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JP2010263564A5 - 半導体チップ - Google Patents

半導体チップ Download PDF

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Publication number
JP2010263564A5
JP2010263564A5 JP2009114600A JP2009114600A JP2010263564A5 JP 2010263564 A5 JP2010263564 A5 JP 2010263564A5 JP 2009114600 A JP2009114600 A JP 2009114600A JP 2009114600 A JP2009114600 A JP 2009114600A JP 2010263564 A5 JP2010263564 A5 JP 2010263564A5
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JP
Japan
Prior art keywords
circuit
semiconductor chip
signal
pad
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009114600A
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English (en)
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JP2010263564A (ja
JP5325650B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009114600A priority Critical patent/JP5325650B2/ja
Priority claimed from JP2009114600A external-priority patent/JP5325650B2/ja
Priority to CN2010101708870A priority patent/CN101901801A/zh
Priority to US12/772,748 priority patent/US7915926B2/en
Publication of JP2010263564A publication Critical patent/JP2010263564A/ja
Publication of JP2010263564A5 publication Critical patent/JP2010263564A5/ja
Application granted granted Critical
Publication of JP5325650B2 publication Critical patent/JP5325650B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 複数のパッドと、
    前記パッドと電気的に接続される入力回路又は出力回路と、
    外部回路又は内部回路からの信号の読み出しを制御するリードアクセス信号を出力する主制御部と、
    前記リードアクセス信号に基づいて、前記外部回路又は前記内部回路から信号が印加されるパッドと電気的に接続される前記入力回路又は前記出力回路の活性化を制御する活性化制御部と、
    を備える半導体チップ。
JP2009114600A 2009-05-11 2009-05-11 半導体チップ Active JP5325650B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009114600A JP5325650B2 (ja) 2009-05-11 2009-05-11 半導体チップ
CN2010101708870A CN101901801A (zh) 2009-05-11 2010-04-30 半导体芯片和包括该半导体芯片的半导体器件
US12/772,748 US7915926B2 (en) 2009-05-11 2010-05-03 Semiconductor chip and semiconductor device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009114600A JP5325650B2 (ja) 2009-05-11 2009-05-11 半導体チップ

Publications (3)

Publication Number Publication Date
JP2010263564A JP2010263564A (ja) 2010-11-18
JP2010263564A5 true JP2010263564A5 (ja) 2012-04-05
JP5325650B2 JP5325650B2 (ja) 2013-10-23

Family

ID=43061983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009114600A Active JP5325650B2 (ja) 2009-05-11 2009-05-11 半導体チップ

Country Status (3)

Country Link
US (1) US7915926B2 (ja)
JP (1) JP5325650B2 (ja)
CN (1) CN101901801A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101198141B1 (ko) * 2010-12-21 2012-11-12 에스케이하이닉스 주식회사 반도체 메모리 장치
US9537306B2 (en) * 2015-02-12 2017-01-03 Taiwan Semiconductor Manufacturing Company Limited ESD protection system utilizing gate-floating scheme and control circuit thereof
CN117368701B (zh) * 2023-12-07 2024-03-15 芯洲科技(北京)股份有限公司 焊盘检测电路

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216342A (ja) * 1999-01-21 2000-08-04 Mitsubishi Electric Corp 集積回路チップおよびその未使用パッドの処理方法
JP2002084182A (ja) * 2000-09-07 2002-03-22 Fuji Electric Co Ltd システム制御用回路
JP4726334B2 (ja) * 2001-06-13 2011-07-20 ルネサスエレクトロニクス株式会社 半導体装置
JP4136359B2 (ja) * 2001-11-15 2008-08-20 株式会社ルネサステクノロジ マイクロコンピュータ
KR100422450B1 (ko) * 2002-05-10 2004-03-11 삼성전자주식회사 반도체 메모리장치의 플립칩 인터페이스회로 및 그 방법
JP2006245063A (ja) * 2005-02-28 2006-09-14 Nec Electronics Corp 半導体チップおよび半導体チップを搭載する半導体装置
JP2007200392A (ja) * 2006-01-24 2007-08-09 Elpida Memory Inc 半導体記憶装置及び半導体集積回路装置
JP2008249388A (ja) * 2007-03-29 2008-10-16 Fujitsu Microelectronics Ltd 半導体装置および半導体装置モジュール
JP4999569B2 (ja) * 2007-06-18 2012-08-15 ルネサスエレクトロニクス株式会社 半導体記憶装置

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