JP2010182998A - Light irradiation device and light irradiation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation device that irradiates one surface side of a body to be irradiated with ultraviolet rays from a light-emitting means of the ultraviolet rays etc., and also reflects part of light transmitted and/or passed through the body to be irradiated toward the other surface side of the body to be irradiated, thereby irradiating both sides of the body to be irradiated with the light; and to provide a light irradiation method. <P>SOLUTION: The light irradiation device 10 irradiates with the light the body B to be irradiated which has a semiconductor wafer W stuck across an adhesion sheet S having an ultraviolet-ray curing type adhesive layer SA on an inner peripheral side of a ring frame RF. The device includes the light-emitting means 11 disposed on the one surface side of the body B to be irradiated to irradiate it with the light, and a reflecting means 12 disposed on the other surface side of the body B to be irradiated, and cures the adhesive layer SA with the light irradiation by the light-emitting means 11 and also reflects the part of light transmitted and/or passed through the body B to be irradiated toward the other surface side of the body B to be irradiated to irradiate even the semiconductor wafer W side with the light. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light irradiation apparatus and a light irradiation method, and more particularly to a light irradiation apparatus and a light irradiation method capable of irradiating light to an adhesive sheet having a photoreactive adhesive layer attached to a semiconductor wafer or the like.

  In a processing apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is applied to the circuit surface of the wafer to perform back surface grinding, or a dicing tape is applied to a plurality of chips. A process of tidy up is performed. The adhesive sheet used for such treatment employs an ultraviolet curable (photoreactive) adhesive as the adhesive, and after the treatment as described above, the ultraviolet ray (light) is adhered by an ultraviolet irradiation device. By irradiating the adhesive, the adhesive is cured to weaken the adhesive force, and the wafer can be prevented from being broken and easily peeled off.

  Examples of the ultraviolet irradiation device are disclosed in Patent Documents 1 to 3. Patent Documents 1 and 2 disclose a configuration in which ultraviolet rays are irradiated from one side of an adhesive sheet attached to a wafer, and Patent Document 3 discloses a configuration in which ultraviolet rays are irradiated from both sides of a substrate. ing.

JP 2008-171844 A JP 2008-235650 A JP-A-7-192996

However, in the ultraviolet irradiation apparatus disclosed in Patent Documents 1 and 2, when the ultraviolet rays are irradiated on both surfaces of the adhesive sheet, the wafer must be reversed and the same irradiation operation must be performed again. descend. Further, when a wafer having a small size is adopted as the ultraviolet light emitting means, there is an inconvenience that the ultraviolet light is wasted.
The ultraviolet irradiation apparatus described in Patent Document 3 enables ultraviolet irradiation on both surfaces of a substrate such as a wafer, but the apparatus has a configuration in which ultraviolet irradiation means are relatively arranged vertically with the substrate positioned in the middle. For this reason, not only is the configuration complicated, but also the power consumption is increased.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to irradiate light from one side of the irradiated body from the light emitting means and to transmit and / or transmit the irradiated body. An object of the present invention is to provide a light irradiation apparatus and a light irradiation method capable of irradiating light on both surfaces of the irradiated object by reflecting the light that has passed through toward the other surface of the irradiated object.

In order to achieve the above object, the present invention provides a light irradiation apparatus for performing light irradiation on an irradiated object having one surface and the other surface.
A light emitting means for irradiating light from one surface side of the irradiated body, and a light emitting means disposed on the other surface side of the irradiated body, and a part of the light transmitted and / or passed through the irradiated body. It is configured to include a reflecting means for reflecting toward the irradiation body.

Further, the present invention is a light irradiation apparatus for performing light irradiation on an irradiated object to which a semiconductor wafer is attached via an adhesive sheet having a photoreactive adhesive layer on the inner peripheral side of a ring frame.
A light emitting means for irradiating light from one surface side of the irradiated body, and a light emitting means disposed on the other surface side of the irradiated body, and a part of the light transmitted and / or passed through the irradiated body It is possible to adopt a configuration in which a reflection unit that reflects the object to be irradiated is provided.

  In the light irradiation apparatus, it is preferable that the light emitting unit and the reflection unit include a light collecting plate that forms a focal point on the irradiated body.

  Further, the light collecting plate of the reflecting means has a configuration including an inclined region that directs reflected light in a predetermined direction.

Furthermore, the present invention relates to a light irradiation method for performing light irradiation on an irradiated object having one surface and the other surface.
A method is employed in which light irradiation is performed from one surface side of the irradiated body, and a part of the light transmitted and / or passed through the irradiated body is reflected toward the irradiated body.

According to the present invention, since the light from the single light emitting means is reflected by the reflecting means and the light can be irradiated on both sides of the irradiated object, the apparatus configuration is simplified and the power consumption is suppressed. can do. In particular, when the irradiated object includes a semiconductor wafer and the semiconductor wafer is divided into a large number of chips, even if the adhesive adheres to the outer periphery of the chip by dicing, The adhesive can be surely cured and a pick-up failure or the like due to the fact that the adhesive force is not reduced when picking up the chip can be avoided. In addition, when a photocurable adhesive sheet such as a protective sheet or a dicing tape is attached to both surfaces of the semiconductor wafer, the adhesive force of these adhesive sheets can be reduced by one irradiation operation, By reversing the front and back as in the prior art and repeating the same operation again, the processing capability is not reduced. Furthermore, even when a wafer with a small wafer size is adopted as the ultraviolet light emitting means, it can be effectively utilized by irradiating the other surface with ultraviolet light that has been conventionally wasted.
Moreover, since light irradiation is performed so that a focus may be formed on a to-be-irradiated body, efficient light irradiation can be performed also from this point.

The schematic front view of the light irradiation apparatus which concerns on this embodiment. FIG. The schematic perspective view of the light irradiation apparatus of FIG. Explanatory drawing of a modification.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 and 2, the light irradiation apparatus 10 is irradiated with a wafer W attached to an inner peripheral side of the ring frame RF via an adhesive sheet S having a photoreactive (ultraviolet curable) adhesive layer SA. It is configured as a device that irradiates the body B with light (ultraviolet rays). In the present embodiment, the adhesive sheet S has an adhesive layer SA formed on the upper surface side of the base sheet, and the wafer W is separated into a plurality of chips C by dicing.
The irradiated body B is supported via a support means (not shown) and is provided so as to be relatively movable in the left-right direction in FIG.

  The light irradiating device 10 is disposed on the upper side in the drawing, which is the light emitting means 11 for irradiating light from the lower side in FIG. And reflecting means 12 for reflecting the light transmitted and / or passed through the irradiated body B toward the upper surface side of the irradiated body B. In the present embodiment, the adhesive sheet S has a light transmitting property. In the present invention, the term “permeation” means passing through the inside of the substance, and “passing” means passing through the outside of the substance.

  The light emitting means 11 includes an ultraviolet lamp 15 extending in the left-right direction in FIG. 1 and a length for accommodating the ultraviolet lamp 15, and condenses the light from the ultraviolet lamp 15 to be irradiated on the irradiated object B. The 1st light-condensing plate 16 which irradiates. The first light collector 16 is made of a mirror, mirror-finished metal, or the like, and has a U-shape in which the opening width gradually increases toward the upper side. The light emitted by the ultraviolet lamp 15 is orthogonal to the paper surface in FIG. The curvature is set so as to be focused in a line along the line, and this focal position is set as the focal point P. The irradiated object B is configured such that the adhesive layer SA moves relative to the focal point P.

  The reflection means 12 is made of a mirror, a mirror-finished metal, or the like, and is configured by a second light collector 20 having an inverted U-shaped shape whose opening width gradually increases toward the lower side. As shown in FIG. 1, the second light collector 20 includes a horizontal region 20A substantially corresponding to the diameter of the wafer W and a pair of inclined regions 20B connected to both ends of the horizontal region 20A. The horizontal region 20 </ b> A and each inclined region 20 </ b> B reflect a part of light transmitted and / or passed through the irradiated body B out of the light emitted by the light emitting means 11 toward the upper surface side of the irradiated body B. 2, the inverted U-shaped curvature is set so that the reflected light is focused in a line shape along the direction orthogonal to the paper surface in FIG. Is set to As shown in FIG. 1, the inclination angle θ of each inclined region 20 </ b> B is set so that the reflected light is directed toward the upper surface of the wafer W.

  In addition, the light irradiation apparatus 10 and the support means (not shown) for supporting the irradiation object B are arranged in a predetermined case capable of forming an inert gas atmosphere such as nitrogen gas, and thereby oxygen contained in the atmosphere. The curing inhibition can be prevented in advance.

  The light irradiation to the irradiated object B by the light irradiation device 10 is performed by moving a support means (not shown) that supports the irradiated object B in the direction of arrow A in FIG. Done. At this time, the adhesive layer SA of the adhesive sheet S is transported on the virtual plane T shown in FIG. When the irradiated body B passes between the light emitting means 11 and the reflecting means 12, the line-shaped light forming the focal point P scans the irradiated body B from the lower surface side, whereby the adhesive of the adhesive sheet S The layer SA will be cured. At this time, a part of the light transmitted and / or passed through the irradiation object B is reflected by the second light collector 20 and irradiated on the upper surface side of the irradiation object B. At this time, the light reflected by the inclined region 20B of the second light collector 20 is set so as to be directed toward the upper surface of the wafer W, so that the adhesive attached to the outer peripheral edge of the chip C can be more effectively removed. It can be cured to reduce or eliminate adhesion.

  Therefore, according to such an embodiment, the adhesive adhered to the outer peripheral edge of the chip C due to dicing of the wafer W is reduced in adhesiveness, and the adhesive is uncured in the subsequent pickup process and the like. Inconveniences such as defective pickup can be avoided. Further, even when a photocurable adhesive sheet is attached to the upper surface of the wafer W, the adhesive force of the upper surface side adhesive sheet can be reduced by a single irradiation operation. In addition, since it is possible to irradiate light from both sides of the adhesive sheet S by the single light emitting means 11, the configuration is simplified compared to the conventional configuration employing a pair of light emitting means arranged relative to each other. In addition, the power consumption can be greatly reduced.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the wafer W is arranged inside the ring frame RF and the wafer W is integrated with the adhesive sheet S as shown in the figure to be irradiated B, but the wafer is not provided with the ring frame RF. Also includes those in which an adhesive sheet S is attached to W. In this case, it is also possible to target a case where an adhesive sheet S having the same planar shape as that of the wafer W is adhered to the entire surface, a case where an adhesive sheet smaller than the wafer W is attached to the wafer W, and the like. Further, the ultraviolet lamp 15 may have a size or a length that passes from the outside of the ring frame RF to the other surface side. Furthermore, as shown in FIG. 4 (A), one surface is a target in which a photoreactive adhesive sheet S is pasted on both surfaces of an adherend W1 that does not have optical transparency as an irradiated body B. You may comprise so that the light irradiated from the (lower) side and the light which passed from the outer side of the said to-be-irradiated body B to the other surface (upper surface) side may be reflected in the to-be-irradiated body B. Further, as shown in FIG. 4 (B), the object to be irradiated B is one in which a light-reactive adhesive sheet S is pasted on both surfaces of a light-transmitting adherend W2, and one surface ( Light that has been irradiated from the (lower) side and passed from the outside of the irradiated body B to the other surface (upper surface) side, and light that has been transmitted (transmitted and attenuated) through both adhesive sheets S and the adherend W1. May be configured to be reflected by the irradiated object B.

Furthermore, the relative position of each part constituting the light irradiation apparatus 10 according to the present invention, that is, the layout is not limited to the illustrated configuration example, and the position can be changed vertically or horizontally. Accordingly, the term indicating the direction can be the lower surface, the lower portion, the upper and lower sides, and the like by changing the layout of each part of the apparatus, and these changed modes are included as equivalent to the present invention.
Further, as the light source constituting the light emitting means 11, the adoption of a halogen lamp, a mercury lamp, a fluorescent lamp, a metal halide lamp, a light emitting diode or the like is not hindered.

  Further, the irradiated object B includes a coating film that performs photoreaction, glass laminated through a photoreactive adhesive layer, a resin plate, and the like, and the wafer W may be a silicon wafer or a compound wafer.

  Further, the inclined region 20B may be separated from the horizontal region 20, and the inclined angle θ may be changed via angle changing means such as a motor or a cylinder (not shown). With this configuration, the irradiation destination of the reflected light can be easily changed. For example, even when the size (diameter) of the wafer W is changed, it is possible to cope with the change.

DESCRIPTION OF SYMBOLS 10 Light irradiation apparatus 11 Light emission means 12 Reflection means 16 1st light-condensing plate 20 2nd light-condensing plate 20B Inclined area B Subject to be irradiated P Focus S Adhesive sheet SA Adhesive layer RF Ring frame W Semiconductor wafer

Claims (5)

In a light irradiation apparatus that performs light irradiation on an irradiated object having one surface and the other surface,
A light emitting means for irradiating light from one surface side of the irradiated body;
Reflecting means arranged on the other surface side of the irradiated body and reflecting part of the light transmitted through and / or passed through the irradiated body toward the irradiated body. A light irradiation device. In a light irradiation apparatus for performing light irradiation on an irradiated object to which a semiconductor wafer is attached via an adhesive sheet having a photoreactive adhesive layer on the inner peripheral side of the ring frame,
A light emitting means for irradiating light from one surface side of the irradiated body;
Reflecting means arranged on the other surface side of the irradiated body and reflecting part of the light transmitted through and / or passed through the irradiated body toward the irradiated body. A light irradiation device.   The light emitting device according to claim 1, wherein the light emitting unit and the reflecting unit include a light collector that forms a focal point on the irradiated body.   4. The light irradiation apparatus according to claim 1, wherein the light collecting plate of the reflecting means includes an inclined region for directing reflected light in a predetermined direction. In the light irradiation method of performing light irradiation on the irradiated object having one surface and the other surface,
Irradiate light from one side of the irradiated object,
A light irradiation method characterized in that a part of light transmitted and / or passed through the irradiated body is reflected toward the irradiated body.

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