JP2010253496A - Soldering apparatus and soldering method - Google Patents

Abstract

There is provided a soldering apparatus that can obtain a stable solder state by avoiding scorching of a printed circuit board, an electronic component, and the like, and has high safety.
A soldering apparatus includes: (a) a cone nozzle 150 having an opening 152 formed at a tip and a weight-like space that narrows toward the opening 152 formed therein; and (b). An optical system (such as a collimator lens 121, a mirror 122, and a condensing lens 123) for condensing the laser beam 113 in a spindle-shaped space; and (c) a solder supply means (thread solder supply) for supplying the thread solder 111 to the spindle-shaped space. Device 160, pipe 130, etc.) and (d) obtained by melting the lower tip portion of the thread solder 111 supplied to the weight space with the convergent light 115 obtained by condensing the laser beam 113. The molten ball 112 is supplied from the opening 152.
[Selection] Figure 1

Description

  The present invention relates to a soldering apparatus that applies a melted solder using a laser beam to a portion to be soldered.

Conventionally, various techniques have been proposed for soldering apparatuses (see, for example, Patent Document 1).
For example, as shown in FIG. 7, the soldering apparatus 10 heats the soldering target portion 55 with the laser beam 13 and brings the thread solder 11 into contact with the soldering target portion 55 heated with the laser beam 13. This is an apparatus for soldering a soldering target portion 55. Here, FIG. 7 is displayed in a state where the soldering apparatus 10 is cut along the optical axis of the convergent light 15 with the XY plane as a cut surface in order to make the internal structure of the soldering apparatus 10 easier to see. is doing.

  Specifically, in the soldering apparatus 10, a through hole is formed in the upper center of the lens barrel 20. An optical fiber 21 is inserted into a through hole formed in the upper center of the lens barrel. Laser light 13 is emitted from the optical fiber 21 inserted into the through hole. The laser beam 13 emitted from the optical fiber 21 irradiates the soldering target portion 55 through the collimator lens 22 and the condenser lens 23. The soldering target portion 55 is heated by the convergent light 15 that irradiates the soldering target portion 55. At this time, the position of the soldering apparatus 10 is adjusted so that the focal point of the condenser lens 23 is positioned on the soldering target portion 55.

  In the soldering apparatus 10, a through hole is formed along the optical axis at the center of the condenser lens 23. A pipe 30 is inserted into a through hole formed at the center of the condenser lens 23. The thread solder 11 is supplied to the soldering target portion 55 from the outside of the lens barrel 20 through the pipe 30 inserted into the through hole. The lower tip portion of the thread solder 11 supplied from the pipe 30 comes into contact with the soldering target portion 55 heated by the laser beam 13. Due to the heat of the soldering target portion 55 heated by the laser beam 13, the lower tip portion of the thread solder 11 in contact with the soldering target portion 55 is melted. As a result, the soldering target portion 55 is soldered.

JP 2007-98452 A

  However, in the conventional soldering apparatus 10, the irradiation target of the laser beam 13 is the soldering target portion 55. For this reason, a part of the convergent light 15 is reflected by the soldering target portion 55 or reflected by the solder 12 being melted by the soldering target portion 55. As a result, the printed circuit board 51 may be burned or the electronic component 53 may be burned around the soldering target portion 55 by the reflected light 16 that is a part of the reflected convergent light 15.

  For example, when the irradiation of the laser beam 13 is started, the soldering target portion 55 is also cooled. For this reason, the melting condition of the thread solder 11 is poor, and the soldering target portion 55 is difficult to get wet. At this time, even if the lower tip portion of the thread solder 11 is brought into contact with the soldering target portion 55, the soldering target portion 55 is not sufficiently heated, so that the lower tip portion of the thread solder 11 becomes hemispherical. Part of the convergent light 15 is reflected at the lower tip of the hemispherical thread solder 11. The printed circuit board 51 and the electronic component 53 are burned by the reflected light 16 that is a part of the reflected convergent light 15.

  However, it is possible to avoid scorching the printed circuit board 51 and the electronic component 53 depending on the selection of the soldering object and the soldering conditions. However, it takes time to select an object to be soldered and to determine the soldering conditions.

  Even if the thread solder 11 is supplied from the center of the condenser lens 23, the thread solder 11 is tilted or shaken by the residual stress of the thread solder 11, and the optical axis of the condenser lens 23 is changed. In some cases, the thread solder 11 cannot be supplied stably. In this case, if the lower tip portion of the thread solder 11 is displaced from the heating position of the soldering target portion 55, sufficient heating cannot be obtained, and the melting state of the thread solder 11 is poor. If the soldering condition of the thread solder 11 is poor, the heating temperature for the lower end portion of the thread solder 11 varies during preheating or continuous heating, and the solder state is not stable.

Further, since the laser beam 13 is emitted from the lens barrel 20 to the outside, a cover and various interlocks are required for safety.
Therefore, in view of the above problems, the present invention has an object to provide a soldering apparatus that can obtain a stable solder state by avoiding scorching of a printed circuit board or an electronic component, and having high safety. To do.

In order to achieve the above object, a soldering apparatus according to the present invention has the following features.
(CL1) A soldering apparatus according to the present invention is (a) a soldering apparatus that melts solder with laser light and solders a portion to be soldered, and (b) an opening is formed at the tip. A nozzle in which a conical space constricted toward the opening is formed; (c) an optical system for condensing the laser light in the conical space; and (d) the solder in the conical space. And (e) a molten portion obtained by melting a part of the solder supplied to the weight space with convergent light obtained by condensing the laser beam. , Supplied from the opening.

  (CL2) The soldering apparatus according to (CL1) includes (a) a gas supply unit that supplies gas to the conical space, and (b) the molten portion is ejected from the opening. The gas is extruded from the opening to the outside of the nozzle.

  (CL3) The soldering apparatus according to the above (CL1) includes: (a) an infrared sensor that measures infrared rays radiated from the melted portion; and (b) that the melted portion disappears from the tip of the nozzle. Laser light supply means for stopping the supply of the laser light when detected by an infrared sensor.

(CL4) In the soldering apparatus described in (CL1) above, the inner surface of the nozzle facing the conical space reflects light.
In addition, this invention may be implement | achieved as the soldering method shown below other than a soldering apparatus.

  (CL5) A soldering method according to the present invention is (a) a soldering method in which solder is melted with laser light to solder a portion to be soldered, and (b) an opening formed at the tip of a nozzle A first step of supplying the laser light to a conical space formed inside the nozzle so as to constrict toward the concentric surface, and condensing the laser light in the conical space; and (c) the conical space. A second step of melting a part of the solder supplied to the spindle-shaped space by convergent light obtained by supplying the solder to the laser beam and condensing the laser beam in the spindle-shaped space; and d) applying a molten portion obtained by melting a part of the solder to the soldering target portion, and soldering the soldering target portion.

  (CL6) In the soldering method according to (CL5), the infrared rays emitted from the melted portion are measured by an infrared sensor, and the melted portion is measured from the tip of the nozzle based on the result measured by the infrared sensor. When it is determined that the laser beam has been eliminated, a fourth step of stopping the supply of the laser beam is included.

  (CL7) In the soldering method according to (CL5), in the third step, a gas is supplied to the weight space, and the gas blown out from the opening is used to discharge the nozzle from the opening. The molten part is pushed out to the outside.

  (CL8) In the soldering method described in (CL7), (a) the solder is solder containing solder, and (b) the convergent light is included in the solder containing solder in the second step. The flux is heated and volatilized, and (c) in the third step, the volatilized flux is sprayed onto the soldering target portion by being mixed with the gas ejected from the opening.

  According to the present invention, the laser light is condensed in the space near the opening in the weight space, the light leaking from the opening is blocked by the melted portion, and the laser light is almost contained inside the nozzle. When the melted portion disappears from the tip of the nozzle, the supply of laser light is immediately stopped. Thus, it is possible to avoid the convergent light from leaking outside the nozzle. As a result, the printed circuit board and electronic components are hardly burned by the light leaking outside the nozzle. When using laser light, a cover that is necessary for safety is not required.

  Further, the solder is supplied to the weight space while being regulated by the inner surface of the nozzle facing the weight space. The solder always passes through a place where the laser light is condensed and the light density is increased (a space near the opening in the conical space). For this reason, the variation in the energy of the light irradiating the solder is reduced. As a result, it is possible to avoid the solder heating temperature from varying during preheating or continuous heating. A stable solder state can be obtained.

  For these reasons, it is possible to realize a soldering apparatus that is highly safe and can be used in close proximity to the soldering iron.

It is a figure which shows the structure of the soldering apparatus in embodiment. It is a figure which shows the outline | summary of the laser beam condensed on the inside of the cone nozzle in embodiment. (A)-(C) is a figure which shows the process in which a molten ball is formed in the soldering apparatus in embodiment. (A), (B) is a figure which shows the process of soldering the soldering object part from diagonally upward of a printed circuit board using the soldering apparatus in embodiment. (A), (B) is a figure which shows the process of soldering the soldering object part from the back surface of a printed circuit board using the soldering apparatus in embodiment. It is a figure which shows the mode of the molten ball formed in the soldering apparatus in the modification of embodiment. It is a figure which shows the structure of the conventional soldering apparatus.

(Embodiment)
Embodiments according to the present invention will be described below.
<Overview>
The soldering apparatus according to the present embodiment has the following features (1) to (4).

  (1) A soldering apparatus is (a) a soldering apparatus that melts solder with laser light and solders a part to be soldered, and (b) an opening is formed at the tip. A nozzle in which a conical space narrowing toward the inside is formed; (c) an optical system for condensing laser light in the conical space; and (d) a solder supply means for supplying solder to the conical space. (E) A melted portion obtained by melting a part of the solder supplied to the weight space with the convergent light obtained by condensing the laser light is supplied from the opening.

  (2) The soldering apparatus includes (a) gas supply means for supplying gas to the conical space, and (b) the melted portion is pushed out of the nozzle from the opening by the gas ejected from the opening. It is a thing.

  (3) The soldering apparatus includes: (a) an infrared sensor that measures infrared radiation emitted from the melted part; and (b) an infrared sensor that detects that the melted part has disappeared from the tip of the nozzle. Laser light supply means for stopping supply.

(4) In the soldering apparatus, the inner surface of the nozzle facing the conical space reflects light.
In addition, the soldering method using the soldering apparatus in this Embodiment has the characteristics shown in the following (5) to (8).

  (5) The soldering method is (a) a soldering method in which solder is melted with laser light to solder a portion to be soldered, and (b) is narrowed toward the opening formed at the tip of the nozzle. A first step of supplying laser light to the conical space formed inside the nozzle and condensing the laser light into the conical space; and (c) supplying solder to the conical space, A second step of melting a part of the solder supplied to the pyramidal space with convergent light obtained by condensing the light into the pyramidal space, and (d) melting obtained by melting a part of the solder And applying a portion to the soldering target portion and soldering the soldering target portion.

  (6) The soldering method is to measure the infrared radiation emitted from the melted portion with an infrared sensor, and based on the result measured with the infrared sensor, when it is determined that the melted portion has disappeared from the tip of the nozzle, A fourth step of stopping the supply is included.

(7) In the third step, the soldering method supplies gas to the conical space and pushes the molten portion from the opening to the outside of the nozzle with the gas ejected from the opening.
(8) In the soldering method, (a) the solder is solder containing solder, and (b) in the second step, the flux contained in the solder containing solder is heated and volatilized by convergent light, and (c ) In the third step, the volatilized flux mixed with the gas blown from the opening is sprayed onto the soldering target portion.

Based on the above points, the soldering apparatus according to the present embodiment will be described.
<Configuration>
First, the structure of the soldering apparatus in this Embodiment is demonstrated.

As shown in FIG. 1, the soldering device 110 is a device that melts the yarn solder 111 with a laser beam 113 and applies a molten ball 112 obtained by melting to a soldering target portion (not shown). Here, FIG. 1 is displayed in a state where the soldering device 110 is cut along the optical axis of the convergent light 150 with the XY plane as a cut surface in order to make the internal structure of the soldering device 110 easier to see. is doing. Although a supply device for the laser beam 113 is omitted, a laser device capable of continuously supplying the laser beam is connected to the optical fiber 124. Although the supply device of the gas 116 is omitted, a device capable of supplying an inert gas such as N ₂ or atmospheric gas is connected to the bypass pipe 131.

  The cone nozzle 150 corresponds to the nozzle. The tip of the cone nozzle 150 corresponds to the tip of the nozzle. The collimator lens 121, the mirror 122, the condenser lens 123, and the like correspond to the optical system. The optical fiber 124, the laser beam 113 supply device (not shown), and the like correspond to the laser beam supply means. The thread solder supply device 160, the pipe 130, and the like correspond to the solder supply means. The bypass pipe 131, the pipe 130, the gas supply device (not shown), and the like correspond to the gas supply means. The lower end portion of the thread solder 111 corresponds to a part of the solder. The molten ball 112 corresponds to a molten portion pushed out, that is, a molten portion supplied from an opening.

  Here, as an example, in the soldering apparatus 110, the collimator lens 121 is attached to the right side portion of the housing 120 with the optical axis aligned with the X direction. A mirror 122 is attached to the center of the housing 120 in a state where light incident from the right side of the housing 120 is emitted to the lower side of the housing 120. A condensing lens 123 is attached to the lower part of the housing 120 with the optical axis aligned in the Y direction. When the laser beam 113 emitted from the optical fiber 124 enters the collimator lens 121, the parallel light 114 is emitted from the collimator lens 121. The parallel light 114 emitted from the collimator lens 121 is reflected by the mirror 122. When the parallel light 114 reflected by the mirror 122 enters the condenser lens 123, convergent light 115 is emitted from the condenser lens 123.

  Further, in the soldering apparatus 110, through holes that can be inserted into the pipe 130 and are located on the optical axis are formed in the upper portion of the housing 120, the mirror 122, and the condenser lens 123, respectively. A pipe 130 is inserted into each through hole in a detachable state so as to facilitate maintenance. In particular, the hole formed in the upper part of the housing 120 is sealed with an O-ring 125 in a state where the pipe 130 is inserted. About the through hole formed in the condensing lens 123, only the tip of the pipe 130 is inserted.

  In the soldering apparatus 110, the cone hood 140 is attached to the right side surface of the housing 120 with screws 141. The tip of the optical fiber 124 is inserted at the apex of the cone hood 140. A cone nozzle 150 is attached to the lower surface of the housing 120 with a screw 151 with the pointed end down. An opening 152 having an opening diameter slightly larger than the diameter of the thread solder 111 and positioned on the optical axis is formed at the tip of the cone nozzle 150. A conical space constricted toward the opening 152 is formed inside the cone nozzle 150.

  In the soldering apparatus 110, at least the inner part of the cone nozzle 150 is made of a material that is difficult to form a solder fillet. Thereby, the contact area between the lower tip portion of the thread solder 111 and the inner surface of the cone nozzle 150 can be reduced. Accordingly, the amount of heat transmitted to the cone nozzle 150 can be reduced.

  In the soldering apparatus 110, the inner surface of the cone nozzle 150 is subjected to laser reflection processing. Further, the focal length of the condenser lens 123 is set so that the outer peripheral portion of the convergent light 115 is reflected by the inner surface of the tip of the cone nozzle 150. At this time, as shown in FIG. 2, the convergent light 115 is reflected by the inner surface of the cone nozzle 150, and a beam waist 118 is formed on the optical axis of the condenser lens 123. As a result, the outer peripheral portion of the convergent light 115 is reflected by the inner surface of the cone nozzle 150. Along with this, the energy density of the space near the opening 152 in the weight space increases. The distribution of the energy density shows a gentle and continuous change. As a result, the meltable range of the thread solder 111 is expanded.

Further, as shown in FIG. 1, in the soldering apparatus 110, for example, a gas 116 such as an inert gas such as N ₂ or an atmospheric gas is supplied from the bypass pipe 131 through the pipe 130 to the cone nozzle 150. Supplied inside. As a result, the gas 116 can be ejected from the opening 152. Further, when solder containing solder is used as the thread solder 111, the flux contained in the solder containing solder is heated by the convergent light 115 and volatilizes. However, the volatilized flux mixed with the gas 116 ejected from the opening 152 is sprayed onto the soldering target portion. Along with this, a stable solder state can be obtained. It is possible to avoid flux from adhering to the condenser lens 123.

  In the soldering apparatus 110, the infrared sensor 126 is installed at a position where the infrared light in the space near the opening 152 in the weight space can be measured through the condenser lens 123. As a result, it is possible to measure the radiation energy and surface temperature of the lower tip portion of the thread solder 111 melted in the space near the opening 152 in the weight space.

  Further, in the soldering apparatus 110, the infrared sensor 126 is used during drag soldering by utilizing the fact that the infrared sensor 126 detects a discontinuous signal each time the molten ball 112 disappears from the tip of the cone nozzle 150. The disappearance of the molten ball 112 is detected by the discontinuous signal detected in (1). When the disappearance of the molten ball 112 is detected, the supply device (not shown) of the laser beam 113 immediately stops the supply of the laser beam. As a result, it is possible to avoid leakage of laser light to the outside of the cone nozzle 150. The laser light leaking to the outside of the cone nozzle 150 hardly causes scoring of electronic parts and printed boards.

<Soldering method>
Next, a soldering method using the soldering apparatus 110 will be described.
First, in the soldering apparatus 110, the laser beam 113 is continuously emitted from the optical fiber 124. The laser beam 113 continuously emitted from the optical fiber 124 is condensed in the space near the opening 152 in the weight space via the collimator lens 121, the mirror 122, and the condenser lens 123. At this time, the light density on the optical axis of the condenser lens 123 gradually increases as it approaches the opening 152.

  In the soldering apparatus 110, the thread solder 111 is sent out from the thread solder supply apparatus 160. The thread solder 111 delivered from the thread solder supply device 160 is supplied into the cone nozzle 150 through the pipe 130. At this time, the lower end portion of the thread solder 111 is guided from the center of the condenser lens 123 to the opening 152 along the optical axis of the condenser lens 123 while being regulated by the inner surface of the cone nozzle 150.

  As a result, the lower end portion of the thread solder 111 always passes through a place where the laser beam 113 is condensed and the light density is increased (a space near the opening 152 in the weight space). At this time, the lower end portion of the thread solder 111 supplied along the optical axis of the condensing lens 123 is gradually heated without approaching the opening 152 and is gradually opened. In the space near 152, the lower end portion of the thread solder 111 is melted. For this reason, even if spear-containing solder is used as the thread solder 111, it is possible to prevent the solder balls and flux from scattering. It is possible to avoid contamination of the inside of the cone nozzle 150.

  Further, when the lower end portion of the thread solder 111 is positioned in the space near the opening 152 in the weight space, the lower end portion of the thread solder 111 is melted by the convergent light 115. The opening 152 is closed by the lower end portion of the melted solder solder 111 (hereinafter referred to as a melted portion), and the inside of the cone nozzle 150 is sealed. After melting, the gas 116 is supplied from the bypass pipe 131 through the pipe 130 into the sealed cone nozzle 150. Along with this, the internal pressure of the cone nozzle 150 rises and the melted portion that closes the opening 152 is pushed out of the cone nozzle 150. The melted portion pushed out of the cone nozzle 150 is held at the tip of the cone nozzle 150 while being floated from the opening 152 by the gas 116 ejected from the opening 152. The melted portion extruded to the outside of the cone nozzle 150 is formed into a spherical shape with surface tension, for example, like a sparkler ball, and becomes a molten ball 112. Light leaking from the opening 152 is blocked by the molten ball 112. At this time, a balance is maintained between the surface tension acting on the root of the molten ball 112, the gravity applied to the molten ball 112, and the discharge pressure of the gas 116.

  In the soldering device 110, infrared rays 117 are emitted from the surface of the molten ball 112. Infrared rays 117 radiated from the surface of the molten ball 112 pass through a condenser lens 123 and a mirror 122 individually coated with a film that passes heat rays of 2 μm or more, and are received by an infrared sensor 126. The surface temperature of the molten ball 112 is specified from the infrared light 117 received by the infrared sensor 126. The power of the laser beam 113 emitted from the optical fiber 124 is adjusted according to the surface temperature of the molten ball 112 specified by the infrared sensor 126. As a result, it is possible to actively reduce the variation in the heating temperature by adjusting the feed amount of the thread solder 111 and the output of the laser beam 113.

  When soldering the soldering target portion, the soldering device 110 applies the molten ball 112 to the soldering target portion in a state where the light leaking from the opening 152 is blocked by the molten ball 112.

<Molded ball formation process>
Next, the process of forming molten balls will be described.
Here, it is assumed that the lower end portion of the thread solder 111 is bent by the residual stress of the thread solder 111. In this case, in the soldering apparatus 110, if the lower tip portion of the thread solder 111 is removed from the position where the laser beam is condensed, the lower tip portion of the thread solder 111 does not reach the solder melting point. However, the inside of the cone nozzle 150 is narrowed toward the opening 152. For this reason, as shown in FIG. 3A, when the lower end portion of the thread solder 111 comes into contact with the inner wall of the cone nozzle 150, the thread reaches the space near the opening 152 in the weight space on the inner surface of the cone nozzle 150. The lower end portion of the solder 111 is guided. When the lower tip portion of the thread solder 111 is positioned in the space near the opening 152 in the weight space, the lower tip portion of the thread solder 111 is gradually heated by the convergent light 115 as shown in FIG. A melted portion grows at the lower end portion of the thread solder 111. As shown in FIG. 3C, the gas 116 is supplied to the inside of the cone nozzle 150 in a state where the opening 152 is closed at the melted portion. The melted portion is pushed out from the opening 152 by the gas 116. As a result, the molten ball 112 is supplied from the tip of the cone nozzle 150.

<Usage example>
Next, a usage example of the soldering apparatus 110 will be described.
<First example>
First, as an example, in the soldering apparatus 110, as shown in FIG. 4A, even if the cone nozzle 150 is tilted, the tip of the cone nozzle 150 has a surface tension that acts on the root of the molten ball 112. Molten ball 112 is held. In a state where the molten ball 112 is held at the tip of the cone nozzle 150, the molten ball is formed on the portion of the land 172 of the printed circuit board 171 and the lead 174 of the electronic component 173 (hereinafter referred to as a soldering target portion 175). 112 contacts. Along with this, as shown in FIG. 4B, the soldering target portion 175 is heated by the molten ball 112. The surface tension acting between the molten ball 112 and the soldering target portion 175 increases. The molten ball 112 can be taken from the tip of the cone nozzle 150. A solder fillet 176 is formed on the soldering target portion 175.

  At this time, the soldering apparatus 110 uses the fact that the amount of infrared light received by the infrared sensor 126 changes when the molten ball 112 is removed, so that the molten ball 112 has disappeared from the tip of the cone nozzle 150. It is determined whether or not. When it is determined that the molten ball 112 has run out, the laser beam 113 is immediately stopped from being emitted from the optical fiber 124.

<Second example>
Next, as a second example, in the soldering apparatus 110, as shown in FIG. 5A, with the molten ball 112 formed at the tip of the cone nozzle 150, above the lead terminal 184 of the electronic component. The cone nozzle 150 is disposed at the center. Then, as shown in FIG. 5B, the cone nozzle 150 is lowered until the lead terminal 184 of the electronic component is inserted into the opening 152. A portion of the land 182 of the printed circuit board 181 and the lead terminal 184 of the electronic component (hereinafter referred to as a soldering target portion 185) is heated by the molten ball 112. When the sum of the surface tension acting between the molten ball 112 and the soldering target portion 185 and the gravity applied to the molten ball 112 becomes larger than the surface tension acting between the lower tip portion of the yarn solder 111 and the molten ball 112. The molten ball 112 flows out to the soldering target portion 185, and a solder fillet 186 is formed on the soldering target portion 185.

  At this time, in the soldering device 110, even if the solder containing spear is used as the thread solder 111, the range in which the flux is scattered is limited to the inside of the cone nozzle 150. For this reason, it can avoid that the periphery of the part to be soldered becomes dirty. Further, by making the wettability of the tip portion of the cone nozzle 150 at the solder melting temperature lower than that of the soldering target portion, the molten ball 112 flows more easily into the soldering target portion.

<Summary>
As described above, according to the present embodiment, the laser beam 113 is condensed in the space near the opening 152 in the conical space, the light leaking from the opening 152 is blocked by the molten ball 112, and the cone nozzle 150 The laser beam 113 is almost contained inside. When the molten ball 112 disappears from the tip of the cone nozzle 150, the supply of the laser beam 113 is immediately stopped. From this, it is possible to avoid the convergent light 115 leaking outside the cone nozzle 150. As a result, the printed circuit board and the electronic component are hardly burned by the light leaking outside the cone nozzle 150. When using laser light, a cover that is necessary for safety is not required.

  Further, the lower end portion of the thread solder 111 is supplied to the opening 152 along the optical axis of the condenser lens 123 while the position is regulated by the inner surface of the cone nozzle 150. The lower end portion of the thread solder 111 always passes through a place where the laser beam 113 is condensed and the light density is increased (a space near the opening 152 in the weight space). For this reason, the variation in the energy of light that irradiates the lower tip portion of the thread solder 111 is reduced. As a result, it is possible to avoid variations in the heating temperature of the thread solder 111 during preheating or continuous heating. A stable solder state can be obtained.

For these reasons, it is possible to realize a soldering apparatus 110 that is highly safe and can be used in close proximity to the soldering iron.
<Modification>
(1) As shown in FIG. 1, a gas supply port 155 may be formed in the cone nozzle 150. Accordingly, gas can be supplied instead of the pipe 130 or from other than the pipe 130, and pressure can be applied to the inside of the cone nozzle 150.

  (2) Instead of the condensing lens 123, a condensing lens having a shorter focal length than the condensing lens 123 may be used. In this case, a molten ball is formed above the opening 152. The molten ball formed above the opening 152 is separated from the thread solder 111 by the pressure of the gas supplied into the cone nozzle 150. The opening 152 is closed with the molten ball separated from the thread solder. With the opening 152 closed, gas is supplied and the internal pressure of the cone nozzle 150 rises. The molten ball that closes the opening 152 is blown to the outside of the cone nozzle 150.

  (3) Instead of the condensing lens 123, a condensing lens having a focal length longer than that of the condensing lens 123 may be used. In this case, the lower end portion of the thread solder 111 is melted at the tip of the cone nozzle 150 as shown in FIG. 6 instead of being melted inside the cone nozzle 150. As a result, a molten ball 112 is formed at the tip of the cone nozzle 150.

  (4) A material in which the inner part of the cone nozzle 150 has good laser reflectivity and is difficult to form a solder fillet, such as white ceramic, aluminum or copper coated with DLC (diamond-like carbon). It may be configured by.

  (5) Cream solder may be used instead of the thread solder 111. At this time, by continuously supplying the cream solder, the one that falls into a string and solidifies into a pencil core is melted.

(6) Instead of the thread solder 111, other meltable materials such as plastics may be used.
(7) Instead of the bypass pipe 131, the gas 116 may be supplied from the yarn solder supply device 160 into the cone nozzle 150 through the pipe 130.

  INDUSTRIAL APPLICABILITY The present invention can be used as a soldering apparatus that applies solder melted using laser light to a portion to be soldered.

DESCRIPTION OF SYMBOLS 10 Soldering apparatus 11 Yarn solder 12 Solder under melting 13 Laser light 15 Convergent light 16 Reflected light 20 Lens barrel 21 Optical fiber 22 Collimator lens 23 Condensing lens 30 Pipe 51 Printed circuit board 53 Electronic component 55 Solder target part 110 Soldering Device 111 Thread solder 112 Molten ball 113 Laser beam 114 Parallel beam 115 Converging beam 116 Gas 117 Infrared ray 118 Beam waist 120 Case 121 Collimator lens 122 Mirror 123 Condensing lens 124 Optical fiber 125 O-ring 126 Infrared sensor 130 Pipe 131 Bypass pipe 140 Cone Hood 141 Screw 150 Cone Nozzle 151 Screw 152 Opening 155 Gas Supply Port 160 Yarn Solder Supply Device 171 Printed Circuit Board 172 Land 173 Electronic Component 174 Lead 175 Solder Target Part 176 Department fillet 181 PCB 182 lands 184 leads 185 soldered target portion 186 solder fillet

Claims (8)

A soldering apparatus that melts solder with laser light and solders a portion to be soldered,
An opening is formed at the tip, and a nozzle in which a conical space that narrows toward the opening is formed;
An optical system for condensing the laser light in the conical space;
Solder supply means for supplying the solder to the conical space,
The melted portion obtained by melting a part of the solder supplied to the weight space with the convergent light obtained by condensing the laser light is supplied from the opening. Soldering device. Gas supply means for supplying gas to the conical space,
The soldering apparatus according to claim 1, wherein the melted portion is extruded from the opening to the outside of the nozzle by the gas ejected from the opening. An infrared sensor for measuring infrared radiation emitted from the melted portion;
2. The soldering according to claim 1, further comprising: a laser beam supply unit that stops the supply of the laser beam when the infrared sensor detects that the melted portion has disappeared from the tip of the nozzle. 3. apparatus. The soldering apparatus according to claim 1, wherein an inner surface of the nozzle facing the conical space reflects light. A soldering method in which solder is melted with laser light to solder a portion to be soldered,
A first step of supplying the laser light to a weight-like space formed inside the nozzle so as to squeeze toward an opening formed at the tip of the nozzle and condensing the laser light in the weight-like space. When,
The solder is supplied to the weight space, and a part of the solder supplied to the weight space is melted by convergent light obtained by condensing the laser light in the weight space. Process,
And a third step of applying a melted portion obtained by melting a part of the solder to the soldering target portion and soldering the soldering target portion. Infrared radiation emitted from the melted part is measured by an infrared sensor, and when it is determined that the melted part has disappeared from the tip of the nozzle based on the result of measurement by the infrared sensor, the supply of the laser beam is stopped. The soldering method according to claim 5, further comprising: a fourth step. 6. In the third step, gas is supplied to the conical space, and the molten portion is pushed out from the opening to the outside of the nozzle by the gas ejected from the opening. Soldering method as described in 4. The solder is a solder containing solder,
In the second step, with the convergent light, the flux contained in the solder containing solder is heated and volatilized,
The soldering method according to claim 7, wherein, in the third step, the volatilized flux mixed with the gas blown out from the opening is sprayed onto the soldering target portion.

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