JP2010251358A - Method for forming laminated wiring pattern, and method for manufacturing laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a laminated wiring pattern without causing interlaminar delamination of insulating layers, even forming a thick wiring pattern, when forming a laminated wiring pattern comprising a plurality of wiring patterns respectively laminated via the insulating layer. <P>SOLUTION: As a photosensitive insulating paste for forming an insulating layer, it is configured to use a photosensitive insulating paste in which the content of an optical absorbing agent is adjusted so as to obtain an exposure amount which is more than or equal to an amount required for photocuring the whole area in a thickness direction of a photosensitive insulating paste film 12. A wiring pattern is formed by the optical imprint method or the photolithography method. A through-hole for a via hole is formed by the photolithographic method, before curing the photosensitive insulating paste film, and the exposure amount during processing by the photolithography method is set to an exposure amount, such that the diameter of the through-hole for a via hole to be formed is ≥50% of the diameter of a light-shielding area for forming the through-hole for a via hole of a photomask. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for forming a wiring pattern and a method for manufacturing an electronic component using the wiring pattern, and more specifically, includes a plurality of wiring patterns stacked via an insulating layer inside a stacked body constituting the stacked electronic component. The present invention relates to a method for forming a multilayer wiring pattern and a method for manufacturing a multilayer electronic component using the method.

In recent years, a multilayer chip coil having a multilayer coil formed by interconnecting internal electrodes stacked via an insulating layer has been widely used as a small and high-performance coil component.
One method for manufacturing such a multilayer chip coil is as described below (see Patent Document 1).

According to this method, first, a first photosensitive insulating paste film 52a is formed on a carrier film 51 as shown in FIG.
Then, a photosensitive wiring paste is applied on the photosensitive insulating paste film 52a and dried, and then a first-layer photosensitive wiring paste pattern 53a as shown in FIG. 5B is formed by photolithography. .

  Next, as shown in FIG. 5C, after forming a second-layer photosensitive insulating paste film 52b, via-holes 54 for via holes are formed at predetermined positions by photolithography.

Then, as shown in FIG. 5D, formation of the second layer photosensitive wiring paste pattern 53b, filling of the via hole through hole 54 with conductive paste (via hole conductor) 56, and third layer of photosensitive insulation The paste film 52c, the via hole 54, and the third-layer photosensitive wiring paste pattern 53c are formed.
Then, the uppermost photosensitive insulating paste film 52d is formed so as to cover the third-layer photosensitive wiring paste pattern 53c. Thereby, the laminated body 55 provided with the multilayer paste pattern is formed.

Note that both the photosensitive wiring paste pattern and the via hole through hole in the photosensitive insulating paste film are formed by photolithography after applying and drying the photosensitive wiring paste and the photosensitive insulating paste.
In addition, a photosensitive insulating paste to which a light absorber is added is usually used as the photosensitive insulating paste so that a via hole having a desired diameter can be formed by photolithography.

  Then, the laminated body is cut into a chip size, the carrier film is peeled off, and then fired and external electrodes are formed, whereby a laminated coil type component 57 as shown in FIG. 5E is obtained. The multilayer coil component 57 includes a coil (not shown) in which an internal conductor formed by sintering a photosensitive wiring paste pattern is connected via a via-hole conductor, and both end portions of the coil are provided at both ends. And a pair of external electrodes 58a and 58b that are electrically connected to each other.

  By the way, according to the conventional method, when a wiring pattern is formed by photolithography, in order to obtain a multilayer coil component having high characteristics, if a wiring pattern having a large cross-sectional area is formed, the wiring pattern As a photosensitive insulating paste film formed so as to cover the wiring pattern, it is necessary to form a thick photosensitive insulating paste film in order to fill the steps of the wiring pattern and to ensure insulation characteristics. However, as described above, the photosensitive insulating paste contains a light absorber so that a desired via-hole through hole can be formed. Therefore, even if the amount of light irradiation is increased, the photosensitive insulating paste can be cured to a deep portion. It is difficult to reach a necessary amount of light, and it is not easy to form an insulating layer in which the entire region is sufficiently cured in the thickness direction. That is, when the thickness of the photosensitive insulating paste is increased, when the photosensitive insulating paste is photocured, irradiation light does not easily reach the deep part of the photosensitive insulating paste. Difference in the cured state at the side).

Then, when the insulating layers are laminated and multilayered with the difference in the cured state, at the interface of each insulating layer, the photosensitive surface is not sufficiently cured on the upper surface side of the sufficiently cured photosensitive insulating paste. The insulating paste is repeatedly laminated. Since the thermal shrinkage rate of the photosensitive insulating paste varies depending on its cured state, peeling occurs at the layer interface in a heat load process such as drying or baking. As described above, when peeling occurs between insulating layers after firing, there are problems such as abnormal characteristics of laminated electronic components and a decrease in reliability due to exposure of wiring.
Therefore, when forming a laminated wiring pattern composed of a plurality of wiring patterns laminated via an insulating layer, it is not easy to form a thick wiring pattern by an optical method such as a photolithography method. It is.

JP 2005-109097 A

  The present invention solves the above-described problem, and in forming a laminated wiring pattern composed of a plurality of wiring patterns laminated via an insulating layer, the insulating layer is formed even when a thick wiring pattern is formed. An object of the present invention is to provide a method for forming a multilayer wiring pattern capable of forming a good wiring pattern (laminated wiring pattern) without causing delamination of the layer, and a method for manufacturing a multilayer electronic component using the same.

In order to solve the above problems, the laminated wiring forming method of the present invention comprises:
A method for forming a laminated wiring pattern comprising a plurality of wiring patterns laminated via an insulating layer,
(a) forming a photosensitive conductive paste film;
(b) exposing and developing the photosensitive conductive paste film to form a wiring pattern;
(c) forming a photosensitive insulating paste film containing a light absorber so as to cover the wiring pattern and its surroundings;
(d) forming an insulating layer by exposing and curing the photosensitive insulating paste film;
(e) forming a photosensitive conductive paste film on the insulating layer;
(f) exposing and developing the photosensitive conductive paste film to form a wiring pattern;
(g) forming a photosensitive insulating paste film containing a light absorber so as to cover the wiring pattern and its surroundings;
and (h) forming an insulating layer by exposing and curing the photosensitive insulating paste film, and
As the photosensitive insulating paste, a photosensitive material whose content of the light absorbing agent is adjusted so that an exposure amount more than an amount necessary for photocuring the entire region in the thickness direction of the photosensitive insulating paste film can be obtained. It is characterized by using a conductive insulating paste.

  In the step of forming the wiring patterns (b) and (f), the wiring pattern is formed by an optical imprint method.

  In the step of forming the wiring patterns (b) and (f), the wiring pattern is formed by a photolithography method.

Further, at the stage before exposing and curing the photosensitive insulating paste film of (d) and at the stage before exposing and curing the photosensitive insulating paste film of (h), by a photolithography method, A step of forming a through hole for a via hole in the photosensitive insulating paste film;
Depending on the content of the light absorber in the photosensitive insulating paste film, the exposure amount during processing by the photolithography method in the step of forming the via hole through hole, the diameter of the via hole through hole to be formed, The exposure amount is set to be 50% or more of the diameter of the light shielding region for forming the through hole for the via hole of the photomask used in the photolithography method.

  A step of firing the laminate having the insulating layer and the wiring pattern formed in claim 1 or 2 is provided.

In the wiring forming method of the present invention, as a photosensitive insulating paste for forming an insulating layer that insulates a plurality of wiring patterns between layers, the content of the light absorbing agent can be applied to the entire region in the thickness direction of the photosensitive insulating paste film. Since the photosensitive insulating paste adjusted so as to obtain an exposure amount higher than the amount necessary for curing is used, the wiring pattern is made thicker, and each insulating layer (photosensitive insulating paste) Even when the thickness of the film is increased, each insulating layer (photosensitive insulating paste film) can be sufficiently cured in the entire region in the thickness direction. Therefore, the laminated body in which each insulating layer (photosensitive insulating paste film) in a uniform state sufficiently cured from the front side to the back side is peeled off at the interface of the insulating layer even in a heat load process such as drying and baking. Will not occur.
As a result, in the case of forming a laminated wiring pattern composed of a plurality of wiring patterns laminated via an insulating layer, even when a wiring pattern having a large film thickness is formed, the insulating layer is not delaminated and the efficiency is increased. It is possible to form a well-reliable laminated wiring pattern.

Further, in the step of forming the wiring patterns of (b) and (f) of claim 1, each insulating layer (photosensitive insulating paste film) is formed in the thickness direction by forming the wiring pattern by a photoimprint method. It is possible to achieve a uniform state that is sufficiently cured in the entire region.
As a result, when forming a multilayer wiring pattern composed of a plurality of wiring patterns stacked via an insulating layer, even when a wiring pattern having a large film thickness is formed, the insulating layer is efficiently laminated without causing delamination. A wiring pattern can be formed.

Further, in the step of forming the wiring pattern of (b) and (f) of claim 1, each of the insulating layers (photosensitive insulating paste film) is also formed when the wiring pattern is formed by photolithography. It becomes possible to obtain a uniform state that is sufficiently cured in the entire region in the thickness direction.
As a result, when forming a multilayer wiring pattern composed of a plurality of wiring patterns stacked via an insulating layer, even when a wiring pattern having a large film thickness is formed, the insulating layer is efficiently laminated without causing delamination. A wiring pattern can be formed.

Further, in the stage before exposing and curing the photosensitive insulating paste film of (d) of claim 1 and in the stage before exposing and curing the photosensitive insulating paste film of (h), by photolithography, In addition to providing a step for forming a through hole for a via hole in the photosensitive insulating paste film, exposure during processing by a photolithography method in the step of forming the through hole for the via hole according to the content of the light absorber in the photosensitive insulating paste film The amount is set to an amount such that the diameter of the through hole for the via hole to be formed is 50% or more of the diameter of the light shielding region for forming the through hole for the via hole of the photomask used in the photolithography method. It is possible to form an insulating layer having a through hole for a via hole having a diameter. In addition, about the other area | region of the photosensitive insulating paste film, it can be set as the fully hardened state in the whole area | region of the thickness direction by performing required exposure after formation of the through-hole for via holes.
As a result, even when a wiring pattern having a large film thickness is formed, a laminated body having a plurality of wiring patterns arranged through the insulating layer can be reliably and efficiently produced without causing delamination of the insulating layer. It becomes possible to form.

In the method for manufacturing a laminated electronic component according to the present invention, since the laminate including the insulating layer and the wiring pattern formed in claim 1 or 2 is fired, a plurality of layers laminated via the insulating layer are formed. It is possible to efficiently manufacture a highly reliable multilayer electronic component having a structure in which wiring (conductor) is disposed inside a multilayer body and having no insulation layer delamination.
Therefore, according to the present invention, it is possible to efficiently manufacture a highly reliable and high-quality multilayer coil component having a thick wiring (conductor) having a large cross-sectional area.

(a)-(c) is a figure which shows the formation method of the laminated wiring pattern concerning the Example (Example 1) of this invention. (a)-(c) is a figure which shows the process following the process of Fig.1 (a)-(c) of the formation method of the multilayer wiring pattern concerning Example 1 of this invention. It is a figure which shows typically the structure of the multilayer electronic component (multilayer coil component) manufactured by the method concerning Example 1 of this invention. (a), (b) is a figure which shows the one part process of the formation method of the laminated wiring pattern concerning the other Example of this invention. (a)-(e) is a figure which shows the manufacturing method of the conventional multilayer chip coil.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

  A case where a laminated coil component including a coil formed by connecting a plurality of wirings (coil conductors) laminated via an insulating layer via via-hole conductors in a laminated body will be described as an example.

(1) As a photosensitive insulating paste, a photosensitive glass paste containing a photosensitive material and glass powder as main components is prepared.
Moreover, the photosensitive Ag paste which has a photosensitive material and Ag powder as the main components is prepared as a photosensitive electrode paste.

  (2) Then, as shown in FIG. 1A, a first layer of photosensitive glass paste film 2 is formed on a carrier film (base material) 1 by printing, dried, and then irradiated with UV light. Then, the photosensitive glass paste film 2 is photocured.

(3) A first layer of photosensitive Ag paste film 3 serving as a wiring material is formed on the entire surface of this photosensitive glass paste film 2 by printing, dried, and then released as shown in FIG. Press with the mold 5 for photoimprinting treated with the agent 4.
Here, as the optical imprint mold 5, the light-transmitting material such as quartz has a concavo-convex portion 15 (for example, a step of 40 μm or more) having a desired pattern composed of the concave portion 5 a and the convex portion 5 b. A structure having a light-shielding film (light-shielding film) film 16 such as a Ni film formed at the tip of 5b was used. Moreover, the mold 5 for optical imprinting is immersed in a release agent made of a fluorine-based silane coupling agent for 5 minutes, so that the release agent 4 is attached to the concavo-convex portion 15 including the light shielding film 16. used.

  (4) After pressing the optical imprint mold 5, ultraviolet light (UV light) is applied from the optical imprint mold 5 side while the optical imprint mold 5 is in close contact with the photosensitive Ag paste film 3. Irradiate. As a result, only the portion 3a of the photosensitive Ag paste film 3 that has entered the recess 5a of the optical imprint mold 5 is exposed and photocured. That is, since the light-shielding film 16 is formed on the surface of the convex portion 5b of the optical imprint mold 5 and is shielded from light, the portion 3b below the convex portion 5b of the photosensitive Ag paste film 3 is not exposed. Therefore, it remains without photocuring.

  (5) After the irradiation of the UV light is completed, the optical imprint mold 5 is peeled (released) from the photosensitive Ag paste film 3. Thereby, as shown in FIG.1 (c), the photosensitive glass paste film | membrane (insulating layer) 2 formed on the carrier film (base material) 1 is made into the shape of the recessed part 5a of the mold 5 for optical imprints. Residual film (uncured) of uncured photosensitive Ag paste film that has been thinned by being pressed by the light-cured Ag paste wiring 3a that is molded into a corresponding shape and pressed by the convex portion 5b of the mold 5 for optical imprinting Membrane) 3b remains.

  (6) Then, the whole is exposed to a developing solution to remove the remaining film 3b of the uncured photosensitive Ag paste, and on the photosensitive glass paste film (insulating layer) 2 as shown in FIG. A photocured Ag paste wiring 3a is formed. The film thickness of the Ag paste wiring 3 a is approximately equal to or greater than the thickness corresponding to the step of the concavo-convex portion 15 of the optical imprint mold 5.

(7) Further, as shown in FIG. 2B, a photosensitive glass paste is formed on the entire surface by printing and dried to form a second photosensitive glass paste film 12 to be an insulating layer.
Then, exposure and development are performed by a photolithography method to form the through hole 7 for the via hole (FIG. 2B). The thickness of the photosensitive glass paste film 12 at this time is the sum (50 μm + 20 μm = 70 μm) of the thickness of the Ag paste wiring 3a (for example, 50 μm) and the thickness of the photosensitive glass paste film 12 on the Ag paste wiring 3a (for example, 20 μm). .

  After the exposure and development are performed as described above to form the through-hole 7 for the via hole, the photosensitive glass paste film 12 is further irradiated with light so that the photosensitive glass paste film 12 is spread over the entire region in the thickness direction. Let it harden sufficiently.

  In Example 1, as a photosensitive glass paste for forming an insulating layer, an acrylic photosensitive resin is used as a photosensitive agent, a yellow dye is used as a light absorber, and Si-B-Bi-K-Al is used as a glass component. The photosensitive glass paste which used each type | system | group glass and adjusted the addition amount of the light absorber to 0.10 weight% or less was used.

The addition amount of the light absorber is such that when the thickness of the second photosensitive glass paste film 12 on the Ag paste wiring 3a is about 20 μm and the total film thickness is about 70 μm, the exposure amount is about 2.5 mJ / When exposed under the condition of cm ² , a via hole through hole 7 having a diameter of 50% or more of the photomask design diameter (the diameter of the light shielding region for forming the through hole for the photo mask via hole) is formed. Amount.

  The diameter of the via-hole through-hole 7 is set to be 50% or more of the photomask design diameter when the requirement is satisfied so that the diameter of the via-hole through-hole 7 to be formed can be controlled. This is possible because it is easy to form a through hole for a via hole having a diameter close to a target diameter.

  The amount of exposure varies depending on the target diameter of the through hole 7 for via holes. Further, the addition amount and exposure amount of the light absorber also vary depending on the thickness of the photosensitive glass paste film 12 on the Ag paste wiring 3a and the total film thickness.

As the paste for forming the insulating layer, the photosensitive glass paste is used in Example 1. However, the configuration is not limited to the above-described one, and a photosensitive glass paste having different components and compositions is used. In addition, it is possible to use a paste whose main component is an insulating material other than glass.
Also, the type of light absorber is not limited to the above example, and other light absorbers can be used. In addition, it cannot be overemphasized that the addition amount may change with kinds of light absorber.

(8) On the photosensitive glass paste film 12 formed as described above, a photosensitive Ag paste film is formed on the entire surface by printing, and then dried to form a photosensitive Ag paste film serving as an upper wiring material. . At this time, the via hole through hole 7 is filled with photosensitive Ag paste. The photosensitive Ag paste filled in the via-hole through hole 7 becomes a via-hole conductor through a firing process.
Then, through the same process as that for forming the first-layer Ag paste wiring 3a, as shown in FIG. 2C, an upper-layer Ag paste wiring 13a is formed.

Furthermore, in the case of forming a multilayer wiring pattern, the above-described insulating layer (photosensitive glass paste film) forming process and wiring (Ag paste wiring) forming process thereon are repeated.
Then, after forming the desired number of layers of Ag paste wiring, the uppermost photosensitive glass paste film is formed by printing, dried, and then irradiated with UV light to cure the photosensitive glass paste film. Let

  Then, after dicing and peeling of the carrier film, the chip element is obtained by firing. Then, after the chip element is barrel-polished as necessary, external electrodes are formed.

  As a result, wiring (coil conductor) 33 formed by firing Ag paste wiring (3a, 13a (FIG. 2 (c)), etc.) is disposed on the insulating layer 22 as schematically shown in FIG. The multilayer coil component 10 including the coil 20 connected via the via-hole conductor (not shown) and the external electrodes 40a and 40b that are electrically connected to the coil 20 is obtained.

  According to the method of Example 1, the content of the light absorber was adjusted so as to obtain an exposure amount greater than the amount necessary for photocuring the entire region in the thickness direction of the photosensitive glass paste film. Since the photosensitive glass paste (photosensitive insulating paste) is used, the difference in the cured state between the front side and the deep side (back side) of the photosensitive glass paste film (insulating layer) is alleviated (substantially uniform). become). Therefore, when forming a multilayer wiring pattern composed of a plurality of wiring patterns stacked via an insulating layer, even when a wiring pattern having a large film thickness is formed, the insulating layer is not delaminated efficiently and reliably. It becomes possible to form a highly reliable laminated wiring pattern. That is, according to the method of the first embodiment, it is possible to suppress and prevent peeling between the photosensitive glass paste films (insulating layers) in a heat load process such as drying and baking, and as a result, reliability is improved. Therefore, it is possible to efficiently manufacture a laminated electronic component having high characteristics and good characteristics.

Moreover, the exposure amount at the time of photolithography processing for forming the through hole for the via hole in the photosensitive glass paste film is 50% or more of the photomask design diameter (the diameter of the light shielding region for forming the through hole for the via hole of the photomask). By setting the amount of via-holes having a diameter of 1 to obtain the via-holes having a desired diameter, the change in resolution due to the change in the amount of addition of the light absorber is alleviated, and a via-hole having a desired diameter can be obtained.
Therefore, it is possible to manufacture multilayer electronic components such as multilayer coil components having high characteristics with a high yield while suppressing occurrence of characteristic abnormality and deterioration of reliability.

  In Example 1, the printing method was used as the method for forming the photosensitive glass paste film and the photosensitive Ag paste film, but it is also possible to use a general film forming technique such as spin coating or spray coating. .

  In Example 1 described above, the Ag paste wiring 3a (FIGS. 1 and 2) was formed by the optical imprinting method. In Example 2, the Ag paste wiring 3a (FIG. 4) was formed by the photolithography method.

In the steps other than the step of forming the Ag paste wiring 3a, that is, the step of forming the photosensitive glass paste film, the step of forming the through hole for the via hole in the photosensitive glass paste film, etc. The same multilayer coil component as the multilayer coil component manufactured in Example 1 was manufactured by the same method.
In forming the Ag paste wiring by photolithography in Example 2, the Ag paste wiring was formed by the procedure described below.

  First, as shown in FIG. 4A, a photosensitive Ag paste film 3 to be a wiring material is formed on the entire surface of the photosensitive glass paste film 2 of the carrier film by printing in the same manner as in Example 1 above. , Dried.

  Then, the photosensitive Ag paste film 3 is irradiated with UV light through the photomask 44 and then developed to remove unexposed portions of the photosensitive Ag paste film 3, as shown in FIG. 4B. The Ag paste wiring 3a was formed.

  Thereafter, in the same manner as in Example 1, the formation of a photosensitive glass paste film on the Ag paste wiring, the formation of a through hole for a via hole in the photosensitive glass paste film, and the like were performed. A laminated coil component having the same configuration (configuration as shown in FIG. 3) was prepared. In Example 2, regarding the formation of the Ag paste wiring, the photolithography method was also used for the Ag paste wiring in the second and subsequent layers.

  And also when using photolithography for formation of Ag paste wiring like this Example 2, it was confirmed that the same effect as the case of the said Example 1 is acquired by applying this invention.

  In the first and second embodiments, the case where a multilayer coil component is manufactured as the multilayer electronic component has been described as an example. However, the present invention manufactures another multilayer electronic component such as a multilayer LC filter. It can also be applied to cases.

  In the first embodiment, the optical imprint method is applied to the formation of the Ag paste wiring. In the second embodiment, photolithography is applied. However, in some cases, another optical method is used to form the Ag paste wiring. It is also possible to use.

  In Examples 1 and 2, the photolithography method is used to form the through hole for the via hole in the interlayer insulating film. However, it is formed by the optical imprint method using the mold processed into the shape of the through hole for the via hole. It is also possible.

  The present invention is not limited to the above embodiments in other points, and various applications and modifications can be made within the scope of the invention.

1 Carrier film (base material)
2 First layer photosensitive glass paste film 3 First layer photosensitive Ag paste film 3a First layer Ag paste wiring 3b Residual film (uncured film)
DESCRIPTION OF SYMBOLS 4 Mold release agent 5 Optical imprint mold 5a Concave part 5b Convex part 7 Via hole for via hole 10 Laminated coil component 12 Second layer photosensitive glass paste 13a Second layer Ag paste wiring 15 Concavity and convexity part 16 Film (light shielding film) )
20 Coil 22 Insulating layer 33 Wiring (coil conductor)
40a, 40b External electrode 44 Photomask

Claims (5)

A method for forming a laminated wiring pattern comprising a plurality of wiring patterns laminated via an insulating layer inside a laminate comprising an insulating layer and a wiring pattern,
(a) forming a photosensitive conductive paste film;
(b) exposing and developing the photosensitive conductive paste film to form a wiring pattern;
(c) forming a photosensitive insulating paste film containing a light absorber so as to cover the wiring pattern and its surroundings;
(d) forming an insulating layer by exposing and curing the photosensitive insulating paste film;
(e) forming a photosensitive conductive paste film on the insulating layer;
(f) exposing and developing the photosensitive conductive paste film to form a wiring pattern;
(g) forming a photosensitive insulating paste film containing a light absorber so as to cover the wiring pattern and its surroundings;
and (h) forming an insulating layer by exposing and curing the photosensitive insulating paste film, and
As the photosensitive insulating paste, a photosensitive material whose content of the light absorbing agent is adjusted so that an exposure amount more than an amount necessary for photocuring the entire region in the thickness direction of the photosensitive insulating paste film can be obtained. A method for forming a laminated wiring pattern, comprising using a conductive insulating paste.   2. The method of forming a laminated wiring pattern according to claim 1, wherein in the step of forming the wiring patterns (b) and (f), the wiring pattern is formed by an optical imprint method.   2. The method of forming a laminated wiring pattern according to claim 1, wherein in the step of forming the wiring patterns (b) and (f), the wiring pattern is formed by a photolithography method. In the step (d) before exposing and curing the photosensitive insulating paste film, and in the step (h) before exposing and curing the photosensitive insulating paste film, the photosensitive insulating paste film is formed by photolithography. A process for forming a through hole for a via hole in a conductive insulating paste film,
Depending on the content of the light absorber in the photosensitive insulating paste film, the exposure amount during processing by the photolithography method in the step of forming the via hole through hole, the diameter of the via hole through hole to be formed, The exposure amount is set to be 50% or more of the diameter of the light shielding region for forming the through hole for the via hole of the photomask used in the photolithography method. A method for forming a multilayer wiring pattern.   A method for producing a laminated electronic component, comprising the step of firing the laminated body provided with the insulating layer and the wiring pattern formed in claim 1 or 2.

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