JP2010129669A - Substrate treatment system - Google Patents

Abstract

【Task】
In substrate processing, it is possible to prevent misuse of the boat and to properly manage the cleaning time of the boat, to prevent defective lots and wafer damage, and to further improve the quality of wafer processing.
[Solution]
A substrate processing apparatus 1 having a processing furnace 28 for storing and processing a substrate, a substrate holder 26 for holding the substrate in the processing furnace, and a controller for managing the substrate holder and executing the substrate processing. And a main management device that instructs the substrate processing apparatus to execute batch processing of substrates, wherein the control unit has first substrate holder management data registered therein, The main management apparatus instructs batch control information including second substrate holder management data to the control unit, and the control unit collates the first substrate holder management data with the second substrate holder management data. If there is consistency between the two substrate holder management data, the substrate processing is executed based on the batch processing information.
[Selection] Figure 1

Description

  The present invention relates to a substrate processing system which is a process for manufacturing a semiconductor device and performs substrate processing such as thin film formation, impurity diffusion, annealing treatment, etching, etc. on a substrate such as a wafer or a glass substrate, or an LCD. It is.

  A substrate processing system for processing a substrate to manufacture a semiconductor device includes a main management device (HOST computer) and a plurality of substrate processing devices connected to the HOST computer. The substrate processing device is operated by the HOST computer. Centralized management.

  The substrate processing is executed according to a recipe in which processing conditions are set, the HOST computer selects a recipe according to the processing, and the substrate processing apparatus executes the selected recipe to perform the required substrate processing. .

  One of the processes set in the recipe is selection and management of the substrate holder.

  For example, when the substrate processing apparatus is a batch-type substrate processing apparatus having a vertical processing furnace, the processing of the substrate (wafer) is performed in a state in which a required number of substrates are held in a substrate holder (boat). Before the processing, unprocessed wafers are transferred to the boat, and processed wafers are discharged from the boat after the processing. In addition, loading / unloading of the boat into / from the processing furnace is performed.

  When batch processing is performed with the substrate processing equipment, the number of batch processing differs depending on the film formation type, so the boat can also hold multiple wafers that can hold wafers or have different holding pitches. Selected boats are used.

  Alternatively, when a film forming process is performed, reaction products are deposited on the boat, and therefore, when the boat is used a predetermined number of times, it is necessary to clean the deposit to remove the deposit. Therefore, it is necessary to manage the number of times the boat is used.

  Conventionally, the type of boat, the number of times of use, and the necessity of cleaning are managed by the operator, which is complicated and may be misused. Misuse of the boat can cause substrate processing defects and wafer damage. This may cause damage to the lot production operation.

  In view of such circumstances, the present invention makes it possible to prevent misuse of a boat and to properly manage the cleaning time of the boat, to prevent lot defects and wafer damage, and to further improve the quality of wafer processing. .

  The present invention includes a processing furnace that stores and processes a substrate, a substrate holder that holds the substrate in the processing furnace, and a control unit that manages the substrate holder and performs substrate processing. In a substrate processing system comprising an apparatus and a main management apparatus that instructs the substrate processing apparatus to execute batch processing of substrates, the control unit is registered with first substrate holder management data, The main management apparatus instructs batch control information including second substrate holder management data to the control unit, and the control unit collates the first substrate holder management data with the second substrate holder management data. If there is consistency between the two substrate holder management data, the present invention relates to a substrate processing system that executes substrate processing based on the batch processing information.

  According to the present invention, a processing furnace that stores and processes a substrate, a substrate holder that holds the substrate in the processing furnace, and a controller that manages the substrate holder and executes substrate processing are provided. In a substrate processing system comprising a substrate processing apparatus and a main management apparatus that instructs the substrate processing apparatus to execute batch processing of substrates, the control unit registers first substrate holder management data The main management apparatus instructs batch control information including second substrate holder management data to the control unit, and the control unit includes the first substrate holder management data, the second substrate holder management data, and the like. If there is consistency between the two substrate holder management data, the substrate processing is executed based on the batch processing information, so that erroneous use of the substrate holder is prevented in the batch processing execution of the substrate processing apparatus. Defective, wafer damage Preventing further exhibits an excellent effect of improving the processing quality of the wafer.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  First, a substrate processing apparatus in which the present invention is implemented will be described.

  The substrate processing apparatus performs a substrate processing process which is one of the manufacturing processes of a semiconductor device (IC). In the following description, a vertical substrate processing apparatus that includes a vertical furnace as an example of a substrate processing apparatus and performs oxidation processing, CVD film formation processing, diffusion processing, annealing processing, etc. on the substrate will be described.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a housing 2. A front maintenance port 4 serving as an opening provided for maintenance is opened at the front front portion of the front wall 3 of the housing 2, and the front maintenance port 4 is opened and closed by a front maintenance door 5.

  A pod loading / unloading port 6 is opened on the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2, and the pod loading / unloading port 6 is a front shutter (loading / unloading opening / closing mechanism) 7. A load port (substrate transfer container delivery table) 8 is installed in front of the front side of the pod loading / unloading port 6, and the load port 8 is configured to align the placed pod 9. Has been.

  The pod 9 is a hermetically sealed substrate transfer container, and is loaded into the load port 8 by an in-process transfer apparatus (not shown) and unloaded from the load port 8.

  A rotary pod shelf (substrate transfer container storage shelf) 11 is installed at an upper portion of the housing 2 at a substantially central portion in the front-rear direction. The rotary pod shelf 11 includes a plurality of pods 9. It is configured to store.

  The rotary pod shelf 11 is a vertically-supported support column 12 that is intermittently rotated, and a plurality of shelf plates (substrate transfer container placement) that are radially supported by the support column 12 at the upper, middle, and lower positions. The shelf 13 is configured to store the pods 9 in a state where a plurality of pods 9 are placed.

  A pod opener (substrate transfer container lid opening / closing mechanism) 14 is provided below the rotary pod shelf 11. The pod opener 14 can mount the pod 9 and can open and close the lid of the pod 9. It has a configuration.

  A pod transfer device (container transfer device) 15 is installed between the load port 8 and the rotary pod shelf 11 and the pod opener 14, and the pod transfer device 15 holds the pod 9. The pod 9 can be moved between the load port 8, the rotary pod shelf 11, and the pod opener 14.

  A sub-housing 16 is provided over the rear end of the lower portion of the housing 2 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 19 for loading / unloading wafers (substrates) 18 into / from the sub-casing 16 are arranged on the front wall 17 of the sub-casing 16 vertically and vertically. The pod openers 14 are provided to the upper and lower wafer loading / unloading ports 19, 19, respectively.

  The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open and close the wafer entrance of the pod 9 by opening and closing the lid of the pod 9 placed on the mounting table 21 by the opening and closing mechanism 22.

  The sub casing 16 constitutes a transfer chamber 23 that is airtight from a space (pod transport space) in which the pod transport device 15 and the rotary pod shelf 11 are disposed. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23, and the wafer transfer mechanism 24 has a required number of wafers 18 (five in the drawing). A wafer mounting plate 25 is provided, and the wafer mounting plate 25 can move in the horizontal direction, rotate in the horizontal direction, and move up and down. The wafer transfer mechanism 24 is configured to load and unload wafers 18 with respect to a boat (substrate holder) 26.

  In the rear region of the transfer chamber 23, a standby unit 27 that accommodates and waits for the boat 26 is configured, and a vertical processing furnace 28 is provided above the standby unit 27.

  The processing furnace 28 has a processing chamber in which the boat 26 is accommodated. The lower end of the processing chamber is a furnace port, and the furnace port is opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 29. It is supposed to be done.

  A boat elevator (substrate holder lifting mechanism) 31 for raising and lowering the boat 26 is installed between the right end of the housing 2 and the right end of the standby portion 27 of the sub-housing 16. Yes. A seal cap 33 as a lid is horizontally attached to the arm 32 connected to the elevator platform of the boat elevator 31, and the seal cap 33 supports the boat 26 vertically, and the furnace of the processing furnace 28. The mouth can be closed airtight.

  The boat 26 includes a plurality of pillars, and the pillars are configured to hold a plurality of (for example, about 50 to 150) wafers 18 in multiple stages in a horizontal posture with their centers aligned. Yes.

  The boat 26 is provided with a plurality of types of boats having different wafer holding numbers. For example, a plurality of boats capable of holding 150, 125, and 100 are prepared, and each boat corresponds to the holding number. The holding pitch of the wafer 18 is set. In addition, each boat 26 is provided with a code so that a solid can be identified, and it is possible to manage the history of selection of the boat 26 to be used, the number of times the boat 26 is used, the time of cleaning, and the like. ing.

  Thus, the boat 26 corresponding to the type of substrate processing is selected, and the number of wafers 18 corresponding to the substrate processing is loaded into the boat 26.

  Further, dummy wafers (not shown) are stored in the substrate processing apparatus 1, and a required number of dummy wafers are loaded on the upper and lower portions of the boat 26 as necessary. Monitor wafers are loaded into the boat 26 at a required interval.

  A clean unit 35 is disposed at a position facing the boat elevator 31 side, and the clean unit 35 is configured by a supply fan and a dustproof filter so as to supply a clean atmosphere or clean air 34 which is an inert gas. ing. Between the wafer transfer mechanism 24 and the clean unit 35, a notch alignment device (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer 18.

  The clean air 34 blown out from the clean unit 35 is circulated through a notch aligner (not shown), the wafer transfer mechanism 24, and the boat 26, and is then sucked in by a duct (not shown), 2 is exhausted to the outside, or is circulated to the primary side (supply side) which is the suction side of the clean unit 35, and is again blown into the transfer chamber 23 by the clean unit 35. It is configured.

  Next, the operation of the processing apparatus of the present invention will be described.

  When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the housing 2 by the pod carrying device 15 through the pod loading / unloading port 6 and mounted on the designated shelf 13 of the rotary pod shelf 11. Placed. The pod 9 is temporarily stored in the rotary pod shelf 11, and is then transferred from the shelf plate 13 to one of the pod openers 14 by the pod transfer device 15 and transferred to the mounting table 21. Alternatively, it is transferred directly from the load port 8 to the mounting table 21.

  At this time, the wafer loading / unloading port 19 is closed by the opening / closing mechanism 22, and the clean air 34 is circulated and filled in the transfer chamber 23. For example, when the transfer chamber 23 is filled with nitrogen gas as the clean air 34, the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the housing 2 (atmosphere). Yes.

  The opening side end surface of the pod 9 placed on the mounting table 21 is pressed against the opening edge of the wafer loading / unloading port 19 in the front wall 17 of the sub casing 16 and the lid is opened and closed. It is removed by the mechanism 22 and the wafer entrance is opened.

  When the pod 9 is opened by the pod opener 14, the wafer 18 is taken out from the pod 9 by the wafer transfer mechanism 24 and transferred to a notch aligning device (not shown). After aligning 18, the wafer transfer mechanism 24 loads the wafer 18 into the standby section 27 located behind the transfer chamber 23 and charges (charges) the boat 26.

  The wafer transfer mechanism 24 that has transferred the wafer 18 to the boat 26 returns to the pod 9 and loads the next wafer 18 into the boat 26.

  During the loading operation of the wafer 18 into the boat 26 by the wafer transfer mechanism 24 in one (upper or lower) pod opener 14, the other (lower or upper) pod opener 14 has the rotary pod shelf. 11 and another pod 9 is transferred and transferred by the pod transfer device 15, and the opening operation of the pod 9 by the other pod opener 14 is simultaneously performed.

  When a predetermined number of wafers 18 are loaded into the boat 26, the furnace port portion of the processing furnace 28 that has been closed by the furnace port shutter 29 is opened by the furnace port shutter 29. Subsequently, the boat 26 is lifted by the boat elevator 31 and loaded (loaded) into the processing furnace 28 (processing chamber). The loaded wafer 18 includes a monitor wafer.

  After loading, the furnace port is hermetically closed by the seal cap 33, and the boat 26 is hermetically stored in the processing chamber while holding the wafers 18. While the wafer 18 is heated and a processing gas is introduced into the processing chamber, the wafer 18 is evacuated so as to be maintained at a predetermined pressure, and a required processing is performed on the wafer 18 in the processing furnace 28.

  After the processing, the wafer 18 and the pod 9 are discharged to the outside of the casing 2 in the reverse procedure to the above except for the alignment process of the wafer 18 with a notch aligner (not shown).

  FIG. 3 shows a schematic configuration of a substrate processing system including the substrate processing apparatus 1.

  In FIG. 3, reference numeral 41 denotes a HOST computer as a main management apparatus, and 1a, 1b,..., 1n denote a plurality of substrate processing apparatuses. The host computer 41 is connected to a communication network, for example, a LAN 42, and the control units 49a, 49b, ..., 49n of the substrate processing apparatuses 1a, 1b, ..., 1n are connected to the LAN 42 through relay distributors, for example, the HUB 43. ing.

  The HOST computer 41 controls the operation of the substrate processing apparatuses 1a, 1b,.

  In the online operation, a series of processes such as loading and unloading of the pod 9, process condition designation, process start designation, determination of the type of the boat 26 used corresponding to the process condition, process data collection, etc. are performed by the HOST computer 41. Executed and managed by

  The HOST computer 41 includes a main communication control unit 45, a main calculation control unit 46, a main storage unit 47, and an operation unit 48. The main storage unit 47 automatically receives the substrate processing apparatuses 1a, 1b,. , 49n, a communication program for performing communication with the control units 49a, 49b,..., 49n is stored, and a recipe for executing substrate processing is registered. In the main memory 47, batch processing information for causing the substrate processing apparatuses 1a, 1b,..., 1n to perform batch processing is registered, and the batch processing information is stored in the substrate processing apparatuses 1a, 1b,. , 1n is updated by batch processing result data transmitted via the LAN 42.

  The boat 26 is one of the management targets of the management program, and the type of the boat 26 to be used is determined according to the process conditions, and the cleaning time of the boat 26 is managed according to the substrate processing contents. The management information of these boats 26 is communicated to the control units 49a, 49b, ..., 49n via the LAN 42.

  Each of the control units 49a, 49b,..., 49n includes, for example, the substrate processing apparatus 1a (hereinafter referred to as substrate processing apparatus 1) includes a communication control unit 51, an arithmetic control unit 52, and a storage unit 53. Includes a communication program for communicating with the HOST computer 41, a substrate processing program for executing a recipe, transfer of the pod 9 in the substrate processing apparatus 1, transfer of the wafer 18, loading of the boat 26 , A program required for substrate processing such as a sequence program for executing loading / unloading, process conditions being executed on the display unit (not shown) of the substrate processing apparatus 1, progress of processing, management data of the boat 26 Are stored, a boat management program for using the boat 26 corresponding to the processing contents, and a recipe for substrate processing are registered. Further, the management data of the boat 26 is recorded in the storage unit 53, and the calculation control unit 52, the storage unit 53, the boat management program, etc. constitute a boat management unit.

  As described above, each boat 26 is provided with a code capable of identifying a solid, and boat management data related to the boat solid is stored in the storage unit 53 in association with the code. .

  FIG. 4 shows an example of boat management data.

  The boat management data includes a code for identifying the individual (Code: code assigned to each boat, currently used boat selection), the number of wafers 18 that can be held (the number of slots: the number of stages in the boat slot), the total number of uses ( T. Count: cumulative use number of times the boat has been used for substrate processing), actual use number (A. Count: use number after boat cleaning), and the like.

  Therefore, the boat individual data recorded in the storage unit 53 includes the number of slots, the total number of uses, and the actual number of uses associated with the code. The boat 26 is used for the total use number and the actual use number. Each time it is updated, the number is incremented by one.

  In the storage unit 53, usable boats 26 are registered. Here, the usable boat 26 can be registered from the operation input unit of the substrate processing apparatus 1, or the HOST computer 41 can be registered via the LAN 42.

  FIG. 5 shows a boat management screen 55 displayed on the display unit of the substrate processing apparatus 1 by a display program. The boats 26 registered in the substrate processing apparatus 1 are displayed by codes, and the number of slots for each boat 26 is displayed. The total use count and actual use count are displayed in association with the code. The registered boat 26 in use is displayed as a code in another column as being used.

  The boat management in the substrate processing apparatus 1 will be described with reference to FIG.

  First, information on usable boats 26 (boat management information) is registered.

  Next, the boat 26 corresponding to the substrate processing to be executed is selected.

  Wafers 18 are loaded into the boat 26 and a film forming process is performed.

  When the film forming process is executed, the management data of the boat 26 is updated. As a result of the update, it is determined whether or not the use limit has been reached. If the use limit has not been reached, the use is determined. If the use limit is reached, the boat replacement is determined.

  When it is determined that the usage limit is reached, the boat 26 is replaced with a new boat 26 (or a washed boat), and the boat 26 that has reached the usage limit is subjected to cleaning maintenance.

  When the type of film forming process is changed, the boat 26 is replaced with a boat 26 corresponding to the film forming process.

  The operation of the substrate processing system will be described with reference to FIG.

  When communication between the substrate processing apparatus 1 and the HOST computer 41 is established, the HOST computer 41 instructs the substrate processing apparatus 1 to set boat management data.

  In the substrate processing apparatus 1, in response to the boat management data setting instruction, the boat management data such as the code of the usable boat 26 and the number of slots corresponding to the code, the total number of times of use, the number of times of actual use, etc. 49 is registered. Further, the boat 26 adapted to the substrate processing to be executed from now on, for example, the boat 26 having the BTL001 code shown in FIG. 5 is selected.

  The registered boat management data and the code of the selected boat 26 are transmitted to the HOST computer 41 and corresponding inputs are made.

  In the HOST computer 41, batch information including a recipe and the like for executing substrate processing and boat management data are registered in the substrate processing apparatus 1. The batch information and boat management data suitable for the substrate processing to be executed are transmitted to the substrate processing apparatus 1. The batch information is stored in the storage unit 53 in order to execute substrate processing.

  In the substrate processing apparatus 1, the management data of the boat 26 selected by the substrate processing apparatus 1 is collated with the boat management data transmitted from the HOST computer 41, and the boat management from the HOST computer 41 is verified. If the data matches the boat management data of the boat 26 selected by the substrate processing apparatus 1, the process proceeds to the subsequent steps. If the matching cannot be obtained, the boat 26 registered in the substrate processing apparatus 1 is restored. A selection is made. Since the management data of the boat 26 is collated, misuse of the boat 26 is prevented.

  When the boat management data is matched, a verification result OK signal is transmitted to the HOST computer 41, and the HOST computer 41 further transmits a pod insertion instruction to the substrate processing apparatus 1.

  The pod insertion instruction includes the number of wafers, the type of wafer 18 to be processed, and the like suitable for the substrate processing to be executed. The carrier (pod) information includes carrier ID, carrier type, Lot ID, number of wafers, and wafer. Wafer information such as ID is included.

  The information about the pod (substrate transfer container) 9 stored in the rotary pod shelf 11 or the pod 9 carried into the load port 8 is compared with the pod information of the batch input instruction, and both pods are checked. If the information is matched, a verification result OK signal is transmitted to the HOST computer 41 and batch processing (substrate processing) is started.

  The number of boats used in batch processing is counted up and reported to the HOST computer 41 as batch processing performance data. In the HOST computer 41, it is possible to manage the batch and the boat with the latest data by updating the management data based on the batch processing result data.

  Needless to say, the present invention can be applied to a horizontal substrate processing apparatus and a single-wafer type substrate processing apparatus.

(Appendix)
The present invention includes the following embodiments.

  (Supplementary Note 1) Substrate processing having a processing furnace for storing and processing a substrate, a substrate holder for holding the substrate in the processing furnace, and a control unit for managing the substrate holder and executing the substrate processing In a substrate processing system comprising an apparatus and a main management apparatus that instructs the substrate processing apparatus to execute batch processing of substrates, the control unit is registered with first substrate holder management data, The main management apparatus instructs batch control information including second substrate holder management data to the control unit, and the control unit collates the first substrate holder management data with the second substrate holder management data. If there is consistency between the two substrate holder management data, the substrate processing system executes the substrate processing based on the batch processing information.

  (Supplementary Note 2) The batch processing information includes substrate information about a substrate to be processed and transport container information about a substrate transport container that stores the substrate to be processed, and the control unit includes the instructed substrate information, transport container information, and The substrate processing system according to appendix 1, wherein the substrate information held in the substrate processing apparatus and the transport container information are collated, and if there is consistency, the substrate processing is executed based on the batch processing information.

  (Additional remark 3) It has a processing furnace which stores and processes a substrate, a substrate holder which holds a substrate in the processing furnace, a control unit which manages the substrate holder and executes substrate processing, The control unit includes a management unit in which management data related to a plurality of the substrate holders is registered, selects the substrate holder used for substrate processing based on the management data, and based on the management data A substrate processing apparatus for determining a cleaning time of the substrate holder.

  (Additional remark 4) It is a main management apparatus provided with the memory | storage part in which batch processing information and board | substrate holder management data are stored, and the calculation control part which instruct | indicates batch processing to a substrate processing apparatus, Comprising: The said calculation control part is the said Transmitting verification substrate holder management data for a substrate holder used in the substrate processing apparatus, and based on the batch processing result data transmitted from the substrate processing apparatus after the substrate processing, the batch processing information and the substrate holder A main management device for updating management data.

1 is a schematic perspective view showing a substrate processing apparatus according to an embodiment of the present invention. 1 is a schematic side view showing a substrate processing apparatus according to an embodiment of the present invention. It is a block diagram which shows embodiment of this invention. It is a figure which shows an example of the boat management data in embodiment of this invention. It is a figure which shows the display screen which displays the boat management data in embodiment of this invention. It is explanatory drawing which shows the flow of the boat management by the substrate processing apparatus side in embodiment of this invention. It is explanatory drawing which shows the flow of the information between the HOST computer and substrate processing apparatus boat in embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Pod 11 Rotating pod shelf 18 Wafer 24 Wafer transfer mechanism 26 Boat 28 Processing furnace 41 HOST computer 42 LAN
45 main communication control unit 46 main calculation control unit 49 control unit 52 calculation control unit 53 storage unit

Claims (1)

  A substrate processing apparatus having a processing furnace for storing and processing a substrate, a substrate holder for holding the substrate in the processing furnace, a control unit for managing the substrate holder and executing substrate processing; In a substrate processing system comprising a main management device for instructing a substrate processing apparatus to execute batch processing of substrates, first control data is registered in the control unit, and the main management device Instructs the control unit to execute batch processing information including second substrate holder management data, and the control unit collates the first substrate holder management data with the second substrate holder management data, If there is consistency between the holder management data, the substrate processing system executes substrate processing based on the batch processing information.

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