JP2010116515A - Epoxy resin composition and sheet - Google Patents
Epoxy resin composition and sheet Download PDFInfo
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- JP2010116515A JP2010116515A JP2008292086A JP2008292086A JP2010116515A JP 2010116515 A JP2010116515 A JP 2010116515A JP 2008292086 A JP2008292086 A JP 2008292086A JP 2008292086 A JP2008292086 A JP 2008292086A JP 2010116515 A JP2010116515 A JP 2010116515A
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- epoxy resin
- bisphenol
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 110
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 103
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 150000001412 amines Chemical class 0.000 claims abstract description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 11
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 9
- 229920000570 polyether Polymers 0.000 claims abstract description 9
- 230000009477 glass transition Effects 0.000 description 16
- 238000002834 transmittance Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- -1 phosphorus compound Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
【課題】透明性を備え、柔軟性に優れたエポキシ樹脂組成物及びこのエポキシ樹脂組成物製のシートを提供する。
【解決手段】エポキシ樹脂、硬化剤で形成されるエポキシ樹脂組成物。エポキシ樹脂が、（１）ビスフェノールＡ型エポキシ樹脂、（２）ビスフェノールF型エポキシ樹脂、（３）水添ビスフェノールＡ型エポキシ樹脂、（４）主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂、（５）シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であり、シリコーンの割合が３５〜６５質量％であり、かつビスフェノールＡ型エポキシ樹脂が共重合体の末端に配置されたエポキシ樹脂、の（１）から（５）のいずれかを1つ以上を含む。硬化剤は、分子内にエーテル結合を含むアミン又は分子内にエーテル結合を含む酸無水物のいずれか又は双方である。
【選択図】なしAn epoxy resin composition having transparency and excellent flexibility and a sheet made of the epoxy resin composition are provided.
An epoxy resin composition formed of an epoxy resin and a curing agent. The epoxy resin is (1) bisphenol A type epoxy resin, (2) bisphenol F type epoxy resin, (3) hydrogenated bisphenol A type epoxy resin, and (4) the main chain is a straight chain having a polyether skeleton. Epoxy resin, (5) a copolymer of silicone and bisphenol A type epoxy resin, the proportion of silicone being 35 to 65% by mass, and an epoxy resin in which bisphenol A type epoxy resin is disposed at the end of the copolymer Any one of (1) to (5) is included. The curing agent is either or both of an amine containing an ether bond in the molecule and an acid anhydride containing an ether bond in the molecule.
[Selection figure] None
Description
本発明は、透明性を備え、柔軟性に優れたエポキシ樹脂組成物及びこのエポキシ樹脂組成物製のシートである。 The present invention is an epoxy resin composition having transparency and excellent flexibility, and a sheet made of this epoxy resin composition.
エポキシ樹脂は、硬化剤と反応させると不融不溶の三次元架橋硬化物となり、高機械的強度、高耐熱性、高絶縁性、耐薬品性が高いなどのの特長を備えた高性能、多機能樹脂として広汎な用途に利用されている。 Epoxy resin, when reacted with a curing agent, becomes an infusible and insoluble three-dimensional cross-linked cured product, with high mechanical strength, high heat resistance, high insulation, and high chemical resistance. It is used for a wide range of applications as a functional resin.
エポキシ樹脂をシート状にした技術しては特許文献１がある。
本発明は、透明性を備え、シート状やフィルム状に成形しても柔軟性を有するエポキシ樹脂組成物及びそのシートである。 The present invention is an epoxy resin composition having transparency and having flexibility even when molded into a sheet or film, and a sheet thereof.
本発明は、エポキシ樹脂、硬化剤で形成されるエポキシ樹脂組成物であって、エポキシ樹脂が、（１）ビスフェノールＡ型エポキシ樹脂、（２）ビスフェノールF型エポキシ樹脂、（３）水添ビスフェノールＡ型エポキシ樹脂、（４）主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂、（５）シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であり、シリコーンの割合が３５〜６５質量％であり、かつビスフェノールＡ型エポキシ樹脂が共重合体の末端に配置されたエポキシ樹脂、の（１）から（５）のいずれかを1つ以上を含み、硬化剤が、分子内にエーテル結合を含むアミン又は分子内にエーテル結合を含む酸無水物のいずれか又は双方であるエポキシ樹脂組成物である。
他の発明は、本発明にかかるエポキシ樹脂組成物をシート状にしたものである。
The present invention is an epoxy resin composition formed of an epoxy resin and a curing agent, wherein the epoxy resin is (1) bisphenol A type epoxy resin, (2) bisphenol F type epoxy resin, (3) hydrogenated bisphenol A. Type epoxy resin, (4) a linear epoxy resin whose main chain has a polyether skeleton, and (5) a copolymer of silicone and bisphenol A type epoxy resin, the proportion of silicone being 35 to 65% by mass And one or more of (1) to (5) of an epoxy resin in which a bisphenol A type epoxy resin is arranged at the end of the copolymer, and the curing agent has an ether bond in the molecule It is an epoxy resin composition which is either or both of an amine containing or an acid anhydride containing an ether bond in the molecule.
In another invention, the epoxy resin composition according to the present invention is formed into a sheet.
本発明は、上記構成により、透明性を有し、シート状やフィルム状に成形しても柔軟性を有するという効果を有する。 According to the above configuration, the present invention has the effect of having transparency and having flexibility even when molded into a sheet or film.
以下、本発明について詳細に説明する Hereinafter, the present invention will be described in detail.
本発明は、エポキシ樹脂、硬化剤で形成されるエポキシ樹脂組成物であって、
エポキシ樹脂が、
（１）ビスフェノールＡ型エポキシ樹脂、
（２）ビスフェノールF型エポキシ樹脂、
（３）水添ビスフェノールＡ型エポキシ樹脂、
（４）主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂、
（５）シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であり、シリコーンの割合が３５〜６５質量％であり、かつビスフェノールＡ型エポキシ樹脂が共重合体の末端に配置されたエポキシ樹脂、
の（１）から（５）のいずれかを1つ以上を含み、
硬化剤が、分子内にエーテル結合を含むアミン又は分子内にエーテル結合を含む酸無水物のいずれか又は双方であるエポキシ樹脂組成物である。
The present invention is an epoxy resin composition formed with an epoxy resin and a curing agent,
Epoxy resin
(1) Bisphenol A type epoxy resin,
(2) Bisphenol F type epoxy resin,
(3) Hydrogenated bisphenol A type epoxy resin,
(4) an epoxy resin in which the main chain has a polyether skeleton and is linear;
(5) An epoxy resin which is a copolymer of silicone and bisphenol A type epoxy resin, the ratio of silicone is 35 to 65% by mass, and the bisphenol A type epoxy resin is arranged at the end of the copolymer,
Including one or more of (1) to (5)
It is an epoxy resin composition in which the curing agent is either or both of an amine containing an ether bond in the molecule or an acid anhydride containing an ether bond in the molecule.
本発明の特徴は、分子内にエーテル結合を含むアミン又は分子内にエーテル結合を含む酸無水物を硬化剤として用いたことにある。硬化剤にエーテル結合を含むことによって、エポキシ樹脂組成物全体の分子骨格を柔軟にし、エポキシ樹脂組成物全体のガラス転移温度を下げ、これによりエポキシ樹脂組成物をシート状に柔軟性を持たせることができた。 A feature of the present invention is that an amine containing an ether bond in the molecule or an acid anhydride containing an ether bond in the molecule is used as a curing agent. By including an ether bond in the curing agent, the molecular skeleton of the entire epoxy resin composition is made flexible, and the glass transition temperature of the entire epoxy resin composition is lowered, thereby making the epoxy resin composition flexible in a sheet form. I was able to.
エポキシ樹脂を柔軟にできたのは、エーテル結合が他の結合より回転しやすいことに着目したことにある。エーテル結合を有する硬化剤としては、アミンと酸無水物がある。 The reason why the epoxy resin can be made flexible is that the ether bond is more easily rotated than other bonds. Examples of the curing agent having an ether bond include amines and acid anhydrides.
エーテル結合を有するアミンとしては、プロピレンオキシド、エチレンオキシドなどを繰り返し単位としてもつポリエーテル骨格の末端に1級アミノ基をもつ化合物が挙げられ、好ましくは末端の官能基がジアミン及びトリアミンであるポリオキシアルキレンアミンである。 Examples of the amine having an ether bond include a compound having a primary amino group at the end of a polyether skeleton having propylene oxide, ethylene oxide or the like as a repeating unit, and preferably a polyoxyalkylene whose terminal functional groups are diamine and triamine. It is an amine.
エーテル結合を有する酸無水物としては、プロピレンオキシド、エチレンオキシドなどを繰り返し単位としてもつポリエーテル骨格の末端に酸無水物を反応させた化合物があげられ、好ましくはプロピレンオキシド骨格を有する酸無水物である。 Examples of the acid anhydride having an ether bond include a compound obtained by reacting an acid anhydride at the end of a polyether skeleton having propylene oxide, ethylene oxide or the like as a repeating unit, and preferably an acid anhydride having a propylene oxide skeleton. .
硬化剤の添加量は、少ないとエポキシ樹脂硬化が発揮されない傾向にあり、多いと反応しない硬化剤が内に残ってしまう傾向にある。そのため、エポキシ樹脂１００質量部に対する硬化剤の添加量の下限は、好ましくは４質量部以上、より好ましくは７質量部以上であり、上限は好ましくは２５０質量部以下、より好ましくは１６０質量部以下である。 When the addition amount of the curing agent is small, epoxy resin curing tends not to be exhibited, and when the addition amount is too large, a curing agent that does not react tends to remain inside. Therefore, the lower limit of the addition amount of the curing agent with respect to 100 parts by mass of the epoxy resin is preferably 4 parts by mass or more, more preferably 7 parts by mass or more, and the upper limit is preferably 250 parts by mass or less, more preferably 160 parts by mass or less. It is.
本発明におけるエポキシ樹脂として５種類採用したのは、エポキシ樹脂のなかでもガラス転移温度の低いものを選択したものである。 Five types of epoxy resins used in the present invention are selected from epoxy resins having a low glass transition temperature.
また、上述のエポキシ樹脂組成物をシート状に形成することにより、柔軟なエポキシ樹脂組成物製シートを得ることができた。ここで、シートと説明しているが、厚さが数μｍのフィルムも含まれる。 Moreover, the flexible epoxy resin composition sheet | seat was able to be obtained by forming the above-mentioned epoxy resin composition in a sheet form. Here, although described as a sheet, a film having a thickness of several μm is also included.
シート状への形成は、剥離フィルムに塗工する方法、押出成形、射出成形、ラミネート成形がある。 Forming into a sheet form includes a method of coating a release film, extrusion molding, injection molding, and laminate molding.
上述のエポキシ樹脂組成物には、組成に影響を与えない範囲で、硬化促進剤、変色防止剤、界面活性剤を適宜配合することができる。 A curing accelerator, a discoloration inhibitor, and a surfactant can be appropriately blended with the above-described epoxy resin composition as long as the composition is not affected.
（実施例１）
〈エポキシ樹脂組成物の作製〉
ビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製ｅｐ８２８）と前記エポキシ樹脂１００質量部に対して酸無水物硬化剤（新日本理化社製リカシッドＨＦ−０８（登録商標））を１６０質量部添加した。この配合部材１００質量部に対して硬化促進剤としてリン化合物（北興化学社製ＴＢＰ−DＡ）を０．２質量部、添加剤としてレベリング剤（ビックケミー社製ＢＹＫ３００）を１質量部添加し、これらによってエポキシ樹脂組成物を作製した。
Example 1
<Preparation of epoxy resin composition>
160 parts by mass of an acid anhydride curing agent (Ricacid HF-08 (registered trademark) manufactured by Shin Nippon Rika Co., Ltd.) was added to 100 parts by mass of the bisphenol A type epoxy resin (ep828 manufactured by Japan Epoxy Resin Co., Ltd.) and the epoxy resin. 0.2 parts by mass of a phosphorus compound (TBP-DA manufactured by Hokuko Chemical Co., Ltd.) as a curing accelerator and 1 part by mass of a leveling agent (BYK300 manufactured by BYK Chemie) as an additive are added to 100 parts by mass of this compounding member. An epoxy resin composition was prepared by
〈エポキシ樹脂組成物シートの作製〉
この基材層の樹脂組成物を、厚さ０．０５ｍｍのＰＥＴ（ポリエチレンテレフタレート）製のフィルム上に、硬化後の厚さが０．０５ｍｍになるように塗布し、１３０℃９０分加熱乾燥させ、これにより基材層を作製した。
<Preparation of epoxy resin composition sheet>
The base layer resin composition was applied onto a 0.05 mm thick PET (polyethylene terephthalate) film so that the cured thickness would be 0.05 mm, followed by heating and drying at 130 ° C. for 90 minutes. Thus, a base material layer was produced.
実施例１のシートについて、以下に示す方法で（１）ガラス転移温度（２）光透過率を測定、評価した。 About the sheet | seat of Example 1, (1) Glass transition temperature (2) Light transmittance was measured and evaluated by the method shown below.
ガラス転移温度
シートのガラス転移温度はＴＡインスツルメント社製の動的粘弾性測定装置ＲＳＡ IIIを使用し（測定周波数１０Ｈｚ、試験モード：引張）、ｔａｎδピーク温度をガラス転移温度とした。４０度以下が好ましい。
The glass transition temperature of the glass transition temperature sheet was measured using a dynamic viscoelasticity measuring device RSA III manufactured by TA Instruments (measurement frequency 10 Hz, test mode: tensile), and the tan δ peak temperature was defined as the glass transition temperature. 40 degrees or less is preferable.
光透過率
保護シートの透過率は、島津製作所社製のUV−２４００を使用し、波長４００ｎｍ〜７００nmにおける光透過率を測定した。これらの結果を表１に示す。７０％以上が好ましい。
For the transmittance of the light transmittance protective sheet, UV-2400 manufactured by Shimadzu Corporation was used, and the light transmittance at a wavelength of 400 nm to 700 nm was measured. These results are shown in Table 1. 70% or more is preferable.
表１に示すように、実施例１は、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。 As shown in Table 1, Example 1 was able to obtain a flexible sheet having both good glass transition temperature and light transmittance.
（実施例２）
水添ビスフェノールＡ型エポキシ樹脂（ＤＩＣ社製ＥＸＡ７０１５）と前記エポキシ樹脂１００質量部に対してアミン硬化剤 （三井ファインケミカル社製ジェファーミンD４００（登録商標））を４３質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例２も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
(Example 2)
Example 1 except that 43 parts by mass of an amine curing agent (Jeffamine D400 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.) was added to 100 parts by mass of the hydrogenated bisphenol A type epoxy resin (EXA7015 manufactured by DIC) and 100 parts by mass of the epoxy resin. Were tested in the same manner. The results are shown in Table 1. In Example 2 as well, a flexible sheet having a good glass transition temperature and light transmittance could be obtained.
（実施例３）
シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であるエポキシ樹脂（ｎａｎｏ ｒｅｓｉｎｓ社製Ａｌｂｉｆｌｅｘ３４８（登録商標））と前記エポキシ樹脂１００質量部に対してアミン硬化剤（三井ファインケミカル社製ジェファーミンD２３０（登録商標））を４質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例３も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
(Example 3)
Epoxy resin (Albiflex 348 (registered trademark) manufactured by nanoresins) which is a copolymer of silicone and bisphenol A type epoxy resin and 100 parts by mass of the epoxy resin are amine curing agents (Jeffamine D230 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.). )) Was added in the same manner as in Example 1 except that 4 parts by mass was added. The results are shown in Table 1. In Example 3 as well, a flexible sheet having a good glass transition temperature and light transmittance could be obtained.
（実施例４）
水添ビスフェノールＡ型エポキシ樹脂（ＤＩＣ社製ＥＸＡ７０１５）１００質量部、ビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製４００７ｐ）を３３質量部、アミン硬化剤（三井ファインケミカル社製ジェファーミンD４００（登録商標））を３２質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例４も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
Example 4
100 parts by mass of hydrogenated bisphenol A type epoxy resin (EXA7015 manufactured by DIC), 33 parts by mass of bisphenol F type epoxy resin (4007p manufactured by Japan Epoxy Resin Co., Ltd.), amine curing agent (Jeffamine D400 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.) ) Was added in the same manner as in Example 1 except that 32 parts by mass were added. The results are shown in Table 1. In Example 4 as well, a flexible sheet having a good glass transition temperature and light transmittance could be obtained.
（実施例５）
水添ビスフェノールＡ型エポキシ樹脂（ＤＩＣ社製ＥＸＡ７０１５）と前記エポキシ樹脂１００質量部に対してビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製４００４ｐ）を８７質量部、主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂（阪本薬品工業社製ＳＲ−ＰＴＭＧ）を６３質量部、アミン硬化剤（三井ファインケミカル社製ジェファーミンD４００（登録商標））を５９質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例５も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
(Example 5)
A hydrogenated bisphenol A type epoxy resin (EXA7015 manufactured by DIC) and 100 parts by mass of the epoxy resin have 87 parts by mass of bisphenol F type epoxy resin (4004p manufactured by Japan Epoxy Resin Co., Ltd.), and the main chain has a polyether skeleton. Example 1 except that 63 parts by mass of a linear epoxy resin (SR-PTMG manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.) and 59 parts by mass of an amine curing agent (Jeffamine D400 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.) were added. The same test was performed. The results are shown in Table 1. In Example 5 as well, a flexible sheet having good glass transition temperature and light transmittance could be obtained.
（実施例６）
水添ビスフェノールＡ型エポキシ樹脂（ＤＩＣ社製ＥＸＡ７０１５）と前記エポキシ樹脂１００質量部に対してビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製４００４ｐ）を８７質量部、主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂（阪本薬品工業社製ＳＲ−ＰＴＭＧ）を３８質量部、ビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製ｅｐ８２８）を２５質量部、アミン硬化剤（三井ファインケミカル社製ジェファーミンD４００（登録商標））を６６質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例６も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
(Example 6)
A hydrogenated bisphenol A type epoxy resin (EXA7015 manufactured by DIC) and 100 parts by mass of the epoxy resin have 87 parts by mass of bisphenol F type epoxy resin (4004p manufactured by Japan Epoxy Resin Co., Ltd.), and the main chain has a polyether skeleton. 38 parts by mass of linear epoxy resin (SR-PTMG manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.), 25 parts by mass of bisphenol A type epoxy resin (ep828 manufactured by Japan Epoxy Resin Co., Ltd.), amine curing agent (Jefamine manufactured by Mitsui Fine Chemical Co., Ltd.) The test was conducted in the same manner as in Example 1 except that 66 parts by mass of D400 (registered trademark) was added. The results are shown in Table 1. In Example 6 as well, a flexible sheet having a good glass transition temperature and light transmittance could be obtained.
（実施例７）
水添ビスフェノールＡ型エポキシ樹脂（ＤＩＣ社製ＥＸＡ７０１５）と前記エポキシ樹脂１００質量部に対してビスフェノールＦ型エポキシ樹脂（ジャパンエポキシレジン社製４００４ｐ）を９４質量部、主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂（阪本薬品工業社製ＳＲ−ＰＴＭＧ）を３８質量部、ビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製ｅｐ８２８）を２５質量部、シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であるエポキシ樹脂（ｎａｎｏ ｒｅｓｉｎｓ社製ａｌｂｉｆｌｅｘ３４８（登録商標））を３８質量部、アミン硬化剤（三井ファインケミカル社製ジェファーミンD４００（登録商標））を７３質量部添加した他は実施例１と同様に試験した。結果を表１に示す。実施例７も、ガラス転移温度、光透過率のいずれも良好で柔軟なシートを得ることができた。
(Example 7)
Hydrogenated bisphenol A type epoxy resin (EXA7015 manufactured by DIC Corporation) and 94 parts by mass of bisphenol F type epoxy resin (4004p manufactured by Japan Epoxy Resin Co., Ltd.) with respect to 100 parts by mass of the epoxy resin, and the main chain has a polyether skeleton. 38 parts by mass of linear epoxy resin (SR-PTMG manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.), 25 parts by mass of bisphenol A type epoxy resin (ep828 manufactured by Japan Epoxy Resin Co., Ltd.), and the weight of silicone and bisphenol A type epoxy resin Example 1 except that 38 parts by mass of a combined epoxy resin (albiflex 348 (registered trademark) manufactured by nanoresins) and 73 parts by mass of an amine curing agent (Jeffamine D400 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.) were added. Tested. The results are shown in Table 1. In Example 7 as well, a flexible sheet having a good glass transition temperature and light transmittance could be obtained.
（比較例１）
ビスフェノールＡ型エポキシ樹脂（ジャパンエポキシレジン社製ｅｐ８２８）と前記エポキシ樹脂１００質量部に対してノボラック硬化剤（ＤＩＣ社製ＴＤ−２１３１）を４５質量部添加した他は実施例１と同様に試験した。結果を表１に示す。比較例１は、ガラス転移温度が高いままであり、シートとしての柔軟性に欠けていた。
(Comparative Example 1)
A test was conducted in the same manner as in Example 1 except that 45 parts by mass of a novolak curing agent (TD-2131 manufactured by DIC) was added to 100 parts by mass of bisphenol A type epoxy resin (ep828 manufactured by Japan Epoxy Resin) and 100 parts by mass of the epoxy resin. . The results are shown in Table 1. In Comparative Example 1, the glass transition temperature remained high and the sheet lacked flexibility.
（比較例２）
トリアジン骨格を含むエポキシ樹脂（日産化学工業社製ＴＥＰＩＣ−ＰＡＳ２６）と前記エポキシ樹脂１００質量部に対してアミン硬化剤（三井ファインケミカル社製ジェファーミンD４００（登録商標））を６２質量部添加した他は実施例１と同様に試験した。結果を表１に示す。トリアジン骨格を含むエポキシ樹脂は、ガラス転移温度を上げる作用を有するものであり、そのため、比較例２のエポキシ樹脂組成物及びそのシートは、比較例１と同様なシートに高いガラス転移温度を示した。
(Comparative Example 2)
Other than adding 62 parts by mass of an amine curing agent (Jeffamine D400 (registered trademark) manufactured by Mitsui Fine Chemical Co., Ltd.) to 100 parts by mass of an epoxy resin containing a triazine skeleton (TEPIC-PAS26 manufactured by Nissan Chemical Industries) and 100 parts by mass of the epoxy resin The test was performed in the same manner as in Example 1. The results are shown in Table 1. The epoxy resin containing a triazine skeleton has an action of increasing the glass transition temperature. Therefore, the epoxy resin composition of Comparative Example 2 and its sheet showed a high glass transition temperature in the same sheet as Comparative Example 1. .
（比較例３）
シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であるエポキシ樹脂（ｎａｎｏ ｒｅｓｉｎｓ社製ａｌｂｉｆｌｅｘ３４８（登録商標））と前記エポキシ樹脂１００質量部に対して酸無水物硬化剤（新日本理化社製リカシッドＨＦ−０８（登録商標））を２６質量部添加した他は実施例１と同様に試験した。結果を表１に示す。比較例３は、光透過率が低く透明性に欠けていた。
(Comparative Example 3)
An epoxy resin (albiflex 348 (registered trademark) manufactured by nanoresins), which is a copolymer of silicone and bisphenol A type epoxy resin, and an acid anhydride curing agent (Rikacid HF- manufactured by Shin Nippon Rika Co., Ltd.) with respect to 100 parts by mass of the epoxy resin. The test was conducted in the same manner as in Example 1 except that 26 parts by mass of 08 (registered trademark) was added. The results are shown in Table 1. Comparative Example 3 had low light transmittance and lacked transparency.
本発明のエポキシ樹脂組成物は上述の構成により、柔軟性を有し、光透過性に優れたものである。 The epoxy resin composition of this invention has a softness | flexibility and was excellent in the light transmittance by the above-mentioned structure.
Claims (2)
エポキシ樹脂が、
（１）ビスフェノールＡ型エポキシ樹脂、
（２）ビスフェノールF型エポキシ樹脂、
（３）水添ビスフェノールＡ型エポキシ樹脂、
（４）主鎖がポリエーテル骨格を有し直鎖状であるエポキシ樹脂、
（５）シリコーンとビスフェノールＡ型エポキシ樹脂の共重合体であり、シリコーンの割合が３５〜６５質量％であり、かつビスフェノールＡ型エポキシ樹脂が共重合体の末端に配置されたエポキシ樹脂、
の（１）から（５）のいずれかを1つ以上を含み、
硬化剤が、分子内にエーテル結合を含むアミン又は分子内にエーテル結合を含む酸無水物のいずれか又は双方であるエポキシ樹脂組成物。 An epoxy resin composition formed with an epoxy resin and a curing agent,
Epoxy resin
(1) Bisphenol A type epoxy resin,
(2) Bisphenol F type epoxy resin,
(3) Hydrogenated bisphenol A type epoxy resin,
(4) an epoxy resin in which the main chain has a polyether skeleton and is linear;
(5) An epoxy resin which is a copolymer of silicone and bisphenol A type epoxy resin, the ratio of silicone is 35 to 65% by mass, and the bisphenol A type epoxy resin is arranged at the end of the copolymer,
Including one or more of (1) to (5)
An epoxy resin composition in which the curing agent is either or both of an amine containing an ether bond in the molecule or an acid anhydride containing an ether bond in the molecule.
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| JP2012001573A (en) * | 2010-06-14 | 2012-01-05 | Denki Kagaku Kogyo Kk | Conductive epoxy resin composition and conductive epoxy resin sheet |
| JP2012174533A (en) * | 2011-02-22 | 2012-09-10 | Sekisui Chem Co Ltd | Insulation material and laminate structure |
| EP2518114A1 (en) * | 2011-04-25 | 2012-10-31 | Toray Advanced Materials Korea Inc. | Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same |
| CN117487475A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High temperature resistant pressure-sensitive tape and preparation method thereof |
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| JPH0258525A (en) * | 1988-08-25 | 1990-02-27 | Toshiba Chem Corp | Resin composition for sealing use |
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| JPS5554326A (en) * | 1978-10-16 | 1980-04-21 | Texaco Development Corp | Manufacture of epoxy resin |
| JPH0258525A (en) * | 1988-08-25 | 1990-02-27 | Toshiba Chem Corp | Resin composition for sealing use |
| JP2004315652A (en) * | 2003-04-16 | 2004-11-11 | Dainippon Ink & Chem Inc | Epoxy resin composition and flooring using the same |
| JP2007023272A (en) * | 2005-06-15 | 2007-02-01 | Hitachi Chem Co Ltd | Liquid epoxy resin composition for sealing, electronic component device and wafer level chip size package |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012001573A (en) * | 2010-06-14 | 2012-01-05 | Denki Kagaku Kogyo Kk | Conductive epoxy resin composition and conductive epoxy resin sheet |
| JP2012174533A (en) * | 2011-02-22 | 2012-09-10 | Sekisui Chem Co Ltd | Insulation material and laminate structure |
| EP2518114A1 (en) * | 2011-04-25 | 2012-10-31 | Toray Advanced Materials Korea Inc. | Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same |
| US8945668B2 (en) | 2011-04-25 | 2015-02-03 | Toray Advanced Materials Korea Inc. | Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same |
| CN117487475A (en) * | 2023-11-17 | 2024-02-02 | 江苏科麦特科技发展有限公司 | High temperature resistant pressure-sensitive tape and preparation method thereof |
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