JP2010116543A - Prepreg and method of manufacturing the same, and printed wiring board using the same - Google Patents

Abstract

An object of the present invention is to provide a prepreg and a printed wiring board that maintain hygroscopicity, heat resistance, and chemical resistance, are inexpensive, have excellent workability, and can increase thermal conductivity.
SOLUTION: A core material 7 and a composite material impregnated in the core material 7, wherein the composite material is a semi-cured resin body, and magnesium oxide, water dispersed in the resin body. It is an inorganic filler selected from oxides and carbonates, and the surface thereof is subjected to surface treatment with a compound consisting of at least one of Si, Ti, Zr, Fe, and Al, or Si, By containing at least one inorganic filler surface-treated with a compound of at least one of Ti, Zr, Fe, and Al and a compound of magnesium, hygroscopicity, heat resistance, and chemical resistance are maintained. The present invention provides a prepreg and printed wiring board that are inexpensive, excellent in workability, and have high thermal conductivity.
[Selection] Figure 1

Description

  The present invention relates to a prepreg used when mounting various electronic components such as power semiconductors requiring heat countermeasures at high density, a manufacturing method thereof, and a printed wiring board using the prepreg.

  2. Description of the Related Art Conventionally, printed wiring boards for mounting electronic components have been obtained by laminating, integrating, and curing a plurality of prepregs made of glass epoxy resin and copper foil.

  With the miniaturization and high performance of equipment, heat generation of electronic components often becomes a problem, and printed wiring boards having heat dissipation (or thermal conductivity) are required as a new heat countermeasure.

  For example, using a crystalline epoxy resin with improved thermal conductivity, a material with improved thermal conductivity has been proposed. An example will be described with reference to FIG. That is, FIGS. 5A and 5B are cross-sectional views illustrating a state in which a crystalline polymer having both mesogenic groups is oriented using a magnetic field to increase the thermal conductivity (see, for example, Patent Document 1). ).

  5A and 5B, magnetic lines of force indicated by arrows 2 are generated between a plurality of magnets 1 (for example, permanent magnets as magnetic field generating means). Then, a resin 4 (for example, a crystalline epoxy resin in a liquid state before being cured) placed in the mold 3 is placed between the magnetic field lines indicated by the arrows 2, and the resin 4 is thermally cured in this magnetic field. . 5A shows a state in which a magnetic field is applied in a direction perpendicular to the resin 4, and FIG. 5B shows a state in which a magnetic field in a parallel direction is applied.

  However, in order to orient the crystalline epoxy that is originally hard to be magnetized, it is cured for 10 minutes to 1 hour in the mold 3 heated to a temperature of 150 to 170 ° C. in a high magnetic field with a magnetic flux density of 5 to 10 Tesla. Special processing is required. The crystalline epoxy resin thus formed may have anisotropy in thermal conductivity and mechanical strength (for example, bending strength). As a result, a prepreg or printed wiring board produced using such a crystalline epoxy resin has direction dependency (or anisotropy), so that flexibility is reduced (for example, bending resistance is reduced). Or easily bent when bent) (Patent Document 1).

  On the other hand, in order to increase the thermal conductivity of the prepreg, it has been proposed to add an inorganic filler at a high density. For example, an example in which an inorganic filler such as a nitride such as boron nitride or aluminum nitride, or an oxide such as titanium oxide or aluminum oxide is used (Patent Document 2).

  However, these nitrides are expensive in price, and when the filling amount of the inorganic filler is increased, the prepreg and the printed wiring board using the prepreg become very expensive. In addition, metal oxides such as titanium oxide and aluminum oxide have a low hardness and are inferior in machinability when a printed wiring board is produced.

  Therefore, by using or partially adding alkaline earth and alkali metal oxides, hydroxides, and carbonates to the inorganic filler, it is inexpensive in price, excellent in workability, and has excellent thermal conductivity. The printed wiring board which has is obtained.

  However, these alkaline earth and alkali metal oxides, hydroxides, and carbonates have an alkaline surface state and are active. When it improves, when it is set as a prepreg and a printed wiring board, subjects, such as a fall of hygroscopicity and heat resistance, and the chemical-resistance fall at the time of wiring, are assumed.

JP 2004-225054 A JP-A-60-136298

  As described above, in the case of the conventional printed wiring board, increasing the amount of filling with the inorganic filler to increase the thermal conductivity of the printed wiring board causes an increase in price and a decrease in workability. Then, problems such as deterioration of characteristics due to moisture absorption of the printed wiring board, reduction in heat resistance, and reduction in chemical resistance when the printed wiring board is created are assumed.

  Therefore, the present invention focuses on the inorganic filler constituting the prepreg and its surface treatment agent, and further focuses on the composition of the constituent resin and the base material, while increasing the thermal conductivity of the printed wiring board, while solving the above-mentioned problems. An object of the present invention is to provide a prepreg and a printed wiring board capable of maintaining the overcome characteristics.

  In order to achieve this object, the present invention provides a prepreg having a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing, the prepreg having a thickness of 10 It consists of a core material of not less than 300 microns and not more than 300 microns and a composite material impregnated in this core material, the composite material is composed of a semi-cured resin body and an inorganic filler dispersed in the resin body, The inorganic filler is one of magnesium oxide, hydroxide, and carbonate, and the inorganic filler is subjected to surface treatment with a compound composed of at least one of Si, Ti, Zr, Fe, and Al. Or the inorganic filler is a prepreg that has been surface-treated with a compound of at least one of Si, Ti, Zr, Fe, and Al and magnesium. To.

  According to the prepreg of the present invention, a manufacturing method thereof and a printed wiring board using the prepreg, it has excellent thermal conductivity, maintains stability such as moisture absorption characteristics, heat resistance, and chemical resistance, and is inexpensive and processable. Excellent prepreg and printed wiring board can be obtained, and by using the printed wiring board produced using the prepreg of the present invention, electronic components can be mounted at high density, such as liquid crystal and plasma TV, Various electronic devices can be reduced in size and performance.

Sectional drawing and enlarged sectional view of the prepreg in the embodiment of the present invention The figure which shows an example of the manufacturing process of the prepreg in embodiment of this invention Sectional drawing which shows the manufacturing process of the multilayer printed wiring board in embodiment of this invention Sectional drawing which shows the manufacturing process of the multilayer printed wiring board in embodiment of this invention Sectional view showing a conventional method for increasing thermal conductivity

Example 1
Hereinafter, the prepreg in Example 1 of this invention is demonstrated.

  FIG. 1 is a sectional view and an enlarged sectional view of a prepreg according to an embodiment of the present invention.

  First, description will be made with reference to FIG. FIG. 1A is a cross-sectional view of a prepreg in the embodiment.

  The thickness of the core material 7 is desirably 10 to 300 microns. When the thickness of the core material 7 is less than 10 microns, the mechanical strength (for example, tensile strength) of the prepreg 5 (or a printed wiring board formed by curing the prepreg 5) may be affected. When the thickness of the core material 7 exceeds 300 microns, the thickness of the prepreg 5 increases, which may affect the handling property (for example, difficult to wind).

  When a woven fabric is used for the core material 7, in FIG. 1A, an arrow 11 indicates an opening portion of the core material 7 in which the core material fibers 6 are woven (this opening portion is also called a basket hole portion). Is). Moreover, when a nonwoven fabric is used for the core material 7, in FIG.1 (c), the arrow 11 shows the space in which the fiber does not exist among the core materials 7 obtained by the core material fiber 6 couple | bonding as an opening part. ing.

  As shown in FIG. 1A, a prepreg 5 described in the embodiment is composed of a core material 7 and a semi-cured resin body 8 impregnated in the core material 7. And the opening part (part shown by the arrow 11) of the core material 7 and the surface of the core material 7 are covered (or filled) with the semi-cured resin body 8.

  Next, the structure of the opening will be described in detail. FIG. 1B is an enlarged cross-sectional view of the opening of the prepreg in the embodiment of the present invention. As shown in FIG. 1B, an inorganic filler 9 is dispersed in the semi-cured resin body 8, and the inorganic filler 9 is subjected to a surface treatment by a surface treatment layer 10. The surface treatment layer 10 suppresses hygroscopicity, improves heat resistance, and improves chemical resistance.

  In this embodiment, the thickness of the prepreg 5 is obtained by positively forming an opening in the core material 7 and filling the opening with a semi-cured resin body 8 as shown in FIG. This will increase the thermal conductivity in the direction.

  Further, by making the prepreg 5 difficult to contract in the XY direction, the prepreg 5 can be made difficult to extend in the Z direction (thickness direction). As a result, the effect of improving the reliability of the printed wiring board in the Z direction (for example, the connection reliability of the through hole portion) can be obtained. This is because the thermal expansion in the Z direction is suppressed.

  Moreover, the effect of improving the workability of the via hole by the laser of the prepreg 5 or a drill is also acquired by raising the aperture ratio of the core material 7.

  The thickness of the prepreg 5 is desirably 20 microns or more and 500 microns or less. When the thickness of the prepreg 5 is less than 20 microns, the mechanical strength (for example, tensile strength) of the prepreg 5 (or a printed wiring board formed by curing the prepreg 5) may be affected. In addition, when the thickness exceeds 500 microns, handling (for example, difficult to wind) may be affected.

  It is desirable to make the prepreg 5 thicker than the glass core 7. By making the prepreg 5 thicker than the thickness of the core material 7, the thickness of the superscript resin (so-called extra semi-cured resin body 8 covering the surface of the core material 7) can be secured. By securing a certain amount of this superscript resin, for example, the effect of absorbing the thickness of the copper foil 16 that forms the inner layer pattern in FIGS. 3A to 3B described later can be obtained. Due to this thickness absorption effect, for example, unevenness is less likely to occur on the surface of the printed wiring board 20 shown in FIG.

  Next, an example of a method for manufacturing the prepreg 5 will be described with reference to FIG. FIG. 2 is a schematic diagram illustrating an example of a method for producing the prepreg 5 in cross section. In FIG. 2, 13 is a roll, which schematically shows a part of the prepreg manufacturing equipment. 12 is a composite material varnish, and 14 is a tank. In the tank 14, a member for forming the semi-cured resin body 8, that is, a composite material was dissolved in a predetermined solvent (for example, methyl ethyl ketone, alcohols, cyclopentanone, etc .: methyl ethyl ketone is used in this embodiment). It is set in the state.

  First, as the core material 7, a glass woven fabric having a thickness of 45 microns and an aperture ratio of 5% was used. Then, as shown in FIG. 2, the core material 7 is set on the roll 13, sent in the direction indicated by the arrow 11 a, and impregnated with the composite material varnish 12 set in the tank 14. The amount of impregnation of the composite material varnish 12 impregnated in the core material 7 is adjusted while turning the roll 13 in the direction of the arrow 11b. Then, the solvent component is removed from the composite material varnish 12 by flowing through a dryer or the like (not shown) as indicated by an arrow 11c. Furthermore, the resin component contained in the composite material is brought into a semi-cured state (a state before the main curing, so-called B-stage state) by heating or the like to obtain a semi-cured resin body 8. Thus, the prepreg 5 is continuously produced. In addition, the manufacturing method of the prepreg 5 is not limited to this.

  Next, the composite material set in the tank 14 will be described. As the composite material, it is desirable to select a material having a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after the prepreg 5 is cured. When the heat conductivity after curing is less than 0.5 W / (m · K), it may be difficult to obtain the effect of heat conduction through the opening. A material having a thermal conductivity exceeding 20 W / (m · K) is expensive and may be difficult to handle.

  Here, in order to realize a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing, at least a composite material and a compound surface treatment are provided on the surface. It is desirable that the inorganic filler is dispersed in the resin.

  Then, an epoxy resin is used as the resin, and the inorganic filler has a compound other than M1 on the surface of the inorganic filler, where (group 1 element or group 2 element excluding hydrogen) is M1 on the surface. It is desirable that the surface treatment is carried out by using a compound other than M1 and M1. The inorganic filler preferably contains at least one oxide, hydroxide, or carbonate of “Group 1 element or Group 2 element excluding hydrogen” (that is, M1).

  As M1, for example, magnesium is desirably used, which is an inorganic filler selected from oxides, hydroxides, and carbonates of M1 (for example, magnesium), and the surface thereof is Si, Ti, Zr, Fe, Inorganic that has been surface-treated with a compound comprising at least one of Al, or surface-treated with a compound of at least one of Si, Ti, Zr, Fe, and Al and magnesium The filler is composed of at least one kind of inorganic filler.

  Needless to say, a curing agent for curing the epoxy resin or the like is added as necessary.

  Further, the core fiber 6 is subjected to a surface treatment with a surface treatment agent (not shown) such as a silane coupling agent, a phosphate ester, a sulfonate ester, or a carboxylic acid ester, so that the core fiber 6 and Since the inorganic filler 9 has a binding force through the surface treatment agent, both the thermal conductivity and the mechanical strength of the prepreg 5 can be achieved.

  In addition, it becomes the prepreg 5 by making these resin into a semi-hardened state.

  The proportion of the inorganic filler 9 in the prepreg 5 is preferably 20% by volume or more and 60% by volume or less of the entire prepreg 5. If it is less than 20% by volume, the thermal conductivity of the prepreg 5 may be lowered. Further, if it is higher than 60% by volume, the flexibility of the prepreg 5 and the wiring embedding property during hot pressing may be affected.

  Here, when the viscosity of the composite material varnish 12 is high, the coating property is lowered, the surface property of the prepreg is lowered, and it may be a factor such as poor adhesion when forming the final printed wiring board. In particular, when the proportion of the inorganic filler 9 is large, it is affected by the properties of the inorganic filler, and the viscosity characteristics are significantly changed. As a result, the productivity of the prepreg and the printed wiring board is greatly affected.

  Next, a method for producing a printed wiring board having high thermal conductivity using the prepreg 5 will be described.

  3A and 3B are cross-sectional views illustrating an example of a method for fixing (or integrating) a copper foil on the surface of the prepreg 5.

  First, as shown in FIG. 3A, a copper foil 16 is set on one or more surfaces of a prepreg 5 including a semi-cured resin body 8 and a core material 7 impregnated with the semi-cured resin body 8. Then, the press 15 is moved as indicated by the arrow 11, and the copper foil 16 is attached to one or more surfaces of the prepreg 5. In FIGS. 3A and 3B, a mold set in the press 15 is not shown. And these members are pressure-integrated at a predetermined temperature. Thereafter, the press 15 is pulled away in the direction of the arrow 11 as shown in FIG. In this way, the copper foil 16 is fixed to one or more surfaces of the prepreg 5 to obtain a laminate 17. In this way, by fixing the copper foil 16 on the prepreg 5 without using an adhesive or the like, high thermal conductivity of the finished laminate 17 is realized.

  Next, the copper foil 16 fixed to one or more surfaces of the laminate 17 is patterned into a predetermined shape. Note that patterning steps (photoresist application, exposure, development, copper foil 16 etching, photoresist removal step, etc.) are not shown.

  Next, with reference to FIGS. 4A to 4C, a state in which the laminated body 17 is laminated to form a four-layer printed wiring board will be described.

  FIGS. 4A to 4C are schematic views illustrating in section how a multilayer (for example, four layers) printed wiring board is created.

  First, as shown in FIG. 4A, a laminate 17 is prepared by processing the copper foil 16 into a predetermined pattern shape on at least one surface thereof. And the prepreg 5 is set so that this laminated body 17 may be pinched | interposed. Further, a copper foil 16 is set outside the prepreg 5. In addition, when using the commercially available copper foil 16, the adhesive force (anchor effect) of the copper foil 16 and the prepreg 5 can be improved by setting the rough surface side to the prepreg 5 side. In this state, a press device (not shown) is used to pressurize, heat, and integrate these members. By heating at the time of pressing, the semi-cured resin body 8 included in the prepreg 5 is softened, and the pattern of the copper foil 16 fixed on the prepreg 5 (or the embedding of a step by the pattern) or the copper foil 16 The effect of increasing the adhesion is obtained. Moreover, the effect which fixes the copper foil 16 is also acquired, without using an adhesive agent. In this way, the laminated body 17 is created.

  Next, the hole 18 is formed in the predetermined position of this laminated body 17, and it is set as the state of FIG. 4 (B). In FIG. 4B, the hole 18 is formed by a drill, a laser or the like (both not shown).

  Thereafter, copper is plated on the inner wall of the hole 18 to obtain the state shown in FIG. As shown in FIG. 4C, interlayer connection between the copper foils 16 formed on the inner layer and the surface layer is performed by the copper plating part 19. Next, the printed wiring board 20 is completed by forming a solder resist (not shown) or the like.

  Next, members constituting the semi-cured resin body 8 and the composite material will be described in detail.

  Examples of the composite material include a thermosetting resin mainly composed of an epoxy resin, an inorganic filler that enhances thermal conductivity, a surface treatment agent for firmly bonding the inorganic fillers, and the flexibility of the printed wiring board 20 (or In order to increase the resistance to cracking, a material to which a rubber resin or the like is added can be used.

  In addition, thermal conductivity in a resin part can be raised by making 40 weight% or more of epoxy resins into crystalline epoxy resin. Moreover, heat conduction can be improved by making all of the epoxy resin (or 100% by weight) crystalline epoxy. Moreover, although the crystalline epoxy resin after hardening may be easily broken in some cases, it can be made difficult to break by adding a rubber resin or a thermoplastic resin. By adding these as fine particles, the influence on heat conduction can be suppressed.

  The ratio between the main agent and the curing agent is calculated from the epoxy equivalent.

  When a crystalline epoxy resin is used, both the thermal conductivity and the mechanical strength can be improved by using a thermoplastic resin having a phenyl group. Moreover, the effect which raises the mechanical strength (for example, difficulty of a crack) of the completed printed wiring board 20 is acquired by adding such a thermoplastic resin.

  In addition, the average particle size of the inorganic filler is preferably 0.01 μm or more and 50.00 μm or less, more preferably 0.1 μm or more and 10.0 μm or less. Since the specific surface area increases as the average particle size becomes smaller, the heat dissipation area increases and the radiation efficiency increases. However, when the average particle size is less than 0.01 μm, the specific surface area increases and the kneading of the composite material becomes difficult. Moreover, when it exceeds 50.00 micrometers, the filling to the opening part formed in the core material 7 will become difficult.

  In order to increase the filling rate of the inorganic filler, a plurality of types of inorganic fillers having different particle size distributions may be selected and used in combination.

  Next, an example of the measurement result of the characteristics of the produced printed wiring board 20 will be described in detail.

  As an example, using the inorganic filler shown in the following [Table 1], a composite material is formed by mixing with a predetermined epoxy resin and a curing agent, and this is dissolved in a predetermined solvent, and then a core material. The glass woven fabric was impregnated and dried, and the latter half was cured to form a prepreg, and a printed wiring board was formed by a predetermined method.

  As a comparative example, a printed wiring board was prepared in the same manner as in the example using an inorganic filler having no surface treatment shown in [Table 1] below.

  These printed wiring boards prepared using the inorganic fillers of the examples and comparative examples were subjected to a moisture absorption heat resistance test (copper foil on both sides) and chemical resistance test (wiring board) after being left at 192H at 30 ° C.-60%. .

  Moreover, since the viscosity characteristic of the composite material varnish 12 largely changes depending on the properties of the inorganic filler as described above, the varnish viscosity was also evaluated.

  The results are shown in [Table 2] below.

  As is clear from the results of [Table 2-1] to [Table 2-3], in order to obtain a certain heat conduction, the surface treatment was performed in the state where the necessary amount of the inorganic filler component was added. In a system using no inorganic filler, as shown in [Table 2-3], there is a problem in either the hygroscopic heat resistance test or the chemical resistance test.

  On the other hand, regarding a system using an inorganic filler that has been subjected to a surface treatment with a compound containing an element other than M1, which is (Group 1 element or Group 2 element excluding hydrogen), [Table 2-1] As shown in [Table 2-2], no such abnormality was observed, and good results were obtained.

  Furthermore, in a system using an inorganic filler that has not been surface-treated, the viscosity of the composite material varnish is increased due to the alkalinity of the inorganic filler surface and the mutual agglomeration between the inorganic fillers. , M1 (that is, Group 1 element or Group 2 element other than hydrogen) is subjected to a surface treatment with a compound containing an element other than hydrogen, and the viscosity is also reduced, resulting in prepreg coating productivity. The improvement is seen.

  A prepreg having a thermal conductivity of 0.5 W / (m · K) or more and 20.0 W / (m · K) or less after curing, the prepreg having a thickness of 10 to 300 microns. And a semi-cured resin body impregnated in the core material, the semi-cured resin body comprising a semi-cured resin body and an inorganic filler dispersed in the resin body, the inorganic filler being It is desirable to use an inorganic filler selected from oxides, hydroxides, and carbonates of M1 composed of (Group 1 element or Group 2 element excluding hydrogen).

  In addition, the surface of the inorganic filler selected from M1 oxide, hydroxide, and carbonate may be subjected to a surface treatment with a compound other than M1 (that is, a Group 1 element or Group 2 element excluding hydrogen). desirable. Alternatively, the surface of the inorganic filler may be surface treated with a compound of M1 and a material other than M1. By including at least one kind of these inorganic fillers, it is possible to ensure hygroscopicity, heat resistance and chemical resistance, and to provide a printed wiring board excellent in high thermal conductivity and workability at low cost and easily in productivity.

  The Group 1 element is an element belonging to Group 1 in the periodic table, and corresponds to, for example, hydrogen, lithium, sodium, potassium, rubidium, cesium, and francium.

  The Group 2 element is an element belonging to Group 2 of the periodic table, for example, and corresponds to beryllium, magnesium, calcium, strontium, barium, radium, for example.

  In addition, from the viewpoint of heat conduction, the inorganic filler is preferably an oxide, hydroxide, or carbonate of magnesium, particularly an oxide, and the surface treatment is a film of an oxide such as Si, Al, Ti, Fe, and P. And a film on a colloid of hydroxide are preferable because they can be used easily and safely.

  The amount of treatment is indicated in [Table 1] in terms of oxide with respect to the inorganic filler M1 compound, and is preferably about 0.1 to 100 wt%. If it is less than 0.1 wt%, the surface coating effect is low, and the effect of suppressing hygroscopicity is reduced. Moreover, desirably, 0.2 wt% or more and 30.0 wt% or less keep the covering property and the properties of the filler.

Examples of the surface treatment include a surface treatment formed from a metal alkoxide (MOR) and a metal oxide (MO) and metal alkoxide (MOR ′) film obtained by hydrolysis and dehydration reaction or alcohol decomposition. By this treatment, the surface reaction film can be easily formed with a relatively low production reaction temperature, and furthermore, by adding minute 10 nm to 100 nm SiO ₂ particles in the film, it is caused by thermal strain in the film. The stress can be relaxed, and a stronger film can be formed.

  Here, R means hydrogen or a hydrocarbon having 1 to 4 carbon atoms.

  In addition, the surface treatment is a system in which heat treatment is performed with an organic polysiloxane having the general formula (Chemical Formula 1), and the surface treatment is performed. can get. In particular, when at least one of R1, R2, and R3 of the organic polycyclosan is H, the coating efficiency is increased, and a stronger film can be formed.

  Further, as the core fiber constituting the woven or non-woven fabric, a fiber made of polyester, aramid, or glass is used. As the glass fiber, any one or more of crystallized glass fiber, quartz glass fiber, and reinforced glass fiber is used. By setting it as the prepreg of Claim 1 which consists of a fiber, even when the opening rate of a core material is raised, the intensity | strength can be maintained.

  The resin of the semi-cured resin body is composed of at least a semi-cured epoxy resin, and further an epoxy resin and a thermoplastic resin. Among the epoxy resins, 60 wt% or more and 100 wt% or less are crystalline epoxy resins. By doing so, the thermal conductivity of the printed wiring board can be increased.

  In the system in which the surface treatment is performed with a compound using a material other than the Group 1 element or Group 2 element M1 excluding hydrogen of the present invention (herein referred to as M2), the composite material has a thickness of 10 microns or more. When impregnated in a core material of 300 microns or less, the viscosity of the composite varnish is also reduced, and as a result, the prepreg coating productivity is improved.

  Therefore, the printed wiring board excellent in heat dissipation can be manufactured at low cost by using a method for manufacturing a prepreg having a step of making the composite material a semi-cured state.

  A printed wiring board obtained by laminating and curing a plurality of prepregs and copper foils having a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing, The prepreg includes a core material having a thickness of 10 microns to 300 microns and a semi-cured resin body impregnated in the core material. The semi-cured resin body includes a semi-cured resin body and a resin body in the resin body. The inorganic filler is an inorganic filler selected from oxides, hydroxides, and carbonates of the Group 1 element or Group 2 element M1 excluding hydrogen, and An inorganic filler whose surface is surface-treated with a compound by M2 other than M1 (Group 1 element or Group 2 element excluding hydrogen), or surface-treated by a compound of M2 and M1 At least one More preferably, an inorganic filler selected from magnesium oxide, hydroxide, and carbonate, and the surface thereof is made of at least one of Si, Ti, Zr, Fe, and Al. Inorganic containing at least one inorganic filler that has been surface-treated with a compound or that has been surface-treated with a compound of at least one of Si, Ti, Zr, Fe, and Al and magnesium By providing a printed wiring board made of a filler, it is possible to reduce the size and performance of mobile phones, plasma televisions, electrical equipment, and devices that require industrial heat dissipation.

  As described above, by using the prepreg according to the present invention and the manufacturing method thereof and the printed wiring board using the prepreg, it is possible to reduce the size of a mobile phone, a plasma television, an electrical component, or an industrial device that requires heat dissipation. And high performance.

1 Magnet 2 Magnetic field line 3 Mold 4 Resin 5 Prepreg 6 Core fiber 7 Core material (woven fabric)
8 Semi-cured resin body 9 Inorganic filler 11 Arrow 12 Composite material varnish 13 Roll 14 Tank 15 Press 16 Copper foil 17 Laminated body 18 Hole 19 Copper plating part 20 Printed wiring board

Claims (13)

A prepreg having a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing, the core having a thickness of 10 to 300 microns, Composed of a composite material impregnated with a material, the composite material is composed of a semi-cured resin body, and an inorganic filler dispersed in the resin body,
The inorganic filler is one of magnesium oxide, hydroxide, and carbonate,
The inorganic filler is subjected to a surface treatment with a compound composed of at least one of Si, Ti, Zr, Fe, and Al.
Alternatively, the inorganic filler is a prepreg that is surface-treated with a compound of at least one of Si, Ti, Zr, Fe, and Al and magnesium. The prepreg according to claim 1, wherein the inorganic filler has an average particle size of 0.01 μm or more and 50.00 μm or less. The prepreg according to claim 1, wherein the inorganic filler has an average particle size of 0.1 μm to 10.0 μm. The prepreg according to claim 1, wherein a surface treatment amount for the inorganic filler is 0.1 wt% or more and 100 wt% or less. The prepreg according to claim 1, wherein a surface treatment amount of the inorganic filler is 0.2 wt% or more to 30.0 wt%. The prepreg according to claim 1, wherein the surface treatment comprises a metal oxide formed from metal alkoxide or a composite of metal oxide and metal alkoxide. _2. The prepreg according to claim 1, wherein the surface treatment comprises a metal oxide formed from SiO ₂ particles having a particle diameter of 10 nm to 100 nm and a metal alkoxide or a composite of a metal oxide and a metal alkoxide. The prepreg according to claim 1, wherein the surface treatment is performed with an organic polysiloxane having a general formula (Formula 1).
The prepreg according to claim 7, wherein at least one of R1, R2, and R3 of the organic polycyclosan is H. The prepreg according to claim 1, wherein the resin body is an epoxy resin and a curing agent. The prepreg according to claim 10, wherein 40% by volume or more of the epoxy resin is a crystalline epoxy resin. The surface treatment according to claim 1 or 2, wherein the resin body and the resin body dispersed in the resin body have a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing. Preparing a composite material composed of an inorganic filler containing at least an inorganic filler, impregnating the composite material with a core material having a thickness of 10 to 300 microns, and making the resin body semi-cured Process,
The manufacturing method of the prepreg which has. A printed wiring board obtained by laminating and curing a plurality of prepregs having a thermal conductivity of 0.5 W / (m · K) or more and 20 W / (m · K) or less after curing and a copper foil processed into a predetermined pattern Because
The prepreg consists of a core material having a thickness of 10 microns to 300 microns, a resin body, and an inorganic filler dispersed in the resin body,
The inorganic filler is selected from magnesium oxide, hydroxide, and carbonate,
The surface of the inorganic filler is subjected to a surface treatment with a compound composed of at least one of Si, Ti, Zr, Fe, and Al.
Or the printed wiring board by which the said inorganic filler surface is surface-treated with the compound of at least 1 sort (s) of Si, Ti, Zr, Fe, and Al and magnesium.