JP2010260233A - Method for manufacturing liquid discharge head - Google Patents

Abstract

A plurality of sizes of chips are formed on a single substrate.
A plurality of blocks comprising: an energy generating element that generates energy for ejecting ink; a drive circuit that drives the energy generating element; and an electrode pad that supplies power to the energy generating element. A block forming step in which the blocks are arranged on the substrate 1; There is a cutting step of forming a plurality of types of recording head substrates having different lengths in the arrangement direction of the discharge ports by cutting the substrate at arbitrary positions in the arrangement direction of the discharge ports in the block 10.
[Selection] Figure 8

Description

  The present invention relates to a method for manufacturing a liquid discharge head that discharges liquid, and more particularly to a method for manufacturing an ink jet recording head.

  As an example of using a liquid discharge head that discharges liquid, there is an ink jet recording method in which recording is performed by discharging liquid onto a recording material.

  An ink jet recording head applied to an ink jet recording method (liquid jet recording method) generally generates energy used for discharging a fine discharge port, a liquid flow path, and a liquid provided in a part of the liquid flow path. A plurality of energy generating elements are provided. As a method for manufacturing such an ink jet recording head, for example, Patent Document 1 discloses a technique for forming an energy generating element and a nozzle having an ejection port on a substrate.

JP-A-6-286149

  By the way, a plurality of chips of the same size are regularly arranged in a grid pattern on a single substrate, so that a large number of chips can be obtained using a single substrate. It is also suitable for mass production.

  However, in the case of producing a small number of chips of various sizes, it is necessary to manufacture as many chips of a desired size as necessary, so that multiple types with different sizes using a single substrate. It is desirable to be able to manufacture the chip.

  Accordingly, the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a method for manufacturing a liquid discharge head capable of manufacturing a plurality of types of liquid discharge head substrates using a single substrate. To do.

In order to achieve the above-described object, a method for manufacturing a liquid discharge head according to the present invention includes:
A plurality of blocks including an energy generating element that generates energy for discharging liquid, a drive circuit that drives the energy generating element, and an electrode pad for supplying power to the energy generating element are arranged on the substrate. Forming a block,
A nozzle having a discharge port, a pressure generating unit in which an energy generating element is disposed, and a flow path for supplying a liquid to the pressure generating unit, and having at least one nozzle forming member in which a plurality of discharge ports are arranged A nozzle forming step to be formed on the block;
A supply port forming step of forming a supply port for supplying a liquid to the flow path of the nozzle forming member at a position corresponding to at least one block of the substrate;
A cutting step of forming a plurality of types of liquid discharge head substrates having different lengths in the arrangement direction of the discharge ports by cutting the substrate at an arbitrary position in the arrangement direction of the discharge ports in the block;
A method of manufacturing a liquid discharge head having

  According to the present invention, by selectively cutting at an arbitrary position in the arrangement direction of the discharge ports in the block, a plurality of types of liquid discharge heads having different lengths in the arrangement direction of the discharge ports using a single substrate Substrates can be manufactured.

It is a top view which shows typically an example of the inkjet recording head of embodiment. It is sectional drawing which shows typically an example of the inkjet recording head of embodiment. 1 is a perspective view schematically illustrating an example of an ink jet recording head cartridge according to an embodiment. It is a top view which shows typically arrangement | positioning of the block on the board | substrate in embodiment. It is a top view showing typically an example of a block on a substrate in an embodiment. It is sectional drawing which shows typically an example of the manufacturing method of an inkjet recording head. It is sectional drawing which shows typically an example of the patterning on the block cut | disconnected by the cutting process in embodiment. It is a top view which shows typically an example of the cutting position on the board | substrate in embodiment. It is a top view which shows typically an example of the cutting position on the board | substrate in embodiment. It is a top view which shows typically arrangement | positioning of the block on the board | substrate in embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. In the following description, constituent members having the same function are denoted by the same reference numerals, and the description thereof may be omitted.

  The liquid discharge head can be mounted on a printer, a copier, a facsimile having a communication system, a device such as a word processor having a printer unit, or an industrial recording device combined with various processing devices.

  By using this liquid discharge head, recording can be performed on various recording materials such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, and ceramics.

  In addition, “recording” used in this specification means not only giving an image having a meaning such as a character or a figure to a recording material but also giving an image having no meaning such as a pattern. Also points to.

  Furthermore, “ink” or “liquid” is to be broadly interpreted, and is applied on a recording material to form an image, a pattern, a pattern, or the like, process the recording material, or use ink or The liquid used for processing the recording material shall be included. Here, as the treatment of the ink or the recording material, for example, the fixing property is improved by coagulation or insolubilization of the coloring material in the ink applied to the recording material, the recording quality or the coloring property is improved, and the image durability is improved. It points out including improvement.

  First, an ink jet recording head (hereinafter referred to as a recording head) to which the liquid discharge head of the present invention can be applied will be described.

  FIG. 1 is a schematic diagram illustrating a recording head according to an embodiment. As shown in FIG. 1, in the recording head of this embodiment, energy generating elements 2 that generate energy used for ejecting liquid ink are arranged in two rows at a predetermined pitch for each block 10. A substrate 1 made of Si is formed.

  On the substrate (wafer) 1, a plurality of electrode pads 6 for supplying power to the energy generating element 2 are arranged in a direction parallel to the X direction in FIG. Is arranged. That is, the plurality of electrode pads 6 are arranged in each block 10 in a direction perpendicular to the main scanning direction of the recording head during the recording operation. Since each block 10 is electrically provided independently, only one block 10 can function as a recording head.

  A supply port 3 formed through the substrate 1 by etching Si is opened in the substrate 1 between the two rows of the energy generating elements 2 for each block 10.

  A nozzle forming member 4 is formed on the substrate 1. The nozzle forming member 4 includes an orifice 8 that is a nozzle having a discharge port 5 that opens above each energy generating element 2, and a foaming chamber as a pressure generating unit in which the energy generating element 2 is disposed as shown in FIG. 7a and a flow path 7b for supplying ink to the foaming chamber 7a. The supply port 3 communicates with each discharge port 5 via individual flow paths 7b and foaming chambers.

  This recording head is arranged so that the surface on which the supply port 3 is formed faces the recording surface of the recording material. The recording head causes ink filled in the flow path 7b through the supply port 3 to be ejected from the ejection port 5 by the energy generated by the energy generating element 2, and the ink droplet is covered. Recording on the recording material is performed by adhering to the recording material.

  Examples of the energy generating element 2 include an electrothermal conversion element (so-called heater) as thermal energy, and examples of the mechanical energy include a piezoelectric element, but are not limited thereto.

  This recording head can be mounted on a printer, a copying machine, a facsimile, a device such as a word processor having a printer unit, or an industrial recording device combined with various processing devices.

  FIG. 3 is a perspective view showing an example of an ink jet cartridge on which the recording head 100 shown in FIG. 1 is mounted.

  The inkjet cartridge 300 includes the above-described recording head 100 and an ink storage portion 200 that stores ink to be supplied to the recording head 100, and these are integrated. Note that these do not necessarily have to be integrated, and the ink container 200 can be removed.

  Next, the manufacturing method of the recording head of this embodiment will be described below. FIG. 5 is a plan view schematically showing an example of the block 10 on the substrate 1 in the embodiment. FIG. 6 is a cross-sectional view schematically showing an example of a method for manufacturing the recording head 100 of the present embodiment, and is a cross-sectional view taken along a line AA ′ in FIG. 1 and viewed from a plane perpendicular to the substrate.

  As shown in FIG. 4, a plurality of blocks 10 having the same length in the arrangement direction of the discharge ports 5 are arranged on the substrate 1 in a lattice pattern. That is, a plurality of blocks 10 having the same size are formed on the substrate 1 and arranged in a lattice pattern, and each block 10 arranged in a direction orthogonal to the arrangement direction of the discharge ports 5 has a scribe 11 interposed therebetween. It is divided between. Then, as shown in FIGS. 5 and 6A, for each block 10, a substrate 1 provided with an energy generating element 2, a drive circuit (not shown), and an electrode pad 6 is prepared (block forming step). ).

  The size of the block 10 is not limited and can be set to any size. When an exposure apparatus (stepper) is used for patterning the block 10, the reticle can be used effectively by setting the size of the integral multiple of the block 10 and the size of the angle of view the same. Also, as shown in FIGS. 10A and 10B, a plurality of types of blocks 10 having different lengths in the arrangement direction of the discharge ports 5 may be arranged on the substrate 1 in a grid pattern. That is, even if a plurality of blocks 10 are formed in different sizes and arranged in a lattice pattern, and each block 10 arranged in a direction perpendicular to the arrangement direction of the discharge ports 5 is partitioned with the scribe 11 interposed therebetween. Good. As shown in FIG. 5, a plurality of electrode pads 6 are arranged in a block 10 of the substrate 1 in parallel with a direction parallel to the arrangement direction of the discharge ports 5.

  Examples of the energy generating element 2 include an electrothermal conversion element (heater) or a piezoelectric element (piezo element). In general, in order to improve the durability of these energy generating elements, various functional layers such as a protective layer are provided. However, in the present invention, these functional layers may be provided. Of course.

  Subsequently, as illustrated in FIG. 6B, a resin layer 9 is formed on the substrate 1. The resin layer 9 is patterned and positioned between the substrate 1 and the nozzle forming member 4 in the completed recording head. For the resin layer 9, a thermoplastic resin is usually used. Examples of the thermoplastic resin include polyether amide, polyimide, polycarbonate, polyester, and the like.

  At this time, the purpose of providing the resin layer 9 on the substrate 1 is usually formed by using a material such as silicon as a material, the substrate 1 having a metal or inorganic surface, and using a resin or the like. The purpose is to improve the adhesion to the nozzle forming member 4 in many cases. The purpose of providing the resin layer 9 on the substrate 1 also includes the purpose of protecting elements provided on the surface of the substrate 1. Of course, even for other purposes, the resin layer 9 may be formed on the substrate 1 as necessary.

  Next, as illustrated in FIG. 6C, the resin layer 9 is patterned to form a patterned resin layer 12. The patterning method can be performed using photolithography when the resin layer 9 is a photosensitive material. Moreover, when the resin layer 9 is a material which does not have photosensitivity, methods, such as an etching, can be used.

  Subsequently, as shown in FIG. 6D, a dissolvable resin is dissolved in a solvent, and the resin is applied onto the substrate 1 on which the resin layer 12 is formed by using a spin coat (solvent coat) method. A resin layer 13 is formed.

  Examples of the soluble resin that forms the resin layer 13 include polymethyl isopropenyl ketone, polyphenyl isopropenyl ketone, polymethyl vinyl ketone, polyphenyl vinyl ketone, and polymethyl methacrylate. Moreover, as a solvent used for this resin, water-insoluble cyclohexanone, methyl isobutyl ketone, xylene, water-soluble methyl lactate, ethyl lactate, etc. are mentioned.

  Next, as shown in FIG. 6 (e), the dissolvable resin layer 13 is patterned to form a desired flow path pattern 14 with the resin layer 13 on the resin layer 12 formed on the substrate 1. .

  Subsequently, as shown in FIG. 6 (f), a coating layer 15 for covering the flow path pattern 14 is formed on the substrate 1 on which the resin layer 12 and the flow path pattern 14 are formed. As a method for forming the coating layer 15, there is a method in which an epoxy resin and a photoacid generator are mixed and a solvent coating is performed as a solution. However, the method is not limited to this method, and an inorganic substance, a resin, or the like can be selected. it can.

  Next, as shown in FIG. 6G, an orifice 8 having a discharge port 5 is formed in the coating layer 15 (nozzle forming step). The formation method of the orifice 8 having the discharge port 5 can be selected according to the material of the coating layer 15, and examples thereof include photolithography and dry etching.

  At this time, when cutting waste of the nozzle forming member 4 is generated at the time of cutting the block 10 in a dicing process performed in a subsequent process, and this cutting dust closes the discharge ports 5 of the other blocks 10, There is a concern that a discharge failure may occur. Therefore, in order to prevent the generation of cutting dust, as shown in FIG. 7A, the coating layer 15 constituting the nozzle forming member 4 on the arbitrary block 10 to be cut in the dicing process is formed on the discharge port 5. Sometimes, it may be removed in advance by using a solvent or etching. That is, in the dicing process, it is desirable to cut the substrate 1 at a predetermined block 10 in which the nozzle forming member 4 is not formed among the plurality of blocks 10.

  Next, as shown in FIG. 6 (h), the supply port 3 is formed in the substrate 1. When the substrate 1 is made of Si, the supply port 3 can be formed by performing Si anisotropic etching using a dry etching apparatus (supply port forming step). This supply port forming step is a step of forming the supply port 3 at a position corresponding to at least one block 10 of the substrate 1. Further, as another processing method for forming the supply port, a known processing method related to the substrate can be applied.

  At this time, there is a concern that cracks may occur in the supply port 3 at the time of cutting in a dicing process performed in a subsequent process. For this reason, as shown in FIG. 7B, the supply port 3 is formed in an arbitrary block 10 to be cut in the dicing process as necessary to prevent the supply port 3 from being cracked. It does not have to be done. That is, in the dicing process, it is desirable to cut the substrate 1 in a predetermined block 10 in which the supply port 3 is not formed among the plurality of blocks 10.

  Subsequently, as shown in FIG. 6I, after the flow path pattern 14 is dissolved and removed using a solvent, the coating layer 15 in which the discharge ports 5 are formed is cured. The steps so far are processed in the state of a wafer. In FIG. 6, the state of one block 10 is shown for convenience, but in actuality, processing is performed in the state of a wafer on which a plurality of blocks 10 are arranged.

  Next, as shown in FIGS. 8, 9A, and 9B, in the dicing process, the block 10 and the scribe 11 are arranged at an arbitrary position in the arrangement direction of the ejection ports 5 in the selected arbitrary block 10. Is cut along the dicing line 16 (cutting step). By this step, the substrate 1 is divided into a desired chip size.

  Note that the block 10 to be cut is arbitrarily selected according to the desired chip size, and is not limited to the cutting position shown in FIG. That is, it is needless to say that any block 10 can be cut and can be cut into any chip size. In addition, a known substrate cutting method can be applied in the dicing process. Finally, the recording head is completed through a process (not shown) for performing necessary electrical connection.

  As described above, according to the present embodiment, an arbitrary position in the arrangement direction of the ejection ports 5 in the selected arbitrary block 10 is selectively cut. As a result, a single substrate 1 is used to obtain a plurality of types of recording head substrates (liquid ejection head substrates) having different lengths in the arrangement direction of the ejection ports 5, that is, recording head substrates having a desired recording width. It becomes possible. Therefore, according to the present embodiment, it is possible to manufacture a necessary number of head chips of a plurality of types using a single substrate 1.

  The form mentioned above is an example to the last, and various other embodiment can be taken.

  Examples will be described in detail below.

Example 1
As shown in FIG. 4, a plurality of blocks 10 formed in the same size are arranged in a lattice pattern, and each block 10 arranged in a direction orthogonal to the arrangement direction of the discharge ports 5 has a scribe 11 therebetween. A Si substrate partitioned by sandwiching is formed. And the board | substrate 1 with which the energy generating element 2, the drive circuit (not shown), and the electrode pad 6 were provided for every block 10 on the Si substrate was prepared (FIG. 5). At this time, the width of each block 10 in the direction perpendicular to the main scanning direction is 6350 μm (0.25 inches).

  The energy generating elements 2 of each block 10 are arranged in two rows in a direction perpendicular to the main scanning direction, and 127 pieces are arranged per row. The distance between the energy generating elements 2 (the direction perpendicular to the main scanning direction) is 50 μm from the center of the energy generating element 2 to the center of the adjacent energy generating element 2. A plurality of electrode pads 6 are arranged in a block 10 in a direction perpendicular to the main scanning direction.

  Next, as shown in FIG. 6B, a polyetheramide resin was applied on the substrate 1 by spin coating. As the polyetheramide resin, HIMAL1200 manufactured by Hitachi Chemical Co., Ltd. using N-methyl-2-pyrrolidone and butyl cellosolve acetate as solvents was used. Thereafter, baking was performed at 100 ° C. for 30 minutes, and then baking was performed at 250 ° C. for 60 minutes to form a resin layer 9 with a thickness of 2 μm.

  Next, a photosensitive positive resist was applied on the resin layer 9 made of polyetheramide resin by a spin coating method, followed by patterning to form a photosensitive positive resist pattern.

  The resin layer 9 made of polyetheramide resin is etched using the photosensitive positive resist pattern, and then the photosensitive positive resist is removed to form a resin layer patterned as shown in FIG. 6 (c). 12 formed an adhesion layer.

Next, a polymethylisopropenyl ketone resin (ODUR-1010A manufactured by Tokyo Ohka Kogyo Co., Ltd. using cyclohexanone as a solvent was used) was applied onto the substrate 1 and the resin layer 12 by a spin coating method (solvent coating method). . Thereafter, baking was performed at 120 ° C. for 6 minutes, and as shown in FIG. 6D, a resin layer 13 having a thickness of 14 μm was formed with polymethylisopropenyl ketone. Subsequently, the resin layer 13 made of polymethylisopropenyl ketone was exposed at an exposure amount of 11 J / cm ² using an exposure apparatus (Ushio Electric Co., Ltd .: UX-3000SC). The resin layer 13 was developed with methyl isobutyl ketone to form a flow path pattern 14 as shown in FIG.

  Then, the following composition was apply | coated by the spin coat method on the board | substrate 1 with which the resin layer 12 and the flow path pattern 14 were formed. Thereafter, baking was performed at 60 ° C. for 9 minutes to form a coating layer 15 with a thickness of 25 μm as shown in FIG.

-Epoxy resin: EHPE3150
Silane coupling agent: A-187
Photoacid generator: SP-172
-Coating solvent: Xylene Next, the coating layer 15 was exposed with the exposure amount of 0.12 J / cm < ² > using the exposure apparatus (Canon company make: MPA-600SUPER). At this time, the coating layer 15 on the block 10 to be cut in the subsequent process is not exposed. Thereafter, baking was performed at 90 ° C. for 4 minutes.

  Subsequently, development was performed using a mixed solvent of methyl isobutyl ketone and xylene to form an orifice 8 having a discharge port 5 as shown in FIG. At this time, the interval between the ejection ports 5 (direction perpendicular to the main scanning direction) was set to 50 μm from the center of the ejection port 5 to the center of the adjacent ejection port 5. At this time, as shown in FIG. 7A, the coating layer 15 on the block 10 to be cut in the subsequent process was dissolved. Thereafter, baking was performed at 140 ° C. for 60 minutes.

  Next, using a dry etching apparatus, the substrate 1 was etched by Si anisotropic etching to form a supply port 3 as shown in FIG. At this time, the supply port 3 is not formed in an arbitrary block 10 to be cut in a subsequent process as shown in FIG.

  Subsequently, in the wet removal apparatus, ultrasonic waves were applied at 40 ° C. or lower, and methyl lactate was used as a solvent to remove the polymethylisopropenyl ketone channel pattern 14 as shown in FIG. At this time, the flow path pattern 14 on the block 10 to be cut in the subsequent process is also dissolved as shown in FIG. Thereafter, baking was performed at 200 ° C. for 60 minutes, and the nozzle forming member 4 was completely cured.

  Next, as shown in FIGS. 8, 9A and 9B, the selected block 10 is cut along the dicing line 16 using a dicing apparatus, and the dicing line on the scribe 11 is used. Cut along 16. Thus, the substrate 1 was divided into each chip size of 0.25 inch to 1.25 inch. Finally, the recording head was completed through a process (not shown) for electrically connecting necessary portions.

  It should be noted that the recording head of this embodiment has 127 recording heads in a width of 6300 μm in the X direction on the block 10 whose width in the direction perpendicular to the main scanning direction (X direction) is 6350 μm (0.25 inch). The discharge ports 5 are arranged in a line. Therefore, the recording head of the first embodiment has a resolution of 512 dpi (dot / inch).

(Example 2)
As shown in FIGS. 10 (a) and 10 (b), a plurality of types of blocks 10 formed in different sizes are arranged in a lattice pattern and arranged in a direction perpendicular to the arrangement direction of the discharge ports 5. Each block 10 forms a Si substrate partitioned with a scribe 11 therebetween. Then, as shown in FIG. 5, a substrate 1 provided with an energy generating element 2, a drive circuit (not shown), and an electrode pad 6 was prepared for each block 10 on this Si substrate.

  At this time, the blocks 10 are arranged in combination with different widths of 25400 μm (1 inch) and 6350 μm (0.25 inch) in the direction perpendicular to the main scanning direction (FIG. 10). (A)).

  The energy generating elements 2 included in the block 10 having a width of 25400 μm are arranged in two rows in a direction perpendicular to the main scanning direction, and 511 elements are arranged per row. In addition, the energy generating elements 2 included in the block 10 having a width of 6350 μm are arranged in two rows in a direction perpendicular to the main scanning direction, and 127 pieces are arranged per row.

  The interval between the energy generating elements 2 (direction perpendicular to the main scanning direction) is set such that the distance from the center of the energy generating element 2 to the center of the adjacent energy generating element 2 is 50 μm in each block 10. Has been. A plurality of electrode pads 6 are arranged in a block 10 along a direction perpendicular to the main scanning direction. The steps shown in FIGS. 6, 7 and 8 were performed in the same manner as in Example 1.

  The recording head of this embodiment has a width of 25350 μm on the block 10 whose width in the direction perpendicular to the main scanning direction is 25400 μm (1 inch), and a direction perpendicular to the main scanning direction. 511 discharge ports 5 are arranged in a line.

  Further, the recording head of this embodiment has a width of 6300 μm on the block 10 whose width in the direction perpendicular to the main scanning direction is 6350 μm (0.25 inch) and a direction perpendicular to the main scanning direction. In addition, 127 discharge ports 5 are arranged in a line. Therefore, the resolution is 512 dpi (dot / inch) in any recording head.

(Example 3)
As shown in FIG. 10A and FIG. 10B, a plurality of blocks 10 formed in different sizes are arranged in a lattice pattern, and are arranged in directions orthogonal to the arrangement direction of the discharge ports 5. A block 10 forms a Si substrate partitioned with a scribe 11 therebetween. Then, as shown in FIG. 5, a substrate 1 provided with an energy generating element 2, a drive circuit (not shown), and an electrode pad 6 was prepared for each block 10 on this Si substrate.

  At this time, each block 10 has a width in the direction perpendicular to the main scanning direction of 19050 μm (0.75 inch), 12700 μm (0.5 inch), and 6350 μm (0.25 inch) different sizes. They are arranged (FIG. 10 (b)).

  The energy generating elements 2 included in the block 10 having a width of 19050 μm are arranged in two rows in a direction perpendicular to the main scanning direction, and 383 are arranged per row. In addition, the energy generating elements 2 included in the block 10 having a width of 12700 μm are arranged in two rows in a direction perpendicular to the main scanning direction, and 255 pieces are arranged per row. In addition, the energy generating elements 2 included in the block 10 having a width of 6350 μm are arranged in two rows in a direction perpendicular to the main scanning direction, and 127 pieces are arranged per row.

  The interval between the energy generating elements 2 (direction perpendicular to the main scanning direction) is set such that the distance from the center of the energy generating element 2 to the center of the adjacent energy generating element 2 is 50 μm in each block 10. Yes. A plurality of electrode pads 6 are arranged in a block 10 in a direction perpendicular to the main scanning direction. The steps shown in FIGS. 6, 7 and 8 were performed in the same manner as in Example 1.

  The recording head of this embodiment has a width of 19000 μm and a direction perpendicular to the main scanning direction on the block 10 whose width in the direction perpendicular to the main scanning direction is 19050 μm (0.75 inch). In addition, 383 discharge ports 5 are arranged in a line. Further, the recording head of this embodiment has a width of 12650 μm and a direction perpendicular to the main scanning direction on the block 10 whose width in the direction perpendicular to the main scanning direction is 12700 μm (0.5 inch). In addition, 255 discharge ports 5 are arranged in a line. Further, the recording head of this embodiment has a width of 6300 μm on the block 10 whose width in the direction perpendicular to the main scanning direction is 6350 μm (0.25 inch) and a direction perpendicular to the main scanning direction. In addition, 127 discharge ports 5 are arranged in a line. Therefore, the resolution is 512 dpi (dot / inch) in any recording head.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Energy generating element 3 Supply port 4 Nozzle formation member 5 Discharge port 6 Electrode pad 7a Foaming chamber (pressure generation part)
7b Flow path 8 Orifice (nozzle)
10 blocks

Claims (6)

A plurality of blocks comprising: an energy generating element that generates energy for discharging liquid; a drive circuit that drives the energy generating element; and an electrode pad that supplies power to the energy generating element. A block forming step of arranging and forming
A nozzle forming member comprising a nozzle having a discharge port, a pressure generating unit in which the energy generating element is disposed, and a flow path for supplying a liquid to the pressure generating unit, wherein a plurality of the discharge ports are arranged, Forming a nozzle on at least one of the blocks;
A supply port forming step of forming a supply port for supplying a liquid to the flow path of the nozzle forming member at a position corresponding to at least one block of the substrate;
A cutting step of forming a plurality of types of liquid discharge head substrates having different lengths in the arrangement direction of the discharge ports by cutting the substrate at arbitrary positions in the arrangement direction of the discharge ports in the block;
A method of manufacturing a liquid discharge head having   2. The liquid ejection head according to claim 1, wherein in the block formation step, the plurality of blocks having the same length in the arrangement direction of the ejection ports are arranged in a grid pattern on the substrate. Method.   2. The liquid ejection head according to claim 1, wherein, in the block formation step, a plurality of types of the blocks having different lengths in the arrangement direction of the ejection ports are arranged and arranged on the substrate in a lattice shape. Method.   4. The method of manufacturing a liquid ejection head according to claim 1, wherein, in the cutting step, the substrate is cut at the block in which the supply port is not formed among the plurality of blocks. 5.   5. The method of manufacturing a liquid ejection head according to claim 1, wherein, in the cutting step, the substrate is cut in the block in which the nozzle forming member is not formed among the plurality of blocks. 6.   6. The method of manufacturing a liquid ejection head according to claim 1, wherein, in the block formation step, the plurality of electrode pads are formed by being arranged in a direction parallel to an arrangement direction of the ejection ports.

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