JP2010276628A - Liquid crystal display - Google Patents

Abstract

The present invention provides a technique capable of reducing the thickness of a liquid crystal display device and simultaneously supporting improvement in heat dissipation performance and image quality regardless of the screen size.
A light source unit combining a light source composed of a plurality of light emitting elements mounted on a wiring board and a light guide plate for guiding light from the light source toward the liquid crystal panel, and a positioning member for holding the light source unit are provided. The wiring board and the light guide plate are simultaneously positioned by a positioning member provided on the metal chassis, and a plurality of light source units are arranged in the horizontal direction or the vertical direction of the liquid crystal panel according to the screen size.
[Selection] Figure 4

Description

  The present invention relates to a liquid crystal display device that can efficiently exhaust heat generated inside a housing.

  In recent years, as a display device, a light-emitting plasma display device or a non-light-emitting liquid crystal display device is increasingly used in place of a CRT (Cathode Ray Tube).

  Among these, the liquid crystal display device uses a liquid crystal panel as a transmissive light modulation element, and includes a lighting device (hereinafter referred to as a backlight) on the back thereof to irradiate the liquid crystal panel with light. The liquid crystal panel forms an image by controlling the transmittance of light emitted from the backlight.

  As a backlight system for irradiating the liquid crystal panel with light, the following two systems are mainly known.

  One is a sidelight system in which light sources are arranged on the left and right or upper and lower ends of a liquid crystal panel and light is incident through a light guide plate for emitting light incident from a side surface in a planar direction. The other is a direct system that irradiates light from the back of the liquid crystal panel.

  One feature of the liquid crystal display device is that the outer shape can be thinned. In recent years, a liquid crystal display device that is thinner and consumes less power is desired. If the liquid crystal display device is made thin, it will be difficult to secure an air flow path for exhausting heat generated inside the housing that makes up the outer shape of the liquid crystal display device, so it will not be able to efficiently exhaust heat, and the heat-sensitive part will The problem of rising.

  Therefore, for example, in Patent Document 1, in a sidelight type liquid crystal display device, an LED (Light Emitting Diode) is used as a light source of a backlight, and a light source mounting substrate is connected to a heat dissipation member in order to remove heat generated by the LED. A configuration for radiating heat from both surfaces of the light source mounting substrate is described.

JP 2007-12416 A

  Among the backlight methods for irradiating light to the liquid crystal panel, the sidelight method is a light source that is concentrated on the edge of the screen, so heat radiation from the light source or cooling, for example, a light source according to the video signal It is difficult to control the illuminance and increase the size as compared with the direct method.

  In particular, when expanding the size of a liquid crystal display device from a small screen size to a large screen size, a light guide plate designed according to each screen size and optical design is required. Hinder.

  On the other hand, the direct method increases the number of light sources used compared to the sidelight method, and thus increases cost and power consumption. In the direct method, it is necessary to increase the distance from the light source to the liquid crystal panel (that is, the distance in the thickness direction of the liquid crystal panel) in order to reduce the luminance unevenness of the image displayed on the liquid crystal panel. It is disadvantageous for the thinning. Furthermore, there is a disadvantage in that it is difficult to obtain a high contrast ratio by controlling the light source by taking a distance from the light source to the liquid crystal panel.

  The object of the present invention has been made in view of the above-described problems of the prior art, and can improve the heat dissipation performance and the image quality in common regardless of the screen size while enabling the thinning of the liquid crystal display device. A liquid crystal display device is provided.

  An object of the present invention is to provide a liquid crystal display device including a backlight having a light source for illuminating the liquid crystal panel from the back and a chassis for holding the backlight, and the backlight is in a direction parallel to the display surface of the liquid crystal panel. A plurality of light source units that combine a light source that emits light, a wiring board on which the light source is mounted, and a light-transmitting light guide plate for guiding the light of the light source toward the liquid crystal panel, and the light source unit It comprises a metal chassis provided with a positioning member for supporting, and is achieved by positioning and attaching the wiring board and the light guide plate by the positioning member.

  The above-described object is achieved by the wiring board being thermally connected to the heat radiating member and also being thermally connected to the positioning member.

  The above-described object is achieved by thermally connecting the wiring board to the heat dissipating member and the positioning member on the front and back surfaces of the wiring board, respectively.

  The above-mentioned object is achieved by positioning and attaching the light guide plate by the positioning member common to the wiring board.

  The above object is also provided in a liquid crystal display device including a backlight having a light source that illuminates the liquid crystal panel from the back, and a chassis that holds the backlight. The backlight is in a direction parallel to the display surface of the liquid crystal panel. A plurality of light source units that combine a light source that emits light, a wiring board on which the light source is mounted, and a light-transmitting light guide plate that guides light from the light source toward the liquid crystal panel, and the light source unit. The light source unit is positioned with the wiring board and the light guide plate with the positioning member, and the backlight includes the light source unit with the display surface of the liquid crystal panel. This is achieved by being arranged in a plurality of stages or a plurality of rows in a parallel direction.

  According to the present invention, it is possible to provide a liquid crystal display device that can reduce the thickness of the liquid crystal display device and can improve the heat dissipation performance and the image quality in common regardless of the screen size.

It is a figure which shows 1st Example of a liquid crystal display device, and is the figure which looked at the inside from the front. It is AA sectional drawing and BB sectional drawing in FIG. It is a component diagram of the wiring board used for the 1st example. It is the front view and sectional drawing of the light source unit of a 1st Example. It is a component diagram of the wiring board used for the 2nd example. It is the front view and sectional drawing of the light source unit of a 2nd Example. It is sectional drawing which shows the modification of a 2nd Example, and component drawing used there.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings as appropriate.

A liquid crystal television which is an example of a liquid crystal display device to which the present invention is applied is shown in FIGS.
FIG. 1 is a front view of the inside of the liquid crystal television 1 of the first embodiment.
Fig.2 (a) is the elements on larger scale of the AA cross section of FIG.
FIG. 2B is a partially enlarged view of the BB cross section of FIG.
As shown in FIG. 2A, the liquid crystal television according to this embodiment includes a liquid crystal panel 2 as a passive display device, a backlight unit 3 for irradiating the liquid crystal panel 2 with light, and a liquid crystal panel 2. And an optical sheet 4 for diffusing the light of the backlight unit 3. The liquid crystal panel 2 may be provided with a color filter, may be monochrome, or may be an IPS system or a VA system. The backlight unit 3 is assembled in a chassis 5 formed into a box shape with a metal such as an aluminum plate or a steel plate. Further, a circuit board 6 such as a signal control circuit, a power supply circuit, and a panel drive circuit is mounted on the rear surface of the chassis 5 and includes a housing 7 for storing these elements. In addition, the optical sheet 4 is schematically illustrated as one sheet in FIG. 2A, but in actuality, the optical sheet 4 is configured by combining any one of a diffusion sheet, a prism sheet, a diffusion plate, a polarization selective reflection film, and the like. Since these sheets reflect a part of the light emitted from the light source 8 and reflect the light toward the backlight unit 3, the light reflected again from the backlight unit 3 is transmitted and diffused, and the luminance is uniform. There is an effect to increase.

  As shown in FIG. 2B, the backlight unit 3 includes a wiring board 9 on which a light source 8 including a plurality of emitting elements such as light emitting diodes (LEDs) is mounted, and aluminum provided on the wiring board 9. A heat sink 10 in which a thermally conductive material is formed in an L shape, and light emitted from the light source 8 in the direction of arrow A (that is, a direction parallel to the liquid crystal panel 2) are incident, and this is reflected in the direction of arrow B ( That is, it includes a light source unit 12 that is combined with a light guide plate 11 that is bent in a direction orthogonal to the display surface of the liquid crystal panel 2 and led to the liquid crystal panel 2 disposed on the front surface of the backlight unit 3. As shown in FIG. 1, a plurality of light source units 12 are arranged in the direction of arrow A and the direction of arrow C, that is, the direction parallel to the display surface of the liquid crystal panel 2.

  The illuminance of the light source 8 (intensity of light emitted from the light source 8) is controlled for each light source unit 12 through the circuit board 6 for each light source unit 12 using the luminance information of the video signal, for example, as a unit. You may make it do. In this case, the brightness and color of the display image on the liquid crystal panel 2 can be locally controlled corresponding to the light source unit 12. As a result, the contrast and color purity of the display image can be improved.

  As the number of light source units 12 increases, finer control can be performed. For example, as shown in FIG. 1, when eight light source units 12 are arranged in the A direction and sixteen in the C direction, the display area of the liquid crystal panel 2 is divided into 128 areas corresponding to each light source unit 12, The brightness and color can be controlled for each divided area. Of course, the number of light source units 12 (the number of divisions of the display area) is not limited to this. As described above, as the number of the light source units 12 increases, fine control is possible. However, if the number is too large, the number of parts and the cost are significantly increased, so an appropriate number is set according to the size of the liquid crystal panel 2. It is desirable to do.

  Further, as shown in FIG. 2B, the light source unit 12 is assembled to the chassis 5 by pre-fixing one or a plurality of light source units 12 to a sub-chassis 13 made of a heat conductive metal such as aluminum, The sub chassis 13 on which the light source unit 12 is mounted may be attached to the chassis 5. Thereby, assembling property can be improved. By dividing the backlight unit 3 into the light source units 12 and arranging them, the luminance and color are controlled for each divided area, so that it is easy to control the brightness of a desired area during so-called area control, and high contrast and high quality. In addition to realizing the backlight unit 3 that can provide video with low power consumption, the light source unit 12 can be shared even if the screen size changes, and the screen size can be developed at low cost.

Further, details of the light source unit of this embodiment will be described with reference to FIG.
FIG. 3 shows a wiring board 9 on which a light emitting diode (LED) is mounted as the light source 8.
FIG. 3 shows a state before the LED is mounted, but the LED 8 is solder-connected to a wiring pad portion 9a formed corresponding to the electrode of the LED. On the wiring board 9, copper wiring patterns 9 c for feeding power to the LEDs 8 are formed on the LED mounting surface 9 b and the back surface. The front surface wiring pattern 9c and the back surface wiring pattern (not shown) are electrically and thermally connected by a plurality of through holes 9d. The heat generated by the LED 8 is diffused in the plane direction by the wiring pattern 9c on the front surface, thermally conducted to the back surface through the through hole 9d, and further diffused in the plane direction by the wiring pattern on the back surface.

  After being thermally diffused on the front and back surfaces, heat is transferred to the heat sink 10 and the sub chassis 13 shown in FIG. Since the entire back surface of the wiring board is connected to the heat sink 10, it is desirable that the through hole 9d be as close as possible to the pattern portion 9a on which the LED 8 is mounted so that the heat of the LED 8 is transmitted to the back surface as short as possible.

  The LED 8 may have, for example, a configuration in which a plurality of RGB three-color light emitting element sets are provided, or a set of colors other than RGB (for example, blue and yellow) may be used. When using light emitting elements of a plurality of colors, the light source 8 may be provided with an optical component for mixing light from the light emitting elements of different colors. Alternatively, a plurality of single-color (for example, white) light-emitting elements may be provided.

4A to 4C are sectional views of the light source unit 12 in which the wiring board 9 is mounted on the subchassis 13.
4A shows a front cross-sectional view as seen from the direction of arrow B in FIG. 2B, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. FIG. 4C is a cross-sectional view taken along the line B-B of FIG. 4A, and shows a cross-section at the mounting portion of the LED 8.

  As shown in FIGS. 4B and 4C, the heat sink 10 formed in an L shape on the substantially entire back surface of the wiring board 9 is bonded to the wiring board 9 with a heat conductive adhesive or the like. A claw-like cut and raised piece 14 is formed in the sub chassis 13. When the heat sink 10 to which the wiring board 9 is bonded is attached to the sub-chassis 13, one side of the cut-and-raised piece 14 is used as a wiring pattern 9 c (shown in FIG. 3) on the surface of the wiring board 9 between the LED 8 and the LED 8. The heat sink 10 is fixed to the subchassis 13 by contact.

  As a result, the wiring board 9, that is, the LED 8 is positioned with reference to the cut and raised piece 14, and the heat generated by the LED 8 is thermally diffused by the wiring pattern on the front and back of the wiring board 9 and is transferred from the front and back of the wiring board 9 to the sub chassis 13. Heat conduction is performed and thermal diffusion is performed in the subchassis 13. Further, heat is radiated from the subchassis 13 to the chassis 5 shown in FIG. High heat radiation performance is obtained because heat diffusion is performed on the front and back of the wiring substrate 9 and contributes to heat radiation over a wide area.

  In particular, the heat path from the wiring pattern on the surface to the cut piece 14 is effective because heat is quickly radiated from the LED 8. The connection between the wiring board 9 and the heat sink 10 may be a heat conductive double-sided tape or the like. The wiring pattern portion is formed with an insulating layer for electrical insulation.

  On the other hand, the light guide plate 11 is inclined on the side facing the sub-chassis 13 and becomes thinner as it gets away from the light incident surface 11a, and has a thin portion at the end. A step 11c having a shape corresponding to the shape of the thin portion 11b is provided in the vicinity of the light guide plate incident surface 11a so that the thin portion 11b at the end of the adjacent light guide plate is placed. For example, a step 11c is formed in the vicinity of the incident surface 11a of the light guide plate 11 so that a part of the thin portion 11b at the end of the light guide plate 11d can be put on the plurality of light guide plates 11 and 11d. Easy positioning.

  Further, the light guide plate 11 is also fixed to the sub chassis 13 with the cut and raised piece 14 positioning the wiring board 9 as a reference. For example, a plurality of convex portions 11 e are provided on the light incident surface 11 a of the light guide plate 11, and the convex portions 11 e are cut and raised, and are brought into contact with and fixed to the surface opposite to the surface that contacts the wiring substrate 9. The convex portion 11e may be integrally formed with the light guide plate 11 or may be another member. Since the positional relationship between the LED 8 and the light guide plate 11 affects the light use efficiency of the light source, it is necessary to determine the positional relationship between the LED and the light guide plate with high accuracy in the light source unit.

  According to the present embodiment, the positional relationship between the LED and the light guide plate can be easily and accurately determined based on the raised piece of the subchassis. In particular, when the light source units are divided and arranged, it is necessary to accurately determine the positional relationship between the LED and the light guide plate in all the light source units. Therefore, easy positioning is important in improving productivity. According to the present embodiment, it is possible to improve the heat radiation performance and positioning of the light source at the same time, and it is easy to assemble and to improve the productivity. For this reason, it is possible to provide a backlight unit that not only excels in heat dissipation performance of the light source but also reduces production costs.

  In addition, when mounting a plurality of light source units as a unit on a subchassis, a plurality of light source units mounted on the subchassis (wiring with LEDs mounted) are integrated by connecting and integrating the light guide plates of the plurality of light source units. One light guide plate may be used for the substrate and the heat sink. Such a light guide plate can be manufactured by a manufacturing method such as integral molding. Therefore, attachment to a chassis becomes easy and an assembly man-hour can be reduced. Therefore, it is possible to provide a backlight unit with a lower production cost.

  In order to reduce the number of parts, the light source unit may be directly installed on the chassis by providing a positioning and raising piece directly on the chassis without using the sub-chassis.

  A second embodiment according to the wiring board of the present invention will be described with reference to FIG.

  Since the wiring board of the first embodiment requires a space on the back surface of the wiring board for taking out the power supply cable to the LED, for example, when a connector is attached, the connection area with the heat sink is reduced accordingly. I have to. In the second embodiment, as shown in FIG. 5, a flexible wiring board 15 in which a copper wiring pattern is formed on an insulating film such as polyimide is used as a wiring board, and two areas of an LED mounting area 15a and a wiring area 15b are used. The flexible wiring board 15 is bent at a portion indicated by a broken line between the two and connected to a heat sink.

  The LED mounting area 15a is an area for mounting a plurality of LEDs, and the wiring area 15b is an area in which a wiring pattern for supplying power to each LED is mainly formed. In the LED mounting area 15a, a wide wiring pattern 15c is formed to diffuse the heat of the LED 8, and is connected to the wiring pattern 15d formed in the wiring area 15b via the wiring pattern 15c. In the LED mounting area 15a, a wiring pattern 15c may be provided on the front and back as needed, and through vias connecting the two may be provided. As will be described later, a notch 15e is provided in the bent portion of the flexible wiring board 15.

6A to 6C are sectional views of the light source unit 12 in which the flexible wiring board 15 is mounted on the subchassis 13.
6A shows a front cross-sectional view as viewed from the direction of arrow B in FIG. 2B, and FIG. 6B is a cross-sectional view taken along the line AA in FIG. FIG. 6C is a cross-sectional view taken along the line B-B in FIG. 6A, and shows a cross-section at the mounting portion of the LED 8.

  As shown in FIG. 5, the flexible wiring board 15 is bent at a portion indicated by a broken line between the mounting area 15a and the wiring area 15b of the LED 8, and is formed into an L shape over the entire back surface of the mounting area. 16 is bonded with a heat conductive adhesive or the like. The bent portion of the flexible wiring board 15 requires a height in the arrow B direction corresponding to the bending radius.

  In this embodiment, a notch 15e is provided in the bent portion where the LED 8 is mounted between the mounting area 15a and the wiring area 15b of the LED 8, and the bent portion is formed only in the area portion of the wiring pattern connecting the LED mounting area 15a and the wiring area 15b. Is to be formed. Thereby, it is possible to bend the portion where the LED 8 is mounted without requiring a height corresponding to the bending radius.

  FIG. 6 (b) shows a cross section at a portion bent at the area portion of the wiring pattern connecting the mounting area 15a and the wiring area 15b of the LED 8, and FIG. 6 (c) shows a cross section at the portion where the LED 8 is mounted. Yes.

  By providing the heat sink 16 with a notch 16a in the same manner as the flexible wiring board 15, as shown in FIG. 6C, a connection area on the surface 15f of the flexible wiring board 15 on which the LEDs 8 are mounted can be secured. Further, the heat sink 16 is provided with a step 16b corresponding to the thickness of the flexible wiring board 15 so as to escape the wiring area 15b of the flexible wiring, and is attached to the sub chassis 13. The sub-chassis 13 has a tab-like cut-and-raised piece 14. When the heat sink 16 to which the flexible wiring board 15 is bonded is attached to the sub-chassis 13, the cut-and-raised surface of the cut-and-raised piece 14 is the flexible wiring board. The heat sink 16 is fixed to the subchassis 13 in contact with the non-mounting portion between the 15 LEDs 8 and the LED 8.

  After the heat is diffused by the wide wiring pattern 15c (shown in FIG. 5) provided in the LED mounting area 15a, the heat is dissipated from both surfaces of the flexible wiring board 15 by the heat sink 16 and the cut and raised pieces 14 provided in the sub chassis 13. Therefore, high heat dissipation performance can be obtained.

  As shown in FIG. 6 (a), a connector or various sensors for connecting to a control circuit for controlling lighting or illuminance of the LED 8 in a part of the wiring area 15b of the flexible wiring board 15, and LED driving A circuit component 17 such as a driver element may be mounted. In this case, the notch portion 16 c is provided in the step portion of the heat sink 16 according to the shape of the mounted component 17. Since the notch 16c does not reach the bonding portion with the LED mounting area 15a, the connection area between the LED mounting area 15a and the heat sink 16 is not impaired, and heat can be efficiently transferred from the LED 8 to the heat sink 16. it can. About a light-guide plate, it can be set as the structure similar to 1st Example.

  According to the present embodiment, the heat radiation performance of the light source and the positioning of the LED and the light guide plate can be improved at the same time, and the assembly becomes easy and the productivity is improved. For this reason, it is possible to provide a backlight unit that not only excels in heat dissipation performance of the light source but also reduces production costs. In addition, since a part of the circuit components can be mounted on the light source unit, a highly functional light source unit can be provided, the scale of the circuit board installed on the rear surface of the chassis can be reduced, and the apparatus can be thinned.

  Further, as shown in FIG. 7, the flexible wiring board 15 is sandwiched between the heat sink 16 and the second heat sink 18 by the second heat sink 18 between the flexible wiring board 15 and the heat sink 16 shown in the second embodiment of FIG. Any configuration may be used.

FIG. 7A is a cross-sectional view corresponding to the AA cross section of FIG. 6B, and FIG. 7B shows the second heat sink 18.
In the present embodiment, the second heat sink 18 is shared as a positioning member for the LED 8 and the light guide plate 11. The second heat sink 18 has a flat portion 18a that comes into contact with the wiring area of the flexible wiring board and the heat sink step portion, and is provided with a plurality of cut and raised pieces 18b at the end of the flat portion.

  The cut-and-raised piece 18 b contacts the LED mounting surface of the flexible wiring board 15 at the non-mounting portion between the LEDs 8 of the flexible wiring board 15, and the flexible wiring board 15 is sandwiched between the heat sink 16 and the second heat sink 18. Configured as follows.

  Here, the heat sink 16 and the second heat sink 18 may be simultaneously bonded to the flexible wiring board 15. The light source module including the flexible wiring board 15 on which the LED 8 is mounted, the heat sink 16 and the second heat sink 18 is attached to the chassis 5 via the sub chassis 13 or directly. In any case, the back surface side 18c of the contact surface of the raised piece 18b provided on the second heat sink 18 with the flexible wiring board 15 is used as a positioning reference for installing the light guide plate 11.

  That is, the light guide plate 11 is installed so that the convex portion 11e provided on the light incident surface of the light guide plate abuts on the surface. As a result, the light source module itself can be provided with a positioning reference, so that it is possible to simultaneously improve the heat radiation performance and the positioning property of the LED and the light guide plate without providing a positioning and raising piece on the sub-chassis or chassis. Become.

  As described above, the present invention provides a light source unit that combines a light source that emits light in a direction parallel to a display surface of a liquid crystal panel and a light guide plate having translucency for guiding light from the light source toward the liquid crystal panel. A metal chassis provided with a positioning member for holding or supporting the light source unit, the light source comprising a plurality of light emitting elements mounted on a wiring board, and the wiring board formed on the wiring board. The wiring member is connected to a heat sink through a wiring pattern for feeding power to the light emitting element, and is also thermally connected to a positioning member provided on the metal chassis.

  One side surface of the light guide plate is a light incident surface on which light from the light source is incident. The light guide plate is positioned simultaneously with a wiring board by a positioning member provided on the metal chassis, and the light source unit includes the liquid crystal panel. Are arranged in the horizontal direction or the vertical direction of the liquid crystal panel according to the screen size. Even if the light source unit is divided, the positional relationship between the light source and the light guide plate constituting the light source unit and the positional relationship between the light source units can be accurately positioned by the positioning member, and heat can be radiated to the metal chassis via the positioning member. It is possible to simultaneously improve the heat dissipation performance and positioning.

  In the direction orthogonal to the display surface of the liquid crystal panel, a plurality of light source units may be arranged so that the light guide plate of one light source unit and the light guide plate of another light source unit overlap each other. Further, the back surface of the wiring board on which the light source is mounted is mounted by being thermally connected to a metal plate, and is provided in the metal chassis in a region between the light emitting elements on the surface on which the light source of the wiring board is mounted. The metal plate is fixed to the metal chassis while being brought into contact with the positioning member formed.

DESCRIPTION OF SYMBOLS 1 Liquid crystal television 2 Liquid crystal panel 3 Backlight unit 5 Chassis 8 Light source (LED)
9 Wiring boards 10 and 16 Heat sink 11 Light guide plate 11e Light guide plate convex portion 12 Light source unit 13 Sub chassis 14 Cut and raised piece (positioning member)
15 Flexible wiring board 18 Second heat sink

Claims (5)

In a liquid crystal display device including a backlight having a light source that illuminates the liquid crystal panel from the back and a chassis that holds the backlight,
The backlight includes a light source that emits light in a direction parallel to the display surface of the liquid crystal panel, a wiring board on which the light source is mounted, and a light-transmissive guide that guides the light from the light source toward the liquid crystal panel. A plurality of light source units combined with a light plate, and a metal chassis provided with a positioning member for supporting the light source unit,
The liquid crystal display device, wherein the wiring board and the light guide plate are positioned and attached by the positioning member. The liquid crystal display device according to claim 1.
The wiring board is thermally connected to a heat radiating member and is also thermally connected to the positioning member. The liquid crystal display device according to claim 1.
The liquid crystal display device, wherein the wiring board is thermally connected to a heat radiating member and the positioning member on the front surface and the back surface of the wiring substrate, respectively. The liquid crystal display device according to claim 1.
The liquid crystal display device, wherein the light guide plate is positioned and attached by the positioning member common to the wiring board. In a liquid crystal display device including a backlight having a light source that illuminates the liquid crystal panel from the back and a chassis that holds the backlight,
The backlight includes a light source that emits light in a direction parallel to the display surface of the liquid crystal panel, a wiring board on which the light source is mounted, and a light-transmissive guide that guides the light from the light source toward the liquid crystal panel. A plurality of light source units combined with a light plate, and a metal chassis provided with a positioning member for supporting the light source unit,
The light source unit is configured such that the wiring board and the light guide plate are positioned by the positioning member, and the backlight is configured by arranging the light source units in a plurality of stages or a plurality of rows in a direction parallel to the display surface of the liquid crystal panel. A liquid crystal display device.

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