JP2010258360A - Box type electronic module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a box type electronic module of an engine control unit, etc. for automobile, which is improved in durability and waterproof property, inexpensive, and highly reliable. <P>SOLUTION: The box type electronic module includes a first constitution member (metal base) 15 and a second constitution member (connector) 13 which are bonded and joined together with an adhesive 20 serving as a sealing material. The first constitution member 15 is provided with an adhesive filled groove 16 which has a narrow opening 16a and a wide filled portion 16b connecting therewith, and is sectioned in a projecting shape, an inverted T shape, an L shape, an inverted funnel shape, or a sectional shape similar thereto, wherein a first adhesive layer 20A is formed in the adhesive filled groove 16, a second adhesive layer 20B is formed on the bonded portion 15f of the first constitution member 15 positioned right above the first adhesive layer 20A, and the second constitution member 13 is bonded and joined to the first constitution member 15 via the first adhesive layer 20A and second adhesive layer 20B. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a box-type electronic module having a first component member (for example, a metal base) and a second component member (for example, a connector) that are bonded and bonded with an adhesive material that also serves as a sealing material.

  Conventionally, as can be seen in, for example, Patent Document 1 below, as a box-type electronic module such as an engine control unit for automobiles, for electrically connecting a circuit board on which electronic components are mounted and the circuit board to the outside And a base for holding the circuit board and the connector, and a sealing cover that covers the connector and the base so as to cover the circuit board.

  In such a box-type electronic module, the base and the connector, the connector and the cover, and the cover and the base are usually sealed with an adhesive that also serves as a sealing material, and the cover and the base are screwed together. It comes to stop.

  In addition, when assembling the box-shaped electronic module as described above, when it is applied (when uncured), it has a shape-retaining property that does not collapse, and when pressed to a predetermined thickness, In general, a silicone adhesive having a plasticity that flows so as to follow the shape is used (see, for example, Patent Document 2 below).

JP 2003-258451 A JP 2005-146198 A

  The conventional box-type electronic module as described above has the following problems to be solved.

  In other words, the adhesive material that also serves as a sealing material that has been used in the past has an adhesive strength and a degree of peeling depending on the surface condition of the part to be bonded of the parts (base, cover, connector, etc.) constituting the box-shaped electronic module and the usage environment. It will be significantly different. As a specific example, soldering flux adheres to the surface (bonded part) of the component part in the manufacturing process of the box-type electronic module, or the box-type electronic module installed in the engine room of the vehicle, for example, If rainwater or a washing agent at the time of car washing is applied to the adhesive joint, the adhesive strength will be reduced, or the adhesive force at the adhesive interface with the adherend will be weak, and the adhesive will not remain on the adherend. In some cases, interfacial delamination may occur, and when such adhesive strength reduction or interfacial delamination occurs, the waterproof sealability is impaired, and electronic components, connectors, and the like mounted on the circuit board are liable to fail.

  In particular, a large twisting force is applied to the connector and base when the mating connector is attached to the connector, and a large load is easily applied due to the weight or vibration of the harness. Peeling easily occurs.

  On the other hand, the degree of cure of the adhesive varies depending on the volume of the adhesive. In the heat-curing type adhesive, the adhesive reaches the curing temperature and cures after the adherend reaches the curing temperature. In addition, moisture curing type adhesives take in moisture contained in the air around the box-type electronic module and gradually cure from the surface to the deep part, so that it can be touched from the surface where moisture in the air can be touched. If the distance to the deep part where it cannot be done is long, it takes time to cure the adhesive. According to the catalog value of the adhesive manufacturer, it takes one day to cure from the surface to a depth of 3 mm.

  The present invention has been made in view of the above circumstances. The object of the present invention is to make it difficult to cause a decrease in adhesive strength, interfacial delamination, or the like in an adhesive that bonds and bonds constituent members, and is durable and waterproof. It is an object of the present invention to provide a box-type electronic module such as an automobile engine control unit that can improve the performance and is inexpensive and highly reliable, and a method for manufacturing the same.

  In order to achieve the above object, a box-shaped electronic module according to the present invention basically includes a first component member and a second component member that are bonded and bonded with an adhesive material that also serves as a sealing material. Adhering to the first component member having a cross-sectional convex shape, a reverse T-shape, an L-shape, a reverse funnel shape, or a cross-sectional shape similar to them, each having a narrow opening and a wide filling portion connected thereto. A material filling groove is provided, a first adhesive layer is formed in the adhesive filling groove, and a first adhesive member layer is formed on the adherend portion of the first component member, which is positioned substantially directly above the first adhesive layer. Two adhesive layers are formed, and the second constituent member is adhesively bonded to the first constituent member via the first adhesive layer and the second adhesive layer.

  In this case, preferably, the first component member is a metal base, and the second component member is a connector.

  In a more specific preferred embodiment, a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, the circuit board is mounted, and the connector is made of an adhesive. A metal base that is bonded to the circuit board, and a sealing cover that is bonded to the metal base with an adhesive to cover the circuit board and the metal base, and the metal base includes a narrow opening. An adhesive filling groove having a cross-sectional convex shape, an inverted T-shape, an L-shape, a reverse funnel shape, or a cross-sectional shape similar to them is provided, and the adhesive filling groove. A first adhesive material layer is formed therein, a second adhesive material layer is formed on the adherend portion of the metal base positioned substantially directly above the first adhesive material layer, and the connector is attached to the metal base. First adhesive layer and second adhesive It is characterized by being adhesively bonded via the layer.

As the adhesive, a condensation type silicone adhesive is preferably used.
The metal base is preferably made of aluminum die casting.
The housing of the connector is preferably made of a thermoplastic resin such as polybutylene terephthalate or nylon.
The cover is preferably a press-formed product made of a steel plate.

  On the other hand, a method for manufacturing a box-shaped electronic module according to the present invention is a method for manufacturing the above-described box-shaped electronic module, and the first component member has a cross-section including a narrow opening and a wide filling portion connected to the narrow opening. An adhesive filling groove having a convex shape, an inverted T shape, an L shape, a reverse funnel shape, or a cross-sectional shape similar to them is provided, and the adhesive filling groove is filled with an adhesive material for first bonding. A material layer is formed and cured, and then an adhesive is applied onto the adherend portion of the first component located substantially directly above the first adhesive material layer to form a second adhesive layer And bonding the first constituent member and the second constituent member by placing the second constituent member on the second adhesive layer and curing the second adhesive layer. It is characterized by that.

  In the box-shaped electronic module according to the present invention, the first adhesive layer that is cured in the adhesive filling groove and adhered to the inner wall surface of the groove has a lower wide width even when a large tensile load is applied upward. Since the portion is locked to the adherend portion of the first component member, it does not come out of the adhesive filling groove. On the other hand, the lower surface of the second adhesive layer is bonded to the bonded portion of the first component member, and a part (center portion) of the second adhesive layer is bonded to the upper end surface of the upper narrow portion of the first adhesive layer. Is done. In this case, since the adhesion between the lower surface of the second adhesive layer and the upper end surface of the upper narrow portion of the first adhesive layer is an adhesion between the same types of adhesives, the adhesive strength is the second adhesive layer. Compared with the case where the entire lower surface of the adhesive member is bonded to the bonded portion of the first component member (conventional product), it is much larger.

  That is, a rivet effect by the adhesive filling groove is obtained at the adhesive joint portion by the first and second adhesive layers, and the first and second adhesive layers are not broken below the adhesive strength of the adhesive.

  Moreover, since the uncured adhesive (second adhesive layer) is applied on the first adhesive layer after the first adhesive layer is first cured, the vicinity of the interface of the first adhesive layer In addition, diffusion / penetration of the polymer constituting the second adhesive layer occurs, and this interaction called diffusion / penetration is called “crosslinking” between the first adhesive layer and the second adhesive layer. Strong bond forms are generated and their bond strength is further increased.

  Therefore, according to the box-shaped electronic module and the manufacturing method thereof according to the present invention, high waterproof sealability and durability can be obtained, so that intrusion of rainwater and the like can be reliably prevented, and reliability can be improved.

  In general, the larger the volume of the adhesive layer, the longer it takes to cure and the manufacturing cost increases. On the other hand, as described above, the product of the present invention can considerably increase the adhesive strength and the waterproof sealing effect, so that the volume of the adhesive layer can be reduced accordingly. Therefore, the time required for curing can be shortened, and advantages can be obtained in terms of production efficiency and cost.

The longitudinal cross-sectional view which shows one Embodiment of the box-type electronic module of this invention. The top view of the box-type electronic module shown by FIG. The exploded view of the box-type electronic module shown by FIG. The front view which shows the connector part of the box-type electronic module shown by FIG. The top view of the state which removed the cover from the box-type electronic module shown by FIG. (A) is an enlarged sectional view of the main part (around the adhesive filling groove) of the box-type electronic module shown in FIG. 1, and (B), (C), (D) are other examples of the shape of the adhesive filling groove. FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 is a partially cutaway schematic cross-sectional view showing an embodiment of a box-shaped electronic module according to the present invention, FIG. 2 is a plan view thereof, FIG. 3 is an exploded view thereof, FIG. 4 is a front view of the partially cutaway portion, and FIG. It is the top view which removed the cover from the state of FIG.

  The box-type electronic module 10 according to the present embodiment is used as an engine control unit for automobiles. The circuit board 14 on which the electronic component 21 is mounted is electrically connected to the circuit board 14 and external sensors and control mechanisms. A connector 13 for connection is attached and fixed, and an adhesive 20 (first adhesive layer 20A, second adhesive) on which the connector 13 also serves as a sealing material is attached to a heat radiating metal base 15 on which the circuit board 14 is mounted. The cover 11 is bonded and bonded to the metal base 15 via the adhesive 20 (third adhesive layer 20C), and the connector 13 and the cover 11 are bonded to the adhesive 20 (fourth layer). It is adhesively bonded via an adhesive layer 20D).

  The circuit board 14 is a rectangular resin printed wiring board. A eutectic solder paste is printed on the surface of the circuit board 14 by a screen printing machine, and necessary electronic components 21, 21,... Are mounted by an automatic mounting machine, and then soldered in a solder reflow furnace. It is natural. Here, the electronic components 21, 21,... Are arithmetic ICs, chip resistors, chip capacitors, aluminum electrolytic capacitors, and the like.

  The connector 13 includes a substantially rectangular parallelepiped housing 13A formed of a thermoplastic resin and a required number of metal terminals 13B accommodated in the housing 13A. The housing 13A is inserted with a plug of an external harness. A rectangular cylindrical shape with rounded corners, two large and small socket parts 13c, 13d, a thick plate-like terminal holding wall part 13e for holding the metal terminal 13B, and a front view outline projecting inward from the terminal holding wall part 13e. It has a trapezoidal and cylindrical inward protruding portion 13f.

  The metal terminal 13B is formed, for example, by punching a 0.5 mm thick copper plate to a width of 0.5 mm and press-molding it into an L-shape, and at the connection portion (lower end) with the circuit board 14 Tin plating is applied. Also, the metal terminal 13B has X terminal (for example, 80 terminals) for input to the larger socket part 13c, and Y terminal (for example, 40 terminals) for output to the smaller socket part 13d, respectively. 13e and the inwardly projecting portion 13f are inserted into through holes formed in the bottom surface portion, and are held and fixed (in the drawing, each portion is depicted in a simplified manner).

  The connector 13 is integrally attached and fixed to the front end of the circuit board 14 with fixing claws. The lower end portion of the metal terminal 13B of the connector 13 is inserted into a through hole 14s formed in the circuit board 14 so as to protrude downward about 1 mm therefrom, and the lower end portion is soldered to the circuit board 14. Are joined and electrically connected.

  On the other hand, the heat radiating metal base 15 is made of aluminum die-casting, has a rectangular shape in plan view, and a projecting portion 15d on which the circuit board 14 is placed projects from the main surface side on which the circuit board 14 is mounted. A fin 15b for heat dissipation is formed on the back side.

  Further, near the four corners of the metal base 15, female screws 28 (see FIG. 5) into which the fastening screws 19 for fastening with the cover 11 are screwed are formed.

  An adhesive filling groove 16 that is linear in plan view and has a convex cross section is formed in the front end 15A, which is the end of the metal base 15 on the connector 13 side. The adhesive filling groove 16 is formed by a slide method or a lost wax method, and can be understood by referring to an enlarged view of FIG. 6A in addition to FIGS. And a narrow opening 16a having a narrow width opening on the upper surface of the metal base 15, and a wide filling portion 16b having a wide cross-sectional rectangle on the back side (lower side) from the narrow opening 16a. For example, the opening 16a has a width of 4 mm and a depth of 2 mm, and the wide filling portion 16b has a width of 6 mm and a depth of 4 mm, for example.

  The cover 11 is formed by pressing a steel plate having a thickness of 0.5 mm into a tray shape, has a rectangular shape in plan view, a portion 11A covering the circuit board 14 has a depth of about 19 mm, and a connector 13 (inward protruding portion 13f thereof). 11B has a depth of about 30 mm, and the outer peripheral portion of the three sides excluding the front end side is laid down to form an L-shaped flange portion 11C. As will be described later, the flange portion 11C is a portion that comes into contact with the adhesive material 20 (third adhesive material layer 20C) applied on the three side end portions 15B, 15C, and 15D of the metal base 15, and is close to the four corners thereof. Is provided with a screwing raised projection 18 for fastening and fixing the cover 11 to the metal base 15 with a screw 19, and the base 15 through a screw through hole formed in the raised projection 18. The screw 19 is screwed into the female screw portion 28 formed in (see FIG. 2). The flange portion 11C is formed so as to draw an arc on the inner side of the stepped convex portion 18 for screwing to avoid the flange portion 11C. Further, a hole for attaching the waterproof filter 22 is formed in the central portion of the cover 11, and the entire surface of the metal cover 11 is galvanized.

  Next, a procedure for assembling the circuit board 14, the connector 13, the metal base 15, and the cover 11 through adhesive bonding 20 that also serves as a sealing material will be described.

  Here, as the adhesive 20, a silicone-based, moisture-curing adhesive, more specifically a deacetone-type or dealcohol-type condensation-type adhesive is used. The adhesive 20 has a shape-retaining property that does not collapse when applied (when uncured), and flows to follow the shape of the adherend when pressed to a predetermined thickness. It has plasticity.

  When assembling the box-shaped electronic module 10 of the present embodiment, first, the adhesive 20 is placed in the adhesive filling groove 16 formed in the front end portion 15A of the metal base 15, or an air pressure control type automatic applicator or It is filled with an automatic coating machine that applies air pressure to the adhesive in the tank and controls it with an open / close valve.

  Thereafter, the metal base 15 filled with the adhesive 20 in the groove 16 is subjected to constant temperature and humidity at a temperature of 60 ° C. and a humidity of 60% RH before forming the other adhesive layers (20B, 20C, 20D). It is put in the tank for about 3 hours, and then stored in the room for 1 day or longer to cure the adhesive 20 (first adhesive layer 20A) in the groove 16.

  After the first adhesive material layer 20A is cured in this way, the same kind is applied to the adherend portion 15f (see FIG. 6) of the metal base 15 located substantially directly above the first adhesive material layer 20A. The second adhesive layer 20B is formed by applying the adhesive material 20 with an automatic coating machine. At the same time, the adhesive 20 is also applied to the central portion of the base 15 with an automatic application machine. Thereafter, the circuit board 14 to which the connector 13 is integrally attached and fixed is mounted by an automatic mounting machine. Here, the purpose of bonding the central portion of the base 15 is to prevent the circuit board 14 from being lifted (this adhesive layer is indicated by a virtual line 20E in FIG. 5).

  When the circuit board 14 is mounted, the lower surface 13U of the inwardly projecting portion 13f of the connector 13 is placed on the second adhesive layer 20B (see FIGS. 4 and 6).

  Next, the upper surface of the metal base 15 other than the front end portion 15A, the left end portion 15C, the upper surface of the right end portion 15D (see FIG. 5), the upper surface 13V excluding the lower surface 13U of the inward projecting portion 13f of the connector 13, the left side The adhesive 20 is applied to the surface (slope) 13R and the right side (slope) 13L (see FIG. 4) by an automatic applicator to form a third adhesive layer 20C and a fourth adhesive layer 20D, respectively. In this case, the adhesive applied to the upper surface of the metal base 15, that is, the linear second adhesive layer 20B applied to the front end 15A, the rear end 15B, the left end 15C, and the right end 15D on three sides. The applied U-shaped fourth adhesive layer 20C in plan view is brought into contact with each other at both ends thereof, and when the two adhesive layers 20B and 20C are combined, a rectangular ring shape in plan view is obtained. Further, both lower ends of the fourth adhesive layer 20D applied to the upper surface 13A excluding the lower surface 13U of the inward protruding portion 13f of the connector 13, the left side surface (slope) 13L, and the right side surface (slope) 13R are also attached to the second adhesive. The material layer 20B and the fourth adhesive material layer 20D come into contact with each other (see FIGS. 4 and 5). When the adhesive 20 is applied to the upper surfaces of the left end portion 15C and the right end portion 15D of the metal base 15, it is applied so as to draw an arc on the inner side while avoiding the screwing stepped convex portion 18 of the cover 11. .

  Subsequently, the metal cover 11 is mounted on the metal base 15 and the connector 13 to which the adhesive 20 is applied by an automatic mounting machine, and the whole is assembled. Then, this assembly is put into a thermostatic chamber for 3 hours, and the second, third, and fourth adhesive layers 20B, 20C, and 20D other than the already cured first adhesive layer 20A are also cured.

  When the adhesive layers 20A, 20B, 20C, and 20D are cured in this way, the connector 13 is bonded and bonded to the metal base 15 that holds the circuit board 14 via the first adhesive layer 20A and the second adhesive layer 20B. In addition, the metal cover 11 is bonded and joined to the metal base 15 via the third adhesive layer 20C, and the connector 13 (inward protruding portion 13f) and the metal cover 11 form the fourth adhesive layer 20D. Thus, the inside of the metal base 15 (the space in which the circuit board 14 is disposed) is completely sealed.

  Next, after introducing compressed air from the mounting hole of the waterproof filter 22 of the metal cover 11, the pressure is confirmed, and after checking whether or not the adhesive is adhered without any gap due to no pressure change, the metal cover 11 is checked. Assembling of the box-type electronic module 10 is completed by fitting the filter 22 into the mounting hole 23 formed in the center of the box-type electronic module 10.

  Thereafter, a program is written in the box-type electronic module 10, and a finished product is obtained through an electrical continuity test.

  Next, the effect by the connector 13 being adhesively bonded to the metal base 15 via the first adhesive layer 20A and the second adhesive layer 20B, which is a characteristic part of the box-type electronic module 10 of the present embodiment. Will be explained.

  That is, in the present embodiment, as shown in FIG. 6A, the adhesive 20 is filled in the adhesive filling groove 16, and the first adhesive composed of the upper narrow portion 20Aa and the lower wide portion 20Ab. After the material layer 20A is formed and the first adhesive material layer 20A is cured, the adhesive material 20 is applied onto the adherend portion 15f of the metal base 15 located substantially directly above the first adhesive material layer 20A. Then, the second adhesive layer 20B is formed, and then the connector 13 is placed on the second adhesive layer 20B to cure the second adhesive layer 20B, thereby bonding the metal base 15 and the connector 13 together. It is made to join.

  Here, the first adhesive layer 20A cured within the adhesive filling groove 16 and adhered to the inner wall surface of the groove 16 has the lower wide portion 20Ab made of metal even when a large tensile load is applied upward. Since it is locked to the adherend 15 f of the base 15, it does not come out of the adhesive filling groove 16. On the other hand, the lower surface portion 20Bb of the second adhesive material layer 20B is bonded to the bonded portion 15f of the metal base 15, and a part (center portion) of the lower width portion 20Aa of the first adhesive material layer 20A. Bonded to the upper end. In this case, the adhesion between the lower surface portion 20Bb of the second adhesive material layer 20B and the upper narrow portion 20Aa of the first adhesive material layer 20A is an adhesion between the same kind of adhesive materials, and therefore, the adhesive strength is the second adhesion. This is much larger than when the entire lower surface 20Bb of the material layer 20B is bonded to the bonded portion 15f of the metal base 15 (conventional product).

  That is, a rivet effect by the adhesive filling groove 16 is obtained at the adhesive joint portion by the first and second adhesive layers 20A, 20B, and the first and second adhesive layers 20A, 20A, 20B does not break.

  In addition, since the uncured adhesive (second adhesive layer 20B) is applied on the first adhesive layer 20A after first curing the first adhesive layer 20A, the upper narrow portion 20Aa is applied. In the vicinity of the upper end portion (boundary with the lower surface portion Bb), diffusion / penetration of the polymer constituting the second adhesive layer 20B occurs, and the interaction between the diffusion / penetration causes the first adhesive layer 20A and the second adhesive layer 20B. A so-called “crosslinking” is formed between the adhesive layer 20B and the bonding strength and peel strength thereof are further increased.

  For this reason, even if rainwater is applied to the adhesive joint portion, or the connector 13 is subjected to a twisting force when attaching the mating connector or a load due to the weight or vibration of the harness, it can withstand the adhesive strength of the adhesive 20.

  Therefore, in the box-shaped electronic module 10 of this embodiment, high waterproof sealing performance and durability can be obtained, and therefore, intrusion of rainwater and the like can be surely prevented, and high reliability can be obtained.

  In general, the larger the volume of the adhesive layer, the longer it takes to cure and the manufacturing cost increases. On the other hand, as described above, in the present embodiment, the adhesive strength and the waterproof seal effect can be considerably increased, and thus the volume of the adhesive layer can be reduced accordingly. Therefore, the time required for curing can be shortened, and advantages can be obtained in terms of production efficiency and cost.

  Further, since the metal base 15 filled with the adhesive 20 in the groove 16 is put in a constant temperature and humidity chamber alone before the entire assembly, the adhesive 20 is cured. 20 (first adhesive layer 20A) is likely to be exposed to high temperature and high humidity. Therefore, the first adhesive layer 20A can be cured in a short time after assembly, compared to the case where the first adhesive layer 20A is cured together with the other adhesive layers 20B, 20C, and 20D, thereby improving productivity. it can.

  In the above-described embodiment, the adhesive filling groove 16 provided in the front end portion 15A of the metal base 15 has a convex cross-sectional shape. As shown, for example, an L-shape (16B) as shown in FIG. 6 (B), an inverted T-shape (16C) as shown in (C), and a reverse funnel as shown in (D) A cross-sectional shape similar to them, such as a shape (16D).

10 Box-type electronic module
11 Metal cover
13 Connector
13A housing
13B metal terminal
14 Circuit board
15 Metal base
16 Adhesive filling groove
19 Tightening screw
20 Moisture-curing adhesive
20A First adhesive layer 20B Second adhesive layer 20C Third adhesive layer 20D Fourth adhesive layer 21 Electronic component

Claims (8)

  A box-shaped electronic module having a first component member and a second component member that are bonded and bonded with an adhesive material that also serves as a sealing material, wherein the first component member has a narrow opening and a wide filling continuous therewith. An adhesive filling groove having a cross-sectional convex shape, an inverted T-shape, an L-shape, a reverse funnel shape, or a cross-sectional shape similar to them is provided, and the first portion is provided in the adhesive filling groove. An adhesive layer is formed, a second adhesive layer is formed on the adherend portion of the first constituent member located substantially directly above the first adhesive layer, and the first constituent member has the first adhesive member on the first constituent member. 2. A box-shaped electronic module, wherein two constituent members are bonded and bonded via the first adhesive layer and the second adhesive layer.   The box-shaped electronic module according to claim 1, wherein the first component member is a metal base, and the second component member is a connector. A circuit board on which electronic components are mounted; a connector for electrically connecting the circuit board and the outside; a metal base on which the circuit board is mounted and the connector is bonded via an adhesive; A box-shaped electronic module comprising: a sealing cover joined to the metal base and the connector via an adhesive so as to cover part or all of the circuit board, the connector, and the metal base; ,
Adhesive filling groove having a cross-sectional convex shape, an inverted T-shape, an L-shape, a reverse funnel shape, or a cross-sectional shape similar to the narrow-width opening portion and a wide-width filling portion connected to the metal base. Is provided, and a first adhesive layer is formed in the adhesive filling groove, and a second adhesive layer is formed on the adherend portion of the metal base that is positioned substantially immediately above the first adhesive layer. A box-type electronic module, wherein the connector is adhesively bonded to the metal base via the first adhesive layer and the second adhesive layer.   The box-type electronic module according to claim 1, wherein a condensation type silicone adhesive is used as the adhesive.   The box-type electronic module according to any one of claims 2 to 4, wherein the metal base is made of aluminum die casting.   The box-type electronic module according to any one of claims 2 to 5, wherein the housing of the connector is made of a thermoplastic resin such as polybutylene terephthalate or nylon.   The box-type electronic module according to claim 3, wherein the cover is a press-formed product made of a steel plate.   A method of manufacturing a box-shaped electronic module having a first component member and a second component member that are bonded and bonded with an adhesive material that also serves as a sealing material, wherein the first component member includes a narrow opening and a An adhesive filling groove having a cross-sectional convex shape, a reverse T-shape, an L-shape, a reverse funnel shape, or a similar cross-sectional shape composed of continuous wide filling portions is provided, and the adhesive is filled in the adhesive filling groove. The material is filled to form a first adhesive layer and cured, and then the adhesive is applied on the adherend portion of the first component member located substantially directly above the first adhesive layer. The second adhesive layer is applied to form the second adhesive material layer, and the second constituent material layer is placed on the second adhesive material layer to cure the second adhesive material layer. A method of manufacturing a box-shaped electronic module, characterized in that the structural member is adhesively bonded.

Images