JP2010108230A - Method of manufacturing noncontact ic card - Google Patents

Abstract

The present invention provides a method for producing a non-contact type IC card having a uniform card thickness, no distortion on the card surface, and excellent appearance characteristics such as printing characteristics.
The method includes a step of laminating and pressing a card constituent member to obtain a laminated body as a card base having a plurality of card-shaped portions, and a step of punching the laminated body into a card shape to obtain a card, In the step of obtaining a laminate by sandwiching the card constituent member in a state accommodated in an upper press plate and a lower press plate having a recess capable of accommodating the card constituent member, and pressing them together, the card The component member has one or more through holes penetrating each of the card component members when they are stacked in a portion other than the card shape portion, and one or more in the concave portion of the lower press plate or in the upper press plate. The card constituent member is accommodated in the concave portion of the lower press plate, and is pressed in a state where the through hole of each of the card constituent members and the protruding portion are fitted.
[Selection] Figure 3

Description

  The present invention relates to a method of manufacturing a non-contact type IC card in which an IC chip and an antenna coil are incorporated in a card base material, and information can be exchanged with the outside at least in a non-contact manner.

  Non-contact type IC cards have been commercialized since the 1990s, and various types of products such as data transmission specifications and data processing functions in the cards have been developed today. The greatest feature of the non-contact type IC card is that data can be transmitted and received in a non-contact manner. This improves operability during use by the user and reduces the maintenance burden on the terminal infrastructure. Due to the speedy and convenient features of this non-contact type IC card, it can be applied to traffic tickets in combination with gate devices, entrance / exit management cards, ID cards such as membership cards / employee cards, and electronic money. It has spread.

  Traditionally, mainly for credit cards and cash cards of financial system, for the purpose of card alteration prevention and transaction by imprinter, alphanumeric characters and kana characters are raised by stamping from the back of the card using metal type letters. Embossing is used. However, in traffic-related non-contact IC chip-mounted credit cards, which have been rapidly expanding in recent years, monochrome printing (UG: Ultragraphic) is used instead of embossing due to the effects on non-contact IC chips and antennas. The traffic commuter pass is required to have a rewritable function (which can be rewritten repeatedly). Also, employee ID cards and entrance / exit management cards require CP printing characteristics and UG printing characteristics for printing a facial photograph, and there is a need for a card that is smooth and excellent in printing characteristics without distortion on the card surface. A membership card with a face photo is required to have no defects in appearance quality in combination with a security function, and the quality requirements for appearance quality are very strict.

  The most common manufacturing method for a non-contact type IC card is a laminating method. An inlet in which an LSI and an antenna are joined is sandwiched between plastic sheets that have been printed in advance, and a card is formed by the laminating method. At this time, in order to absorb the thickness of the inlet, the inlet portion is punched into the plastic sheet, or the unevenness of the inlet is absorbed by a combination of a plurality of layers to produce a card having a smooth surface. However, the surface of the non-contact type IC card obtained by the above-described method has problems such as large undulations and inclinations or IC module misalignment.

Patent Document 1 has a thickness within ± 20% of the thickness of the obtained non-contact type IC card on the outer periphery of the laminate of the base material, the IC module, the hot melt adhesive, and the decorative film during press molding. A manufacturing method in which a frame is interposed between press dies is disclosed. According to this manufacturing method, the laminated body can have a small area for one IC card, or the outer peripheral portion of the laminated body can have a target thickness only by the frame. However, when IC cards are produced as mass production, it is usually necessary to use a large multi-sided sheet. In this case, the area of the upper and lower press plates increases, and the weight increases accordingly. In particular, the upper press plate is wrinkled, and the distance between the upper and lower press plates at the center of the laminate is not uniform with the thickness of the outer peripheral frame, making it difficult to make the entire laminate uniform. It was.
JP 2001-331773 A

  The present invention solves such problems of the prior art, and provides a method for producing a non-contact type IC card having a uniform card thickness, no distortion on the card surface, and excellent appearance characteristics such as printing characteristics. It is an issue.

  The invention according to claim 1 of the present invention includes a step of laminating and pressing card constituent members comprising at least a core sheet, an inlet, and an oversheet to obtain a laminate as a card base having a plurality of card-shaped portions attached thereto, In the method of manufacturing a non-contact type IC card, the step of obtaining a laminated body contains the card constituent member, the upper press plate, and the card constituent member. It is a step of obtaining a laminated body by sandwiching and pressing in a state of being accommodated in a lower press plate having a possible recess, and the card constituent member is laminated at a portion other than the card-shaped portion Having one or more through-holes penetrating each of the card constituent members, and having one or more protrusions in the recess of the lower press plate or in the upper press plate, Manufacturing the non-contact type IC card, wherein the card constituent member is accommodated in the concave portion of the side press plate and pressed in a state in which the through hole and the protrusion of each card constituent member are fitted. Is the method.

  The invention according to claim 2 of the present invention is characterized in that the difference between the depth of the concave portion of the lower press plate and the height of the protrusion is within 0.02 mm. It is the manufacturing method of the non-contact-type IC card described.

  Further, in the invention according to claim 3 of the present invention, the opening diameter of each through hole of each of the card constituent members is larger than 0.3 mm and 1.0 mm or less than the outer diameter of the protruding portion. Or a method for producing a non-contact type IC card according to any one of 2).

  In the invention according to claim 4 of the present invention, the total thickness of the card constituent members before being pressed and bonded together is 0.02 to 0.05 mm from the depth of the concave portion of the lower press plate. It is thick, It is a manufacturing method of the non-contact-type IC card of any one of Claims 1-3 characterized by the above-mentioned.

  The invention according to claim 5 of the present invention is characterized in that an air vent groove having a width of 0.5 to 1.0 mm is provided on the outer peripheral portion of the concave portion of the lower press plate. Item 5. A method for producing a non-contact type IC card according to any one of Items 1 to 4.

  According to the method for manufacturing a non-contact type IC card of the present invention, the card constituent member is accommodated in the lower press plate having the recess, and the through-hole provided in a portion other than the card-shaped portion and the lower press plate The upper press plate is sandwiched and pressed in a state of being fitted with a protrusion having a height substantially equal to the recess provided in the upper press plate or in the upper press plate. Therefore, the finished thickness of the card is defined by the depth of the concave portion and the height of the protruding portion, and the card can be laminated to a uniform thickness over the entire multi-faceted card base having a large area.

  Furthermore, according to the method of manufacturing a non-contact type IC card of the present invention, the through hole is provided in a portion other than the card-shaped portion, and the opening diameter of each through hole of the card constituent member is 0.3 mm or more. Since the outer diameter of the projecting portion is 0 mm or less, it is easy to set the card constituent member in the concave portion, the lateral punching or the like does not occur in the card punched into the card shape, and the dimensional uniformity is obtained.

  Further, the total thickness of the card component members before being bonded is 0.02 to 0.05 mm thicker than the depth of the recess, and a groove for air bleeding having a width of 0.5 to 1.0 mm is formed on the outer periphery of the recess. Therefore, a smooth surface free from defects in appearance such as air accumulation, dents and spiders on the card surface can be obtained. As a result, it is possible to obtain a non-contact IC card having no distortion on the card surface after heat lamination and excellent appearance characteristics and excellent printing characteristics.

  A method for manufacturing a non-contact type IC card of the present invention will be described below based on an embodiment with reference to the drawings.

  FIG. 1 is a schematic diagram illustrating a cross section of a card component of an embodiment of the method for producing a non-contact type IC card of the present invention, wherein (a) shows before lamination, (b) shows after lamination, c) shows the inlet. FIG. 2 is a perspective view illustrating one card after punching into a card shape of a non-contact type IC card according to the manufacturing method of the present invention. FIG. 3 is a schematic diagram for explaining an embodiment of a process for obtaining a laminated body as a card base having a plurality of card-shaped portions on a multifaceted surface in the method for producing a contactless IC card of the present invention. a) is a schematic view of a state in which each card constituent member is disposed in the lower press plate recess, as viewed from above, and (b) is a schematic cross sectional view of the card constituent member at section XX ′ in (a). (C) is the schematic which looked at the state which the upper side press board and the lower side press board pressed and became the laminated body in the partial cross section in the cross section XX 'of (a).

One example of the configuration of the non-contact type IC card of the present invention is as shown in FIG. 1, in order from the upper side, the first top sheet (3), the first core sheet (1), the inlet (10), the first 2 core sheet (2) and 2nd surface sheet (4). Usually, the first and second core sheets sandwiched between the inlets are sandwiched between the first and second front and back surface sheets that have been subjected to offset printing or screen printing with multiple imprints, respectively, and melt laminated to obtain a card base. To do.
The first topsheet (3) is preferably made of PET (biaxially stretched polyethylene terephthalate) as a material, and may have a rewrite layer as the outermost layer. The material of the second surface sheet (4) is preferably PET having the same thickness as that of the first surface sheet (3) in order to avoid curling of the card. As the first core sheet (1), an electrically insulating thermoplastic resin sheet can be used. Generally, a hard vinyl chloride (PVC) sheet is used, but as an alternative to PVC that generates toxic gases during incineration, an amorphous polyester (for example, Eastsr manufactured by Eastman Chemical Co., Ltd.).
PET-G: terephthalic acid, glycol, 1,4 cyclohexanedimethanol copolymer) and the like can be preferably used. The material of the second core sheet (2) is the same as that of the first core sheet (1) because of its heat-fusibility.

  The inlet (10) seals the IC chip (11) on the electrically insulating antenna sheet (14) such as PET, PEN (polyethylene naphthalate), PI (polyimide), and the physical properties of the IC chip. A reinforcing plate (13) for improving the strength and an antenna coil (15) made of Cu (copper), Al (aluminum) or the like are used. Although the antenna coil and the IC chip are not connected, the bump formed on the input / output pad of the IC chip and the antenna connection land of the antenna coil are connected via an anisotropic conductive film ACF or the like. The antenna to be used is created by etching, printing, or winding on the film or sheet described above with π or the number of windings according to the transmission specifications of the IC. In this case, if there is post-processing such as embossing, the antenna pattern and the position of the antenna in the card are designed so that they can co-exist with these processing. In the present invention, emphasis is placed on surface smoothness rather than embossability. The degree of freedom in antenna design is high.

As described above, the first core sheet (1) is an electrically insulating resin sheet having a thickness of 0.1 to 0.4 mm, such as PET-G, PVC, etc. As shown in FIG. In the first core sheet (1), an IC chip (11) mounted on the inlet (10), a sealing resin (12), and an IC chip portion including a reinforcing plate (13) can be stored. 5) is formed. Here, the clearance between the IC chip portion and the opening side wall of the first core sheet is about 0.3 mm to 1 mm on one side reference, so that the first core sheet (1) does not run over the IC chip portion, It is necessary to avoid damage to the IC chip due to the pressure during thermal lamination. Further, at the time of thermal lamination, the shape is determined so that the molten resin can sufficiently fill the clearance between the IC chip and the opening side wall of the first core sheet, and the IC portion of the card does not become uneven. The shape of the opening is a circular shape or a rectangular shape according to the shape of the IC chip or the reinforcing plate disposed on the IC chip.

  With the above-described configuration, the member can be used so that the total thickness of the melt-laminated card can accurately achieve a target thickness within the thickness standard of 0.68 to 0.84 mm of the non-contact type IC card, for example, 0.76 mm. To form a laminate. Here, the first and second core sheets are not limited to a single layer in relation to the height of the IC chip portion or other constituent materials, and may be a plurality of layers. Although not shown, there is no particular limitation on the interposition of the adhesive resin layer or the treatment of the interface for assisting the heat-fusability and adhesion between the top sheet and the core sheet.

  As shown in FIG. 3 (a), the card component is formed as a multi-faceted sheet and mounted with a plurality of inlets. Here, the first surface sheet (3), the first core sheet (1), the second core sheet (2), and the second surface sheet (4) penetrate each through when they are stacked. A hole (6) is formed.

  Next, as shown in FIG. 3 (c), the upper press plate (7) of the laminating / press-molding apparatus is a flat plate, and the lower press plate (8) has a recess (9 ) Is provided. The lower press plate is formed with a plurality of protrusions (60) that enter through holes (6) provided in the card component. Here, the depth of the concave portion and the height of the protrusion (60) formed in the concave portion (9) are formed to be approximately the same dimension, and this dimension is the thickness of the target non-contact type IC card. In contrast, within ± 0.01 mm. That is, the depth of the recess and the height of the protrusion are the target dimensions in the standard thickness of 0.68 mm to 0.84 mm of the non-contact type IC card, and the depth of the recess of the lower press plate The height difference between the protrusions is preferably 0.02 mm or less.

  Further, as the lower press plate (8), for example, a stainless steel material having a thickness of 3 mm is used to cut and create a concave portion (9) having a depth corresponding to the card thickness, and the protruding portion has a pin shape. A plurality of things can be formed by screwing. As a method for forming the concave portion (9), a stainless steel frame having a thickness corresponding to the card thickness can be screwed to the outer peripheral portion to form the concave portion. Here, the recess area secures a margin so that the thickness reduction of the laminate can be absorbed. Furthermore, an air vent groove (16) having a width of 0.5 mm to 1.0 mm is provided on the outer peripheral portion of the concave portion (9), so that air accumulates on the card surface, resulting in appearance defects such as dents and spiders. Do not. Moreover, in order to ensure rigidity also about an upper side press plate (7), a stainless steel material with a thickness of 3 mm is used.

  The above-mentioned laminated component is set in the recess (9) of the lower press plate (8) with the through hole (6) as the sheet configuration shown in FIG. 1 (a), and sandwiched between the upper and lower press plates, A single-layered structure in which an inlet is sandwiched by thermal lamination at a temperature of 130 ° C. to 170 ° C. to provide a card base with excellent thickness uniformity in a multi-faceted state. Next, the card base is peeled off from the press plate, and then punched into a card shape by punching with a single-edged or male-female die to obtain a single contactless IC card. Here, the total thickness of the laminated constituent members is set to 0.02 mm to 0.05 mm thick with respect to the recess depth of the lower press plate, that is, the protrusion height, so that the thickness after lamination is targeted. The card thickness can be set.

As described above, according to the non-contact type IC card manufacturing method of the present invention, the thickness of the multi-contact non-contact type IC card can be finished within ± 0.03 mm of the target thickness, It is possible to provide a non-contact type IC card excellent in appearance quality.

  In the above description of the embodiment of the present invention, the recesses and the protrusions are provided on the lower press plate. However, the recesses may be provided on the lower press plate and the protrusions may be provided on the upper press plate.

  In the above description, a single-layer arrangement in which the upper and lower press plates are set as one set is shown. However, in mass production, it is desirable to use a multi-layer press of 4/5 layers. At this time, the weight of the press plate is increased, and the press plate is wrinkled, and the card thickness is likely to change. However, as in the manufacturing method of the present invention, a protrusion is provided in the recess of the press plate. As a result, the press plate can be prevented from being warped, and the effect of the protrusions is great in ensuring the uniformity of the product thickness.

  Further, in the above-described embodiment of the present invention, the total thickness of the card constituent members before lamination is reduced so that the card thickness becomes a target thickness within the thickness standard of 0.68 mm to 0.84 mm of the non-contact type IC card. The thickness of the side press plate was set to 0.02 mm to 0.05 mm thick so that the thickness after lamination was equal to the depth of the recess. It can be easily prepared by preparing a press plate.

  Each card produced by the manufacturing method of the present invention is subjected to various optional processes such as holograms, diffraction gratings, etc., or the addition of a rewrite function, as in the prior art. Also, 0th-order issuance and primary issuance such as IC initialization and security information setting and generation of necessary data files are performed. In addition, inspection based on the function of exchanging information with the outside and various standard physical properties is performed, and the apparatus becomes ready for use.

  Small cards produced as described above are usually packed, transported, and shipped to the customer side in a superposed state. Finally, as a secondary issue (personalization) using an issuing machine according to the card specifications, individual information is put on the surface of the card together with the IC encoding. Examples of processing contents in the card issuing machine include monochrome printing (UG), color printing (photo CP), and overcoat. In order to avoid the influence on the non-contact type IC chip, the credit card mounted with the non-contact type IC chip produced by the manufacturing method of the present invention usually performs monochrome printing or color printing of a facial photograph instead of embossing. In the traffic commuter pass, the rewrite layer is written. By adopting the non-contact type IC card manufacturing method of the present invention described above, it has excellent surface properties suitable for CP printing for printing a face photograph at the time of secondary issuance and UG (ultra graphic) printing for monochrome printing. It is possible to stably provide the non-contact type IC card that is being used in mass production.

Schematic explaining the card | curd structural member of one Embodiment of the manufacturing method of this invention in a cross section. The perspective view of the non-contact-type IC card of one shape in one Embodiment of the manufacturing method of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Schematic explaining one Embodiment of the process of obtaining the card surface with which the multifaceted of the manufacturing method of this invention was obtained.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st core sheet 2 ... 2nd core sheet 3 ... 1st surface sheet 4 ... 2nd surface sheet 5 ... Opening part 6 ... Through-hole 7. ··· Upper press plate 8 ··· Lower press plate 9 ··· Concave portion 10 ··· Inlet 11 ··· IC chip 12 ··· Sealing resin 13 ··· Reinforcing plate 14 · · · Antenna sheet 15 · · · .... Antenna coil 16 ... Air vent groove 20 ... Laminate 60 ... Projection

Claims (5)

Laminating and pressing at least a card component composed of a core sheet, an inlet, and an oversheet to obtain a laminated body as a card base having a plurality of card-shaped portions, and obtaining a card by punching the laminated body into a card shape In a method for manufacturing a non-contact type IC card having a process,
The step of obtaining a laminated body is performed by sandwiching the card constituent member in a state of being accommodated in an upper press plate and a lower press plate having a recess capable of accommodating the card constituent member, and pressing them together to laminate the laminate. A process of obtaining
The card component member has one or more through-holes penetrating each of the card component members when stacked, in a portion other than the card shape portion,
Having one or more protrusions in the recess of the lower press plate or in the upper press plate;
The non-contact type IC card, wherein the card constituent member is accommodated in the concave portion of the lower press plate, and is pressed in a state in which the through hole and the protrusion of each card constituent member are fitted. Manufacturing method.   2. The method of manufacturing a non-contact type IC card according to claim 1, wherein a difference between a depth of the concave portion of the lower press plate and a height of the protrusion is within 0.02 mm.   3. The non-contact type IC card according to claim 1, wherein an opening diameter of each through hole of each of the card constituent members is greater than 0.3 mm and less than 1.0 mm and larger than an outer diameter of the protrusion. Manufacturing method.   The total thickness of thickness before pressing and bonding each said card | curd structural member is 0.02-0.05 mm thicker than the depth of the said recessed part of the said lower side press board, Any one of Claims 1-3 characterized by the above-mentioned. A method for producing a non-contact type IC card according to claim 1.   The non-pressurizing device according to any one of claims 1 to 4, wherein a groove for air bleeding having a width of 0.5 to 1.0 mm is provided on an outer peripheral portion of the concave portion of the lower press plate. A method for manufacturing a contact IC card.

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