JP2010118651A - Heat sink, multilayer heat sink, and method of manufacturing heat sink - Google Patents

Abstract

A heat dissipation plate, a multilayer heat dissipation plate, and a method of manufacturing the heat dissipation plate capable of improving the thermal conductivity in the plate thickness direction are provided.
A heat dissipation plate according to the present invention includes a core having a core surface and a hole having a hole shaft facing a hole axis in a direction along a normal direction of the core surface, and is bonded to the core surface and has a hole. And a heat transfer plate filling the inside.
[Selection] Figure 1

Description

  The present invention relates to a radiator plate, a multilayer radiator plate, and a method for manufacturing the radiator plate. In particular, the present invention relates to a radiator plate on which a semiconductor element is mounted, a multilayer radiator plate, and a method for manufacturing the radiator plate.

  A large current of 100 A or more is supplied to a semiconductor element mounted on a circuit board used for industrial machine tools, industrial robots, air conditioner compressors, semiconductor manufacturing equipment, medical equipment, or motor drives of hybrid vehicles. There is a case. In this case, the temperature of the semiconductor element supplied with the current may be 100 ° C. or higher due to heat generation. Heat generated from the semiconductor element greatly affects the reliability and life of each component mounted on the circuit board including the semiconductor element. Therefore, there is a circuit board including a base material, a heat spreader, a heat sink and the like as a circuit board on which the semiconductor element is mounted for the purpose of radiating heat generated by the semiconductor element. A circuit board using a composite material for heat dissipation is also known.

As a conventional heat-dissipating composite material, a composite material comprising an expanded metal formed from a metal plate having a linear expansion coefficient of 8 × 10 ⁻⁶ / ° C. or less and a matrix metal made of copper (Cu) surrounding the expanded metal. It is known (see, for example, Patent Document 1). In addition, as a shape of this expanded metal, it is prescribed | regulated to Japanese Industrial Standard JISG3351 (refer nonpatent literature 1).

  The composite material according to Patent Document 1 can provide a composite material that is excellent in strength and thermal conductivity because the linear expansion coefficient of the composite material is kept small by the expanded metal and the thermal conductivity is secured by the matrix metal. Further, since the expanded metal is wrapped with the matrix metal, the manufacturing cost can be reduced as compared with the case where the hole is formed in the flat metal plate by precision casting or punching.

JP 2003-152144 A

JIS G3351, "Expanded Metals"

  However, the composite material described in Patent Document 1 uses an expanded metal having a large hole diameter in which the diameter of the hole is about 10 to 100 times the plate thickness. On the other hand, when the hole diameter is less than 10 times, the hole axis is inclined with respect to the plate surface, and the hole area ratio is lowered, so that the heat transfer characteristics in the plate thickness direction are good while maintaining a small hole diameter. It is difficult to produce a composite material.

  Therefore, the objective of this invention is providing the manufacturing method of a heat sink, a multilayer heat sink, and a heat sink which can improve the thermal conductivity with respect to a plate | board thickness direction.

  In order to achieve the above object, the present invention provides a core having a core surface, a hole having a hole axis directed in a direction along the normal direction of the core surface, and joining the core surface and filling the hole. A heat radiating plate comprising a hot plate is provided.

  In addition, in the heat dissipation plate, the hole is formed by being surrounded by a plurality of strands, and the core surface is formed by a first core surface formed by one surface of the plurality of strands and the other surface of the plurality of strands. And the second core surface facing the first core surface, and the hole axis may be oriented in a direction along the normal direction of the first core surface and the second core surface. The heat transfer plate includes a first heat conductive plate provided in contact with the first core surface and a second heat conductive plate provided in contact with the second core surface, and the first heat conductive plate and the second heat conductive plate are provided. The conductive plate may be joined by a first heat conductive plate that fills the hole and a second heat conductive plate that fills the hole.

  Further, in the heat sink, the core has a plurality of holes, and a ratio between a distance between one hole of the plurality of holes and another hole adjacent to the one hole and a plate thickness of the heat sink is It may be less than 10. The ratio of the total area of the plurality of holes in the top view to the area of the heat sink may be 10% or more and 90% or less. The core may be formed of a material having a thermal expansion coefficient lower than that of the heat transfer plate, and the heat transfer plate may be formed of a material having a higher thermal conductivity than the core. Alternatively, the heat transfer plate may be formed of a material selected from the group consisting of copper (Cu), aluminum (Al), copper alloy, and aluminum alloy.

  In order to achieve the above object, the present invention provides a first core having a first core surface and a first hole having a hole axis in a direction along a normal direction of the first core surface, A first heat radiating plate having a first heat transfer plate joined to the core surface and filling the first hole, a second core surface, and a hole axis directed in a direction along the normal direction of the second core surface A second core having a second hole and a second heat radiating plate having a second heat transfer plate joined to the flat second smooth surface and filling the second hole. A multilayer heat sink is provided in which two heat sinks are joined.

  In order to achieve the above object, the present invention provides a core material preparation step for preparing a core material having a core surface and a hole having a hole axis directed in a direction along the normal direction of the core surface, and a core material There is provided a method of manufacturing a heat radiating plate comprising a heat transfer plate joining step for joining the heat transfer plate to the surface of the heat sink.

  In the manufacturing method of the heat radiating plate, the core material preparation step is such that the press forming part is provided from the other surface side of the flat plate to the intermittently supplied flat plate toward the lower blade that supports the flat plate on one surface of the flat plate. A cutting process for forming a plurality of cuts on the flat plate by pressing, a pressing process for forming a molded body having a plurality of oblique holes by pressing the plurality of cut portions, and a plurality of the molded body The molded body is compression-molded along the direction of the hole axis of the oblique hole, and has a plurality of holes with a hole axis perpendicular to the plane direction of the molded body, and a core surface perpendicular to the direction of the hole axis is formed. You may prepare the core material obtained through the compression process to form.

  Moreover, the manufacturing method of the said heat sink WHEREIN: A lower blade has a cutting blade which forms several cut | interruptions, and a process type | mold part which is provided adjacent to a cutting blade and presses the part of several cut | interruptions. The cutting process forms a plurality of cuts by pressing the press-molded portion toward the cutting blade, and the press working step is performed by pressing the press-molded portion against the work mold portion. You may form a molded object simultaneously. Furthermore, it may further include a bending step of bending the molded body to correct the direction of the hole axis, and the compression step may form a heat dissipation plate from the molded body subjected to the bending process.

  Moreover, the manufacturing method of the said heat sink WHEREIN: While a cutting process is inclined and supplied with respect to the longitudinal direction of a lower blade, it is on the flat plate supplied with the feed stroke synchronized with the period when a press molding part is pressed on a flat plate. A plurality of cuts may be formed. In the heat transfer plate joining step, the heat transfer plates may be joined using a cold rolling clad method or a warm rolling clad method.

  According to the heat sink and the heat sink manufacturing method according to the present invention, it is possible to provide a heat sink, a multilayer heat sink, and a heat sink manufacturing method that can improve the thermal conductivity in the plate thickness direction.

(A) is a top view of the heat sink which concerns on 1st Embodiment, (b) is AA sectional drawing of (a). It is a figure which shows a part of manufacturing process of the heat sink which concerns on 1st Embodiment. It is a figure which shows the structure just before manufacture of the heat sink which concerns on 1st Embodiment. (A) is a top view of the core material which concerns on 1st Embodiment, (b) is BB sectional drawing of (a). (A) is the elements on larger scale of the hole of the core material which concerns on 1st Embodiment, (b) is bb sectional drawing of (a). It is a figure which shows the manufacturing method of the core material which concerns on 1st Embodiment. It is a figure which shows the manufacturing method of the core material which concerns on 1st Embodiment. It is a figure which shows the flow of the raw material used for manufacture of the core material which concerns on 1st Embodiment. It is a perspective view of the lower blade used for manufacture of the core material which concerns on 1st Embodiment. It is a figure which shows the relationship between the thermal conductivity and thermal expansion coefficient of the heat sink which concerns on 1st Embodiment. It is a schematic diagram of the core material manufacturing apparatus which concerns on 2nd Embodiment. It is sectional drawing of the multilayer heat sink which concerns on 3rd Embodiment. It is a figure which shows the heat conductivity and the through-hole pitch board thickness ratio of the thickness direction of the heat sink which concern on an Example and a comparative example. It is a figure which shows the thermal expansion coefficient of the heat sink which concerns on an Example and a comparative example.

[First Embodiment]
Fig.1 (a) shows the outline | summary of the upper surface of the heat sink which concerns on the 1st Embodiment of this invention, FIG.1 (b) shows the outline | summary of the AA cross section of Fig.1 (a).

(Structure of heat sink 1)
The heat sink 1 according to the first embodiment of the present invention includes a core 10 having a hole 15 formed by being surrounded by a plurality of strands 12, and a first heat conduction plate provided by being joined to the upper surface of the core 10. The first heat transfer plate 20 and the second heat transfer plate 25 as a second heat conductive plate provided to be joined to the lower surface of the core 10 are provided.

  The heat sink 1 according to the present embodiment is formed, for example, with a plate thickness (TIT) of about 0.1 mm to 1 mm. The pitch of the holes 15 according to the present embodiment, that is, the distance between one hole 15 and another hole adjacent to the one hole 15 (hereinafter referred to as “through-hole pitch (LW)”) is For example, it is formed to be about 0.1 mm to 3 mm. However, the heat sink 1 according to the present embodiment has a plate thickness and a through hole pitch at which the ratio (LW / TIT) of the plate thickness (TIT) to the through hole pitch (LW) is less than 10. Moreover, the ratio which occupies with respect to the area in the top view of the heat sink 1 of the sum total of the area in the top view of the some hole 15 which the heat sink 1 has can be 10% or more and 90% or less.

(Core 10)
The core 10 includes a core surface 10a serving as a first core surface joined to a part of the surface of the first heat transfer plate 20 and a core serving as a second core surface joined to a part of the surface of the second heat transfer plate 25. Surface 10b. The core surface 10a is a surface formed by one surface of a plurality of strands, and the core surface 10b is a surface formed by the other surface of the plurality of strands. That is, the core surface 10a and the core surface 10b are opposed to each other. And the hole axis | shaft 15a of the hole 15 which is a micro hole which the core 10 has faces in the orthogonal | vertical direction with respect to the core surface 10a and the core surface 10b. That is, the hole axis 15a faces in the direction along the normal line of the core surface 10a and the normal line of the core surface 10b.

  The core 10 has a plurality of holes 15, and each hole 15 is filled with a material constituting the first heat transfer plate 20 and a material constituting the second heat transfer plate 25. Specifically, the material constituting the first heat transfer plate 20 and the material constituting the second heat transfer plate 25 are joined in the hole 15, whereby the first heat transfer plate 20 and the second heat transfer plate. 25 is connected. Therefore, in this Embodiment, the core 10, the 1st heat exchanger plate 20, and the 2nd heat exchanger plate 25 are united, respectively, and the heat sink 1 is formed.

  The core 10 is formed of a material having a thermal expansion coefficient lower than that of the material constituting the first heat transfer plate 20 and the material constituting the second heat transfer plate 25. For example, the core 10 is formed of an invar material or a super invar material that is a low thermal expansion material having a small thermal expansion coefficient within a normal temperature range. An example of the invar material is an Fe-36Ni alloy containing 36% by weight of Ni and the balance being Fe. The super invar material is, for example, an Fe-32Ni-5Co alloy containing 32 wt% Ni and 5 wt% Co with the balance being Fe.

(First heat transfer plate 20 and second heat transfer plate 25)
The first heat transfer plate 20 and the second heat transfer plate 25 as the heat transfer plates are each formed from a material having a higher thermal conductivity than the thermal conductivity of the material constituting the core 10. Specifically, the first heat transfer plate 20 and the second heat transfer plate 25 are each formed from copper (Cu), aluminum (Al), a copper alloy, or an aluminum alloy. Moreover, the material which comprises the 1st heat exchanger plate 20, and the material which comprises the 2nd heat exchanger plate 25 can also be made into the same material or a different material. The first heat transfer plate 20 and the second heat transfer plate 25 can each be formed from silver (Ag) having a thermal conductivity larger than that of Cu. Further, the first heat transfer plate 20 and the second heat transfer plate 25 can each be formed of carbon (C) having a large anisotropy and an in-plane conductivity larger than Cu.

(Manufacturing method of heat sink 1)
FIG. 2A shows a part of the manufacturing process of the heat sink according to the first embodiment of the present invention, and FIG. 2B shows an example of the structure immediately before the manufacturing of the heat sink according to the first embodiment of the present invention. Indicates.

  First, refer to FIG. 2A. A sheet coil 200 for a first heat transfer plate made of a material to be the first heat transfer plate 20, a sheet coil 250 for a second heat transfer plate made of a material to be the second heat transfer plate 25, and the core 10 A coil around which the core material 100 is wound is prepared. Then, the first heat transfer plate sheet and the second heat transfer plate sheet are pulled out from the first heat transfer plate sheet coil 200 and the second heat transfer plate sheet coil 250, and the core material 100 is pulled out. Next, the first heat transfer plate sheet is bonded to one surface of the core material 100 by the rolling roll 300 and the second heat transfer plate sheet is bonded to the other surface of the core material 100. Thereby, the thermal radiation sheet 2 is manufactured. And the heat sink 1 which concerns on 1st Embodiment is manufactured by cutting out the manufactured heat-radiation sheet 2 to a defined shape.

  In addition, surface treatment can be performed on one surface and the other surface of the core material 100. For example, a fine unevenness is formed on one surface and the other surface of the core material 100 using a wire brush or the like. Thereby, a new surface is formed on one surface and the other surface of the core material 100, and the bondability between the core material 100 and the first heat transfer plate sheet and the second heat transfer plate sheet can be improved. it can.

  Here, the rolling by the rolling roll 300 employs cold clad rolling or warm clad rolling. As a whole, the core material 100 sandwiched between the sheet drawn from the first heat transfer plate sheet coil and the sheet drawn from the second heat transfer plate sheet coil has a reduction reduction ratio of 40% to 55%. Add. By this rolling, the material constituting the sheet drawn from the sheet coil for the first heat transfer plate and the second heat transfer plate for the hole 105 formed by being surrounded by the plurality of strands 102 of the core material 100 The material constituting the sheet drawn out from the sheet coil flows and enters, and both materials are joined in the hole 105. In addition, although the said junction part is small as a reduction | restoration, since it is a part which has deform | transformed greatly, the new surface of both materials appears, and the new surfaces of both materials join. Moreover, both materials and the surface of the core material 100 are joined. Then, after rolling with the rolling roll 300, the heat radiation sheet 2 is manufactured by performing a diffusion heat treatment at a temperature of 600 ° C. or higher and 800 ° C. or lower in a predetermined atmosphere. By performing the diffusion heat treatment, the dissimilar metals (that is, the metal composing both materials and the metal composing the core material 100) are mixed between the two materials and the surface of the core material 100, whereby both the material and the core are mixed. Bondability with the material 100 is improved. That is, by performing diffusion heat treatment, diffusion bonding proceeds between both materials and the core material 100.

  2B shows the positional relationship between the core material 100 and the sheet drawn from the sheet coil for the first heat transfer plate before being rolled by the rolling roll 300, the sheet drawn from the sheet coil for the second heat transfer plate, and FIG. Indicates. That is, the core material 100 is disposed at a position sandwiched between the sheet drawn from the first heat transfer plate sheet coil 200 and the sheet drawn from the second heat transfer plate sheet coil 250. And the sheet pulled out from the core surface 100a and the first heat transfer plate sheet coil 200 by the rolling roll 300, the core surface facing the core surface 100a, and the sheet pulled out from the second heat transfer plate sheet coil 250. The heat radiating sheet 2 is joined.

(Details of core material 100)
Fig.3 (a) shows the outline | summary of the upper surface of the core material which concerns on the 1st Embodiment of this invention, (b) shows the outline | summary of the BB cross section of Fig.3 (a).

  The core material 100 includes a plurality of strands 102 and holes 105 that are surrounded by the plurality of strands 102. A plurality of strands 102 forming one hole 105 are continuously integrated. And the core surface 100a and the core surface 100b facing the core surface 100a are formed by the surface of the some strand 102. FIG. Further, the hole 105 is formed such that the hole axis 105a of the hole 105 is perpendicular to the core surface 100a and the core surface 100b. That is, the normal of the core surface 100a and the normal of the core surface 100b coincide with the direction in which the hole axis 105a faces.

  The plurality of holes 105 provided in the core material 100 are provided by repeating an arrangement in which six other holes 105 are adjacent to one hole 105. Specifically, the plurality of holes 105 are provided in a honeycomb shape. Each of the plurality of holes 105 is formed in a substantially hexagonal shape (or turtle shell shape) when viewed from above. In the modification of the present embodiment, each of the plurality of holes 105 can be formed in a square shape when viewed from above. In the present embodiment, for example, the core material 100 having a large aperture ratio of 65% or more is used.

  Fig.4 (a) shows the elements on larger scale of the hole of the core material which concerns on the 1st Embodiment of this invention, FIG.4 (b) shows the bb cross section of Fig.4 (a).

  In FIG. 4A, the interval between one hole 105 and another hole adjacent to the one hole 105 (hereinafter referred to as “hole pitch in the first direction” or “direction along the width of the cutting blade 52, which will be described later). LW) in some cases. The plate thickness of the core material 100 is W. In this case, in the core material 100 according to the present embodiment, the LW value is formed to be equal to or greater than the W value. In FIG. 4B, T is the thickness of a flat plate that is a raw material of the core material 100. Also, SW is the hole pitch in the second direction, that is, the hole pitch in the direction perpendicular to the first direction (the direction along the width of the cutting blade 52). B represents the bond length. Here, as an example, core material 100 according to the present embodiment has a shape in which the value of LW is equal to or greater than the value of W. For example, the core material 100 in which the LW / W ratio LW / W is 3 or less, preferably 1 or more and 3 or less can be obtained. As an example, a flat plate having a thickness T of 1 mm or less can be used for the purpose of making the thickness W equal to or less than the size of the hole 105.

(Manufacturing method of core material 100)
5A and 5B show the outline of the manufacturing method of the core material according to the first embodiment of the present invention, and FIG. 5C shows the outline of the flow of raw materials used for the manufacture of the core material according to the first embodiment. FIG. 5D is a perspective view of the lower blade used for manufacturing the core material according to the first embodiment.

  Specifically, FIG. 5A shows the outline of the press top dead center position immediately before the press working step. FIG. 5B shows the molded body in the state immediately after the pressing process at the press bottom dead center position and the core material 100 manufactured through the compression process.

  As shown in FIG. 5A, the core material manufacturing apparatus 3 used for manufacturing the core material 100 according to the present embodiment includes an oblique supply roll 30 that supplies a flat plate 5 that is a raw material of the core material 100 to the core material manufacturing apparatus 3. , A press forming part 42 and a lower blade 50 for cutting and pressing the supplied flat plate 5, a bending part 60 and a bending jig 65 for bending the formed body subjected to the cutting and pressing, A smooth compression press unit 44 that performs compression molding on the molded body that has been subjected to the bending process, and a frame feed guide jig 70 that supplies the molded body that has been subjected to the bending process to the smooth compression press unit 44 are provided. Further, the press molding part 42 and the smooth compression press part 44 are held by the die set upper plate 40, and the lower blade 50 and the bending molding part 60 are installed in the die set lower part 45.

  In the present embodiment, the press molding unit 42 and the smooth compression press unit 44 are in the normal direction of the surface of the flat plate 5 supplied to the core material manufacturing apparatus 3 in accordance with the operation of the die set upper plate 40, that is, the vertical direction. To work. In particular, the press molding unit 42 according to the present embodiment operates only in the vertical direction, and is perpendicular to both the supply direction of the flat plate 5 to the core material manufacturing apparatus 3 and the vertical direction (on the paper surface of FIG. 5A). Do not operate in the normal direction.

  The core material manufacturing apparatus 3 performs a cutting process, a pressing process, and a smooth compression process on the flat plate 5 by pressing the die set upper plate 40 against the die set lower part 45 at high speed and intermittently. The core material 100 according to the present embodiment is manufactured. This will be specifically described below. In the following description, the core material 100 according to the present embodiment may be referred to as “fine pore metal”.

(Flat plate supply process)
First, the flat plate 5 (for example, a solid flat plate coil) that is a material of the core material 100 is tilted with respect to the longitudinal direction of the lower blade 50 via the oblique supply roll 30, and directed toward the press forming portion 42 and the lower blade 50. Supply intermittently. Specifically, as shown in FIG. 5C, the longitudinal direction of the flat plate 5 is inclined by an angle α with respect to a cutting position 400 where a plurality of cuts are formed by the press forming portion 42 and the lower blade 50 described later. Is supplied to the core material manufacturing apparatus 3. The flat plate 5 is supplied to the core material manufacturing apparatus 3 along the supply direction 420 inclined by the angle α with respect to the cutting position 400 (FIG. 5C). Further, the flat plate 5 is supplied to the core material manufacturing apparatus 3 with a feed stroke synchronized with a cycle (hereinafter referred to as “cutting cycle”) in which the press-molded portion 42 is pressed against one surface of the flat plate 5.

  Here, the angle α is an angle calculated from the following equation.

  Moreover, the speed | rate (feeding speed) which supplies the flat plate 5 to the core material manufacturing apparatus 3 shall be the speed prescribed | regulated by the following formula | equation per 1 stroke of a press. That is, in this embodiment, the feed rate is synchronized with the cutting cycle. The press indicates that the press molding portion 42 is pressed against the lower blade 50 to cut a part of the flat plate 5, and the core material of the flat plate 5 is pressed when the press molding portion 42 is pressed against the lower blade 50. The feed speed to the manufacturing apparatus 3 is substantially zero, and when the press forming portion 42 is separated from the lower blade 50, the feed speed of the flat plate 5 to the core material manufacturing apparatus 3 is a speed defined by the following expression.

  In “Equation 2”, “W” is a feed width per stroke of the flat plate 5 when the flat plate 5 is supplied to the core material manufacturing apparatus 3. That is, a cut is formed in the flat plate 5 for each “W” as shown in FIG. 5A, and “W” corresponds to the step width of the flat plate 5.

(Cutting process and pressing process)
Next, the flat plate 5 supplied between the press forming part 42 and the lower blade 50 is supported by the lower blade 50 on one surface of the flat plate 5, and the press forming unit 42 presses from the other surface side of the flat plate 5. Applied (FIG. 5B). Thereby, a several cut | interruption is formed in the flat plate 5 (cutting process). And the press molding part 42 performs a press process with respect to a some cut simultaneously with formation of a some cut, and forms the molded object which has a some diagonal hole from a some cut (press work process). Tangent lines of corner portions of the plurality of step portions 7 of the molded body become the molded body surface 8. In the present embodiment, the oblique hole means a hole whose hole axis is inclined with respect to the surface of the molded body. Further, “simultaneously” means “a series” or “sequentially”.

  Moreover, in the modification of this Embodiment, a cutting process and a press work process can also be implemented as follows. That is, first, a plurality of cuts are formed in the flat plate 5 in the cutting process. And a manufacturing process is once stopped at the time of forming several cut | interruptions (stop process). Subsequently, a pressing process can be performed. In still another modification, a cutting process including a multi-stage cutting operation can be used.

  Specifically, the press forming part 42 according to the present embodiment has a wave-shaped wave blade 42a. On the other hand, as shown in FIG. 5D, the lower blade 50 is provided adjacent to the cutting blade 52 that forms a plurality of cuts in the flat plate 5 and the cutting blade 52, and presses each of the plurality of cut portions. And a processing part 54 having a substantially waveform. That is, the upper end of the lower blade 50 has a shape in which the cutting blade 52 and the machining die portion 54 are continuously arranged.

  The cutting process and the pressing process will be described in more detail. First, in the flat plate 5 supplied between the press forming part 42 and the lower blade 50, a plurality of intermittent cuts are formed by the wave blade 42a of the press forming part 42 and the cutting blade 52 of the lower blade 50 ( For example, staggered cuts are formed on the flat plate 5). That is, the wave blade 42 a is pressed toward the cutting blade 52, thereby forming a plurality of cuts on the flat plate 5. And the precision press work (for example, precise waveform processing) is given to each part of a plurality of cuts by wave cutting edge 42a and the precision processing die part which is processing die part 54. That is, when the wave blades 42a are pressed toward the machining die portion 54, diagonal holes are formed in a staggered pattern from each of the plurality of cuts. Thereby, the molded object which has the diagonal hole arranged with a short pitch with respect to the plate | board thickness of the flat plate 5 is formed. As an example, the ratio of the plate thickness of the flat plate 5 to the pitch can be about 2 to 3, and in this case, the pitch can be made close to the plate thickness. The formed body in which the oblique holes are formed is conveyed from the press forming part 42 and the lower blade 50 in a direction oblique to the operation direction of the press forming part 42. It should be noted that the hole pitch in the direction along the width of the cutting blade 52 and the hole pitch in the direction perpendicular to the direction along the width of the cutting blade 52 are the pitch of the unevenness of the cutting blade 52 immediately after the cutting step. The pitch is substantially the same, and after the pressing process, the pitch is different from the uneven pitch of the cutting blade 52.

  Since the lower blade 50 according to the present embodiment includes the cutting blade 52 and the processing die portion 54, the cutting and pressing are simultaneously performed on the flat plate 5. After going through the cutting process and the pressing process, the flat plate 5 becomes a molded body having a plurality of oblique holes. As shown in FIG. 5C, the molded body is supplied to the bending molding unit 60 along the conveyance direction 422. That is, in the present embodiment, the supply direction 420 of the flat plate 5 with respect to the core material plate manufacturing apparatus 3 changes to a transport direction 422 in a direction different from the supply direction 420 at the cutting position 400.

  Here, the conveyance direction 422 is inclined by an angle β with respect to the cutting position 400 as shown in FIG. 5C. The angle β is defined by the following equation.

(Bending process)
Next, by passing the molded body between the bending molded part 60 and the bending jig 65, the molded body is bent to correct the hole axial direction of the oblique holes (bending process). That is, by bending the molded body that has undergone the cutting process and the pressing process by the bending part 60 and the bending jig 65, the hole axes of the plurality of oblique holes are aligned in one direction. Specifically, the hole axes of the plurality of oblique holes are aligned in a direction along the operation direction of the smooth compression press unit 44 described later. That is, as the molded body is conveyed along the conveying direction 422 while being pressed against the bending portion 60 by the bending jig 65, the hole axis of the oblique holes of the molded body is gradually rotated with respect to the conveying direction 422. Then, a molded body in which the hole shaft of the oblique hole is rotated by approximately 90 ° with respect to the hole shaft immediately after the cutting process and the press working process is supplied to the smooth compression press unit 44.

  The formed body in which the directions of the hole axes of the plurality of oblique holes are aligned is supplied to the smooth compression press unit 44 by the frame feed guide jig 70. That is, the compact is supplied to the smooth compression press unit 44 “one frame” at a time. Here, “one frame” refers to a unit in which a portion where a plurality of oblique holes of the molded body are arranged in a line in a straight line.

(Compression process)
Next, the molded body supplied to the smooth compression press unit 44 frame by frame by the frame feed guide jig 70 is along the direction along the hole axis of the hole of the molded body, that is, along the direction horizontal to the hole axis. It is compression-molded by the smooth compression press part 44 which moves up and down (compression process, FIG. 5B). The compression molding is performed on the stepped portion 1a of the molded body conveyed between the smooth compression press portion 44 and the receiving portion 45a. Thereby, the core material 100 whose plate | board thickness is "W" is manufactured. In the present embodiment, the plate thickness “W” of the core material 100 coincides with the feed width at which the flat plate 5 is supplied to the press-forming portion 42 and the lower blade 50.

  Subsequently, the core material 100 in which a plurality of holes 105 having a hole axis perpendicular to the core surface 100a is formed is carried out of the core material manufacturing apparatus 3 along the carry-out direction 424 (FIG. 5C). When the stepped portion 100c is compression-molded, the core material 100 unloaded from the core material manufacturing apparatus 3 has a core surface 100a and a core surface 100b that are smooth surfaces. Here, the core surface 100b is a surface facing the core surface 100a. In addition, when the core material 100 is carried out of the core material manufacturing apparatus 3 from the compression press position 410 where the smooth compression press unit 44 compresses the molded body, the unloading direction 424 is the compression press position 410. Changes by an angle γ. Note that the angle γ varies depending on the material of the flat plate 5 that is a raw material of the core material 100, the shapes of the plurality of holes 105, and the like.

(Modification)
In the modified example of the manufacturing method of the core material 100 according to the first embodiment, the press molding unit 42 is pressed not only in the vertical direction but also every time the press molding unit 42 is pressed against the lower blade 50. The unit 42 can also be operated with a half-pitch shift in the normal direction (lateral direction) of the paper surface of FIG. 5A. In this case, both the press molding part 42 and the lower blade 50 are reciprocated in a direction perpendicular to the operation direction of the press molding part 42. That is, the press molding part 42 is pressed with respect to the lower blade 50, and the lower blade 50 is pressed with respect to the press molding part 42 while being shifted every half pitch. And by making the structure of the lower blade 50 into a shape that can respond to the operation in the lateral direction of the press molding part 42, the direction of the plurality of cuts formed in the flat plate 5 can be matched with the direction of the molded body. it can.

(Characteristics and cross-sectional configuration of heat sink)
The thermal conductivity and thermal expansion coefficient of the heat sink 1 including the core 10 made of Invar material, the first heat transfer plate 20 made of copper, and the second heat transfer plate 25 made of copper are the core 10, the first heat transfer plate. 20 and the values of the thermal conductivity and thermal expansion coefficient of the second heat transfer plate 25 can be calculated.

  First, when a core (solid clad material) having no holes 10 is used, the heat of a heat sink (hereinafter referred to as “Cu / Inver / Cu material (CIC material)”) in which copper is bonded to the surface of the core. The conductivity is expressed by the following “Equation 4” in the plate surface direction and by the following “Equation 5” in the plate thickness direction.

  In the case of the heat radiating plate 1 according to the first embodiment, the thermal conductivity in the thickness direction of the heat radiating plate 1 is expressed by the following equation (6).

  In addition, in the equations of “Equation 4” to “Equation 6”, λ1 is the thermal conductivity of the core, and λ2 is the thermal conductivity of copper. Further, f1 is a cross-sectional ratio of the core (Inver's cross-sectional ratio, hereinafter may be referred to as “Inver ratio”), and f2 is a cross-sectional ratio of copper. Л1 is the thickness of the core (Inver thickness), and Л2 is the thickness of the copper layer on the surface (that is, the first heat transfer plate and the second heat transfer plate). Furthermore, η is the penetration rate of copper (cross-sectional ratio of copper in the core hole). For example, the copper penetration rate η is approximately obtained by dividing the maximum diameter of the hole 15 by the total value of the width of the strand 12 and the maximum diameter of the hole 15 when the heat sink 1 is viewed from above. be able to. For example, when the penetration rate η is 0%, it indicates a CIC material. In addition, the cross-sectional ratio f1 of the core and the cross-sectional ratio f2 of the copper can be obtained from the following formulas “Expression 7” and “Expression 8”.

  Furthermore, the thermal expansion coefficient in the plate surface direction (that is, the direction perpendicular to the plate thickness direction) is a weighted average value of the Young's modulus of the invar material (Inver material) and the copper Young's modulus constituting the core. It can be calculated by the following “Equation 9”. The Invar material has a Young's modulus of 142 GPa and copper has a Young's modulus of 136 GPa. Here, in “Equation 9”, ρ1 is the thermal expansion coefficient of the Invar material, and ρ2 is the thermal expansion coefficient of copper.

  FIG. 6 shows the relationship between the thermal conductivity and the thermal expansion coefficient of the heat sink according to the first embodiment of the present invention.

  In FIG. 6, the penetration rate is represented as “η” and the cross-sectional ratio of the core is represented as “Inver ratio”. Each curved marking indicates that the thermal conductivity changes due to the difference in the Inver ratio at each penetration rate, and it is shown that the thermal conductivity gradually decreases as the Inver ratio increases. ing. In the region where the Inver ratio increases from over 20% to 100%, the thermal conductivity gradually decreases as the Inver ratio increases.

  Specifically, the Inver ratio is 100%, 80%, 71%, 60% from the left side (the side where the thermal expansion coefficient is small) to the right side (the side where the thermal expansion coefficient is large) in FIG. 50%, 33%, 25%, 20%, 5% (in FIG. 6, as an example, among the markings of the Inver ratio on the curve of η = 20%, the Inver ratio is 100%, 71 %, 50% and 20% positions are indicated). The decrease in the Inver ratio corresponds to the thickness of the core 10 (invar material) gradually decreasing with respect to the thickness of the heat sink 1 as the Inver ratio decreases.

  For example, when the penetration rate η is 20%, the heat is increased at a higher rate than when the Inver ratio is around 25% to the Inver ratio is around 20%, and between the Inver ratio is 100% and the Inver ratio is 25%. Conductivity increases. When the Inver ratio is changed from 20% to 5%, the thermal conductivity is rapidly increased. Such a change in the thermal conductivity shows a substantially similar tendency when the penetration rate is 0%, 40%, 50%, 60%, 80%, and 90%.

  FIG. 6 shows the result of expressing the relational expression between the thermal conductivity λt of the heat sink and the thermal expansion coefficient ρ from the formulas “Equation 4” to “Equation 9”. The thermal expansion coefficient on the horizontal axis in FIG. 6 substantially corresponds to the cross-sectional configuration ratio. Further, the thermal conductivity on the vertical axis in FIG. 6 changes according to the cross-sectional configuration ratio. The cross-sectional configuration ratio refers to both the Inver cross-sectional ratio and the copper penetration rate.

  In the case of a CIC material formed using a solid clad material, the thermal conductivity in the direction of the plate surface is expressed by an expression of “Equation 4” and changes linearly according to the change in the cross-sectional configuration ratio. On the other hand, the thermal conductivity in the plate thickness direction of the CIC material changes along a curved line represented by an expression of “Equation 5”. As can be seen from FIG. 6, in the CIC material, it can be seen that the thermal conductivity in the plate thickness direction rapidly decreases when the Inver ratio is 20% or more.

  On the other hand, the heat sink 1 using the core 10 according to the first embodiment of the present invention has a straight line represented by the formula of “Equation 4” according to the ratio of the penetration rate and the cross-sectional configuration ratio, A value corresponding to an arbitrary point in the region surrounded by the curve represented by the formula of “Equation 5” can be adopted. The penetration rate changes according to the thermal conductivity in the plate thickness direction. That is, the heat radiating plate 1 having a higher thermal conductivity is obtained when the penetration rate is higher than when the penetration rate is low. In the present embodiment, a straight line represented by the formula (4) in a region surrounded by the straight line represented by the formula (4) and the curve represented by the formula (5). In the range up to the vicinity (that is, excluding the linear shape), the penetration rate and the cross-sectional configuration ratio can be determined.

  In the heat radiating plate 1 according to the first embodiment of the present invention, for example, the thermal conductivity in the plate thickness direction is approximated to the thermal conductivity in the plate surface direction, and is expressed by, for example, an expression of “Equation 4”. In the region surrounded by the straight line and the curve expressed by the formula (5), the penetration rate η is in the range of about 40% to 60%, and the Inver ratio is 50% to 70%. It can be set as the structure which becomes in the range of about%. For example, by reducing the thickness of the first heat transfer plate 20 and the thickness of the second heat transfer plate 25 in the cross section of the heat radiating plate 1, the thermal conductivity in the plate thickness direction can be increased.

  In addition, if a heat sink is manufactured using an expanded metal whose hole axis is inclined with respect to the plate surface, the material constituting the first heat transfer plate 20 and the second heat transfer plate 25 is sufficiently contained in the hole. Does not invade. Therefore, in this case, the thermal conductivity in the plate thickness direction is halved compared to the heat radiating plate 1 according to the present embodiment.

(Effects of the first embodiment)
In the heat radiating plate 1 according to the first embodiment of the present invention, the core 10 has a plurality of holes 15 having a diameter as small as the thickness of the core 10, and the core 10 has a plurality of holes 15. Since the hole axis of the hole 15 is perpendicular to the surface of the heat radiating plate 1 and the aperture ratio can be increased, the first heat transfer plate 20 and the second heat transfer plate 25 are appropriate in the plurality of holes 15. To join. That is, when the hole 15 according to the present embodiment is formed, the region where the material constituting the first heat transfer plate 20 and the material constituting the second heat transfer plate 25 are joined can be increased, and the penetration rate can be increased. Can be big. Thereby, according to this Embodiment, the heat sink 1 with favorable thermal conductivity of a plate | board thickness direction can be provided.

  That is, according to the heat sink 1 according to the first embodiment, the material constituting the first heat transfer plate 20 in the hole 15 and the second heat transfer with respect to the cross-sectional ratio of the core 10 in the cross section of the heat sink 1. Since the cross-sectional ratio of the material constituting the heat plate 25 is relatively large, the thermal expansion coefficient in the in-plane direction of the heat radiating plate 1 can be lowered and the thermal conductivity in the thickness direction can be increased. Therefore, the heat sink 1 according to the present embodiment can be applied to a member of a semiconductor circuit on which a semiconductor element that supplies a large current is mounted, for example.

Moreover, since the heat sink 1 which concerns on this Embodiment can be manufactured from an invar material and copper, or an invar material and aluminum, or an invar material, copper, and aluminum, copper and molybdenum, or copper and tungsten The heat sink 1 can be provided at a lower cost compared to the case of using. And the heat sink 1 which concerns on this Embodiment can be used for the use as which low thermal expansion and the high heat dissipation in a plate | board thickness direction are requested | required. For example, the heat sink 1 according to the present embodiment is a low linear expansion material such as silicon (Si) or silicon carbide (SiC) (for example, the linear expansion coefficient of Si is about 4 × 10 ⁻⁶ (1 / K). It can be used as a heat sink for a semiconductor element formed mainly from the heat sink 1 to the semiconductor due to the thermal stress generated by the difference between the linear expansion coefficient of the heat sink 1 and the linear expansion coefficient of the semiconductor element. It can suppress that an element peels.

  Furthermore, in the embodiment of the present invention, it is surrounded by a straight line expressed by the formula 4 and a curve expressed by the formula 5 according to the ratio of the penetration rate and the cross-sectional configuration ratio. A value corresponding to an arbitrary point in the defined area can be adopted. For example, the heat radiating plate 1 having a thermal conductivity in the thickness direction near the straight line represented by the formula (4) and a thermal expansion coefficient can be used. Can be formed. Thereby, for example, it is possible to provide an inexpensive heat radiating plate 1 having characteristics equal to or higher than those of a low thermal expansion heat radiating plate such as Cu-W, Cu-Mo, and Low Expansion Copper (L-COP).

[Second Embodiment]
FIG. 7 shows an outline of a core material manufacturing apparatus according to the second embodiment of the present invention.

  The manufacturing method of the core material 100 according to the second embodiment is the same as the manufacturing method of the core material 100 according to the first embodiment except that there is no bending process and the compression process is different. The manufacturing method of the core material 100 according to the embodiment has substantially the same configuration. Therefore, detailed description is omitted except for the differences. In addition, the core material 100 which concerns on 2nd Embodiment is equipped with the same structure as the core material 100 which concerns on 1st Embodiment in the state after manufacture.

  As shown in FIG. 7, the core material manufacturing apparatus 3a according to the second embodiment includes an oblique supply roll 30 that supplies the flat plate 5 to the core material manufacturing apparatus 3a, and cutting and pressing the supplied flat plate 5. The press molding part 42 and the lower blade 50 which process are provided, and the smooth compression press part 46 and the compression molding part 56 which perform compression molding with respect to the molded object to which the cutting | disconnection and press work were given.

  First, the compact conveyed from the press molding part 42 and the lower blade 50 is conveyed along a direction horizontal to the operation direction of the press molding part 42. And the lower blade 50 which concerns on this Embodiment is further provided with the compression molding part 56 in the side surface, and performs the compression press to the molded object which has an oblique hole by the smooth compression press part 46 and the compression molding part 56. FIG.

  As an example, the slope 41 a of the pressing portion 41 included in the die set upper plate 40 presses the slope 46 b provided on the end portion 46 a of the smooth compression press portion 46 in accordance with the operation of the press molding portion 42. And the smooth compression press part 46 works toward the direction of the compression molding part 56 according to the said press. The smooth compression press unit 46 performs compression molding on the molded body between the smooth compression press unit 46 and the compression molding unit 56. By performing compression molding, the molded body becomes the core material 100, and the core material 100 is carried out of the core material manufacturing apparatus 3 a through the opening 45 b of the die set lower part 45.

  In the modification of 2nd Embodiment, it can also be set as the structure which does not provide the press part 41 and the edge part 46a. That is, in the modified example of the second embodiment, the plus molding part 42 and the smooth compression press part 46 are operated independently. For example, the smooth compression press unit 46 operates toward the compression molding unit 56 after the cutting step. The smooth compression press unit 46 performs compression molding on the molded body between the smooth compression press unit 46 and the compression molding unit 56.

[Third Embodiment]
FIG. 8 shows an outline of a cross section of a multilayer heat sink according to the third embodiment of the present invention.

  The multilayer radiator plate according to the third embodiment has the same configuration as that of the radiator plate 1 according to the first embodiment, except that the multilayer radiator plate has a configuration in which the radiator plate 1 according to the first embodiment is laminated. Is provided. Therefore, a detailed description is omitted except for differences.

  The multilayer heat sink according to the third embodiment has a configuration in which two heat sinks 1 are laminated. That is, in FIG. 8, one heat sink 1 as a first heat sink is a first core surface 10a as a first core surface, and a hole axis 10a is directed in a direction along the normal direction of the core surface 10a. It has the core 10 as a 1st core which has the hole 15 as a hole, and the 1st heat exchanger plate 20 which fills the inside of the hole 15 while joining to the core surface 10a. The other heat radiating plate 1 as the second heat radiating plate has a core surface 10a as the second core surface and a hole as a second hole with the hole axis 10a facing in the direction along the normal direction of the core surface 10a. 15, and a second heat transfer plate 20 that joins the core surface 10 a and fills the hole 15. And the multilayer heat sink which concerns on 3rd Embodiment is comprised by joining a 1st heat exchanger plate and a 2nd heat exchanger plate.

  The joining of one heat sink 1 and the other heat sink 2 is performed by, for example, cold-welding the first heat transfer plate 20 of one heat sink 1 and the second heat transfer plate 25 of the other heat sink 1, It can be carried out by diffusion bonding, bonding using high-temperature solder, or bonding using a low-temperature brazing material. Thereby, for example, a multilayer heat sink having a cross-sectional thickness exceeding 1.5 mm can be formed. In addition, in the modification of 3rd Embodiment, the multilayer heat sink which laminated | stacked the 3 or more heat sink 1 can also be formed.

  As an example of the present invention, Fe-36Ni was used as a material constituting the core 10. And the core material 100 was manufactured with the manufacturing method of the core material demonstrated in 1st Embodiment. Then, the heat sink which concerns on an Example was manufactured with the manufacturing method of the heat sink demonstrated in 1st Embodiment using the manufactured core material 100. FIG. Both the first heat transfer plate 20 and the second heat transfer plate 25 were made of copper.

  Specifically, the thickness (TI), hole pitch (LW1), hole axis inclination value of the core material 100 according to the example, the thickness (TIT) of the heat sink according to the example, the copper penetration rate (η ), Through-hole pitch (LW), through-hole pitch plate thickness ratio (LW / TIT), Inver ratio (I), thermal expansion coefficient, and thermal conductivity value (λ) are shown in Table 1. Here, the through-hole pitch LW is, for example, the distance between the hole axis 15 a of one hole 15 of the heat sink 1 and the hole axis 15 a of another hole 15 adjacent to the one hole 15. In Table 1, each value of the core and the heat sink according to the comparative example, and a copper sheet (sheet coil for the first heat transfer plate) as a material constituting the first heat transfer plate 20 and the second heat transfer plate 25 are shown. The thickness of the sheet and the sheet of the sheet coil for the second heat transfer plate) is shown as a copper plate thickness.

  In the examples (Examples 1 to 4), the thickness of the core material 100 was set to 0.2 mm to 1 mm. The hole pitch was set to 0.24 mm to 1.2 mm. The hole axes of the holes of the core material 100 according to Examples 1 to 4 are all perpendicular to the plate surface. In each of Examples 1 to 4, the copper sheet (the sheet drawn from the sheet coil for the first heat transfer plate and the second heat transfer) having a thickness at which the Inver ratio becomes a predetermined value is formed on the upper and lower surfaces of the core material 100. Sheets drawn from the sheet coil for plate) were stacked and rolled. The thickness of the copper sheet is as shown in Table 1. Rolling was performed under conditions where no intermetallic compound was generated between the core material 100 and the copper sheet.

  Subsequently to the rolling, diffusion heat treatment at about 600 ° C. was performed. Thereby, although the material which comprises each mutually was diffused between the core material 100 which has a fine hole, and a copper sheet, it became the joined state in which the intermetallic compound was not produced | generated. Note that the rolling was performed at a working degree of about 50%. Thereby, the heat-radiation sheet was manufactured in each of Examples 1 to 4. And the heat sink which concerns on each of Example 1 thru | or 4 was manufactured by cut | disconnecting the heat radiating sheet which concerns on Example 1 thru | or 4 to predetermined size.

  On the other hand, the heat sinks according to Comparative Examples 1 to 3 are made of the same material as that of each of Examples 1 to 4, and the expanded metal having fine holes subjected to only cutting and pressing is rolled to smooth the surface. The core used was used. This is because it is difficult to produce an expanded metal having a hole having a small diameter with respect to the plate thickness by a conventional method for producing an expanded metal. Since this fine expanded metal was not subjected to the bending process performed in the examples, the hole axis was inclined with respect to the plate surface. Moreover, the heat sink which concerns on the comparative examples 4 and 5 was formed using the core which does not have a hole. That is, the heat sink according to Comparative Examples 4 and 5 is a CIC material.

  Then, the thermal conductivity and the through-hole pitch plate thickness ratio in the thickness direction of each of Examples 1 to 4 and Comparative Examples 1 to 5 were evaluated. In both examples and comparative examples, the case where the Inver ratio was 50% and the case where the ratio was about 30% were typically produced.

  FIG. 9 shows the thermal conductivity in the thickness direction and the through-hole pitch plate thickness ratio of the heat radiating plates according to Examples and Comparative Examples. Moreover, FIG. 10 shows the thermal expansion coefficient of the heat sink which concerns on an Example and a comparative example.

In the heat sinks according to Examples 1 to 4, as shown in FIG. 10, the thermal expansion coefficient is 8.9 to 11.9 × 10 ⁻⁶ (/ ° C. · m), and according to Comparative Examples 1 to 5. The thermal expansion coefficient of the heat radiating plate was 8.4 to 12.0 × 10 ⁻⁶ (/ ° C. · m).

  Moreover, in the heat sink which concerns on the comparative example 4, as shown in FIG. 9, the heat conductivity of thickness direction (plate thickness direction) is 21 (W / degreeC * m), and the heat sink which concerns on the comparative example 5 Was 31 (W / ° C. · m). The thermal conductivity in the in-plane direction of the heat sink according to Comparative Example 4 is 200 (W / ° C. · m) although not shown in Table 1, and the heat conductivity in the in-plane direction of the heat sink according to Comparative Example 5 is shown. Considering that the rate was 260 (W / ° C. · m), the thermal conductivity in the thickness direction of the heat sinks according to Comparative Examples 4 and 5 was an order of magnitude higher than the thermal conductivity in the in-plane direction. It was small.

  Here, in Examples 1 and 2, the through-hole pitches were 2.4 mm and 2.2 mm, respectively, 1 mm in Example 3, and 0.4 mm in Example 4. Moreover, about Inver ratio, Example 1 and 3 is 50%, and Example 2 and 4 is 31%. And the heat conductivity of the thickness direction of the heat sink which concerns on Example 1 and 3 is 163 (W / degreeC * m), and in the heat sink concerning Examples 2 and 4, 221 (W / degreeC * m) )Met. In the heat sinks according to Examples 1 to 4, the thermal conductivity in the thickness direction is in the in-plane direction of the CIC material (for example, Comparative Examples 4 and 5) (for example, 200 to 260 (W / ° C. · m)).

  Moreover, the heat conductivity of the thickness direction of the heat sink which concerns on the comparative examples 1 and 2 is 95 to 101 (W / degreeC * m), and was improved compared with the heat sink which concerns on the comparative examples 4 and 5. . However, compared with the heat sinks according to Examples 1 to 4, the heat sinks according to Examples 1 to 4 showed higher thermal conductivity. This is considered to be because it is difficult to improve the thermal conductivity in the thickness direction because the holes of the cores according to Comparative Examples 1 and 2 are inclined with respect to the plate surface.

  Moreover, although the heat conductivity of the heat sink which concerns on the comparative example 3 was 180 (W / degreeC * m), a through-hole pitch is 39 (mm) and implement | achieves the heat sink which has a fine hole. It is difficult. That is, the heat sinks according to Examples 1 to 4 have a through-hole pitch of 0.4 mm to 2.4 mm, and a plurality of fine holes are provided in the core at extremely short intervals. It has a structure filled with conductive copper. Thereby, for example, when the heat sink is cut out to a size suitable for a semiconductor element such as an integrated circuit (IC), the difference described below between the heat sink according to Comparative Example 3 and the heat sink according to Examples 1 to 4 is described. Occurs.

  That is, in the case of the heat radiating plate according to Comparative Example 3, at the time of cutting out the heat radiating plate, either the heat radiating plate composed mostly of the heat transfer plate or the heat radiating plate composed mostly of the core is cut out. It is. On the other hand, in the case of the heat radiating plate according to Examples 1 to 4, since it has the through-hole pitch of the narrow pitch as described above, even when the heat radiating plate is cut out, the core and the copper formed from the invar material A heat radiating plate including a heat transfer plate made of a proper ratio can be obtained. In addition, since the hole axis | shaft with which the heat sink which concerns on the comparative example 3 is equipped with has a hole axis | shaft inclined with respect to a plate surface, when trying to narrow a through-hole pitch to the same extent as the heat sink which concerns on Example 1 thru | or 4. Since the aperture ratio is also reduced at the same time, there is a limit to improving the thermal conductivity in the thickness direction.

  While the embodiments and examples of the present invention have been described above, the embodiments and examples described above do not limit the invention according to the claims. It should be noted that not all combinations of features described in the embodiments and examples are necessarily essential to the means for solving the problems of the invention.

DESCRIPTION OF SYMBOLS 1 Heat sink 2 Heat sink 3, 3a Core material manufacturing apparatus 5 Flat plate 7 Step part 8 Molded body surface 10 Core 10a, 10b Core surface 12 Strand 15 Hole 15a Hole shaft 20 1st heat exchanger plate 25 2nd heat exchanger plate 30 Diagonal Supply roll 40 Die set upper plate 41 Press part 41a Slope 42 Press forming part 42a Corrugated blade 44 Smooth compression press part 45 Die set lower part 45b Opening 46 Smooth compression press part 46a End 46b Slope 50 Lower blade 52 Cutting blade 54 Processing die Part 56 Compression molding part 60 Bending part 65 Bending jig 70 Frame feed guide jig 100 Core material 100a Core surface 100b Core surface 100c Stepped part 102 Strand 105 Hole 105a Hole shaft 200 First heat transfer sheet coil 250 Second transmission Sheet coil for hot plate 300 Roll roll 400 Cutting position 410 Compressor Scan position 420 the feed direction 422 conveying direction 424 out direction

Claims (14)

A core having a core surface and a hole having a hole axis directed in a direction along a normal direction of the core surface;
A heat radiating plate comprising a heat transfer plate that joins the core surface and fills the hole. The hole is formed by being surrounded by a plurality of strands,
The core surface is a first core surface formed by one surface of the plurality of strands;
A second core surface formed by the other surface of the plurality of strands and facing the first core surface;
The heat sink according to claim 1, wherein the hole axis is oriented in a direction along a normal direction of the first core surface and the second core surface. The heat transfer plate includes a first heat conductive plate provided in contact with the first core surface, and a second heat conductive plate provided in contact with the second core surface,
The first heat conduction plate and the second heat conduction plate are joined by the first heat conduction plate filling the hole and the second heat conduction plate filling the hole. Heat sink. The core has a plurality of the holes,
The heat sink according to claim 3, wherein a ratio of a distance between one hole of the plurality of holes and another hole adjacent to the one hole and a thickness of the heat sink is less than 10.   The heat sink according to claim 4, wherein the plurality of the holes have a ratio of a total area of the plurality of holes in a top view of 10% to 90% with respect to the area of the heat sink. The core is formed of a material having a thermal expansion coefficient lower than that of the heat transfer plate,
The said heat exchanger plate is a heat sink of Claim 5 formed from the material which has higher heat conductivity than the said core. The core is formed from Invar material or Super Invar material,
The said heat exchanger plate is a heat sink of Claim 6 formed from the material selected from the group which consists of copper (Cu), aluminum (Al), a copper alloy, and an aluminum alloy. A first core having a first core surface and a first hole having a hole axis directed in a direction along a normal direction of the first core surface, and joined to the first core surface and in the first hole A first heat radiating plate having a first heat transfer plate filled with
A second core having a second core surface and a second hole having a hole axis directed in a direction along a normal direction of the second core surface, and the second hole joined to the flat second smooth surface A second heat radiating plate having a second heat transfer plate filling the inside,
A multilayer heat radiating plate in which the first heat radiating plate and the second heat radiating plate are joined. A core material preparation step of preparing a core material having a core surface and a hole having a hole axis directed in a direction along a normal direction of the core surface;
A heat sink manufacturing method comprising: a heat transfer plate bonding step for bonding a heat transfer plate to a surface of the core material. The core material preparation step includes
To the flat plate supplied intermittently, toward the lower blade supporting the flat plate on one side of the flat plate,
A cutting step of forming a plurality of cuts on the flat plate by pressing a press-formed part from the other surface side of the flat plate;
A pressing process for forming a molded body having a plurality of oblique holes by applying a press process to the plurality of cut portions; and
Compression molding is performed on the molded body along the direction of the hole axis of the plurality of oblique holes of the molded body, the plurality of holes having a hole axis perpendicular to the planar direction of the molded body, The manufacturing method of the heat sink of Claim 9 which prepares the said core material obtained through the compression process which forms the said core surface perpendicular | vertical to the direction which a hole axis faces. The lower blade has a cutting blade that forms the plurality of cuts, and a processing die portion that is provided adjacent to the cutting blade and presses the portions of the plurality of cuts,
The cutting step forms the plurality of cuts by pressing the press-molded portion against the cutting blade,
The said press work process is a manufacturing method of the heat sink of Claim 10 which forms the said molded object simultaneously with the said cutting process by the said press molding part being pressed toward the said process die part. Further comprising a bending step of bending the molded body to correct the direction of the hole axis;
The said compression process is a manufacturing method of the heat sink of Claim 11 which forms the said heat sink from the said molded object to which the bending process was given.   The cutting step is supplied while being inclined with respect to the longitudinal direction of the lower blade, and the flat plate supplied with a feed stroke synchronized with a cycle in which the press-formed portion is pressed against the flat plate. The manufacturing method of the heat sink of Claim 12 which forms.   The said heat exchanger plate joining process is a manufacturing method of the heat sink of Claim 13 which joins the said heat exchanger plate using the cold rolling clad method or the warm rolling clad method.

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