JP2010205773A - Solid-state imaging device and method for manufacturing the same - Google Patents

Abstract

An object of the present invention is to prevent the occurrence of insulation of a wiring pattern due to the inclination or warpage of a solid-state image pickup device substrate at the time of manufacture or after completion of a product in a small solid-state image pickup device, and to improve the quality.
A solid-state image pickup device substrate is mounted on an insulating structure having a through-opening portion so as to close the through-opening portion, and a first adhesive and a second adhesive are used for fixing the solid-state image pickup device substrate. Two types of agents form.
[Selection] Figure 1

Description

  The present invention relates to a solid-state imaging device and a manufacturing method thereof, and more particularly to a small solid-state imaging device formed using a semiconductor imaging device such as a surveillance camera, a medical camera, and an in-vehicle camera, and a manufacturing method thereof. .

  In recent years, the demand for small cameras for mobile phones, in-vehicle components, etc. has been rapidly increasing. This type of small camera uses a solid-state imaging device that outputs an image input as an electrical signal by an optical system such as a lens by a solid-state imaging device. With the downsizing and higher performance of this imaging device, the camera is further downsized and used in various fields, expanding the market as a video input device. In a conventional image pickup apparatus using a semiconductor image pickup device, components such as an LSI on which a lens, a semiconductor image pickup device, a driving circuit thereof, a signal processing circuit, and the like are mounted are respectively formed in a housing or a structure and combined. Conventionally, such a mounting structure is formed by mounting each element on a printed circuit board on a flat plate.

  Therefore, in order to further reduce the size of the device, a solid-state imaging device as shown in FIG. 7 is disclosed (Patent Document 1). In this structure, a solid-state imaging device 103 and an optical filter 109 are mounted on the front and back of a resin structure 101 having an opening 102 and a three-dimensional wiring portion 104. Further, after the solid-state imaging device 103 is connected to the resin structure 101 using the bumps 105, the surroundings are reinforced and fixed by filling a sealing resin 108 around the periphery.

  However, with such a structure and manufacturing method, an increase in the number of pins due to higher functionality of the mounted solid-state imaging device and a reduction in the size of the resin structure can cause an electrical contact interface in some wiring pattern portions. Phenomenon of floating and peeling occurred.

JP 2003-158252 A

  As described above, when floating or peeling at the electrical contact interface occurs, an electrical failure occurs, and even a partial electrical failure becomes a defective product as a solid-state imaging device. In particular, even if the electrical connection at the time of initial assembly is okay, it is difficult to ensure the subsequent reliability, and there is a problem that the incidence of defects increases.

  The present invention has been made in view of the above circumstances, and is characterized in that a first adhesive and a second adhesive are formed to reinforce a solid for reinforcing electrical connection of a solid-state imaging device, It is an object to ensure electrical connection with a substrate and improve the quality of a solid-state imaging device.

The solid-state imaging device according to the present invention is made of an insulating resin and has a structure having a through-opening, a wiring formed on the surface of the structure, connected to the wiring, and the through-opening A solid-state image sensor mounted on the structure so as to close; and a translucent member mounted on the structure so as to face the solid-state image sensor and close the through opening. In order to fix the electrical connection to the structure, two types of adhesives, a first adhesive and a second adhesive, are formed.
With this configuration, the state immediately after the electrical connection when the solid-state imaging element is mounted can be reinforced and fixed with the first adhesive, and then the entire reinforcement and fixing can be performed with the second adhesive. Since the connection can be strengthened, quality and yield can be improved.

Another solid-state imaging device according to the present invention is characterized in that the first adhesive has a high viscosity and the second adhesive has a low viscosity.
With this configuration, when the first adhesive is used, it can be partially reinforced and fixed, and when the second adhesive is used, the whole can be reinforced and fixed. The fixing effect can be improved.

Another solid-state imaging device of the present invention is characterized in that the first adhesive is used at the corners of the solid-state imaging element and the second adhesive is used at the sides of the solid-state imaging element.
With this configuration, it is possible to reinforce and fix corners that are effective against inclination with the first adhesive, and to reinforce and fix the side filling the whole with the second adhesive, thereby improving the reinforcing and fixing effect. I can do it.

Another solid-state imaging device of the present invention is characterized in that the first adhesive is a thermosetting adhesive and the second adhesive is an adhesive having UV curable properties and thermosetting properties. .
With this configuration, the first adhesive is thermally cured and fixed, and then the second adhesive is filled while being irradiated with UV, thereby preventing adhesion of the adhesive to the optical member (such as an optical filter). A solid state imaging device with high reliability can be provided.

Another solid-state imaging device of the present invention is characterized in that an optical filter is used as the translucent member.
With this configuration, good optical characteristics can be obtained.

The method for manufacturing a solid-state imaging device according to the present invention includes a step of mounting a solid-state imaging device on a wiring portion formed on the surface of an insulating resin having a through-opening, and a first portion at a corner of the mounted solid-state imaging device. A step of applying the adhesive, a step of thermally curing the first adhesive at the same time, a step of filling the second adhesive around the solid-state imaging device, and curing the second adhesive. It consists of a process and the process of mounting | wearing a translucent member, It is characterized by the above-mentioned.
With this configuration, it is possible to manufacture a structure in which the reinforcing fixing force is improved, and it is possible to obtain an improvement in quality and yield.

In the method for manufacturing a solid-state imaging device according to the present invention, the filling step is a step of filling the second adhesive while irradiating UV through the through opening.
With this configuration, the first adhesive is thermally cured and fixed, and then the second adhesive is filled while being irradiated with UV, thereby preventing adhesion of the adhesive to an optical filter and the like. A high solid-state imaging device can be provided.

  As described above, according to the solid-state imaging device and the method of manufacturing the same of the present invention, the occurrence of poor electrical connection due to the inclination or warping of the solid-state imaging device substrate is suppressed, and the local electrode portion adhesion is also reinforced. Therefore, a high-quality solid-state imaging device can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
1 and 2 are sectional views of the solid-state imaging device according to the first embodiment of the present invention.
A through opening 2 is formed in the structure 1, and the solid-state imaging device 3 is electrically attached to the wiring pattern 4 formed on the surface of the structure 1 through bumps 5. The solid-state image sensor 3 is mounted so as to close the through-opening 2, and the tip of the bump 5 connected to a terminal (not shown) of the solid-state image sensor 3 is connected by a conductive adhesive 6. The wiring pattern of the structure 1 is connected. The first adhesive 7 is disposed at the corner of the solid-state image sensor 3, and the second adhesive is provided around the bump 5 and the conductive adhesive 6 and between the solid-state image sensor 3 and the structure 1. 8 is filled. An optical filter 9 as a translucent member is installed opposite to the solid-state imaging device 3.
The first adhesive 7 is formed at the corner of the solid-state image sensor 3 as shown in FIG.

The structure 1 is made of an insulating polyphthalamide resin, the optical filter 9 is a crystal refracting plate, and the bump 5 is a gold bump.
The first adhesive reduces the stress applied to the entire connection part by suppressing the inclination and warpage of the entire solid-state imaging device with respect to an external heat change, and plays a role of suppressing the occurrence of connection failure at each connection part. . The second adhesive fills the space around the connection bumps and the space between the solid-state imaging device and the structure, thereby playing a role of reinforcing the partial adhesive force of each connection portion.

  The first adhesive had a high viscosity (140 Pa · s) and used a thermosetting epoxy resin. This is because it stays at the corner of the solid-state imaging device and suppresses the overall movement. The second adhesive had a low viscosity (5 Pa · s), and UV curable and thermosetting epoxy resins were used. This is because the necessary space is filled without any gaps to ensure adhesion.

  By adopting such a configuration, it is possible to further suppress poor connection at the connection portion against thermal changes and external impacts, and there is no electrical insulation failure at the time of manufacture and product completion, and a high quality solid An imaging device can be obtained.

Next, a method for manufacturing the solid-state imaging device will be described. Manufacturing process diagrams are shown in FIGS.
First, the optical filter 9 as a translucent member was bonded to the structure 11 (FIG. 3). Next, the solid-state imaging device substrate 3 was placed on the metal wiring pattern 4 of the structure 1 so as to close the through opening 2 so as to face the optical filter 9 (FIG. 4). At this time, the bumps 5 were formed on the electrodes (not shown) of the solid-state image pickup device substrate 3, and the conductive adhesive 6 was transferred and formed on the tip thereof. The bump 5 was formed of a gold wire, and a silver paste was used as the conductive adhesive 6.

Thus, after installing the solid-state image sensor (substrate) 3 on the (metal) wiring pattern 4, the first adhesive 7 was applied to the corners of the solid-state image sensor 3 as shown in FIG. 6. Here, an epoxy resin that does not contain a UV curing initiator is used as the first adhesive 7.
Thereafter, as shown in FIG. 7, the conductive adhesive 6 and the first adhesive 7 were heat-cured. Subsequently, the second adhesive 8 was filled. As the second adhesive 8, an epoxy resin containing a UV curing initiator was used. At this time, since the first adhesive 7 is present at the corner of the solid-state imaging device 3, the second adhesive 8 was filled from the side of the solid-state imaging device 3.

  When the second adhesive 8 was injected, UV light (not shown) was irradiated from the translucent member 9 side through the opening. As a result, the second adhesive 8 is cured with UV light from the opening 2 side. For this reason, it is possible to fill only the necessary portion without reaching the imaging area of the solid-state imaging device substrate 3. Subsequently, the second adhesive was heat-cured.

  By taking such a manufacturing method, the inclination and the curvature of the solid-state imaging device substrate at the time of curing the conductive paste can be suppressed and firmly fixed in place. Furthermore, partial adhesion can be reinforced with an adhesive filled in the space, and a high-quality solid-state imaging device free from defective electrical insulation can be manufactured.

  As described above, according to the solid-state imaging device and the method of manufacturing the same of the present invention, the occurrence of poor electrical connection due to the inclination or warping of the solid-state imaging device substrate is suppressed, and the local electrode portion adhesion is also reinforced. Therefore, since it is possible to provide a high-quality solid-state imaging device, it can be applied to various electronic devices such as a portable terminal.

It is sectional drawing which shows the solid-state imaging device in the 1st Embodiment of this invention. It is a top view which shows the solid-state imaging device in the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the solid-state imaging device in the 2nd Embodiment of this invention. It is process drawing which shows the manufacturing method of the solid-state imaging device in the 2nd Embodiment of this invention. It is process drawing which shows the manufacturing method of the solid-state imaging device in the 2nd Embodiment of this invention. It is process drawing which shows the manufacturing method of the solid-state imaging device in the 2nd Embodiment of this invention. It is sectional drawing which shows the solid-state imaging device of a prior art example.

DESCRIPTION OF SYMBOLS 1 Structure 2 Through-opening part 3 Solid-state image sensor 4 Wiring pattern 5 Bump 6 Conductive adhesive 7 First adhesive 8 Second adhesive 9 Optical filter

Claims (7)

A structure made of an insulating resin and having a through opening; and
A wiring portion formed on the surface of the structure;
A solid-state imaging device connected to the wiring portion and mounted on the structure so as to close the through opening;
A translucent member mounted on the structure so as to face the solid-state imaging element and close the through opening;
A solid-state imaging device, wherein two types of first adhesive and second adhesive are formed for fixing electrical connection of the solid-state imaging element to the structure. The solid-state imaging device according to claim 1,
The first adhesive has a high viscosity, and the second adhesive has a low viscosity. The solid-state imaging device according to claim 1 or 2,
A solid-state imaging device in which a first adhesive is used at a corner of a solid-state image sensor and a second adhesive is used at a side of the solid-state image sensor. The solid-state imaging device according to any one of claims 1 to 3,
The solid-state imaging device, wherein the first adhesive is a thermosetting adhesive, and the second adhesive is a UV-curable and thermosetting adhesive. The solid-state imaging device according to claim 1,
The translucent member is a solid-state imaging device which is an optical filter. Mounting a solid-state imaging device on a wiring portion formed on the surface of an insulating resin having a through opening; and
Applying a first adhesive to a corner of the mounted solid-state imaging device;
Thermally curing the first adhesive simultaneously;
Filling the periphery of the solid-state image sensor with a second adhesive;
Curing the second adhesive;
A method for manufacturing a solid-state imaging device, comprising: a step of mounting a translucent member. It is a manufacturing method of the solid-state imaging device according to claim 1,
The filling step is a method of manufacturing a solid-state imaging device, which is a step of filling the second adhesive while irradiating UV through the through opening.

Images