JP2010245310A - Solder jet device - Google Patents

Abstract

Provided is a solder jet device that makes it easy to adjust the height of a jet, constantly improving the quality of solder and reducing the manufacturing cost, and a plurality of jets formed on a wave forming plate. A solder jet device for ejecting molten solder from an outlet and supplying molten solder, wherein the wave forming plate protrudes upward from the planar portion at the flat portion covering the tip of the jet nozzle and the peripheral wall portion of the jet nozzle The protrusion has an inclination angle of 15 ° to 60 ° with respect to the molten solder ejection direction, thereby increasing the pressure of the solder jet at the ejection port and obtaining a stable pressure. The solder jet height can be easily adjusted, and the solder quality can always be maintained at a high quality.
[Selection] Figure 2

Description

  The present invention relates to a solder jet apparatus using a wave forming plate of a jet nozzle that stably supplies molten solder from a jet outlet to a printed wiring board.

  There is a solder jet device that performs soldering by supplying a molten solder ejected from a jet nozzle to a printed wiring board on which surface-mounted components and discrete components (components with lead feet) are mixed. .

  A sectional view of a conventional solder jet apparatus is shown in FIG. As shown in FIG. 4, the primary jet nozzle 700 for supplying the molten solder 400 satisfactorily to the entire solder surface with respect to the printed wiring board 500 on which the electronic components are mounted, and the printed wiring board 500 that has already been supplied with solder are extraneous. Some have a secondary jet nozzle 200 for removing the molten solder 400. The primary jet nozzle 700 and the secondary jet nozzle 200 are immersed in a solder bath 300 in which molten solder is stored. The molten solder 400 is ejected from the primary jet nozzle 700 and the secondary jet nozzle 200 toward the conveyance path of the printed wiring board 500.

  The tip of the primary jet nozzle 700 is provided with a wave forming plate 710 with a plurality of jet openings opened to jet the molten solder 400 in a rough state.

  Next, the wave forming plate will be described. FIG. 5 is a schematic view of a conventional wave forming plate, FIG. 5 (a) is a plan view seen from the printed wiring board side, FIG. 5 (b) is a cross-sectional view taken along line AA of FIG. FIG.5 (c) is the B section enlarged view of FIG.5 (b). As shown in FIG. 5, the wave forming plate 710 includes a plurality of jet outlets 711 and a flat portion 712 that forms the jet outlets 711. These spouts 711 have a round shape with the same diameter, and include, for example, an upstream spout, a middle spout, and a downstream spout with respect to the conveyance direction 510 of the printed wiring board 500. Three rows are provided, and all the jets 711 are formed at different positions with respect to the transport direction 510 of the printed wiring board 500.

  When the molten solder 400 ejected from the spout 711 of the wave forming plate 710 is soldered to the printed wiring board 500, the gap between the wave forming plate 710 and the printed wiring board 500 is filled with the molten solder 400, so that the gas There is no place to remove the red-eye defect and the solder quality is deteriorated.

  Another conventional wave forming plate will be described. 6 is a schematic view of another conventional wave forming plate, FIG. 6 (a) is a plan view seen from the printed wiring board side, and FIG. 6 (b) is a cross-sectional view taken along line AA of FIG. 6 (a). FIG. 6C is an enlarged view of part B of FIG. 6B. As shown in FIG. 6, the wave forming plate 720 has a jet port 721 arranged in the flat portion 722 in the same manner as in FIG. 5. As a difference, as shown in FIG. 6C, the protrusion 723 protrudes at a predetermined height with respect to the plate thickness t2.0 mm of the flat surface 722 (for example, Patent Document 1). And in the plane part 722 and the projection part 723, it exists in the state which the jet nozzle 721 of (phi) 5.0 mm opened. Further, when the protrusion 723 protrudes, there is a space between the adjacent protrusions 723. When the printed wiring board 500 passing immediately above the jet port 721 receives a jet of the molten solder 400, this space becomes a gas escape path, so that it is possible to suppress red-eye defects and the like caused by poor gas escape.

JP 2004-356161 A

  However, in the conventional configuration, when the molten solder 400 is ejected from the ejection port 721 of the wave forming plate 720, the tip of the ejection port 721 is higher than the flat portion 722. It became difficult to adjust the height of the jet, and it took time to adjust the height of the jet, and there was a problem that the solder quality was lowered when soldering was performed due to insufficient adjustment.

  Further, the wave forming plate 720 is manufactured at a very high manufacturing cost, such as by welding the protrusion 723 to the flat surface portion 722 or cutting the protrusion 723 from the single metal lump to the flat surface portion 722. There was also a problem.

  The present invention solves the above-described conventional problems, and an object thereof is to provide a solder jet device that facilitates adjustment of the jet height, constantly improves the solder quality, and reduces the manufacturing cost. And

  In order to solve the above-described conventional problems, a solder jet device according to the present invention is a solder jet device that supplies molten solder by ejecting molten solder from a plurality of ejection ports formed in a wave forming plate. The forming plate includes a flat portion covering the tip of the jet nozzle, and a protruding portion protruding upward from the flat portion at the peripheral wall portion of the jet port, and the protruding portion is 15 ° to the ejection direction of the molten solder. It has an inclination angle of 60 °.

  With this configuration, the pressure of the solder jet at the jet outlet can be increased, a stable pressure can be obtained, and the height adjustment of the solder jet can be facilitated.

  As described above, according to the present invention, the solder jet apparatus that can easily adjust the solder jet height and can always maintain the solder quality at a high quality by the predetermined shape of the protrusion on the peripheral wall of the jet outlet in the wave forming plate. Can be provided.

  Further, by forming the protrusion on the peripheral wall of the jet port by press working, it can be easily formed into a protrusion shape, and the manufacturing cost can be reduced.

Sectional drawing of the solder jet apparatus in Embodiment 1 of this invention Schematic diagram of wave forming plate according to Embodiment 1 of the present invention FIG. 5 is a diagram showing the relationship between the protrusions of the wave forming plate and the solder quality according to Embodiment 1 of the present invention. Sectional view of a conventional solder jet device Overview of conventional wave forming plate Schematic diagram of other conventional wave forming plates

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  First, an outline of the solder jet device will be described. FIG. 1 is a cross-sectional view of a solder jet device according to Embodiment 1 of the present invention.

  As shown in FIG. 1, in the solder jet device 1 according to the first embodiment, the primary jet nozzle 100 and the secondary jet nozzle 200 are arranged in the solder tank 300 in the order of the conveyance direction 510 of the printed wiring board 500. ing. In the solder bath 300, Sn—Ag—Cu-based molten solder 400 is stored up to the vicinity of the tips of the primary jet nozzle 100 and the secondary jet nozzle 200.

  When the solder jet device 1 solders the molten solder 400 to the printed wiring board 200, the primary jet nozzle 100 jets the molten solder 400 in a rough state for the purpose of eliminating unsold solder defects, and the secondary jet nozzle 200 In order to eliminate bridging defects, the molten solder 400 is jetted in a gentle state. The molten solder 400 jetted from the primary jet nozzle 100 and the secondary jet nozzle 200 flows down to the liquid level of the molten solder 400 in the solder bath 300.

  At this time, the tip of the primary jet nozzle 100 is provided with a wave forming plate 110 with a plurality of jet openings opened to jet the molten solder 400 in a rough state.

  Next, the wave forming plate will be described. FIG. 2 is a schematic diagram of the wave forming plate according to the first embodiment of the present invention, FIG. 2 (a) is a plan view seen from the printed wiring board side, and FIG. 2 (b) is A in FIG. 2 (a). 2A is a cross-sectional view, and FIG. 2C is an enlarged view of a portion B in FIG. As shown in FIG. 2, the wave forming plate 110 is connected to the plurality of jet outlets 111, the flat part 112 that forms the jets 111 and covers the tip of the primary jet nozzle 100, and the flat part 112. And a protrusion 113 protruding around the ejection port 111. These spouts 111 have a round shape with the same diameter, and include, for example, an upstream-row spout, an intermediate-row spout, and a downstream-row spout with respect to the transport direction 510 of the printed wiring board 500. Three rows are provided, and all the jets 111 are formed at different positions with respect to the transport direction 510 of the printed wiring board 500.

In particular, as shown in FIG. 2C, the protrusion 113 protrudes 2.6 mm in height with respect to the plate thickness t2.0 mm of the flat surface 112. Further, the protrusion 112 is inclined by 30 ° with respect to the jet direction of the molten solder 400 so that the jet port φ5.0 mm on the printed wiring board 500 side has a jet port φ9.0 mm on the solder bath 300 side. It is at an angle. Since the protrusion 112 has an inclination angle of 30 °, the molten solder 400 pushed up with an area of 64 mm ² having a diameter of 9.0 mm at the ejection port 111 has an area of 20 mm ² having a diameter of 5.0 mm, that is, one third. The pressure increases because it is ejected in the area. Therefore, the height of the jet of the molten solder 400 is stabilized, and the adjustment of the height of the jet when the solder jet device 1 is operated becomes easy.

  Further, when the protrusion 113 protrudes by 2.6 mm, a space is formed between the adjacent protrusions 113. When the printed wiring board 500 passing immediately above the jet port 111 receives a jet of the molten solder 400, this space serves as a gas escape path, so that it is possible to suppress poor soldering caused by bad gas escape, This leads to improved soldering quality.

  Finally, the soldering quality by the protrusion 113 was examined. FIG. 3 is a relationship diagram between the protrusions of the wave forming plate and the solder quality according to the first embodiment of the present invention. FIG. 3A is a relationship between the inclination angle of the protrusions and the solder quality, and FIG. Is the relationship between the height of the protrusion and the solder quality.

In FIG. 3A, the horizontal axis represents the inclination angle with the direction of the solder jet of the protrusion 113, and the vertical axis represents the soldering quality at that time qualitatively. As shown in FIG. 3A, good soldering quality could be obtained when the inclination angle of the protrusion 113 was between 15 ° and 60 °. In particular, the best soldering quality was obtained when the inclination angle of the protrusion 113 was between 30 ° and 45 °. However, when the tilt angle is less than 15 °, the solder bath 300 side of the jet port 111 has an area of 38 mm ² or less of φ7.0 mm, that is, 2 times or less of the area 20 mm ² of φ5.0 mm, and pushes up the molten solder 400. Pressure decreased and solder quality decreased. Further, when the inclination angle exceeded 60 °, the gap between the protrusions 113 was reduced, and there was no gas escape path, so that the solder quality was deteriorated.

In FIG. 3B, the horizontal axis represents the height of the projection 113 from the flat portion 112, and the vertical axis represents the soldering quality at that time qualitatively. As shown in FIG. 3B, good soldering quality could be obtained when the height of the protrusion 113 was 1.0 mm to 3.5 mm. However, when the height is less than 1.0 mm, the solder tank 300 side of the jet port 111 has an area of 38 mm ² or less of φ7.0 mm, that is, less than twice the area of 20 mm ² of φ5.0 mm. The pressure to raise decreased and the solder quality deteriorated. In addition, when the height exceeded 3.5 mm, the pressure for pushing up the molten solder 400 was lowered due to the distance from the flat surface portion 112 to the tip of the ejection port 111, and the solder quality was lowered.

  From these, when the inclination angle of the protrusion 113 is 15 ° to 60 °, good solder quality can be obtained. Furthermore, when the height of the protrusion 113 is also 1.0 mm to 3.5 mm, better solder quality can be obtained.

  Further, since the protrusion 113 has an inclination angle of 15 ° to 60 ° and a height of 1.0 mm to 3.5 mm, the protrusion 113 on the peripheral wall of the jet port is formed by pressing, It can be easily formed into a protruding shape, and the manufacturing cost can be reduced.

  According to such a configuration, the molten solder is pushed up by providing a protrusion having a height of 1.0 mm to 3.5 mm on the peripheral wall of the jet port of the wave forming plate at an inclination angle of 15 ° to 60 °. The pressure is increased to generate a stable jet, the jet height can be easily adjusted, and the solder quality can always be maintained at a high quality.

  The solder jet device according to the present invention is easy to adjust the jet height and can always maintain high quality solder, so that the solder jet device using the jet nozzle for supplying to the printed circuit board can be used. Useful as.

DESCRIPTION OF SYMBOLS 1 Solder jet apparatus 100 Primary jet nozzle 110 Wave-forming board 111 Jet port 112 Plane part 113 Projection part 200 Secondary jet nozzle 300 Solder tank 400 Molten solder 500 Printed wiring board 510 Transport direction

Claims (4)

A solder jet device for supplying molten solder by ejecting molten solder from a plurality of ejection ports formed in a wave forming plate,
The wave forming plate is a flat portion covering the tip of the jet nozzle;
A protrusion protruding upward from the flat surface portion at the peripheral wall portion of the jet outlet,
The solder jet device, wherein the protrusion has an inclination angle of 15 ° to 60 ° with respect to a jet direction of the molten solder. The solder jet apparatus according to claim 1, wherein the protrusion has a height of 1.0 mm to 3.5 mm from the flat portion. The solder jet apparatus according to claim 1, wherein the protrusion is provided on a wave forming plate of a primary jet nozzle. The solder jet apparatus according to claim 1, wherein the protrusion is formed by press working.

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