JP2010205925A - Aligner, adjustment method, and method of manufacturing device - Google Patents

Abstract

High-order aberrations of a projection optical system can be adjusted independently, and excellent imaging performance is realized.
Each of optical elements 30a, 30c, 30e, and 30g is driven in the optical axis direction of a projection optical system 30 to adjust aberration components that are axially symmetric with respect to the optical axis such as distortion, spherical aberration, and field curvature. . The drive unit 50 drives each of the optical elements 30a, 30c, 30e, and 30g in a direction that is decentered with respect to the optical axis of the projection optical system 30, thereby decentering distortion, on-axis coma aberration, and one-sided Kakeas aberration. The aberration component asymmetric with respect to the optical axis is adjusted.
[Selection] Figure 1

Description

  The present invention relates to an exposure apparatus, an adjustment method, and a device manufacturing method.

  A projection exposure apparatus is used when a fine semiconductor device such as a semiconductor memory or a logic circuit or a liquid crystal device is manufactured by using a photolithography technique. The projection exposure apparatus projects a pattern (a plurality of different types of patterns) formed on a reticle (mask) onto a substrate such as a wafer via a projection optical system and transfers the pattern.

  In recent years, semiconductor devices have been highly integrated, and in order to transfer highly integrated patterns to a substrate with high accuracy, it is indispensable to reduce aberrations and distortion of the projection optical system. . Here, the aberration of the projection optical system is not only due to the aberration in the design value, but also due to an aberration that changes due to a manufacturing error in the manufacturing stage, an environment (atmospheric pressure and temperature) where the exposure apparatus is arranged, a change with time, and an exposure heat. Includes changing aberrations.

  Accordingly, several techniques for reducing (correcting) aberrations and distortion of the projection optical system have been proposed (see Patent Documents 1 and 2). For example, Patent Document 1 discloses a technique for correcting magnification, distortion, spherical aberration, astigmatism, and coma by driving an optical element that constitutes a projection optical system. Patent Document 2 discloses a technique for correcting spherical aberration and the like by controlling the wavelength of light (exposure light) from a light source.

JP-A-11-195602 Japanese Patent Laid-Open No. 7-220988

  However, in the prior art, higher-order aberrations cannot be adjusted (corrected) independently. Therefore, as the degree of integration of semiconductor devices increases, the aberration and distortion of the projection optical system are sufficiently reduced (corrected). It is becoming impossible.

  The present invention has been made in view of such problems of the prior art, and provides an exposure apparatus that can independently adjust higher-order aberrations of a projection optical system and realizes excellent imaging performance. For illustrative purposes.

  In order to achieve the above object, an exposure apparatus according to one aspect of the present invention is an exposure apparatus including a projection optical system that projects a reticle pattern onto a substrate, and the projection optical system is driven by a unit amount. A first optical element having a first value of a ratio of an aberration change amount of the first component and an aberration change amount of the second component of the projection optical system, and the projection when the unit amount is driven. A second optical element having a ratio of an aberration change amount of the first component and an aberration change amount of the second component of the optical system different from the first value; and the projection when the unit amount is driven. An exposure apparatus comprising: at least one third optical element having a ratio of an aberration change amount of the first component and an aberration change amount of the second component of the optical system different from the first value; A driving unit for driving each of the first optical element and the second optical element; Control for driving the first optical element and the second optical element by the drive unit so that each of the aberration of the first component and the aberration of the second component of the projection optical system is reduced. A ratio of an aberration change amount of the first component and an aberration change amount of the second component when the unit optical system is driven as the second optical element. The optical element having a second value that is farther from the first value than the third optical element is selected.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an exposure apparatus that can independently adjust higher-order aberrations of the projection optical system and realizes excellent imaging performance.

It is the schematic which shows the structure of the exposure apparatus as 1 side surface of this invention. It is a figure which shows an example of the drive of the optical element of the projection optical system of the exposure apparatus shown in FIG. The amount of change in high-order spherical aberration (C16) and low-order spherical aberration (C9) when each of the plurality of optical elements of the projection optical system of the exposure apparatus shown in FIG. 1 is driven by a unit amount in the optical axis direction. It is a graph which shows ratio with change amount. It is a figure for demonstrating each of the base formation part and fan formation part of eccentric distortion. 3 is a flowchart for explaining a method of adjusting a projection optical system of the exposure apparatus shown in FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  With reference to FIG. 1, an exposure apparatus 1 as one aspect of the present invention will be described. In this embodiment, the exposure apparatus 1 is a projection exposure apparatus that exposes the pattern of the reticle 20 onto the wafer 40 by a step-and-scan method. However, the exposure apparatus 1 can also apply a step-and-repeat method and other exposure methods.

  The exposure apparatus 1 includes an illumination device 10, a reticle stage 25 on which the reticle 20 is placed, a projection optical system 30, a wafer stage 45 on which the wafer 40 is placed, a drive unit 50, and a control unit 60.

  The illumination device 10 illuminates a reticle 20 on which a transfer pattern is formed, and includes a light source 12 and an illumination optical system 14.

As the light source 12, for example, an ArF excimer laser having a wavelength of about 193 nm or a KrF excimer laser having a wavelength of about 248 nm is used. However, the light source 12 is not limited to the excimer laser, and an F ₂ laser, an ultrahigh pressure mercury lamp, or the like may be used. The light source 12 includes a wavelength variable unit 12a that changes the wavelength of the emitted light (that is, exposure light).

  The illumination optical system 14 is an optical system that uses the light from the light source 12 to illuminate the reticle 20 with a uniform illuminance distribution and predetermined illumination conditions, and includes, for example, a lens, a mirror, an optical integrator, a diaphragm, and the like. .

  The reticle 20 has a transfer pattern, and is supported and driven by the reticle stage 25. Diffracted light emitted from the reticle 20 is projected onto the wafer 40 via the projection optical system 30. The reticle 20 and the wafer 40 are arranged in an optically conjugate relationship. Since the exposure apparatus 1 is a step-and-scan type exposure apparatus, the pattern of the reticle 20 is transferred to the wafer 40 by scanning the reticle 20 and the wafer 40.

  The reticle stage 25 supports the reticle 20 and drives the reticle 20 using, for example, a linear motor. Specifically, the reticle stage 25 drives the reticle 20 in the optical axis direction of the projection optical system 30, the direction perpendicular to the optical axis of the projection optical system 30, and the rotation direction thereof. In addition, the reticle stage 25 is controlled by the control unit 60, and the reticle 20 is adjusted so that the imaging state (eccentric distortion, axial coma aberration, single Vokeas aberration, etc.) of the light passing through the projection optical system 30 is adjusted. It can also be driven. Specifically, the reticle stage 25 drives the reticle 20 in the optical axis direction of the projection optical system 30 or tilts the reticle 20 with respect to a plane perpendicular to the optical axis of the projection optical system 30. Thereby, the imaging state of the light passing through the projection optical system 30 is adjusted, and the projection optical system 30 can realize desired imaging characteristics.

  The projection optical system 30 is an optical system that includes a plurality of optical elements 30 a to 30 g and projects the pattern of the reticle 20 onto the wafer 40. The optical elements 30a to 30g are lenses in the present embodiment, but may be mirrors or the like.

  The wafer 40 is a substrate onto which the pattern of the reticle 20 is projected (transferred), and is supported and driven by the wafer stage 45. However, a glass plate or other substrate can be used instead of the wafer 40. A resist is applied to the wafer 40.

  The wafer stage 45 drives the wafer 40 in the optical axis direction of the projection optical system 30, the direction perpendicular to the optical axis of the projection optical system 30, and the rotation direction thereof using a linear motor or the like, like the reticle stage 25. .

  The drive unit 50 is controlled by the control unit 60 to drive a part of the plurality of optical elements 30a to 30g, in the present embodiment, each of the optical elements 30a, 30c, 30e, and 30g. Specifically, as shown in FIG. 2A, the drive unit 50 drives each of the optical elements 30a, 30c, 30e, and 30g in the optical axis direction of the projection optical system 30, thereby causing distortion, spherical aberration, An aberration component that is axially symmetric with respect to the optical axis such as curvature of field is adjusted. The drive unit 50 drives each of the optical elements 30a, 30c, 30e, and 30g in a direction that is decentered with respect to the optical axis of the projection optical system 30, thereby decentering distortion, on-axis coma aberration, and one-sided Kakeas aberration. The aberration component asymmetric with respect to the optical axis is adjusted. The driving in the direction decentered with respect to the optical axis of the projection optical system 30 is a direction perpendicular to the optical axis of the projection optical system 30 as shown in FIGS. 2B and 2C. And tilting with respect to a plane perpendicular to the optical axis of the projection optical system 30.

  The control unit 60 has a CPU and a memory, and controls the operation of the exposure apparatus 1. In particular, in this embodiment, the control unit 60 calculates the driving direction and driving amount of the optical elements 30a, 30c, 30e, and 30g for adjusting (reducing) the aberration of the projection optical system 30 to a target value, The drive unit 50 is controlled according to the drive direction and drive amount. Further, the control unit 60 controls the wavelength variable unit 12 a and the reticle stage 25 in order to correct (adjust) the imaging state of the light that has passed through the projection optical system 30.

  Here, the optical elements 30a, 30c, 30e, and 30g driven by the drive unit 50 will be described. In the optical elements 30a, 30c, 30e, and 30g, the ratio between the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system 30 when the unit amount is driven is a first value. A first optical element and a second optical element different from the first value. Further, in the optical elements 30a, 30c, 30e, and 30g, the ratio of the aberration change amount of the first component and the second aberration change amount of the projection optical system 30 when the unit amount is driven is different from the first value. And at least one third optical element. As the second optical element, the ratio of the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system 30 when driven by a unit amount is higher than that of the third optical element. An optical element having a second value away from the value of 1 is selected. On the other hand, as the third optical element, as described above, the ratio between the aberration change amount of the first component and the second aberration change amount of the projection optical system 30 when driven by a unit amount is strictly, Although different from the first value, an optical element having a value in a range that can be regarded as substantially the same as the first value is selected. Note that the aberration change amount (sensitivity) of the projection optical system 30 when the optical element is driven by a unit amount is obtained, for example, by performing a simulation based on the design value of each optical element constituting the projection optical system 30. can do. The aberration change amount of the projection optical system 30 when the optical element is driven by a unit amount can also be obtained by actually driving each optical element constituting the projection optical system 30 and measuring the aberration change amount. it can.

  When the aberration of the projection optical system 30 is expressed by a Zernike polynomial, 16 terms of the Zernike coefficient corresponding to higher-order spherical aberration are the first component aberration (C16), and the Zernike coefficient corresponding to the lower-order spherical aberration is The ninth term is specifically described as the second component aberration (C9).

  FIG. 3 shows a change amount (sensitivity) of high-order spherical aberration (C16) and a low-order spherical surface when each of the plurality of optical elements 30a to 30g of the projection optical system 30 is driven by a unit amount in the optical axis direction. It is a graph which shows ratio with the variation | change_quantity (sensitivity) of an aberration (C9). In FIG. 3, the vertical axis adopts the sensitivity of high-order spherical aberration (C16), the horizontal axis adopts the sensitivity of low-order spherical aberration (C9), and one plot corresponds to one optical element. To do. In FIG. 3, the circled optical element group α is an optical element in which the ratio of the sensitivity of the higher order spherical aberration (C16) and the sensitivity of the lower order spherical aberration (C9) can be regarded as substantially the same. is there. On the other hand, in the optical element β, the sensitivity of the higher order spherical aberration (C16) of the optical element group α is the ratio of the sensitivity of the higher order spherical aberration (C16) to the sensitivity of the lower order spherical aberration (C9). And the ratio of the sensitivity of the lower order spherical aberration (C9) is significantly different (ie farthest). Therefore, an optical element β in which the ratio of the sensitivity of the higher-order spherical aberration (C16) and the sensitivity of the lower-order spherical aberration (C9) is different from the optical element group α (other optical element group) is set by the driving unit 50. Select as at least one of the optical elements 30a, 30c, 30e and 30g to be driven. As a result, each of the optical elements 30a, 30c, 30e, and 30g is appropriately driven in the direction of the optical axis of the projection optical system 30, so that the higher-order spherical aberration (C16) and the lower-order spherical aberration (C9) are independent. Thus, adjustment (reduction) can be performed. Here, the stroke of unit drive by the drive unit 50 is L, the adjustment amount of the higher-order spherical aberration (C16) of the projection optical system 30 is a, and low when the optical element β is driven by a unit amount in the optical axis direction. The sensitivity of the next spherical aberration (C9) is x, and the sensitivity of the higher order spherical aberration (C16) is y. Also, let m be the ratio between the sensitivity of the low-order spherical aberration (C9) and the sensitivity of the high-order spherical aberration (C16) when the optical element group α is driven by a unit amount in the optical axis direction. In this case, the optical element β preferably satisfies the relationship y × L−x × L × m> a.

  However, the aberration of the first component and the aberration of the second component of the projection optical system 30 are not limited to the high-order spherical aberration (C16) and the low-order spherical aberration (C9), respectively. For example, the aberration of the first component and the aberration of the second component of the projection optical system 30 may be a fifth-order distortion and a third-order distortion, respectively. In this case, among the optical elements 30a, 30c, 30e, and 30g driven by the drive unit 50, optical elements having a ratio of the sensitivity of the fifth-order distortion to the sensitivity of the third-order distortion are different from those of the other optical element groups. Select as at least one of Accordingly, the third-order distortion and the fifth-order distortion can be independently adjusted (reduced) by appropriately driving each of the optical elements 30a, 30c, 30e, and 30g in the optical axis direction of the projection optical system 30. Is possible.

  Further, the 14th term of the Zernike coefficient and the 7th term of the Zernike coefficient are respectively expressed as the first component aberration (high-order axial coma aberration (C14)) and the second component aberration (low-order aberration) of the projection optical system 30. On-axis coma (C7)) may be used. In this case, the drive unit 50 drives an optical element in which the ratio of the sensitivity of the high-order axial coma aberration (C14) to the sensitivity of the low-order axial coma aberration (C7) is different from that of the other optical element groups. As at least one of the optical elements 30a, 30c, 30e and 30g. Thus, by driving each of the optical elements 30a, 30c, 30e, and 30g appropriately in a direction that is decentered with respect to the optical axis of the projection optical system 30, high-order axial coma (C14) and low-order coma It is possible to independently adjust (reduce) the on-axis coma aberration (C7).

  Further, the 12 terms of the Zernike coefficient and the 5 terms of the Zernike coefficient are respectively expressed as the first component aberration (high-order one-sided Bokeh (C12)) and the second component aberration (low-order one-sided Bakeasus) of the projection optical system 30. (C5)). In this case, an optical element 30a driven by the drive unit 50 is an optical element in which the ratio of the sensitivity of the high-order one-sided Vokeas (C12) and the sensitivity of the low-order one-sided Vokeas (C5) is different from the other optical element groups. , 30c, 30e, and 30g. As a result, each of the optical elements 30a, 30c, 30e, and 30g is appropriately driven in a direction that is eccentric with respect to the optical axis of the projection optical system 30, so that the high-order half-bokes (C12) and the low-order half-pieces are obtained. It is possible to independently adjust (reduce) the Vokeas (C5).

  Further, the 13th term of the Zernike coefficient and the 6th term of the Zernike coefficient are respectively expressed as the first component aberration (high-order aberration (C13)) and the second component aberration (low-order aberration (C6) of the projection optical system 30. )). In this case, optical elements 30a and 30c driven by the drive unit 50 are optical elements in which the ratio of the sensitivity of the high-order aberration (C13) and the sensitivity of the low-order aberration (C6) is different from that of other optical element groups. , 30e and 30g. Thus, by driving each of the optical elements 30a, 30c, 30e, and 30g appropriately in a direction that is decentered with respect to the optical axis of the projection optical system 30, high-order aberration (C13) and low-order aberration ( C6) can be adjusted (reduced) independently.

  Further, the decentered portion of the decentering distortion and the decentered distortion of the fan forming portion may be the aberration of the first component and the aberration of the second component of the projection optical system 30, respectively. In this case, optical elements 30a, 30c, 30e driven by the drive unit 50 are optical elements having a ratio of the sensitivity of the decentration distortion to the platform formation and the sensitivity of the decentration distortion fan formation to the other optical element groups. Select as at least one of 30g. As a result, by appropriately driving each of the optical elements 30a, 30c, 30e and 30g in the direction decentering with respect to the optical axis of the projection optical system 30, the platform formation and the fan formation of the eccentric distortion can be independently performed. It is possible to adjust (reduce). In addition, the base formation part and the fan formation part of the eccentric distortion are respectively defined as shown in FIGS. 4 (a) and 4 (b).

  4 (a) and 4 (b), the horizontal direction is the x-axis, the vertical direction is the y-axis, the image height coordinates are (x, y), the x-axis direction distortion is dx, and the y-axis direction distortion is dy and the proportionality constant are a to d. In this case, the base formation portion is expressed by the following Equation 1 or Equation 2, and the fan formation portion is expressed by the following Equation 3 or Equation 4.

dx = a * x * y, dy = a * y ² (Formula 1)
dx = b * x ² , dy = b * x * y (Formula 2)
dx = −c * x * y, dy = c * x ² (Formula 3)
dx = d * y ² , dy = −d * x * y (Formula 4)
In addition, although each of Formula 1 and Formula 2 represents a part for forming a table, directions of the table forming part are orthogonal to each other. In general, the trapezoidal portion is expressed by these linear sums. Similarly, each of Expression 3 and Expression 4 represents the fan formation, but the directions of the fan formation are orthogonal to each other. In general, the fan formation is expressed by a linear sum of these.

  It is also possible to focus on the sagittal image surface and the meridional image surface formed by the light that has passed through the projection optical system 30 when driven by a unit amount. In this case, optical elements 30a, 30c, 30e driven by the drive unit 50 are optical elements having a ratio between the sagittal image plane change amount and the meridional image plane change amount when the unit amount is driven different from those of other optical element groups. Select as at least one of 30g. Thus, each of the optical elements 30a, 30c, 30e, and 30g is independently driven so that the sagittal image plane and the meridional image plane coincide with each other by appropriately driving in the optical axis direction of the projection optical system 30. Adjustment (correction) can be performed.

  Hereinafter, a method for adjusting the projection optical system 30 will be described with reference to FIG. FIG. 5 is a flowchart for explaining a method for adjusting the projection optical system 30.

  In S502, the amount of change in aberration of the first component and the amount of change in aberration of the second component of the projection optical system 30 when each of the plurality of optical elements 30a to 30g constituting the projection optical system 30 is driven by a unit amount. Get the ratio of. Specifically, as described above, the graph as shown in FIG. 3 is acquired by simulation or actual measurement. Hereinafter, the ratio between the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system 30 when the unit amount is driven is referred to as an aberration change amount ratio.

  In S504, based on the aberration change amount ratio acquired in S502, an optical element (for example, the optical element shown in FIG. 3) having an aberration change amount ratio different from that of the other optical element group (for example, the optical element group α shown in FIG. 3). Select β).

  In S506, some of the optical elements 30a to 30g constituting the projection optical system 30 are driven so that the aberration change amount ratio selected in S504 includes an optical element different from the other optical element groups. enable.

  In S508, for each of the optical elements that can be driven in S506, a driving direction and a driving amount for reducing each of the aberration of the first component and the aberration of the second component of the projection optical system 30 are calculated. For this calculation, it is preferable to use an optimization method, and the optimization variables, constraint conditions, and objective function are set as follows, for example.

Optimization variable: Drive amount of optical element that can be driven in step S506 Optimization constraint condition: Upper limit and lower limit of drive amount of optical element that can be driven in step S506 Optimization target function: First component Aberration of second component (ie, other component) that occurs when adjusting aberration (for example, aberration of other terms of Zernike polynomial, distortion, and field curvature generated when adjusting higher-order spherical aberration) Sum multiplied by a predetermined weight)
Then, a variable solution that minimizes the objective function within a range that satisfies the constraint conditions is obtained from the optimization method. Optimization algorithms include linear programming, quadratic programming, quadratic cone programming, and simplex method. The calculation of the driving amount of the optical element using the optimization method is disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 2005-268451.

  In S510, the optical element that can be driven in S506 is driven according to the driving direction and driving amount calculated in S508, and the first component aberration and the second component aberration of the projection optical system 30 are adjusted.

  Thus, according to the adjustment method of the present embodiment, each of the first aberration and the second aberration can be adjusted independently. Accordingly, for example, the projection optical system 30 can adjust high-order aberrations and low-order aberrations independently, thereby realizing excellent imaging performance.

  In the exposure, light emitted from the light source 12 illuminates the reticle 20 by the illumination optical system 14. The light reflecting the pattern of the reticle 20 is imaged on the wafer 40 by the projection optical system 30. As described above, in the projection optical system 30 used by the exposure apparatus 1, high-order aberrations and low-order aberrations are independently adjusted to realize excellent imaging performance. Therefore, the exposure apparatus 1 can provide a high-quality device (semiconductor element, LCD element, imaging element (CCD, etc.), thin film magnetic head, etc.) with high throughput and high cost efficiency. Such a device includes a step of exposing a substrate (wafer, glass plate, etc.) coated with a photoresist (photosensitive agent) using the exposure apparatus 1, a step of developing the exposed substrate, and other known steps. , Manufactured by going through.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (12)

An exposure apparatus including a projection optical system that projects a reticle pattern onto a substrate,
The projection optical system is
A first optical element having a first value as a ratio of an aberration change amount of the first component and an aberration change amount of the second component of the projection optical system when driven by a unit amount;
A second optical element in which a ratio of an aberration change amount of the first component and an aberration change amount of the second component of the projection optical system when driven by the unit amount is different from the first value;
At least one third optical device in which the ratio of the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system when driven by the unit amount is different from the first value. Elements,
Including
The exposure apparatus includes:
A drive unit for driving each of the first optical element and the second optical element;
Control for driving the first optical element and the second optical element by the driving unit so that each of the aberration of the first component and the aberration of the second component of the projection optical system is reduced. And
Including
As the second optical element, the ratio of the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system when driven by the unit amount is the third optical element. An exposure apparatus, wherein an optical element having a second value that is farther from the first value than an element is selected. When the aberration of the projection optical system is expressed by a Zernike polynomial, the aberration of the first component of the projection optical system is the 16th term of the Zernike coefficient, and the aberration of the second component of the projection optical system is the Zernike coefficient. Corresponds to item 9,
The control unit projects the first optical element and the second optical element so that an aberration corresponding to the 16th term of the Zernike coefficient and an aberration corresponding to the 9th term of the Zernike coefficient are reduced. The exposure apparatus according to claim 1, wherein the exposure unit is driven in the optical axis direction of the optical system by the driving unit. The aberration of the first component of the projection optical system corresponds to fifth-order distortion, and the aberration of the second component of the projection optical system corresponds to third-order distortion,
The control unit moves the first optical element and the second optical element in the optical axis direction of the projection optical system so that each of the fifth-order distortion and the third-order distortion is reduced. The exposure apparatus according to claim 1, wherein the exposure apparatus is driven by: When the aberration of the projection optical system is expressed by a Zernike polynomial, the aberration of the first component of the projection optical system is the 14th term of the Zernike coefficient, and the aberration of the second component of the projection optical system is the Zernike coefficient. Corresponds to item 7,
The controller drives the first optical element and the second optical element so that an aberration corresponding to the 14th term of the Zernike coefficient and an aberration corresponding to the 7th term of the Zernike coefficient are reduced. The exposure apparatus according to claim 1, wherein the exposure unit is driven in a direction decentered with respect to the optical axis of the projection optical system. When the aberration of the projection optical system is expressed by a Zernike polynomial, the aberration of the first component of the projection optical system is the 12th term of the Zernike coefficient, and the aberration of the second component of the projection optical system is the Zernike coefficient. Corresponds to item 5,
The controller drives the first optical element and the second optical element so that an aberration corresponding to the 12th term of the Zernike coefficient and an aberration corresponding to the 5th term of the Zernike coefficient are reduced. The exposure apparatus according to claim 1, wherein the exposure unit is driven in a direction decentered with respect to the optical axis of the projection optical system. When the aberration of the projection optical system is expressed by a Zernike polynomial, the aberration of the first component of the projection optical system is the 13th term of the Zernike coefficient, and the aberration of the second component of the projection optical system is the Zernike coefficient. Corresponds to item 6,
The controller drives the first optical element and the second optical element so that an aberration corresponding to the 13th term of the Zernike coefficient and an aberration corresponding to the 6th term of the Zernike coefficient are reduced. The exposure apparatus according to claim 1, wherein the exposure unit is driven in a direction decentered with respect to the optical axis of the projection optical system. The aberration of the first component of the projection optical system corresponds to a stage formation of eccentric distortion, and the aberration of the second component of the projection optical system corresponds to a fan formation of eccentric distortion,
The control unit causes the drive unit to move the first optical element and the second optical element with respect to the optical axis of the projection optical system so that the platform formation and the fan formation of the eccentric distortion are reduced. The exposure apparatus according to claim 1, wherein the exposure apparatus is driven in an eccentric direction.   The driving unit drives the first optical element and the second optical element in a direction perpendicular to an optical axis of a projection optical system, or drives the first optical element and the second optical element. The exposure apparatus according to claim 4, wherein the exposure apparatus is tilted with respect to a plane perpendicular to the optical axis of the projection optical system.   When the unit amount driving stroke is L, the aberration adjustment amount of the first component of the projection optical system is a, and the second optical element is driven by a unit amount in the optical axis direction of the projection optical system. The aberration change amount of the first component of the projection optical system is x, and the second component of the projection optical system when the second optical element is driven by a unit amount in the optical axis direction of the projection optical system. 2. The exposure apparatus according to claim 1, wherein y is an aberration variation amount and m is the first value of the first optical element, wherein y × L−x × L × m> a is satisfied. . An exposure apparatus including a projection optical system that projects a reticle pattern onto a substrate,
The projection optical system is
A first optical element whose ratio between a sagittal image plane change amount and a meridional image plane change amount formed by light that has passed through the projection optical system when driven by a unit amount is a first value;
A second optical element having a ratio of a sagittal image plane change amount and a meridional image plane change amount formed by light that has passed through the projection optical system when driven by the unit amount is different from the first value;
At least one third optical element having a ratio of a sagittal image plane change amount and a meridional image plane change amount formed by light that has passed through the projection optical system when driven by the unit amount is different from the first value. When,
Including
The exposure apparatus includes:
A drive unit for driving each of the first optical element and the second optical element;
A controller that drives the first optical element and the second optical element by the driving unit so that a sagittal image plane and a meridional image plane formed by light that has passed through the projection optical system coincide;
Including
As the second optical element, a ratio of a sagittal image plane change amount and a meridional image plane change amount formed by light that has passed through the projection optical system when driven by the unit amount is the third optical element. An optical device having a second value that is farther from the first value than the first value is selected. An adjustment method for adjusting a projection optical system for projecting a reticle pattern onto a substrate,
For each of the plurality of optical elements constituting the projection optical system, the ratio between the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system when the optical element is driven by a unit amount. An acquisition step to acquire,
Based on the ratio of the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system acquired in the acquisition step, the aberration change of the first component of the projection optical system A first optical element having a first value of the ratio of the amount and the amount of aberration change of the second component, and the amount of aberration change of the first component and the aberration of the second component of the projection optical system A second optical element having a ratio with a change amount different from the first value; and a ratio between the aberration change amount of the first component and the aberration change amount of the second component of the projection optical system is A selection step of selecting at least one third optical element different from the value of 1;
Each of the first optical element and the second optical element selected in the selection step is driven to adjust the aberration of the first component and the aberration of the second component of the projection optical system. Adjustment steps to
Have
In the selection step, as the second optical element, a ratio between an aberration change amount of the first component and an aberration change amount of the second component of the projection optical system when driven by the unit amount is: An adjustment method comprising: selecting an optical element having a second value farther from the first value than the third optical element. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 10,
Developing the exposed substrate;
A device manufacturing method characterized by comprising:

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