JP2010122165A - Temperature measuring unit and surface temperature measuring apparatus therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a "temperature measuring unit" capable of measuring the temperature of the heat radiation surface of a heater element such as IC chip under a heat radiation atmosphere simply and stably, and a "surface temperature measuring apparatus" using the same. <P>SOLUTION: Using a temperature measuring unit 3 embracing a thermocouple 6 in a folded-back section 5a prepared at one lateral side of a favorable thermally-conductive sheet 5 and intervening the favorable thermally-conductive sheet 5 between a heat radiation surface 1a of an IC chip 1 being a test object and a heat sink 4 in a hermetically sealed state, the folded-back section 5a is deployed near the heat radiation surface 1a. For example, a graphite sheet 50 on a tacky layer 51 is prepared on one surface while a coating layer 52 is prepared on the other surface is suitable as the thermally-conductive sheet 5. In this case, while the thermocouple 6 can be fixed with the tacky layer 51 existing at the folded-back section 5a, the graphite sheet 50 can be fixed to the heat radiation surface 1a of the IC chip 1 with the tacky layer 51 existing at a residual part except the folded-back section 5a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a temperature measuring unit capable of measuring the temperature of a heat radiating surface of a heating element such as an IC chip used while radiating heat by a heat sink, and a surface temperature measuring apparatus using the temperature measuring unit.

  Since heat-generating elements such as IC chips mounted on a substrate generate a large amount of heat during use and may adversely affect surrounding electronic components, a heat sink has conventionally been installed on the heat-dissipating surface of this type of heat-generating element. Often heat dissipation measures are taken to keep them in close contact. The heat sink is a member having a large surface area made of a material having excellent thermal conductivity such as aluminum, for example, and the heat of the heat radiating surface of the heat generating element can be efficiently released to the heat sink to suppress the temperature rise of the heat radiating surface.

  By the way, as part of the performance test of this type of heat generating element, the temperature of the heat radiating surface of the heat generating element may be measured while performing heat dissipation with a heat sink in the same manner as in actual use conditions. In other words, since the temperature of the heat dissipation surface of the heating element is greatly affected by the surrounding environment such as the heat sink, performance testing under such a heat dissipation environment is required at the prototype stage of a circuit mechanism that incorporates the heating element. It may become.

  However, even if an attempt is made to measure the temperature of the heat dissipation surface of the heating element while performing heat dissipation by the heat sink, this heat dissipation surface is covered with the heat sink and is not exposed. The temperature of the heat radiating surface was indirectly measured by contacting the heat sink near the surface. However, the surface temperature of the heat sink is lower than the temperature of the heat dissipation surface of the heating element, and the temperature difference depends on the ease of heat transfer inside the heat sink, so this method accurately measures the temperature of the heat dissipation surface. It was difficult to do.

Therefore, a temperature sensor such as a thermocouple is attached to the recess or opening provided in the heat sink, and this temperature sensor is brought into contact with the heat dissipation surface of the heating element, so that the temperature of the heat dissipation surface of the heating element is directly measured while performing heat dissipation by the heat sink. A surface temperature measuring device that can be used has been proposed (see, for example, Patent Document 1).
JP 2007-234950 A

  However, in the above-described conventional technique in which the heat sink is provided with a recess or an opening in order to bring the temperature sensor into contact with the heat radiating surface of the heating element, a cutting process or a drilling process is performed to form such a recess or opening in the metal heat sink. There was a complication that had to be done. Further, in such a conventional technique, since the recess and opening of the heat sink in which the temperature sensor is disposed must be provided in a portion close to the heat dissipation surface of the heating element, the heat dissipation efficiency of the heat sink is reduced by such a recess and opening. In addition, there is a problem that variations in the mounting positions of the temperature sensors arranged in the recesses and openings are easily connected to errors in the measured values. That is, even if such a conventional technique is adopted, the temperature of the heat radiation surface of the heat generating element in a heat radiation environment cannot be accurately measured.

  The present invention has been made in view of the actual situation of the prior art, and a first object of the present invention is to provide a temperature measurement unit that can easily and accurately measure the temperature of the heat dissipation surface of the heat generating element in a heat dissipation environment. It is to provide. A second object of the present invention is to provide a surface temperature measuring device which can easily and stably measure the temperature of the heat radiating surface of a heat generating element in a heat radiating environment using such a temperature measuring unit. .

  The present invention uses a temperature measurement unit in which a thermocouple is held in a folded portion provided on one side of a good heat conductive sheet, and this good heat conductive sheet is used as a heat radiation surface of a heating element such as an IC chip. By arranging the folded portion in the vicinity of the heat radiating surface in close contact with the heat sink, the amount of increase in thermal resistance between the heat radiating surface and the heat sink can be made substantially zero with a heat conductive sheet, and the thermoelectric The temperature of the heat radiating surface can be measured based on the temperature of the heat-conductive sheet measured in pairs.

  According to the temperature measurement unit of the present invention, the heat resistance increase amount between the heat dissipation surface and the heat sink can be increased with good heat conduction by interposing the heat transfer sheet in close contact between the heat dissipation surface of the heat generating element and the heat sink. It is possible to make the temperature of the sheet measured by the thermocouple held in the folded portion of the good thermal conductive sheet equal to the temperature of the heat radiating surface. Become. In other words, if this temperature measurement unit is used, it is not necessary to apply special processing to the heat sink, and even if there is some variation in the mounting position of the thermocouple, the measured value will not be affected so much. It becomes possible to easily and stably measure the temperature of the heat dissipation surface of the element.

  In the surface temperature measuring device of the present invention, a good heat conductive sheet is interposed between a heat radiation surface of a heat generating element and a heat sink, and a thermocouple held by a folded portion of the good heat conductive sheet is provided. Since it is arranged in the vicinity of the heat radiating surface, the amount of increase in thermal resistance between the heat radiating surface of the heat generating element and the heat sink can be made substantially zero by the good heat conductive sheet, and good heat conduction measured by a thermocouple. The temperature of the conductive sheet can be regarded as equivalent to the temperature of the heat radiating surface. In other words, with this surface temperature measuring device, it is not necessary to apply special processing to the heat sink, and even if there is some variation in the mounting position of the thermocouple, the measured value will not be affected so much. The temperature of the heat radiation surface can be measured easily and stably.

  The present invention relates to a temperature measurement unit for measuring the temperature of the heat dissipation surface in a heat dissipation environment of a heat generating element used in a state where the heat sink is in close contact with the heat dissipation surface, covering the heat dissipation surface and the heat dissipation surface and the A good heat conductive sheet that is interposed in close contact with the heat sink, and a folded portion provided on one side is disposed in the vicinity of the heat radiating surface, and the folded portion of the good heat conductive sheet A thermocouple hugged, the thermal conductivity in the in-plane direction of the good thermal conductive sheet is substantially equal to the thermal conductivity of the heat radiating surface of the heating element, and the temperature measuring contact portion of the thermocouple Is embedded in the folded portion.

  Since the temperature measuring unit configured in this manner is completed by folding one side of the good heat conductive sheet and holding the thermocouple, it can be manufactured inexpensively and easily. If most of the heat-conductive sheet excluding the folded portion is interposed between the heat-dissipating surface of the heat-generating element and the heat sink so that the heat-generating element generates heat, good heat-conductivity measured by a thermocouple is obtained. The temperature of the heat-sensitive sheet can be regarded as being equivalent to the temperature of the heat radiating surface of the heat generating element, and the amount of increase in thermal resistance between the heat radiating surface and the heat sink can be made substantially zero by the heat-conductive sheet. At this time, even if there is some variation in the mounting position of the thermocouple in the folded portion, the measurement value is not so much affected, so there is little error in the measured value due to variation in the mounting position of the thermocouple. In addition, since it is not necessary to perform special processing on the heat sink, errors in measurement values due to modification of the shape of the heat sink can be avoided.

  In the temperature measurement unit having the above-described configuration, the heat-conductive sheet is made of a graphite sheet having an adhesive layer on one side, and the thermocouple is fixed by the adhesive layer existing on the folded part, and the remaining part excluding the folded part If the graphite sheet is fixed to the heat-dissipating surface of the heating element by the adhesive layer existing in this part, it becomes easy to fix the thermocouple embedded in the folded part, and the graphite sheet has extremely high thermal conductivity Is preferable because it can be easily fixed in close contact with the heat radiating surface of the heat generating element. In this case, when a flexible coating layer is provided on the other surface of the graphite sheet, the bending strength of the good heat conductive sheet is increased, so that the folded portion is easily formed.

  Further, in the temperature measurement unit having the above configuration, when a cylindrical protective case made of a material having a high thermal insulation property is attached to one side portion of the good heat conductive sheet, the folded portion is stored. Since the heat radiation from the folded portion can be suppressed even in an environment where a forced air flow is generated around the heating element by an air cooling fan or the like, the reliability of the measured value can be improved.

  The surface temperature measuring device of the present invention covers a substrate and a heat dissipation surface of a heating element mounted on the substrate in a close contact state, and a folded portion provided on one side is disposed in the vicinity of the heat dissipation surface. A heat-conductive sheet, a thermocouple held in the folded portion of the heat-conductive sheet, and a heat sink fixed to the substrate and in close contact with the other surface of the heat-conductive sheet, The heat conductive sheet has a thermal conductivity in the in-plane direction substantially equal to the thermal conductivity of the heat radiating surface of the heating element, and the temperature measuring contact portion of the thermocouple is embedded in the folded portion, The temperature of the heat conductive sheet was measured by the thermocouple in a state where the heating element was heated.

  The surface temperature measuring apparatus configured as described above is sandwiched between the heat-radiating surface of the heat generating element and the heat sink, and is held by the folded portion of the heat-conductive sheet. Since the thermocouple is disposed in the vicinity of the heat radiating surface, the temperature of the heat conductive sheet measured by the thermocouple can be regarded as equivalent to the temperature of the heat radiating surface of the heating element, and the heat radiating surface The amount of increase in thermal resistance between the heat sink and the heat sink can be made substantially zero by the good heat conductive sheet. At this time, even if there is some variation in the mounting position of the thermocouple in the folded portion, the measurement value is not so much affected, so there is little error in the measured value due to variation in the mounting position of the thermocouple. In addition, since it is not necessary to perform special processing on the heat sink, errors in measurement values due to modification of the shape of the heat sink can be avoided.

  In the surface temperature measuring apparatus having the above configuration, the heat-conductive sheet is made of a graphite sheet having an adhesive layer provided on one side, and the thermocouple is fixed by the adhesive layer existing in the folded portion, and the folded portion is excluded. If the graphite sheet is fixed to the heat radiating surface of the heating element by the adhesive layer existing in the remaining part, it becomes easy to fix the thermocouple embedded in the folded portion, and the selection range of the thermal conductivity is large. It is preferable because a wide graphite sheet can be easily fixed in close contact with the heat radiating surface of the heating element. In this case, when a flexible coating layer is provided on the other surface of the graphite sheet, the bending strength of the good heat conductive sheet is increased, so that the folded portion is easily formed.

  Further, in the surface temperature measuring device having the above-described configuration, when the cylindrical protective case made of a material having a high thermal insulation property is attached to one side portion of the good heat conductive sheet, the folded portion is accommodated. Further, since the heat radiation from the folded portion can be suppressed even in an environment where a forced air flow is generated around the IC chip by an air cooling fan or the like, the reliability of the measured value can be improved.

  An embodiment will be described with reference to the drawings. FIG. 1 is an explanatory view showing a state in which the temperature of the heat radiation surface of the IC chip is measured by the surface temperature measuring apparatus according to the embodiment of the present invention, and FIG. 3 is a perspective view of a temperature measuring unit used in the measuring apparatus, FIG. 3 is a cross-sectional view of the main part of the temperature measuring unit, FIG. 4 is an enlarged view of part A in FIG. 2, and FIG. FIG. 6 is an explanatory diagram showing the layer structure of the good thermal conductive sheet shown in FIG. 5, and FIGS. 7 and 8 are explanatory diagrams showing the manufacturing procedure of the temperature measuring unit. It is.

  The surface temperature measuring apparatus shown in FIG. 1 is for measuring the temperature of the heat radiation surface of an IC chip in a heat radiation environment as part of the performance test of the IC chip, and is a substrate on which the IC chip 1 to be inspected is mounted. 2, a temperature measuring unit 3 that measures the temperature by being brought into close contact with the heat radiating surface 1 a of the IC chip 1, and a heat sink 4 for radiating the heat of the heat radiating surface 1 a to the external space. That is, since the IC chip 1 is used in a heat radiation environment in which the heat sink 4 is in close contact with the heat radiation surface 1a, performance tests such as whether the temperature of the heat radiation surface 1a in the heat radiation environment is within an allowable range are performed. It is measured by this surface temperature measuring device.

  As shown in FIGS. 2 to 4, the temperature measurement unit 3 is configured by a good heat conductive sheet 5 and a thermocouple 6, and a folded portion 5 a provided on one side of the good heat conductive sheet 5 is provided. A thermocouple 6 is held. And the rectangular sheet | seat part 5b except the folding | returning part 5a among the good heat conductive sheets 5 covers the heat radiating surface 1a of the IC chip 1, and is interposed in close contact between the heat radiating surface 1a and the heat sink 4, The folded portion 5a holding the thermocouple 6 is disposed in the vicinity of the heat radiating surface 1a. In addition, the magnitude | size and shape of the square sheet | seat part 5b are equivalent to the thermal radiation surface 1a.

  The heat conductive sheet 5 is composed of a graphite sheet 50 having an adhesive layer 51 on one side and a coating layer 52 on the other side. As is well known, graphite is a material whose thermal conductivity in the plane direction is superior to that in the thickness direction. Therefore, the heat in the in-plane direction of the good thermal conductive sheet 5 is directed toward the folded portion 5a. Conducted well towards. In this embodiment, a PGS graphite sheet manufactured by Panasonic Corporation is used as the graphite sheet 50. The adhesive layer 51 and the coating layer 52 can be appropriately selected from materials having good thermal conductivity. For example, the coating layer 52 is preferably polyethylene terephthalate having high flexibility. In this good heat conductive sheet 5, the thermocouple 6 is fixed by the adhesive layer 51 existing in the folded portion 5a. As shown in FIGS. 3 and 4, most of the thermocouple 6 including the temperature measuring contact portion 6a is formed. The folded portion 5 a holds the thermocouple 6 while being embedded in the adhesive layer 51. Further, when the heat radiation surface 1a of the IC chip 1 is covered with the rectangular sheet portion 5b of the good heat conductive sheet 5, the good heat conductivity sheet 5 is fixed to the heat radiation surface 1a by the adhesive layer 51 existing in the square sheet portion 5b. .

  Next, a manufacturing procedure of the temperature measurement unit 3 will be described. First, as shown in FIGS. 5 and 6, among the release papers covering the adhesive layer 51 coated on one side of the graphite sheet 50, the release paper 7 covering the entire area of the rectangular sheet portion 5 b, and the folded portion The remaining release paper (not shown) is removed, leaving only the strip-like release paper 8 covering a partial region of the extended sheet portion 5c having the shape 5a developed. In FIG. 5, the area covered with the strip-shaped release paper 8 corresponds to the sheet portion 5c existing between the imaginary line B that bisects the extended sheet portion 5c in the lateral direction and the rectangular sheet portion 5b. The right half region shown in the figure corresponds to a central band-like region among the three divided along the virtual line B. Then, by positioning and mounting the thermocouple 6 on the adhesive layer 51 applied to the belt-like region C existing between the belt-like region covered with the release paper 8 and the virtual line B, it is shown in FIG. As described above, the thermocouple 6 is temporarily fixed at a predetermined position on the extended sheet portion 5c.

  When the thermocouple 6 is positioned on the extended sheet portion 5c, it is desirable to place the temperature measuring contact portion 6a directly beside the heat generating source having the highest temperature on the heat radiation surface 1a of the IC chip 1. Therefore, it is preferable to provide a mark or the like as a positioning reference on the release paper 8 in advance so that the thermocouple 6 can be positioned easily and accurately. In addition, after the thermocouple 6 is temporarily fixed on the extended sheet portion 5c, if the heat conductive filling material having good adhesion is applied on the temperature measuring contact portion 6a, the temperature measuring contact portion 6a becomes air. The possibility of contact with can be completely eliminated. A suitable example of such a filling material is Kitagawa Industries Co., Ltd. Change Gel / CGD / CGDR.

  Thereafter, the extended sheet portion 5c is folded back in the vicinity of the imaginary line B into a U-shape, and as shown in FIG. 8, a strip-shaped region existing between the strip-shaped region covered with the release paper 8 and the rectangular sheet portion 5b. On the adhesive layer 51 applied to D (see FIGS. 5 and 6), the adhesive layer 51 applied to the tip portion of the extended sheet portion 5c is overlaid, and the adhesive layers 51 are pressure-bonded. Then, after removing the release paper 8, squeezing is performed on the extended sheet part 5 c in the direction of the arrow in FIG. 8 so as to push out the air around the thermocouple 6, thereby extending the folded sheet part. The pressure-sensitive adhesive layers 51 facing each other are pressed together. As a result, most of the thermocouple 6 including the temperature measuring contact portion 6a is embedded in the adhesive layer 51. Therefore, the extended sheet portion 5c that is crimped in a folded shape and holds the thermocouple 6 is a folded portion. 5a (see FIG. 3), and the temperature measuring unit 3 is completed.

  When measuring the surface temperature of the IC chip using the temperature measuring unit 3 thus manufactured, first, the IC chip 1 to be inspected is mounted on the substrate 2, and the heat radiating surface 1 a of the IC chip 1. The rectangular sheet portion 5b from which the release paper 7 is removed is placed on the upper surface, and the entire surface of the heat radiating surface 1a is covered with the rectangular sheet portion 5b. Since the rectangular sheet portion 5b has the same size and shape as the heat radiating surface 1a, if the adhesive sheet 51 is exposed by removing the release paper 7, the rectangular sheet portion 5b can be easily tightly fixed on the heat radiating surface 1a by the adhesive layer 51. it can. Thereafter, the heat sink 4 is overlaid on the coating layer 52 of the rectangular sheet portion 5 b, and the heat sink 4 is fixed to the substrate 2 using the mounting screws 9. By doing so, the rectangular sheet portion 5b of the temperature measurement unit 3 is sandwiched between the heat radiation surface 1a and the heat sink 4 and is held in close contact with both of them. Moreover, the folding | returning part 5a holding the thermocouple 6 of the temperature measurement unit 3 will be arrange | positioned in the vicinity of the thermal radiation surface 1a, and the thermocouple 6 is connected to the measuring device which is not shown in figure.

  Therefore, when the IC chip 1 shown in FIG. 1 is energized and the heat radiating surface 1a generates heat, the heat is quickly transmitted to the heat sink 4 via the heat conductive sheet 5 having excellent heat conductivity, and the heat sink 4 having a large surface area. The heat is dissipated from the outside to the external space. Moreover, since the good heat conductive sheet 5 is heated to a temperature equivalent to that of the heat radiating surface 1a, by measuring the temperature of the good heat conductive sheet 5 with the thermocouple 6 in the folded portion 5a, The temperature can be measured.

  As described above, in the present embodiment, the rectangular sheet portion 5b of the heat conductive sheet 5 excluding the folded portion 5a is interposed between the heat radiation surface 1a of the IC chip 1 and the heat sink 4 in a close contact state. Since the thermocouple 6 held by the folded portion 5a is arranged in the vicinity of the heat radiating surface 1a, the IC chip 1 is heated and the temperature is measured by the thermocouple 6, so that the thermocouple 6 can be measured. The temperature of the heat conductive sheet 5 can be regarded as being equivalent to the temperature of the heat radiating surface 1a of the IC chip 1, and the increase in thermal resistance between the heat radiating surface 1a and the heat sink 4 is made substantially zero by the heat conductive sheet. Can do. At this time, even if there is some variation in the attachment position of the thermocouple 6 in the folded portion 5a, the measurement value is not significantly affected, and therefore there is little error in the measurement value due to the variation in the attachment position of the thermocouple 6. In addition, since it is not necessary to perform special processing on the heat sink 4, it is possible to avoid errors in measurement values due to the shape modification of the heat sink 4. In addition, the temperature measurement unit 3 is completed by folding one side of the good heat conductive sheet 5 and holding the thermocouple 6, so that it can be manufactured inexpensively and easily. Therefore, according to the present embodiment, the temperature of the heat radiation surface 1a of the IC chip 1 in the heat radiation environment can be measured easily and stably.

  In the above embodiment, the temperature of the heat radiating surface 1a is measured with the folded portion 5a of the good heat conductive sheet 5 exposed in the vicinity of the IC chip 1. However, as shown in FIG. A cylindrical protective case 10 made of a material rich in material may be attached to one side portion of the good heat conductive sheet 5 and the folded portion 5 a may be housed in the protective case 10. When the folded portion 5a is housed in the protective case 10 in this way, heat dissipation from the folded portion 5a is suppressed even in an environment in which forced airflow is generated around the IC chip 1 by an air cooling fan or the like. The reliability of the measured value can be improved. However, in order that the protective case 10 does not impair the air cooling effect, the good heat conductive sheet 5 is preferably set so that the folded portion 5a is located on the downstream side of the airflow with respect to the IC chip 1. Moreover, it is preferable to use a flexible cylindrical resin molded product that can be opened and closed as the protective case 10 because the protective case 10 can be easily attached to one side of the heat-conductive sheet 5.

  Moreover, in the said Example, although the graphite sheet 50 by which the adhesion layer 51 was provided in the single side | surface and the coating layer 52 was provided in the other side is used as the good heat conductive sheet 5, thermal conductivity other than graphite is used. A sheet made of a material having a wide selection range can be substituted, and the coating layer and the adhesive layer can be omitted if the bending strength and shear strength of the sheet are high.

It is explanatory drawing which shows a mode that the temperature of the thermal radiation surface of IC chip is measured by the surface temperature measuring apparatus which concerns on the Example of this invention. It is a perspective view of the temperature measurement unit used for this surface temperature measuring device. It is principal part sectional drawing of this temperature measurement unit. It is an enlarged view of the A section in FIG. It is a top view before the bending process of the good heat conductive sheet which is a component of this temperature measurement unit. It is layer structure explanatory drawing of the good heat conductive sheet shown in FIG. It is explanatory drawing which shows the preparation procedures of this temperature measurement unit. It is explanatory drawing which shows the preparation procedures of this temperature measurement unit. It is principal part sectional drawing which shows the state which attached the protective case to the one side part of the heat conductive sheet with the application example of this temperature measurement unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC chip 1a Heat radiation surface 2 Board | substrate 3 Temperature measurement unit 4 Heat sink 5 Good heat conductive sheet 5a Folding part 5b Square sheet part 6 Thermocouple 6a Temperature measuring contact part 10 Protective case 50 Graphite sheet 51 Adhesive layer 52 Coating layer

Claims (8)

A temperature measurement unit for measuring the temperature of the heat dissipation surface in a heat dissipation environment of a heat generating element used in a state where the heat sink is in close contact with the heat dissipation surface,
A heat-conductive sheet that covers the heat-radiating surface and is interposed in close contact between the heat-radiating surface and the heat sink, and a folded portion provided on one side is disposed in the vicinity of the heat-radiating surface; A thermocouple held in the folded portion of the good thermal conductive sheet, and the thermal conductivity in the in-plane direction of the good thermal conductive sheet is substantially equal to the thermal conductivity of the heat radiating surface of the heating element. And a temperature measuring contact portion of the thermocouple is embedded in the folded portion.   In Claim 1, The said good heat conductive sheet consists of a graphite sheet in which the adhesion layer was provided in the single side | surface, and has fixed the said thermocouple by the said adhesion layer in the said folding | returning part, The said folding | returning part The temperature measurement unit, wherein the graphite sheet is fixed to the heat radiation surface by the adhesive layer existing in the remaining portion excluding.   3. The temperature measuring unit according to claim 2, wherein a coating layer rich in flexibility is provided on the other surface of the graphite sheet.   The tubular protective case made of a material having a high thermal insulation property is attached to one side portion of the good heat conductive sheet to accommodate the folded portion. A temperature measurement unit characterized by that. A good heat conductive sheet that covers the heat dissipation surface of the substrate and the heat generating element mounted on the substrate in a close contact state, and a folded portion provided on one side portion is disposed in the vicinity of the heat dissipation surface; A thermocouple held in the folded portion of the thermally conductive sheet, and a heat sink fixed to the substrate and in close contact with the other surface of the good thermal conductive sheet,
The thermal conductivity sheet has a thermal conductivity in the in-plane direction substantially equal to the thermal conductivity of the heat dissipation surface of the heating element, and the temperature measuring contact portion of the thermocouple is embedded in the folded portion, A surface temperature measuring apparatus, wherein the temperature of the heat-conductive sheet is measured by the thermocouple in a state where the heating element is heated.   In Claim 5, The said good heat conductive sheet consists of a graphite sheet in which the adhesion layer was provided in the single side | surface, and has fixed the said thermocouple by the said adhesion layer which exists in the said folding | turning part, The said folding | turning part The surface temperature measuring apparatus according to claim 1, wherein the graphite sheet is fixed to the heat radiating surface by the adhesive layer existing in a remaining portion excluding.   7. A surface temperature measuring apparatus according to claim 6, wherein a coating layer rich in flexibility is provided on the other surface of the graphite sheet.   The tubular protective case made of a material having a high thermal insulation property is attached to one side portion of the good heat conductive sheet to accommodate the folded portion. A surface temperature measuring device.

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