JP2010276790A - Display device manufacturing method and display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a display device, by which hollow structure can be made accurately, and to provide the display device. <P>SOLUTION: After the whole side plane 32B of a reflection element 32 is covered with an intermediate film 51, a display panel 10 is stuck by an adhesive layer 41, and the intermediate film 51 is removed by evaporation or burning to form the hollow structure. Then, the hollow structure can be formed accurately since the adhesive layer 41 has no possibility of sticking to the side plane 32B of the reflection element 32. In the adhesive layer 41, an upper plane 41B1 of a non-sticking region 41B has a curved surface shape of convex toward the reflection plate 30. It is preferable that wettability of the intermediate film 51 is improved by providing a protective layer 33 such as silicon nitride at the surface of the reflection element 32, and a whole side plane 32B of the reflection element 32 is reliably covered with the intermediate film 51. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device using a self-luminous element such as an organic light-emitting element (organic EL (Electroluminescence) element) and a display device.

  In a display device using a self-luminous element, it has been proposed to improve the light extraction efficiency from the self-luminous element by providing a reflector (reflector) in the vicinity of the self-luminous element in order to increase display luminance ( For example, see Patent Document 1.) The reflecting plate is formed by disposing a reflecting element such as a truncated cone corresponding to a self-luminous element on a base material. A metal reflective film is usually provided on the side surface of the reflective element. In particular, in order to pursue light extraction efficiency, a total reflection type has been proposed that does not use a metal reflection film, but has a hollow structure, a vacuum or an inert gas around the reflection element, and utilizes the difference in refractive index between the two. (For example, refer to Patent Document 2).

JP 2001-85738 A Japanese Patent No. 3951893

  However, conventionally, when the reflecting plate and the display panel are bonded to each other with the adhesive layer, it is difficult to form the hollow structure with high accuracy, and the optical performance of the reflecting element cannot be obtained.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a method for manufacturing a display device capable of forming a hollow structure with high accuracy, and to improve the shape accuracy of the hollow structure and to improve the optical properties of the reflective element. An object of the present invention is to provide a display device capable of improving performance.

The manufacturing method of a display device according to the present invention includes the following steps (A) to (C).
(A) The process of covering all the side surfaces of the reflective element on the base material with an evaporable or combustible intermediate film (B) A reflective plate having the reflective element and the intermediate film on the base material, and the substrate A step of bonding a display panel having a self-luminous element to each other with an adhesive layer in between (C) A step of bonding the reflector and the display panel and then removing the intermediate film by evaporation or combustion

The display device according to the present invention includes the following components (A) to (D).
(A) Display panel having a self-luminous element on a substrate (B) Reflecting plate disposed opposite to the self-luminous element and having a reflective element on a base material (C) Provided on the self-luminous element, the front end surface of the reflective element It has the non-bonding area | region other than the bonding area | region and bonding area | region which touches, and the upper surface of a non-bonding area | region has a convex curved surface shape toward a reflecting plate (D) The upper surface and reflection of a non-bonding area | region Hollow structure surrounded by element side

  In the display device of the present invention, light generated by the self-luminous element is incident on the front end surface of the reflective element, reflected by the side surface of the reflective element, and extracted outside. Here, since the upper surface of the non-bonding region of the adhesive layer has a convex curved shape toward the reflector, the entire side surface of the reflective element is exposed from the adhesive layer, and the shape accuracy of the hollow structure is high. It has become. Therefore, the optical performance of the reflective element is improved.

  According to the method for manufacturing a display device of the present invention, the entire side surface of the reflective element on the base material is covered with an evaporable or flammable intermediate film, and then the display panel is bonded with an adhesive layer. Since the film is removed by evaporation or combustion, the adhesive layer does not adhere to the side surface of the reflective element, and the hollow structure can be formed with high accuracy.

  According to the display device of the present invention, since the upper surface of the non-bonding region of the adhesive layer is formed in a convex curved shape facing the reflector, the shape accuracy of the hollow structure is improved and the optical performance of the reflective element is improved. It becomes possible to improve.

It is a figure showing the structure of the display apparatus which concerns on the 1st Embodiment of this invention. FIG. 2 is an equivalent circuit diagram illustrating an example of the pixel drive circuit illustrated in FIG. 1. FIG. 2 is a cross-sectional view illustrating a configuration in a display area of the display device illustrated in FIG. 1. It is sectional drawing which represented the manufacturing method of the display apparatus shown in FIG. 3 to process order. FIG. 5 is a cross-sectional view illustrating a process following FIG. 4. FIG. 6 is a cross-sectional view illustrating a process following FIG. 5. FIG. 7 is a cross-sectional view illustrating a process following FIG. 6. FIG. 8 is a cross-sectional diagram illustrating a process following the process in FIG. 7. FIG. 9 is a cross-sectional diagram illustrating a process following the process in FIG. 8. FIG. 10 is a cross-sectional view illustrating an example of the process illustrated in FIG. 9B in the order of processes. FIG. 10 is a cross-sectional view illustrating another example of the process illustrated in FIG. 9B in the order of processes. FIG. 10 is a cross-sectional diagram illustrating a process following the process in FIG. 9. FIG. 13 is a cross-sectional diagram illustrating a process following the process in FIG. 12. FIG. 14 is a cross-sectional diagram illustrating a process following the process in FIG. 13. It is a figure for demonstrating the problem of the conventional manufacturing method. It is a figure for demonstrating another problem. FIG. 15 is a cross-sectional view illustrating a process following FIG. 14. It is sectional drawing which represented the other manufacturing method of the display apparatus shown in FIG. 3 to process order. It is a figure showing the structure of the display apparatus which concerns on the 2nd Embodiment of this invention. It is a figure showing the structure of the display apparatus which concerns on the 3rd Embodiment of this invention. It is a top view showing schematic structure of the module containing the display apparatus of the said embodiment. It is a perspective view showing the external appearance of the application example 1 of the display apparatus of the said embodiment. (A) is a perspective view showing the external appearance seen from the front side of the application example 2, (B) is a perspective view showing the external appearance seen from the back side. 12 is a perspective view illustrating an appearance of application example 3. FIG. 14 is a perspective view illustrating an appearance of application example 4. FIG. (A) is a front view of the application example 5 in an open state, (B) is a side view thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description will be given in the following order.
1. 1st Embodiment (example which has a reflecting plate between a display panel and a sealing panel)
2. Second embodiment (example without a sealing panel (CF-less structure))
3. Third embodiment (an example in which a sealing panel and a reflector are integrated)

(First embodiment)
FIG. 1 shows a configuration of a display device according to the first embodiment of the present invention. This display device is used as an organic EL television device or the like. For example, a plurality of organic light emitting elements 10R, 10G, and 10B, which will be described later, are arranged in a matrix on the substrate 11 as a display region 110. Is. Around the display area 110, a signal line driving circuit 120 and a scanning line driving circuit 130, which are drivers for displaying images, are provided.

  A pixel drive circuit 140 is formed in the display area 110. FIG. 2 illustrates an example of the pixel driving circuit 140. The pixel driving circuit 140 is an active driving circuit provided in a lower layer of a first electrode 13 described later. That is, the pixel drive circuit 140 includes a drive transistor Tr1 and a write transistor Tr2, a capacitor (holding capacitor) Cs between the transistors Tr1 and Tr2, a first power supply line (Vcc), and a second power supply line (GND). ), The organic light emitting element 10R (or 10G, 10B) connected in series to the drive transistor Tr1. The drive transistor Tr1 and the write transistor Tr2 are configured by a general thin film transistor (TFT), and the configuration may be, for example, an inverted staggered structure (so-called bottom gate type) or a staggered structure (top gate type). There is no particular limitation.

  In the pixel driving circuit 140, a plurality of signal lines 120A are arranged in the column direction, and a plurality of scanning lines 130A are arranged in the row direction. An intersection between each signal line 120A and each scanning line 130A corresponds to one of the organic light emitting elements 10R, 10G, and 10B (sub pixel). Each signal line 120A is connected to the signal line drive circuit 120, and an image signal is supplied from the signal line drive circuit 120 to the source electrode of the write transistor Tr2 via the signal line 120A. Each scanning line 130A is connected to the scanning line driving circuit 130, and a scanning signal is sequentially supplied from the scanning line driving circuit 130 to the gate electrode of the writing transistor Tr2 via the scanning line 130A.

  FIG. 3 illustrates a cross-sectional configuration in the display region 110 of the display device illustrated in FIG. This display device includes a reflection plate 30 between the display panel 10 and the sealing panel 20. The display panel 10 and the reflection plate 30 are bonded together by an adhesive layer 41. The reflection plate 30 and the sealing panel 20 are bonded together over the entire surface by an adhesive layer 42 such as a thermosetting resin or an ultraviolet curable resin.

  The display panel 10 generates blue light on an organic light emitting element 10R that generates red light, an organic light emitting element 10G that generates green light, and a substrate 11 made of glass, silicon (Si) wafer, resin, or the like. The organic light emitting elements 10B to be provided are sequentially provided in a matrix as a whole. The organic light emitting elements 10R, 10G, and 10B have a rectangular planar shape, and a combination of adjacent organic light emitting elements 10R, 10G, and 10B constitutes one pixel.

  The organic light emitting devices 10R, 10G, and 10B are each provided with a first electrode 13 as an anode, an insulating film 14, and a light emitting layer to be described later, from the substrate 11 side, with the pixel driving circuit 140 and the planarizing layer 12 described above therebetween. And a second electrode 16 as a cathode are stacked in this order, and are covered with a protective film 17 as necessary.

  The first electrode 13 is formed corresponding to each of the organic light emitting elements 10R, 10G, and 10B and is electrically separated from each other by the insulating film 14. In addition, the first electrode 13 has a function as a reflective electrode that reflects light generated in the light emitting layer, and it is desirable that the first electrode 13 has a reflectance as high as possible in order to increase the light emission efficiency. For example, the first electrode 13 has a thickness of 100 nm to 1000 nm, specifically about 50 nm, and includes aluminum (Al) or an alloy containing aluminum (Al), or silver (Ag) or silver (Ag). It is made of an alloy. The first electrode 13 is made of chromium (Cr), titanium (Ti), iron (Fe), cobalt (Co), nickel (Ni), molybdenum (Mo), copper (Cu), tantalum (Ta), tungsten ( W), platinum (Pt), gold (Au) or other metal elements such as simple substances or alloys may be used.

  The insulating film 14 is for ensuring the insulation between the first electrode 13 and the second electrode 16 and for accurately forming the light emitting region in a desired shape. For example, photosensitive acrylic, polyimide, polybenzoxazole Or an inorganic insulating material such as silicon oxide (SiO 2). The insulating film 14 has an opening corresponding to the light emitting region of the first electrode 13. The organic layer 15 and the second electrode 16 may be continuously provided not only on the light emitting region but also on the insulating film 14, but light emission occurs only in the opening of the insulating film 14.

  The organic layer 15 has, for example, a structure in which a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are stacked in this order from the first electrode 13 side. It may be provided according to. The organic layer 15 may have a different configuration depending on the emission color of the organic light emitting elements 10R, 10G, and 10B. The hole injection layer is a buffer layer for improving hole injection efficiency and preventing leakage. The hole transport layer is for increasing the efficiency of transporting holes to the light emitting layer. In the light emitting layer, recombination of electrons and holes occurs when an electric field is applied to generate light. The electron transport layer is for increasing the efficiency of electron transport to the light emitting layer. Note that an electron injection layer (not shown) made of LiF, Li 2 O, or the like may be provided between the electron transport layer and the second electrode 16.

  As a constituent material of the hole injection layer of the organic light emitting device 10R, for example, 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine (m-MTDATA) or 4,4 ′, 4 ″ is used. -Tris (2-naphthylphenylamino) triphenylamine (2-TNATA). Examples of the constituent material of the hole transport layer of the organic light emitting device 10R include bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD). As a constituent material of the light emitting layer of the organic light emitting device 10R, for example, an 8-quinolinol aluminum complex (Alq3) and 2,6-bis [4- [N- (4-methoxyphenyl) -N-phenyl] aminostyryl] naphthalene are used. What mixed 40 volume% of -1,5- dicarbonitrile (BSN-BCN) is mentioned. Examples of the constituent material of the electron transport layer of the organic light emitting element 10R include Alq3.

  Examples of the constituent material of the hole injection layer of the organic light emitting element 10G include m-MTDATA and 2-TNATA. As a constituent material of the hole transport layer of the organic light emitting device 10G, for example, α-NPD can be given. As a constituent material of the light emitting layer of the organic light emitting element 10G, for example, a material in which 3% by volume of Coumarin 6 is mixed with Alq3 can be cited. Examples of the constituent material of the electron transport layer of the organic light emitting device 10G include Alq3.

  Examples of the constituent material of the hole injection layer of the organic light emitting device 10B include m-MTDATA and 2-TNATA. As a constituent material of the hole transport layer of the organic light emitting device 10B, for example, α-NPD can be given. Examples of the constituent material of the light emitting layer of the organic light emitting element 10B include spiro 6Φ. Examples of the constituent material of the electron transport layer of the organic light emitting device 10B include Alq3.

  For example, the second electrode 16 has a thickness of 5 nm or more and 50 nm or less, and is made of a single element or alloy of a metal element such as aluminum (Al), magnesium (Mg), calcium (Ca), or sodium (Na). Among these, an alloy of magnesium and silver (MgAg alloy) or an alloy of aluminum (Al) and lithium (Li) (AlLi alloy) is preferable. The second electrode 16 may be made of ITO (indium / tin composite oxide) or IZO (indium / zinc composite oxide).

  The protective film 17 has a thickness of, for example, 500 nm or more and 10,000 nm or less, and is made of silicon oxide (SiO 2), silicon nitride (SiN), or the like.

  The sealing panel 20 is located on the second electrode 16 side of the display panel 10, and includes a sealing substrate 21 that seals the organic light emitting elements 10 R, 10 G, and 10 B together with the adhesive layer 30. The sealing substrate 21 is made of a material such as glass that is transparent to the light generated in the organic light emitting elements 10R, 10G, and 10B. The sealing substrate 21 is provided with, for example, a color filter 22 and a light shielding film 23 as a black matrix, and extracts light generated in the organic light emitting elements 10R, 10G, and 10B, and also provides the organic light emitting elements 10R, 10G, and 10B and external light reflected by the wiring between them are absorbed to improve the contrast. An overcoat layer (not shown) made of an acrylic resin or an epoxy resin may be provided on the color filter 22 and the light shielding film 23 in order to improve flatness.

  The color filter 22 may be provided on either side of the sealing substrate 21 but is preferably provided on the display panel 10 side. This is because the color filter 22 is not exposed on the surface and can be protected by the adhesive layer 30. The color filter 22 includes a red filter 22R, a green filter 22G, and a blue filter 22B, and is sequentially arranged corresponding to the organic light emitting elements 10R, 10G, and 10B.

  Each of the red filter 22R, the green filter 22G, and the blue filter 22B is formed, for example, in a rectangular shape without a gap. Each of the red filter 22R, the green filter 22G, and the blue filter 22B is composed of a resin mixed with a pigment, and by selecting the pigment, the light transmittance in a target red, green, or blue wavelength region is high. The light transmittance in other wavelength ranges is adjusted to be low.

  The light shielding film 23 is provided along the boundary of the red filter 22R, the green filter 22G, and the blue filter 22B. The light shielding film 23 is configured by, for example, a black resin film having an optical density of 1 or more mixed with a black colorant, or a thin film filter using thin film interference. Of these, a black resin film is preferable because it can be formed inexpensively and easily. The thin film filter is formed by, for example, laminating one or more thin films made of metal, metal nitride, or metal oxide, and attenuating light by utilizing interference of the thin film. Specific examples of the thin film filter include those in which chromium and chromium oxide (III) (Cr 2 O 3) are alternately stacked.

  The reflection plate 30 is disposed opposite to the organic light emitting elements 10R, 10G, and 10B, and has a plurality of convex shapes, for example, a truncated cone shape or a shape similar to the same, on the base material 31. The base material 31 is comprised by the glass substrate, for example. On the base material 31, a resin layer 32A made of an ultraviolet curable resin or a thermosetting resin is provided, and a part of the resin layer 32A in the thickness direction is a reflective element 32. Note that the reflective elements 32 may be provided in the entire thickness direction of the resin layer 32A. The base material 31 and the reflective element 32 may be integrally formed of an ultraviolet curable resin or a thermosetting resin.

  A space surrounded by the periphery of the reflective element 32, that is, the upper surface of the adhesive layer 41 and the surface of the reflective plate 30 (resin layer 32 </ b> A) has a hollow structure 50. The hollow structure 50 is a vacuum, an inert gas, or a gas (specifically, air) containing at least one of oxygen, nitrogen, and the like, and has a refractive index lower than that of the reflective element 32. Therefore, the light generated in the organic light emitting elements 10R, 10G, and 10B is reflected at the interface between the side surface 32B of the reflecting element 32 and the hollow structure 50 and is extracted outside. In this way, if the periphery of the reflecting element 32 is the hollow structure 50, it is not necessary to provide a reflecting mirror film of metal or the like on the side surface 32B of the reflecting element 32. Reflector films made of metal or the like have an inevitable absorption loss of several percent, so that the light extraction efficiency is potentially low. In the present embodiment, it is possible to increase the light extraction efficiency by eliminating such absorption loss in the reflecting mirror film. Further, there is no possibility that moisture and the like enter the organic light emitting elements 10R, 10G, and 10B from the space between the display panel 10 and the reflection plate 20, and deterioration of the organic light emitting elements 10R, 10G, and 10B due to the influence of moisture and the like can be suppressed. .

  The side surface 32B of the reflective element 32 may have, for example, a linear taper cross-sectional shape or a curved surface shape that can be approximated by an aspheric polynomial. In particular, a curved surface shape that can be approximated by an aspheric polynomial is desirable. This is because it is easy to satisfy the total reflection condition for both the light hitting the lower part of the reflecting element 32 and the light hitting the upper part of the reflecting element 32, which is advantageous for raising the light toward the substrate 31 side. When the cross-sectional shape of the linear taper is used, the light hitting the lower part of the reflecting element 32 is less likely to satisfy the total reflection condition, but the light extraction efficiency can be sufficiently improved as compared with the case where the reflecting plate 30 is not provided as a whole.

A protective layer 33 is preferably formed on the surface of the reflective element 32. This protective layer 33 is for increasing the wettability of the intermediate film 51 in the manufacturing process described later, and is made of, for example, silicon nitride (SiNx), silicon oxynitride (SiONx), or SiO ₂ . The thickness of the protective layer 33 is preferably such that it does not affect the total reflection conditions, for example 0.5 nm or more and 20 nm or less, and more preferably 1 nm or more and 5 nm or less. The protective layer 33 may be formed not only on the surface of the reflective element 32 but also on the entire surface of the resin layer 32A.

  The adhesive layer 41 is provided on the organic light emitting elements 10R, 10G, and 10B, and is in contact with the distal end surface 32C of the reflective element 32 in the bonding region 41A. On the other hand, the adhesive layer 41 is not in contact with the reflecting plate 30 in the non-bonding region 41B other than the bonding region 41A. That is, the space surrounded by the upper surface 41B1 of the non-bonding region 41B and the surface of the reflector 30 (resin layer 32A) is the hollow structure 50 described above. The upper surface 41B1 of the non-bonding region 41B has a convex curved surface shape toward the reflecting plate 30. Thereby, in this display apparatus, it is possible to improve the shape accuracy of the hollow structure 50 and to improve the optical performance of the reflective element 32.

  The adhesive layer 41 is made of a thermosetting resin or an ultraviolet curable resin. In particular, a thermosetting resin is preferable. This is because, in the manufacturing process, the adhesive layer 41 is heated and cured, and at the same time, an intermediate film 51 described later can be removed by evaporation or combustion, and the manufacturing process can be greatly simplified.

  This display device can be manufactured, for example, as follows.

  4 to 18 show the manufacturing method of this display device in the order of steps. First, as shown in FIG. 4A, the pixel driver circuit 140 is formed over the substrate 11 made of the above-described material.

  Next, as shown in FIG. 4B, a planarizing layer 12 made of, for example, photosensitive polyimide is applied and formed on the entire surface of the substrate 11 by, for example, spin coating, and is formed into a predetermined shape by exposure and development processing. After patterning and forming the connection hole 12A, firing is performed.

  Subsequently, as shown in FIG. 5A, after the first electrode 13 made of the above-described thickness and material is formed on the planarizing layer 12 by, for example, sputtering, for example, by lithography and etching, for example. The first electrode 13 is patterned into a predetermined shape. Thereby, a plurality of first electrodes 13 are formed on the planarization layer 12.

  After that, as shown in FIG. 5B, a photosensitive resin is applied over the entire surface of the substrate 11, an opening is provided by exposure and development, and then baked to form the insulating film.

  Subsequently, as shown in FIG. 6A, the hole injection layer, the hole transport layer, the light emitting layer, and the electron transport layer of the organic light emitting device 10R made of the above-described thickness and material are sequentially formed by, for example, vacuum deposition. A film is formed to form the organic layer 15 of the organic light emitting element 10R. Thereafter, as shown in FIG. 6 (A), in the same manner as the organic layer 15 of the organic light emitting element 10R, the hole injection layer, the hole transport layer, The light emitting layer and the electron transport layer are sequentially formed to form the organic layer 15 of the organic light emitting element 10G. Subsequently, similarly as shown in FIG. 6A, in the same manner as the organic layer 16 of the organic light emitting device 10R, the hole injection layer, the hole transport layer, The light emitting layer and the electron transport layer are sequentially formed to form the organic layer 15 of the organic light emitting element 10B.

  After forming the organic layer 15 of the organic light emitting devices 10R, 10G, and 10B, as shown in FIG. 6B, the second electrode 16 made of the above-described thickness and material is formed over the entire surface of the substrate 11 by, for example, vapor deposition. Form. Thus, the organic light emitting devices 10R, 10G, and 10B shown in FIG. 3 are formed.

  Next, as shown in FIG. 7, the protective film 17 made of the above-described thickness and material is formed on the second electrode 16. Thereby, the display panel 10 shown in FIG. 3 is formed.

  Further, the reflection plate 30 is formed. First, as shown in FIG. 8A, a resist is applied to the glass substrate 61 by using, for example, a slit coater to form a resist film 62A. Next, as shown in FIG. 8B, the resist film 62A is patterned by exposing the resist film 62A to ultraviolet light UV through the photomask 63 and developing it using, for example, a photolithography technique. Thereby, as shown in FIG. 8C, a mother die 64 in which the reflective element 62 is formed on the glass substrate 61 is formed.

  Subsequently, as shown in FIG. 9A, a mold 65 made of nickel (Ni) is formed by electroforming using a mother mold 64. After that, as shown in FIG. 9B, the reflector 30 is formed by light imprint (2P: Photo-Polymarization) or thermal imprint using the mold 65. In this way, a large number of reflectors 30 can be replicated (replicated) from one mold 65 at a low cost, which improves productivity and is suitable for mass production.

  In the case of optical imprinting, first, as shown in FIG. 10A, a resin layer 32A made of an ultraviolet curable resin is formed on a base material 31 made of a glass substrate such as BK-7 glass. The resin layer 32A is brought into contact with the mold 65 and irradiated with ultraviolet light UV. Irradiation conditions can be, for example, 300 mJ × 30 pass (9 J). After that, by releasing from the mold 65, as shown in FIG. 10B, the reflector 30 having the reflecting element 32 on the base material 31 is formed.

  In the case of thermal imprinting, first, as shown in FIG. 11A, a resin layer 32A is formed by injecting a resin 35 such as PDMS (Poly-Dimethyl-Siloxane) from a container 34 into a mold 65. , Heat cure. Specifically, for example, “Sylgard (registered trademark) 184” manufactured by Dow Corning can be used as PDMS. For example, the curing conditions may be 58 ° C. and 1 hour. After that, as shown in FIG. 11 (B), the reflective plate 30 having the base material 31 and the reflective element 32 integrally is formed by peeling from the mold 65.

  After forming the reflecting plate 30, as shown in FIG. 9C, the surface of the reflecting element 32 (resin layer 32A) is formed by sputtering, vacuum deposition, CVD (Chemical Vapor Deposition), molecular beam epitaxy, or the like. The protective layer 33 made of the above-described thickness and material is formed.

  After forming the protective layer 33, the entire side surface 32 </ b> B of the reflective element 32 is covered with the intermediate film 51 as shown in FIG. This intermediate film 51 is used as a sacrificial layer for forming the hollow structure 50, and has an evaporable property or a combustible property so that it can be removed in a later process. The intermediate film 51 can be formed, for example, by spraying the following materials as powders on the reflector 30 and then melting by heating. The intermediate film 51 can also be formed by diluting the following material with an alcohol solvent, applying the material on the reflection plate 30 by spin coating, and removing the solvent by heat drying.

  As a material for the intermediate film 51, it is desirable that it has a melting point near room temperature at normal pressure and can be melted and applied with a simple heating device. Moreover, it is desirable to have a boiling point of 200 ° C. or lower under reduced pressure. Furthermore, a material having a melting point of 40 ° C. or higher and 60 ° C. or lower and a boiling point of 100 ° C. or higher and 120 ° C. or lower is preferable. As a result, the manufacturing cost can be greatly reduced.

  Specifically, the material of the intermediate film 51 includes paraffin wax or acrylic emulsion. As the paraffin wax, a desired material can be selected depending on the number of carbon atoms in the molecule, and the boiling point at normal pressure is about 40 ° C. to 80 ° C.

  In the step of forming the intermediate film 51, as shown in FIG. 12B, it is preferable to expose the tip surface 32C of the reflective element 32 and cover the entire side surface 32B. Since the side surface 32B is a portion where a difference in refractive index is desired between the side surface 32B and the hollow structure 50, adhesion of the adhesive layer 41 to the side surface 32B is suppressed by reliably covering the side surface 32B with the intermediate film 51. Can do. For that purpose, for example, it is possible to embed a part of the side surface 32B with the intermediate film 51 and cover the entire side surface 32B with the intermediate film 51 by utilizing the wettability of the intermediate film 51 by the protective film 33. is there. In that case, a recess 51 </ b> A is formed on the upper surface of the intermediate film 51. When the protective film 33 is not used, the intermediate film 51 may be embedded up to the distal end surface 32C of the reflective element 32 by adjusting the coating amount of the intermediate film 51.

  After forming the intermediate film 51, as shown in FIG. 13, an adhesive layer 41 made of a thermosetting resin is formed on the organic light emitting elements 10R, 10G, and 10B. Subsequently, the reflector 30 and the display panel 10 are conveyed to a reduced pressure heating device and aligned, and then bonded together with the adhesive layer 41 interposed therebetween, so that the adhesive layer 41 is temporarily cured. The curing conditions are, for example, 0.1 mmHg, 80 ° C. or higher and 100 ° C. or lower. At this time, the adhesive layer 41 enters the concave portion 51 </ b> A of the intermediate film 51, and the upper surface 41 </ b> B <b> 1 of the non-bonding region 41 </ b> B becomes a convex curved shape toward the reflecting plate 30.

  After the adhesive layer 41 is temporarily cured, as shown in FIG. 14, the reflective plate 30 and the display panel 10 are heated while the degree of vacuum is maintained, and the adhesive layer 41 is fully cured. Thereby, the adhesive layer 41 is firmly bonded to the distal end surface 32C of the reflective element 32 in the bonding region 41A.

  At this time, it is preferable that the heating temperature for the main curing of the adhesive layer 41 is higher than the boiling point of the intermediate film 51, for example, 100 ° C. or more and 120 ° C. or less. Accordingly, as shown in FIG. 14, it is possible to form the hollow structure 50 by removing the intermediate film 51 by evaporation or combustion simultaneously with the main curing of the adhesive layer 41, and the manufacturing process is remarkably simplified. It becomes. Since the intermediate film 51 removed by evaporation or combustion is under reduced pressure, it is recovered by a vacuum pump or the like.

  On the other hand, when the reflector 30 and the display panel 10 are directly bonded with the adhesive layer 41 interposed therebetween without providing the intermediate film 51, the adhesive layer 41 reflects as shown in FIG. A phenomenon of creeping up and eroding on the side surface 32B of the element 32 occurred. This was due to capillary action and was difficult to prevent. Further, as shown in FIG. 16, there is a possibility that a phenomenon in which the tip end portion of the reflective element 32 is sunk into the adhesive layer 41 due to pressurization at the time of bonding. The phenomenon shown in FIG. 15 or FIG. 16 can occur independently or simultaneously.

  When the phenomenon shown in FIG. 15 or FIG. 16 occurs, a part of the side surface 32B of the reflective element 32 is covered with the adhesive layer 41, resulting in a defective shape of the hollow structure 50. Since the adhesive layer 41 is also transparent and has a refractive index close to that of the reflective element 32, light jumps into the adhesive layer 41, and the light extraction efficiency decreases. As described above, the defective shape of the hollow structure 50 distorts the shape of the reflecting element 32 to a non-designed shape, induces in-plane variation of the optical coupling, and causes luminance unevenness. Such a problem becomes more prominent as the size of the display panel 10 increases.

  It should be noted that in substrate sealing or the like, it is a well-known technique to adjust the gap using spacers, beads, or the like. However, when the hollow structure 50 is to be formed using such a conventional technique, it is necessary to manage the thickness of each constituent member including the glass substrate, the spacer to be used, and the beads with high accuracy. The cost will increase.

  In addition, with the recent trend toward high-definition panels, the area where spacers and beads can be arranged is substantially limited to the peripheral area outside the effective screen. Therefore, the gap distance in the screen, that is, the distance between the light emitting layer and the tip end face 32C of the reflecting element 32 changes, the optical coupling efficiency changes, and luminance unevenness is induced.

  In the present embodiment, the entire side surface 32B of the reflector 32 is covered with an evaporable or combustible intermediate film 51, and then the display panel 10 is bonded by the adhesive layer 41 to evaporate or remove the intermediate film 51. Since it is removed by combustion, the adhesive layer 41 does not adhere to the side surface 32B of the reflective element 32, and the hollow structure 50 can be formed with high accuracy and low cost and high yield. Therefore, the hollow structure 50 is uniformly formed over the entire surface, the light coupling between the light emitting layer and the tip end surface 32C of the reflective element 32 is performed uniformly, the luminance in-plane uniformity is improved, and the point defects are reduced. It becomes possible. Particularly, it is suitable for a large screen.

  Furthermore, by providing the protective layer 33 on the surface of the reflective element 32, moisture in the hollow structure 50 or residual components of the intermediate film 51 can be adsorbed by the protective layer 33 and the reflective element 32 can be protected. Therefore, the possibility that the reflective element 32 is undesirably affected by moisture in the hollow structure 50 or the residual component of the intermediate film 51 is reduced, and the reliability of the reflective element 32 is improved.

  In addition, since the periphery of the reflecting element 32 is the hollow structure 50, it is not necessary to provide a reflecting mirror film made of metal on the side surface 32B of the reflecting element 32. Therefore, the process of polishing the tip end surface 32C of the reflecting element 32 and removing the reflecting mirror film after forming the reflecting mirror film becomes unnecessary, and the manufacturing process can be simplified and the cost can be reduced. In particular, in the case of a large screen, the problem of in-plane non-uniformity in the polishing process is also solved.

  After removing the intermediate film 51, as shown in FIG. 17A, a light shielding film 23 made of the above-described material is formed on the sealing substrate 21 made of the above-described material, and is patterned into a predetermined shape. . Next, as shown in FIG. 17B, the material of the red filter 22R is applied onto the sealing substrate 21 by spin coating or the like, and patterned and baked by a photolithography technique to form the red filter 22R. Form. At the time of patterning, the peripheral edge portion of the red filter 22R may cover the light shielding film 23. Subsequently, as shown in FIG. 17C, the blue filter 22B and the green filter 22G are sequentially formed in the same manner as the red filter 22R. Thereby, the sealing panel 20 is formed.

  Subsequently, an adhesive layer 42 is formed on the reflective plate 30, and the reflective plate 30 and the sealing panel 20 are bonded together with the adhesive layer 42 interposed therebetween. Thus, the display device shown in FIGS. 1 to 3 is completed.

  Moreover, this display device can also be manufactured as follows, for example.

  First, the display panel 10 is formed by the steps shown in FIGS. 4 to 7 in the same manner as the manufacturing method described above.

  Further, the reflection plate 30 is formed. FIG. 18 shows another manufacturing method of the reflector 30 in the order of steps. First, as shown in FIG. 18A, a resist is applied to the base material 31 using, for example, a slit coater to form a resin film 32A. In this case, a permanent resist represented by “SU-8 (trade name)” manufactured by Kayaku Microchem Corporation is used as the resist. Next, as shown in FIG. 18B, the resin film 32A is patterned by exposing the resin film 32A to ultraviolet rays UV through the photomask 63 and developing it using, for example, a photolithography technique. Thereby, as shown in FIG. 18C, the reflector 30 having the reflective element 32 on the base material 31 can be formed.

  Subsequently, as shown in FIG. 18D, a protective film 33 is formed on the surface of the reflective element 32 (resin film 32A) by the process shown in FIG. 9C in the same manner as the manufacturing method described above. To do.

  After that, in the same manner as the manufacturing method described above, the entire side surface 32B of the reflective element 32 is covered with the intermediate film 51 by the process shown in FIG. 12, and the adhesive layer 41 is interposed by the process shown in FIG. The display panel 10 is bonded, and the intermediate film 51 is removed by evaporation or combustion by the process shown in FIG.

  Similarly to the manufacturing method described above, the sealing panel 20 is formed by the process shown in FIG. 17, and the reflecting plate 30 and the sealing panel 20 are bonded together with the adhesive layer 42 interposed therebetween. Thus, the display device shown in FIGS. 1 to 3 is completed.

  In this display device, a scanning signal is supplied to each pixel from the scanning line driving circuit 130 via the gate electrode of the writing transistor Tr2, and an image signal is supplied from the signal line driving circuit 120 via the writing transistor Tr2. Held in Cs. That is, the driving transistor Tr1 is controlled to be turned on / off in accordance with the signal held in the holding capacitor Cs, whereby the driving current Id is injected into each of the organic light emitting elements 10R, 10G, and 10B, so that holes, electrons, Recombine to emit light. This light is transmitted through the second electrode 16, the reflecting plate 30, the color filter 22 and the sealing substrate 21 and extracted.

  Specifically, light generated by the organic light emitting elements 10R, 10G, and 10B is incident from the front end surface 32C of the reflecting element 32, reflected by the interface between the side surface 32B of the reflecting element 32 and the hollow structure 50, and extracted outside. It is. Here, since the upper surface of the non-bonding region 41B of the adhesive layer 41 has a curved surface shape that is convex toward the reflector 30, the entire side surface of the reflective element 32 is exposed from the adhesive layer 42, and the hollow structure The shape accuracy of 50 is high. Therefore, the shape of the reflective element 32 is not distorted to a non-designed one, and the optical performance of the reflective element 32 is improved.

  In addition, the distance between the light emitting layer and the reflective element 32 does not change in the display region 110, variation in optical coupling efficiency is eliminated, and luminance unevenness is reduced. It is particularly suitable for a large screen display device.

  As described above, in the method for manufacturing the display device according to the present embodiment, after covering the entire side surface 32B of the reflective element 32 with the intermediate film 51, the display panel 10 is bonded with the adhesive layer 41, and the intermediate film 51 is evaporated or burnt. Thus, the adhesive layer 41 is not attached to the side surface 32B of the reflective element 32, and the hollow structure 50 can be formed with high accuracy. Further, the manufacturing cost can be reduced and the yield of the hollow structure 50 can be improved.

  In the display device according to the present embodiment, the upper surface 41B1 of the non-bonding region 41B of the adhesive layer 41 is formed in a convex curved surface shape toward the reflecting plate 30, so that the shape accuracy of the hollow structure 50 is increased, and the reflective element The optical performance of 32 can be improved.

(Second Embodiment)
FIG. 19 illustrates a cross-sectional configuration of a display device according to the second embodiment of the present invention. The display device of the present embodiment has the same configuration, operation, and effects as those of the first embodiment, except that a CF-less structure without the sealing panel 20 and the adhesive layer 42 is provided. It can be manufactured in the same manner.

(Third embodiment)
FIG. 20 illustrates a cross-sectional configuration of a display device according to the third embodiment of the present invention. The display device according to the present embodiment uses the sealing panel 20 as the base material 31 and includes the CF-integrated reflection plate in which the color filter 22 is provided on the bottom surface of the reflection element 32. The configuration is the same as that of the first embodiment.

  This display device can be manufactured, for example, as follows.

  First, similarly to the first embodiment, the display panel 10 is formed by the steps shown in FIGS. In the same manner as in the first embodiment, the sealing panel 20 is formed by the process shown in FIG.

  Next, the reflector 30 is formed by one of the two manufacturing methods described in the first embodiment. At that time, by using the sealing panel 20 described above as the base material 31 in the optical imprint method shown in FIG. 10 or the base material 31 shown in FIG. Form.

  Subsequently, similarly to the first embodiment, a protective film 33 is formed on the surface of the reflective element 32 (resin film 32A) by the process shown in FIG. 9C.

  After that, as in the first embodiment, the entire side surface 32B of the reflective element 32 is covered with the intermediate film 51 by the process shown in FIG. 12, and the adhesive layer 41 is interposed by the process shown in FIG. Then, the display panel 10 is bonded together, and the hollow film 50 is formed by removing the intermediate film 51 by evaporation or combustion by the process shown in FIG.

  Further, similarly to the first embodiment, the sealing panel 20 is formed by the process shown in FIG. 17, and the reflecting plate 30 and the sealing panel 20 are bonded together with the adhesive layer 42 therebetween. As a result, the display device shown in FIG. 20 is completed.

  Here, since the color filter 22 is formed on the bottom surface of the reflecting element 32, the sealing panel 20 and the reflecting plate 30 are integrated, and the number of parts is reduced and the bonding process is performed as compared with the first embodiment. Can also be reduced. Further, it is not necessary to remove the color filter 22 in order to reduce the cost, and there is no possibility of causing performance deterioration such as a decrease in contrast or a deterioration in visibility. By providing the reflecting plate 30, the luminance can be increased without increasing the current injection, and the reliability such as the element life can be improved.

  In this embodiment, in addition to the operations and effects of the first embodiment, the number of parts can be reduced, the number of alignments for bonding can be reduced, and the manufacturing cost, tact time, and yield can be reduced. It is advantageous in view of the above.

(Modules and application examples)
Hereinafter, application examples of the display device described in the above embodiment will be described. The display device according to the above embodiment is an image signal that is input from the outside or is generated internally, such as a television device, a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, or a video camera. Alternatively, the present invention can be applied to display devices for electronic devices in various fields that display images.

(module)
The display device of the above-described embodiment is incorporated into various electronic devices such as application examples 1 to 5 described later, for example, as a module as illustrated in FIG. In this module, for example, a region 210 exposed from the sealing panel 20 or the reflecting plate 30 is provided on one side of the substrate 11, and the wiring of the signal line driving circuit 120 and the scanning line driving circuit 130 is extended to the exposed region 210. Thus, an external connection terminal (not shown) is formed. The external connection terminal may be provided with a flexible printed circuit (FPC) 220 for signal input / output.

(Application example 1)
FIG. 22 illustrates an appearance of a television device to which the display device of the above embodiment is applied. The television apparatus has, for example, a video display screen unit 300 including a front panel 310 and a filter glass 320, and the video display screen unit 300 is configured by the display device according to each of the above embodiments. .

(Application example 2)
FIG. 23 shows an appearance of a digital camera to which the display device of the above embodiment is applied. The digital camera includes, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 is configured by the display device according to each of the above embodiments. Yes.

(Application example 3)
FIG. 24 shows the appearance of a notebook personal computer to which the display device of the above embodiment is applied. The notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image. The display unit 530 is a display according to each of the above embodiments. It is comprised by the apparatus.

(Application example 4)
FIG. 25 shows the appearance of a video camera to which the display device of the above embodiment is applied. This video camera has, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640. Reference numeral 640 denotes the display device according to each of the above embodiments.

(Application example 5)
FIG. 26 illustrates an appearance of a mobile phone to which the display device of the above embodiment is applied. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes. The display 740 or the sub-display 750 is configured by the display device according to each of the above embodiments.

While the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment, and various modifications can be made. For example, the material and thickness of each layer, the film formation method, and the film formation conditions described in the above embodiment are not limited, and other materials and thicknesses may be used. It is good also as conditions. For example,
In the above embodiment, the reflector 30 and the display panel 10 are bonded together in a reduced-pressure atmosphere. For example, an inert gas (rare gas) that does not affect the reliability is introduced to adjust the back pressure. You may make it stick together. Further, after the reflection plate 30 and the display panel 10 are bonded together, a sealing step of reducing the pressure of the hollow structure 50 in a desired gas atmosphere may be performed. For example, after the intermediate film 51 is removed, a method of sealing by edge sealing while adjusting the degree of vacuum using a variable leak valve in an argon (Ar) atmosphere is used. At that time, not only argon (Ar) but also rare gases such as neon, krypton, and xenon may be used.

  In the above embodiment, the configurations of the organic light emitting elements 10R, 10B, and 10G and the reflector 30 are specifically described. However, it is not necessary to include all layers, and further include other layers. May be.

  Furthermore, the present invention can be applied to a self-light-emitting device using other self-light-emitting elements such as an LED (Light Emitting Diode), an FED (Field Emission Display), and an inorganic electroluminescence element in addition to the organic light-emitting element.

  In addition, the display device of the present invention can also be applied to light-emitting devices for purposes other than display, such as lighting devices.

  DESCRIPTION OF SYMBOLS 10 ... Display panel, 10R, 10G, 10B ... Organic light emitting element, 11 ... Board | substrate, 12 ... 1st electrode, 13 ... Insulating film, 14 ... Organic layer, 15 ... 2nd electrode, 16 ... Protective film, 20 ... Sealing Panel, 21 ... Sealing substrate, 22 ... Color filter, 23 ... Light-shielding film, 30 ... Reflecting plate, 31 ... Base material, 32 ... Reflective element, 32A ... Resin layer, 32B ... Side face, 32C ... End face, 33 ... Protective layer, 41, 42 ... adhesive layer, 41A ... bonding region, 41B ... non-bonding region, 50 ... hollow region, 51 ... intermediate film, 110 ... display region, 140 ... pixel drive circuit, Cs ... capacitor, Tr1 ... Drive transistor, Tr2 ... write transistor

Claims (7)

Covering all of the side surfaces of the reflective element on the substrate with an evaporable or combustible intermediate film;
A step of bonding a reflective plate having the reflective element and the intermediate film on the base material, and a display panel having a self-luminous element on the substrate with an adhesive layer in between;
And a step of removing the intermediate film by evaporation or combustion after bonding the reflector and the display panel. The method for manufacturing a display device according to claim 1, wherein a front end surface of the reflective element is exposed from the intermediate film, and the entire side surface of the reflective element is covered with the intermediate film. The method for manufacturing a display device according to claim 2, wherein a protective layer for increasing wettability of the intermediate film is formed on the surface of the reflective element before forming the intermediate film. The said adhesive layer is comprised with a thermosetting resin, and the said adhesive layer is hardened while heating to the temperature higher than the boiling point of the said intermediate film, and the said intermediate film is removed. Method of manufacturing the display device. The display device manufacturing method according to claim 4, wherein the intermediate film is formed of paraffin wax or acrylic emulsion. A display panel having self-luminous elements on a substrate;
A reflective plate disposed opposite to the self-luminous element and having a reflective element on the substrate;
Provided on the self-luminous element, has a non-bonding region other than the bonding region and the bonding region in contact with the reflective element, and the upper surface of the non-bonding region is a convex curved surface shape toward the reflecting plate An adhesive layer having
The display apparatus provided with the hollow structure enclosed by the upper surface of the said non-bonding area | region, and the surface of the said reflecting plate. The display device according to claim 6, further comprising a protective layer on a surface of the reflective element.

Images