JP2010138244A - Styrene resin extrusion foam with skin and manufacturing method of the same - Google Patents
Styrene resin extrusion foam with skin and manufacturing method of the same Download PDFInfo
- Publication number
- JP2010138244A JP2010138244A JP2008314322A JP2008314322A JP2010138244A JP 2010138244 A JP2010138244 A JP 2010138244A JP 2008314322 A JP2008314322 A JP 2008314322A JP 2008314322 A JP2008314322 A JP 2008314322A JP 2010138244 A JP2010138244 A JP 2010138244A
- Authority
- JP
- Japan
- Prior art keywords
- foam
- skin
- styrene resin
- styrene
- extruded foam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006260 foam Substances 0.000 title claims abstract description 136
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 229920005989 resin Polymers 0.000 title claims abstract description 97
- 239000011347 resin Substances 0.000 title claims abstract description 97
- 238000001125 extrusion Methods 0.000 title claims abstract description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000465 moulding Methods 0.000 claims abstract description 31
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 18
- 150000002367 halogens Chemical class 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 5
- 239000004088 foaming agent Substances 0.000 claims description 32
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 22
- 238000005187 foaming Methods 0.000 claims description 21
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000001569 carbon dioxide Substances 0.000 claims description 7
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 7
- 229920001890 Novodur Polymers 0.000 claims description 6
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 4
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004604 Blowing Agent Substances 0.000 claims description 2
- 210000000170 cell membrane Anatomy 0.000 claims description 2
- 239000004566 building material Substances 0.000 abstract description 4
- 239000012770 industrial material Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 22
- 229920005990 polystyrene resin Polymers 0.000 description 21
- 238000000034 method Methods 0.000 description 20
- 239000000203 mixture Substances 0.000 description 19
- 238000002156 mixing Methods 0.000 description 15
- 210000004027 cell Anatomy 0.000 description 14
- 239000003063 flame retardant Substances 0.000 description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
- 239000000440 bentonite Substances 0.000 description 11
- 229910000278 bentonite Inorganic materials 0.000 description 11
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 11
- 238000009413 insulation Methods 0.000 description 11
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 10
- -1 diene compounds Chemical class 0.000 description 9
- 238000004898 kneading Methods 0.000 description 8
- 239000000454 talc Substances 0.000 description 8
- 229910052623 talc Inorganic materials 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 7
- 229910021536 Zeolite Inorganic materials 0.000 description 7
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 239000001282 iso-butane Substances 0.000 description 7
- 239000000314 lubricant Substances 0.000 description 7
- 239000002667 nucleating agent Substances 0.000 description 7
- 239000010457 zeolite Substances 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 4
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229960003750 ethyl chloride Drugs 0.000 description 2
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229940050176 methyl chloride Drugs 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- RVHSTXJKKZWWDQ-UHFFFAOYSA-N 1,1,1,2-tetrabromoethane Chemical compound BrCC(Br)(Br)Br RVHSTXJKKZWWDQ-UHFFFAOYSA-N 0.000 description 1
- JVPKLOPETWVKQD-UHFFFAOYSA-N 1,2,2-tribromoethenylbenzene Chemical compound BrC(Br)=C(Br)C1=CC=CC=C1 JVPKLOPETWVKQD-UHFFFAOYSA-N 0.000 description 1
- SVHAMPNLOLKSFU-UHFFFAOYSA-N 1,2,2-trichloroethenylbenzene Chemical compound ClC(Cl)=C(Cl)C1=CC=CC=C1 SVHAMPNLOLKSFU-UHFFFAOYSA-N 0.000 description 1
- JHEUBGXRQQQKCW-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2,3-dibromopropoxy)benzene Chemical compound BrCC(Br)COC1=C(Br)C(Br)=C(Br)C(Br)=C1Br JHEUBGXRQQQKCW-UHFFFAOYSA-N 0.000 description 1
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 1
- ORYGKUIDIMIRNN-UHFFFAOYSA-N 1,2,3,4-tetrabromo-5-(2,3,4,5-tetrabromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC(OC=2C(=C(Br)C(Br)=C(Br)C=2)Br)=C1Br ORYGKUIDIMIRNN-UHFFFAOYSA-N 0.000 description 1
- NBEJKUFPCUUBHV-UHFFFAOYSA-N 1,2-dibromo-3-isocyanatopropane Chemical compound BrCC(Br)CN=C=O NBEJKUFPCUUBHV-UHFFFAOYSA-N 0.000 description 1
- KUJHYJBRSXWIFB-UHFFFAOYSA-N 1,3,5-tribromo-2-[1-(2,4,6-tribromophenoxy)ethoxy]benzene Chemical compound BrC=1C=C(Br)C=C(Br)C=1OC(C)OC1=C(Br)C=C(Br)C=C1Br KUJHYJBRSXWIFB-UHFFFAOYSA-N 0.000 description 1
- NZUPFZNVGSWLQC-UHFFFAOYSA-N 1,3,5-tris(2,3-dibromopropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound BrCC(Br)CN1C(=O)N(CC(Br)CBr)C(=O)N(CC(Br)CBr)C1=O NZUPFZNVGSWLQC-UHFFFAOYSA-N 0.000 description 1
- PWXTUWQHMIFLKL-UHFFFAOYSA-N 1,3-dibromo-5-[2-(3,5-dibromo-4-prop-2-enoxyphenyl)propan-2-yl]-2-prop-2-enoxybenzene Chemical compound C=1C(Br)=C(OCC=C)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC=C)C(Br)=C1 PWXTUWQHMIFLKL-UHFFFAOYSA-N 0.000 description 1
- LXIZRZRTWSDLKK-UHFFFAOYSA-N 1,3-dibromo-5-[2-[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propan-2-yl]-2-(2,3-dibromopropoxy)benzene Chemical compound C=1C(Br)=C(OCC(Br)CBr)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC(Br)CBr)C(Br)=C1 LXIZRZRTWSDLKK-UHFFFAOYSA-N 0.000 description 1
- FOZVXADQAHVUSV-UHFFFAOYSA-N 1-bromo-2-(2-bromoethoxy)ethane Chemical compound BrCCOCCBr FOZVXADQAHVUSV-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- DDBYLRWHHCWVID-UHFFFAOYSA-N 2-ethylbut-1-enylbenzene Chemical compound CCC(CC)=CC1=CC=CC=C1 DDBYLRWHHCWVID-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 1
- QEJPOEGPNIVDMK-UHFFFAOYSA-N 3-bromo-2,2-bis(bromomethyl)propan-1-ol Chemical compound OCC(CBr)(CBr)CBr QEJPOEGPNIVDMK-UHFFFAOYSA-N 0.000 description 1
- CEBRPXLXYCFYGU-UHFFFAOYSA-N 3-methylbut-1-enylbenzene Chemical compound CC(C)C=CC1=CC=CC=C1 CEBRPXLXYCFYGU-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- BWKHOIPCZURDHL-UHFFFAOYSA-N ClC(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)Cl Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)C(Cl)(Cl)Cl BWKHOIPCZURDHL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WLLGXSLBOPFWQV-UHFFFAOYSA-N MGK 264 Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CCCC)C1=O WLLGXSLBOPFWQV-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KFNNIILCVOLYIR-UHFFFAOYSA-N Propyl formate Chemical compound CCCOC=O KFNNIILCVOLYIR-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- NGAZZOYFWWSOGK-UHFFFAOYSA-N ethyl-n-butyl-ketone Natural products CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- QWTDNUCVQCZILF-UHFFFAOYSA-N iso-pentane Natural products CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
Description
本発明は、建材および産業資材用断熱材などに使用される板状のスキン付スチレン系樹脂押出発泡体に関する。さらに詳しくは、環境適合性に優れ、かつ、良好な断熱性、強度物性を有するスキン付スチレン系樹脂押出発泡体に関する。 The present invention relates to a plate-like styrene-based resin extruded foam with a skin used for building materials, heat insulating materials for industrial materials, and the like. More specifically, the present invention relates to a styrene resin extruded foam with skin having excellent environmental compatibility and good heat insulation and strength properties.
従来、スチレン系樹脂押出発泡体は、施工性、断熱特性の好適性から、建屋の断熱材として汎用されて来た。これらスチレン系樹脂押出発泡体を得るには、スチレン系樹脂を押出機にて加熱溶融し、途中、発泡剤を添加、混練して流動ゲルを得、該流動ゲルを発泡に適する温度に冷却した後、ダイを通して低圧領域に圧力開放して発泡させ、同時に、板状に成形して、発泡体を連続的に得る方法が一般的である。 Conventionally, a styrene resin extruded foam has been widely used as a heat insulating material for buildings because of its workability and suitability for heat insulation. In order to obtain these styrene resin extruded foams, the styrene resin was heated and melted with an extruder, and during the course, a foaming agent was added and kneaded to obtain a fluid gel, and the fluid gel was cooled to a temperature suitable for foaming. Thereafter, a method is generally used in which pressure is released through a die to a low-pressure region and foamed, and simultaneously formed into a plate shape to obtain a foam continuously.
スチレン系樹脂発泡体の発泡剤としては、従来、優れた断熱特性を得るために、フロン類や飽和炭化水素類が使用され、また、良好な機械的物性、発泡体寸法安定性および生産性を得るために、スチレン系樹脂に易透過性のガスである塩化メチル、塩化エチルに代表されるハロゲン化炭化水素を併用されていた。 Conventionally, chlorofluorocarbons and saturated hydrocarbons have been used as foaming agents for styrenic resin foams in order to obtain excellent heat insulation properties. In addition, good mechanical properties, foam dimensional stability and productivity have been achieved. In order to obtain the styrene resin, halogenated hydrocarbons represented by methyl chloride and ethyl chloride, which are easily permeable gases, were used in combination.
しかし、近年、オゾン層破壊、地球温暖化、化学物質による大気や水質への影響、等の環境問題がクローズアップされてきている。例えば、フロン類に関しては、オゾン層破壊物質、地球温暖化物質として規制対象物質となり、その使用が困難な状況である。また、塩化メチル、塩化エチルについては、PRTR法における第1種指定物質として届出が義務づけられており、排出量が管理されている状況である。従って、少しでも環境に優しい発泡剤を使用することが望まれている。
However, in recent years, environmental issues such as ozone layer destruction, global warming, and the influence of chemical substances on the atmosphere and water quality have been highlighted. For example, chlorofluorocarbons are regulated substances as ozone-depleting substances and global warming substances, and their use is difficult. In addition, methyl chloride and ethyl chloride are required to be reported as
これらの背景の下、環境適合性の面で非常に有効であり、また、発泡体難燃性の面でも不燃性であることから極めて有効な、水、二酸化炭素のような発泡剤を使いこなす検討がなされてきた。 Under these circumstances, it is very effective in terms of environmental compatibility, and it is also non-flammable in terms of foam flame retardancy. Has been made.
それに併せて、断熱性能および強度物性に優れたスキン付押出発泡体の検討が行われてきた。 At the same time, studies have been made on extruded foams with skins excellent in heat insulation performance and strength properties.
特許文献1には、スキン層密度と発泡体全体密度との関係および総揮発性有機化合物の放散速度を規定した建材用スチレン系樹脂押出発泡板の技術内容が開示されており、スキン層密度と発泡体全体密度との関係において、発泡体全体密度を維持しつつスキン層を高密度化するには限界があることが記載されている。
更なる高密度のスキン層付与に関する技術が要望されていた。
本発明は、前記従来技術に鑑みてなされたものであり、環境適合性のある発泡剤を使用し、スキン層の高密度化により、優れた断熱性能、強度物性を持ち合わせたスキン付スチレン系樹脂押出発泡体を提供することを目的とする。 The present invention has been made in view of the prior art, and uses a styrene-based resin with skin having excellent heat insulating performance and strength properties by using a foaming agent that is compatible with the environment and increasing the density of the skin layer. An object is to provide an extruded foam.
本発明者らは、前記課題解決の為、発泡剤として非ハロゲン発泡剤を使用し、特に成形方法を主に検討してきた。その結果、ダイと密着または接して設置される板状成形する為の押出成形金型の金型形状、金型温度を適正条件に設定することにより、発泡体全体密度に対して極めて高密度のスキン層密度を付与できることを見出し、本発明に至った。 In order to solve the above-mentioned problems, the present inventors have used non-halogen foaming agents as foaming agents, and have mainly studied molding methods. As a result, by setting the mold shape and mold temperature of the extrusion mold for plate-shaped molding placed in close contact with or in contact with the die to an appropriate condition, the density of the foam is extremely high. The present inventors have found that a skin layer density can be imparted and have reached the present invention.
すなわち、本発明は、
[1] スチレン系樹脂を加熱溶融させ、発泡剤を該スチレン系樹脂に添加し、ダイを通して押出発泡し、ダイに接続された押出成形金型を用いて成形して得られるスキン付スチレン系樹脂押出発泡体であって、押出発泡体の表面から厚み方向に2mm以内のスキン層の密度が50〜90kg/m3であり、かつ、押出発泡板全体の密度が上記スキン層の密度よりも5〜30kg/m3低いことを特徴とする、スキン付スチレン系樹脂押出発泡体、
[2] スキン層の密度が55〜90kg/m3であることを特徴とする、[1]記載のスキン付スチレン系樹脂押出発泡体、
[3] 発泡剤として、(A)炭素数が3〜5の飽和炭化水素より選ばれる少なくとも1種、(B)ジメチルエーテル、ジエチルエーテルおよびメチルエチルエーテルよりなる群より選ばれる少なくとも1種のエーテル、および(C)その他の非ハロゲン系発泡剤を用いることを特徴とする、[1]または[2]記載のスキン付スチレン系樹脂押出発泡体、
[4] (C)その他の非ハロゲン系発泡剤が、水または二酸化炭素であることを特徴とする、[3]記載のスキン付スチレン系樹脂押出発泡体。
[5] 発泡体を形成する気泡の平均径が0.1〜0.6mmであることを特徴とする、[1]〜[4]のいずれかに記載のスキン付スチレン系樹脂押出発泡体。
[6] 発泡体を形成する気泡が、気泡径0.25mm以下の気泡および気泡径0.3〜1mmの気泡より構成され、これらの気泡がセル膜を介して海島状に分散し、かつ、気泡径0.25mm以下の気泡が発泡体断面積あたり10〜90%の占有面積比を有することを特徴とする[4]記載のスキン付スチレン系樹脂押出発泡体、
[7] 発泡体の曲げ強度が25〜150N/cm2であり、熱伝導率が0.024〜0.028W/mKであることを特徴とする、[1]〜[6]のいずれかに記載のスキン付スチレン系樹脂押出発泡体、および
[8] スチレン系樹脂を加熱溶融させ、発泡剤を該スチレン系樹脂に添加し、ダイを通して押出発泡し、ダイに接続された押出成形金型を用いて成形して得られるスキン付スチレン系樹脂押出発泡体の製造方法であって、
押出成形金型の金型温度T(℃)が、スチレン系樹脂のビカット軟化温度t(℃)に対して、(t−70)≦T≦(t+10)の関係を満たすことを特徴とする、スキン付スチレン系樹脂押出発泡体の製造方法
に関する。
That is, the present invention
[1] A styrene-based resin with skin obtained by heating and melting a styrene-based resin, adding a foaming agent to the styrene-based resin, extrusion foaming through a die, and molding using an extrusion mold connected to the die It is an extruded foam, and the density of the skin layer within 2 mm in the thickness direction from the surface of the extruded foam is 50 to 90 kg / m 3 , and the density of the entire extruded foam plate is 5 than the density of the skin layer. characterized in that 30 kg / m 3 lower, styrene resin extruded foam integral skin,
[2] The styrene-based resin extruded foam with skin according to [1], wherein the density of the skin layer is 55 to 90 kg / m 3 ,
[3] As the blowing agent, (A) at least one selected from saturated hydrocarbons having 3 to 5 carbon atoms, (B) at least one ether selected from the group consisting of dimethyl ether, diethyl ether and methyl ethyl ether, And (C) a styrene-based resin extruded foam with skin according to [1] or [2], wherein other non-halogen-based foaming agent is used,
[4] (C) The styrene resin extruded foam with skin according to [3], wherein the other non-halogen foaming agent is water or carbon dioxide.
[5] The styrene-based resin extruded foam with skin according to any one of [1] to [4], wherein an average diameter of bubbles forming the foam is 0.1 to 0.6 mm.
[6] The bubbles forming the foam are composed of bubbles having a bubble diameter of 0.25 mm or less and bubbles having a bubble diameter of 0.3 to 1 mm, these bubbles are dispersed in a sea-island shape through the cell membrane, and The styrene resin extruded foam with skin according to [4], wherein the bubbles having a bubble diameter of 0.25 mm or less have an occupied area ratio of 10 to 90% per foam cross-sectional area,
[7] The bending strength of the foam is 25 to 150 N / cm 2 , and the thermal conductivity is 0.024 to 0.028 W / mK. Any one of [1] to [6] [8] A styrene resin extruded foam with skin, and [8] a styrene resin is heated and melted, a foaming agent is added to the styrene resin, extrusion foamed through a die, and an extrusion mold connected to the die. A method of manufacturing a styrene resin extruded foam with skin obtained by molding using a skin,
The mold temperature T (° C.) of the extrusion mold satisfies the relationship of (t−70) ≦ T ≦ (t + 10) with respect to the Vicat softening temperature t (° C.) of the styrenic resin. The present invention relates to a method for producing a styrene resin extruded foam with skin.
本発明により、環境適合性に優れた発泡剤を用い、高密度のスキン層を付与することにより、建材および産業資材用途において必要とされる、断熱性、曲げ強度、に優れたスキン付スチレン系樹脂押出発泡体を得ることができる。 By using a foaming agent excellent in environmental compatibility according to the present invention, by providing a high-density skin layer, a styrene system with skin excellent in heat insulation and bending strength required for building materials and industrial materials applications A resin extruded foam can be obtained.
本発明のスキン付スチレン系樹脂押出発泡体において、優れた断熱性能および曲げ強度の品質を付与せしめる為には、押出発泡体の表面から厚み方向に2mm以内のスキン層の密度は、50〜90kg/m3が好ましく、55〜90kg/m3がより好ましい。スキン層密度が50kg/m3より小さいと、優れた断熱性能および曲げ強度を発現しにくい傾向にあり、スキン層密度が90kg/m3より大きいと、軽量性が低下する。 In the styrene resin extruded foam with skin of the present invention, the density of the skin layer within 2 mm in the thickness direction from the surface of the extruded foam is 50 to 90 kg in order to give excellent heat insulation performance and bending strength quality. / M 3 is preferable, and 55 to 90 kg / m 3 is more preferable. When the skin layer density is less than 50 kg / m 3 , excellent heat insulating performance and bending strength tend to be difficult to develop, and when the skin layer density is greater than 90 kg / m 3 , the lightness is reduced.
本発明のスキン付押出発泡体の全体密度は、上記スキン層の密度よりも5〜30kg/m3低いことが好ましく、10〜30kg/m3低いことがより好ましい。発泡体の全体密度とスキン層との密度差が5kg/m3未満となると、スキンが破れやすく、クラックが発生する問題が発生する傾向があり、発泡体の全体密度と表皮層の密度差が30kg/m3を超えると、板状成形が困難となる傾向がある。 The overall density of the extruded foam with skin of the present invention is preferably 5-30 kg / m 3 lower than the density of the skin layer, more preferably 10-30 kg / m 3 lower. If the density difference between the total density and the skin layer of the foam is less than 5 kg / m 3, skin easily broken, there is a tendency that problems of cracks generated is generated, the density difference between the total density and the skin layer of the foam If it exceeds 30 kg / m 3 , plate-shaped molding tends to be difficult.
本発明のスキン付スチレン系樹脂押出発泡体の製造方法としては、スチレン系樹脂に各種添加剤を混合した後、押出機に供給して加熱溶融し、更に押出機内にて、圧入された発泡剤と共に高温高圧下で混合混練を行い、スチレン系樹脂溶融組成物(流動ゲル)とし、該流動ゲルを冷却用押出機により押出発泡に適する樹脂温度まで冷却した後、スリットダイを通して低圧領域に押出発泡して、さらに、ダイに接続された押出成形金型を用いて成形することにより、板状発泡体を得る方法をとる。 As a method for producing a styrene resin extruded foam with skin according to the present invention, various additives are mixed into a styrene resin, and then supplied to an extruder, heated and melted, and further pressed into the extruder. At the same time, the mixture is kneaded under high temperature and high pressure to obtain a styrene resin melt composition (fluid gel). The fluid gel is cooled to a resin temperature suitable for extrusion foaming by a cooling extruder, and then extruded and foamed to a low pressure region through a slit die. In addition, a method of obtaining a plate-like foam by molding using an extrusion mold connected to a die is employed.
本発明のスキン付スチレン系樹脂押出発泡体の成形方法としては、開口部が直線上のスリット形状を有するスリットダイより圧力開放して得られた発泡体を、スリットダイと密着または接して設置した押出成形金型および、該成形金型の下流側に隣接して設置した成形ロールなどを用いて、断面積の大きい板状発泡体を成形する方法が用いられる。 As the molding method of the styrene resin extruded foam with skin of the present invention, the foam obtained by releasing the pressure from the slit die having a linear slit shape was placed in close contact with or in contact with the slit die. A method of molding a plate-like foam having a large cross-sectional area using an extrusion mold and a molding roll installed adjacent to the downstream side of the molding mold is used.
本発明に用いられる押出成形金型としては、平行あるいは入口から出口に向かって緩やかに拡大するよう設置された上下2枚の板状物により構成されるものであり、必要に応じて、上記板状物の両端部に、垂直方向の2枚の板状物が設置してもよい。 The extrusion mold used in the present invention is constituted by two upper and lower plate-like objects installed so as to expand gently in parallel or from the inlet to the outlet, and if necessary, the above plate Two plate-like objects in the vertical direction may be installed at both ends of the object.
本発明に用いられる押出成形金型としては、発泡体の表面性(スキン層の表面性)の悪化を防止する観点から、押出発泡された樹脂溶融組成物が接する壁面(樹脂流動壁面)に厚み20〜3000μmのフッ素樹脂層が付設されたものを使用することが好ましい。 The extrusion mold used in the present invention has a thickness on the wall surface (resin fluid wall surface) in contact with the extruded foamed resin melt composition from the viewpoint of preventing deterioration of the surface property of the foam (surface property of the skin layer). It is preferable to use one provided with a fluororesin layer of 20 to 3000 μm.
本発明における製造方法においては、押出成形金型の金型形状、即ち、押出発泡された後の溶融樹脂組成物が接している領域(以降、「樹脂流動面」と称する場合がある)の長さと形状の調整、および金型温度の調整により、所望する発泡体の断面形状および発泡体品質を得ることができる。 In the production method of the present invention, the mold shape of the extrusion mold, that is, the length of the region (hereinafter, sometimes referred to as “resin fluid surface”) in contact with the molten resin composition after being extruded and foamed. The desired cross-sectional shape and foam quality of the foam can be obtained by adjusting the shape and the mold temperature.
本発明のスキン付発泡体は、押出成形金型の金型温度T(℃)を制御することにより、特に使用するスチレン系樹脂のビガット軟化温度と関連して制御することにより、高密度のスキン層を付与することができる。 The foam with a skin of the present invention has a high-density skin by controlling the mold temperature T (° C.) of the extrusion mold, in particular by controlling in relation to the bigat softening temperature of the styrene resin used. A layer can be applied.
押出成形金型の金型温度T(℃)は、使用するスチレン系樹脂のビカット軟化温度t(℃)に対して、(t−70)≦T≦(t+10)で制御することが好ましく、(t−60)≦T≦(t+10)で制御することがより好ましい。さらに、押出成形金型温度T(℃)がt−70(℃)より低いと、発泡体のスキン層が伸びづらくなり、表面性の悪化を防止することが困難になる傾向にある。押出成形金型温度T(℃)がt+10(℃)より高いと、発泡体のスキン層が軟化、気泡(セル)が破泡し、表面性の悪化を防止することが困難になる傾向にある。 The mold temperature T (° C.) of the extrusion mold is preferably controlled by (t−70) ≦ T ≦ (t + 10) with respect to the Vicat softening temperature t (° C.) of the styrene resin used. It is more preferable to control by t−60) ≦ T ≦ (t + 10). Furthermore, when the extrusion mold temperature T (° C.) is lower than t-70 (° C.), the skin layer of the foam becomes difficult to extend, and it tends to be difficult to prevent deterioration of the surface property. When the extrusion mold temperature T (° C.) is higher than t + 10 (° C.), the foam skin layer is softened, bubbles (cells) are broken, and it is difficult to prevent deterioration of surface properties. .
なお、押出成形金型の金型温度T(℃)とは、樹脂流動面近傍での金型表面温度を、接触型温度計を使用して測定した温度である。すなわち、押出成形金型温度は、図1に示すように、成形金型の下板において、成形金型の最後端から5cm、樹脂流動面の左端部から5cmの位置に、接触型温度計を設置して、測定した値である。 The mold temperature T (° C.) of the extrusion mold is a temperature obtained by measuring the mold surface temperature in the vicinity of the resin flow surface using a contact thermometer. That is, as shown in FIG. 1, the temperature of the extrusion mold is set to 5 cm from the rearmost end of the mold and 5 cm from the left end of the resin flow surface on the lower plate of the mold. It is the value measured after installation.
本発明において使用されるスチレン系樹脂の組成は、特に限定されるものではなく、スチレン単量体のみから得られるスチレンホモポリマー、スチレン単量体とスチレンと共重合可能な単量体あるいはその誘導体から得られるランダム、ブロックあるいはグラフト共重合体、後臭素化ポリスチレン、ゴム強化ポリスチレンなどの変性ポリスチレンなどが挙げられる。これらは単独あるいは2種以上混合して使用することができる。 The composition of the styrenic resin used in the present invention is not particularly limited, and a styrene homopolymer obtained only from a styrene monomer, a monomer copolymerizable with styrene monomer and styrene, or a derivative thereof. And modified polystyrene such as post-brominated polystyrene and rubber-reinforced polystyrene. These can be used alone or in admixture of two or more.
スチレンと共重合可能な単量体としては、メチルスチレン、ジメチルスチレン、エチルスチレン、ジエチルスチレン、イソプロピルスチレン、ブロモスチレン、ジブロモスチレン、トリブロモスチレン、クロロスチレン、ジクロロスチレン、トリクロロスチレンなどのスチレン誘導体、ジビニルベンゼンなどの多官能性ビニル化合物、アクリル酸、メタクリル酸、アクリル酸メチル、メタクリル酸メチル、アクリル酸エチル、メタクリル酸エチル、アクリロニトリルなどの(メタ)アクリル系化合物、ブダジエンなどのジエン系化合物あるいはその誘導体、無水マレイン酸、無水イタコン酸などの不飽和カルボン酸無水物などが挙げられる。これらは、単独で使用してもよいし、2種以上を混合して使用しても良い。 Examples of monomers copolymerizable with styrene include methylstyrene, dimethylstyrene, ethylstyrene, diethylstyrene, isopropylstyrene, bromostyrene, dibromostyrene, tribromostyrene, chlorostyrene, dichlorostyrene, and trichlorostyrene. Polyfunctional vinyl compounds such as divinylbenzene, (meth) acrylic compounds such as acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, acrylonitrile, diene compounds such as budadiene or the like Derivatives, unsaturated carboxylic acid anhydrides such as maleic anhydride, itaconic anhydride and the like. These may be used alone or in combination of two or more.
本発明におけるスチレン系樹脂としては、加工性の面から、スチレンホモポリマーが好ましい。 The styrene resin in the present invention is preferably a styrene homopolymer from the viewpoint of processability.
本発明の発泡剤としては、エーテルおよび、炭素数が3〜5の飽和炭化水素の少なくとも1種からなる発泡剤を使用することが可能である。これらの非ハロゲン発泡剤は、得られる発泡体をより安定的に軽量化でき、断熱性、寸法安定性の発泡体品質をより向上させるのに効果的である。 As the foaming agent of the present invention, it is possible to use a foaming agent composed of at least one of ether and a saturated hydrocarbon having 3 to 5 carbon atoms. These non-halogen foaming agents can reduce the weight of the obtained foam more stably, and are effective in further improving the foam quality of heat insulation and dimensional stability.
本発明におけるエーテルとしては、ジメチルエーテル、ジエチルエーテル、メチルエチルエーテルなどが挙げられ、発泡性、発泡成形性、安定性の点から、ジメチルエーテルが好ましい。 Examples of the ether in the present invention include dimethyl ether, diethyl ether, methyl ethyl ether and the like, and dimethyl ether is preferable from the viewpoint of foamability, foam moldability, and stability.
本発明における炭素数3〜5の飽和炭化水素としては、プロパン、n−ブタン、i−ブタン、n−ペンタン、i−ペンタン、ネオペンタンなどが挙げられる。炭素数3〜5の飽和炭化水素のなかでは、発泡性と発泡体の断熱性能の点からn−ブタン、i−ブタン、n−ブタンとi−ブタンの混合物が好ましく、特に好ましくはn−ブタンとi−ブタンの混合物である。 Examples of the saturated hydrocarbon having 3 to 5 carbon atoms in the present invention include propane, n-butane, i-butane, n-pentane, i-pentane, neopentane and the like. Among the saturated hydrocarbons having 3 to 5 carbon atoms, n-butane, i-butane, and a mixture of n-butane and i-butane are preferable, and n-butane is particularly preferable from the viewpoint of foamability and thermal insulation performance of the foam. And i-butane.
本発明のその他の非ハロゲン発泡剤としては、水および二酸化炭素よりなる群から選ばれる少なくとも1種を使用することが可能である。 As another non-halogen foaming agent of the present invention, at least one selected from the group consisting of water and carbon dioxide can be used.
本発明における使用発泡剤全量としては、発泡倍率の設定値などに応じて適宜かわるものではあるが、発泡体密度20〜85kg/m3の軽量発泡体を得ようとした場合、スチレン系樹脂100重量部に対して0.5〜10重量部が好ましく、1〜9重量部がより好ましい。使用発泡剤全量が0.5重量部未満では、発泡倍率が低く、樹脂発泡体としての軽量、断熱などの特性が発揮されにくい場合があり、一方、10重量部を超えると、発泡体中にボイドなどの不良を生じる傾向がある。 The total amount of foaming agent used in the present invention is appropriately changed according to the setting value of the foaming ratio, etc., but when trying to obtain a lightweight foam having a foam density of 20 to 85 kg / m 3 , the styrenic resin 100 0.5-10 weight part is preferable with respect to weight part, and 1-9 weight part is more preferable. When the total amount of the foaming agent used is less than 0.5 parts by weight, the foaming ratio is low, and the characteristics such as light weight and heat insulation as the resin foam may be difficult to be exhibited. On the other hand, when the amount exceeds 10 parts by weight, There is a tendency to cause defects such as voids.
本発明では、さらに、以下に示すような発泡剤を少量使用することもできる。例えば、ジメチルケトン、メチルエチルケトン、ジエチルケトン、メチルn−プロピルケトン、メチルn−ブチルケトン、メチルi−ブチルケトン、メチルn−アミルケトン、メチルn−ヘキシルケトン、エチルn−プロピルケトン、エチルn−ブチルケトン等のケトン類;メタノール、エタノール、プロピルアルコール、i−プロピルアルコール、ブチルアルコール、i−ブチルアルコール、t−ブチルアルコール等のアルコール類;蟻酸メチルエステル、蟻酸エチルエステル、蟻酸プロピルエステル、蟻酸ブチルエステル、蟻酸アミルエステル、プロピオン酸メチルエステル、プロピオン酸エチルエステル等のカルボン酸エステル類;窒素などの無機発泡剤;アゾ化合物などの化学発泡剤などを用いることができる。 In the present invention, a small amount of a foaming agent as shown below can also be used. For example, ketones such as dimethyl ketone, methyl ethyl ketone, diethyl ketone, methyl n-propyl ketone, methyl n-butyl ketone, methyl i-butyl ketone, methyl n-amyl ketone, methyl n-hexyl ketone, ethyl n-propyl ketone, ethyl n-butyl ketone Alcohols such as methanol, ethanol, propyl alcohol, i-propyl alcohol, butyl alcohol, i-butyl alcohol, t-butyl alcohol; formic acid methyl ester, formic acid ethyl ester, formic acid propyl ester, formic acid butyl ester, formic acid amyl ester Carboxylic acid esters such as methyl propionate and ethyl propionate; inorganic foaming agents such as nitrogen; and chemical foaming agents such as azo compounds.
本発明で得られるスキン付スチレン系樹脂押出発泡体における平均気泡径は、優れた断熱性や適正な強度を保有する観点より、0.1〜0.6mmが好ましく、0.15〜0.5mmがより好ましい。 The average cell diameter in the styrene resin extruded foam with skin obtained in the present invention is preferably 0.1 to 0.6 mm, preferably 0.15 to 0.5 mm, from the viewpoint of possessing excellent heat insulation and appropriate strength. Is more preferable.
本発明においては、非ハロゲン系発泡剤として水を用いることにより、スキン付スチレン系樹脂押出発泡体中に、気泡径が概ね0.25mm以下の比較的気泡径の小さい気泡(以下、小気泡という)と、気泡径が概ね0.3mmから1mm程度の比較的気泡径の大きな気泡(以下、大気泡という)が海島状に混在してなる特徴的な気泡構造を有する発泡体が得られ、得られる発泡体の断熱性能が向上する。 In the present invention, by using water as the non-halogen-based foaming agent, bubbles having a relatively small bubble diameter (hereinafter referred to as small bubbles) having a bubble diameter of approximately 0.25 mm or less are contained in the styrene resin extruded foam with skin. ) And a bubble having a characteristic bubble structure in which bubbles having a relatively large bubble diameter (hereinafter referred to as large bubbles) having a bubble diameter of approximately 0.3 mm to 1 mm are mixed in a sea-island shape. The heat insulation performance of the foam is improved.
気泡径0.25mm以下の小気泡および気泡径0.3〜1mmの大気泡が混在してなる特定の気泡構造の発泡体においては、発泡体断面積あたりに占める小気泡の面積の割合(単位断面積あたりの占有面積率)(以下、小気泡面積率という)は、5〜95%が好ましく、10〜90%がより好ましく、20〜80%がさらに好ましく、25〜70%が特に好ましい。 In a foam having a specific bubble structure in which small bubbles having a bubble diameter of 0.25 mm or less and large bubbles having a bubble diameter of 0.3 to 1 mm are mixed, the ratio of the area of small bubbles to the cross-sectional area of the foam (unit: 5 to 95% is preferable, 10 to 90% is more preferable, 20 to 80% is further preferable, and 25 to 70% is particularly preferable.
本発明においては、水および二酸化炭素の吸着剤または分散剤として、ベントナイトまたはゼオライトを使用することができる。 In the present invention, bentonite or zeolite can be used as an adsorbent or dispersant for water and carbon dioxide.
ベントナイトとしては、例えば、天然ベントナイト、精製ベントナイト、有機化ベントナイト等が挙げられ、ゼオライトとしては、例えば、天然ゼオライト、合成ゼオライト等が挙げられる。 Examples of bentonite include natural bentonite, purified bentonite, and organic bentonite, and examples of zeolite include natural zeolite and synthetic zeolite.
本発明におけるベントナイトまたはゼオライトの使用量は、スチレン系樹脂100重量部に対して、0.1〜20重量部が好ましく、0.15〜10重量部がより好ましい。 The amount of bentonite or zeolite used in the present invention is preferably 0.1 to 20 parts by weight and more preferably 0.15 to 10 parts by weight with respect to 100 parts by weight of the styrene resin.
本発明においては、用途における要求に応えるために、難燃剤を使用することが好ましい。 In the present invention, it is preferable to use a flame retardant in order to meet the demand in the application.
本発明において使用される難燃剤として、ハロゲン系難燃剤から選ばれる少なくとも1種を用いることが更に好ましい。さらに、リン酸エステル系化合物、窒素含有化合物、等を共存させてもよい。 As the flame retardant used in the present invention, it is more preferable to use at least one selected from halogen-based flame retardants. Furthermore, a phosphate ester compound, a nitrogen-containing compound, and the like may coexist.
本発明製において使用されるハロゲン系難燃剤としては、例えば、臭素系難燃剤として、ヘキサブロモシクロドデカン、テトラブロモシクロオクタン、ジブロモネオペンチルグリコール、トリブロモネオペンチルアルコール、トリス(トリブロモネオペンチル)ホスフェート、トリス(2、3−ジブロモプロピル)イソシアヌレート、テトラブロモエタンなどの脂肪族あるいは脂環式炭化水素の臭素化物、ヘキサブロモベンゼン、エチレンビスペンタブロモジフェニル、デカブロモジフェニルエタン、デカブロモジフェニルエーテル、オクタブロモジフェニルエーテル、2,3−ジブロモプロピルペンタブロモフェニルエーテルなどの芳香族化合物の臭素化物、テトラブロモビスフェノールA、テトラブロモビスフェノールAビス(2,3−ジブロモプロピルエーテル)、テトラブロモビスフェノールA(2−ブロモエチルエーテル)、テトラブロモビスフェノールAジグリシジルエーテル、テトラブロモビスフェノールAビス(アリルエーテル)、テトラブロモビスフェノールAジグリシジルエーテルとトリブロモフェノールとの付加物などの臭素化ビスフェノール類およびその誘導体、テトラブロモビスフェノールAポリカーボネートオリゴマー、テトラブロモビスフェノールAジグリシジルエーテルとブロモ化ビスフェノールとの付加物のエポキシオリゴマーなどの臭素化ビスフェノール類誘導体オリゴマー、エチレンビステトラブロモフタルイミド、ビス(2,4,6ートリブロモフェノキシ)エタンなどの臭素系芳香族化合物、臭素化アクリル系樹脂、エチレン−ビスジブロモノルボルナンジカルボキシイミドなどがあげられる。塩素系難燃剤として、塩素化パラフィン、塩素化ナフタレン、パークロロペンタデカンなどの塩素化脂肪族化合物、塩素化芳香族化合物、塩素化脂環式化合物などがあげられる。
これらの中でも、難燃性の点から臭素系難燃剤が好ましく、特にスチレン系樹脂との相溶性などの点から、ヘキサブロモシクロドデカン、テトラブロモシクロオクタン、トリス(2,3−ジブロモプロピル)イソシアヌレート、ジブロモネオペンチルグリコール、テトラブロモビスフェノールAビス(2,3−ジブロモプロピルエーテル)が好ましくい。
Examples of the halogen-based flame retardant used in the present invention include, as brominated flame retardants, hexabromocyclododecane, tetrabromocyclooctane, dibromoneopentyl glycol, tribromoneopentyl alcohol, and tris (tribromoneopentyl). Phosphate, tris (2,3-dibromopropyl) isocyanurate, bromide of aliphatic or alicyclic hydrocarbon such as tetrabromoethane, hexabromobenzene, ethylenebispentabromodiphenyl, decabromodiphenylethane, decabromodiphenyl ether, Brominated aromatic compounds such as octabromodiphenyl ether and 2,3-dibromopropylpentabromophenyl ether, tetrabromobisphenol A, tetrabromobisphenol A bis (2,3- Bromopropyl ether), tetrabromobisphenol A (2-bromoethyl ether), tetrabromobisphenol A diglycidyl ether, tetrabromobisphenol A bis (allyl ether), adduct of tetrabromobisphenol A diglycidyl ether and tribromophenol Brominated bisphenols and derivatives thereof, tetrabromobisphenol A polycarbonate oligomers, brominated bisphenol derivatives oligomers such as epoxy oligomers of adducts of tetrabromobisphenol A diglycidyl ether and brominated bisphenol, ethylenebistetrabromophthalimide, Brominated aromatic compounds such as bis (2,4,6-tribromophenoxy) ethane, brominated acrylic resins, ethylene-bisdi Etc. Romo norbornane dicarboximide and the like. Examples of the chlorinated flame retardant include chlorinated aliphatic compounds such as chlorinated paraffin, chlorinated naphthalene, and perchloropentadecane, chlorinated aromatic compounds, and chlorinated alicyclic compounds.
Among these, brominated flame retardants are preferable from the viewpoint of flame retardancy, and hexabromocyclododecane, tetrabromocyclooctane, tris (2,3-dibromopropyl) isocyanate are particularly preferable from the viewpoint of compatibility with styrene resins. Nurate, dibromoneopentyl glycol, and tetrabromobisphenol A bis (2,3-dibromopropyl ether) are preferred.
本発明における難燃剤の使用量は、スチレン系樹脂100重量部に対して、1.5〜4重量部が好ましく、1.5〜2.5重量部がより好ましい。ハロゲン系難燃剤の使用量が前記未満では、難燃性が得られがたい傾向があり、一方、前記範囲を超えると、発泡体のガラス転移温度が低下し、耐熱性が低下する傾向がある。 The amount of the flame retardant used in the present invention is preferably 1.5 to 4 parts by weight and more preferably 1.5 to 2.5 parts by weight with respect to 100 parts by weight of the styrene resin. If the amount of halogenated flame retardant used is less than the above, flame retardancy tends to be difficult to obtain, whereas if it exceeds the above range, the glass transition temperature of the foam tends to decrease and heat resistance tends to decrease. .
本発明においては、以下のような加工助剤を使用することができる。加工助剤の具体例としては、シリカ、タルク、ケイ酸カルシウム、ワラストナイト、カオリン、クレイ、マイカ、酸化亜鉛、酸化チタン、炭酸カルシウムなどの無機化合物、ステアリン酸ナトリウム、ステアリン酸マグネシウム、ステアリン酸バリウム、流動パラフィン、オレフィン系ワックス、ステアリルアミド系化合物などが挙げられる。 In the present invention, the following processing aids can be used. Specific examples of processing aids include silica, talc, calcium silicate, wollastonite, kaolin, clay, mica, zinc oxide, titanium oxide, calcium carbonate and other inorganic compounds, sodium stearate, magnesium stearate, stearic acid Examples thereof include barium, liquid paraffin, olefin wax, and stearyl amide compound.
本発明の製造方法において使用される安定剤としては、フェノール系抗酸化剤、リン系安定剤、ベンゾトリアゾール類、ヒンダードアミン類などの耐光性安定剤が使用される。 As the stabilizer used in the production method of the present invention, a light-resistant stabilizer such as a phenol-based antioxidant, a phosphorus-based stabilizer, a benzotriazole, or a hindered amine is used.
次に本発明のスキン付スチレン系樹脂押出発泡体を実施例に基づいて、さらに詳細に説明するが、本発明はかかる実施例のみに限定されるものではない。 Next, although the styrene-type resin extrusion foam with a skin of this invention is demonstrated in detail based on an Example, this invention is not limited only to this Example.
スチレン系樹脂のビガット軟化温度、押出成形金型温度、発泡体断面プロファイル、発泡体全体密度、発泡体スキン層密度、平均気泡径、小気泡占有面積比率、発泡体熱伝導率、発泡体曲げ強度、発泡体燃焼性の発泡体物性を、下記の方法にしたがって評価した。 Bigat softening temperature of styrenic resin, extrusion mold temperature, foam cross-sectional profile, foam overall density, foam skin layer density, average cell diameter, small cell occupation area ratio, foam thermal conductivity, foam bending strength The foam physical properties of foam combustibility were evaluated according to the following methods.
(1)スチレン系樹脂のビガット軟化温度(℃)
使用するスチレン系樹脂のビカット軟化温度は、JIS K7206(50N荷重)に準じて測定した。
(1) Bigat softening temperature of styrene resin (℃)
The Vicat softening temperature of the styrene resin used was measured according to JIS K7206 (50 N load).
(2)押出成形金型温度(℃)
押出成形金型温度は、成形金型の下板において、成形金型の最後端から5cm、樹脂流動面の左端部から5cmの位置に、接触型温度計(株式会社佐藤計量器製作所製、デジタル温度計)を設置して、測定した値である。
(2) Extrusion mold temperature (℃)
The extrusion mold temperature is 5 cm from the rear end of the mold and 5 cm from the left end of the resin flow surface on the lower plate of the mold. This is the value measured by installing a thermometer.
(3)発泡体断面プロファイル
得られた発泡体断面の厚み方向寸法および幅方向寸法を、ノギスを用いて測定した。
なお、厚み方向寸法に関しては、幅方向両端部および幅方向中心部の3点での測定値の平均値として求めた。
(3) Foam cross-sectional profile The thickness direction dimension and the width direction dimension of the obtained foam cross section were measured using calipers.
In addition, about the thickness direction dimension, it calculated | required as an average value of the measured value in 3 points | pieces of the width direction both ends and the width direction center part.
(4)発泡体全体密度(kg/m3)
発泡体全体密度は、次の式に基づいて求め、単位をkg/m3に換算して示した。
発泡体密度(g/cm3)=発泡体重量(g)/発泡体体積(cm3)
本測定では、発泡体(厚み:約25〜30mm、幅:約150mm)の幅方向中心部にて、製品厚み×幅100mm×長さ100mmのサンプルを切り出し、密度を測定し、3点での平均値として求めた。
(4) Whole foam density (kg / m 3 )
The overall density of the foam was determined based on the following formula, and the unit was expressed in terms of kg / m 3 .
Foam density (g / cm 3 ) = foam weight (g) / foam volume (cm 3 )
In this measurement, a sample of product thickness × width 100 mm × length 100 mm was cut out at the center in the width direction of the foam (thickness: about 25 to 30 mm, width: about 150 mm), the density was measured, and three points were measured. Obtained as an average value.
(5)発泡体スキン層密度(kg/m3)
発泡体スキン層密度は、次の式に基づいて求め、単位をkg/m3に換算して示した。
発泡体スキン層密度(g/cm3)=スキン層重量(g)/スキン層体積(cm3)
本測定では、発泡体(厚み:約25〜30mm、幅:約150mm)の幅方向中心部にて、スキン層2mm×幅100mm×長さ100mmの上下スキン層サンプルを切り出し、密度を測定、上下あわせて6点での平均値として求めた。
(5) Foam skin layer density (kg / m 3 )
The foam skin layer density was determined based on the following formula, and the unit was expressed in terms of kg / m 3 .
Foam skin layer density (g / cm 3 ) = skin layer weight (g) / skin layer volume (cm 3 )
In this measurement, a skin layer sample of 2 mm in width × 100 mm in width × 100 mm in length was cut out at the center in the width direction of the foam (thickness: about 25-30 mm, width: about 150 mm), and the density was measured. In addition, it was determined as an average value at 6 points.
(6)平均気泡径(mm)
得られた発泡体における、厚み方向・幅方向・押出方向の各方向の気泡径を、ASTM D−3576に準じて測定した。
すなわち、得られた発泡体の幅方向の断面を50〜100倍に拡大投影して、厚み方向での平均気泡径(HD)および幅方向での平均気泡径(TD)を測定する。次に押出方向の断面を拡大投影して、押出方向での平均気泡径(MD)を測定した。
平均気泡径は、各方向での平均気泡径の積の3乗根として、以下の式より算出した。
平均気泡径=(HD×TD×MD)1/3
(6) Average bubble diameter (mm)
The bubble diameter in each direction of the thickness direction, the width direction, and the extrusion direction in the obtained foam was measured according to ASTM D-3576.
That is, the cross-section in the width direction of the obtained foam is enlarged and projected 50 to 100 times, and the average cell diameter (HD) in the thickness direction and the average cell diameter (TD) in the width direction are measured. Next, the cross section in the extrusion direction was enlarged and projected, and the average cell diameter (MD) in the extrusion direction was measured.
The average bubble diameter was calculated from the following equation as the third root of the product of the average bubble diameter in each direction.
Average bubble diameter = (HD x TD x MD) 1/3
(7)小気泡占有面積比率(%)
発泡体を構成する大小の気泡が海島状に分布している場合、気泡径0.25mmより小さい気泡について発泡体の断面積あたりの占有面積比率を小気泡占有面積比率とした。ここで、気泡径0.25mmより小さい気泡とは、円相当直径が0.25mmより小さい気泡とする。
(7) Small bubble occupation area ratio (%)
When the large and small bubbles constituting the foam are distributed in a sea-island shape, the occupied area ratio per cross-sectional area of the foam for the bubbles smaller than the bubble diameter of 0.25 mm was defined as the small bubble occupied area ratio. Here, the bubble having a bubble diameter smaller than 0.25 mm is a bubble having a circle equivalent diameter smaller than 0.25 mm.
(8)発泡体熱伝導率(W/mK)
製造後7日経過したスチレン系樹脂押出発泡体の熱伝導率を、JIS A9511に準じて測定した。
(8) Foam thermal conductivity (W / mK)
The thermal conductivity of the styrene resin extruded foam 7 days after production was measured according to JIS A9511.
(9)発泡体曲げ強度(N/cm2)
製造後7日経過した発泡体について、発泡体曲げ強度を測定した。発泡体製品の任意の位置からサンプルサイズ、厚み25mm×幅75mm×長さ300mmを切り出し、JIS A9511 押出法ポリスチレンフォーム保温板に準じて測定し、n=3の平均値として求めた。
(9) Bending strength of foam (N / cm 2 )
The foam bending strength was measured for the foam after 7 days of manufacture. A sample size, thickness 25 mm × width 75 mm × length 300 mm was cut out from an arbitrary position of the foam product, measured according to a JIS A9511 extrusion method polystyrene foam heat insulating plate, and obtained as an average value of n = 3.
(10)発泡体燃焼性
JIS A9511 押出法ポリスチレンフォーム保温板に準じて測定した。測定は製造後7日経過した発泡体について行った。
3秒以内に炎が消えて、残じんがなく、燃焼限界指示線を超えて燃焼しないことの基準を満たしておれば、○(合格)とし、この基準に達しない場合は、×(不合格)とした。
(10) Foam combustibility Measured according to JIS A9511 extrusion method polystyrene foam heat insulating plate. The measurement was performed on a foam that had passed 7 days after production.
If the flame extinguishes within 3 seconds, there is no residue, and it does not burn beyond the burn-up limit indicator line, it will be ○ (pass), and if this standard is not reached, × (fail) ).
(実施例1)
押出プロセスとして、第1押出機(溶融混練用65mmφ単軸押出機)−第2押出機(冷却混合用90mmφ単軸押出機)−第3押出機(冷却混合用150mmφ単軸押出機)を使用した。
ポリスチレン樹脂として、大日本インキ化学工業(株)製、商品名:HP500M(ビガット軟化温度102℃、MFR=2.8g/10分)を使用し、ポリスチレン樹脂100重量部に対して、水分散剤としてベントナイト1.0重量部、ハロゲン系難燃剤としてヘキサブロモシクロドデカン(以下、「HBCD」と略称する)4.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、水0.8重量部、イソブタン3.0重量部、ジメチルエーテル2.5重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は70℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が40kg/m3、スキン層密度が61kg/m3、平均気泡径0.24mm。大気泡と小気泡が混在した気泡構造を有しており、小気泡占有面積率は35%であった。得られた発泡体の熱伝導率は0.027W/mK、曲げ強度は126N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
Example 1
As the extrusion process, the first extruder (65 mmφ single screw extruder for melt kneading)-the second extruder (90 mmφ single screw extruder for cooling and mixing)-the third extruder (150 mmφ single screw extruder for cooling and mixing) is used. did.
As a polystyrene resin, Dainippon Ink Chemical Co., Ltd. product name: HP500M (Bigat softening temperature 102 ° C., MFR = 2.8 g / 10 min) is used, and as a water dispersant for 100 parts by weight of the polystyrene resin. 1.0 part by weight of bentonite, 4.0 part by weight of hexabromocyclododecane (hereinafter abbreviated as “HBCD”) as a halogen flame retardant, 0.2 part by weight of talc as a nucleating agent, and barium stearate as a lubricant After dry blending 0.25 parts by weight, these resin mixtures were fed to an extruder. The resin mixture supplied to the first extruder is melted and kneaded by heating to about 200 ° C., and 0.8 parts by weight of water, 3.0 parts by weight of isobutane, 2 parts of dimethyl ether are added to 100 parts by weight of polystyrene resin as a foaming agent. .5 parts by weight were pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the extrusion mold used was set to 70 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 40 kg / m 3 , a skin layer density of 61 kg / m 3 , and an average cell diameter of 0.24 mm. It had a bubble structure in which large bubbles and small bubbles were mixed, and the occupied area ratio of small bubbles was 35%. The resulting thermal conductivity of the foam 0.027W / mK, bending strength 126N / cm 2, for flammability met the criteria of JIS A9511.
(実施例2)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、PSジャパン(株)製、商品名:G9401(ビガット軟化温度103℃、MFR=2.2g/10分)を使用し、ポリスチレン樹脂100重量部に対して、水分散剤としてベントナイト1.0重量部、ハロゲン系難燃剤としてHBCD4.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、水0.8重量部、イソブタン3.5重量部、ジメチルエーテル2.0重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は50℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が44kg/m3、スキン層密度が71kg/m3、平均気泡径0.21mm。大気泡と小気泡が混在した気泡構造を有しており、小気泡占有面積率は45%であった。得られた発泡体の熱伝導率は0.026W/mK、曲げ強度は135N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
(Example 2)
The same process as in Example 1 was used for the extrusion process.
As polystyrene resin, PS Japan Co., Ltd. product name: G9401 (Bigat softening temperature 103 ° C., MFR = 2.2 g / 10 min) is used, and bentonite 1.100 parts by weight of polystyrene resin is used as a water dispersant. After dry blending 0 parts by weight, 4.0 parts by weight of HBCD as a halogen flame retardant, 0.2 parts by weight of talc as a nucleating agent, and 0.25 parts by weight of barium stearate as a lubricant, these resin mixtures were extruded. Supplied to the machine. The resin mixture supplied to the first extruder is melted and kneaded by heating to about 200 ° C., and 0.8 parts by weight of water, 3.5 parts by weight of isobutane, 2 parts of dimethyl ether are added to 100 parts by weight of polystyrene resin as a foaming agent. 0.0 part by weight was pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 50 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 44 kg / m 3 , a skin layer density of 71 kg / m 3 , and an average cell diameter of 0.21 mm. It had a bubble structure in which large bubbles and small bubbles were mixed, and the occupied area ratio of small bubbles was 45%. The obtained foam had a thermal conductivity of 0.026 W / mK, a flexural strength of 135 N / cm 2 , and a combustibility that met the standards of JIS A9511.
(実施例3)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、PSジャパン(株)製、商品名:G9401(ビガット軟化温度103℃、MFR=2.2g/10分)を使用し、ポリスチレン樹脂100重量部に対して、水分散剤としてベントナイト1.0重量部、ハロゲン系難燃剤としてHBCD3.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、水1.0重量部、二酸化炭素3.0重量部、イソブタン2.5重量部、ジメチルエーテル1.5重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は80℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が36kg/m3、スキン層密度が56kg/m3、平均気泡径0.26mm。大気泡と小気泡が混在した気泡構造を有しており、小気泡占有面積率は25%であった。得られた発泡体の熱伝導率は0.027W/mK、曲げ強度は114N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
(Example 3)
The same process as in Example 1 was used for the extrusion process.
As polystyrene resin, PS Japan Co., Ltd. product name: G9401 (Bigat softening temperature 103 ° C., MFR = 2.2 g / 10 min) is used, and bentonite 1.100 parts by weight of polystyrene resin is used as a water dispersant. After dry blending 0 parts by weight, 3.0 parts by weight of HBCD as a halogen flame retardant, 0.2 parts by weight of talc as a nucleating agent, and 0.25 parts by weight of barium stearate as a lubricant, these resin mixtures were extruded. Supplied to the machine. The resin mixture supplied to the first extruder is melted and kneaded by heating to about 200 ° C., and 1.0 part by weight of water, 3.0 parts by weight of carbon dioxide, and isobutane with respect to 100 parts by weight of polystyrene resin as a foaming agent. 2.5 parts by weight and 1.5 parts by weight of dimethyl ether were pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 80 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 36 kg / m 3 , a skin layer density of 56 kg / m 3 , and an average cell diameter of 0.26 mm. It had a bubble structure in which large bubbles and small bubbles were mixed, and the occupied area ratio of small bubbles was 25%. The obtained foam had a thermal conductivity of 0.027 W / mK, a flexural strength of 114 N / cm 2 , and a combustibility that satisfied the standards of JIS A9511.
(実施例4)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、PSジャパン(株)製、商品名:679(ビガット軟化温度87℃、MFR=18g/10分)を使用し、ポリスチレン樹脂100重量部に対して、吸着剤としてゼオライト1.0重量部、ハロゲン系難燃剤としてHBCD2.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、二酸化炭素3.0重量部、イソブタン1.0重量部、ジメチルエーテル3.0重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は60℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が52kg/m3、スキン層密度が75kg/m3、平均気泡径0.38mm。得られた発泡体の熱伝導率は0.027W/mK、曲げ強度は142N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
Example 4
The same process as in Example 1 was used for the extrusion process.
PS Japan Co., Ltd., trade name: 679 (Bigat softening temperature 87 ° C., MFR = 18 g / 10 min) is used as the polystyrene resin, and 1.0 weight of zeolite as an adsorbent with respect to 100 parts by weight of the polystyrene resin. Parts, HBCD 2.0 parts by weight as a halogen-based flame retardant, 0.2 parts by weight of talc as a nucleating agent, and 0.25 parts by weight of barium stearate as a lubricant are dry blended, and these resin mixtures are fed to an extruder. Supplied. The resin mixture supplied to the first extruder is melt-kneaded by heating to about 200 ° C., and 3.0 parts by weight of carbon dioxide, 1.0 part by weight of isobutane, dimethyl ether with respect to 100 parts by weight of polystyrene resin as a foaming agent. 3.0 parts by weight were pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 60 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 52 kg / m 3 , a skin layer density of 75 kg / m 3 , and an average cell diameter of 0.38 mm. The obtained foam had a thermal conductivity of 0.027 W / mK, a bending strength of 142 N / cm 2 , and a combustibility that satisfied the standards of JIS A9511.
(実施例5)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、大日本インキ化学工業(株)製、商品名:HP500M(ビガット軟化温度102℃、MFR=2.8g/10分)を使用し、ポリスチレン樹脂100重量部に対して、吸着剤としてゼオライト1.0重量部、ハロゲン系難燃剤としてHBCD2.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、二酸化炭素3.0重量部、イソブタン1.0重量部、ジメチルエーテル3.0重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は60℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が52kg/m3、スキン層密度が75kg/m3、平均気泡径0.38mm。得られた発泡体の熱伝導率は0.027W/mK、曲げ強度は142N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
(Example 5)
The same process as in Example 1 was used for the extrusion process.
As a polystyrene resin, Dainippon Ink Chemical Co., Ltd. product name: HP500M (Bigat softening temperature 102 ° C., MFR = 2.8 g / 10 minutes) is used, and as an adsorbent for 100 parts by weight of the polystyrene resin. After dry blending 1.0 part by weight of zeolite, 2.0 parts by weight of HBCD as a halogen flame retardant, 0.2 part by weight of talc as a nucleating agent, and 0.25 part by weight of barium stearate as a lubricant, these resins are used. The mixture was fed to the extruder. The resin mixture supplied to the first extruder is melt-kneaded by heating to about 200 ° C., and 3.0 parts by weight of carbon dioxide, 1.0 part by weight of isobutane, dimethyl ether with respect to 100 parts by weight of polystyrene resin as a foaming agent. 3.0 parts by weight were pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 60 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained skins with foam, the whole density of 52kg / m 3, a skin layer density 75 kg / m 3, average cell diameter 0.38 mm. The obtained foam had a thermal conductivity of 0.027 W / mK, a bending strength of 142 N / cm 2 , and a combustibility that satisfied the standards of JIS A9511.
(比較例1)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、大日本インキ化学工業(株)製、商品名:HP500M(ビガット軟化温度102℃、MFR=2.8g/10分)を使用し、ポリスチレン樹脂100重量部に対して、水分散剤としてベントナイト1.0重量部、ハロゲン系難燃剤としてHBCD4.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、水0.8重量部、イソブタン3.0重量部、ジメチルエーテル2.5重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は120℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が38kg/m3、スキン層密度が45kg/m3、平均気泡径0.33mm。大気泡と小気泡が混在した気泡構造を有しており、小気泡占有面積率は35%であった。得られた発泡体の熱伝導率は0.029W/mK、曲げ強度は126N/cm2、燃焼性についてはJIS A9511の基準を満たしていた。
(Comparative Example 1)
The same process as in Example 1 was used for the extrusion process.
As a polystyrene resin, Dainippon Ink Chemical Co., Ltd. product name: HP500M (Bigat softening temperature 102 ° C., MFR = 2.8 g / 10 min) is used, and as a water dispersant for 100 parts by weight of the polystyrene resin. After dry blending 1.0 parts by weight of bentonite, 4.0 parts by weight of HBCD as a halogen flame retardant, 0.2 parts by weight of talc as a nucleating agent, and 0.25 parts by weight of barium stearate as a lubricant, these resins are used. The mixture was fed to the extruder. The resin mixture supplied to the first extruder is melted and kneaded by heating to about 200 ° C., and 0.8 parts by weight of water, 3.0 parts by weight of isobutane, 2 parts of dimethyl ether are added to 100 parts by weight of polystyrene resin as a foaming agent. .5 parts by weight were pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 120 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 38 kg / m 3 , a skin layer density of 45 kg / m 3 , and an average cell diameter of 0.33 mm. It had a bubble structure in which large bubbles and small bubbles were mixed, and the occupied area ratio of small bubbles was 35%. The obtained foam had a thermal conductivity of 0.029 W / mK, a flexural strength of 126 N / cm 2 , and a combustibility that satisfied the standards of JIS A9511.
(比較例2)
押出プロセスは、実施例1と同様のプロセスを使用した。
ポリスチレン樹脂として、PSジャパン(株)製、商品名:G9401(ビガット軟化温度103℃、MFR=2.2g/10分)を使用し、ポリスチレン樹脂100重量部に対して、水分散剤としてベントナイト1.0重量部、ハロゲン系難燃剤としてHBCD4.0重量部、造核剤としてタルク0.2重量部、及び、滑剤としてステアリン酸バリウム0.25重量部をドライブレンドした後、これらの樹脂混合物を押出機へ供給した。第1押出機に供給した樹脂混合物を、約200℃に加熱して溶融混練し、発泡剤としてポリスチレン樹脂100重量部に対して、水0.8重量部、イソブタン3.5重量部、ジメチルエーテル2.0重量部を、第1押出機の先端付近で樹脂中に圧入した。その後、第1押出機に連結された第2押出機、第3押出機で混練しながら冷却し、第3押出機の先端に設けたスリットダイより、発泡樹脂温度約110〜140℃にて大気中へ押出発泡させた後、スリットダイに密着させて設置した押出成形金型およびその下流側に設置した成形ロールにより板状成形を行った。
使用した押出成形金型の押出成形金型温度は120℃を設定、厚み25mm×幅200mmである断面形状のスキン付押出発泡板を得た。
得られたスキン付発泡体は、全体密度が42kg/m3、スキン層密度が48kg/m3、平均気泡径0.29mm。大気泡と小気泡が混在した気泡構造を有しており、小気泡占有面積率は45%であった。得られた発泡体の熱伝導率は0.028W/mK、曲げ強度は96N/cm2、燃焼性についてはJIS A 9511の基準を満たしていた。
(Comparative Example 2)
The same process as in Example 1 was used for the extrusion process.
As polystyrene resin, PS Japan Co., Ltd. product name: G9401 (Bigat softening temperature 103 ° C., MFR = 2.2 g / 10 min) is used, and bentonite 1.100 parts by weight of polystyrene resin is used as a water dispersant. After dry blending 0 parts by weight, 4.0 parts by weight of HBCD as a halogen flame retardant, 0.2 parts by weight of talc as a nucleating agent, and 0.25 parts by weight of barium stearate as a lubricant, these resin mixtures were extruded. Supplied to the machine. The resin mixture supplied to the first extruder is melted and kneaded by heating to about 200 ° C., and 0.8 parts by weight of water, 3.5 parts by weight of isobutane, 2 parts of dimethyl ether are added to 100 parts by weight of polystyrene resin as a foaming agent. 0.0 part by weight was pressed into the resin near the tip of the first extruder. Then, it cools, kneading | mixing with the 2nd extruder connected with the 1st extruder, and the 3rd extruder, and it is air | atmosphere at the foaming resin temperature of about 110-140 degreeC from the slit die provided in the front-end | tip of the 3rd extruder. After extrusion foaming inward, plate molding was performed with an extrusion mold placed in close contact with the slit die and a molding roll placed downstream thereof.
The extrusion mold temperature of the used extrusion mold was set to 120 ° C., and an extruded foam board with skin having a cross-sectional shape having a thickness of 25 mm × width of 200 mm was obtained.
The obtained foam with skin has an overall density of 42 kg / m 3 , a skin layer density of 48 kg / m 3 , and an average cell diameter of 0.29 mm. It had a bubble structure in which large bubbles and small bubbles were mixed, and the occupied area ratio of small bubbles was 45%. The obtained foam had a thermal conductivity of 0.028 W / mK, a flexural strength of 96 N / cm 2 , and a combustibility that satisfied the standards of JIS A 9511.
前記実施例1〜5および比較例1〜2で得られた結果をまとめて、表1に示す。 The results obtained in Examples 1-5 and Comparative Examples 1-2 are summarized in Table 1.
1 成形金型の上板
2 成形金型の下板
3 溶融
4 金型温度の接触温度計での測定箇所(成形金型の最後端から5cm、樹脂流動面の左端部から5cmの位置)
DESCRIPTION OF
Claims (8)
押出発泡体の表面から厚み方向に2mm以内のスキン層の密度が50〜90kg/m3であり、かつ、押出発泡体全体の密度が上記スキン層の密度よりも5〜30kg/m3低いことを特徴とするスキン付スチレン系樹脂押出発泡体。 Styrene resin extruded foam with skin obtained by heating and melting a styrene resin, adding a foaming agent to the styrene resin, extrusion foaming through a die, and molding using an extrusion mold connected to the die Because
The density of the skin layer within 2 mm in the thickness direction from the surface of the extruded foam is 50 to 90 kg / m 3 , and the density of the entire extruded foam is 5 to 30 kg / m 3 lower than the density of the skin layer. A styrene-based resin extruded foam with a skin.
押出成形金型の金型温度T(℃)が、スチレン系樹脂のビカット軟化温度t(℃)に対して、(t−70)≦T≦(t+10)の関係を満たすことを特徴とする、スキン付スチレン系樹脂押出発泡体の製造方法。 Styrene resin extruded foam with skin obtained by heating and melting a styrene resin, adding a foaming agent to the styrene resin, extrusion foaming through a die, and molding using an extrusion mold connected to the die A manufacturing method of
The mold temperature T (° C.) of the extrusion mold satisfies the relationship of (t−70) ≦ T ≦ (t + 10) with respect to the Vicat softening temperature t (° C.) of the styrenic resin. A method for producing a styrene resin extruded foam with skin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314322A JP2010138244A (en) | 2008-12-10 | 2008-12-10 | Styrene resin extrusion foam with skin and manufacturing method of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314322A JP2010138244A (en) | 2008-12-10 | 2008-12-10 | Styrene resin extrusion foam with skin and manufacturing method of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2010138244A true JP2010138244A (en) | 2010-06-24 |
Family
ID=42348652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008314322A Pending JP2010138244A (en) | 2008-12-10 | 2008-12-10 | Styrene resin extrusion foam with skin and manufacturing method of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010138244A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012229276A (en) * | 2011-04-22 | 2012-11-22 | Kaneka Corp | Extruded styrene resin foam and method for producing the same |
| JP2013119619A (en) * | 2011-12-08 | 2013-06-17 | Kaneka Corp | Styrenic resin extruded foam |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002051918A1 (en) * | 2000-12-22 | 2002-07-04 | Kaneka Corporation | Extruded styrene resin foam and process for producing the same |
| JP2004263039A (en) * | 2003-02-28 | 2004-09-24 | Sekisui Plastics Co Ltd | Styrene resin extrusion foam board for building materials |
-
2008
- 2008-12-10 JP JP2008314322A patent/JP2010138244A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002051918A1 (en) * | 2000-12-22 | 2002-07-04 | Kaneka Corporation | Extruded styrene resin foam and process for producing the same |
| JP2004263039A (en) * | 2003-02-28 | 2004-09-24 | Sekisui Plastics Co Ltd | Styrene resin extrusion foam board for building materials |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012229276A (en) * | 2011-04-22 | 2012-11-22 | Kaneka Corp | Extruded styrene resin foam and method for producing the same |
| JP2013119619A (en) * | 2011-12-08 | 2013-06-17 | Kaneka Corp | Styrenic resin extruded foam |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105722901A (en) | Extruded styrenic resin foam and method for manufacturing same | |
| JP5454731B2 (en) | Styrenic resin extruded foam and method for producing the same | |
| JP2010254864A (en) | Styrenic resin extruded foam and method for producing the same | |
| JP5248041B2 (en) | Thermoplastic resin foam | |
| WO2012057060A1 (en) | Extruded styrene resin foam and process for production thereof | |
| JP2007238927A (en) | Thermoplastic resin foam | |
| JP2010138244A (en) | Styrene resin extrusion foam with skin and manufacturing method of the same | |
| JP4784113B2 (en) | Styrene resin extruded foam manufacturing method | |
| JP2009173771A (en) | Method for producing styrenic resin extruded foam | |
| JP2009298850A (en) | Method for producing styrene-based resin-extruded foam material | |
| JP3976592B2 (en) | Styrenic resin extruded foam and method for producing the same | |
| JP6381223B2 (en) | Polystyrene resin foam | |
| JP2012172140A (en) | Styrenic resin extruded foam and method for producing the same | |
| JP2022032685A (en) | Method for producing styrenic resin foam by extrusion foaming, and produced foam, and foamable resin composition used in production method | |
| JP2009275065A (en) | Method for producing styrenic resin extrusion-foamed article | |
| JP2009298876A (en) | Styrenic resin-extruded foam and its manufacturing method | |
| JP2005162774A (en) | Highly heat-insulating styrene resin foam and its manufacturing method | |
| JP2005264117A (en) | Styrenic resin extruded foam and its production method | |
| JP4474733B2 (en) | Method for producing styrene resin foam | |
| JP4708315B2 (en) | Thermoplastic resin foam | |
| JP4222916B2 (en) | Flame retardant polystyrene resin extruded foam and method for producing the same | |
| JP2008280388A (en) | Extruded foam of styrenic resin and method for producing the same | |
| JP2008274115A (en) | Styrenic resin extruded foam and method for producing the same | |
| JP2005314610A (en) | Styrenic resin extruded foam and method for producing the same | |
| JP4118125B2 (en) | Styrene resin foam manufacturing method and foam |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111021 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130208 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130402 |
|
| A02 | Decision of refusal |
Effective date: 20130806 Free format text: JAPANESE INTERMEDIATE CODE: A02 |