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JP2010135364A - Electronic component mounting line and assembly work unit - Google Patents

Electronic component mounting line and assembly work unit Download PDF

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Publication number
JP2010135364A
JP2010135364A JP2008307167A JP2008307167A JP2010135364A JP 2010135364 A JP2010135364 A JP 2010135364A JP 2008307167 A JP2008307167 A JP 2008307167A JP 2008307167 A JP2008307167 A JP 2008307167A JP 2010135364 A JP2010135364 A JP 2010135364A
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substrate
machine
electronic component
component mounting
robot
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Kazuhide Nagao
和英 永尾
Yoshinori Yamada
佳典 山田
Takuya Tsutsumi
卓也 堤
Motoshi Himeno
素志 姫野
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Panasonic Corp
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Panasonic Corp
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Abstract

【課題】コネクタ等のような大型の部品を基板に取り付ける作業が部品装着機と同じライン内で実行されるようにした電子部品実装ライン及び組み立て作業機を提供することを目的とする。
【解決手段】電子部品実装ライン１が部品装着機４のほか、組み立て作業機８を備える。組み立て作業機８は、基台１３と、基台１３上に設けられてヘッド支持部１４ｃを水平面内で移動させる直交座標型ロボットであるＸＹロボット１４と、ＸＹロボット１４のヘッド支持部１４ｃに着脱自在に取り付けられたロボットハンド機構２２ａを備える。
【選択図】図４An object of the present invention is to provide an electronic component mounting line and an assembly work machine in which a work for attaching a large component such as a connector or the like to a board is performed in the same line as the component mounting machine.
An electronic component mounting line includes an assembly work machine in addition to a component mounting machine. The assembling machine 8 is attached to and detached from the base 13, the XY robot 14 that is an orthogonal coordinate type robot that is provided on the base 13 and moves the head support 14 c in a horizontal plane, and the head support 14 c of the XY robot 14. A robot hand mechanism 22a attached freely is provided.
[Selection] Figure 4

Description

本発明は、装着ヘッドにより電子部品をピックアップして基板に装着する部品装着機を含む複数台の作業機が連結されて成る電子部品実装ライン及び組み立て作業機に関するものである。   The present invention relates to an electronic component mounting line and an assembly work machine in which a plurality of work machines including a component mounting machine for picking up an electronic part by a mounting head and mounting the electronic part on a substrate are connected.

電子部品実装ラインは半田印刷機、部品装着機、リフロー炉及び外観検査機等の複数台の作業機が連結されて成り、半田印刷機で半田が印刷された基板に部品装着機で部品を装着し、その部品が装着された基板をリフロー炉で加熱及び冷却することにより基板上の半田を溶融・固化して電子部品を基板上に固定する（特許文献１）。このようにして電子部品が基板上に固定された後は、コネクタなどの電子部品に比較して大型の部品が基板に取り付けられる。
特開平１１−１７７２９０号公報 The electronic component mounting line consists of multiple working machines such as a solder printing machine, component mounting machine, reflow furnace, and appearance inspection machine, and the parts are mounted on the board printed with solder by the solder printer. Then, by heating and cooling the substrate on which the component is mounted in a reflow furnace, the solder on the substrate is melted and solidified to fix the electronic component on the substrate (Patent Document 1). After the electronic component is thus fixed on the substrate, a larger component is attached to the substrate than the electronic component such as a connector.
JP 11-177290 A

しかしながら、従来の電子部品実装ラインは、基板に小型の電子部品を装着することを目的としてこれに関連する作業機から成っており、電子部品が装着された基板にコネクタ等の大型の部品を取り付ける組み立て作業は、ライン外で作業者が別途手作業で行うようになっている。   However, the conventional electronic component mounting line is composed of a working machine related to the purpose of mounting a small electronic component on a substrate, and a large component such as a connector is attached to the substrate on which the electronic component is mounted. The assembly work is performed manually by an operator outside the line.

そこで本発明では、コネクタ等のような大型の部品を基板に取り付ける作業が部品装着機と同じライン内で実行されるようにした電子部品実装ライン及び組み立て作業機を提供することを目的とする。   In view of the above, an object of the present invention is to provide an electronic component mounting line and an assembly work machine in which a work for attaching a large component such as a connector to a board is performed in the same line as the component mounting machine.

請求項１に記載の電子部品実装ラインは、装着ヘッドにより電子部品をピックアップして基板に装着する部品装着機を含む複数台の作業機が連結されて成る電子部品実装ラインであって、これら複数台の作業機の中に、部品を把持して基板に取り付けるロボットハンド機構を備えた組み立て作業機が含まれている。   The electronic component mounting line according to claim 1 is an electronic component mounting line formed by connecting a plurality of work machines including a component mounting machine for picking up an electronic component by a mounting head and mounting the electronic component on a substrate. An assembly work machine including a robot hand mechanism that grips components and attaches them to a substrate is included in the work machine.

請求項２に記載の電子部品実装ラインは、請求項１に記載の電子部品実装ラインであって、部品装着機及び組み立て作業機は、ともに、基台及び基台上に設けられてヘッド支持部を水平面内で移動させる直交座標型ロボットを共通する設備として有し、部品装着機の装着ヘッド及び組み立て作業機のロボットハンド機構はそれぞれ直交座標型ロボットのヘッド支持部に着脱自在に取り付けられている。   An electronic component mounting line according to claim 2 is the electronic component mounting line according to claim 1, wherein both the component mounting machine and the assembly work machine are provided on the base and the base, and the head support section As a common facility, the mounting robot of the component mounting machine and the robot hand mechanism of the assembly work machine are detachably attached to the head support of the rectangular robot. .

請求項３に記載の電子部品実装ラインは、請求項１又は２に記載の電子部品実装ラインであって、組み立て作業機は、互いに独立して移動可能な複数のロボットハンド機構を備えている。   An electronic component mounting line according to a third aspect is the electronic component mounting line according to the first or second aspect, wherein the assembly machine includes a plurality of robot hand mechanisms that can move independently of each other.

請求項４に記載の電子部品実装ラインは、請求項３に記載の電子部品実装ラインであって、組み立て作業機は、基板の搬送及び位置決めを行う複数の基板搬送路を備え、複数の基板搬送路によって位置決めされた複数の基板に対して複数のロボットハンド機構により作業を行うようになっている。   The electronic component mounting line according to claim 4 is the electronic component mounting line according to claim 3, wherein the assembly work machine includes a plurality of substrate transport paths for transporting and positioning the substrate, and a plurality of substrate transports Work is performed on a plurality of substrates positioned by a path by a plurality of robot hand mechanisms.

請求項５に記載の組み立て作業機は、基台と、基台上に設けられてヘッド支持部を水平
面内で移動させる直交座標型ロボットと、直交座標型ロボットのヘッド支持部に着脱自在に取り付けられたロボットハンド機構とを備えた。 The assembly work machine according to claim 5 is detachably attached to a base, a Cartesian coordinate robot provided on the base and moving the head support portion in a horizontal plane, and a head support portion of the Cartesian coordinate robot. Robot hand mechanism.

本発明では、電子部品実装ラインを構成する複数台の作業機の中に、部品を把持して基板に取り付けるロボットハンド機構を備えた組み立て作業機が含まれているので、コネクタ等のような大型の部品を基板に取り付ける組み立て作業が部品装着機と同じライン内で実行される。   In the present invention, an assembly work machine including a robot hand mechanism that grips components and attaches them to a board is included in a plurality of work machines constituting the electronic component mounting line. Assembling work for attaching the components to the board is performed in the same line as the component mounting machine.

以下、図面を参照して本発明の実施の形態について説明する。図１は本発明の一実施の形態における電子部品実装ラインの概略構成図、図２は本発明の一実施の形態における電子部品実装ラインを構成する部品装着機の斜視図、図３は本発明の一実施の形態における部品装着機の制御系統を示すブロック図、図４は本発明の一実施の形態における電子部品実装ラインを構成する組み立て作業機の斜視図、図５は本発明の一実施の形態における組み立て作業機の制御系統を示すブロック図、図６は本発明の一実施の形態における組み立て作業機が備えるロボットハンド機構の拡大図である。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of an electronic component mounting line in an embodiment of the present invention, FIG. 2 is a perspective view of a component mounting machine constituting the electronic component mounting line in an embodiment of the present invention, and FIG. 4 is a block diagram showing a control system of a component mounting machine in one embodiment, FIG. 4 is a perspective view of an assembly work machine constituting an electronic component mounting line in one embodiment of the present invention, and FIG. 5 is one embodiment of the present invention. FIG. 6 is an enlarged view of the robot hand mechanism provided in the assembly work machine according to the embodiment of the present invention.

図１において、電子部品実装ライン１は半田印刷機２、印刷後外観検査機３、部品装着機４、装着後外観検査機５、リフロー炉６、リフロー後外観検査機７及び組み立て作業機８等の複数台の作業機が連結されて構成されている。   In FIG. 1, an electronic component mounting line 1 includes a solder printing machine 2, a post-print appearance inspection machine 3, a component mounting machine 4, a post-mounting appearance inspection machine 5, a reflow furnace 6, a reflow appearance inspection machine 7, an assembly work machine 8, and the like. The plurality of working machines are connected to each other.

図１において、半田印刷機２は、一対のベルトコンベアから成る基板搬送路２ａと、この基板搬送路２ａによって搬送及び位置決めされた基板ＰＢに対して半田印刷作業を実行する印刷部２ｂをそれぞれ２つずつ備えている。各基板搬送路２ａは外部から投入された基板ＰＢを受け取って所定位置に位置決めし、各印刷部２ｂは基板搬送路２ａによって位置決めされた基板ＰＢ上の電極（図示せず）上にペースト状の半田を印刷する。半田印刷機２は、このような半田印作業を行ったら、各基板搬送路２ａにより基板ＰＢを下流側の印刷後外観検査機３に搬出する。   In FIG. 1, a solder printing machine 2 includes a board conveyance path 2a composed of a pair of belt conveyors, and two printing units 2b that perform solder printing operations on a board PB conveyed and positioned by the board conveyance path 2a. It has one by one. Each substrate transport path 2a receives a substrate PB input from the outside and positions it at a predetermined position, and each printing unit 2b is pasted on an electrode (not shown) on the substrate PB positioned by the substrate transport path 2a. Print the solder. When the solder printing machine 2 performs such a solder marking operation, the board PB is carried out to the post-printing appearance inspection machine 3 on the downstream side through each board conveyance path 2a.

図１において、印刷後外観検査機３は、一対のベルトコンベアから成る基板搬送路３ａと、この基板搬送路３ａによって搬送及び位置決めされた基板ＰＢに対して外観検査作業を行う検査部３ｂをそれぞれ２つずつ備えている。各基板搬送路３ａは半田印刷機２から搬出された基板ＰＢを受け取って所定位置に位置決めし、各検査部３ｂは基板搬送路３ａによって位置決めされた半田印刷後の基板ＰＢをカメラによって撮像して基板ＰＢの外観の異常の有無を検査する。印刷後外観検査機３は、このような印刷後外観検査作業を行ったら、各基板搬送路３ａにより基板ＰＢを下流側の部品装着機４に搬出する。   In FIG. 1, a post-print appearance inspection machine 3 includes a substrate transport path 3a composed of a pair of belt conveyors, and an inspection unit 3b that performs an appearance inspection operation on the substrate PB transported and positioned by the substrate transport path 3a. Two are provided. Each board conveyance path 3a receives the board PB carried out from the solder printer 2 and positions it at a predetermined position, and each inspection unit 3b images the board PB after solder printing positioned by the board conveyance path 3a with a camera. The presence or absence of an abnormality in the appearance of the substrate PB is inspected. When the post-print appearance inspection machine 3 performs such post-print appearance inspection work, the board PB is carried out to the component mounting machine 4 on the downstream side through each board conveyance path 3a.

図１において、部品装着機４は、一対のベルトコンベアから成る基板搬送路１１と、この基板搬送路１１によって搬送及び位置決めされた基板ＰＢに対して電子部品Ｐの装着作業を行う装着ヘッド１２をそれぞれ２つずつ備えている。各基板搬送路１１は印刷後外観検査機３から搬出された基板ＰＢを受け取って所定位置に位置決めし、各装着ヘッド１２は基板搬送路１１によって位置決めされた半田印刷後の基板ＰＢ上に電子部品Ｐを装着する。   In FIG. 1, the component mounting machine 4 includes a substrate transport path 11 composed of a pair of belt conveyors, and a mounting head 12 that performs the mounting operation of the electronic component P on the substrate PB transported and positioned by the substrate transport path 11. There are two each. Each board conveyance path 11 receives the board PB carried out from the appearance inspection machine 3 after printing and positions it at a predetermined position, and each mounting head 12 has an electronic component on the board PB after solder printing positioned by the board conveyance path 11. Wear P.

図２において、２つの基板搬送路１１は基台１３上に設けられており、基台１３上には直交座標型ロボットであるＸＹロボット１４が設けられている。ＸＹロボット１４は、基台１３上に固定されて各基板搬送路１１による基板ＰＢの搬送方向（Ｘ軸方向）と直交する水平方向（Ｙ軸方向）に延びたＹ軸テーブル１４ａと、Ｘ軸方向に延びてＹ軸テーブル１４ａ上をＹ軸方向にスライド自在な２つのＸ軸テーブル１４ｂと、各Ｘ軸テーブル１４
ｂ上をＸ軸方向にスライド自在な２つのヘッド支持部１４ｃから成り、２つの装着ヘッド１２はこれら２つのヘッド支持部１４ｃに１つずつ着脱自在に取り付けられている。各装着ヘッド１２には真空圧制御により電子部品Ｐの真空吸着と離脱が可能な複数の吸着ノズル１２ａが取り付けられている。基台１３には複数のパーツフィーダ１６が着脱自在に取り付けられており、それぞれ所定の部品供給位置１６ａに電子部品Ｐを供給する。 In FIG. 2, two substrate transport paths 11 are provided on a base 13, and an XY robot 14 that is an orthogonal coordinate robot is provided on the base 13. The XY robot 14 is fixed on the base 13 and extends in a horizontal direction (Y-axis direction) orthogonal to the transport direction (X-axis direction) of the substrate PB by each substrate transport path 11; Two X-axis tables 14b extending in the direction and slidable on the Y-axis table 14a in the Y-axis direction, and each X-axis table 14
b comprises two head support portions 14c slidable in the X-axis direction, and the two mounting heads 12 are detachably attached to the two head support portions 14c one by one. Each mounting head 12 is provided with a plurality of suction nozzles 12a capable of vacuum suction and detachment of the electronic component P by vacuum pressure control. A plurality of parts feeders 16 are detachably attached to the base 13 and supply electronic components P to predetermined component supply positions 16a.

各基板搬送路１１による基板ＰＢの搬送及び位置決め動作、ＸＹロボット１４による装着ヘッド１２の移動動作及び各パーツフィーダ１６による電子部品Ｐの供給動作は部品装着機４が備える制御装置１７（図３）によってその作動制御がなされる。また、各吸着ノズル１２ａの装着ヘッド１２に対する昇降及び回転動作制御は装着ヘッド１２内に設けられたノズル作動機構１８（図３）を介して制御装置１７によってなされ、各吸着ノズル１２ａによる電子部品Ｐのパーツフィーダ１６からの真空吸着（ピックアップ）動作及び基板ＰＢ上での離脱（装着）動作の各制御は、装着ヘッド１２内に設けられた真空吸着機構１９を介して制御装置１７によってなされる（図３）。   The control device 17 (see FIG. 3) provided in the component mounting machine 4 performs the transport and positioning operation of the substrate PB by each substrate transport path 11, the moving operation of the mounting head 12 by the XY robot 14, and the supply operation of the electronic component P by each parts feeder 16. The operation is controlled by. Further, the control of the raising and lowering and rotating operation of each suction nozzle 12a with respect to the mounting head 12 is performed by the control device 17 via the nozzle operating mechanism 18 (FIG. 3) provided in the mounting head 12, and the electronic component P by each suction nozzle 12a. Each control of the vacuum suction (pickup) operation from the parts feeder 16 and the separation (mounting) operation on the substrate PB is performed by the control device 17 via a vacuum suction mechanism 19 provided in the mounting head 12 ( FIG. 3).

図２において、各装着ヘッド１２には撮像視野を下方に向けた基板カメラ２０が取り付けられており、基台１３上の２つの基板搬送路１１の両外側位置には撮像視野を上方に向けた部品カメラ２１が１つずつ取り付けられている。基板カメラ２０は装着ヘッド１２とともに水平面内方向に移動し、基板搬送路１１によって位置決めされた基板ＰＢの上面の基板位置検出マークＭ（図２）を上方から撮像する。部品カメラ２１は装着ヘッド１２がパーツフィーダ１６からピックアップした電子部品Ｐを下方から撮像する。基板カメラ２０及び部品カメラ２１の撮像動作によって得られた画像データはそれぞれ制御装置１７に送られる（図３）。   In FIG. 2, each mounting head 12 is attached with a substrate camera 20 with the imaging field of view facing downward, and the imaging field of view is directed upward at both outer positions of the two substrate transport paths 11 on the base 13. One component camera 21 is attached. The substrate camera 20 moves in the horizontal plane together with the mounting head 12, and images the substrate position detection mark M (FIG. 2) on the upper surface of the substrate PB positioned by the substrate transport path 11 from above. The component camera 21 images the electronic component P picked up from the parts feeder 16 by the mounting head 12 from below. Image data obtained by the imaging operations of the board camera 20 and the component camera 21 are respectively sent to the control device 17 (FIG. 3).

ここで、図３に示すように、各装着ヘッド１２に設けられたノズル作動機構１８、真空吸着機構１９及び基板カメラ２０はそれぞれヘッド支持部１４ｃ側に設けられたケーブル接続コネクタＣ１と装着ヘッド１２側に設けられたケーブル接続コネクタＣ２が嵌合している状態で制御装置１７と電気的に接続されるようになっている。これら両ケーブル接続コネクタＣ１，Ｃ２は、装着ヘッド１２のヘッド支持部１４ｃに対する着脱に応じて嵌合及び分離される。両ケーブル接続コネクタＣ１，Ｃ２が嵌合すると、制御装置１７はノズル作動機構１８、真空吸着機構１９及び基板カメラ２０との間で信号伝送が可能となり、この信号伝送が可能となる状態に基づいて、制御装置１７は、ヘッド支持部１４ｃに装着ヘッド１２が取り付けられている状態を認識することができる。   Here, as shown in FIG. 3, the nozzle operating mechanism 18, the vacuum suction mechanism 19, and the substrate camera 20 provided in each mounting head 12 are respectively connected to the cable connection connector C <b> 1 and the mounting head 12 provided on the head support portion 14 c side. The cable connection connector C2 provided on the side is electrically connected to the control device 17 in a fitted state. Both the cable connection connectors C1 and C2 are fitted and separated according to the attachment / detachment of the mounting head 12 with respect to the head support portion 14c. When both cable connection connectors C1 and C2 are fitted, the control device 17 can transmit signals to the nozzle operating mechanism 18, the vacuum suction mechanism 19 and the substrate camera 20, and based on the state in which this signal transmission is possible. The control device 17 can recognize the state in which the mounting head 12 is attached to the head support portion 14c.

部品装着機４の制御装置１７は、上流側の印刷後外観検査機３から基板搬送路１１に基板ＰＢが投入されたことを検知したら、その基板搬送路１１を作動させて基板ＰＢを所定の作業位置に位置決めするとともに、装着ヘッド１２を基板ＰＢの上方に移動させて、基板カメラ２０により基板ＰＢ上の基板位置検出マークＭを撮像し、基板ＰＢの基準位置からの位置ずれを求める。次いで制御装置１７は、装着ヘッド１２をパーツフィーダ１６の上方に移動させて部品供給位置１６ａに供給された電子部品Ｐをピックアップし、そのピックアップした電子部品Ｐを部品カメラ２１の上方を通過させて電子部品Ｐの撮像を行う。制御装置１７はこれにより電子部品Ｐの部品認識を行うとともに、吸着ノズル１２ａに対する電子部品Ｐの位置ずれ（吸着ずれ）を求める。そして制御装置１７は、基板ＰＢの位置ずれと電子部品Ｐの吸着ずれが補正されるように吸着ノズル１２ａの水平面内方向移動及び回転動作を行いながら電子部品Ｐを基板ＰＢ上で離脱させ、電子部品Ｐを基板ＰＢ上の目標装着位置に装着する。制御装置１７は、装着ヘッド１２により基板ＰＢ上の目標装着位置の全てに電子部品Ｐを装着したら、基板搬送路１１を作動させてその基板ＰＢを外部に搬出する。   When the control device 17 of the component mounting machine 4 detects that the board PB has been input from the upstream post-printing appearance inspection machine 3 to the board transport path 11, the board transport path 11 is operated to move the board PB to a predetermined position. In addition to positioning at the work position, the mounting head 12 is moved above the substrate PB, and the substrate position detection mark M on the substrate PB is imaged by the substrate camera 20 to obtain a positional deviation from the reference position of the substrate PB. Next, the control device 17 moves the mounting head 12 above the parts feeder 16 to pick up the electronic component P supplied to the component supply position 16a, and passes the picked-up electronic component P over the component camera 21. The electronic component P is imaged. Thus, the control device 17 recognizes the electronic component P and obtains a positional deviation (suction deviation) of the electronic component P with respect to the suction nozzle 12a. Then, the control device 17 separates the electronic component P on the substrate PB while moving and rotating the suction nozzle 12a in the horizontal plane so that the positional displacement of the substrate PB and the suction displacement of the electronic component P are corrected. The component P is mounted at the target mounting position on the substrate PB. When the electronic component P is mounted on all of the target mounting positions on the substrate PB by the mounting head 12, the control device 17 operates the substrate transport path 11 to carry out the substrate PB to the outside.

図１において、装着後外観検査機５は、一対のベルトコンベアから成る基板搬送路５ａ
と、この基板搬送路５ａによって搬送及び位置決めされた基板ＰＢに対して外観検査作業を行う検査部５ｂをそれぞれ２つずつ備えている。各基板搬送路５ａは部品装着機４から搬出された基板ＰＢを受け取って所定位置に位置決めし、各検査部５ｂは基板搬送路５ａによって位置決めされた電子部品Ｐの装着後の基板ＰＢをカメラによって撮像して基板ＰＢの外観の異常の有無を検査する。装着後外観検査機５は、このような装着後外観検査作業を行ったら、基板搬送路５ａにより基板ＰＢを下流側のリフロー炉６に搬出する。 In FIG. 1, a post-mounting appearance inspection machine 5 includes a substrate transport path 5a comprising a pair of belt conveyors.
And two inspection sections 5b each for performing an appearance inspection operation on the substrate PB transported and positioned by the substrate transport path 5a. Each board transport path 5a receives the board PB unloaded from the component mounting machine 4 and positions it at a predetermined position, and each inspection unit 5b uses the camera to mount the board PB after mounting the electronic component P positioned by the board transport path 5a. An image is taken to inspect for an abnormality in the appearance of the substrate PB. When the post-mounting appearance inspection machine 5 performs such post-mounting appearance inspection work, the substrate PB is carried out to the reflow furnace 6 on the downstream side by the substrate transfer path 5a.

図１において、リフロー炉６は、一対のベルトコンベアから成る基板搬送路６ａを２つ備えており、装着後外観検査機５から搬出された基板ＰＢを各基板搬送路６ａによって受け取り、各基板ＰＢを搬送して炉内を進行させながら加熱及び冷却するリフロー作業を行う。基板ＰＢが炉内で加熱及び冷却されると基板ＰＢ上の半田は固化するので、電子部品Ｐが基板ＰＢ上に固定される。炉内を通過した基板ＰＢはそのまま下流側のリフロー後外観検査機７に搬出される。   In FIG. 1, the reflow furnace 6 includes two substrate transport paths 6 a each composed of a pair of belt conveyors. The substrate PB unloaded from the appearance inspection machine 5 after being mounted is received by each substrate transport path 6 a, and each substrate PB is received. A reflow operation is carried out to heat and cool while moving the inside of the furnace. When the substrate PB is heated and cooled in the furnace, the solder on the substrate PB is solidified, so that the electronic component P is fixed on the substrate PB. The substrate PB that has passed through the furnace is directly carried out to the post-reflow visual inspection machine 7 on the downstream side.

図１において、リフロー後外観検査機７は、一対のベルトコンベアから成る基板搬送路７ａと、この基板搬送路７ａによって搬送及び位置決めされた基板ＰＢに対して外観検査作業を行う検査部７ｂをそれぞれ２つずつ備えている。各基板搬送路７ａはリフロー炉６から搬出された基板ＰＢを受け取って所定位置に位置決めし、各検査部７ｂは基板搬送路７ａによって位置決めされたリフロー後の基板ＰＢをカメラによって撮像して基板ＰＢの外観の異常の有無を検査する。リフロー後外観検査機７は、このようなリフロー後外観検査作業を行ったら、各基板搬送路７ａにより基板ＰＢを下流側の組み立て作業機８に搬出する。   In FIG. 1, a post-reflow visual inspection machine 7 includes a substrate conveyance path 7a composed of a pair of belt conveyors, and an inspection unit 7b that performs an appearance inspection operation on the substrate PB conveyed and positioned by the substrate conveyance path 7a. Two are provided. Each substrate transport path 7a receives the substrate PB unloaded from the reflow furnace 6 and positions the substrate PB at a predetermined position, and each inspection unit 7b images the substrate PB after reflow positioned by the substrate transport path 7a with a camera to capture the substrate PB. Inspect for any abnormal appearance. After performing the post-reflow visual inspection work, the post-reflow visual inspection machine 7 carries out the substrate PB to the downstream assembly work machine 8 through the respective substrate transport paths 7a.

図１において、組み立て作業機８は、一対のベルトコンベアから成る基板搬送路１１と、この基板搬送路１１によって搬送及び位置決めされた基板ＰＢに対して部品Ｅを取り付ける組み立て作業を行う組み立てヘッド２２をそれぞれ２つずつ備えている。各基板搬送路１１はリフロー後外観検査機７から搬出された基板ＰＢを受け取って所定位置に位置決めし、各組み立てヘッド２２は基板搬送路１１によって位置決めされたリフロー後の基板ＰＢ上に部品Ｅを装着する。   In FIG. 1, an assembly work machine 8 includes a substrate transport path 11 composed of a pair of belt conveyors, and an assembly head 22 that performs an assembly operation for attaching a component E to a substrate PB transported and positioned by the substrate transport path 11. There are two each. Each substrate transport path 11 receives the substrate PB carried out from the post-reflow visual inspection machine 7 and positions it at a predetermined position, and each assembly head 22 puts the component E on the substrate PB after reflow positioned by the substrate transport path 11. Installing.

図４に示すように、２つの基板搬送路１１は基台１３上に設けられており、２つの組み立てヘッド２２は基台１３上に設けられた直交座標型ロボットであるＸＹロボット１４の２つのヘッド支持部１４ｃに１つずつ着脱自在に取り付けられているが、これら基台１３、２つの基板搬送路１１及びＸＹロボット１４は、部品装着機４と同一の設備である。   As shown in FIG. 4, the two substrate transfer paths 11 are provided on the base 13, and the two assembly heads 22 are two of the XY robot 14 that is an orthogonal coordinate robot provided on the base 13. The base 13, the two board transfer paths 11, and the XY robot 14 are the same equipment as the component mounting machine 4, but are detachably attached to the head support portion 14 c one by one.

基台１３には部品装着機４のように小型の電子部品Ｐを供給する複数のパーツフィーダ１６ではなく、基板ＰＢに取り付けるコネクタのように電子部品Ｐに比較して大型の部品Ｅを供給する複数のトレイフィーダ２６が着脱自在に取り付けられている。各基板搬送路１１による基板ＰＢの搬送及び位置決め動作、ＸＹロボット１４による組み立てヘッド２２の移動動作は、この組み立て作業機８が備える制御装置２７によってその作動制御なされる（図５）。   The base 13 is not supplied with a plurality of parts feeders 16 for supplying small electronic components P as in the component mounting machine 4, but is supplied with a large component E as compared with the electronic components P such as a connector attached to the substrate PB. A plurality of tray feeders 26 are detachably attached. Operation of the substrate PB transport and positioning operation by each substrate transport path 11 and the movement operation of the assembly head 22 by the XY robot 14 are controlled by the controller 27 provided in the assembly work machine 8 (FIG. 5).

図６において、組み立てヘッド２２に備えられるロボットハンド機構２２ａは、ＸＹロボット１４のヘッド支持部１４ｃに着脱自在に取り付けられるベースプレート３１と、ペースプレート３１に対して昇降自在に設けられた昇降プレート３２と、昇降プレート３２にベアリングユニット３３を介して取り付けられ、昇降プレート３２に対して水平な第１軸Ｊ１回りに旋回自在に設けられた旋回部材３４と、旋回部材３４に取り付けられ、旋回部材３４に対して垂直な第２軸Ｊ２回りに旋回自在に支持された把持部支持部材３５と、把持部支持部材３５の下端に取り付けられ、把持部支持部材３５に対して水平な第３軸Ｊ３回りに揺動自在に設けられた把持部３６を備えて構成されている。把持部３６は人間の
手と同様の把持動作が可能な５つの指部３６ａを備えている。 In FIG. 6, the robot hand mechanism 22 a provided in the assembly head 22 includes a base plate 31 that is detachably attached to the head support portion 14 c of the XY robot 14, and a lift plate 32 that is provided so as to be lifted and lowered relative to the pace plate 31. The revolving plate 32 is attached to the revolving plate 32 via the bearing unit 33, and is provided to the revolving member 34 so as to be rotatable about the first axis J1 that is horizontal with respect to the elevating plate 32. A gripping part support member 35 that is pivotally supported around a second axis J2 that is perpendicular to the gripping part, and is attached to the lower end of the gripping part support member 35 and about a third axis J3 that is horizontal to the gripping part support member 35. The grip portion 36 is provided so as to be swingable. The grip portion 36 includes five finger portions 36a that can perform a grip operation similar to that of a human hand.

図６において、昇降プレート３２は昇降モータ４１（図５も参照）の駆動によってベースプレート３１に対して昇降し（矢印Ａ）、旋回部材３４は把持部支持部材３５に内蔵された第１軸回り旋回モータ４２（図５）の駆動によって昇降プレート３２に対して旋回する（矢印Ｒ１）。把持部支持部材３５は把持部支持部材３５に内蔵された第２軸回り旋回モータ４３（図５）の駆動によって旋回部材３４に対して旋回し（矢印Ｒ２）、把持部３６は把持部支持部材３５に内蔵された第３軸回り揺動モータ４４（図５）の駆動によって把持部支持部材３５に対して揺動する（矢印Ｒ３）。また、把持部３６の各指部３６ａは、把持部３６に内蔵された複数の把持モータ４５の駆動によって把持動作を行う（矢印Ｂ）。これら昇降モータ４１、第１軸回り旋回モータ４２、第２軸回り旋回モータ４３、第３軸回り揺動モータ４４及び複数の把持モータ４５はロボットハンド駆動部４６を構成しており（図５）、このロボットハンド駆動部４６を構成する上記モータ４１〜４５の各々は、制御装置２７によって作動制御がなされるようになっている（図５）。   In FIG. 6, the lift plate 32 moves up and down with respect to the base plate 31 by driving a lift motor 41 (see also FIG. 5) (arrow A), and the turning member 34 turns around the first axis built in the gripping part support member 35. It turns with respect to the raising / lowering plate 32 by the drive of the motor 42 (FIG. 5) (arrow R1). The gripping part support member 35 pivots with respect to the turning member 34 by driving a second axis turning motor 43 (FIG. 5) built in the gripping part support member 35 (arrow R2), and the gripping part 36 is gripping part support member. It swings with respect to the holding part support member 35 by driving a third axis swing motor 44 (FIG. 5) built in the head 35 (arrow R3). Each finger part 36a of the grip part 36 performs a gripping operation by driving a plurality of gripping motors 45 built in the grip part 36 (arrow B). The lift motor 41, the first-axis turning motor 42, the second-axis turning motor 43, the third-axis swing motor 44, and the plurality of gripping motors 45 constitute a robot hand drive 46 (FIG. 5). Each of the motors 41 to 45 constituting the robot hand drive unit 46 is controlled by the control device 27 (FIG. 5).

図６において、把持部３６を構成する５つの指部３６ａの先端部には力覚センサ４７が設けられており、各力覚センサ４７は制御装置２７に繋がっている（図５）。このため制御装置２７は、力覚センサ４７からの情報に基づいて、把持部３６が物体を把持しているか否か、把持しているときにはどの程度の把持力（握力）で把持しているかを検知することができる。   In FIG. 6, force sensors 47 are provided at the distal ends of the five finger portions 36 a constituting the grip portion 36, and each force sensor 47 is connected to the control device 27 (FIG. 5). Therefore, based on information from the force sensor 47, the control device 27 determines whether or not the gripping part 36 is gripping an object, and to what degree the gripping force (grip strength) is gripped. Can be detected.

図４において、各組み立てヘッド２２には、撮像視野を下方に向けた視認カメラ５０が取り付けられている。視認カメラ５０はロボットハンド機構２２ａとともに水平面内方向に移動し、制御装置２７に制御されて、ロボットハンド機構２２ａにより把持しようとする部品Ｅを撮像する（図５）。視認カメラ５０の撮像動作によって得られた画像データは制御装置２７に送られる（図５）。   In FIG. 4, each assembly head 22 is attached with a visual camera 50 whose imaging field of view is directed downward. The visual camera 50 moves in the horizontal plane direction together with the robot hand mechanism 22a and is controlled by the control device 27 to image the part E to be gripped by the robot hand mechanism 22a (FIG. 5). Image data obtained by the imaging operation of the visual camera 50 is sent to the control device 27 (FIG. 5).

ここで、図５に示すように、各ロボットハンド機構２２ａのロボットハンド駆動部４６、力覚センサ４７及び視認カメラ５０は、それぞれヘッド支持部１４ｃ側に設けられた前述のケーブル接続コネクタＣ１と組み立てヘッド２２側に設けられたケーブル接続コネクタＣ３が嵌合している状態で制御装置２７と電気的に接続されるようになっている。これら両ケーブル接続コネクタＣ１，Ｃ３は、組み立てヘッド２２のヘッド支持部１４ｃに対する着脱に応じて嵌合及び分離され、ケーブル接続コネクタＣ１，Ｃ３が嵌合すると、制御装置２７はロボットハンド駆動部４６、力覚センサ４７及び視認カメラ５０との間で信号伝送が可能となり、この信号伝送が可能となる状態に基づいて、制御装置２７は、ヘッド支持部１４ｃに組み立てヘッド２２が取り付けられている状態を認識することができる。   Here, as shown in FIG. 5, the robot hand driving unit 46, the force sensor 47, and the visual camera 50 of each robot hand mechanism 22a are assembled with the above-described cable connection connector C1 provided on the head support unit 14c side. The cable connection connector C3 provided on the head 22 side is electrically connected to the control device 27 in a state where it is fitted. These cable connection connectors C1 and C3 are fitted and separated according to the attachment and detachment of the assembly head 22 with respect to the head support portion 14c. When the cable connection connectors C1 and C3 are fitted, the control device 27 includes the robot hand drive unit 46, Signal transmission is possible between the force sensor 47 and the visual camera 50. Based on the state in which this signal transmission is possible, the control device 27 determines that the assembly head 22 is attached to the head support portion 14c. Can be recognized.

組み立て作業機８の制御装置２７は、上流側のリフロー後外観検査機７から基板搬送路１１に基板ＰＢが投入されたことを検知したら、基板搬送路１１を作動させて基板ＰＢを所定の作業位置に位置決めし、組み立てヘッド２２をトレイフィーダ２６の上方に移動させて、視認カメラ５０によってトレイフィーダ２６上の部品Ｅを視認しながら、ロボットハンド機構２２ａの把持部３６により部品Ｅを把持する。そして、組み立てヘッド２２を基板搬送路１１によって位置決めされた基板ＰＢの上方に移動させて、把持部３６により把持した部品Ｅを基板ＰＢ上の目標取り付け位置に取り付ける。制御装置２７は、ロボットハンド機構２２ａにより基板ＰＢ上の目標取り付け位置の全てに部品Ｅを取り付けたら、基板搬送路１１を作動させてその基板ＰＢを外部に搬出する。   When the control device 27 of the assembling machine 8 detects that the substrate PB has been put into the substrate transport path 11 from the post-reflow visual inspection machine 7 on the upstream side, the substrate transport path 11 is operated to operate the substrate PB for a predetermined operation. The assembly head 22 is moved to a position above the tray feeder 26, and the component E is grasped by the grasping portion 36 of the robot hand mechanism 22a while visually recognizing the component E on the tray feeder 26 with the visual camera 50. Then, the assembly head 22 is moved above the substrate PB positioned by the substrate transport path 11 to attach the component E gripped by the gripping portion 36 to the target mounting position on the substrate PB. When the controller 27 attaches the component E to all of the target attachment positions on the substrate PB by the robot hand mechanism 22a, the controller 27 operates the substrate conveyance path 11 to carry out the substrate PB to the outside.

以上説明したように、本実施の形態における電子部品実装ライン１は、この電子部品実装ライン１を構成する複数台の作業機の中に、部品Ｅを把持して基板ＰＢに取り付けるロ
ボットハンド機構２２ａを備えた組み立て作業機８が含まれているので、コネクタ等のような大型の部品を基板ＰＢに取り付ける組立作業が部品装着機４と同じライン内で実行される。 As described above, the electronic component mounting line 1 according to the present embodiment has the robot hand mechanism 22a that holds the component E and attaches it to the substrate PB among the plurality of working machines constituting the electronic component mounting line 1. Therefore, the assembly work for attaching a large component such as a connector to the board PB is performed in the same line as the component placement machine 4.

ここで、部品装着機４及び組み立て作業機８は、ともに、基台１３及び基台１３上に設けられてヘッド支持部１４ｃを水平面内で移動させる直交座標型ロボットであるＸＹロボット１４を共通する設備として有しており、部品装着機４の装着ヘッド１２及び組み立て作業機８のロボットハンド機構２２ａはそれぞれＸＹロボット１４のヘッド支持部１４ｃに着脱自在に取り付けられている。   Here, both the component mounting machine 4 and the assembly work machine 8 share the XY robot 14 that is provided on the base 13 and the base 13 and is an orthogonal coordinate robot that moves the head support portion 14c in a horizontal plane. The mounting head 12 of the component mounting machine 4 and the robot hand mechanism 22a of the assembly work machine 8 are detachably attached to the head support portion 14c of the XY robot 14, respectively.

すなわち、本実施の形態における組み立て作業機８は、基台１３と、基台１３上に設けられてヘッド支持部１４ｃを水平面内で移動させる直交座標型ロボットとしてのＸＹロボット１４と、ＸＹロボット１４のヘッド支持部１４ｃに着脱自在に取り付けられたロボットハンド機構２２ａとを備えたものであるので、組み立て作業機８は部品装着機４との間でヘッド部（装着ヘッド１２と組み立てヘッド２２）を取り替えるだけでよく、部品装着機４を含む電子部品実装ライン１内に設置して用いることに適したものとなっている。   That is, the assembly work machine 8 in the present embodiment includes a base 13, an XY robot 14 as an orthogonal coordinate robot that is provided on the base 13 and moves the head support 14 c in a horizontal plane, and the XY robot 14. Since the robot hand mechanism 22a is detachably attached to the head support portion 14c, the assembling machine 8 places the head portion (the mounting head 12 and the assembly head 22) with the component mounting machine 4. It only needs to be replaced, and is suitable for installation and use in the electronic component mounting line 1 including the component mounting machine 4.

また、本実施の形態における電子部品実装ライン１が備える組み立て作業機８は、互いに独立して移動可能な複数（ここでは２つ）のロボットハンド機構２２ａを備えているので、人間が両手を使って行う作業と同様の複雑な作業を行うこともできる。   Further, the assembly work machine 8 provided in the electronic component mounting line 1 according to the present embodiment includes a plurality (here, two) of robot hand mechanisms 22a that can move independently from each other, so that a human uses both hands. It is also possible to perform complex tasks similar to those performed in

更に、組み立て作業機８は、基板ＰＢの搬送及び位置決めを行う複数（ここでは２つ）の基板搬送路１１を備え、これら複数の基板搬送路１１によって位置決めされた複数の基板ＰＢに対して複数（ここでは２つ）のロボットハンド機構２２ａにより作業を行うようになっているので、部品Ｅを基板ＰＢに取り付ける組み立て作業を複数の基板ＰＢについて同時並行的に行うことができ、高い生産効率で組み立て作業を行うことができるようになっている。   Further, the assembly work machine 8 includes a plurality (here, two) of substrate transport paths 11 for transporting and positioning the substrate PB, and a plurality of the substrate PBs positioned by the plurality of substrate transport paths 11. Since the work is performed by the robot hand mechanisms 22a (here, two), the assembly work for attaching the component E to the board PB can be performed simultaneously on a plurality of boards PB with high production efficiency. Assembly work can be performed.

これまで本発明の実施の形態について説明してきたが、本発明は上述の実施の形態に示したものに限定されない。例えば、上述の実施の形態では、電子部品実装ライン１を構成する各作業機は複数の基板搬送路を備えたものとなっていたが、組み立て作業機８を含め、各作業機が備える基板搬送路の数は１つであってもよい。また、上述の実施の形態では、組み立て作業機８は互いに独立して移動可能な複数のロボットハンド機構２２ａを備えていたが、必ずしも複数のロボットハンド機構２２ａを備えていなければならないわけではなく、１つのロボットハンド機構２２ａを備えているのであってもよい。   Although the embodiment of the present invention has been described so far, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, each work machine constituting the electronic component mounting line 1 is provided with a plurality of board transfer paths, but the board transfer included in each work machine including the assembly work machine 8 is provided. The number of roads may be one. In the above-described embodiment, the assembly work machine 8 includes a plurality of robot hand mechanisms 22a that can move independently from each other. However, the assembly work machine 8 does not necessarily have to include a plurality of robot hand mechanisms 22a. One robot hand mechanism 22a may be provided.

また、上述の実施の形態では、電子部品実装ライン１が半田印刷機２、印刷後外観検査機３、部品装着機４、装着後外観検査機５、リフロー炉６、リフロー後外観検査機７及び組み立て作業機８を含むものとなっていたが、電子部品実装ライン１は少なくとも部品装着機１と組み立て作業機８を含んでいればよく、これらの作業機の一部が欠けていたり、その他の作業機が含まれたりしていても構わない。また、上述の実施の形態において示したロボットハンド機構２２ａの構成は一例に過ぎず、部品Ｅを把持して基板ＰＢに取り付けることができるものであれば、その構成の如何は問わない。また、上述の実施の形態では、ロボットハンド機構２２ａにより把持する部品Ｅはコネクタ等の電子部品Ｐに比較して大型の部品であるとしていたが、これは一例に過ぎず、必ずしも電子部品Ｐに比較して大型の部品である必要はない。   In the above-described embodiment, the electronic component mounting line 1 includes the solder printer 2, the post-printing appearance inspection machine 3, the component mounting machine 4, the post-mounting appearance inspection machine 5, the reflow furnace 6, the post-reflow appearance inspection machine 7, and Although the assembly work machine 8 has been included, the electronic component mounting line 1 only needs to include at least the component mounting machine 1 and the assembly work machine 8, and some of these work machines are missing. A work machine may be included. Further, the configuration of the robot hand mechanism 22a shown in the above-described embodiment is merely an example, and the configuration is not limited as long as the component E can be gripped and attached to the substrate PB. In the above-described embodiment, the component E gripped by the robot hand mechanism 22a is a large component compared to the electronic component P such as a connector. However, this is merely an example, and the electronic component P is not necessarily limited to the electronic component P. Compared to large parts, it is not necessary.

コネクタ等のような大型の部品を基板に取り付ける作業が部品装着機と同じライン内で実行されるようにした電子部品実装ライン及び組み立て作業機を提供する。   Provided are an electronic component mounting line and an assembly work machine in which an operation of attaching a large component such as a connector to a board is performed in the same line as a component mounting machine.

本発明の一実施の形態における電子部品実装ラインの概略構成図1 is a schematic configuration diagram of an electronic component mounting line according to an embodiment of the present invention. 本発明の一実施の形態における電子部品実装ラインを構成する部品装着機の斜視図The perspective view of the component mounting machine which comprises the electronic component mounting line in one embodiment of this invention 本発明の一実施の形態における部品装着機の制御系統を示すブロック図The block diagram which shows the control system of the component mounting machine in one embodiment of this invention 本発明の一実施の形態における電子部品実装ラインを構成する組み立て作業機の斜視図The perspective view of the assembly work machine which comprises the electronic component mounting line in one embodiment of this invention 本発明の一実施の形態における組み立て作業機の制御系統を示すブロック図The block diagram which shows the control system of the assembly work machine in one embodiment of this invention 本発明の一実施の形態における組み立て作業機が備えるロボットハンド機構の拡大図The enlarged view of the robot hand mechanism with which the assembly machine in one embodiment of this invention is provided

符号の説明Explanation of symbols

１ 電子部品実装ライン
２ 半田印刷機（作業機）
３ 印刷後外観検査機（作業機）
４ 部品装着機（作業機）
５ 装着後外観検査機（作業機）
６ リフロー炉（作業機）
７ リフロー後外観検査機（作業機）
８ 組み立て作業機（作業機）
１２ 装着ヘッド
１３ 基台
１４ ＸＹロボット（直交座標型ロボット）
１４ｃ ヘッド支持部
２２ａ ロボットハンド機構
ＰＢ 基板
Ｐ 電子部品
Ｅ 部品 1 Electronic component mounting line 2 Solder printer (work machine)
3 Post-print appearance inspection machine (work machine)
4 Parts mounting machine (work machine)
5 Post-mounting appearance inspection machine (work machine)
6 Reflow furnace (work machine)
7 Visual inspection machine after reflow (work machine)
8 Assembly machine (work machine)
12 Mounting head 13 Base 14 XY robot (Cartesian coordinate robot)
14c Head support 22a Robot hand mechanism PB Substrate P Electronic component E Component

Claims (5)

装着ヘッドにより電子部品をピックアップして基板に装着する部品装着機を含む複数台の作業機が連結されて成る電子部品実装ラインであって、これら複数台の作業機の中に、部品を把持して基板に取り付けるロボットハンド機構を備えた組み立て作業機が含まれていることを特徴とする電子部品実装ライン。   An electronic component mounting line formed by connecting a plurality of work machines including a component mounting machine that picks up electronic parts with a mounting head and places them on a substrate, and grips the components in the plurality of work machines. An electronic component mounting line including an assembly work machine equipped with a robot hand mechanism that attaches to a substrate. 部品装着機及び組み立て作業機は、ともに、基台及び基台上に設けられてヘッド支持部を水平面内で移動させる直交座標型ロボットを共通する設備として有し、部品装着機の装着ヘッド及び組み立て作業機のロボットハンド機構はそれぞれ直交座標型ロボットのヘッド支持部に着脱自在に取り付けられていることを特徴とする請求項１に記載の電子部品実装ライン。   Both the component placement machine and the assembly work machine have a base and a Cartesian coordinate robot that is provided on the base and moves the head support in a horizontal plane as a common facility. 2. The electronic component mounting line according to claim 1, wherein each of the robot hand mechanisms of the work implement is detachably attached to a head support portion of the Cartesian coordinate robot. 組み立て作業機は、互いに独立して移動可能な複数のロボットハンド機構を備えていることを特徴とする請求項１又は２に記載の電子部品実装ライン。   The electronic component mounting line according to claim 1, wherein the assembly work machine includes a plurality of robot hand mechanisms that can move independently of each other. 組み立て作業機は、基板の搬送及び位置決めを行う複数の基板搬送路を備え、複数の基板搬送路によって位置決めされた複数の基板に対して複数のロボットハンド機構により作業を行うようになっていることを特徴とする請求項３に記載の電子部品実装ライン。   The assembly work machine is provided with a plurality of substrate transport paths for transporting and positioning the substrate, and works with a plurality of robot hand mechanisms on the plurality of substrates positioned by the plurality of substrate transport paths. The electronic component mounting line according to claim 3. 基台と、基台上に設けられてヘッド支持部を水平面内で移動させる直交座標型ロボットと、直交座標型ロボットのヘッド支持部に着脱自在に取り付けられたロボットハンド機構とを備えたことを特徴とする組み立て作業機。   A base, a Cartesian coordinate robot provided on the base and moving the head support in a horizontal plane, and a robot hand mechanism detachably attached to the head support of the Cartesian coordinate robot. A special assembly machine.
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