors, Specifically, as shown in the figure, a λ plate 2a is arranged between the mask 2 and the laser oscillator 1, and the laser beam that has passed through the mask 2 is split into two by a beam splitter 4a comprising a first half mirror. Then, the laser beam that has passed through the beam splitter 4a passes through the beam combiner 4c formed of the second half mirror, and the laser beam reflected by the beam splitter 4a has an angle at which it becomes the first mirror. Is reflected by the variable mirror 8c and tilting mirror 8d serving as the second mirror, is reflected by the beam combiner 4c, the laser light of two are both turned to the configuration is guided to the condenser lens 5 in the bend mirror 4b.

  Since the position of the reflected laser beam is shifted by the angle of the variable angle mirrors 8c and 8d, the interval between the two laser beams reflected by the bend mirror 4b can be controlled by the angle of the variable angle mirrors 8c and 8d. it can.

  The variable angle mirrors 8c and 8d are configured so that, for example, a motor, a piezo element, and the like are controlled by the control device 9, and a database describing the relationship between the angles Θ1 and Θ2 of the variable angle mirror angles 8c and 8d and the beam interval S. 9 a is connected to the control device 9.

  The operation of the laser processing method and laser processing apparatus configured as described above will be described.

  The laser light is divided almost in half by the beam splitter 4a, is combined by the beam combiner 4c through the angle variable mirror 8c, is reflected by the bend mirror 4b, and is guided to the condenser lens 5.

  At this time, the variable angle mirrors 8c and 8d are controlled by the control device 9, and the two laser beams are substantially parallel after the beam combiner 4c. The two laser beams entering in parallel are condensed on the workpiece by the condensing lens 5 at the inter-beam distance S and used for processing.

  In this way, the principle is simple, but it is not easy in practice. It is practically difficult to adjust the optical axis center of the laser light so that it is perfectly coincident with the ideal mechanical center. Therefore, the optical axis center of the laser beam does not coincide with the mechanical center, and angle control cannot be expressed by an ideal function. In addition, optical components such as the beam splitter 4a and the beam combiner 4c generally have a wedge angle, so that the laser light transmitted through the optical component is output in a direction slightly deviated from the angle calculated from the refractive index. In order to accurately position the laser beam interval on the micron order, it is necessary to correct the influence of the wedge angle.

  In the fourth embodiment based on the current situation as described above, the angle Θ1 of the variable angle mirror 8c, the angle Θ2 of the variable angle mirror 8d, and the beam interval S are measured in advance to describe the relationship between the angles Θ1 and Θ2 and the beam interval S. The angle is controlled by storing in the database 9a and reading the value. The measurement is often performed by reading a laser-processed point with an image recognition device or the like and measuring the distance between the beam centers.

  In this way, by dividing the laser light into two parts, passing the two angle variable mirrors 8c and 8d, combining them by the beam combiner 4c, and guiding the laser light in a state substantially parallel to the condenser lens 5 Two laser processings can be performed simultaneously while maintaining a precisely controlled beam spacing S, the time required for processing can be reduced, and the entire throughput including workpiece loading and unloading and workpiece positioning alignment can be achieved. Productivity can be improved.

(Embodiment 5)
FIG. 6 is a diagram showing an outline of a laser processing apparatus in Embodiment 5 of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-4, and the description is abbreviate | omitted.

  The feature of the fifth embodiment is that when dividing the laser beam, one laser beam divided by the half mirror and the other laser beam divided by the half mirror are irradiated from directions that are substantially coaxially opposed to each other. Reflected by a plurality of mirrors arranged so that one of the laser light and the other laser light is substantially crossed, a prism or a cross-sectional prism-shaped mirror is moved in a direction substantially perpendicular to the direction of the laser light. Each of the lasers on the workpiece corresponding to the amount of movement of the prism or the prism having a cross-sectional prism shape in a direction substantially perpendicular to the direction of the laser light. The distance of the light is obtained in advance as data, and based on the obtained data, the amount by which the prism or cross-section prism-shaped mirror is moved in a direction substantially perpendicular to the direction of the laser light is determined. Specifically, as shown in the figure, a λ plate 2a is disposed between the mask 2 and the laser oscillator 1, and the laser beam that has passed through the mask 2 is a beam splitter 4a comprising a half mirror. The laser beam that has been branched into two and passed through the beam splitter 4a is reflected by the two bend mirrors 4b with the laser optical axis shifted in the reverse direction, and the laser beam reflected by the beam splitter 4a is reflected in the reverse direction by the bend mirror 4b. The distance between the laser beams is controlled by reflecting the laser beam on the same axis as the laser beam axis shifted in the opposite direction and moving the laser beam in the direction of the laser beam axis (up and down in the figure). Like to do.

  The prism 8e may be a prism-shaped mirror, and is configured such that, for example, a linear motor or a piezo element is controlled by the control device 9, and the relationship between the movement position of the prism 8e and the beam interval S is described. The database 9b is connected to the control device 9.

  Note that the interval and parallelism of the laser beams are affected by the angle of the surface of the prism 8e and the angle of the bend mirror 4b, so care should be taken in installing them, but the principle is simple, but it is not easy in practice. It is practically difficult to adjust the optical axis center of the laser light so that it is perfectly coincident with the ideal mechanical center. Therefore, the optical axis center of the laser beam does not coincide with the mechanical center, and angle control cannot be expressed by an ideal function. In addition, optical components such as the beam splitter 4a generally have a wedge angle, so that the laser light transmitted through the optical component is output in a direction slightly deviated from the angle calculated from the refractive index. In order to accurately position the laser beam interval on the micron order, it is necessary to correct the influence of the wedge angle. In the fifth embodiment based on the above situation, the movement position of the prism 8e and the beam interval S are measured in advance, stored in the database 9b describing the relationship between the movement position and the beam interval S, and the value is read out. Control. The measurement is often performed by reading a laser-processed point with an image recognition device or the like and measuring the distance between the beam centers.

  As described above, the laser beam is divided into two beams, and the two laser beams are guided to the condenser lens 5 as parallel beams by the prism 8e. It can be performed at the same time, the time required for processing is reduced, and the productivity improvement of the entire throughput including the workpiece loading / unloading and the positioning alignment of the workpiece is possible.

(Embodiment 6)
FIG. 7 is a diagram showing an outline of a laser processing apparatus according to Embodiment 6 of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-5, and the description is abbreviate | omitted.

  A feature of the sixth embodiment is that when the laser beam is divided, a diffractive optical element disposed on the optical path of the laser beam is used, and the diffractive optical element is rotated with respect to the incidence of the laser beam. As shown in the figure, the laser light emitted from the laser oscillator 1 passes through the mask 2 and is incident on the DOE 3 by the bend mirror 4b. Branch into two at DOE3. The two branched laser beams pass through a collimator unit 2b composed of a collimator and an aperture disposed between the lenses from a plurality of lenses, and are guided to the condenser lens 5.

  The brittle substrate placed on the processing table 7 so that the laser light condensed to an energy density equal to or higher than the processing threshold by the condensing lens 5 scribes the brittle material (coating layer) of the brittle substrate 6 made of a base material and a brittle material. 6 is irradiated.

  The processing table 7 moves in the X and Y axes (left and right and up and down in the drawing) and rotates, and the processing position is moved by relatively moving the laser beam and the brittle substrate 6.

  For example, the electronic devices 6a such as semiconductor wafers are arranged in a lattice pattern, and after completing laser processing in one direction, the processing table 7 is rotated 90 degrees to perform processing in the remaining directions.

  The DOE 3 is rotated by a laser beam positioning control device 8 that rotates the DOE 3 in order to control the interval between the branched laser beams. The laser beam positioning control device 8 controls the laser oscillator 1 and the processing table 7. The controller 9 is connected to the controller 9 and a database 9c is stored in which the beam interval S of each laser beam on the workpiece corresponding to the rotation angle Θ4 of the DOE 3 is obtained in advance and stored as data. The rotation angle of the DOE 3 is controlled based on the obtained data.

  Further, the DOE 3, the condensing lens 5, and the workpiece (brittle substrate 6) are arranged at substantially the same distance as the focal length of the condensing lens 5.

  Furthermore, when the diameter of the aperture of the collimator unit 2b is d and the beam separation width by laser diffraction is L, d is set so as to satisfy the conditions of 2L or more and 3L or less, and the collimator unit 2b When the focal length of each lens is f0 and the focal length of the condensing lens 5 arranged on the workpiece side with respect to the collimator is f, f0 is set so as to satisfy a condition larger than 0.5f.

  If the focal length of each lens of the collimator is f0 and the focal length of the condensing lens 5 disposed on the workpiece side of the collimator is f, f0 can be further satisfied by satisfying a condition sufficiently larger than 3f. good.

  The operation of the laser processing method and laser processing apparatus configured as described above will be described.

  As shown in FIG. 7, the laser light is an extremely simple optical system that is divided into the number designated by the DOE 3 and guided to the condenser lens 5. The laser light incident on the condensing lens 5 is condensed on the brittle substrate 6 at the inter-beam distance S and used for processing. At this time, the DOE 3 is controlled by the control device 9. The machining width S is described by a cosine component S ″ = S′cos Θ4 of S ′, which is a design value of DOE3.

  In this way, the principle is simple, but it is not easy in practice. It is practically difficult to adjust the center of the optical axis of the laser light so that it completely coincides with the ideal center of rotation of the DOE 3, and further to adjust the laser light to enter the DOE 3 completely perpendicularly.

  Therefore, the optical axis center of the laser beam does not coincide with the rotation center, and angle control cannot be expressed by an ideal function. In addition, the optical component of the DOE 3 generally has a wedge angle, so that when the laser beam is incident at an angle other than vertical, the optical component is output in a slightly shifted direction. In order to accurately position the laser beam interval on the micron order, it is necessary to correct the influence of the wedge angle.

  In the sixth embodiment based on the above situation, the rotation angle Θ4 and the beam interval S of the DOE 3 are measured in advance, stored in the database 9c describing the relationship between the angle Θ4 and the beam interval S, and the value is read out. To control the angle. The measurement is often performed by reading a laser-processed point with an image recognition device or the like and measuring the distance between the beam centers.

  Thus, by dividing the laser beam into two through the DOE 3 and simultaneously processing, two laser processing can be performed simultaneously while maintaining the beam interval S accurately, and the time required for processing is reduced, and the workpiece is processed. Productivity improvement with full throughput, including loading and unloading and positioning alignment of workpieces.

  Note that there is a diffraction pattern generated by the DOE 3 as a problem when the DOE 3 is actually installed. In an actual DOE design, even if the design is such that the even number of diffracted light is extinguished, the diffracted light of the third order, the fifth order, etc. is mixed with an intensity of several percent in addition to the intended first order diffracted light. . If this is used for processing as it is, it is condensed at the processing point and the energy density is increased, and this causes a processing quality deterioration as a processing flaw. In order to avoid this, a relay optical system is configured by using two collimator lenses, and an aperture having a diameter that is twice to three times the separation distance by diffracted light is provided at the central condensing point. A collimator unit 2b for cutting the above higher-order light is provided. Further, the focal length f0 of the lens used for the collimator lens of the relay optical system has a focal length of 0.5 times or more with respect to the focal length f of the condensing lens 5 used for calculation processing. Although it is necessary to take care not to generate aberrations in the optical system, it is safer to set the optical system to 3 times or more in practice.

(Embodiment 7)
FIG. 8 is a diagram showing an outline of a laser processing apparatus according to Embodiment 7 of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-6, and the description is abbreviate | omitted.

  The feature of the seventh embodiment is that when a laser beam is divided, an acoustooptic device (abbreviated as AOE) disposed on the optical path of the laser beam is used, and the drive signal applied to the acoustooptic device is It has means for controlling the interval between the laser beams by varying the frequency, and the interval between the laser beams on the workpiece corresponding to the frequency of the drive signal applied to the acoustooptic device is obtained in advance as data, Means for controlling the frequency based on the obtained data is provided. Specifically, as shown in the figure, the laser light emitted from the laser oscillator 1 passes through the mask 2, enters the AOE 3c by the bend mirror 4b, and is output as laser light of two angles at each time by the AOE 3c. Is done. Laser beams having different angles are guided to the condenser lens 5.

  The brittle substrate placed on the processing table 7 so that the laser light condensed to an energy density equal to or higher than the processing threshold by the condensing lens 5 scribes the brittle material (coating layer) of the brittle substrate 6 made of a base material and a brittle material. 6 is irradiated.

  The processing table 7 moves in the X and Y axes (left and right and up and down in the drawing) and rotates, and the processing position is moved by relatively moving the laser beam and the brittle substrate 6.

  For example, the electronic devices 6a such as semiconductor wafers are arranged in a lattice pattern, and after completing laser processing in one direction, the processing table 7 is rotated 90 degrees to perform processing in the remaining directions.

  The AOE 3c is provided with a drive unit 8d that varies the drive frequency in order to vary the angle of the incident laser beam, and this drive unit 8d is controlled by a control device 9 that controls the laser oscillator 1 and the processing table 7. In addition, the beam interval S of each laser beam on the workpiece corresponding to the drive frequency of the AOE 3c is obtained and stored as data in advance, specifically, the RF power output from the drive unit 8d to the AOE 3c A database 9d describing the output, command frequency freq, and beam interval S is connected to the control device 9, and the drive frequency of the AOE 3c is controlled based on the obtained data.

  The operation of the laser processing method and laser processing apparatus configured as described above will be described.

  The laser beam is time-divided by the AOE 3c. The division ratio depends on the diffraction efficiency of the AOE 3c and can be controlled by a function of the RF output transmitted from the drive unit 8d to the AOE 3c. Further, the diffraction angle Θ5 is a function of the frequency of the RF output output from the drive unit 8d. Accordingly, the beam interval S is described by the equation Θ5 = (λ · freq) / Va as a function of the frequency of the RF power output from the driving unit 8d.

  Here, λ is the wavelength of the laser, and Va is the velocity of sound waves.

  The output and frequency of the drive unit 8d are controlled by the control device 9. The two laser beams divided by the AOE 3c are incident on the condenser lens 5 with individual angles. The incident laser light having an individual angle is condensed on the workpiece by the beam distance S from the condenser lens 5 and used for processing. In this way, the principle is simple, but it is not easy in practice. In the case of AOE, it is possible to dynamically change the intensity ratio of the two beams or the spacing S between the two beams during the process, further increasing the production flexibility, while AOE3c is Since it is manufactured by attaching electrodes to the optical element, the RF power received by the element varies. Therefore, the frequency output by the drive unit 8d, the output, the intensity ratio of the beam, and the diffraction angle Θ5 are stored in the database 9d and read out for use.

  As described above, the laser beam is time-divided into two by the AOE 3c, and the laser power is processed while maintaining the beam interval S accurately by controlling the output and frequency of the RF power output from the drive unit 8d. It can be performed at the same time, the time required for processing is reduced, and the productivity improvement of the entire throughput including the workpiece loading / unloading and the positioning alignment of the workpiece is possible.

(Embodiment 8)
FIG. 9 is a diagram showing an outline of a laser processing apparatus according to the eighth embodiment of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-7, and the description is abbreviate | omitted.

  The feature of the eighth embodiment is that when a laser beam is divided, a beam splitter disposed on the optical path of the laser beam is used, and the beam splitter is rotated with respect to the incidence of the laser beam to thereby each laser beam The beam splitter has a mechanism for rotating at least one of the rotation in the laser beam traveling direction and the rotation in the direction perpendicular to the laser beam traveling direction. The position of each laser beam on the workpiece corresponding to the rotation angle of the beam splitter is obtained in advance as data, and the rotation angle of the beam splitter is controlled based on the obtained data. Specifically, as shown in the figure, the laser light emitted from the laser oscillator 1 passes through the mask 2, enters the beam splitter 3d by the bend mirror 4b, and splits the laser light into two by the beam splitter 3d. To do. The beam splitter 3d is provided with a special coating, half of the mirror is coated with a half mirror for 50% transmission, and the other half of the other surface is coated with a high reflection. Thus, the beam interval S can be controlled by rotating the beam splitter 3d with the special coating. The two laser beams are guided to the condenser lens 5.

  The brittle substrate placed on the processing table 7 so that the laser light condensed to an energy density equal to or higher than the processing threshold by the condensing lens 5 scribes the brittle material (coating layer) of the brittle substrate 6 made of a base material and a brittle material. 6 is irradiated.

  The processing table 7 moves in the X and Y axes (left and right and up and down in the drawing) and rotates, and the processing position is moved by relatively moving the laser beam and the brittle substrate 6.

  For example, the electronic devices 6a such as semiconductor wafers are arranged in a lattice pattern, and after completing laser processing in one direction, the processing table 7 is rotated 90 degrees to perform processing in the remaining directions.

  The beam splitter 3d is configured to rotate the beam splitter 3d by a laser beam positioning controller 8e in order to control the interval between the branched laser beams. The laser beam positioning controller 8e is used as the laser oscillator 1 and the processing table 7. And a database 9e that controls and stores the beam interval S of each laser beam on the workpiece corresponding to the rotation angle Θ6 of the beam splitter 3d as data in advance. The rotation angle of the beam splitter 3d is controlled based on the obtained data by connecting to the apparatus 9.

  The branching of the laser beam at the beam splitter 3d will be described.

  The laser light is incident on the beam splitter 3d from the incident-side half AR-coated portion and refracts. Due to the 50% reflective coating provided on the half of the exit side, 50% is transmitted and output from the beam splitter 3d, and the rest is reflected and travels inside the beam splitter 3d, and is provided on the opposite half of the entrance side. After reaching the reflective coating and almost totally reflected, it is output from the AR coating portion on the opposite half of the output side. At this time, the optical path is shifted by the amount reflected twice in the beam splitter 3d, and two laser beams moved in parallel are formed. The distance between the two laser beams can be controlled by the tilt angle Θ6 of the beam splitter 3d. The two laser beams generated in this way are collected on the workpiece by the beam distance S from the condenser lens 5 and used for processing. In this way, the principle is simple, but it is not easy in practice. The optical component such as the beam splitter 3d generally has a wedge angle, so that the laser light transmitted through the optical component is output in a direction slightly deviated from the angle calculated from the refractive index. In order to accurately position the laser beam interval on the micron order, it is necessary to correct the influence of the wedge angle. In the eighth embodiment based on the current situation as described above, the tilt angle Θ6 and the beam interval S of the beam splitter 3d are measured in advance and stored in the database 9e describing the relationship between the tilt angle Θ6 and the beam interval S, and the value is stored. The angle is controlled by reading. The measurement is often performed by reading a laser-processed point with an image recognition device or the like and measuring the distance between the beam centers.

  In this way, the laser beam is divided into two, and the two laser beams are guided to the condenser lens 5 with a controlled beam interval, so that the laser processing is performed while maintaining the beam interval S accurately. This can be performed simultaneously, the time required for machining is reduced, and the productivity improvement of the entire throughput including the workpiece loading and unloading and the workpiece positioning alignment is possible.

(Embodiment 9)
FIG. 10 is a diagram showing an outline of a laser processing apparatus according to the ninth embodiment of the present invention.

  In addition, the same code | symbol is attached | subjected about the same structure as Embodiment 1-8, and the description is abbreviate | omitted.

  The feature of the ninth embodiment is that when a laser beam is divided, a beam splitter arranged on the optical path of the laser beam is used, and the beam splitter is moved in a direction substantially perpendicular to the incidence of the laser beam. Means for controlling the interval of each laser beam, and further obtaining the position of each laser beam on the workpiece corresponding to the approximately vertical movement amount of the beam splitter as data in advance, based on the obtained data, Means for controlling a substantially vertical movement of the beam splitter is provided. Specifically, as shown in the figure, the laser beam emitted from the laser oscillator 1 passes through the mask 2, enters the beam splitter 3e by the bend mirror 4b, and splits the laser beam into two by the beam splitter 3e. To do. This beam splitter 3e has a cube-shaped structure, and a special coating is applied to the surface thereof. Half of the mirror is provided with a 50% transmission half mirror coating, and the other half of the other surface is provided with a high height. Reflective coating is applied. The beam interval S can be controlled by moving the beam splitter 3e thus coated with a special coating in the lateral direction with respect to the laser beam. The two laser beams are guided to the condenser lens 5.

  The brittle substrate placed on the processing table 7 so that the laser light condensed to an energy density equal to or higher than the processing threshold by the condensing lens 5 scribes the brittle material (coating layer) of the brittle substrate 6 made of a base material and a brittle material. 6 is irradiated.

  The processing table 7 moves in the X and Y axes (left and right and up and down in the drawing) and rotates, and the processing position is moved by relatively moving the laser beam and the brittle substrate 6.

  For example, the electronic devices 6a such as semiconductor wafers are arranged in a lattice pattern, and after completing laser processing in one direction, the processing table 7 is rotated 90 degrees to perform processing in the remaining directions.

  The beam splitter 3e is configured to move the beam splitter 3e laterally by a laser beam positioning control device 8f such as a slider in order to control the interval between the branched laser beams. Control is performed by a control device 9 that controls the oscillator 1 and the processing table 7, and the beam interval S of each laser beam on the workpiece corresponding to the moving position of the beam splitter 3e is obtained and stored in advance as data. The database 9f is connected to the control device 9, and the movement position of the beam splitter 3e is controlled based on the obtained data.

  The branching of the laser beam at the beam splitter 3e will be described.

  The laser light enters the cube-shaped beam splitter 3e from a position having an offset, and proceeds in the direction of the 50% reflection surface by refraction. At the 50% reflecting surface, the beam is separated in the reflection and transmission directions, proceeds in the respective directions, and is refracted again on the output side to produce two separated parallel rays. At this time, the interval between the two parallel rays is determined by the offset amount of the beam splitter 3e, and the beam interval can be controlled by moving the splitter in parallel. The two beams generated in this way are collected on the workpiece by the beam distance S from the condenser lens 5 and used for processing. In this way, the principle is simple, but it is not easy in practice. The beam splitter 3e must be inserted perpendicularly to the optical axis of the laser beam, but an actual moving mechanism such as a slider has yawing, and such an ideal situation cannot be created. In addition, the beam splitter 3e is manufactured by attaching 50% reflecting surfaces with optical contacts, and naturally there is an error in the parallelism of the outer shape and the verticality of the corner. Therefore, it is necessary to correct the influence of these error factors in order to accurately position the interval between the laser beams on the micron order. In the ninth embodiment based on the current situation as described above, the insertion position DO and the beam interval S with respect to the laser beam of the beam splitter 3e are measured in advance, and the database 9f describing the relationship between the insertion position DO of the beam splitter 3e and the beam interval S. And the angle is controlled by reading the value. The measurement is often performed by reading a laser-processed point with an image recognition device or the like and measuring the distance between the beam centers.

  In this way, the laser beam is divided into two, and the two laser beams are guided to the condenser lens 5 with a controlled beam interval, so that the laser processing is performed while maintaining the beam interval S accurately. This can be performed simultaneously, the time required for machining is reduced, and the productivity improvement of the entire throughput including the workpiece loading and unloading and the workpiece positioning alignment is possible.

  The processing table 7 which is the positioning means used in the above-described embodiment can improve the processing accuracy by relatively moving the workpiece to be irradiated with the laser beam and the laser beam only in one direction. In addition, the control device 9 may perform control so as to generate a plurality of laser beam trajectories with respect to one processing site.

  The laser processing method and laser processing apparatus of the present invention are useful as a laser processing method and a laser processing apparatus capable of improving productivity.

Configuration diagram of laser processing apparatus in Embodiment 1 of the present invention Explanatory drawing of the laser processing method in Embodiment 1 of this invention The block diagram of the laser processing apparatus in Embodiment 2 of this invention Explanatory drawing of the condensing pattern of the laser beam in Embodiment 3 of this invention The block diagram of the laser processing apparatus in Embodiment 4 of this invention Configuration diagram of laser processing apparatus in Embodiment 5 of the present invention The block diagram of the laser processing apparatus in Embodiment 6 of this invention The block diagram of the laser processing apparatus in Embodiment 7 of this invention The block diagram of the laser processing apparatus in Embodiment 8 of this invention The block diagram of the laser processing apparatus in Embodiment 9 of this invention Configuration diagram of conventional laser processing equipment

DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 Mask 3 Laser beam splitting unit 4 Bend mirror 5 Condensing lens 6 Brittle board | substrate 6a Electronic device 6b Street

Claims (84)

Laser light is output from a laser light source in a process in which a composite material having a configuration using a brittle material is applied to both ends of a certain region compared to the base material at least one layer provided on the surface of the base material. A laser processing method comprising: a step of dividing the output laser light into a plurality of steps; and irradiating the divided laser light on a predetermined position of the workpiece. Laser light is output from a laser light source in a process in which a composite material having a configuration using a brittle material is applied to both ends of a certain region compared to the base material at least one layer provided on the surface of the base material. A step of dividing the outputted laser beam into a plurality of steps, a step of determining an interval between the laser beams when the divided laser beam is irradiated onto a workpiece, and a laser beam having a determined interval. A laser processing method including a step of irradiating a predetermined position of a workpiece. When laser processing is performed by moving relative to the processing part of the workpiece wider than the width of each divided laser beam, the interval between the laser beams is set as the maximum interval of the processing part of the workpiece during the initial relative movement. Thereafter, the laser processing method according to claim 2, wherein the interval is narrowed. 4. The laser processing method according to claim 2, wherein the two preceding laser beams of the divided laser beams process the position of the outermost width, and subsequently, the other divided laser beams process the inside thereof. . The laser processing method according to claim 4, wherein the distance between the two preceding laser beams and the laser beam that continuously processes the inside of the two laser beams has a sufficient distance so that the thermal effect does not affect the operation of the workpiece. 6. The laser beam having two preceding laser beams and a laser beam that continuously processes the inside thereof, and the shape of the laser beam that is subsequently processed is different from the shape of the preceding laser beam. Description Laser processing method. The laser processing method according to any one of claims 2 to 6, wherein when processing a workpiece having a plurality of processing parts, an interval between the laser beams is controlled in accordance with an interval between adjacent processing parts. The laser processing method according to any one of claims 2 to 6, wherein when processing a workpiece having a plurality of processing parts, the interval of each laser beam is controlled in accordance with the interval of at least one or more processing parts. . The laser processing method according to claim 2, wherein the interval between the laser beams is controlled in accordance with the width of one processing site. The laser processing method according to any one of claims 2 to 6, wherein an interval between the laser beams is controlled in a relative movement direction so that trajectories of the laser beams are substantially equal. When machining a plurality of machining sites, if the machining sites are odd numbers, the intervals between the laser beams are controlled at least once according to the intervals between adjacent machining sites or at least one machining site separated from each other. 7. The laser processing method according to claim 2, wherein intervals of the laser beams are provided in the relative movement direction so that the trajectories of the laser beams are substantially equal. The laser processing method according to claim 10 or 11, wherein the energy of each laser beam is set to approximately half of the normal energy when the intervals of the laser beams are provided in the relative movement direction so that the locus of each laser beam is substantially equal. When machining a plurality of machining sites, the control means controls the interval between the laser beams according to the interval between adjacent machining sites or at least one machining site separated by at least one machining site. 7. The laser processing method according to claim 2, wherein the laser beam is irradiated at least once so that the dividing means is removed from the optical path of the laser beam and is not branched. When dividing the laser beam, the laser beam is reflected by a plurality of mirrors arranged so as to irradiate one laser beam divided by the half mirror and the other laser beam divided by the half mirror in the same direction on the same axis, The laser processing method according to any one of claims 2 to 13, wherein the interval of each laser beam is controlled by changing the angle of a reflection angle variable mirror arranged on the optical path of the laser beam reflected by a plurality of mirrors. The laser beam is divided by a first half mirror disposed on the optical path of the laser beam, and one laser beam divided by the first half mirror is reflected by the first mirror in the same direction as the other laser beam. Each laser beam reflected by the first mirror is reflected by the second mirror to the second half mirror that passes the other laser beam, and each angle of the second mirror is controlled to control each laser beam. The laser processing method according to claim 14, wherein the light interval is controlled. The laser processing method according to claim 15, wherein an interval of each laser beam on the workpiece corresponding to the angle of the second mirror is obtained as data in advance, and control is performed based on the obtained data. The laser beam is divided by a first half mirror disposed on the optical path of the laser beam, and one laser beam divided by the first half mirror is reflected by the first mirror in the same direction as the other laser beam. The one laser beam reflected by the first mirror is reflected by the second mirror to the second half mirror that allows the other laser beam to pass through, and the angles of the first mirror and the second mirror are determined. The laser processing method according to claim 14, wherein the interval between the laser beams is controlled to control. 18. The laser processing method according to claim 17, wherein an interval between each laser beam on the workpiece corresponding to the angle of the first mirror and the angle of the second mirror is obtained in advance as data, and control is performed based on the obtained data. The laser processing method according to claim 14, wherein the workpiece and the dividing unit are relatively rotated. When dividing the laser beam, the laser beam is reflected by a plurality of mirrors arranged so as to irradiate the laser beam divided by the half mirror and the other laser beam divided by the half mirror from directions facing each other substantially coaxially, A prism or a cross-sectional prism-shaped mirror disposed at a position where the one laser beam and the other laser beam substantially cross each other is moved in a direction substantially perpendicular to the laser beam direction to control the interval between the laser beams. The laser processing method according to any one of 2 to 13. The distance between the laser beams on the workpiece corresponding to the amount by which the prism or the prism having a cross-sectional prism shape is moved in a direction substantially perpendicular to the direction of the laser beam is obtained in advance as data, and the prism or the 21. The laser processing method according to claim 20, wherein an amount of movement of the mirror having a prismatic section in a direction substantially perpendicular to the direction of the laser beam is controlled. The laser processing method according to claim 21 or 22, wherein the workpiece and the dividing means are relatively rotated. The diffractive optical element disposed on the optical path of the laser light is used to divide the laser light, the diffractive optical element is rotated with respect to the incidence of the laser light, and the interval between the laser lights is controlled. A laser processing method according to any one of the above. A lens for receiving each laser beam divided between the diffractive optical element and the workpiece is provided, and the diffractive optical element, the lens, and the workpiece are disposed and processed at substantially the same distance as the focal length of the lens. Item 24. A laser processing method according to Item 23. A collimator comprising a plurality of lenses for entering each laser beam divided between the diffractive optical element and the workpiece, and a lens for entering each laser beam emitted from the collimator are arranged, and a plurality of collimators are arranged. The laser processing method according to claim 23, wherein an aperture is provided between the lenses for processing. 26. The laser processing method according to claim 25, wherein d is processed in an arrangement that satisfies a condition of 2L or more and 3L or less, where d is the diameter of the aperture and L is a beam separation width by laser diffraction. 26. Processing is performed in an arrangement where f0 is greater than 0.5f, where f0 is a focal length of each lens of the collimator and f is a focal length of a lens disposed on the workpiece side of the collimator. Or the laser processing method of 26. 28. Processing is performed in an arrangement where f0 is sufficiently larger than 3f, where f0 is a focal length of each lens of the collimator and f is a focal length of a lens disposed on the workpiece side of the collimator. Laser processing method. The distance between the laser beams on the workpiece corresponding to the rotation angle of the diffractive optical element is obtained in advance as data, and the rotation angle of the diffractive optical element is controlled based on the obtained data. The laser processing method as described. 30. The laser processing method according to claim 23, wherein the workpiece is rotated. 14. The laser light is divided by using an acoustooptic element arranged on the optical path of the laser light, and the frequency of the drive signal applied to the acoustooptic element is varied to control the interval between the laser lights. A laser processing method according to any one of the above. 32. The laser processing method according to claim 31, wherein an interval between the laser beams on the workpiece corresponding to the frequency of the drive signal applied to the acoustooptic device is obtained in advance as data, and the frequency is controlled based on the obtained data. The laser processing method according to claim 31 or 32, wherein the workpiece and the dividing means are moved relative to each other. 14. The method according to claim 2, wherein when dividing the laser beam, a beam splitter disposed on the optical path of the laser beam is used, and the interval between the laser beams is controlled by rotating the beam splitter with respect to incidence of the laser beam. The laser processing method of crab. 35. The laser processing method according to claim 34, wherein at least one of rotation with respect to a traveling direction of laser light and rotation in a direction perpendicular to the traveling direction of laser light is performed as the rotation direction of the beam splitter. 36. The laser processing method according to claim 34 or 35, wherein the position of each laser beam on the workpiece corresponding to the rotation angle of the beam splitter is obtained in advance as data, and the rotation angle of the beam splitter is controlled based on the obtained data. 37. The laser processing method according to claim 34, wherein the workpiece and the dividing means are relatively rotated. 3. A laser beam splitter disposed on an optical path of the laser beam is used to divide the laser beam, and the interval between the laser beams is controlled by moving the beam splitter in a direction substantially perpendicular to the incidence of the laser beam. 14. The laser processing method according to any one of. 39. The laser according to claim 38, wherein the position of each laser beam on the workpiece corresponding to the substantially vertical movement amount of the beam splitter is obtained in advance as data, and the substantially vertical movement of the beam splitter is controlled based on the obtained data. Processing method. 40. The laser processing method according to claim 38 or 39, wherein the workpiece and the dividing means are relatively rotated. The laser processing method according to any one of claims 2 to 40, wherein the positioning means relatively moves the workpiece to be irradiated with the laser beam and the laser beam only in one direction. The laser processing method according to any one of claims 2 to 40, wherein the control device performs control so as to generate a plurality of laser beam trajectories with respect to one processing site. An apparatus for use in a process in which a composite material having a configuration using a brittle material as compared with a base material at least one layer provided on the surface of the base material is subjected to a laser scribing process on both ends of a certain region. A laser processing apparatus comprising: means for outputting a laser beam from; means for dividing the output laser light into a plurality; and means for irradiating a predetermined position of the workpiece with the divided laser light. An apparatus for use in a process in which a composite material having a configuration using a brittle material as compared with a base material at least one layer provided on the surface of the base material is subjected to a laser scribing process on both ends of a certain region. Means for outputting a laser beam from, a means for dividing the outputted laser beam into a plurality of means, a means for determining an interval between the laser beams when the divided laser beam is irradiated onto a workpiece, A laser processing apparatus having means for irradiating a predetermined position of a workpiece with a determined laser beam. When laser processing is performed by moving relative to the processing part of the workpiece wider than the width of each divided laser beam, the interval between the laser beams is set as the maximum interval of the processing part of the workpiece during the initial relative movement. 45. The laser processing apparatus according to claim 44, further comprising control means for narrowing the interval. 46. The control unit according to claim 42 or 45, further comprising control means for processing the position of the outermost width of the two preceding laser beams among the divided laser beams and subsequently processing the other divided laser beams on the inside thereof. Laser processing equipment. 49. The laser processing apparatus according to claim 46, wherein the distance between the two preceding laser beams and the laser beam that processes the inside thereof is sufficiently long so that the distance is reduced by a thermal effect that does not affect the operation of the workpiece. 47. The laser beam having two preceding laser beams and the laser beam that continuously processes the inside thereof, and the shape of the laser beam that is continuously processed is different from the shape of the preceding laser beam. The laser processing apparatus as described. 49. The laser processing apparatus according to any one of claims 44 to 48, wherein when processing a workpiece having a plurality of processing parts, the laser processing apparatus includes a control unit for controlling the interval between laser beams in accordance with the interval between adjacent processing parts. 49. The laser according to claim 44, further comprising means for controlling the interval of each laser beam in accordance with the interval of at least one or more machining sites when machining a workpiece having a plurality of machining sites. Processing equipment. 49. The laser processing apparatus according to any one of claims 44 to 48, further comprising means for controlling the interval between the laser beams in accordance with the width of one processing site. 49. The laser processing apparatus according to any one of claims 44 to 48, further comprising means for controlling the interval between the laser beams in the relative movement direction so that the trajectories of the laser beams are substantially equal. When machining a plurality of machining sites, if the machining sites are odd numbers, the intervals between the laser beams are controlled at least once according to the intervals between adjacent machining sites or at least one machining site separated from each other. 49. The laser processing apparatus according to claim 44, further comprising control means for providing an interval between the laser beams in the relative movement direction so that the trajectories of the laser beams are substantially equal. 54. The control means according to claim 52 or 53, further comprising control means for setting the energy of each laser beam to approximately half of the normal energy when providing the interval of each laser beam in the relative movement direction so that the locus of each laser beam is substantially equal. Laser processing equipment. When machining a plurality of machining sites, the control means controls the interval between the laser beams according to the interval between adjacent machining sites or at least one machining site separated by at least one machining site. The laser processing apparatus according to any one of claims 44 to 48, wherein the laser processing apparatus is a control unit that irradiates the laser beam so that the splitting unit is removed from the optical path of the laser beam and is not branched at least once. When dividing the laser beam, the laser beam is reflected by a plurality of mirrors arranged so as to irradiate one laser beam divided by the half mirror and the other laser beam divided by the half mirror in the same direction on the same axis, The laser processing apparatus according to any one of claims 44 to 55, further comprising means for changing an angle of a reflection angle variable mirror disposed on an optical path of laser light reflected by a plurality of mirrors to control an interval between the laser lights. The laser beam is divided by a first half mirror disposed on the optical path of the laser beam, and one laser beam divided by the first half mirror is reflected by the first mirror in the same direction as the other laser beam. Each laser beam reflected by the first mirror is reflected by the second mirror to the second half mirror that passes the other laser beam, and each angle of the second mirror is controlled to control each laser beam. The laser processing apparatus according to claim 56, further comprising means for controlling a light interval. 58. The laser processing apparatus according to claim 57, further comprising means for previously obtaining, as data, an interval between each laser beam on the workpiece corresponding to the angle of the second mirror, and controlling based on the obtained data. The laser beam is divided by a first half mirror disposed on the optical path of the laser beam, and one laser beam divided by the first half mirror is reflected by the first mirror in the same direction as the other laser beam. The one laser beam reflected by the first mirror is reflected by the second mirror to the second half mirror that allows the other laser beam to pass through, and the angles of the first mirror and the second mirror are determined. 57. The laser processing apparatus according to claim 56, further comprising means for controlling the interval between the laser beams. 60. Laser processing according to claim 59, further comprising means for previously obtaining, as data, an interval between each laser beam on the workpiece corresponding to the angle of the first mirror and the angle of the second mirror, and controlling based on the obtained data. apparatus. 61. The laser processing apparatus according to claim 56, further comprising a mechanism for relatively rotating and moving the workpiece and the dividing means. When dividing the laser beam, the laser beam is reflected by a plurality of mirrors arranged so as to irradiate the laser beam divided by the half mirror and the other laser beam divided by the half mirror from directions facing each other substantially coaxially, Means for controlling a distance between the laser beams by moving a prism or a cross-sectional prism-shaped mirror disposed substantially at a position where the one laser beam and the other laser beam substantially intersect with each other in a direction substantially perpendicular to the laser beam direction; The laser processing apparatus according to any one of claims 44 to 55. The distance between the laser beams on the workpiece corresponding to the amount by which the prism or the prism having a cross-sectional prism shape is moved in a direction substantially perpendicular to the direction of the laser beam is obtained in advance as data, and the prism or the 64. The laser processing apparatus according to claim 62, further comprising means for controlling an amount by which the mirror having the cross-sectional prism shape is moved in a direction substantially perpendicular to the direction of the laser beam. 64. The laser processing apparatus according to claim 62 or 63, further comprising a mechanism for relatively rotating and moving the workpiece and the dividing means. A diffractive optical element disposed on the optical path of the laser light is used to divide the laser light, and the diffractive optical element is rotated with respect to the incidence of the laser light to control the interval between the laser lights. The laser processing apparatus according to any one of 44 to 55. 66. A lens for receiving each laser beam divided between the diffractive optical element and the workpiece is provided, and the diffractive optical element, the lens, and the workpiece are disposed at substantially the same distance as the focal length of the lens. Laser processing equipment. A collimator comprising a plurality of lenses for entering each laser beam divided between the diffractive optical element and the workpiece, and a lens for entering each laser beam emitted from the collimator are arranged, and a plurality of collimators are arranged. The laser processing apparatus according to claim 65, wherein an aperture is provided between the lenses. 68. The laser processing apparatus according to claim 67, wherein d is 2L or more and 3L or less, wherein d is the diameter of the aperture and L is a beam separation width by laser diffraction. 69. The laser according to claim 67 or 68, wherein f0 satisfies a condition greater than 0.5f, where f0 is a focal length of each lens of the collimator and f is a focal length of a lens disposed closer to the workpiece than the collimator. Processing equipment. 70. The laser processing apparatus according to claim 69, wherein f0 satisfies a condition sufficiently larger than 3f, where f0 is a focal length of each lens of the collimator and f is a focal length of a lens disposed closer to the workpiece than the collimator. The mechanism according to any one of claims 65 to 70, further comprising: a mechanism for previously obtaining, as data, an interval between each laser beam on the workpiece corresponding to the rotation angle of the diffractive optical element, and controlling the rotation angle of the diffractive optical element based on the obtained data. The laser processing apparatus in any one. 72. The laser processing apparatus according to claim 65, further comprising a mechanism for rotating the workpiece. A means for controlling an interval between each laser beam by using an acoustooptic device arranged on an optical path of the laser beam and dividing a frequency of a drive signal applied to the acoustooptic device when dividing the laser beam. The laser processing apparatus according to any one of 44 to 55. The laser processing according to claim 73, further comprising means for previously obtaining, as data, an interval between each laser beam on the workpiece corresponding to the frequency of the drive signal applied to the acoustooptic device, and controlling the frequency based on the obtained data. apparatus. The laser processing apparatus according to claim 73 or 74, further comprising a mechanism for relatively rotating and moving the workpiece and the dividing means. When splitting a laser beam, a beam splitter disposed on the optical path of the laser beam is used, and means for controlling the interval between the laser beams by rotating the beam splitter with respect to the incidence of the laser beam is provided. The laser processing apparatus in any one of. 77. The laser processing apparatus according to claim 76, further comprising: a mechanism that performs at least one of rotation in a direction in which laser light travels and rotation in a direction perpendicular to the direction in which laser light travels as the rotation direction of the beam splitter. 78. A laser according to claim 76 or 77, further comprising a mechanism for previously obtaining, as data, the position of each laser beam on the workpiece corresponding to the rotation angle of the beam splitter, and controlling the rotation angle of the beam splitter based on the obtained data. Processing equipment. 79. The laser processing apparatus according to claim 76, further comprising a mechanism for relatively rotating and moving the workpiece and the dividing means. When dividing the laser beam, a beam splitter arranged on the optical path of the laser beam is used, and the beam splitter is moved in a direction substantially perpendicular to the incidence of the laser beam to control the interval between the laser beams. The laser processing apparatus according to any one of claims 44 to 55. 80. A means for obtaining in advance the position of each laser beam on the workpiece corresponding to the substantially vertical movement amount of the beam splitter as data, and controlling the substantially vertical movement of the beam splitter based on the obtained data. The laser processing apparatus as described. The laser processing apparatus according to claim 80 or 81, further comprising a mechanism for relatively rotating and moving the workpiece and the dividing means. The laser processing apparatus according to any one of claims 44 to 82, wherein the positioning means has a mechanism for relatively moving the workpiece to be irradiated with the laser beam and the laser beam only in one direction. The laser processing apparatus according to any one of claims 44 to 82, wherein the control device has means for controlling so as to generate a plurality of laser beam trajectories with respect to one processing site.

Images